JP2007035843A - Electronic circuit device - Google Patents

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JP2007035843A
JP2007035843A JP2005215699A JP2005215699A JP2007035843A JP 2007035843 A JP2007035843 A JP 2007035843A JP 2005215699 A JP2005215699 A JP 2005215699A JP 2005215699 A JP2005215699 A JP 2005215699A JP 2007035843 A JP2007035843 A JP 2007035843A
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heat
electronic circuit
circuit device
electronic component
insulating substrate
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JP4452888B2 (en
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Akira Matsushita
晃 松下
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Hitachi Ltd
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Hitachi Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device which can radiate the heat of an electronic circuit board efficiently. <P>SOLUTION: The heat radiation structure of the electronic circuit device 20 comprises a heat generation electronic part 2 with heat generation, a printed wiring board 1 mounting it, an electronic circuit board 10 composed of solder which joints them, and a heat radiating member 4 for radiating the heat of the electronic circuit board 10 to the outside of the board. A part of the heat radiating member 4 is inserted into a through-hole 7 formed at the printed wiring board 1 to be further jointed by a solder 3b, whereby the heat of the electronic circuit board 10 is efficiently radiated to the outside of the electronic circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発熱を伴う電子部品と、それを実装する絶縁基板と、これらを接合する半田からなる電子回路基板と、前記電子回路基板の熱を基板外へ放熱するための放熱用部材からなる電子回路装置における、電子回路基板から電子回路基板外への放熱構造に関する。   The present invention comprises an electronic component that generates heat, an insulating substrate on which the electronic component is mounted, an electronic circuit board made of solder for joining them, and a heat dissipation member for radiating the heat of the electronic circuit board to the outside of the board. The present invention relates to a heat dissipation structure from an electronic circuit board to the outside of the electronic circuit board in an electronic circuit device.

自動車用電子回路装置は、装置の高機能化と小型化が進み、より大きな熱が小スペース内で発生し、発熱密度が増大する傾向にあるため、電子部品を正常に作動させるには、電子部品および電子回路基板からの放熱構造が重要となっている。   Electronic circuit devices for automobiles are becoming more sophisticated and smaller in size, and more heat is generated in a small space and the heat generation density tends to increase. The heat dissipation structure from components and electronic circuit boards is important.

発熱を伴う電子部品の熱を、その電子部品を実装する電子回路基板へ放熱する方法は、例えば、特開２００３−１５２２８８号公報（特許文献１）に記載がある。   For example, JP 2003-152288 A (Patent Document 1) describes a method for dissipating heat from an electronic component that generates heat to an electronic circuit board on which the electronic component is mounted.

発熱を伴う電子部品とその電子部品を実装するプリント配線板からなる電子回路基板の熱を電子回路基板の外部へ放熱する構造には、例えば、熱伝導グリースを用いる放熱方法として特開２００５−５６７１号公報（特許文献２）に記載がある。   In a structure for radiating the heat of an electronic circuit board composed of an electronic component that generates heat and a printed wiring board on which the electronic component is mounted, for example, as a heat radiating method using thermal conductive grease, Japanese Patent Laid-Open No. 2005-5671 No. (Patent Document 2).

熱伝導接着剤を用いる放熱方法の例が特開２００１−２５７４９１号公報（特許文献３）に記載がある。また、熱伝導シートを用いる方法もある。   An example of a heat dissipation method using a heat conductive adhesive is described in Japanese Patent Laid-Open No. 2001-257491 (Patent Document 3). There is also a method using a heat conductive sheet.

特開２００３−１５２２８８号公報JP 2003-152288 A 特開２００５−５６７１号公報Japanese Patent Laid-Open No. 2005-5671 特開２００１−２５７４９１号公報JP 2001-257491 A

自動車用電子回路装置の電子回路基板の熱を効率よく放熱する方法には、前記のとおり、熱伝導グリースや熱伝導接着剤を用いる方法がある。   As described above, as a method for efficiently radiating the heat of the electronic circuit board of the electronic circuit device for automobiles, there is a method using a heat conductive grease or a heat conductive adhesive.

しかし、これらの材料を用いるには、使用部材の増加、組立て工程の増加および複雑化につながる。また、熱伝導グリースや熱伝導接着剤を使う場合には、これらの厚さ管理が必要となる。   However, using these materials leads to an increase in the number of members used, an increase in the assembly process, and a complication. In addition, when using heat conductive grease or heat conductive adhesive, it is necessary to control the thickness of these.

さらに、特に熱伝導グリースを用いる場合には、経時変化によって熱伝導グリースが流れ出し、放熱能力が低下する恐れがある。   Further, particularly when a thermal conductive grease is used, the thermal conductive grease may flow out due to changes over time, and there is a possibility that the heat radiation capability may be reduced.

本発明は、熱伝導グリースや熱伝導接着剤のような厚さ管理が必要なく、流動性の小さいまたは無い熱伝導材料を用いることで、経時変化による放熱能力の低下を最小限に留めることができる高信頼性を有する電子回路装置を提供することを目的とする。   The present invention does not require a thickness control such as thermal grease or thermal adhesive, and can use a thermal conductive material with little or no fluidity to minimize degradation of heat dissipation capability due to aging. An object is to provide an electronic circuit device having high reliability.

本発明は、発熱が伴う発熱電子部品と、発熱電子部品を装着する絶縁基板と、および発熱電子部品と絶縁基板とを接合する半田層等を有する電子回路基板と、電子回路基板の熱を電子回路基板の外部へ放熱するための放熱用部材と、電子回路基板を内置する外部ケース、および外カバー等を有する電子回路装置において、放熱用部材を熱伝導が良好な金属材料で形成し、絶縁基板に放熱用部材が挿入される挿入孔を設け、放熱用部材は、一方を挿入孔に挿入接合し、他方を前記外カバーに接合したことを特徴とする。   The present invention relates to an electronic circuit board having a heat generating electronic component accompanied by heat generation, an insulating substrate on which the heat generating electronic component is mounted, a solder layer that joins the heat generating electronic component and the insulating substrate, and the like. In an electronic circuit device having a heat radiating member for radiating heat to the outside of the circuit board, an outer case in which the electronic circuit board is placed, and an outer cover, the heat radiating member is formed of a metal material having good heat conduction and insulated. An insertion hole into which a heat radiating member is inserted is provided in the substrate, and one of the heat radiating members is inserted and joined to the insertion hole, and the other is joined to the outer cover.

本発明によれば、放熱用部材を熱伝導が良好な金属材料で形成したので、熱伝導グリースや熱伝導接着剤のような厚さ管理が必要なく、経時変化による放熱能力の低下を解消することができる。   According to the present invention, since the heat radiating member is formed of a metal material having good heat conduction, it is not necessary to manage the thickness as in the case of heat conducting grease or heat conducting adhesive, and the deterioration of heat radiating ability due to aging is eliminated. be able to.

以下、本発明の放熱構造の実施例を図に基づいて説明する。   Embodiments of the heat dissipation structure of the present invention will be described below with reference to the drawings.

〔実施例１〕
図１は、絶縁基板であるプリント配線板１の上に発熱を伴う発熱電子部品２を装着した電子回路基板１０の断面を示す。 [Example 1]
FIG. 1 shows a cross section of an electronic circuit board 10 in which a heat generating electronic component 2 with heat generation is mounted on a printed wiring board 1 which is an insulating substrate.

発熱を伴う発熱電子部品２には、電源レギューレタＩＣやパワートランジスタ等がある。発熱を伴う発熱電子部品２には、一般に、部品内部の素子で発生する熱を部品外部へ放熱するための銅やアルミニュームの放熱板２ａが取付けられており、さらに、放熱板２ａとプリント配線板１（絶縁基板）の間には放熱用の半田層３ａが印刷・充填され、発熱電子部品２の熱をプリント配線板１へ伝える。   Examples of the heat generating electronic component 2 that generates heat include a power regulator IC and a power transistor. The heat generating electronic component 2 that generates heat is generally provided with a heat radiating plate 2a made of copper or aluminum for radiating heat generated by the elements inside the component to the outside of the component, and further, the heat radiating plate 2a and the printed wiring. A heat dissipation solder layer 3a is printed and filled between the boards 1 (insulating board), and the heat of the heat generating electronic component 2 is transmitted to the printed wiring board 1.

尚、発熱を伴う発熱電子部品２の内部構造を示す図示は省略する。   In addition, illustration which shows the internal structure of the heat-generating electronic component 2 accompanied by heat generation is omitted.

プリント配線板１において、発熱を伴う発熱電子部品２の直下（発熱電子部品２に対向する位置）に位置する部位には、１ヶ以上のスルーホール７（挿入孔）を設け、そのスルーホール７の内部には放熱用部材である放熱用ピン４を挿入している。この放熱用ピン４は、熱伝導性が良好な金属材料（銅または銅合金ないし銅または銅合金に鍍金を施した材料）で形成される。   In the printed wiring board 1, at least one through hole 7 (insertion hole) is provided in a portion located immediately below the heat generating electronic component 2 that generates heat (a position facing the heat generating electronic component 2). A heat radiating pin 4 as a heat radiating member is inserted inside. The heat dissipation pin 4 is formed of a metal material having good thermal conductivity (a material obtained by plating copper or a copper alloy or copper or a copper alloy).

さらに、放熱用ピン４の外周には、半田３ｂが充填されており、プリント配線板１の熱を放熱ピン４へ伝えるとともに、放熱ピン４をプリント配線板１へ接合・固定する。   Further, the outer periphery of the heat dissipation pin 4 is filled with solder 3 b, which transfers heat of the printed wiring board 1 to the heat dissipation pin 4 and bonds and fixes the heat dissipation pin 4 to the printed wiring board 1.

尚、半田３ｂには、半田層３ａの一部がスルーホール７内に流れ込んだものを含む。   Note that the solder 3b includes a solder layer 3a partially flowing into the through hole 7.

放熱ピン４をプリント配線板１へ半田接続する方法は、既存の発熱電子部品やコネクタおよびコネクタピンをプリント配線板へ半田接続するための半田リフローまたは半田フロープロセスで実現可能であり、熱伝導接着剤のように硬化する必要が無いため、組立て時間を短縮できる。   The method of soldering the heat radiation pins 4 to the printed wiring board 1 can be realized by a solder reflow or solder flow process for soldering the existing heat generating electronic components, connectors, and connector pins to the printed wiring board. Since it is not necessary to cure like an agent, assembly time can be shortened.

また、半田３ｂは、プリント配線板へ印刷する半田層３ａと同時に印刷しておくことが可能である。   The solder 3b can be printed at the same time as the solder layer 3a to be printed on the printed wiring board.

放熱ピン４と半田３ｂの接合面積、接合強度、および接合部の信頼性、また、プリント配線板１から放熱ピン４への伝熱効率、およびスルーホール内への半田充填率を考慮し、放熱ピン４はスルーホール内に、プリント配線板１の厚さの１／２以上挿入することが望ましい。   Considering the bonding area, bonding strength, and reliability of the bonding portion of the radiating pin 4 and the solder 3b, the heat transfer efficiency from the printed wiring board 1 to the radiating pin 4, and the solder filling rate into the through hole, 4 is preferably inserted into the through hole by a half or more of the thickness of the printed wiring board 1.

また、スルーホール径は、半田充填性を考慮し、基板厚さの２倍以下とすることが望ましい。スルーホール径が基板厚さの２倍を越えると、半田印刷時には半田充填できるが、その後、自重によって半田がスルーホールより流れ出す恐れがある。   Further, it is desirable that the through hole diameter is not more than twice the substrate thickness in consideration of the solder filling property. If the through-hole diameter exceeds twice the substrate thickness, the solder can be filled at the time of solder printing, but then the solder may flow out of the through-hole due to its own weight.

また、基板厚さの２倍を上限とするスルーホールを規則的に配置することで、基板厚さの２倍以上のスルーホールを配置する場合に比べて、スルーホールの配置密度を高めることができ、放熱効率を向上できる。   Further, by regularly arranging the through holes whose upper limit is twice the substrate thickness, it is possible to increase the arrangement density of the through holes as compared with the case of arranging the through holes more than twice the substrate thickness. This can improve heat dissipation efficiency.

図２に示すように、放熱ピン４の先端は外部ケース５へ接続し、電子回路基板１０の熱を基板外へ放熱する。放熱ピン４の一部をケース５の外部へ露出することによって、さらに放熱効率を向上できる。   As shown in FIG. 2, the tips of the heat radiation pins 4 are connected to the outer case 5 to radiate the heat of the electronic circuit board 10 to the outside of the board. By exposing a part of the heat dissipation pin 4 to the outside of the case 5, the heat dissipation efficiency can be further improved.

外カバー１５は、外部ケース５と抱き合うように合わされる。この外部ケース５と外カバー１５の内部に電子回路基板１０を内置して電子回路装置２０が構成される。   The outer cover 15 is fitted so as to hug the outer case 5. The electronic circuit board 20 is configured by placing the electronic circuit board 10 inside the outer case 5 and the outer cover 15.

発熱電子部品２が発生した熱は、外部ケース５と外カバー１５の内部に篭る。それにより、電子回路装置２０の内部温度は上昇する。しかし、発熱電子部品２が発生した熱は、放熱ピン４を介して外部ケース５に伝わり、外部ケース５や外カバー１５の表面から外部に放熱さえる。これにより、電子回路装置２０の温度上昇は抑えられる。   The heat generated by the heat generating electronic component 2 goes into the outer case 5 and the outer cover 15. Thereby, the internal temperature of the electronic circuit device 20 rises. However, the heat generated by the heat generating electronic component 2 is transmitted to the outer case 5 through the heat radiation pins 4 and is radiated to the outside from the surface of the outer case 5 and the outer cover 15. Thereby, the temperature rise of the electronic circuit device 20 is suppressed.

また、図２に示すように、放熱ピン４を途中から曲げることで、外部への露出面積を拡大できる。   Moreover, as shown in FIG. 2, the exposed area to the outside can be expanded by bending the heat radiation pin 4 from the middle.

外部ケース５は、電子回路装置を構成する、外気に接している構造体の一例である。このような構造体には、樹脂ケース、アルミダイキャストケース、金属ケースおよびブラケット、等がある。   The outer case 5 is an example of a structure that constitutes an electronic circuit device and is in contact with the outside air. Such structures include resin cases, aluminum die cast cases, metal cases, brackets, and the like.

このような構造体との一体化の方法には、モールド、ダイキャスト成形、圧入、溶接、等がある。   Examples of methods for integration with such a structure include molding, die casting, press fitting, welding, and the like.

尚、外カバー１５は、外部ケース５と同様、樹脂、アルミダイキャスト等で形成される。   The outer cover 15 is formed of resin, aluminum die cast or the like, like the outer case 5.

図３（比較参考図）と対比しながら、本発明の良さについて説明する。   The advantage of the present invention will be described in comparison with FIG. 3 (comparison reference diagram).

図３に示すように、熱伝導グリース８や熱伝導接着剤を用いて電子回路基板配線板１０から外部ケース５へ放熱する場合、プリント配線板１の裏面への半田だれは熱伝導グリース８や熱伝導接着剤の厚さを増加させ、放熱性を悪化させる原因となるため、これら部材の厚さ管理が必要であり、また、半田だれを防止するプロセス条件の検討が必要となる。   As shown in FIG. 3, when heat is dissipated from the electronic circuit board wiring board 10 to the outer case 5 using the heat conductive grease 8 or heat conductive adhesive, the solder dripping on the back surface of the printed wiring board 1 Since this increases the thickness of the heat conductive adhesive and deteriorates heat dissipation, it is necessary to manage the thickness of these members and to examine process conditions for preventing solder dripping.

一方、図１や図２に示すように放熱ピン４を用いる場合は、図３に示す熱伝導グリース８や熱伝導接着剤の場合に対し、熱伝導グリース８や熱伝導接着剤の厚さ管理は不要となる。   On the other hand, when using the radiating pins 4 as shown in FIGS. 1 and 2, the thickness management of the thermal conductive grease 8 and the thermal conductive adhesive is different from the case of the thermal conductive grease 8 and the thermal conductive adhesive shown in FIG. Is no longer necessary.

また、半田３ｂのだれはスルーホール内を経由して放熱ピン４へ付着させるため、半田だれを許容できる放熱構造を実現できる。   Further, since the solder 3b is attached to the heat radiation pin 4 via the inside of the through-hole, it is possible to realize a heat dissipation structure that allows solder dripping.

さらに、図３に示すように、熱伝導グリース８や熱伝導接着剤を用いる場合は、熱伝導グリース８や熱伝導接着剤をプリント配線板１と平面的に接合するため、これらを塗布する部位に対応するプリント配線板側の部位には発熱電子部品を実装できないため、実装密度が低下する。   Further, as shown in FIG. 3, when the thermal conductive grease 8 or the thermal conductive adhesive is used, the thermal conductive grease 8 or the thermal conductive adhesive is joined to the printed wiring board 1 in a planar manner, and the parts to be applied are applied. Since the heat generating electronic component cannot be mounted on the printed wiring board side corresponding to the above, the mounting density is lowered.

一方、図２に示すように、放熱ピン４による放熱構造では、スルーホール外周に発熱電子部品９を実装でき、実装密度を向上できる。   On the other hand, as shown in FIG. 2, in the heat dissipation structure with the heat dissipation pin 4, the heat generating electronic component 9 can be mounted on the outer periphery of the through hole, and the mounting density can be improved.

放熱ピン４は、熱伝導性の良好な金属で形成したので、従来用いた熱伝導グリースのような流れ出しが生じない。これにより、熱伝導グリースの経時変化による放熱能力低下の問題は解消された。   Since the radiating pin 4 is made of a metal having good thermal conductivity, it does not flow out as in the case of conventionally used thermal conductive grease. As a result, the problem of a decrease in heat dissipation capability due to the aging of the heat conductive grease was solved.

図４は、複数の放熱ピン４を外部ケース５と一体モールドした電子回路装置の断面を示す。複数の放熱ピン４を、発熱電子部品２の形状やケース５の形状に合わせて配置、一体化することができる。   FIG. 4 shows a cross section of an electronic circuit device in which a plurality of heat radiation pins 4 are integrally molded with the outer case 5. A plurality of heat radiation pins 4 can be arranged and integrated according to the shape of the heat generating electronic component 2 and the shape of the case 5.

放熱ピン方式では、熱伝導グリースや熱伝導接着剤、熱伝導シートのように厚さ変化が発生しないため、形状変化に対して安定した放熱構造とできる。   In the heat dissipation pin method, unlike the heat conductive grease, the heat conductive adhesive, and the heat conductive sheet, the thickness does not change, so that a heat dissipation structure stable against the shape change can be achieved.

図５に示すように、放熱ピン４は発熱電子部品２の直下および外周に配置することが好ましい。   As shown in FIG. 5, it is preferable that the radiating pins 4 be disposed directly below and on the outer periphery of the heat generating electronic component 2.

図６はプリント配線板１への放熱ピン４の挿入状態の例を示す。図６（ａ）では放熱ピン４がプリント配線板１を貫通しており、図６（ｂ）では放熱ピン４はプリント配線板１のスルーホール内で止めてある。   FIG. 6 shows an example of a state in which the heat radiation pins 4 are inserted into the printed wiring board 1. In FIG. 6A, the heat dissipation pin 4 penetrates the printed wiring board 1, and in FIG. 6B, the heat dissipation pin 4 is stopped in the through hole of the printed wiring board 1.

図６（ａ）に示す挿入状態は、発熱電子部品２の外周に配置するピンに適用できる。図６（ｂ）の挿入状態は、発熱電子部品２の下部に配置するピンに適用できる。   The insertion state shown in FIG. 6A can be applied to pins arranged on the outer periphery of the heat generating electronic component 2. The insertion state of FIG. 6B can be applied to the pins arranged below the heat generating electronic component 2.

また、放熱ピン４の長さは短く、またピン径は太いほど、熱抵抗を低減できるため、部品下部に配置するピンには図６（ｂ）の挿入状態が適する。   Further, since the heat resistance can be reduced as the length of the heat radiation pin 4 is shorter and the diameter of the pin is larger, the insertion state shown in FIG.

発熱電子部品２の直下の放熱ピン４の径とスルーホール径のクリアランスを小さく取り、部品外周の放熱ピン４の径とスルーホール径のクリアランスを大きく取ることで、組立て性を犠牲にすることなく、高い放熱効率を実現できる。   The clearance between the heat radiation pin 4 directly below the heat generating electronic component 2 and the through hole diameter is made small, and the clearance between the heat radiation pin 4 on the outer periphery of the component and the through hole diameter is made large without sacrificing assembly. High heat dissipation efficiency can be realized.

例えば、放熱ピン４の径は全ピンにおいて共通とし、部品外周のスルーホール径を部品直下のスルーホール径より大きくする、という方法がある。また、逆にスルーホール径を共通にし、部品外周に配置する放熱ピン４の径を細くする方法もある。   For example, there is a method in which the diameter of the radiating pin 4 is common to all pins, and the diameter of the through hole on the outer periphery of the component is made larger than the diameter of the through hole immediately below the component. On the other hand, there is also a method in which the through-hole diameter is made common and the diameter of the radiating pin 4 disposed on the outer periphery of the component is reduced.

放熱ピンの材質は銅または銅合金、および、半田との接合強度の向上、外部露出部の耐腐食性を向上させるために、これらに金、スズ、ニッケルなどの鍍金を施した材料が望ましい。   The material of the heat dissipation pin is preferably copper or a copper alloy, and a material provided with plating such as gold, tin, or nickel in order to improve the bonding strength with solder and the corrosion resistance of the externally exposed portion.

図７に放熱ピン４の形状の例を示す。   FIG. 7 shows an example of the shape of the heat dissipation pin 4.

図７（ａ）は円筒状の放熱ピンを示し、図７（ｂ）は図７（ａ）の円筒ピンの一部をプレスなどによって平面状につぶし、ピン表面からの放熱面積を拡大している。放熱ピンの、プリント配線板のスルーホールへ挿入する部位は図７（ａ）のように円筒状とし、組立て性を向上することが好ましい。   FIG. 7A shows a cylindrical heat radiation pin, and FIG. 7B shows a part of the cylindrical pin of FIG. 7A crushed into a flat shape by a press or the like to enlarge the heat radiation area from the pin surface. Yes. The part of the heat dissipation pin to be inserted into the through hole of the printed wiring board is preferably cylindrical as shown in FIG.

放熱ピン４の、外部へ露出する部位は図７（ｂ）のように平面状のつぶし部４ａを設けることによって放熱効率を向上できる。放熱ピン４をつぶす部位を変えることによって、プリント基板への挿入深さを調整することができる。   The part exposed to the outside of the heat radiation pin 4 can improve the heat radiation efficiency by providing a flat crushing part 4a as shown in FIG. 7B. The insertion depth to the printed circuit board can be adjusted by changing the portion where the heat radiation pin 4 is crushed.

図７（ａ）に示すピンは、その端部をテーパ状にすることによって、スルーホールへの挿入性を向上すると同時に、半田と放熱ピン４の接合面積を拡大することもできる。   The pin shown in FIG. 7A has a tapered end portion, so that the insertion property into the through hole can be improved, and at the same time, the bonding area between the solder and the heat radiation pin 4 can be increased.

〔実施例２〕
図８に第２の実施例を示す。 [Example 2]
FIG. 8 shows a second embodiment.

本実施例では、放熱ピンとプリント配線板の接合に、絶縁性の熱伝導接着剤６を使うことで、半田に比べて電気的な絶縁性を向上し、電気的なショートの発生防止を図る。   In this embodiment, the insulating thermal conductive adhesive 6 is used for joining the heat radiation pin and the printed wiring board, thereby improving the electrical insulation as compared with the solder and preventing the occurrence of an electrical short circuit.

また、絶縁性の熱伝導接着剤６を用いることで、電気的に導通しているスルーホールを放熱用のスルーホールと兼用することができ、放熱性を保ったまま、実装密度の向上、および基板サイズの縮小が可能である。   Further, by using the insulating heat conductive adhesive 6, the electrically conductive through hole can be used also as a heat radiating through hole, improving the mounting density while maintaining the heat radiating property, and The substrate size can be reduced.

絶縁性熱伝導接着剤６を使う場合、加熱硬化が必要となる場合もあるが、放熱ピンを用いる方式である限り、厚さ管理を省くことができ、作業性および歩留まりを向上できる。   When the insulating heat conductive adhesive 6 is used, heat curing may be required. However, as long as the heat dissipation pin is used, the thickness management can be omitted, and workability and yield can be improved.

上記実施例の主な特徴を以下に列挙する。
（１）．熱伝導が良好な金属材料で作られた放熱用部材の一方を絶縁基板に設けた挿入孔内に挿入して接合することによって、絶縁基板から放熱用部材へ効果的に熱を伝達する放熱構造を提供する。発熱電子部品内部のチップで発生した熱は、一般には、発熱電子部品の下部に設けられた放熱板等を経由して、絶縁基板に伝わる。絶縁基板に達した熱は、例えば、絶縁基板に設けたスルーホールなどの挿入孔へ至り、スルーホール表面の銅鍍金を経て、絶縁基板下面へ至る。このとき、スルーホール内に放熱用部材を挿入することで、スルーホール表面より放熱用部材へ熱を伝え、発熱電子部品の熱を絶縁基板の外へ伝達する。 The main features of the above embodiment are listed below.
(1). A heat dissipating structure that effectively transfers heat from the insulating substrate to the heat dissipating member by inserting and joining one of the heat dissipating members made of a metal material with good heat conduction into the insertion hole provided in the insulating substrate I will provide a. The heat generated in the chip inside the heat generating electronic component is generally transferred to the insulating substrate via a heat sink provided below the heat generating electronic component. The heat reaching the insulating substrate reaches, for example, an insertion hole such as a through hole provided in the insulating substrate, and reaches the lower surface of the insulating substrate through copper plating on the surface of the through hole. At this time, by inserting a heat radiating member into the through hole, heat is transmitted from the surface of the through hole to the heat radiating member, and heat of the heat generating electronic component is transmitted outside the insulating substrate.

放熱用部材の一方をプリント配線板に接合した後に、放熱用部材の他方を外部ケース等に取り付けて接合する。予め外部ケースに取り付けておくことも可能である。放熱用部材は外部ケースと一体化しておくことが伝熱の面で最も効果的である。
（２）．絶縁基板に設ける挿入孔および挿入孔へ挿入する放熱用部材は、発熱を伴う発熱電子部品の下部および周囲に配置することが望ましい。放熱用部材による放熱効率が向上するのである。
（３）．放熱用部材は銅または銅合金およびこれらに鍍金を施した材料とすることが好ましい。伝熱がよく、経年変化が生じないからである。
（４）．放熱用部材は、円筒、または円筒部と円筒をつぶした平面部分からなる形状とすることが好ましい。 After joining one of the heat dissipating members to the printed wiring board, the other heat dissipating member is attached and joined to an external case or the like. It is also possible to attach to the outer case in advance. It is most effective in terms of heat transfer that the heat dissipating member is integrated with the outer case.
(2). The insertion hole provided in the insulating substrate and the heat dissipating member to be inserted into the insertion hole are desirably disposed below and around the heat generating electronic component that generates heat. The heat radiation efficiency by the heat radiating member is improved.
(3). The heat radiating member is preferably copper or a copper alloy and a material obtained by plating them. This is because heat transfer is good and aging does not occur.
(4). It is preferable that the heat dissipating member has a shape composed of a cylinder or a flat portion obtained by crushing the cylinder and the cylinder.

円筒、または円筒部の径が大きいほど放熱用部材内部の熱抵抗を低減できるため、円筒または円筒部の径はスルーホール内に挿入できる大きさで、可能な限り大きくすることが望ましい。   Since the thermal resistance inside the heat dissipation member can be reduced as the diameter of the cylinder or the cylindrical portion increases, it is desirable that the diameter of the cylinder or the cylindrical portion is large enough to be inserted into the through hole.

円筒または円筒部の径は、スルーホール径以下に限定するものではなく、スルーホール内に挿入可能であれば、スルーホール径以上であってもよい。
（５）．放熱用部材の一端を外気へ接する構造体（外部ケース）と一体化することによって、発熱電子部品の熱を効果的に電子回路装置の外部へ放熱する構造を提供できる。 The diameter of the cylinder or the cylindrical portion is not limited to the diameter of the through hole or less, and may be equal to or larger than the diameter of the through hole as long as it can be inserted into the through hole.
(5). By integrating one end of the heat radiating member with a structure (outer case) that comes into contact with the outside air, it is possible to provide a structure that effectively radiates the heat of the heat generating electronic component to the outside of the electronic circuit device.

それとともに、放熱用部材を外部環境から保護し、振動などに対する耐久性を向上する。   At the same time, the heat dissipating member is protected from the external environment, and durability against vibrations is improved.

複数の放熱用部材を一体化することにより、放熱効率をさらに向上できる。特に、複数の放熱用部材を一体モールドする場合は、上述した放熱用部材の配置と組み合わせることで、放熱効率をさらに向上できる。
（６）．放熱用部材と絶縁基板の接合材料に半田を用いることで、電子回路装置を構成する発熱電子部品の装着に使用する半田印刷と同時に、放熱用部材を接合固定できる。作業性の向上である。 By integrating a plurality of heat dissipation members, the heat dissipation efficiency can be further improved. In particular, when a plurality of heat dissipation members are integrally molded, the heat dissipation efficiency can be further improved by combining with the above-described arrangement of the heat dissipation members.
(6). By using solder as the bonding material between the heat dissipation member and the insulating substrate, the heat dissipation member can be bonded and fixed simultaneously with the solder printing used for mounting the heat generating electronic components constituting the electronic circuit device. This is an improvement in workability.

また、半田は熱伝導性に優れるため、絶縁基板から放熱用部材への放熱効率が向上するさらに、従来の半田付け技術および製造プロセスを用いることができる。
（７）．放熱用部材と絶縁基板の接合材料に絶縁性の熱伝導接着剤を用いることで、半田に比べて電気的な絶縁性の向上および電気的なショートの発生防止を図る。 Moreover, since solder is excellent in thermal conductivity, the heat radiation efficiency from the insulating substrate to the heat radiating member is improved, and a conventional soldering technique and manufacturing process can be used.
(7). By using an insulating heat conductive adhesive as a bonding material between the heat dissipating member and the insulating substrate, it is possible to improve electrical insulation and prevent electrical shorting compared to solder.

また、絶縁性の熱伝導接着剤を用いることで、電気的に導通しているスルーホールを、放熱用部材を挿入する孔と兼用することができ、絶縁基板の実装密度の向上、および基板サイズの縮小を可能とする。   Also, by using an insulating heat conductive adhesive, the electrically conductive through hole can be used also as a hole for inserting a heat dissipation member, improving the mounting density of the insulating substrate, and the substrate size Can be reduced.

尚、熱伝導性接着剤を用いているが、絶縁基板と外部ケース等を平面的に接着していないため、厚さ管理は省略できる。
（８）．発熱電子部品は絶縁基板との対向面側に半田層と接合する放熱板を有する。これにより、発熱電子部品の発熱が放熱用部材に良く伝達され、放熱効果が向上する。
（９）．挿入孔内に挿入される方の放熱用部材の端部を半田層に接合することにより、発熱電子部品の発熱が放熱用部材に良く伝達され、放熱効果が向上する。 Although the heat conductive adhesive is used, the thickness management can be omitted because the insulating substrate and the outer case are not bonded in a plane.
(8). The heat generating electronic component has a heat radiating plate joined to the solder layer on the side facing the insulating substrate. Thereby, the heat generated by the heat generating electronic component is well transmitted to the heat radiating member, and the heat radiating effect is improved.
(9). By joining the end of the heat radiating member inserted into the insertion hole to the solder layer, the heat generated by the heat generating electronic component is well transmitted to the heat radiating member, and the heat radiating effect is improved.

本発明は、特に、自動車用電子制御装置に用いる、発熱を伴う発熱電子部品およびこれら部品を実装した電子回路基板の放熱構造として利用できる。   INDUSTRIAL APPLICABILITY The present invention can be used particularly as a heat-dissipating electronic component that generates heat and a heat-dissipating structure of an electronic circuit board on which these components are mounted, used in an electronic control device for automobiles.

発熱を伴う発熱電子部品を実装した電子回路基板の断面を示す図。The figure which shows the cross section of the electronic circuit board which mounted the heat_generation | fever electronic component accompanied with heat_generation | fever. 放熱ピンの一端を電子回路基板へ接続し、他端を外部ケースへ接続した電子回路装置の断面を示す図。The figure which shows the cross section of the electronic circuit apparatus which connected one end of the thermal radiation pin to the electronic circuit board, and connected the other end to the external case. 本発明の良さを説明するための比較参考図で、電子回路基板と外部ケースを熱伝導グリースで接続した電子回路装置の断面を示す。It is a comparative reference figure for demonstrating the merit of this invention, and shows the cross section of the electronic circuit apparatus which connected the electronic circuit board and the outer case with the heat conductive grease. 複数の放熱ピンを一体モールドした電子回路装置の断面を示す図。The figure which shows the cross section of the electronic circuit apparatus which integrally molded the several heat radiating pin. 発熱を伴う発熱電子部品の直下および外周へ配置したスルーホールおよび放熱ピンの配置例を示す図。The figure which shows the example of arrangement | positioning of the through hole and heat radiating pin which were arrange | positioned directly under the heat-generating electronic component with heat_generation | fever, and outer periphery. 放熱ピンの挿入深さの例を示す図。（ａ）では放熱用部材は基板を貫通している状態、（ｂ）では放熱用部材は基板内で止めている状態である。The figure which shows the example of the insertion depth of a thermal radiation pin. In (a), the heat radiating member penetrates the substrate, and in (b), the heat radiating member is stopped in the substrate. 放熱ピンの形状例を示す図。（ａ）は円筒状、（ｂ）は円筒の一部をつぶして平面した形状である。The figure which shows the example of a shape of a thermal radiation pin. (A) is a cylindrical shape, (b) is the shape which flattened a part of cylinder. 複数の放熱ピンを一体モールドし、電子回路基板と放熱ピンを絶縁性熱伝導接着剤で接合した電子回路装置の断面を示す図。The figure which shows the cross section of the electronic circuit apparatus which integrally molded the several thermal radiation pin and joined the electronic circuit board and the thermal radiation pin with the insulating heat conductive adhesive.

符号の説明Explanation of symbols

１…プリント配線板、２…発熱を伴う発熱電子部品、２ａ…発熱を伴う発熱電子部品に設けられた放熱板、３ａ…半田層（発熱を伴う発熱電子部品の熱をプリント配線板へ伝達する）、３ｂ…半田（プリント配線板の熱を放熱用部材に伝達する）、４…放熱用ピン（放熱用部材）、４ａ…放熱用部材のつぶし部（平面部分）、５…外部ケース、６…絶縁性熱伝導接着剤、７…スルーホール、８…熱伝導グリース、９…プリント配線板の裏面に実装した発熱電子部品、１０…電子回路基板、１５…外カバー、２０…電子回路装置。   DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Heat generating electronic component accompanied with heat generation, 2a ... Heat radiating plate provided in heat generating electronic component accompanied with heat generation, 3a ... Solder layer (transfers heat of heat generating electronic component accompanied with heat generation to printed wiring board ), 3b ... solder (transmits heat of the printed wiring board to the heat radiating member), 4 ... heat radiating pin (heat radiating member), 4a ... crushing part (plane part) of the heat radiating member, 5 ... outer case, 6 DESCRIPTION OF SYMBOLS Insulating heat conductive adhesive, 7 ... Through hole, 8 ... Thermal conductive grease, 9 ... Heat-generating electronic component mounted on the back surface of the printed wiring board, 10 ... Electronic circuit board, 15 ... Outer cover, 20 ... Electronic circuit device

Claims (9)

発熱が伴う発熱電子部品と、前記発熱電子部品を装着する絶縁基板と、前記発熱電子部品と前記絶縁基板とを接合する半田層等を有する電子回路基板と、
前記電子回路基板の熱を電子回路基板の外部へ放熱するための放熱用部材と、前記電子回路基板を内置する外部ケース、および外カバー等を有する電子回路装置において、
前記放熱用部材を熱伝導が良好な金属材料で形成し、
前記絶縁基板に前記放熱用部材が挿入される挿入孔を設け、
前記放熱用部材は、一方を前記挿入孔に挿入接合し、他方を前記外カバーに接合したことを特徴とする電子回路装置。 A heat generating electronic component accompanied by heat generation, an insulating substrate on which the heat generating electronic component is mounted, an electronic circuit board having a solder layer or the like that joins the heat generating electronic component and the insulating substrate,
In an electronic circuit device having a heat dissipating member for dissipating heat of the electronic circuit board to the outside of the electronic circuit board, an outer case in which the electronic circuit board is placed, an outer cover, etc.
The heat radiating member is formed of a metal material having good heat conduction,
Providing an insertion hole into which the heat dissipation member is inserted in the insulating substrate;
One of the heat radiating members is inserted and joined to the insertion hole, and the other is joined to the outer cover. 請求項１記載の電子回路装置において、
前記挿入孔、および前記放熱用部材は、前記発熱電子部品に対向する位置および／または周囲に設けたことを特徴とする電子回路装置。 The electronic circuit device according to claim 1,
The electronic circuit device, wherein the insertion hole and the heat radiating member are provided at a position facing and / or around the heat generating electronic component. 請求項１または２に記載の電子回路装置において、
放熱用部材は、銅または銅合金ないし銅または銅合金に鍍金を施した材料で形成したことを特徴とする電子回路装置。 The electronic circuit device according to claim 1 or 2,
The heat dissipation member is formed of copper, a copper alloy, a material obtained by plating copper or a copper alloy, or an electronic circuit device. 請求項１〜３の何れに記載された電子回路装置において、
放熱用部材の形状は円筒および／または円筒をつぶした平面を有する形状であることを特徴とする電子回路装置。 The electronic circuit device according to any one of claims 1 to 3,
An electronic circuit device characterized in that the shape of the heat dissipating member is a cylinder and / or a shape having a flattened surface of the cylinder. 請求項１〜４の何れに記載された電子回路装置において、
前記放熱用部材と前記外カバーとの前記接合により前記放熱用部材と前記外カバーを一体化したことを特徴とする電子回路装置。 In the electronic circuit device according to any one of claims 1 to 4,
An electronic circuit device, wherein the heat dissipation member and the outer cover are integrated by the joining of the heat dissipation member and the outer cover. 請求項１〜５の何れに記載された電子回路装置において、
前記挿入孔内に挿入する放熱用部材を半田によって前記絶縁基板に接合固定することを特徴とする電子回路装置。 In the electronic circuit device according to any one of claims 1 to 5,
An electronic circuit device characterized in that a heat radiating member to be inserted into the insertion hole is bonded and fixed to the insulating substrate by soldering. 請求項１〜５の何れに記載された電子回路装置において、
前記挿入孔内に挿入する放熱用部材を絶縁性の熱伝導接着剤によって前記絶縁基板に接合固定することを特徴とする電子回路装置。 In the electronic circuit device according to any one of claims 1 to 5,
An electronic circuit device comprising: a heat-dissipating member inserted into the insertion hole and fixed to the insulating substrate by an insulating heat conductive adhesive. 請求項１〜７の何れに記載された電子回路装置において、
前記発熱電子部品は前記絶縁基板との対向面側に前記半田層と接合する放熱板を有することを特徴とする電子回路装置。 In the electronic circuit device according to any one of claims 1 to 7,
The electronic circuit device according to claim 1, wherein the heat generating electronic component has a heat radiating plate bonded to the solder layer on a side facing the insulating substrate. 請求項１〜８の何れに記載された電子回路装置において、
前記挿入孔内に挿入される方の放熱用部材の端部を前記半田層に接合することを特徴とする電子回路装置。
In the electronic circuit device according to any one of claims 1 to 8,
An electronic circuit device, wherein an end of a heat radiating member inserted into the insertion hole is joined to the solder layer.
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JP2011187809A (en) * 2010-03-10 2011-09-22 Renesas Electronics Corp Semiconductor device and multilayer wiring board
JP2014107310A (en) * 2012-11-26 2014-06-09 Hitachi Automotive Systems Ltd Brake device
CN106852068A (en) * 2016-12-05 2017-06-13 广东欧珀移动通信有限公司 Housing, radiating subassembly and mobile terminal

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JP2011187809A (en) * 2010-03-10 2011-09-22 Renesas Electronics Corp Semiconductor device and multilayer wiring board
US8618632B2 (en) 2010-03-10 2013-12-31 Renesas Electronics Corporation Semiconductor device and multi-layered wiring substrate
JP2014107310A (en) * 2012-11-26 2014-06-09 Hitachi Automotive Systems Ltd Brake device
CN106852068A (en) * 2016-12-05 2017-06-13 广东欧珀移动通信有限公司 Housing, radiating subassembly and mobile terminal

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