JP2007081119A - 共振型電波吸収体とその製造方法 - Google Patents
共振型電波吸収体とその製造方法 Download PDFInfo
- Publication number
- JP2007081119A JP2007081119A JP2005266907A JP2005266907A JP2007081119A JP 2007081119 A JP2007081119 A JP 2007081119A JP 2005266907 A JP2005266907 A JP 2005266907A JP 2005266907 A JP2005266907 A JP 2005266907A JP 2007081119 A JP2007081119 A JP 2007081119A
- Authority
- JP
- Japan
- Prior art keywords
- wave absorber
- radio wave
- powder
- loss agent
- resonance type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006096 absorbing agent Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 229920002050 silicone resin Polymers 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 9
- 239000013464 silicone adhesive Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 238000009833 condensation Methods 0.000 claims description 5
- 230000005494 condensation Effects 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims 2
- 239000004917 carbon fiber Substances 0.000 claims 2
- 239000000835 fiber Substances 0.000 claims 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- 229920006267 polyester film Polymers 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 4
- 239000010703 silicon Substances 0.000 abstract 4
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 13
- 229920001296 polysiloxane Polymers 0.000 description 9
- 238000001723 curing Methods 0.000 description 6
- 229920006268 silicone film Polymers 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 238000013008 moisture curing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
【解決手段】 共振型電波吸収体の製品検査工程前である製造時において、予め表面にシリコーン皮膜を形成した導電層の上に、電波損失剤と硬化剤を混合した縮合型シリコーン樹脂を流した上で、ローラーやプレス機などで厚みを制御し、樹脂の硬化反応によって導電層上のシリコーン皮膜と吸収層であるシリコーン樹脂層を反応固着させる。
【選択図】図1
Description
Claims (10)
- シリコーン樹脂に誘電損失剤、磁性損失剤の粉体を混合した共振型電波吸収体において、電波照射面の反対側に導電層を有する共振型電波吸収体
- 導電層を除く電波吸収体層の厚みが0.1〜5.0mmである請求項1記載の共振型電波吸収体。
- 請求項1又は2記載の共振型電波吸収体に使用するシリコーン樹脂が縮合型シリコーン樹脂である共振型電波吸収体
- フェライト粉または、カルボニル鉄粉などの軟磁性金属粉を磁性損失剤として使用した請求項1又は2記載の共振型電波吸収体。
- 請求項4におけるフェライト粉または、カルボニル鉄粉などの磁性損失剤とシリコーン樹脂の配合比が質量比で、95:5〜35:65である請求項1又は2記載の共振型電波吸収体。
- 導電性カーボン粉,導電性炭素繊維,炭化ケイ素繊維などの導電材を誘電損失剤として使用した請求項1又は2記載の共振型電波吸収体。
- シリコーン樹脂に対して、導電性カーボン粉、導電性炭素繊維、炭化ケイ素繊維などの誘電損失剤を0.01〜35質量%含む請求項1又は2記載の共振型電波吸収体。
- 電波照射面の反対側にステンレス箔、アルミニウム箔、ニッケル箔などの金属箔かポリエステルフィルムなどの樹脂フィルムにアルミニウムなどの金属を蒸着したシートを導電体として接着した請求項1又は2記載の共振型電波吸収体。
- 金属箔または、ポリエステルフィルムなどの樹脂フィルムにアルミニウムなどの金属を蒸着したシートの導電体表面に、予めシリコーン系接着剤を塗布し、接着剤が硬化した後に、誘電損失剤または、磁性損失剤の粉体を混合した硬化前の熱硬化性シリコーン樹脂を乗せて成形した請求項1又は2記載の共振型電波吸収体。
- 予めシリコーン系接着剤を導電体表面に塗布し、接着剤が硬化した後に、誘電損失剤または磁性損失剤の粉体を混合した硬化前の熱硬化性シリコーン樹脂を乗せ、硬化反応により接着剤と一体化させることを特徴とする請求項1又は2記載の共振型電波吸収体の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005266907A JP5481613B2 (ja) | 2005-09-14 | 2005-09-14 | 共振型電波吸収体とその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005266907A JP5481613B2 (ja) | 2005-09-14 | 2005-09-14 | 共振型電波吸収体とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007081119A true JP2007081119A (ja) | 2007-03-29 |
JP5481613B2 JP5481613B2 (ja) | 2014-04-23 |
Family
ID=37941099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005266907A Active JP5481613B2 (ja) | 2005-09-14 | 2005-09-14 | 共振型電波吸収体とその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5481613B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023048050A1 (ja) | 2021-09-24 | 2023-03-30 | マクセル株式会社 | 電磁波吸収体 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326000A (ja) * | 1989-06-23 | 1991-02-04 | Yokohama Rubber Co Ltd:The | 電波吸収体 |
JPH10120985A (ja) * | 1996-10-23 | 1998-05-12 | Shin Etsu Chem Co Ltd | プライマー組成物 |
JP2001044687A (ja) * | 1999-07-29 | 2001-02-16 | Nitto Denko Corp | 電波吸収体及びその製造方法 |
JP2004296758A (ja) * | 2003-03-27 | 2004-10-21 | Takechi Kogyo Gomu Co Ltd | ミリ波電波吸収体 |
JP2005015805A (ja) * | 2003-06-26 | 2005-01-20 | Wacker Chemie Gmbh | プライマー組成物、その製法、基材上へのシリコーンゴムの付着の改善法複合成形品および複合材料、およびその使用 |
JP2005158960A (ja) * | 2003-11-25 | 2005-06-16 | Aichi Steel Works Ltd | 電波吸収体 |
JP2005161132A (ja) * | 2003-11-28 | 2005-06-23 | Dow Corning Toray Silicone Co Ltd | シリコーン積層体の製造方法 |
-
2005
- 2005-09-14 JP JP2005266907A patent/JP5481613B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0326000A (ja) * | 1989-06-23 | 1991-02-04 | Yokohama Rubber Co Ltd:The | 電波吸収体 |
JPH10120985A (ja) * | 1996-10-23 | 1998-05-12 | Shin Etsu Chem Co Ltd | プライマー組成物 |
JP2001044687A (ja) * | 1999-07-29 | 2001-02-16 | Nitto Denko Corp | 電波吸収体及びその製造方法 |
JP2004296758A (ja) * | 2003-03-27 | 2004-10-21 | Takechi Kogyo Gomu Co Ltd | ミリ波電波吸収体 |
JP2005015805A (ja) * | 2003-06-26 | 2005-01-20 | Wacker Chemie Gmbh | プライマー組成物、その製法、基材上へのシリコーンゴムの付着の改善法複合成形品および複合材料、およびその使用 |
JP2005158960A (ja) * | 2003-11-25 | 2005-06-16 | Aichi Steel Works Ltd | 電波吸収体 |
JP2005161132A (ja) * | 2003-11-28 | 2005-06-23 | Dow Corning Toray Silicone Co Ltd | シリコーン積層体の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023048050A1 (ja) | 2021-09-24 | 2023-03-30 | マクセル株式会社 | 電磁波吸収体 |
Also Published As
Publication number | Publication date |
---|---|
JP5481613B2 (ja) | 2014-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI773656B (zh) | 電磁波吸收體 | |
JP6454445B2 (ja) | 電磁波吸収シート | |
US8171622B2 (en) | Flexible printed circuit and method for manufacturing the same | |
JP6453295B2 (ja) | 電磁波吸収体 | |
CN110235537B (zh) | 电磁波吸收片 | |
EP1580235A4 (en) | RESIN COMPOSITION, CURED RESIN, CURED RESIN SHEET, LAMINATE, PREIMPREGNE, ELECTRONIC COMPONENT, AND MULTILAYER SUBSTRATE | |
US10999960B2 (en) | Electromagnetic wave shielding material using perforated metal thin plate and method of manufacturing same | |
JP7350048B2 (ja) | 電磁波吸収体 | |
CN109659703A (zh) | 一种基于泡沫介质基材料与金属结构融合的宽频带电磁波吸收超材料 | |
WO2020020195A1 (zh) | 以聚酰亚胺薄膜为绝缘层的fpc电磁屏蔽膜及其制备方法 | |
JP2011032434A (ja) | 電子部品封止用シート状エポキシ樹脂組成物およびそれにより得られた電子部品装置集合体ならびに電子部品装置 | |
CN105282959A (zh) | 具有低Dk和Df特性的高频覆盖膜及其制造方法 | |
KR20220159303A (ko) | 접착 필름 및 이를 이용한 반도체 패키지의 제조 방법 | |
JP5481613B2 (ja) | 共振型電波吸収体とその製造方法 | |
JP2017110128A (ja) | 熱硬化性接着シート、物品及び物品の製造方法 | |
JP2019009396A (ja) | 電磁波シールド用フィルム、および電子部品搭載基板 | |
KR101498140B1 (ko) | 연성인쇄회로기판의 커버레이어의 제조방법과 이 제조방법을 이용한 연성인쇄회로기판의 제조방법 및 이 제조방법으로 제조된 커버레이어와 연성인쇄회로기판 | |
CN105950054B (zh) | 一种电磁屏蔽膜的制作方法 | |
JP2002118008A (ja) | ミリ波用電磁波吸収体 | |
JP6460419B2 (ja) | 補強部付フレキシブルプリント配線板、その製造方法及び電子機器 | |
KR101310358B1 (ko) | 소성 페라이트 파우더, 이를 적용한 전자파 흡수체 시트 어셈블리 및 그 제조방법 | |
JP2018170393A (ja) | 電磁波シールド用フィルム、および電子部品搭載基板 | |
JP2011035313A (ja) | 電子部品装置集合体およびその製造方法 | |
US20080022507A1 (en) | Manufacturing method for a septum polarizer | |
CN211896770U (zh) | 一种柔性高强聚酰亚胺薄膜胶带 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080912 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101025 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101102 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110824 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120410 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120709 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120709 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130111 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20130308 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130919 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131217 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5481613 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |