JP2007053170A - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP2007053170A JP2007053170A JP2005236006A JP2005236006A JP2007053170A JP 2007053170 A JP2007053170 A JP 2007053170A JP 2005236006 A JP2005236006 A JP 2005236006A JP 2005236006 A JP2005236006 A JP 2005236006A JP 2007053170 A JP2007053170 A JP 2007053170A
- Authority
- JP
- Japan
- Prior art keywords
- refractive index
- light
- light emitting
- resin
- fine particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 13
- 239000010419 fine particle Substances 0.000 claims description 32
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 26
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 229920002050 silicone resin Polymers 0.000 abstract description 13
- 238000000605 extraction Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract 2
- 239000013590 bulk material Substances 0.000 description 6
- 229910010413 TiO 2 Inorganic materials 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】LED基板20と、LED基板20を封止するとともに、屈折率n1の蛍光体32と、屈折率n2の微粒子33が添加された屈折率n3のシリコーン樹脂31を有する封止樹脂部30とを備え、上記屈折率n1〜n3は、n2>n1>n3の関係にあり、微粒子33の粒径は、LED基板20の発する光の波長の1/10以下である。
【選択図】 図1
Description
旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。
Claims (5)
- 発光素子基板と、
この発光素子基板を封止するとともに、屈折率n1の蛍光体と、屈折率n2の微粒子が添加された屈折率n3の樹脂を有する封止樹脂部とを備え、
上記屈折率n1〜n3は、n2>n1>n3の関係にあり、
上記微粒子の粒径は、上記発光素子基板の発する光の波長の1/10以下であることを特徴とする発光装置。 - 上記微粒子の上記樹脂に対する体積割合aが、n12=a・n22+(1−a)n32を満たすことを特徴とする請求項1記載の発光装置。
- 上記微粒子は金属酸化物であることを特徴とする請求項1記載の発光装置。
- 上記金属酸化物は酸化チタン、酸化ジルコニウム、酸化亜鉛、酸化ハフニウム、酸化アルミニウムの少なくとも1種類であることを特徴とする請求項3記載の発光装置。
- 屈折率n4の発光素子基板と、
この発光素子基板を封止するとともに、屈折率n5の微粒子が添加された屈折率n6の樹脂を有する封止樹脂部とを備え、
上記屈折率n5及びn6は、n5>n6の関係にあり、
上記樹脂に対する上記微粒子の体積割合aが、n42=a・n52+(1−a)n52を満たすことを特徴とする発光装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005236006A JP2007053170A (ja) | 2005-08-16 | 2005-08-16 | 発光装置 |
US11/464,383 US7345319B2 (en) | 2005-08-16 | 2006-08-14 | Light emitting device |
CNB200610121510XA CN100413107C (zh) | 2005-08-16 | 2006-08-16 | 发光器件 |
EP06017033A EP1755174A3 (en) | 2005-08-16 | 2006-08-16 | Light emitting device |
TW095130017A TWI308403B (en) | 2005-08-16 | 2006-08-16 | Light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005236006A JP2007053170A (ja) | 2005-08-16 | 2005-08-16 | 発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010020623A Division JP2010098335A (ja) | 2010-02-01 | 2010-02-01 | 発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007053170A true JP2007053170A (ja) | 2007-03-01 |
Family
ID=37434250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005236006A Pending JP2007053170A (ja) | 2005-08-16 | 2005-08-16 | 発光装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7345319B2 (ja) |
EP (1) | EP1755174A3 (ja) |
JP (1) | JP2007053170A (ja) |
CN (1) | CN100413107C (ja) |
TW (1) | TWI308403B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089652A (ja) * | 2010-10-19 | 2012-05-10 | Panasonic Corp | 半導体発光デバイス |
JP2013105947A (ja) * | 2011-11-15 | 2013-05-30 | Toyo Ink Sc Holdings Co Ltd | 発光装置 |
JP2013105946A (ja) * | 2011-11-15 | 2013-05-30 | Toyo Ink Sc Holdings Co Ltd | 発光装置 |
JP2013232479A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体発光装置 |
JP2016092271A (ja) * | 2014-11-06 | 2016-05-23 | シャープ株式会社 | 蛍光体シートおよび照明装置 |
KR101862865B1 (ko) * | 2011-07-18 | 2018-05-31 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1919000A1 (en) * | 2005-08-05 | 2008-05-07 | Matsushita Electric Industries Co., Ltd. | Semiconductor light-emitting device |
JP4751269B2 (ja) * | 2006-08-09 | 2011-08-17 | セイコーインスツル株式会社 | 照明装置及びこれを備える表示装置、携帯電子機器 |
WO2009031084A1 (en) * | 2007-09-04 | 2009-03-12 | Koninklijke Philips Electronics N.V. | Light output device |
US20090154198A1 (en) * | 2007-12-14 | 2009-06-18 | Joo Hoon Lee | Reflection type display apparatus |
CN102471521B (zh) | 2009-08-12 | 2016-08-24 | 皇家飞利浦电子股份有限公司 | 光学组成 |
CN101719533B (zh) * | 2009-11-27 | 2015-12-09 | 晶能光电(江西)有限公司 | 含有荧光粉的数码管及其制造方法 |
KR101713087B1 (ko) * | 2010-02-19 | 2017-03-07 | 도레이 카부시키가이샤 | 형광체 함유 실리콘 경화물, 그 제조 방법, 형광체 함유 실리콘 조성물, 그 조성물 전구체, 시트상 성형물, led 패키지, 발광 장치 및 led 실장 기판의 제조 방법 |
EP2572878A4 (en) * | 2010-05-20 | 2014-10-01 | Dalian Luminglight Co Ltd | DETACHABLE LIGHT-EMITTING FILM WITH LIGHT CONVERSION |
KR101967623B1 (ko) | 2010-12-13 | 2019-04-10 | 도레이 카부시키가이샤 | 형광체 시트, 이것을 사용한 led 및 발광 장치, 그리고 led의 제조 방법 |
DE102011009369A1 (de) * | 2011-01-25 | 2012-07-26 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
JP5672622B2 (ja) * | 2012-05-22 | 2015-02-18 | パナソニックIpマネジメント株式会社 | 波長変換素子およびその製造方法ならびに波長変換素子を用いたled素子および半導体レーザ発光装置 |
WO2014006987A1 (ja) * | 2012-07-04 | 2014-01-09 | シャープ株式会社 | 蛍光材料、蛍光塗料、蛍光体基板、電子機器およびledパッケージ |
US10106666B2 (en) | 2016-03-02 | 2018-10-23 | Samsung Electronics Co., Ltd. | Curable silicone resin composition containing inorganic oxide and optical member using same |
CN107450261B (zh) * | 2016-05-31 | 2021-02-05 | 佳能株式会社 | 波长转换元件、光源装置和图像投影装置 |
CN108611045A (zh) * | 2018-04-19 | 2018-10-02 | 武汉华星光电技术有限公司 | 荧光胶及其制备方法、背光模组 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004015063A (ja) * | 2002-06-07 | 2004-01-15 | Lumileds Lighting Us Llc | ナノ粒子を用いる発光デバイス |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5777433A (en) * | 1996-07-11 | 1998-07-07 | Hewlett-Packard Company | High refractive index package material and a light emitting device encapsulated with such material |
JP3065544B2 (ja) * | 1996-12-06 | 2000-07-17 | スタンレー電気株式会社 | 蛍光剤入りledランプ |
DE19964252A1 (de) * | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle |
US6777871B2 (en) * | 2000-03-31 | 2004-08-17 | General Electric Company | Organic electroluminescent devices with enhanced light extraction |
JP2003101078A (ja) * | 2001-09-25 | 2003-04-04 | Toyoda Gosei Co Ltd | 発光装置 |
JP2003243727A (ja) | 2001-12-14 | 2003-08-29 | Nichia Chem Ind Ltd | 発光装置 |
JP4360788B2 (ja) * | 2002-08-29 | 2009-11-11 | シチズン電子株式会社 | 液晶表示板用のバックライト及びそれに用いる発光ダイオードの製造方法 |
JP4661032B2 (ja) | 2003-06-26 | 2011-03-30 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP2005064233A (ja) * | 2003-08-12 | 2005-03-10 | Stanley Electric Co Ltd | 波長変換型led |
EP1668960A2 (en) * | 2003-09-08 | 2006-06-14 | Nanocrystal Lighting Corporation | Light efficient packaging configurations for led lamps using high refractive index encapsulants |
CN1638585A (zh) * | 2003-12-26 | 2005-07-13 | 日东电工株式会社 | 电致发光装置,平面光源和使用该平面光源的显示器 |
-
2005
- 2005-08-16 JP JP2005236006A patent/JP2007053170A/ja active Pending
-
2006
- 2006-08-14 US US11/464,383 patent/US7345319B2/en not_active Expired - Fee Related
- 2006-08-16 CN CNB200610121510XA patent/CN100413107C/zh not_active Expired - Fee Related
- 2006-08-16 TW TW095130017A patent/TWI308403B/zh not_active IP Right Cessation
- 2006-08-16 EP EP06017033A patent/EP1755174A3/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004015063A (ja) * | 2002-06-07 | 2004-01-15 | Lumileds Lighting Us Llc | ナノ粒子を用いる発光デバイス |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089652A (ja) * | 2010-10-19 | 2012-05-10 | Panasonic Corp | 半導体発光デバイス |
KR101862865B1 (ko) * | 2011-07-18 | 2018-05-31 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
JP2013105947A (ja) * | 2011-11-15 | 2013-05-30 | Toyo Ink Sc Holdings Co Ltd | 発光装置 |
JP2013105946A (ja) * | 2011-11-15 | 2013-05-30 | Toyo Ink Sc Holdings Co Ltd | 発光装置 |
JP2013232479A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 半導体発光装置 |
US9246069B2 (en) | 2012-04-27 | 2016-01-26 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
JP2016092271A (ja) * | 2014-11-06 | 2016-05-23 | シャープ株式会社 | 蛍光体シートおよび照明装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200715619A (en) | 2007-04-16 |
CN1917243A (zh) | 2007-02-21 |
US7345319B2 (en) | 2008-03-18 |
CN100413107C (zh) | 2008-08-20 |
TWI308403B (en) | 2009-04-01 |
EP1755174A3 (en) | 2010-08-25 |
EP1755174A2 (en) | 2007-02-21 |
US20070041191A1 (en) | 2007-02-22 |
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