JP2007065521A - 基板貼合装置 - Google Patents
基板貼合装置 Download PDFInfo
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- JP2007065521A JP2007065521A JP2005254302A JP2005254302A JP2007065521A JP 2007065521 A JP2007065521 A JP 2007065521A JP 2005254302 A JP2005254302 A JP 2005254302A JP 2005254302 A JP2005254302 A JP 2005254302A JP 2007065521 A JP2007065521 A JP 2007065521A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
真空中での基板の貼り合せを高精度に行うことができる基板貼合装置を提供することである。
【解決手段】
貼り合わせ前の2枚の基板を搬入する第1チャンバ室C1と、基板の貼り合わせを行う第2チャンバ室C2と、貼り合わせ後の基板の搬出を行う第3チャンバ室C3とからなり、第1チャンバン室内と第3チャンバ室内とは大気圧から中真空状態にまで可変制御し、第2チャンバ室は中真空から高真空まで可変制御するように構成した。
【選択図】 図1
Description
貼り合わせ前の2枚の基板を搬入する第1チャンバ室と、基板の貼り合わせを行う第2チャンバ室と、貼り合わせ後の基板の搬出を行う第3チャンバ室とからなり、第1チャンバン室内と第3チャンバ室内とは大気圧から中真空状態にまで可変制御し、第2チャンバ室は中真空から高真空まで可変制御するように構成した。
第2チャンバ室への基板の搬入、貼り合せ基板の搬出は略同時に行うことで、基板貼り合わせ時間を大幅に短縮することが可能となる。そのとき第1〜第3チャンバ室の真空度は中真空状態となっており、基板を吸引吸着で保持できる状態となっている。すなわち、吸引吸着用の真空度は高真空状態の負圧を供給する構成としてある。
Claims (6)
- 上下基板をそれぞれ搬入するための搬入用ロボットアームを設けた第1チャンバン室と、第1チャンバ室内を大気圧から中真空状態にする真空ポンプと、
中真空状態で2枚の基板を受け取り、高真空状態で2枚の基板をそれぞれ保持する上テーブルと、下テーブルとを備え、いずれか一方のテーブルを水平方向に移動して、上下2枚の基板の位置合わせをし、上下いずれか一方のテーブルを上下に動作させて基板間隔を狭めて貼り合わせを行う第2チャンバ室と、
中真空状態で、貼り合わせた基板を第2チャンバ室から搬出するロボットアームを備え、大気状態で前記貼り合わせた基板を室外に搬出する第3チャンバ室とを備え、
前記第1チャンバン室と第2チャンバ室と、第3チャンバン室にそれぞれの室内の圧力を計測する計測手段を備え、それぞれの部屋の真空度を制御する制御手段を設けたことを特徴とする基板貼合装置。 - 請求項1に記載の基板貼合装置において、第1〜第3チャンバ各々に中真空状態にて基板を吸引吸着するための真空ポンプを有すること及び、吸引吸着系をチャンバ内と接続しその中間に設けたバルブの開閉により吸引吸着力を制御することを特徴とする基板貼合装置。
- 請求項1に記載の貼り合わせ装置において、第2チャンバ内の上テーブルに高真空状態で基板を保持するのに粘着力を用いたチャックを用いることを特徴とする基板貼合せ装置
- 請求項1に記載の基板貼合装置において、第2チャンバ内の上テーブルに高真空状態で基板を保持するのに静電吸着力を用いたチャックを用いることを特徴とする基板貼合装置。
- 請求項1に記載の基板貼合装置において、貼り合せ後の上下基板の位置ずれを防止するために、基板搬送時にチャンバ内を中真空状態にすることを特徴とする基板貼合装置。
- 請求項1に記載の基板貼合装置において、中真空状態にて基板保持に吸引吸着を用いるため、吸引吸着により排気される気体を常時チャンバに供給する機構を有することを特徴とする基板貼合装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005254302A JP4107316B2 (ja) | 2005-09-02 | 2005-09-02 | 基板貼合装置 |
TW095127813A TW200714951A (en) | 2005-09-02 | 2006-07-28 | Substrate assembly apparatus and method |
KR1020060078352A KR100795136B1 (ko) | 2005-09-02 | 2006-08-18 | 기판 조립장치와 기판 조립방법 |
CNB2006101110767A CN100451775C (zh) | 2005-09-02 | 2006-08-18 | 基板组装装置和基板组装方法 |
US11/513,071 US20070051462A1 (en) | 2005-09-02 | 2006-08-31 | Substrate assembly apparatus and method |
US11/877,224 US20080053619A1 (en) | 2005-09-02 | 2007-10-23 | Substrate assembly apparatus and method |
US13/306,060 US20120067525A1 (en) | 2005-09-02 | 2011-11-29 | Substrate assembly apparatus and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005254302A JP4107316B2 (ja) | 2005-09-02 | 2005-09-02 | 基板貼合装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007065521A true JP2007065521A (ja) | 2007-03-15 |
JP4107316B2 JP4107316B2 (ja) | 2008-06-25 |
Family
ID=37828974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005254302A Expired - Fee Related JP4107316B2 (ja) | 2005-09-02 | 2005-09-02 | 基板貼合装置 |
Country Status (5)
Country | Link |
---|---|
US (3) | US20070051462A1 (ja) |
JP (1) | JP4107316B2 (ja) |
KR (1) | KR100795136B1 (ja) |
CN (1) | CN100451775C (ja) |
TW (1) | TW200714951A (ja) |
Cited By (3)
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WO2010090223A1 (ja) * | 2009-02-05 | 2010-08-12 | 株式会社日立プラントテクノロジー | 基板表面の封止装置と有機elパネルの製造方法 |
JP2012039089A (ja) * | 2010-06-22 | 2012-02-23 | Soytec | 半導体デバイス製造装置 |
JP2013542602A (ja) * | 2010-10-15 | 2013-11-21 | エーファウ・グループ・ゲーエムベーハー | ウェハを処理するためのデバイスおよび方法 |
Families Citing this family (25)
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JP4107316B2 (ja) * | 2005-09-02 | 2008-06-25 | 株式会社日立プラントテクノロジー | 基板貼合装置 |
KR101311855B1 (ko) * | 2006-12-08 | 2013-09-27 | 엘아이지에이디피 주식회사 | 기판합착장치 및 기판합착방법 |
US8387674B2 (en) | 2007-11-30 | 2013-03-05 | Taiwan Semiconductor Manufacturing Comany, Ltd. | Chip on wafer bonder |
TW200931101A (en) * | 2007-12-12 | 2009-07-16 | Chung Shan Inst Of Science | Method of assembling LCD panel, interface apparatus, and assembling apparatus |
JP4288297B1 (ja) | 2008-01-09 | 2009-07-01 | 三菱重工業株式会社 | 圧力制御装置および圧力制御方法 |
US7947570B2 (en) * | 2008-01-16 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method and manufacturing apparatus of semiconductor substrate |
FR2935536B1 (fr) * | 2008-09-02 | 2010-09-24 | Soitec Silicon On Insulator | Procede de detourage progressif |
CN101585668B (zh) * | 2008-10-23 | 2010-10-13 | 刘苏海 | 一种夹层玻璃成型机 |
JP4796120B2 (ja) * | 2008-12-11 | 2011-10-19 | 三菱重工業株式会社 | 常温接合装置 |
EP2200077B1 (en) * | 2008-12-22 | 2012-12-05 | Soitec | Method for bonding two substrates |
TW201131689A (en) | 2009-07-21 | 2011-09-16 | Nikon Corp | Substrate holder system, substrate joining apparatus and method for manufacturing a device |
TWI593048B (zh) * | 2009-07-21 | 2017-07-21 | 尼康股份有限公司 | Substrate processing system, substrate holder, substrate holder pair, substrate bonding apparatus, and device manufacturing method |
KR101073558B1 (ko) * | 2009-10-08 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 기판 합착 장치 및 기판 합착 방법 |
US8338266B2 (en) | 2010-08-11 | 2012-12-25 | Soitec | Method for molecular adhesion bonding at low pressure |
JP5334135B2 (ja) | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | 積層装置 |
FR2964193A1 (fr) | 2010-08-24 | 2012-03-02 | Soitec Silicon On Insulator | Procede de mesure d'une energie d'adhesion, et substrats associes |
CN102012581B (zh) | 2010-09-30 | 2012-08-22 | 深圳市华星光电技术有限公司 | 液晶盒成盒装置及其方法 |
CN102514341B (zh) * | 2011-11-24 | 2014-09-17 | 深圳市宝德自动化精密设备有限公司 | 精密真空oca贴合机及贴合生产方法 |
EP2924536B1 (de) * | 2014-03-28 | 2016-05-18 | RAMPF Production Systems GmbH & Co. KG | Verfahren und Vorrichtung zum Befestigen einer Schutzplatte an einem Display |
CN104730743B (zh) * | 2015-03-31 | 2018-07-27 | 合肥鑫晟光电科技有限公司 | 真空贴合设备 |
US20170207191A1 (en) * | 2016-01-15 | 2017-07-20 | Taiwan Semiconductor Manufacturing Company Ltd. | Bonding system and associated apparatus and method |
KR102041044B1 (ko) | 2018-04-30 | 2019-11-05 | 피에스케이홀딩스 주식회사 | 기판 지지 유닛 |
US11604372B2 (en) | 2018-11-15 | 2023-03-14 | HKC Corporation Limited | Method and control device for laminating display panel as well as vacuum laminator |
CN109581707B (zh) * | 2018-11-15 | 2021-02-26 | 惠科股份有限公司 | 贴合显示面板的方法、控制装置及真空贴合机 |
CN110120181A (zh) * | 2019-04-16 | 2019-08-13 | 武汉华星光电技术有限公司 | 加压脱泡装置及加压脱泡方法 |
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-
2005
- 2005-09-02 JP JP2005254302A patent/JP4107316B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-28 TW TW095127813A patent/TW200714951A/zh not_active IP Right Cessation
- 2006-08-18 KR KR1020060078352A patent/KR100795136B1/ko not_active IP Right Cessation
- 2006-08-18 CN CNB2006101110767A patent/CN100451775C/zh not_active Expired - Fee Related
- 2006-08-31 US US11/513,071 patent/US20070051462A1/en not_active Abandoned
-
2007
- 2007-10-23 US US11/877,224 patent/US20080053619A1/en not_active Abandoned
-
2011
- 2011-11-29 US US13/306,060 patent/US20120067525A1/en not_active Abandoned
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JPS61291631A (ja) * | 1985-06-17 | 1986-12-22 | Honda Motor Co Ltd | 真空処理方法および装置 |
JPH02235329A (ja) * | 1989-03-08 | 1990-09-18 | Mitsubishi Electric Corp | 半導体基板処理装置 |
JPH0636198U (ja) * | 1992-10-06 | 1994-05-13 | 日新電機株式会社 | 真空処理装置 |
JP2001305563A (ja) * | 2000-04-19 | 2001-10-31 | Hitachi Techno Eng Co Ltd | 基板貼合装置 |
JP2002229044A (ja) * | 2000-11-30 | 2002-08-14 | Fujitsu Ltd | 貼合せ基板製造装置 |
JP2003270609A (ja) * | 2002-03-19 | 2003-09-25 | Fujitsu Ltd | 貼合せ基板製造装置及び貼合せ基板製造方法 |
JP2004102215A (ja) * | 2002-07-19 | 2004-04-02 | Hitachi Industries Co Ltd | 基板組立装置 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012039089A (ja) * | 2010-06-22 | 2012-02-23 | Soytec | 半導体デバイス製造装置 |
JP2012099839A (ja) * | 2010-06-22 | 2012-05-24 | Soytec | 半導体デバイス製造装置 |
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US20070051462A1 (en) | 2007-03-08 |
TWI346225B (ja) | 2011-08-01 |
JP4107316B2 (ja) | 2008-06-25 |
US20080053619A1 (en) | 2008-03-06 |
TW200714951A (en) | 2007-04-16 |
US20120067525A1 (en) | 2012-03-22 |
KR100795136B1 (ko) | 2008-01-17 |
CN100451775C (zh) | 2009-01-14 |
CN1936678A (zh) | 2007-03-28 |
KR20070026019A (ko) | 2007-03-08 |
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