JP2007053207A

JP2007053207A - Inspection device and method of component mounting state

Info

Publication number: JP2007053207A
Application number: JP2005236803A
Authority: JP
Inventors: Akira Yamada; 山田　　晃; Ryoichiro Katano; 良一郎片野; Shinjiro Tsuji; 慎治郎辻
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2005-08-17
Filing date: 2005-08-17
Publication date: 2007-03-01
Anticipated expiration: 2025-08-17
Also published as: JP4654829B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device of a component mounting state which inspects the deviation of mounting position and the crimped state of a component in a substrate efficiently and with a high productivity, with the component being mounted by crimping it in the end of the substrate. <P>SOLUTION: The inspection device 1 of a component mounting state inspects the mounting states of the individual components after the components are mounted in a plurality of electrodes formed in the end of the substrate 2. The inspection device 1 comprises: a substrate holder 4 which has the substrate 2 placed thereon and can move between the delivery position and the inspection position; a substrate sucking holder 9 which sucks and holds a portion near the end of the substrate 2 positioned at the inspection position along the end; deviation detection cameras 12a and 12b for observing the deviation of the mounting positions of the components, with respect to the corresponding electrodes of the substrate 2; a indentation detection camera 13 for observing the crimped states of the components with respect to the electrodes; and a moving table unit 14 as a camera driver for moving the deviation detection cameras 12a and 12b and the indentation detection camera 13 on the axial center along the end part of the substrate 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、基板の端部に設けられた複数の電極部にそれぞれ実装された部品の実装位置ずれと圧着状態を検査する部品実装状態検査装置及び方法に関するものである。 The present invention relates to a component mounting state inspection apparatus and method for inspecting a mounting position shift and a crimping state of components respectively mounted on a plurality of electrode portions provided on an end portion of a substrate.

近年、液晶ディスプレイやプラズマディスプレイなどのフラットパネルディスプレイ（以下、ＦＰＤと記す）は、大画面化並びにハイビジョン放送などに対応するために、基板の大型化が進行するとともに実装する部品の高精細度化と部品数の増加を来しており、その結果、部品実装位置の位置ずれ検査や、部品と基板の電極の圧着状態の検査を行う工程に、多くの時間と手間がかかるとともに、大掛かりな検査設備が必要になり、大型のＦＰＤのコスト高の原因となっている。 In recent years, flat panel displays (hereinafter referred to as FPDs) such as liquid crystal displays and plasma displays have been increasing in size and increasing the definition of components to be mounted in order to support larger screens and high-definition broadcasting. As a result, the process for inspecting misalignment of the component mounting position and inspecting the crimping state of the component and board electrodes takes a lot of time and labor, and a large-scale inspection. Equipment is required, which is a cause of high cost of large FPD.

従来のＦＰＤにおける部品実装状態の検査装置としては、部品実装後の実装位置ずれを検査する装置として、基板の電極部に設けられた位置マークと部品に設けられた位置マークを、基板の部品実装面とは反対側から認識カメラで画像認識し、両位置マークの相対位置関係から実装位置ずれを検査するようにしたものが知られている（例えば、特許文献１参照。）。なお、位置マークに代えて、部品のリードと基板の電極の位置を認識するようにしたものも知られている。 As a device for inspecting the mounting state of components in a conventional FPD, as a device for inspecting a mounting position deviation after mounting a component, a position mark provided on the electrode part of the substrate and a position mark provided on the component are mounted on the component of the substrate. It is known that an image is recognized by a recognition camera from the side opposite to the surface and a mounting position deviation is inspected from the relative positional relationship between both position marks (see, for example, Patent Document 1). It is also known that the position of the component lead and the electrode of the substrate is recognized instead of the position mark.

また、部品の圧着状態の検査装置として、基板の電極と部品の電極の間に異方導電材を介装した状態で熱圧着することにより実装された部品の圧着状態を検査するために、異方導電材中の導電粒子の圧着箇所における基板の電極の***状態を微分干渉顕微鏡により観察するようにしたものが知られている（例えば、特許文献２参照。）。この検査装置においては、微分干渉顕微鏡に対して基板を載置したステージを移動させ、検査箇所が自動的に順次微分干渉顕微鏡の下に位置決めされるように構成されている。 In addition, as a device for checking the crimping state of a component, in order to inspect the crimping state of a mounted component by thermocompression bonding with an anisotropic conductive material interposed between the electrode of the substrate and the electrode of the component, There is known a technique in which a raised state of an electrode of a substrate at a press-bonded portion of conductive particles in a conductive material is observed with a differential interference microscope (for example, see Patent Document 2). In this inspection apparatus, the stage on which the substrate is placed is moved with respect to the differential interference microscope, and the inspection location is automatically and sequentially positioned under the differential interference microscope.

また、部品の実装位置ずれと部品の圧着状態の検査を同一のカメラで行うようにしたものも知られている（例えば、特許文献３参照。）。
特許第２９２９９２６号明細書特開２００３−２６９９３４号公報特許第３３２３３９５号明細書 In addition, there is also known one in which a component mounting position shift and a component crimping state inspection are performed by the same camera (for example, see Patent Document 3).
Japanese Patent No. 2929926 JP 2003-269934 A Japanese Patent No. 3323395

ところで、基板に部品を実装した後、その実装位置ずれと圧着状態の検査を行う場合に、特許文献１と特許文献２にそれぞれ開示された検査装置に部品を実装された基板を順次搬送して検査を行うようにすると、設備が大掛かりとなるとともに、検査装置間での搬送・位置決めなどに時間がかかり、検査工程の生産性が良くなく、特に基板の大型化と高精細度の進展に伴い、極めて大きな問題となって来ている。 By the way, after mounting components on the board, when inspecting the mounting position deviation and the crimping state, the boards on which the components are mounted are sequentially transported to the inspection apparatuses disclosed in Patent Document 1 and Patent Document 2, respectively. If inspection is performed, the equipment will be large, and it will take time to transfer and position between inspection devices, resulting in poor inspection process productivity, especially with the increase in substrate size and high definition. It has become a very big problem.

また、これに対して特許文献３に開示されているように、単一の装置で基板にＩＣ部品を接合し、実装位置ずれの検査と圧着状態の検査を１台の共通の認識カメラで行うようにした構成では、検査装置間での搬送位置決めが必要でない点では生産性が向上するが、逆に認識カメラとして視野切替や微分干渉顕微鏡機能への切替が行える構成とする必要があって極めて高価な認識カメラが必要となるため、コスト高になるとともに、位置ずれと圧着状態の検査を別々に順次行う必要があるため、検査に時間がかかるため、やはり検査工程の生産性が良くないという問題がある。 On the other hand, as disclosed in Patent Document 3, an IC component is bonded to a substrate with a single device, and a mounting position shift inspection and a crimped state inspection are performed by one common recognition camera. In such a configuration, productivity is improved in that the conveyance positioning between the inspection apparatuses is not necessary, but conversely, as a recognition camera, it is necessary to have a configuration that can switch to a visual field switching or a differential interference microscope function. Since an expensive recognition camera is required, the cost is high, and since it is necessary to sequentially inspect the positional deviation and the crimped state separately, the inspection takes time, so the inspection process productivity is also not good. There's a problem.

本発明は、上記従来の課題を解決するもので、基板の端部に部品を圧着して実装した基板における実装位置ずれと圧着状態の検査を効率的に生産性良く行うことができる部品実装状態検査装置及び方法を提供することを目的とする。 The present invention solves the above-described conventional problems, and is a component mounting state in which a mounting position shift and a crimping state inspection can be efficiently performed with good productivity on a substrate mounted by crimping a component to an end portion of the substrate. An object is to provide an inspection apparatus and method.

本発明の部品実装状態検査装置は、基板の端部に設けられた複数の電極部にそれぞれ部品を実装した後、各部品の実装状態を検査する部品実装状態検査装置であって、基板を載置して基板の受け渡し位置と検査位置との間で移動可能な基板保持部と、検査位置に位置決めされた基板の端部付近を端部に沿って吸着して支持する基板吸着支持部と、基板の電極部に対する部品の実装位置ずれを検出するずれ検出カメラと、電極部に対する部品の圧着状態を検出する圧痕検出カメラと、ずれ検出カメラと圧痕検出カメラを基板の端部に沿う軸心上を移動させるカメラ駆動部とを備えたものである。 The component mounting state inspection apparatus of the present invention is a component mounting state inspection device that inspects the mounting state of each component after mounting the component on each of the plurality of electrode portions provided on the end portion of the substrate. A substrate holding unit movable between the substrate delivery position and the inspection position, and a substrate suction support unit for adsorbing and supporting the vicinity of the end of the substrate positioned at the inspection position along the end; A displacement detection camera that detects a mounting position shift of a component with respect to an electrode portion of a board, an indentation detection camera that detects a crimping state of a component with respect to the electrode portion, and a displacement detection camera and an indentation detection camera on an axis along the edge of the substrate And a camera driving unit that moves the camera.

また、本発明の部品実装状態検査方法は、基板の端部に設けられた複数の電極部にそれぞれ部品を実装した後、各部品の実装状態を検査する部品実装状態検査方法であって、基板を検査位置に移動させる工程と、検査位置で基板の端部付近を端部に沿って吸着支持する工程と、ずれ検出カメラと圧痕検出カメラを基板の端部に沿う軸心上を移動させ、各電極部に実装された部品の電極部に対する実装位置ずれと電極部に対する部品の圧着状態を順次検出する工程とを備えたものである。 Also, the component mounting state inspection method of the present invention is a component mounting state inspection method for inspecting the mounting state of each component after mounting the component on each of the plurality of electrode portions provided at the end of the substrate, Moving the inspection position to the inspection position, adsorbing and supporting the vicinity of the edge of the substrate along the edge at the inspection position, moving the displacement detection camera and the indentation detection camera on the axis along the edge of the substrate, A step of sequentially detecting a mounting position shift of the component mounted on each electrode portion with respect to the electrode portion and a crimping state of the component with respect to the electrode portion is provided.

この構成によると、基板を基板保持部にて位置決めし、基板の端部付近を基板吸着支持部にて吸着支持した状態で、ずれ検出カメラを移動させて各部品の実装位置ずれの検査を順次行うと同時に、それと並行して圧痕検出カメラを移動させて各部品の圧着状態の検査を順次行うことにより、部品の実装位置ずれと圧着状態の検査を同時に並行して行うことができて効率的に短時間で両検査を行うことができ、また部品が実装されている基板の端部近傍を吸着保持するので、大型の基板においても撓みを生じることなく高精度に位置規制され、焦点合わせなどの調整に時間がかからず、速やかに適正な検査を行うことができ、また基板を固定してカメラを移動させるので、基板が大型化してもコンパクトな装置にでき、また単一の装置でかつずれ検出カメラと圧痕検出カメラはそれぞれ単機能であるためコスト的にも高価にならず、かくして実装位置ずれと圧着状態の検査を効率的に生産性良く行うことができる。 According to this configuration, the substrate is positioned by the substrate holding portion, and the displacement detection camera is moved to sequentially inspect the mounting position displacement of each component while the vicinity of the end portion of the substrate is suction supported by the substrate suction support portion. At the same time, by moving the indentation detection camera in parallel and sequentially inspecting the crimped state of each component, it is possible to perform the component mounting position deviation and the crimped state inspection simultaneously and efficiently. Both inspections can be performed in a short time, and the vicinity of the edge of the board on which the component is mounted is sucked and held, so that even a large board can be positioned with high accuracy without causing deflection, focusing, etc. It takes less time to adjust, and can quickly perform appropriate inspections. Also, the substrate is fixed and the camera is moved, so even if the substrate becomes larger, it can be made compact and a single device can be used. One time Detection camera and indentations detection camera not each expensive in terms of cost because a single function, thus the examination of the mounting position deviation and the crimping state can be carried out efficiently with high productivity.

また、カメラ駆動部は、ずれ検出カメラと圧痕検出カメラを所定間隔あけた状態で同期して移動させるようにすると、両カメラを各部品に対応して個々に位置決めする必要がないので、一層効率的に検査することができる。また、基板の種類に応じて部品の配置間隔が異なる場合があるので、ずれ検出カメラと圧痕検出カメラの間隔を可変できるように構成しておくのが好適である In addition, if the camera drive unit moves the displacement detection camera and the indentation detection camera synchronously with a predetermined interval therebetween, it is not necessary to position both cameras individually corresponding to each part, so that it is more efficient. Can be inspected automatically. In addition, since the arrangement interval of components may differ depending on the type of the board, it is preferable that the interval between the displacement detection camera and the indentation detection camera can be varied.

また、カメラ駆動部は、ずれ検出カメラと圧痕検出カメラを独立して移動させるように構成してもよく、その場合、例えば部品の実装位置ずれは全数検査し、検査に時間を要する圧着状態は両端だけ、又は両端と中央部についてのみ検査するだけで良い場合など、種々の検査態様に効率的に対応することができる。 In addition, the camera drive unit may be configured to move the displacement detection camera and the indentation detection camera independently. It is possible to efficiently cope with various inspection modes, for example, when it is sufficient to inspect only both ends or only both ends and the central portion.

また、基板の端部に沿って複数のずれ検出カメラを備え、カメラ駆動部は各ずれ検出カメラの間隔を可変できるようにすると、複数のずれ検出カメラにて各部品の複数の認識箇所を一度に検出して位置ずれを検査することができる。また、部品の種類に応じて認識箇所の間隔が異なるが、ずれ検出カメラの間隔を可変することで対応することができる。 In addition, a plurality of displacement detection cameras are provided along the edge of the board, and the camera drive unit can change the interval between the respective displacement detection cameras. It is possible to inspect the positional deviation by detecting the above. Moreover, although the interval of the recognition location differs depending on the type of component, it can be dealt with by changing the interval of the displacement detection camera.

また、圧痕検出カメラを基板表面に対して接近離間方向に移動させるカメラ軸方向駆動部を設けることで、圧痕検出カメラを基板表面に対して接近離間方向に移動させて焦点合わせを精度良く行うことができ、的確な検査を確実に行うことができる。 In addition, by providing a camera axial direction drive unit that moves the indentation detection camera in the approaching / separating direction with respect to the substrate surface, the indentation detection camera is moved in the approaching / separating direction with respect to the substrate surface to perform focusing with high accuracy. And accurate inspection can be performed reliably.

また、基板に設けられたマークを検出するマーク検出カメラを別に設け、マーク検出カメラで基板の姿勢を検出し、検出結果に応じて基板保持部が基板を基準位置に位置決めするのが好適である。基板保持部による基板の位置決めに、ずれ検出カメラを利用することもできるが、専用のマーク検出カメラを用いることにより、シンプルな構成と制御によって効率的に検査することができる。 In addition, it is preferable that a mark detection camera for detecting a mark provided on the substrate is provided separately, the posture of the substrate is detected by the mark detection camera, and the substrate holding unit positions the substrate at the reference position according to the detection result. . A displacement detection camera can be used for positioning the substrate by the substrate holder, but by using a dedicated mark detection camera, inspection can be efficiently performed with a simple configuration and control.

本発明の部品実装状態検査装置及び方法によれば、部品の実装位置ずれと圧着状態の検査を同時に並行して行うことができて効率的に短時間で両検査を行うことができ、また基板の端部近傍を吸着保持するので、大型の基板においても撓みを生じることなく速やかに適正な検査を行うことができ、基板を固定してカメラを移動させるので、基板が大型化してもコンパクトな装置にでき、また単一の装置でかつ単機能のずれ検出カメラと圧痕検出カメラを用いるのでコスト高にならず、実装位置ずれと圧着状態の検査を効率的に生産性良く行うことができる。 According to the component mounting state inspection apparatus and method of the present invention, it is possible to inspect the component mounting position deviation and the crimping state simultaneously in parallel, and to perform both inspections efficiently in a short time. Since the vicinity of the edge of the substrate is held by suction, proper inspection can be performed quickly without causing bending even on a large substrate, and the camera is moved while the substrate is fixed, so it is compact even if the substrate is enlarged In addition, since a single device and a single-function displacement detection camera and indentation detection camera are used, the cost is not increased, and the inspection of the mounting position displacement and the crimped state can be efficiently performed with high productivity.

以下、本発明の部品実装状態検査装置の一実施形態について、図１〜図５を参照しながら説明する。本実施形態は、液晶パネル（以下、基板と称する）の端部に設けられた電極部に、異方導電材を介してＴＡＢ（以下、部品と称する）の電極部を仮固着した後、本圧着することで、基板に部品を実装したものを検査対象としたものであり、その部品の電極部と基板の電極部の位置ずれ検査と、異方導電材中の導電粒子による圧痕の検出による部品の圧着状態の検査とを行うものである。尚、本発明においては、基板は、液晶パネルに限定されるものではなく、プラズマディスプレイパネルなどのＦＰＤやその他の各種基板に適用でき、部品もＴＡＢに限らず、フリップチップ実装されるＩＣチップ等の各種部品にも同様に適用できる。 Hereinafter, an embodiment of a component mounting state inspection apparatus according to the present invention will be described with reference to FIGS. In this embodiment, an electrode portion of a TAB (hereinafter referred to as a component) is temporarily fixed to an electrode portion provided at an end portion of a liquid crystal panel (hereinafter referred to as a substrate) through an anisotropic conductive material. By crimping, the parts mounted on the board are to be inspected. By inspecting misalignment between the electrode part of the part and the electrode part of the board, and by detecting the indentation by the conductive particles in the anisotropic conductive material Inspecting the crimped state of the component. In the present invention, the substrate is not limited to a liquid crystal panel, but can be applied to an FPD such as a plasma display panel and other various substrates. The components are not limited to TAB, and an IC chip that is flip-chip mounted. It can be similarly applied to various parts.

先行する部品実装工程で、基板２の３辺の端部にそれぞれ複数の部品３が所定間隔あけて実装されており（図４参照）、この基板２が、図１に示すように、所定の基板受け渡し位置で、部品実装状態検査装置１の基板保持部４に受け渡される。基板保持部４は、基板受け渡し位置で載置された基板２を所定の検査位置に移送して位置決めするものであり、昇降部（図示せず）上に、Ｘ方向に移動・位置決めするＸ方向テーブル５とＹ方向に移動・位置決めするＹ方向テーブル６と回転方向の位置決めをする回転テーブル７とが設置され、回転テーブル７に基板２を吸着して保持する保持面８を設けた構成とされている。Ｘ方向テーブル５は、レールガイド５ａにて移動自在に支持され、送りねじ機構５ｂにて駆動され、Ｙ方向テーブル６は、レールガイド６ａにて移動自在に支持され、送りねじ機構６ｂにて駆動される。 In the preceding component mounting process, a plurality of components 3 are mounted at predetermined intervals on the three side edges of the substrate 2 (see FIG. 4). As shown in FIG. At the board delivery position, the board is transferred to the board holding unit 4 of the component mounting state inspection apparatus 1. The substrate holding unit 4 moves and positions the substrate 2 placed at the substrate delivery position to a predetermined inspection position, and moves and positions the substrate 2 in the X direction on an elevating unit (not shown). A table 5 and a Y-direction table 6 that moves and positions in the Y direction and a rotary table 7 that positions in the rotational direction are installed, and a holding surface 8 that holds the substrate 2 by adsorbing the rotary table 7 is provided. ing. The X direction table 5 is movably supported by a rail guide 5a and driven by a feed screw mechanism 5b, and the Y direction table 6 is movably supported by a rail guide 6a and driven by a feed screw mechanism 6b. Is done.

Ｘ方向の一端側には、検査位置に位置決めされた基板２の端部の近傍を端部に沿って吸着して支持する基板吸着支持部９が配設されている。この基板吸着支持部９は、Ｘ方向に狭幅で、Ｙ方向に長い門型に構成され、その上面に多数の吸着穴９ａが設けられ、基板２の電極部が配置された端部の近傍を載置して吸着保持するように構成されている。 On one end side in the X direction, there is disposed a substrate suction support portion 9 that sucks and supports the vicinity of the end portion of the substrate 2 positioned at the inspection position along the end portion. The substrate suction support portion 9 is formed in a gate shape that is narrow in the X direction and long in the Y direction, and has a plurality of suction holes 9a on the upper surface thereof, in the vicinity of the end portion where the electrode portion of the substrate 2 is disposed. Is mounted and held by suction.

基板吸着支持部９の基板保持部４側に隣接した位置に、基板２の４隅に設けられた基板位置決め用の基板マーク２ａ（図４参照）を認識するための一対の基板マーク認識カメラ１０ａ、１０ｂが配設されている。一方の基板マーク認識カメラ１０ａはＹ方向の一端部に固定設置され、他方の基板マーク認識カメラ１０ｂは、移動テーブル装置１１にて基板２の大きさに応じてＹ方向に移動可能に構成されている。 A pair of substrate mark recognition cameras 10a for recognizing substrate positioning substrate marks 2a (see FIG. 4) provided at the four corners of the substrate 2 at positions adjacent to the substrate holding unit 4 side of the substrate adsorption support unit 9. 10b are arranged. One substrate mark recognition camera 10a is fixedly installed at one end in the Y direction, and the other substrate mark recognition camera 10b is configured to be movable in the Y direction according to the size of the substrate 2 by the moving table device 11. Yes.

基板吸着支持部９の基板保持部４とは反対側に隣接した位置に、基板２の電極部に対する部品３の実装位置ずれを観察する一対のずれ検出カメラ１２ａ、１２ｂと、電極部に対する部品３の圧着状態を検出する圧痕検出カメラ１３が配設されている。圧痕検出カメラ１３は、圧着時に生じた異方導電材中の導電粒子による微小な圧痕を検出できるように、光学顕微鏡に干渉装置を組み込んだ微分干渉顕微鏡と認識カメラにて構成されている。これらずれ検出カメラ１２ａ、１２ｂと圧痕検出カメラ１３は、カメラ駆動部としての移動テーブル装置１４にてそれぞれＹ方向に移動及び位置決め可能に構成されている。移動テーブル装置１４は、レールガイド１４ａに沿って移動可能に支持された２つの移動体１５、１６を備え、送りねじ機構１４ｂにて駆動される一方の移動体１５にずれ検出カメラ１２ａ、１２ａが搭載され、送りねじ機構１４ｃにて駆動される他方の移動体１６に圧痕検出カメラ１３が搭載されている。 A pair of displacement detection cameras 12a and 12b for observing mounting position displacement of the component 3 with respect to the electrode portion of the substrate 2 and a component 3 relative to the electrode portion at a position adjacent to the opposite side of the substrate holding portion 4 of the substrate suction support portion 9. An indentation detection camera 13 for detecting the pressure-bonding state is provided. The indentation detection camera 13 is configured by a differential interference microscope and a recognition camera in which an interference device is incorporated in an optical microscope so that a minute indentation caused by conductive particles in an anisotropic conductive material generated at the time of pressure bonding can be detected. The displacement detection cameras 12a and 12b and the indentation detection camera 13 are configured to be movable and positioned in the Y direction by a moving table device 14 as a camera driving unit. The moving table device 14 includes two moving bodies 15 and 16 supported so as to be movable along the rail guide 14a, and the displacement detecting cameras 12a and 12a are connected to one moving body 15 driven by the feed screw mechanism 14b. The indentation detection camera 13 is mounted on the other moving body 16 that is mounted and driven by the feed screw mechanism 14c.

移動体１５上の一対のずれ検出カメラ１２ａ、１２ｂは、部品３の長手方向両端近傍に設けられた２箇所の認識マークと基板２の電極部に対応して設けられた認識マークを同時にそれぞれ検出できるように設けられたものであり、図２に示すように、一方のずれ検出カメラ１２ａは移動体１５上に立設された取付ブラケット１５ａに設置され、他方のずれ検出カメラ１２ｂは移動体１５上に設けられた間隔変更テーブル装置１７の移動体１７ａ上に設置され、ずれ検出カメラ１２ａ、１２ｂ間の間隔Ａを部品３の大きさ等に応じて可変できるように構成されている。１７ｂは移動体１７ａを移動自在に支持するレールガイド、１７ｃは送りねじ機構である。 A pair of displacement detection cameras 12 a and 12 b on the moving body 15 simultaneously detect two recognition marks provided near both ends in the longitudinal direction of the component 3 and recognition marks provided corresponding to the electrode portions of the substrate 2. As shown in FIG. 2, one displacement detection camera 12 a is installed on a mounting bracket 15 a erected on the movable body 15, and the other displacement detection camera 12 b is disposed on the movable body 15. It is installed on the movable body 17a of the interval changing table device 17 provided above, and is configured such that the interval A between the displacement detection cameras 12a and 12b can be varied according to the size of the component 3 and the like. Reference numeral 17b denotes a rail guide that movably supports the moving body 17a, and reference numeral 17c denotes a feed screw mechanism.

移動体１６上の圧痕検出カメラ１３は、ＸＹ平面に対して垂直なＺ軸方向に移動・位置決め可能なＺ軸移動テーブル装置１８の移動体１８ａに設置されている。このＺ軸移動テーブル装置１８が、圧痕検出カメラ１３を基板２の表面に対して接近離間方向に移動させて自動的に高精度に焦点合わせ行うためのカメラ軸方向駆動部を構成している。１８ｂは、移動体１８ａを移動自在に支持するレールガイド、１８ｃは移動体１８ａを駆動する送りねじ機構である。 The indentation detection camera 13 on the moving body 16 is installed on a moving body 18a of a Z-axis moving table device 18 that can move and position in the Z-axis direction perpendicular to the XY plane. This Z-axis moving table device 18 constitutes a camera axis direction driving unit for moving the indentation detection camera 13 in the approaching and separating direction with respect to the surface of the substrate 2 and automatically performing focusing with high accuracy. Reference numeral 18b denotes a rail guide that movably supports the moving body 18a, and 18c denotes a feed screw mechanism that drives the moving body 18a.

以上の構成の部品実装状態検査装置１による検査方法を、主として図４を参照して説明する。まず、部品３が実装された基板２が、部品実装状態検査装置１に対する所定の受け渡し位置に供給されると、その基板２を基板保持部４の保持面８で受け取って吸着保持し、基板保持部４にて基板２の検査すべき一側の端部をＸ方向の一端側に向け、図４（ａ）に示すように、その端部を基板吸着支持部９に隣接する位置に一旦位置決めする。そして、基板２の当該端部の両端の基板マーク２ａを基板マーク認識カメラ１０ａ、１０ｂにて検出し、基板２の保持面８の中心に対するＸＹ方向の位置ずれ及び回転姿勢の位置ずれを検出する。基板マーク認識カメラ１０ｂは基板２の大きさに応じて予め移動テーブル装置１１にて位置決めされている。 The inspection method by the component mounting state inspection apparatus 1 having the above configuration will be described mainly with reference to FIG. First, when the board 2 on which the component 3 is mounted is supplied to a predetermined delivery position with respect to the component mounting state inspection apparatus 1, the board 2 is received and held by the holding surface 8 of the board holding unit 4 to hold the board. The end of one side of the substrate 2 to be inspected is directed to one end in the X direction at the portion 4, and the end is once positioned adjacent to the substrate suction support portion 9 as shown in FIG. To do. Then, the substrate marks 2a at both ends of the end portion of the substrate 2 are detected by the substrate mark recognition cameras 10a and 10b, and the positional deviation in the XY direction and the positional deviation of the rotational posture with respect to the center of the holding surface 8 of the substrate 2 are detected. . The substrate mark recognition camera 10b is positioned by the moving table device 11 in advance according to the size of the substrate 2.

次に、基板保持部４にて、基板２の位置ずれ検出結果に応じて、基板２の位置と回転姿勢の補正を行いつつ、基板２を検査時の基準位置に位置決めする。この基板２の位置決め状態で、図４（ｂ）に示すように、部品３が実装されている電極部が設けられている基板２の端部が基板吸着支持部９から突出し、その端部に隣接する部分が基板吸着支持部９にて吸着保持される。このように基板２の検査すべき端部近傍を基板吸着支持部９にて吸着保持することで、基板２が大型であっても検査部位が撓み等によって位置ずれすることがなく、簡単かつ速やかに適正な検出が可能となる。 Next, the substrate holding unit 4 positions the substrate 2 at the reference position at the time of inspection while correcting the position and rotation posture of the substrate 2 according to the detection result of the displacement of the substrate 2. In the positioning state of the substrate 2, as shown in FIG. 4B, the end of the substrate 2 on which the electrode portion on which the component 3 is mounted is protruded from the substrate adsorption support portion 9, and the end portion Adjacent portions are adsorbed and held by the substrate adsorption support unit 9. In this way, by adsorbing and holding the vicinity of the end of the substrate 2 to be inspected by the substrate adsorption support portion 9, even if the substrate 2 is large, the inspection site is not displaced due to bending or the like, and it is simple and quick. It is possible to detect properly.

この状態で、まず一番端に実装されている部品３の電極と基板２側の電極部との位置ずれを検査するため、部品３の両端部に設けられている位置マーク３Ｍとそれと対応して基板の端部に設けられている位置マーク２Ｍを、ずれ検出カメラ１２ａ、１２ｂにて画像認識する。これらずれ検出カメラ１２ａ、１２ｂの間隔Ａは、部品３の大きさに応じて予め間隔変更テーブル装置１７にて適切に設定されている。また、基板の位置マーク２Ｍ及び部品３の位置マーク３Ｍとしては、図５（ａ）〜（ｅ）に示すように、種々の形態のものが考えられ、両マーク２Ｍ、３Ｍの相対的な位置関係を求めることで、基板２の電極部と部品３の電極の位置ずれ量を検出することができ、検出した位置ずれ量が所定の許容範囲内に収まったものは適正に位置決めされて実装されていると判定し、許容値を超えている場合は実装不良であると判定される。 In this state, first, in order to inspect the positional deviation between the electrode of the component 3 mounted at the extreme end and the electrode portion on the board 2 side, the position marks 3M provided at both ends of the component 3 correspond to it. Then, the position mark 2M provided at the end of the substrate is recognized by the displacement detection cameras 12a and 12b. The interval A between these displacement detection cameras 12 a and 12 b is appropriately set in advance by the interval change table device 17 in accordance with the size of the component 3. Further, as the position mark 2M on the substrate and the position mark 3M on the component 3, as shown in FIGS. 5 (a) to 5 (e), various forms are conceivable, and the relative positions of the marks 2M and 3M are considered. By obtaining the relationship, it is possible to detect the amount of positional deviation between the electrode portion of the substrate 2 and the electrode of the component 3, and those in which the detected positional deviation amount falls within a predetermined allowable range are properly positioned and mounted. If it exceeds the allowable value, it is determined that the mounting is defective.

一番端の部品３の実装位置検査が終了すると、移動テーブル装置１４を作動させ、移動体１５と移動体１６を同期して同時に移動させ、図４（ｃ）に示すように、移動体１５上のずれ検出カメラ１２ａ、１２ｂを二番目の部品３の電極と基板２の電極部との位置ずれを検査する位置に位置決めするとともに、移動体１６上の圧痕検出カメラ１３を最初の部品３の任意の電極とそれが接合されている基板２側の電極の圧着状態を検出する位置に位置させる。 When the mounting position inspection of the component 3 at the end is completed, the moving table device 14 is operated, and the moving body 15 and the moving body 16 are moved simultaneously in synchronization. As shown in FIG. The upper displacement detection cameras 12a and 12b are positioned at positions to inspect the positional displacement between the electrode of the second component 3 and the electrode portion of the substrate 2, and the indentation detection camera 13 on the moving body 16 is positioned at the first component 3. An arbitrary electrode and the electrode on the side of the substrate 2 to which the electrode is bonded are positioned at a position to detect the crimping state.

この状態で、二番目の部品３の実装位置ずれをずれ検出カメラ１２ａ、１２ｂにて上記と同様に検出し、それと同時に圧痕検出カメラ１３にて圧着時に生じた導電粒子による圧痕の状態を検出し、それによって圧着状態を検査する。その際、圧痕検出カメラの焦点深度は±数十μｍ程度で、ずれ検出カメラの焦点深度が±０．１ｍｍ程度であるのに対して小さいため、高精度のピント合わせが必要であり、そのためＺ軸移動テーブル装置１８にて圧痕検出カメラ１３を基板２の表面に対して接近離間方向に移動調整し、自動焦点合わせ制御を行うことで、簡単かつ短時間に精度の良い検査を行うことができる。 In this state, the mounting position shift of the second component 3 is detected by the displacement detection cameras 12a and 12b in the same manner as described above. , Thereby checking the crimping state. At this time, the depth of focus of the indentation detection camera is about ± several μm, and the focus depth of the displacement detection camera is about ± 0.1 mm, which is small, so high-precision focusing is necessary. By moving and adjusting the indentation detection camera 13 in the approaching and separating direction with respect to the surface of the substrate 2 by the axis movement table device 18, the automatic focusing control can be performed easily and accurately in a short time. .

以後、図４（ｂ）から（ｃ）への過程と同様の過程を繰り返して、ずれ検出カメラ１２ａ、１２ｂと圧痕検出カメラ１３を基板２の端部に沿って順次移動させて、各部品３の基板２側の電極部に対する実装位置ずれと電極部に対する部品３の圧着状態を順次検出して当該端部の全ての部品３の検査を行う。また、基板２の他の側辺の端部に実装された部品３についても同様検査する場合は、基板保持部４の回転テーブル７にて基板２を回転させて同様の検査を行う。また、当該基板２に対する検査が終了すると、この基板２を所定の受け渡し部に移動させて搬出し、次の基板２を受け取って上記と同様に検査を行う。 Thereafter, a process similar to the process from FIG. 4B to FIG. 4C is repeated, and the displacement detection cameras 12a and 12b and the indentation detection camera 13 are sequentially moved along the end portion of the substrate 2 so that each component 3 The mounting position shift with respect to the electrode portion on the substrate 2 side and the crimping state of the component 3 with respect to the electrode portion are sequentially detected to inspect all the components 3 at the end. Further, when the same inspection is performed on the component 3 mounted on the other side edge of the substrate 2, the substrate 2 is rotated by the rotary table 7 of the substrate holding unit 4 and the same inspection is performed. Further, when the inspection for the substrate 2 is completed, the substrate 2 is moved to a predetermined delivery section and unloaded, and the next substrate 2 is received and inspected in the same manner as described above.

上記実施形態では、ずれ検出カメラ１２ａ、１２ｂと圧痕検出カメラ１３を予め設定された間隔をあけた状態で同期して移動させるようにした例を説明したが、ずれ検出カメラ１２ａ、１２ｂと圧痕検出カメラ１３を独立して移動させるようにしても良い。そのようにすると、例えば部品３の実装位置ずれは全数検査し、圧痕検出カメラ１３による検査は、時間を要する場合があるので、両端だけ、又は両端と中央部についてのみ検査するだけで良い場合など、種々の検査態様に効率的に対応することができる。 In the above-described embodiment, the example in which the displacement detection cameras 12a and 12b and the indentation detection camera 13 are moved in synchronization with a predetermined interval therebetween has been described. However, the displacement detection cameras 12a and 12b and the indentation detection are detected. The camera 13 may be moved independently. In such a case, for example, the mounting position deviation of the component 3 is inspected in all cases, and the inspection by the indentation detection camera 13 may take time, so it is only necessary to inspect only both ends or only both ends and the central portion. It is possible to efficiently cope with various inspection modes.

本発明の部品実装状態検査装置によれば、部品の実装位置ずれと圧着状態の検査を同時に並行して行うことができて効率的に短時間で両検査を行うことができ、また基板の端部近傍を吸着保持するので、大型の基板においても撓みを生じることなく速やかに適正な検査を行うことができ、また単一の装置でかつ単機能のずれ検出カメラと圧痕検出カメラを用いるのでコスト高にならず、実装位置ずれと圧着状態の検査を効率的に生産性良く行うことができるため、大型のＦＰＤなどの基板における部品の実装状態の検査に有効に利用できる。 According to the component mounting state inspection apparatus of the present invention, it is possible to perform the inspection of the component mounting position deviation and the crimping state at the same time in parallel, so that both inspections can be performed efficiently in a short time. Since the vicinity of the part is sucked and held, even a large substrate can be quickly inspected properly without bending, and a single device with a single-function displacement detection camera and indentation detection camera is costly. Since the inspection of the mounting position deviation and the crimped state can be efficiently performed with high productivity without increasing the height, it can be effectively used for the inspection of the mounting state of components on a substrate such as a large FPD.

本発明の部品実装状態検査装置の一実施形態の全体斜視図。1 is an overall perspective view of an embodiment of a component mounting state inspection apparatus of the present invention. 同実施形態におけるずれ検出カメラの配設状態を示す斜視図。The perspective view which shows the arrangement | positioning state of the deviation | shift detection camera in the embodiment. 同実施形態における圧痕検出カメラの配設状態を示す斜視図。The perspective view which shows the arrangement | positioning state of the indentation detection camera in the embodiment. 同実施形態における部品実装状態検査工程を順次示す平面図と側面図。The top view and side view which show the component mounting state test | inspection process in the same embodiment sequentially. 同実施形態における基板の位置マークと部品の位置マークの各種組合せ例の説明図。Explanatory drawing of the various combinations of the position mark of a board | substrate and the position mark of components in the embodiment.

符号の説明Explanation of symbols

１部品実装状態検査装置
２基板
３部品
４基板保持部
９基板吸着支持部
１０ａ、１０ｂ基板マーク認識カメラ
１２ａ、１２ｂずれ検出カメラ
１３圧痕検出カメラ
１４移動テーブル装置（カメラ駆動部）
１５移動体
１６移動体
１７間隔変更テーブル装置
１８Ｚ軸移動テーブル装置（カメラ軸方向駆動部） DESCRIPTION OF SYMBOLS 1 Component mounting state inspection apparatus 2 Board | substrate 3 Components 4 Board | substrate holding | maintenance part 9 Board | substrate adsorption | suction support part 10a, 10b Board | substrate mark recognition camera 12a, 12b Shift detection camera 13 Indentation detection camera 14 Moving table apparatus (camera drive part)
DESCRIPTION OF SYMBOLS 15 Moving body 16 Moving body 17 Space | interval change table apparatus 18 Z-axis movement table apparatus (camera axial direction drive part)

Claims

基板の端部に設けられた複数の電極部にそれぞれ部品を実装した後、各部品の実装状態を検査する部品実装状態検査装置であって、基板を載置して基板の受け渡し位置と検査位置との間で移動可能な基板保持部と、検査位置に位置決めされた基板の端部付近を端部に沿って吸着して支持する基板吸着支持部と、基板の電極部に対する部品の実装位置ずれを検出するずれ検出カメラと、電極部に対する部品の圧着状態を検出する圧痕検出カメラと、ずれ検出カメラと圧痕検出カメラを基板の端部に沿う軸心上を移動させるカメラ駆動部とを備えたことを特徴とする部品実装状態検査装置。 A component mounting state inspection device for inspecting the mounting state of each component after mounting the components on each of the plurality of electrode portions provided on the end portion of the substrate. A substrate holding part that can move between the board, a board suction support part that sucks and supports the vicinity of the edge of the board positioned at the inspection position, and a component mounting position shift with respect to the electrode part of the board A displacement detection camera for detecting the indentation, an indentation detection camera for detecting the pressure-bonded state of the component against the electrode portion, and a camera drive unit for moving the displacement detection camera and the indentation detection camera on an axis along the edge of the substrate. A component mounting state inspection apparatus characterized by that.

カメラ駆動部は、ずれ検出カメラと圧痕検出カメラを所定間隔あけた状態で同期して移動させることを特徴とする請求項１記載の部品実装状態検査装置。 2. The component mounting state inspection apparatus according to claim 1, wherein the camera driving unit moves the displacement detection camera and the indentation detection camera synchronously with a predetermined interval therebetween.

カメラ駆動部は、ずれ検出カメラと圧痕検出カメラの間隔を可変できることを特徴とする請求項２記載の部品実装状態検査装置。 The component mounting state inspection apparatus according to claim 2, wherein the camera driving unit can change a distance between the displacement detection camera and the indentation detection camera.

カメラ駆動部は、ずれ検出カメラと圧痕検出カメラを独立して移動させることを特徴とする請求項１記載の部品実装状態検査装置。 The component mounting state inspection apparatus according to claim 1, wherein the camera driving unit moves the displacement detection camera and the indentation detection camera independently.

基板の端部に沿って複数のずれ検出カメラを備え、カメラ駆動部は各ずれ検出カメラの間隔を可変できることを特徴とする請求項１記載の部品実装状態検査装置。 The component mounting state inspection apparatus according to claim 1, further comprising a plurality of displacement detection cameras along an edge of the board, wherein the camera driving unit can vary the interval between the displacement detection cameras.

圧痕検出カメラを基板表面に対して接近離間方向に移動させるカメラ軸方向駆動部を設けたことを特徴とする請求項１記載の部品実装状態検査装置。 2. The component mounting state inspection apparatus according to claim 1, further comprising a camera axial direction drive unit that moves the indentation detection camera in the approaching and separating direction with respect to the substrate surface.

基板に設けられたマークを検出するマーク検出カメラを別に設け、マーク検出カメラで基板の姿勢を検出し、検出結果に応じて基板保持部が基板を基準姿勢に位置決めすることを特徴とする請求項１〜６の何れかに記載の部品実装状態検査装置。 A mark detection camera for detecting a mark provided on the substrate is separately provided, the posture of the substrate is detected by the mark detection camera, and the substrate holding unit positions the substrate in a reference posture according to the detection result. The component mounting state inspection apparatus in any one of 1-6.

基板の端部に設けられた複数の電極部にそれぞれ部品を実装した後、各部品の実装状態を検査する部品実装状態検査方法であって、基板を検査位置に移動させる工程と、検査位置で基板の端部付近を端部に沿って吸着支持する工程と、ずれ検出カメラと圧痕検出カメラを基板の端部に沿う軸心上を移動させ、各電極部に実装された部品の電極部に対する実装位置ずれと電極部に対する部品の圧着状態を順次検出する工程とを備えたことを特徴とする部品実装状態検査方法。 A component mounting state inspection method for inspecting a mounting state of each component after mounting components on a plurality of electrode portions provided on an end portion of the substrate, the step of moving the substrate to the inspection position, and the inspection position The process of adsorbing and supporting the vicinity of the edge of the substrate along the edge, and moving the displacement detection camera and the indentation detection camera on the axis along the edge of the substrate, with respect to the electrode part of the component mounted on each electrode part A component mounting state inspection method comprising: a step of sequentially detecting a mounting position shift and a crimping state of a component with respect to an electrode portion.

ずれ検出カメラと圧痕検出カメラを予め設定された間隔をあけた状態で同期して移動させることを特徴とする請求項８記載の部品実装状態検査方法。 9. The component mounting state inspection method according to claim 8, wherein the shift detection camera and the indentation detection camera are moved synchronously with a predetermined interval therebetween.

ずれ検出カメラと圧痕検出カメラを独立して移動させることを特徴とする請求項８記載の部品実装状態検査方法。 The component mounting state inspection method according to claim 8, wherein the displacement detection camera and the indentation detection camera are moved independently.

基板の端部に沿って複数のずれ検出カメラを配置し、ずれ検出カメラの間隔を基板サイズ及び電極部の配置間隔に応じて可変することを特徴とする請求項８記載の部品実装状態検査方法。 9. The component mounting state inspection method according to claim 8, wherein a plurality of displacement detection cameras are arranged along an end portion of the substrate, and the interval between the displacement detection cameras is varied according to the substrate size and the arrangement interval of the electrode portions. .

圧痕検出カメラを基板表面に対して接近離間方向に移動させ、精度の良い焦点合わせを行うことを特徴とする請求項８記載の部品実装状態検査方法。 9. The component mounting state inspection method according to claim 8, wherein the indentation detection camera is moved in the approaching / separating direction with respect to the substrate surface to perform focusing with high accuracy.

別に設けられたマーク検出カメラにて基板に設けられたマークを検出し、検出結果により基板を基準位置に位置決めすることを特徴とする請求項８〜１２の何れかに記載の部品実装状態検査方法。 13. The component mounting state inspection method according to claim 8, wherein a mark provided on the board is detected by a separately provided mark detection camera, and the board is positioned at a reference position based on a detection result. .