JP2007088394A5 - - Google Patents

Claims (2)

基板を処理する処理室と、
該処理室を加熱する加熱手段と、
前記処理室外に配置され前記加熱手段の温度を測定する第１の温度センサと、
該第１の温度センサよりも前記基板近傍に配置され前記処理室内の温度を測定する第２の温度センサと、
前記第１及び第２の温度センサでそれぞれの測定する温度に基づき前記加熱手段を制御する制御手段とを備え、
前記制御手段は、
前記処理室内で設定温度にて基板を処理するよう前記加熱手段を制御している際に、前記第２の温度センサが正常に温度測定できなくなったとき、前記第２の温度センサが正常に温度測定できなくなる前に求めて記憶しておいた前記設定温度にて温度が安定した際の前記第１及び第２の温度センサで測定したそれぞれの温度の温度差を、前記第２の温度センサで測定する温度と前記設定温度との偏差に基づき第１の演算をすることに替えて、前記記憶された温度差により前記設定温度を補正し、該補正結果と前記第１の温度センサで測定する温度との偏差に基づき第２の演算を行い、該第２の演算結果に基づき前記加熱手段を制御することを特徴とする基板処理装置。 A processing chamber for processing the substrate;
Heating means for heating the processing chamber;
A first temperature sensor arranged outside the processing chamber and measuring the temperature of the heating means;
A second temperature sensor that is disposed near the substrate than the first temperature sensor and measures the temperature in the processing chamber;
Control means for controlling the heating means based on temperatures measured by the first and second temperature sensors ,
The control means includes
When controlling the by cormorants before Symbol heating means for processing the substrate at a set temperature in the processing chamber, can and the second temperature sensor can no longer be properly temperature measurements, normally the second temperature sensor is in each of the temperature difference between the temperature measured by said first and second temperature sensors when the temperature was stable at storage to keep said set temperature determined before can not be temperature measurement, pre Symbol second instead be a temperature measured by a temperature sensor deviations first operation based on the said set temperature, said the set temperature is corrected by the stored temperature difference, the with the correction result first temperature sensor A substrate processing apparatus, wherein a second calculation is performed based on a deviation from the temperature measured in step (b), and the heating unit is controlled based on the second calculation result. 処理室内で設定温度にて基板を処理するよう、加熱手段の温度を測定する第１の温度センサの測定する温度と該第１の温度センサよりも前記基板近傍に配置され前記処理室内の温度を測定する第２の温度センサの測定する温度に基づき前記加熱手段を制御している際に、前記第２の温度センサが正常に温度測定できなくなったとき、該第２の温度センサが正常に温度測定できなくなる前に予め求めて記憶しておいた前記設定温度にて温度が安定した際の前記第１及び第２の温度センサで測定したそれぞれの温度の温度差を、前記第２の温度センサで測定する温度と前記設定温度との偏差に基づき第１の演算をすることに替えて、前記記憶された温度差により前記設定温度を補正し、該補正結果と前記第１の温度センサで測定する温度との偏差に基づき第２の演算を行い、該第２の演算結果に基づき前記加熱手段を制御することを特徴とする半導体装置の製造方法。The temperature measured by the first temperature sensor for measuring the temperature of the heating means and the temperature inside the processing chamber disposed closer to the substrate than the first temperature sensor so as to process the substrate at the set temperature in the processing chamber. When the heating means is controlled based on the temperature measured by the second temperature sensor to be measured and the second temperature sensor becomes unable to measure the temperature normally, the second temperature sensor is normally heated. The temperature difference between the temperatures measured by the first and second temperature sensors when the temperature is stabilized at the set temperature that is obtained and stored in advance before the measurement cannot be performed is the second temperature sensor. Instead of performing the first calculation based on the deviation between the temperature measured in step 1 and the set temperature, the set temperature is corrected by the stored temperature difference, and the correction result and the first temperature sensor are measured. Deviation from temperature The second performs a computation method of manufacturing a semiconductor device, characterized by controlling the heating means based on the second calculation result based.