JP2007036059A - 半田付け実装構造およびその製造方法、並びにその利用 - Google Patents
半田付け実装構造およびその製造方法、並びにその利用 Download PDFInfo
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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Abstract
【解決手段】 本発明のカメラモジュール構造は、プリント基板1に形成された基板電極2と、そのプリント基板1に実装されたカメラモジュール3に形成された実装電極4とが、半田接合部5を介して接合され、基板電極2と実装電極4とが、セルフアライメントにより位置合わせされている。そして、半田接合部5が、特性の異なる第1の半田6と第2の半田7から構成されている。
【選択図】 図1
Description
2 基板電極
3 カメラモジュール(実装部品)
4 実装電極
5 半田接合部
6 第1の半田
7 第2の半田(半田ボール)
10 カメラモジュール構造(半田付け実装構造)
20a,20b 凹部
Claims (13)
- 基板に形成された基板電極と、その基板に実装された実装部品に形成された実装電極とが、半田接合部を介して接合され、
上記半田接合部が、複数種類の半田を含んで構成されていることを特徴とする半田付け実装構造。 - 上記半田接合部は、相対的に溶融温度または溶融時の表面張力の低い第1の半田と、第1の半田よりも溶融温度または溶融時の表面張力の高い第2の半田とを含むことを特徴とする請求項1に記載の半田付け実装構造。
- 上記基板電極および実装電極は、上記半田接合部に覆われていることを特徴とする請求項1に記載の半田付け実装構造。
- 第2の半田が球状であるとともに、
第2の半田が、基板電極および実装電極のそれぞれに形成された凹部に挟持されていることを特徴とする請求項1に記載の半田付け実装構造。 - 上記第2の半田は、基板電極および実装電極に面接触するように形成されていることを特徴とする請求項1に記載の半田付け実装構造。
- 上記複数種類の半田が、鉛フリー半田であることを特徴とする請求項1に記載の半田付け実装構造。
- 上記実装部品が、光学素子であることを特徴とする請求項1に記載の半田付け実装構造。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とを、半田接合部によって接合された半田付け実装構造の製造方法であって、
複数種類の半田により半田接合部を形成し、それら複数種類の半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装構造の製造方法。 - 上記複数種類の半田として、相対的に溶融温度の低い第1の半田と、第1の半田よりも溶融温度の高い第2の半田とを用い、第1の半田の溶融温度以上、第2の半田の溶融温度未満に加熱することを特徴とする請求項8に記載の半田付け実装構造の製造方法。
- 上記複数種類の半田として、相対的に溶融時の表面張力の低い第1の半田と、第1の半田よりも溶融時の表面張力の高い第2の半田とを用い、第1の半田および第2の半田の溶融温度以上に加熱することを特徴とする請求項8に記載の半田付け実装構造の製造方法。
- 上記第2の半田として、半田ボールを用いることを特徴とする請求項9に記載の半田付け実装構造の製造方法。
- 請求項1〜7のいずれか1項に記載の半田付け実装構造を備えることを特徴とする電子機器。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とを、半田接合部によって接合する半田付け実装方法であって、
複数種類の半田により半田接合部を形成し、それら複数種類の半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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JP2005219548A JP4040644B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造の製造方法および半田付け実装方法 |
EP06768352A EP1912484A4 (en) | 2005-07-28 | 2006-07-21 | BRAZING MOUNTING STRUCTURE, METHOD OF MANUFACTURING SAME AND METHOD OF MOUNTING BRAZING STRUCTURE |
US11/989,453 US20090166069A1 (en) | 2005-07-28 | 2006-07-21 | Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure |
KR1020087004276A KR100982183B1 (ko) | 2005-07-28 | 2006-07-21 | 납땜 실장 구조의 제조 방법 |
PCT/JP2006/314474 WO2007013365A1 (ja) | 2005-07-28 | 2006-07-21 | 半田付け実装構造およびその製造方法、並びにその利用 |
CN2006800274151A CN101233793B (zh) | 2005-07-28 | 2006-07-21 | 钎焊安装结构的制造方法以及钎焊安装方法 |
TW095127496A TWI330056B (en) | 2005-07-28 | 2006-07-27 | Soldered package, manufacturing method of same, and utilization of same |
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JP2005219548A JP4040644B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造の製造方法および半田付け実装方法 |
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JP4040644B2 JP4040644B2 (ja) | 2008-01-30 |
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US (1) | US20090166069A1 (ja) |
EP (1) | EP1912484A4 (ja) |
JP (1) | JP4040644B2 (ja) |
KR (1) | KR100982183B1 (ja) |
CN (1) | CN101233793B (ja) |
TW (1) | TWI330056B (ja) |
WO (1) | WO2007013365A1 (ja) |
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JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
JP2011054649A (ja) * | 2009-08-31 | 2011-03-17 | Ihi Corp | 電子装置の製造方法及び電子装置 |
WO2012132880A1 (ja) * | 2011-03-25 | 2012-10-04 | 株式会社村田製作所 | セラミック多層基板 |
WO2015011753A1 (ja) * | 2013-07-22 | 2015-01-29 | 富士機械製造株式会社 | 部品装着検査装置 |
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2005
- 2005-07-28 JP JP2005219548A patent/JP4040644B2/ja not_active Expired - Fee Related
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2006
- 2006-07-21 US US11/989,453 patent/US20090166069A1/en not_active Abandoned
- 2006-07-21 KR KR1020087004276A patent/KR100982183B1/ko not_active IP Right Cessation
- 2006-07-21 EP EP06768352A patent/EP1912484A4/en not_active Withdrawn
- 2006-07-21 CN CN2006800274151A patent/CN101233793B/zh not_active Expired - Fee Related
- 2006-07-21 WO PCT/JP2006/314474 patent/WO2007013365A1/ja active Application Filing
- 2006-07-27 TW TW095127496A patent/TWI330056B/zh not_active IP Right Cessation
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007214172A (ja) * | 2006-02-07 | 2007-08-23 | Nec Corp | Lsiパッケージ及びコア入りはんだバンプ並びにlsiパッケージ実装方法 |
JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
JP2011054649A (ja) * | 2009-08-31 | 2011-03-17 | Ihi Corp | 電子装置の製造方法及び電子装置 |
WO2012132880A1 (ja) * | 2011-03-25 | 2012-10-04 | 株式会社村田製作所 | セラミック多層基板 |
CN103460818A (zh) * | 2011-03-25 | 2013-12-18 | 株式会社村田制作所 | 陶瓷多层基板 |
JPWO2012132880A1 (ja) * | 2011-03-25 | 2014-07-28 | 株式会社村田製作所 | セラミック多層基板 |
JP5590223B2 (ja) * | 2011-03-25 | 2014-09-17 | 株式会社村田製作所 | セラミック多層基板 |
US9681534B2 (en) | 2011-03-25 | 2017-06-13 | Murata Manufacturing Co., Ltd. | Ceramic multilayer substrate |
WO2015011753A1 (ja) * | 2013-07-22 | 2015-01-29 | 富士機械製造株式会社 | 部品装着検査装置 |
JPWO2015011753A1 (ja) * | 2013-07-22 | 2017-03-02 | 富士機械製造株式会社 | 部品装着検査装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI330056B (en) | 2010-09-01 |
JP4040644B2 (ja) | 2008-01-30 |
CN101233793B (zh) | 2012-10-24 |
EP1912484A1 (en) | 2008-04-16 |
KR20080027398A (ko) | 2008-03-26 |
EP1912484A4 (en) | 2009-12-30 |
US20090166069A1 (en) | 2009-07-02 |
CN101233793A (zh) | 2008-07-30 |
KR100982183B1 (ko) | 2010-09-14 |
WO2007013365A1 (ja) | 2007-02-01 |
TW200742512A (en) | 2007-11-01 |
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