JP2007012900A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2007012900A JP2007012900A JP2005192369A JP2005192369A JP2007012900A JP 2007012900 A JP2007012900 A JP 2007012900A JP 2005192369 A JP2005192369 A JP 2005192369A JP 2005192369 A JP2005192369 A JP 2005192369A JP 2007012900 A JP2007012900 A JP 2007012900A
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- JP
- Japan
- Prior art keywords
- wiring board
- insulating film
- circuit component
- flexible wiring
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】 フレキシブル配線基板1上に接続された駆動IC4の両側に、補強部材として半田12、12を着設する。フレキシブル配線基板1を折り曲げた場合のストレスが、半田12、12によりフレキシブル配線基板1及び駆動IC4の接続部分に加わらないため、接続部分の破壊を防止できる。
【選択図】 図3
Description
(実施の形態1)
図1は、本発明に係るインクジェットヘッドの構成を示す分解斜視図であり、図2は、本発明に係るインクジェットヘッドの構成を示す側断面図である。
図7は、本発明の実施の形態2に係るフレキシブル配線基板の構成を示す平面図であり、駆動IC4が接続されている面を図示している。実施の形態2に係るフレキシブル配線基板50上には、インクジェットヘッドに実装する場合に折り曲げるA−A線及びB−B線の間に、駆動IC4の周囲を囲んでエポキシ樹脂による硬化型接着剤51が環状に着設してある。硬化した硬化型接着剤51は、駆動IC4の周囲を補強する補強枠として働く。つまり、硬化型接着剤51が硬化した後では、硬化型接着剤51で囲まれた部分は折り曲げることができなくなるため、駆動IC4の接続端子と駆動用配線21a、21a…及び信号配線21c、21c…との接続部分に折り曲げによるストレスが加わることがない。
2 圧電素子
3 流路ユニット
4 駆動IC
5 フラットケーブル
6 補強フレーム
7 ホルダ
8 ヒートシンク
9 インクバッファタンク
10 回路基板
11 クッション材
12 半田(補強部材)
20 絶縁フィルム
21 配線
24 端子ランド
25 半田バンプ
51 硬化型接着剤(補強部材)
Claims (8)
- 複数の配線が形成された絶縁フィルムと、該絶縁フィルムの一面で前記配線に接続された回路部品とを備える配線基板において、
前記絶縁フィルムに着設してあり、前記絶縁フィルムの折り曲げを防止する補強部材を備えることを特徴とする配線基板。 - 複数の配線が形成された絶縁フィルムと、該絶縁フィルムの一面で前記配線に接続された回路部品とを備え、前記絶縁フィルムを所定位置で折り曲げた状態で実装される配線基板において、
前記絶縁フィルムを折り曲げる方向と交差する方向に前記絶縁フィルムに着設してあり、前記所定位置以外での折り曲げを防止する補強部材を備えることを特徴とする配線基板。 - 前記補強部材は、前記回路部品を挟むように、前記回路部品の両側に設けてある請求項1又は請求項2に記載の配線基板。
- 前記補強部材は、前記回路部品を間にして両側に、前記回路部品に沿って延設され、
前記補強部材の延設方向と直交する方向から見た場合に、前記補強部材の前記延設方向の端部が、前記回路部品の前記延設方向の端部より、前記絶縁フィルムを折り曲げる前記所定位置に近い請求項2に記載の配線基板。 - 前記補強部材は、前記回路部品の周囲を囲んで設けてある請求項1又は請求項2に記載の配線基板。
- 前記補強部材は、前記配線に着設された導電性ろう材又は導電性接着剤である請求項1乃至請求項4のいずれか1つに記載の配線基板。
- 前記補強部材は、硬化型接着剤である請求項1乃至請求項5のいずれか1つに記載の配線基板。
- 前記補強部材は前記一面に着設され、
前記補強部材の高さが、前記回路部品の高さより低い請求項1乃至請求項7のいずれか1つに記載の配線基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192369A JP4770295B2 (ja) | 2005-06-30 | 2005-06-30 | 配線基板 |
US11/426,399 US7674984B2 (en) | 2005-06-30 | 2006-06-26 | Wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192369A JP4770295B2 (ja) | 2005-06-30 | 2005-06-30 | 配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012900A true JP2007012900A (ja) | 2007-01-18 |
JP4770295B2 JP4770295B2 (ja) | 2011-09-14 |
Family
ID=37589910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005192369A Active JP4770295B2 (ja) | 2005-06-30 | 2005-06-30 | 配線基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7674984B2 (ja) |
JP (1) | JP4770295B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008211048A (ja) * | 2007-02-27 | 2008-09-11 | Brother Ind Ltd | 回路素子実装フレキシブル配線材 |
JP2012507459A (ja) * | 2008-10-29 | 2012-03-29 | クラミック エレクトロニクス ゲーエムベーハー | 複合材料、複合材料形成方法、及び接着剤又は接合材料 |
WO2015016401A1 (ko) * | 2013-07-30 | 2015-02-05 | 어레인보우 주식회사 | 연성 회로 기판 및 그 제조 방법 |
JP2016140987A (ja) * | 2015-01-30 | 2016-08-08 | ブラザー工業株式会社 | 液体吐出装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5095460B2 (ja) * | 2008-01-17 | 2012-12-12 | シャープ株式会社 | 半導体装置および表示装置 |
JP5433628B2 (ja) * | 2011-05-12 | 2014-03-05 | 東芝テック株式会社 | 回路基板およびインクジェットヘッドの製造方法 |
KR101493556B1 (ko) * | 2011-10-27 | 2015-02-16 | 엘지디스플레이 주식회사 | 터치 센서 내장형 유기발광 다이오드 표시장치 |
JP2014188814A (ja) * | 2013-03-27 | 2014-10-06 | Seiko Epson Corp | 液体噴射ヘッド、および液体噴射装置 |
JP6715703B2 (ja) * | 2016-03-29 | 2020-07-01 | 日本碍子株式会社 | 金属配線接合構造の製法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03220736A (ja) * | 1990-01-25 | 1991-09-27 | Nec Corp | 半導体素子の実装方法 |
JPH09283889A (ja) * | 1996-04-09 | 1997-10-31 | Rohm Co Ltd | フレキシブル基板の補強方法及びフレキシブル基板 |
JPH11346036A (ja) * | 1998-06-01 | 1999-12-14 | Olympus Optical Co Ltd | 電気基板および電気実装装着方法 |
JP2000058985A (ja) * | 1998-08-11 | 2000-02-25 | Seiko Epson Corp | 配線基板、液晶装置及び電子機器 |
JP2001148547A (ja) * | 1999-11-18 | 2001-05-29 | Sanyo Electric Co Ltd | 電気装置の接続に用いるcof基板 |
JP2002368349A (ja) * | 2001-06-07 | 2002-12-20 | Olympus Optical Co Ltd | フレキシブルプリント基板 |
Family Cites Families (17)
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FR2557385B1 (fr) * | 1983-12-23 | 1986-10-17 | Nozick Jacques | Connecteur electrique multipolaire et son procede de fabrication |
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JPH09109388A (ja) | 1995-10-16 | 1997-04-28 | Rohm Co Ltd | インクジェットプリントヘッド |
US6027208A (en) * | 1995-09-29 | 2000-02-22 | Rohm Co. Ltd. | Ink jet printhead with passage forming panel and vibration plate |
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JP3512655B2 (ja) * | 1998-12-01 | 2004-03-31 | シャープ株式会社 | 半導体装置およびその製造方法並びに該半導体装置の製造に使用される補強用テープ |
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-
2005
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-
2006
- 2006-06-26 US US11/426,399 patent/US7674984B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03220736A (ja) * | 1990-01-25 | 1991-09-27 | Nec Corp | 半導体素子の実装方法 |
JPH09283889A (ja) * | 1996-04-09 | 1997-10-31 | Rohm Co Ltd | フレキシブル基板の補強方法及びフレキシブル基板 |
JPH11346036A (ja) * | 1998-06-01 | 1999-12-14 | Olympus Optical Co Ltd | 電気基板および電気実装装着方法 |
JP2000058985A (ja) * | 1998-08-11 | 2000-02-25 | Seiko Epson Corp | 配線基板、液晶装置及び電子機器 |
JP2001148547A (ja) * | 1999-11-18 | 2001-05-29 | Sanyo Electric Co Ltd | 電気装置の接続に用いるcof基板 |
JP2002368349A (ja) * | 2001-06-07 | 2002-12-20 | Olympus Optical Co Ltd | フレキシブルプリント基板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008211048A (ja) * | 2007-02-27 | 2008-09-11 | Brother Ind Ltd | 回路素子実装フレキシブル配線材 |
JP2012507459A (ja) * | 2008-10-29 | 2012-03-29 | クラミック エレクトロニクス ゲーエムベーハー | 複合材料、複合材料形成方法、及び接着剤又は接合材料 |
WO2015016401A1 (ko) * | 2013-07-30 | 2015-02-05 | 어레인보우 주식회사 | 연성 회로 기판 및 그 제조 방법 |
JP2016140987A (ja) * | 2015-01-30 | 2016-08-08 | ブラザー工業株式会社 | 液体吐出装置 |
Also Published As
Publication number | Publication date |
---|---|
US7674984B2 (en) | 2010-03-09 |
US20070003744A1 (en) | 2007-01-04 |
JP4770295B2 (ja) | 2011-09-14 |
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