JP2007081069A - Chip type solid electrolytic capacitor, terminals, and method for manufacturing them - Google Patents

Chip type solid electrolytic capacitor, terminals, and method for manufacturing them Download PDF

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JP2007081069A
JP2007081069A JP2005266187A JP2005266187A JP2007081069A JP 2007081069 A JP2007081069 A JP 2007081069A JP 2005266187 A JP2005266187 A JP 2005266187A JP 2005266187 A JP2005266187 A JP 2005266187A JP 2007081069 A JP2007081069 A JP 2007081069A
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mounting surface
terminal
substrate mounting
capacitor element
cathode
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Makoto Tsutsui
誠 筒井
Fumio Kida
文夫 木田
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Tokin Corp
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NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a small, large-capacity chip type solid electrolytic capacitor that does not deteriorate the adhesiveness between terminals and exterior resins, the terminals to be used therefor, and a method for manufacturing them. <P>SOLUTION: This chip type solid electrolytic capacitor has a through-hole 5a or 6a at an erection part 5c or 6c of at least either an anode terminal 6 or a cathode terminal 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、固体電解コンデンサに関し、詳しくはチップ型固体電解コンデンサの構造およびそれに用いられる端子ならびにその端子の製造方法に関する。   The present invention relates to a solid electrolytic capacitor, and more particularly to a structure of a chip-type solid electrolytic capacitor, a terminal used therefor, and a method for manufacturing the terminal.

従来から弁作用金属として、タンタル、ニオブなどを用いた固体電解コンデンサは、小型で静電容量が大きく、周波数特性に優れ、ＣＰＵの電源回路などに広く利用されている。   Conventionally, solid electrolytic capacitors using tantalum, niobium or the like as a valve metal are small, have a large capacitance, are excellent in frequency characteristics, and are widely used in power supply circuits for CPUs.

図８は従来のチップ型固体電解コンデンサの基板実装時の断面図である。１はコンデンサ素子であり、このコンデンサ素子１は一端を導出するように陽極引き出し線２を埋設した弁作用金属からなる粉末を成形、焼結して多孔質の陽極体を形成し、この陽極体に公知の方法で誘電体酸化皮膜を形成し、その表面に電解質層、陰極層（以上、図中省略）を順次形成することにより構成されている。   FIG. 8 is a cross-sectional view of a conventional chip-type solid electrolytic capacitor when mounted on a substrate. Reference numeral 1 denotes a capacitor element. The capacitor element 1 is formed by sintering and forming a powder made of a valve metal having an anode lead wire 2 embedded so as to lead out one end, thereby forming a porous anode body. In this method, a dielectric oxide film is formed by a known method, and an electrolyte layer and a cathode layer (not shown) are sequentially formed on the surface thereof.

さらに、コンデンサ素子１から導出した陽極引き出し線２を、起立部６ｃの先端の引き出し線接合部６ｂから起立部６ｃを介して基板実装面に露出面を有する基板実装面部６ｄからなる陽極端子６に電気的に接続、固定し、コンデンサ素子１の陰極層に導電性接着剤３を介して基板実装面に露出面を有する基板実装面部５ｄから植立した起立部５ｃからなる陰極端子５に接続、固定し、この接続部とコンデンサ素子１の全体を覆うように絶縁性の樹脂により外装し、この外装樹脂４を例えばダイシング加工など公知の方法で所望の外形寸法に成形して、チップ型電解固体コンデンサが構成されている。   Further, the anode lead wire 2 led out from the capacitor element 1 is connected to the anode terminal 6 composed of the substrate mounting surface portion 6d having an exposed surface on the substrate mounting surface from the lead wire joining portion 6b at the tip of the standing portion 6c via the standing portion 6c. Electrically connected and fixed, and connected to a cathode terminal 5 comprising a standing portion 5c planted from a substrate mounting surface portion 5d having an exposed surface on the substrate mounting surface via a conductive adhesive 3 on the cathode layer of the capacitor element 1, The exterior resin 4 is fixed and covered with an insulating resin so as to cover the whole of the connection portion and the capacitor element 1, and the exterior resin 4 is formed into a desired external dimension by a known method such as dicing, for example. A capacitor is configured.

上記チップ型固体電解コンデンサは、コンデンサ素子１と陰極端子５及び陽極端子６との接続構造がシンプルであるため、外装樹脂４に対するコンデンサ素子１の収納体積効率を向上できる。近年、携帯電話等の小型携帯機器における更なる軽薄短小化に要求されるチップ型固体電解コンデンサの小型大容量化・薄型化の進展に大きく寄与しており、例えば、特許文献1〜７など、多くの類似構造が提案されている。   Since the chip-type solid electrolytic capacitor has a simple connection structure between the capacitor element 1 and the cathode terminal 5 and the anode terminal 6, the storage volume efficiency of the capacitor element 1 with respect to the exterior resin 4 can be improved. In recent years, it has greatly contributed to the progress of miniaturization, large capacity and thinning of chip-type solid electrolytic capacitors required for further miniaturization in small portable devices such as mobile phones, such as Patent Documents 1-7, Many similar structures have been proposed.

しかしながら、上記従来のチップ型固体電解コンデンサにおいては、端子構造がシンプルであるため、外装樹脂４と陰極端子５、及び陽極端子６との結合力が弱く、基板１１への実装時または実装後に大きな機械的、熱的ストレスが加わった場合、陰極端子５、及び陽極端子６と外装樹脂４との境界面にクラック１２が発生し、電気的特性や信頼性に悪影響を及ぼしたり、最悪の場合、端子と外装樹脂４とが分離してしまうといった課題を有している。   However, since the conventional chip-type solid electrolytic capacitor has a simple terminal structure, the bonding force between the exterior resin 4, the cathode terminal 5, and the anode terminal 6 is weak, and is large when mounted on the substrate 11 or after mounting. When mechanical and thermal stress is applied, a crack 12 occurs at the interface between the cathode terminal 5 and the anode terminal 6 and the exterior resin 4, which adversely affects electrical characteristics and reliability. There is a problem that the terminal and the exterior resin 4 are separated.

特開昭５５−８６１１１号公報JP-A-55-86111 特開２００１−１２６９５８号公報JP 2001-126958 A 特開２００２−４３１７５号公報JP 2002-43175 A 特開２００１−３５８０３７号公報JP 2001-358037 A 特開２００１−３５８０３８号公報JP 2001-358038 A 特開２００１−３５８０４１号公報JP 2001-358041 A 特開２００２−１７０７４４号公報JP 2002-170744 A

本発明の課題は、端子と外装樹脂との結合力を弱めることなく、小型大容量のチップ型固体電解コンデンサおよびそれに用いる端子とその製造方法を提供することにある。   An object of the present invention is to provide a small-sized and large-capacity chip-type solid electrolytic capacitor, a terminal used therefor, and a method for manufacturing the same without weakening the bonding force between the terminal and the exterior resin.

本発明のチップ型固体電解コンデンサでは、陽極引き出し線が導出された弁作用金属からなる多孔質の焼結体の表面に誘電体、電解質、陰極層を順次形成したコンデンサ素子と、一端を外装樹脂の実装面側に露出するようにした基板実装面部と、他端を基板実装面部に対し略垂直に配設され、先端をコンデンサ素子から導出した陽極引き出し線と接続された起立部とからなる陽極端子と、同じく一端を外装樹脂の実装面側に露出するようにした基板実装面部と、他端を基板実装面部に対し略垂直に配設され、導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子と、前記コンデンサ素子を覆うと共に、前記陽極端子及び前記陰極端子を、基板実装面部及び前記基板実装面部と略垂直な外形側面に露出面を有するように外装する絶縁性の樹脂からなる外装材とを具備するチップ型固体電解コンデンサにおいて、前記陽極端子及び陰極端子の少なくとも一方の起立部に貫通孔を有する構成としたものである。   In the chip-type solid electrolytic capacitor of the present invention, a capacitor element in which a dielectric, an electrolyte, and a cathode layer are sequentially formed on the surface of a porous sintered body made of a valve action metal from which an anode lead wire is led out, and one end of which is an exterior resin An anode comprising a substrate mounting surface portion exposed to the mounting surface side, and an upright portion whose other end is disposed substantially perpendicular to the substrate mounting surface portion, and whose tip is connected to an anode lead wire led out from the capacitor element A terminal, a board mounting surface portion whose one end is exposed to the mounting surface side of the exterior resin, and the other end are arranged substantially perpendicular to the substrate mounting surface portion, and are connected to the capacitor element via a conductive adhesive. The cathode terminal formed of an upright portion and the capacitor element are covered, and the anode terminal and the cathode terminal are externally disposed so as to have an exposed surface on a substrate mounting surface portion and an outer side surface substantially perpendicular to the substrate mounting surface portion. In the chip type solid electrolytic capacitor comprising an exterior member made of an insulating resin that is obtained by a structure having a through hole on at least one upright portion of the anode and cathode terminals.

前記チップ型固体電解コンデンサの端子であって、一端を外装樹脂の実装面側に露出するようにした基板実装面部と、基板実装面部と略垂直に配設され一端を陽極引き出し線を介しコンデンサ素子に接続される起立部とからなる陽極端子と、同じく基板実装面部と、基板実装面と略垂直に配設され導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子の少なくとも一方は、前記起立部に貫通孔を有する構成としたものである。   A terminal of the chip-type solid electrolytic capacitor, one end of which is exposed to the mounting surface side of the exterior resin, and a capacitor element that is disposed substantially perpendicular to the substrate mounting surface and is connected to one end via an anode lead wire At least a cathode terminal comprising an upright portion connected to the capacitor element, a board mounting surface portion, and an upright portion disposed substantially perpendicular to the substrate mounting surface and connected to the capacitor element via a conductive adhesive. One is configured to have a through hole in the upright portion.

前記チップ型固体電解コンデンサの端子の製造方法であって、一端を外装樹脂の実装面側に露出するようにした基板実装面部と、基板実装面部と略垂直に配設され一端を陽極引き出し線を介しコンデンサ素子に接続される起立部とからなる陽極端子と、同じく基板実装面部と、基板実装面と略垂直に配設され導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子の少なくとも一方は、前記起立部に貫通孔を設けた後、前記基板実装面部に略垂直に接続したものである。   A method of manufacturing a terminal of the chip-type solid electrolytic capacitor, wherein one end of the chip-type solid electrolytic capacitor is exposed to the mounting surface side of the exterior resin, the substrate mounting surface portion is disposed substantially perpendicular to the substrate mounting surface portion, and one end is connected to the anode lead wire. An anode terminal composed of an upright portion connected to the capacitor element via a cathode, and a cathode comprising a substrate mounting surface portion, and an upright portion disposed substantially perpendicular to the substrate mounting surface and connected to the capacitor element via a conductive adhesive At least one of the terminals is formed by providing a through hole in the upright portion and then connecting substantially vertically to the substrate mounting surface portion.

前記基板実装面部の一部を***させて起立部とした後、前記起立部の所定位置に貫通孔を配けたものである。   After a part of the board mounting surface portion is raised to be an upright portion, a through hole is arranged at a predetermined position of the upright portion.

前記陽極端子及び前記陰極端子を形成する矩形状の板を、製品の外形下面である基板実装面に沿って、製品外形側面方向から内側に向かって延伸する基板実装面部と、前記製品外形側面と平行になる様、第１の曲げ部において実装面側と反対方向に折り曲げた後、第２の曲げ部において引き出し線接合部が頂点となるよう折り返して起立部としたものである。   A board-mounting surface portion extending from a product-outside side direction toward the inside along a board-mounting surface, which is a lower-side outer shape of the product, and a rectangular board forming the anode terminal and the cathode terminal; The first bent portion is bent in the direction opposite to the mounting surface side so as to be parallel, and then the second bent portion is folded back so that the lead wire joining portion becomes the apex, thereby forming an upright portion.

本発明によれば、端子部に貫通孔を設けることにより、外装樹脂の被覆時に端子の貫通孔に外装樹脂が充填され、外装樹脂と陰極端子或いは陽極端子との間にアンカー効果が発生し、端子と外装樹脂との結合度が高いチップ型固体電解コンデンサを安定して生産でき、また、基板実装時または実装後の熱的、機械的ストレスに対しても有効な、生産性、信頼性の向上したチップ型固体電解コンデンサおよびそれに用いる端子とその製造方法を提供することができる。   According to the present invention, by providing a through hole in the terminal portion, the exterior resin is filled in the through hole of the terminal when the exterior resin is coated, and an anchor effect occurs between the exterior resin and the cathode terminal or the anode terminal, Chip-type solid electrolytic capacitors with a high degree of bonding between the terminal and the exterior resin can be stably produced, and they are also effective against thermal and mechanical stresses during or after board mounting. An improved chip-type solid electrolytic capacitor, a terminal used therefor, and a manufacturing method thereof can be provided.

以下、本発明における実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明のチップ型固体電解コンデンサの中心線に沿った縦断面図である。図２は、本発明のチップ型固体電解コンデンサの陽極端子起立部の横断面図である。図３は、本発明のチップ型固体電解コンデンサの基板実装時の断面図である。   FIG. 1 is a longitudinal sectional view taken along the center line of the chip-type solid electrolytic capacitor of the present invention. FIG. 2 is a cross-sectional view of the upright portion of the anode terminal of the chip-type solid electrolytic capacitor of the present invention. FIG. 3 is a cross-sectional view of the chip-type solid electrolytic capacitor of the present invention when mounted on a substrate.

まず、コンデンサ素子１の作製については、タンタルを弁作用金属として用いた場合を説明する。陽極引き出し線２のまわりに、タンタル粉末を成形し、高真空・高温度で焼結する。次にタンタル金属粉末の表面にＴａ2Ｏ5の酸化被膜を形成する。更に、硝酸マンガンに浸漬した後、熱分解して、ＭｎＯ2を形成し、引き続き、グラファイト及びＡｇによる陰極層を形成して、コンデンサ素子１を得る。なお、陰極層のＭｎＯ2に換えて、ポリチオフェンあるいはポリピロールなどの導電性高分子を用いると、ＥＳＲ（等価直列抵抗）の低減に効果がある。また、弁作用金属として、タンタルの他に、ニオブ、アルミニウム、チタンなどを用いることができる。 First, regarding the production of the capacitor element 1, a case where tantalum is used as a valve metal will be described. A tantalum powder is formed around the anode lead wire 2 and sintered at high vacuum and high temperature. Next, an oxide film of Ta 2 O 5 is formed on the surface of the tantalum metal powder. Further, after being immersed in manganese nitrate, it is thermally decomposed to form MnO 2 , and subsequently, a cathode layer made of graphite and Ag is formed to obtain the capacitor element 1. If a conductive polymer such as polythiophene or polypyrrole is used instead of MnO 2 in the cathode layer, ESR (equivalent series resistance) can be reduced. In addition to tantalum, niobium, aluminum, titanium, or the like can be used as the valve metal.

図１、図２に示すように、コンデンサ素子１から導出した陽極引き出し線２を、一端を外装樹脂４の実装面側に露出するようにした基板実装面部６ｄと、他端を基板実装面部６ｄに対し略垂直に配設され貫通孔６ａを有する起立部６ｃとからなる陽極端子６に、引き出し線接合部６ｂにて抵抗溶接、レーザー溶接などの公知の手段により電気的に接続する。さらに、一端を外装樹脂４の実装面側に露出するようにした基板実装面部５ｄと、他端を基板実装面部５ｄに対し略垂直に配設され貫通孔５ａを有する起立部５ｃとからなる陰極端子５に、導電性接着剤３を介しコンデンサ素子１に接続する。次に、外装樹脂４をコンデンサ素子１を覆うようにトランスファーモールド成形した後、ダイシングソーにより所望形状に切断することによりチップ型固体電解コンデンサを得る。   As shown in FIGS. 1 and 2, the anode lead wire 2 led out from the capacitor element 1 has a substrate mounting surface portion 6 d with one end exposed on the mounting surface side of the exterior resin 4, and the other end mounted on the substrate mounting surface portion 6 d. The lead wire 6 is electrically connected to the anode terminal 6 which is disposed substantially perpendicular to the upright portion 6c having the through hole 6a by a known means such as resistance welding or laser welding. Further, a cathode comprising a substrate mounting surface portion 5d whose one end is exposed to the mounting surface side of the exterior resin 4, and an upright portion 5c having the other end disposed substantially perpendicular to the substrate mounting surface portion 5d and having a through hole 5a. The terminal 5 is connected to the capacitor element 1 through the conductive adhesive 3. Next, the exterior resin 4 is transfer molded so as to cover the capacitor element 1 and then cut into a desired shape by a dicing saw to obtain a chip-type solid electrolytic capacitor.

このチップ型固体電解コンデンサは、外装樹脂４による成形時に外装樹脂４が陰極および陽極端子起立部５ｃ、６ｃの貫通孔５ａ、６ａ内部に充填されるため、陰極および陽極端子５、６と外装樹脂４との間にアンカー効果が働き、すなわち、端子の貫通孔を通して内側（素子側）と外側の樹脂が結合し、分離されないため図３に示すような基板実装時において、図８に示したような従来の端子構造によるチップ型固体電解コンデンサに発生する、基板１１への実装時または実装後に受ける機械的、熱的ストレスによるクラック１２に起因する電気的特性や信頼性の低下といったトラブルを防止することが可能となる。   In this chip type solid electrolytic capacitor, since the exterior resin 4 is filled in the through holes 5a, 6a of the cathode and anode terminal standing portions 5c, 6c when molded with the exterior resin 4, the cathode and anode terminals 5, 6 and the exterior resin As shown in FIG. 8, when the substrate is mounted as shown in FIG. 3, the anchor effect works between the terminal 4 and the resin on the inner side (element side) and the outer side through the through hole of the terminal. This prevents a problem such as a decrease in electrical characteristics and reliability caused by a crack 12 caused by mechanical and thermal stress that occurs in a chip-type solid electrolytic capacitor having a conventional terminal structure during or after mounting on a substrate 11. It becomes possible.

次に、本実施の形態のチップ型固体電解コンデンサに用いる端子の作製方法について図４、図５及び図６を参照して説明する。   Next, a method for manufacturing a terminal used in the chip-type solid electrolytic capacitor of this embodiment will be described with reference to FIGS.

図４は、本発明の陰極或いは陽極端子（形成用リードフレーム）の第一の実施の形態を示す斜視図であり、図４（ａ）は、起立部の貫通孔形成後の斜視図であり、図４（ｂ）は基板実装面部を起立部に接続した後の斜視図である。   FIG. 4 is a perspective view showing a first embodiment of a cathode or anode terminal (formation lead frame) according to the present invention, and FIG. 4 (a) is a perspective view after a through hole is formed in an upright portion. FIG. 4B is a perspective view after the substrate mounting surface portion is connected to the upright portion.

図４（ａ）に示すように、矩形状の板からなる陰極および陽極端子起立部５ｃ、６ｃに、例えば打ち抜き、ドリル加工、レーザー加工など公知の手段により、所定形状、所定位置に貫通孔５ａ、６ａを設けた後、図４（ｂ）に示すように、同じく矩形状の板である陰極および陽極端子基板実装面部５ｄ、６ｄと略垂直に溶接、接着などの手段により接続し、陰極端子５及び陽極端子６を形成する。   As shown in FIG. 4 (a), the cathode and anode terminal rising portions 5c and 6c made of a rectangular plate are formed in a predetermined shape and at a predetermined position by a known means such as punching, drilling, or laser processing. 4a, as shown in FIG. 4 (b), the cathode and anode terminal substrate mounting surface portions 5d and 6d, which are also rectangular plates, are connected substantially perpendicularly by means such as welding and bonding, and the cathode terminal 5 and the anode terminal 6 are formed.

図５は、本発明の陰極或いは陽極端子の第二の実施の形態を示す斜視図であり、図５（ａ）は基板実装面部と起立部の形成後の斜視図であり、図５（ｂ）は起立部の貫通孔形成後の斜視図である。   FIG. 5 is a perspective view showing a second embodiment of the cathode or anode terminal of the present invention, and FIG. 5A is a perspective view after forming the substrate mounting surface portion and the upright portion, and FIG. ) Is a perspective view after formation of the through hole of the standing part.

図５（ａ）に示すように、陰極および陽極端子基板実装面部５ｄ、６ｄの一部をコイニングなどの手段により***させて起立部５ｃ、６ｃとした後、図５（ｂ）に示すごとく、起立部５ｃ、６ｃに、例えば打ち抜き、ドリル加工、レーザー加工など公知の手段により、所定形状、所定位置に貫通孔５ａ、６ａを設け陰極端子５及び陽極端子６を形成する。   As shown in FIG. 5 (a), as shown in FIG. 5 (b), after the cathode and anode terminal substrate mounting surface portions 5d, 6d are raised by means of coining or the like to be raised portions 5c, 6c. Through-holes 5a and 6a are provided in predetermined shapes and predetermined positions on the standing portions 5c and 6c by known means such as punching, drilling, and laser processing, for example, and the cathode terminal 5 and the anode terminal 6 are formed.

図６は、本発明の陰極或いは陽極端子の第三の実施の形態を示す斜視図であり、図６（ａ）は、矩形状の板に貫通孔を形成した後の斜視図であり、図６（ｂ）は、第二の曲げ加工中の斜視図であり、図６（ｃ）は、第三の曲げ加工後の斜視図であり、図６（ｄ）は仕上げ加工後の斜視図である。   FIG. 6 is a perspective view showing a third embodiment of the cathode or anode terminal of the present invention, and FIG. 6A is a perspective view after a through hole is formed in a rectangular plate. 6 (b) is a perspective view during the second bending process, FIG. 6 (c) is a perspective view after the third bending process, and FIG. 6 (d) is a perspective view after the finishing process. is there.

図６（ａ）に示すように、矩形状の板である端子部に、例えば打ち抜き、ドリル加工、レーザー加工など公知の手段により、所定形状、所定位置に陰極および陽極端子基板の貫通孔５ａ、６ａを設けた後、図６（ｂ）に示すごとく、製品の外形下面である基板実装面に沿って、製品外形側面方向から内側に向かって延伸する基板実装面部５ｄ、６ｄを、第１の曲げ部７において、実装面方向と反対に９０°の曲げ加工を行う。次いで、第２の曲げ部８において、実装面方向に１８０°の曲げ加工を行った後、製品外形側面方向から内側に向かって延伸するよう、図６（ｃ）に示すごとく、第３の曲げ部９にて９０°の曲げ加工を行うことにより、陰極端子５及び陽極端子６が形成され、更に必要に応じ、図６（ｄ）に示すように潰し、叩き等の仕上げ加工を行う。   As shown in FIG. 6 (a), through holes 5a of the cathode and anode terminal substrates in a predetermined shape and a predetermined position by a known means such as punching, drilling, laser processing, or the like on the terminal portion which is a rectangular plate, After providing 6a, as shown in FIG. 6B, the board mounting surface portions 5d and 6d extending inward from the product outer side surface direction along the board mounting surface, which is the outer lower surface of the product, In the bending part 7, a 90 degree bending process is performed opposite to the mounting surface direction. Next, as shown in FIG. 6 (c), the second bending portion 8 is bent 180 ° in the mounting surface direction and then extended inward from the product outer side surface direction, as shown in FIG. By performing the bending process of 90 ° in the part 9, the cathode terminal 5 and the anode terminal 6 are formed, and if necessary, a finishing process such as crushing and tapping is performed as shown in FIG. 6 (d).

図５及び図６に記載の実施の形態における作製方法により得られた陰極或いは陽極端子は、基板実装面部５ｄ、６ｄと起立部５ｃ、６ｃとが一体成形されているため、電気的接続性に優れた利点を有する。   The cathode or anode terminal obtained by the manufacturing method according to the embodiment shown in FIGS. 5 and 6 is formed with the substrate mounting surface portions 5d and 6d and the upright portions 5c and 6c integrally, so that the electrical connectivity is improved. Has excellent advantages.

以上、この発明の実施の形態を説明したが、この本発明は、この実施の形態に限られるものではなく、例えば貫通孔に角度を設けたり、段差を設けるといった設計変更、あるいは貫通孔の数、位置、形状など本発明の要旨を逸脱しない範囲の設計変更があっても、本発明に含まれる。すなわち、当業者であれば、なしえるであろう各種変形、修正を含むことはもちろんである。   The embodiment of the present invention has been described above, but the present invention is not limited to this embodiment. For example, a design change such as providing an angle or a step in a through hole, or the number of through holes. Even if there is a design change in a range that does not depart from the gist of the present invention, such as position, shape, etc., it is included in the present invention. That is, it goes without saying that various modifications and corrections that can be made by those skilled in the art are included.

陰極端子および陽極端子の基板実装面部の寸法が長さ０．５ｍｍ×幅０．６５ｍｍ×厚さ０．１ｍｍ、起立部の寸法が高さ０．５ｍｍ×幅０．６５ｍｍ×厚さ０．１ｍｍ、貫通孔の大きさが直径０．１５ｍｍにより製作された本発明によるチップ型固体電解コンデンサと、比較例として貫通孔を設けない他は、本発明と同様の構成のチップ型固体電解コンデンサそれぞれ１０個をＪＩＳＣ６００６８−２−２１「端子強度試験方法」に準拠した固着性試験を実施した結果を図７に示す。   The dimensions of the cathode terminal and the substrate mounting surface of the anode terminal are 0.5 mm long × 0.65 mm wide × 0.1 mm thick, and the dimensions of the raised portion are 0.5 mm high × 0.65 mm wide × 0.1 mm thick The chip-type solid electrolytic capacitor according to the present invention with a through-hole size of 0.15 mm and a chip-type solid electrolytic capacitor having the same configuration as the present invention except that no through-hole is provided as a comparative example. FIG. 7 shows the result of performing an adhesion test in accordance with JIS C60068-2-21 “Terminal Strength Test Method”.

本発明におけるチップ型固体電解コンデンサでは、端子の起立部に貫通孔を設けその内部に外装樹脂を充填させていることにより、端子と外装樹脂との間にアンカー効果が発生し固着強度が従来品に比較し増加していることが示されている。   In the chip-type solid electrolytic capacitor according to the present invention, a through hole is provided in the rising portion of the terminal and the interior is filled with the exterior resin, so that an anchor effect is generated between the terminal and the exterior resin, and the fixing strength is the conventional product. It is shown that there is an increase compared to

本発明のチップ型固体電解コンデンサの中心線に沿った縦断面図。The longitudinal cross-sectional view along the centerline of the chip-type solid electrolytic capacitor of this invention. 本発明のチップ型固体電解コンデンサの陽極端子起立部の横断面図。The cross-sectional view of the anode terminal standing part of the chip-type solid electrolytic capacitor of the present invention. 本発明のチップ型固体電解コンデンサの基板実装時の断面図。Sectional drawing at the time of board | substrate mounting of the chip-type solid electrolytic capacitor of this invention. 本発明の陰極或いは陽極端子の第一の実施の形態を示す斜視図、図４（ａ）は起立部の貫通孔形成後の斜視図、図４（ｂ）は基板実装面部を起立部に接続した後の斜視図。FIG. 4A is a perspective view showing a first embodiment of the cathode or anode terminal of the present invention, FIG. 4A is a perspective view after forming a through hole in the upright portion, and FIG. 4B is a view showing connecting the substrate mounting surface portion to the upright portion. FIG. 本発明の陰極或いは陽極端子の第二の実施の形態を示す斜視図、図５（ａ）は基板実装面部と起立部の形成後の斜視図、図５（ｂ）は起立部の貫通孔形成後の斜視図。FIG. 5A is a perspective view showing a second embodiment of the cathode or anode terminal of the present invention, FIG. 5A is a perspective view after formation of a substrate mounting surface portion and an upright portion, and FIG. 5B is a through hole formation of the upright portion. FIG. 本発明の陰極或いは陽極端子の第三の実施の形態を示す斜視図、図６（ａ）は矩形状の板に貫通孔を形成した後の斜視図、図６（ｂ）は第二の曲げ加工中の斜視図、図６（ｃ）は第三の曲げ加工後の斜視図であり、図６（ｄ）は仕上げ加工後の斜視図。FIG. 6A is a perspective view showing a cathode or anode terminal according to a third embodiment of the present invention, FIG. 6A is a perspective view after forming a through hole in a rectangular plate, and FIG. FIG. 6C is a perspective view after the third bending process, and FIG. 6D is a perspective view after the finishing process. 本発明及び従来のチップ型固体電解コンデンサの固着性試験結果を示すグラフ。The graph which shows the adhesiveness test result of this invention and the conventional chip type solid electrolytic capacitor. 従来のチップ型固体電解コンデンサの基板実装時の断面図。Sectional drawing at the time of board mounting of the conventional chip type solid electrolytic capacitor.

符号の説明Explanation of symbols

１ コンデンサ素子
２ 陽極引き出し線
３ 導電性接着剤
４ 外装樹脂
５ 陰極端子
５ａ （陰極端子）貫通孔
５ｃ （陰極端子）起立部
５ｄ （陰極端子）基板実装面部
６ 陽極端子
６ａ （陽極端子）貫通孔
６ｂ （陽極端子）引き出し線接合部
６ｃ （陽極端子）起立部
６ｄ （陽極端子）基板実装面部
７ 第１の曲げ部
８ 第２の曲げ部
９ 第３の曲げ部
１０ はんだ
１１ 基板
１２ クラック DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Anode lead wire 3 Conductive adhesive 4 Exterior resin 5 Cathode terminal 5a (Cathode terminal) Through-hole 5c (Cathode terminal) Standing part 5d (Cathode terminal) Board mounting surface part 6 Anode terminal 6a (Anode terminal) Through-hole 6b (Anode terminal) Lead wire joining portion 6c (Anode terminal) Standing portion 6d (Anode terminal) Board mounting surface portion 7 First bent portion 8 Second bent portion 9 Third bent portion 10 Solder 11 Substrate 12 Crack

Claims (5)

陽極引き出し線が導出された弁作用金属からなる多孔質の焼結体の表面に誘電体、電解質、陰極層を順次形成したコンデンサ素子と、一端を外装表面の実装面側に露出するようにした基板実装面部と、他端を基板実装面部に対し略垂直に配設され、先端をコンデンサ素子から導出した陽極引き出し線と接続された起立部とからなる陽極端子と、同じく一端を外装樹脂の実装面側に露出するようにした基板実装面部と、他端を基板実装面部に対し略垂直に配設され、導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子と、前記コンデンサ素子を覆うと共に、前記陽極端子及び前記陰極端子を、基板実装面部及び前記基板実装面部と略垂直な外形側面に露出面を有するように外装する絶縁性の樹脂からなる外装樹脂とを具備するチップ型固体電解コンデンサにおいて、前記陽極端子及び陰極端子の少なくとも一方の起立部に貫通孔を有することを特徴とするチップ型固体電解コンデンサ。   Capacitor element in which dielectric, electrolyte, and cathode layers are sequentially formed on the surface of a porous sintered body made of a valve metal from which the anode lead wire is led out, and one end is exposed to the mounting surface side of the exterior surface. An anode terminal consisting of a substrate mounting surface portion, an other end disposed substantially perpendicular to the substrate mounting surface portion, and an upright portion connected to an anode lead wire led out from the capacitor element at the tip, and one end mounted with exterior resin A cathode terminal comprising a substrate mounting surface portion exposed to the surface side, and a standing portion that is disposed substantially perpendicular to the substrate mounting surface portion at the other end and connected to the capacitor element via a conductive adhesive; Covering the capacitor element, and including the anode terminal and the cathode terminal, and an exterior resin made of an insulating resin for exteriorly covering the substrate mounting surface portion and an exposed side surface substantially perpendicular to the substrate mounting surface portion. In the chip type solid electrolytic capacitor, chip-type solid electrolytic capacitor characterized by having at least one standing portion into the through hole of the anode and cathode terminals. 陽極引き出し線が導出され、陰極層が形成された、コンデンサ素子に外装樹脂を被装してなるチップ型固体電解コンデンサの端子であって、一端を外装樹脂の実装面側に露出するようにした基板実装面部と、基板実装面部と略垂直に配設され一端を陽極引き出し線を介しコンデンサ素子に接続される起立部とからなる陽極端子と、同じく基板実装面部と、基板実装面と略垂直に配設され導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子の少なくとも一方は、前記起立部に貫通孔を有することを特徴とする端子。   A terminal of a chip-type solid electrolytic capacitor in which an anode lead-out line is led out and a cathode layer is formed and a capacitor element is covered with an exterior resin, and one end is exposed to the mounting surface side of the exterior resin. An anode terminal comprising a substrate mounting surface portion, an upright portion disposed substantially perpendicular to the substrate mounting surface portion and having one end connected to the capacitor element via the anode lead wire, and also substantially perpendicular to the substrate mounting surface portion and the substrate mounting surface. A terminal characterized in that at least one of the cathode terminals including a standing portion disposed and connected to a capacitor element via a conductive adhesive has a through hole in the standing portion. 一端を外装樹脂の実装面側に露出するようにした基板実装面部と、基板実装面部と略垂直に配設され一端を陽極引き出し線を介しコンデンサ素子に接続される起立部とからなる陽極端子と、同じく基板実装面部と、基板実装面と略垂直に配設され導電性接着剤を介しコンデンサ素子に接続される起立部とからなる陰極端子の少なくとも一方は、前記起立部に貫通孔を設けた後、前記基板実装面部に略垂直に接続することを特徴とする請求項２記載の端子の製造方法。   An anode terminal comprising: a substrate mounting surface portion whose one end is exposed to the mounting surface side of the exterior resin; and an upright portion disposed substantially perpendicular to the substrate mounting surface portion and connected to the capacitor element via an anode lead wire. Similarly, at least one of the cathode terminal including the substrate mounting surface portion and the standing portion that is disposed substantially perpendicular to the substrate mounting surface and is connected to the capacitor element via the conductive adhesive has a through hole in the standing portion. 3. The method of manufacturing a terminal according to claim 2, wherein the connection is made substantially perpendicularly to the board mounting surface. 前記基板実装面部の一部を***させて起立部とした後、前記起立部の所定位置に貫通孔を設けることを特徴とする、請求項２記載の端子の製造方法。   The method for manufacturing a terminal according to claim 2, wherein a through hole is provided at a predetermined position of the rising portion after a part of the substrate mounting surface portion is raised to be a rising portion. 前記陽極端子及び前記陰極端子を形成する矩形状の板を、製品の外形下面である基板実装面に沿って、製品外形側面方向から内側に向かって延伸する基板実装面部と、前記製品外形側面と平行になる様、第１の曲げ部において実装面側と反対方向に折り曲げた後、第２の曲げ部において引き出し線接合部が頂点となるよう折り返して起立部とすることを特徴とする、請求項２記載の端子の製造方法。   A board-mounting surface portion extending from a product-outside side direction toward the inside along a board-mounting surface, which is a lower-side outer shape of the product, and a rectangular board forming the anode terminal and the cathode terminal; The first bent portion is bent in a direction opposite to the mounting surface side so as to be parallel to each other, and then the second bent portion is folded back so that the lead wire joining portion becomes the apex to form an upright portion. Item 3. A method for producing a terminal according to Item 2.
JP2005266187A 2005-09-14 2005-09-14 Chip type solid electrolytic capacitor, terminals, and method for manufacturing them Pending JP2007081069A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141142A (en) * 2007-12-06 2009-06-25 Sanyo Electric Co Ltd Solid electrolytic capacitor
JP2009170682A (en) * 2008-01-17 2009-07-30 Sanyo Electric Co Ltd Solid-state electrolytic capacitor
US20110051324A1 (en) * 2009-08-27 2011-03-03 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and a method for manufacturing the same
JP2011222616A (en) * 2010-04-06 2011-11-04 Shindengen Electric Mfg Co Ltd Magnetic substrate and electronic circuit module
US20110310531A1 (en) * 2010-06-17 2011-12-22 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and method of manufacturing the same
JP2012156568A (en) * 2012-05-24 2012-08-16 Sanyo Electric Co Ltd Solid electrolytic capacitor
US8514550B2 (en) * 2011-03-11 2013-08-20 Avx Corporation Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive

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JPS52164244U (en) * 1976-06-08 1977-12-13
JP2005079357A (en) * 2003-09-01 2005-03-24 Nec Tokin Corp Chip type solid electrolytic capacitor, its manufacturing method, and lead frame used therefor

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JPS52164244U (en) * 1976-06-08 1977-12-13
JP2005079357A (en) * 2003-09-01 2005-03-24 Nec Tokin Corp Chip type solid electrolytic capacitor, its manufacturing method, and lead frame used therefor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141142A (en) * 2007-12-06 2009-06-25 Sanyo Electric Co Ltd Solid electrolytic capacitor
US8081421B2 (en) 2007-12-06 2011-12-20 Sanyo Electric Co., Ltd. Solid electrolytic capacitor
US8559166B2 (en) 2007-12-06 2013-10-15 Sanyo Electric Co., Ltd. Solid electrolytic capacitor
JP2009170682A (en) * 2008-01-17 2009-07-30 Sanyo Electric Co Ltd Solid-state electrolytic capacitor
US20110051324A1 (en) * 2009-08-27 2011-03-03 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and a method for manufacturing the same
CN102005312A (en) * 2009-08-27 2011-04-06 三洋电机株式会社 Solid electrolytic capacitor and a method for manufacturing the same
US8562695B2 (en) 2009-08-27 2013-10-22 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and a method for manufacturing the same
JP2011222616A (en) * 2010-04-06 2011-11-04 Shindengen Electric Mfg Co Ltd Magnetic substrate and electronic circuit module
US20110310531A1 (en) * 2010-06-17 2011-12-22 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and method of manufacturing the same
US8753409B2 (en) 2010-06-17 2014-06-17 Sanyo Electric Co., Ltd. Solid electrolytic capacitor and method of manufacturing the same
US8514550B2 (en) * 2011-03-11 2013-08-20 Avx Corporation Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive
JP2012156568A (en) * 2012-05-24 2012-08-16 Sanyo Electric Co Ltd Solid electrolytic capacitor

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