JP2007009022A - Sheet-like adhesive, method for producing electronic part device and electronic part device - Google Patents

Sheet-like adhesive, method for producing electronic part device and electronic part device Download PDF

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JP2007009022A
JP2007009022A JP2005190219A JP2005190219A JP2007009022A JP 2007009022 A JP2007009022 A JP 2007009022A JP 2005190219 A JP2005190219 A JP 2005190219A JP 2005190219 A JP2005190219 A JP 2005190219A JP 2007009022 A JP2007009022 A JP 2007009022A
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adhesive
sheet
electronic component
melt viscosity
component element
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Toshio Enami
俊夫 江南
Kazuyuki Masahara
和幸 正原
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2005190219A priority Critical patent/JP2007009022A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-like adhesive which can suitably be used on the bonding of an electronic part element to a support member or the like, hardly laterally overflows, and can surely bond adherends to each other, and to provide a method for producing an electronic part device with the sheet-like adhesive. <P>SOLUTION: This sheet-like adhesive containing a thermosetting resin is characterized in that the minimum melt viscosity of the adhesive is in a range of 97 to 5,100 Pa s, when a cone plate viscometer is used at the number of revolutions of 1 Hz and when temperature is raised from 25°C at a temperature-raising rate of 10°C/min, and melt viscosity is ≥0.1 MPa s at a temperature of (50°C + the temperature showing the minimum melt viscosity). The method for producing the electronic part device comprises placing the sheet-like adhesive 103 between one side of an electronic part element 105 and a support member 102 on which the electronic part element is loaded, or another electronic part element, pressing the electronic part element to the support member or the other electronic part element, and then curing the sheet-like adhesive. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、熱硬化性樹脂を用いたシート状接着剤、シート状接着剤を用いた電子部品装置の製造方法及び電子部品装置に関し、より詳細には、被着体間において圧接された後に硬化される熱硬化性のシート状接着剤、並びに該シート状接着剤を用いた電子部品装置の製造方法及び電子部品装置に関する。   The present invention relates to a sheet-like adhesive using a thermosetting resin, a method for manufacturing an electronic component device using the sheet-like adhesive, and an electronic component device, and more specifically, cured after being pressed between adherends. The present invention relates to a thermosetting sheet adhesive, a method for manufacturing an electronic component device using the sheet adhesive, and an electronic component device.

従来、半導体素子を基板に接合するに際しては、半導体素子を基板上に搭載した後、半導体素子の下面と基板との間の隙間に接着剤を注入し、硬化させる方法が広く用いられていた。このように、後で接着剤を注入して形成される接着剤層は、通常、アンダーフィルと称されている。アンダーフィルを形成することにより、半導体素子と基板の接合強度が高められ、かつ半導体素子と基板上の電極との電気的接続部分の信頼性が高められている。   Conventionally, when a semiconductor element is bonded to a substrate, a method in which an adhesive is injected into a gap between the lower surface of the semiconductor element and the substrate and then cured after the semiconductor element is mounted on the substrate has been widely used. Thus, the adhesive layer formed by injecting the adhesive later is usually referred to as underfill. By forming the underfill, the bonding strength between the semiconductor element and the substrate is increased, and the reliability of the electrical connection portion between the semiconductor element and the electrode on the substrate is increased.

ところで、半導体素子などの電子部品素子の小型化に伴って、隙間が狭くなったり、電極間隔が狭くなり接合後に接着剤を注入し、アンダーフィルを形成することが困難となってきている。またチップの高機能化に伴いチップサイズが大きくなり、後でアンダーフィルを均一に大面積に注入することが困難になってきた。そのため、近年、シート状もしくはペースト状接着剤を半導体素子の一面と基板との間に介在させた状態で、半導体素子を基板側に圧接し、しかる後シート状もしくはペースト状接着剤を硬化させる方法が用いられてきている。このようなシート状もしくはペースト状接着剤を用いた電子部品素子の製造方法は、例えば下記の特許文献１や特許文献２に開示されている。   By the way, with the miniaturization of electronic component elements such as semiconductor elements, it has become difficult to form an underfill by injecting an adhesive after bonding because gaps are narrowed or electrode intervals are narrowed. In addition, as the function of the chip increases, the chip size increases, and it becomes difficult to inject the underfill uniformly over a large area later. Therefore, in recent years, in a state where a sheet-like or paste-like adhesive is interposed between one surface of the semiconductor element and the substrate, the semiconductor element is pressed against the substrate side, and thereafter the sheet-like or paste-like adhesive is cured. Have been used. A method for manufacturing an electronic component element using such a sheet-like or paste-like adhesive is disclosed in, for example, Patent Document 1 and Patent Document 2 below.

図２（ａ）〜（ｃ）は、従来のシート状接着剤を用いた電子部品装置の製造方法を説明するための各部分切欠正面断面図である。   2 (a) to 2 (c) are each a partially cutaway front sectional view for explaining a method of manufacturing an electronic component device using a conventional sheet-like adhesive.

図２（ａ）に示すように、ステージ１０１上に基板１０２を配置する。他方、吸引治具１０４の下面に半導体素子１０５を吸引保持する。吸引治具１０４は、下面１０４ａに開いた吸引孔１０４ｂを有する。吸引孔１０４ｂから吸引することにより、半導体素子１０５が下面１０４ａに保持されている。半導体素子１０５の下面１０５ａは、下方に突出するように金属バンプ１０６，１０７が設けられている。また、半導体素子１０５では、上面１０５ｂ上に、図示しない電極等が形成されている。   As shown in FIG. 2A, the substrate 102 is disposed on the stage 101. On the other hand, the semiconductor element 105 is sucked and held on the lower surface of the suction jig 104. The suction jig 104 has a suction hole 104b opened in the lower surface 104a. The semiconductor element 105 is held on the lower surface 104a by sucking from the suction hole 104b. Metal bumps 106 and 107 are provided on the lower surface 105a of the semiconductor element 105 so as to protrude downward. Further, in the semiconductor element 105, an electrode or the like (not shown) is formed on the upper surface 105b.

図２（ｂ）に示すように、接合に際しては、吸引治具１０４を下方に移動させ、金属バンプ１０６，１０７を基板１０２の上面に圧接させる。この場合、金属バンプ１０６，１０７によりシート状接着剤１０３の一部が押し退けられ、金属バンプ１０６，１０７の先端が、基板１０２上の電極ランド（図示せず）に電気的に接続される。しかる後、加熱または光の照射等によりシート状接着剤１０３が硬化される。このようにして図２（ｃ）に示すように、基板１０２上に、接着剤硬化物１０３Ａにより半導体素子１０５が接着されている半導体装置１０８が得られる。
特開平２−８２６３３号公報 特開２００４−１４０３６６号公報 As shown in FIG. 2B, when joining, the suction jig 104 is moved downward, and the metal bumps 106 and 107 are pressed against the upper surface of the substrate 102. In this case, a part of the sheet adhesive 103 is pushed away by the metal bumps 106 and 107, and the tips of the metal bumps 106 and 107 are electrically connected to electrode lands (not shown) on the substrate 102. Thereafter, the sheet-like adhesive 103 is cured by heating or light irradiation. In this way, as shown in FIG. 2C, the semiconductor device 108 in which the semiconductor element 105 is bonded to the substrate 102 with the cured adhesive 103A is obtained.
Japanese Patent Laid-Open No. 2-82633 JP 2004-140366 A

図２（ｃ）に示すように、上記製造方法では、圧接によりシート状接着剤の一部が横方向に染み出し、半導体素子１０５の側面から上面１０５ｂに至るように回り込むことがあった。他方、半導体素子１０５の上面１０５ｂには、図示しない電極等が配置されており、この電極が接着剤硬化物１０３Ａにより被覆されると、該電極を他の電子部品素子や回路と電気的に接続することができなくなる。   As shown in FIG. 2C, in the above manufacturing method, a part of the sheet-like adhesive oozes out in the lateral direction due to pressure contact, and sometimes wraps around from the side surface of the semiconductor element 105 to the upper surface 105b. On the other hand, an electrode (not shown) or the like is disposed on the upper surface 105b of the semiconductor element 105. When this electrode is covered with the adhesive cured product 103A, the electrode is electrically connected to other electronic component elements and circuits. Can not do.

このような問題を解決するには、半導体素子１０５と基板１０２との間の隙間から接着剤１０３が側方にはみ出さないようにすることが求められる。しかしながら、硬化前には、上記金属バンプ１０６，１０７により、接着剤１０３を確実に押し退け、金属バンプ１０６，１０７の先端を基板１０３上の電極ランドに確実に接触させることが必要である。そのため、硬化前の接着剤１０３はある程度の流動性を有することが求められる。従って、流動性の低すぎる接着剤を用いることはできないので、接着剤１０３の側方へのはみ出しを確実に抑制することは困難であった。   In order to solve such a problem, it is required that the adhesive 103 does not protrude laterally from the gap between the semiconductor element 105 and the substrate 102. However, before curing, it is necessary to reliably push the adhesive 103 away by the metal bumps 106 and 107 so that the tips of the metal bumps 106 and 107 are in contact with the electrode lands on the substrate 103. Therefore, the adhesive 103 before curing is required to have a certain degree of fluidity. Therefore, since it is not possible to use an adhesive having too low fluidity, it has been difficult to reliably prevent the adhesive 103 from protruding to the side.

本発明の目的は、上述した従来技術の現状に鑑み、電子部品素子の一面を電子部品素子が搭載される支持部材または他の電子部品素子に接着するのに好適に用いられ、接着剤の側方へのはみ出しを好適に抑制することができ、余分なはみ出しによる不良品が生じ難い、シート状接着剤、並びに該シート状接着剤を用いた電子部品装置の製造方法及び電子部品装置を提供することにある。   The object of the present invention is preferably used for bonding one surface of an electronic component element to a support member on which the electronic component element is mounted or another electronic component element in view of the current state of the prior art described above. PROBLEM TO BE SOLVED: To provide a sheet-like adhesive, an electronic component device manufacturing method using the sheet-like adhesive, and an electronic component device that can suitably suppress the protrusion to the direction and hardly cause defective products due to excessive protrusion. There is.

本発明に係るシート状接着剤は、熱硬化性樹脂を含むシート状接着剤であって、コーンプレート粘度計を用いて回転数１Ｈｚ及び昇温速度１０℃／分で２５℃から昇温しつつ粘度を測定した場合の最小溶融粘度が４０ＰａＳ〜５１００ＰａＳの範囲にあり、上記最小溶融粘度を示した温度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上であることを特徴とする。   The sheet-like adhesive according to the present invention is a sheet-like adhesive containing a thermosetting resin, and is heated from 25 ° C. at a rotation speed of 1 Hz and a heating rate of 10 ° C./min using a cone plate viscometer. When the viscosity is measured, the minimum melt viscosity is in the range of 40 PaS to 5100 PaS, and the melt viscosity at a temperature of + 50 ° C. indicating the minimum melt viscosity is 0.1 MPaS or more.

本発明に係るシート状接着剤のある特定の局面では、前記シート状接着剤が、熱硬化性樹脂としてのエポキシ樹脂を含み、エポキシ樹脂１００重量部に対し、数平均分子量１０万〜２５万のエポキシ含有ポリマー１０〜５０重量部と、イミダゾール系硬化剤０．５〜３０重量部とを含む。   In a specific aspect of the sheet adhesive according to the present invention, the sheet adhesive includes an epoxy resin as a thermosetting resin, and has a number average molecular weight of 100,000 to 250,000 with respect to 100 parts by weight of the epoxy resin. It contains 10 to 50 parts by weight of an epoxy-containing polymer and 0.5 to 30 parts by weight of an imidazole curing agent.

本発明に係る電子部品装置の製造方法は、本発明に係るシート状接着剤を、電子部品素子の一面と、電子部品素子が搭載される支持部材または他の電子部品素子との間に介在させ、電子部品素子を支持部材または他の電子部品素子と圧接させる工程と、前記シート状接着剤を硬化させる工程とを備えることを特徴とする。   In the method for manufacturing an electronic component device according to the present invention, the sheet-like adhesive according to the present invention is interposed between one surface of the electronic component element and a support member on which the electronic component element is mounted or another electronic component element. And a step of pressing the electronic component element with a support member or another electronic component element, and a step of curing the sheet-like adhesive.

本発明に係る電子部品装置は、本発明のシート状接着剤の硬化物により電子部品素子が支持部材または他の電子部品素子に接合されていることを特徴とする。   The electronic component device according to the present invention is characterized in that the electronic component element is bonded to a support member or another electronic component element by the cured product of the sheet-like adhesive of the present invention.

本発明に係るシート状接着剤は、熱硬化性樹脂を含み、加熱により硬化し、硬化物を与える。そして、該シート状接着剤は、上記の条件で昇温した際の最小溶融粘度が４０〜５１００ＰａＳの範囲にあり、（該最小溶融粘度時の温度＋５０℃）の温度における溶融粘度が０．１ＭＰａＳ以上であるため、被着体間に圧接された状態で加熱された際に、接着剤の側方へのはみ出しが効果的に抑制される。   The sheet-like adhesive according to the present invention contains a thermosetting resin and is cured by heating to give a cured product. The sheet-like adhesive has a minimum melt viscosity in the range of 40 to 5100 PaS when the temperature is raised under the above conditions, and a melt viscosity at a temperature of (temperature at the minimum melt viscosity + 50 ° C.) is 0.1 MPaS. Since it is above, when it heats in the state press-contacted between to-be-adhered bodies, the protrusion to the side of an adhesive agent is suppressed effectively.

例えば、電子部品素子の一面を、電子部品素子が搭載される支持部材または他の電子部品素子に上記シート状接着剤を介して圧接し、加熱により硬化させる場合、上記シート状接着剤の最小溶融粘度が４０ＰａＳ以上であるため、２５℃から昇温する過程において電子部品素子の一面と、支持部材または他の電子部品素子との間の隙間から側方にシート状接着剤がはみ出し難い。また、上記最小溶融粘度が５１００ＰａＳ未満であるため、上記電子部品素子の一面と、支持部材または他の電子部品素子との間の隙間に充填され得るに必要な流動性を有する。従って、上記隙間が、シート状接着剤により確実に充填され、電子部品素子と、上記支持部材または他の電子部品素子とを良好に接合することができる。   For example, when one surface of an electronic component element is pressed into contact with a support member or other electronic component element on which the electronic component element is mounted via the sheet-like adhesive and cured by heating, the minimum melting of the sheet-like adhesive is performed. Since the viscosity is 40 PaS or more, the sheet-like adhesive hardly protrudes laterally from the gap between one surface of the electronic component element and the support member or another electronic component element in the process of raising the temperature from 25 ° C. In addition, since the minimum melt viscosity is less than 5100 PaS, it has fluidity necessary to be able to fill a gap between one surface of the electronic component element and the support member or another electronic component element. Therefore, the said clearance gap is reliably filled with a sheet-like adhesive agent, and an electronic component element and the said supporting member or another electronic component element can be favorably joined.

加えて、（上記最小溶融粘度を示す温度＋５０℃）の温度における溶融粘度が０．１ＭＰａＳ以上とされているため、加熱に際し、熱硬化させようとした場合、初期にはシート状接着剤が流動化し、被着体間の隙間に確実に充填される。よって、被着体同士を確実に接合することが可能となる。   In addition, since the melt viscosity at a temperature of (the temperature indicating the minimum melt viscosity + 50 ° C.) is set to 0.1 MPaS or more, the sheet-like adhesive is initially flowed when it is attempted to be thermally cured upon heating. And the gaps between the adherends are reliably filled. Therefore, it becomes possible to join adherends reliably.

本発明において、熱硬化性樹脂としてエポキシ樹脂が含有されており、該エポキシ樹脂１００重量部に対し、数平均分子量１０万〜２５万のエポキシ含有ポリマーを１０〜５０重量部及びイミダゾール系硬化剤を０．５〜３０重量部含むシート状接着剤では、上記２５℃から昇温した際の最小溶融粘度を上記特定の範囲とし、かつ最小溶融粘度を示す温度＋５０℃の温度における溶融粘度を０．１ＭＰａＳ以上とすることができ、しかも、硬化後の接合強度を効果的に高めることが可能となる。   In the present invention, an epoxy resin is contained as a thermosetting resin, and 10 to 50 parts by weight of an epoxy-containing polymer having a number average molecular weight of 100,000 to 250,000 is added to 100 parts by weight of the epoxy resin and an imidazole curing agent. In the sheet-like adhesive containing 0.5 to 30 parts by weight, the minimum melt viscosity when the temperature is raised from 25 ° C. is within the specific range, and the melt viscosity at a temperature of 50 ° C. at the temperature showing the minimum melt viscosity is 0.00. It can be set to 1 MPaS or more, and the bonding strength after curing can be effectively increased.

本発明に係る電子部品装置の製造方法では、本発明のシート状接着剤を、電子部品素子の一面と、支持部材または他の電子部品素子との間に介在させ、電子部品素子を支持部材または他の電子部品素子に圧接させた後に、該シート状接着剤を硬化させている。従って、上記シート状接着剤が２５℃から昇温した際の最小溶融粘度は上記特定の範囲にあり、かつ最小溶融粘度を示す温度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上とされているため、本発明に従って電子部品素子の一面と、支持部材または他の電子部品素子との間の空間から側方への接着剤のはみ出しを効果的に抑制することができると共に、電子部品素子と支持部材または他の電子部品素子とを強固にかつ確実に接合することが可能となる。   In the method of manufacturing an electronic component device according to the present invention, the sheet-like adhesive of the present invention is interposed between one surface of the electronic component element and a support member or another electronic component element, and the electronic component element is supported by the support member or After being brought into pressure contact with other electronic component elements, the sheet adhesive is cured. Therefore, the minimum melt viscosity when the temperature of the sheet-like adhesive is raised from 25 ° C. is in the specific range, and the melt viscosity at the temperature of the minimum melt viscosity + 50 ° C. is 0.1 MPaS or more. Therefore, according to the present invention, it is possible to effectively prevent the adhesive from protruding laterally from the space between one surface of the electronic component element and the support member or other electronic component element, and to support the electronic component element and the support. A member or another electronic component element can be firmly and reliably joined.

本発明に係る電子部品装置では、本発明のシート状接着剤の硬化物により電子部品素子が支持部材または他の電子部品素子に接合されているので、電子部品素子と、支持部材または他の電子部品素子との間の隙間から側方への接着剤のはみ出しが生じ難い。従って、電子部品素子を外部と電気的に接続するための電極等が接着剤により覆われ難いので、他の電子部品素子や回路の電気的接続不良が生じ難い。   In the electronic component device according to the present invention, since the electronic component element is joined to the support member or other electronic component element by the cured product of the sheet-like adhesive of the present invention, the electronic component element and the support member or other electronic It is difficult for the adhesive to protrude laterally from the gap between the component elements. Accordingly, since the electrodes for electrically connecting the electronic component elements to the outside are not easily covered with the adhesive, poor electrical connection between other electronic component elements and circuits is unlikely to occur.

本発明に係るシート状接着剤の用途は特に限定されるわけではないが、例えば、電子部品素子の一面を電子部品素子が搭載される支持部材または他の電子部品素子にシート状接着剤を介して圧接し、接着する用途に好適に用いられる。このような用途では、電子部品素子を、支持部材または他の電子部品素子と確実に接合することが可能であると共に、接着剤が隙間から側方へはみ出さないことが強く求められる。すなわち、電子部品素子と支持部材または他の電子部品素子との隙間から側方に余分な接着剤がはみ出し、硬化すると、はみ出した接着剤硬化物が電子部品素子や他の電子部品素子上の電極等を被覆し、電気的接続不良が生じたりするおそれがある。   The use of the sheet-like adhesive according to the present invention is not particularly limited. For example, one surface of the electronic component element is interposed between the supporting member on which the electronic component element is mounted or another electronic component element via the sheet-like adhesive. It is used suitably for the use which presses and adheres. In such an application, it is strongly required that the electronic component element can be reliably bonded to the support member or another electronic component element, and that the adhesive does not protrude laterally from the gap. That is, when the excess adhesive protrudes from the gap between the electronic component element and the support member or another electronic component element and cures, the cured adhesive product that protrudes becomes an electrode on the electronic component element or other electronic component element. There is a risk that poor electrical connection may occur.

本発明に係るシート状接着剤では、このような側方へのはみ出しが効果的に抑制され、例えば電子部品素子と、上記支持部材または他の電子部品素子との接合を確実に行うことができると共に、所望でない側方への接着剤のはみ出しによる電気的接続不良も引き起こし難い。   In the sheet-like adhesive according to the present invention, such lateral protrusion is effectively suppressed, and for example, the electronic component element can be reliably bonded to the support member or other electronic component element. At the same time, it is difficult to cause an electrical connection failure due to the protrusion of the adhesive to the side that is not desired.

以下、本発明のシート状接着剤の詳細を説明する。   Hereinafter, details of the sheet-like adhesive of the present invention will be described.

本発明のシート状接着剤は、熱硬化性樹脂を含み、加熱により硬化する硬化性の接着剤である。そして、常温、すなわち、２５℃ではシート状の形状を有し、加熱により流動性を増し、最終的に硬化し、被着体同士を接合する。   The sheet-like adhesive of the present invention is a curable adhesive that contains a thermosetting resin and is cured by heating. And it has a sheet-like shape at normal temperature, that is, 25 ° C., increases fluidity by heating, finally cures, and adherends are joined together.

上記シート状接着剤では、コーンプレート粘度計を用いて１Ｈｚ及び昇温速度１０℃／分の条件で２５℃から昇温した際の最小溶融粘度が４０ＰａＳ〜５１００ＰａＳの範囲にあり、上記最小溶融粘度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上である。   In the sheet-like adhesive, the minimum melt viscosity when the temperature is raised from 25 ° C. using a cone plate viscometer at 1 Hz and a temperature increase rate of 10 ° C./min is in the range of 40 PaS to 5100 PaS. The melt viscosity at a temperature of + 50 ° C. is 0.1 MPaS or more.

上記のように、２５℃から昇温した場合に、シート状接着剤は流動化する。そのため、被着体間の隙間にむらなく充填される。この場合、最小溶融粘度が４０ＰａＳよりも低いと、流動性が高くなりすぎ、隙間から側方へのはみ出しが生じることとなる。従って、最小溶融粘度は、４０ＰａＳ以上であることが必要である。また、上記最小溶融粘度が高すぎると、加熱により流動性を示した段階において、粘度が低くならず、上記隙間を確実に充填することができなくなる。従って、最小溶融粘度は５１００ＰａＳ以下であることが必要である。より好ましくは、上記最小溶融粘度は、４０〜１００ＰａＳの範囲とされる。   As described above, when the temperature is raised from 25 ° C., the sheet adhesive is fluidized. Therefore, the gaps between the adherends are uniformly filled. In this case, when the minimum melt viscosity is lower than 40 PaS, the fluidity becomes too high, and the protrusion from the gap to the side occurs. Therefore, the minimum melt viscosity needs to be 40 PaS or more. On the other hand, if the minimum melt viscosity is too high, the viscosity does not decrease when the fluidity is exhibited by heating, and the gap cannot be reliably filled. Therefore, the minimum melt viscosity needs to be 5100 PaS or less. More preferably, the minimum melt viscosity is in the range of 40 to 100 PaS.

上記最小溶融粘度を示す温度については、２５℃以上であれば特に限定されないが、熱硬化性のシート状接着剤であるため、加熱により硬化する温度よりも低い温度で、最小溶融粘度を示すこととなる。   The temperature indicating the minimum melt viscosity is not particularly limited as long as it is 25 ° C. or higher. It becomes.

また、本発明に係るシート状接着剤では、最小溶融粘度を示した温度＋５０℃の温度における溶融粘度は、０．１ＭＰａＳ以上であることが必要である。すなわち、上記最小溶融粘度を示した温度においては十分な流動性を示し、隙間にむらなく充填される。そして、さらに加熱された場合、熱硬化反応によりシート状接着剤が硬化し、硬化物を与える。この場合、硬化過程において最小溶融粘度を示した温度＋５０℃の温度における溶融粘度は０．１ＭＰａＳ以上であることが必要であり、それによって、シート状接着剤が充填される隙間において、十分に接着剤が広がった状態で硬化されることとなる。０．１ＭＰａＳ未満の場合には、接合すべき領域に十分に接着剤が濡れ広がらなくなる。好ましくは、最小溶融粘度を示す温度＋５０℃の温度における溶融粘度は、０．０１ＭＰａＳ以上とされる。   Further, in the sheet-like adhesive according to the present invention, the melt viscosity at the temperature of the minimum melt viscosity + 50 ° C. needs to be 0.1 MPaS or more. That is, at the temperature showing the minimum melt viscosity, sufficient fluidity is exhibited and the gaps are filled evenly. And when it heats further, a sheet-like adhesive will harden | cure by thermosetting reaction and give hardened | cured material. In this case, it is necessary that the melt viscosity at the temperature of the minimum melt viscosity in the curing process + 50 ° C. is 0.1 MPaS or more, and thus the adhesive is sufficiently bonded in the gap filled with the sheet adhesive. It will be hardened with the agent spread. If the pressure is less than 0.1 MPaS, the adhesive will not be sufficiently wetted and spread in the areas to be joined. Preferably, the melt viscosity at the temperature of the minimum melt viscosity + 50 ° C. is 0.01 MPaS or more.

なお、最小溶融粘度を示す温度＋５０℃の温度における溶融粘度の上限値については、特に限定されない。すなわち、この温度において硬化が完全に進行した場合、硬化物となり、溶融粘度をもはや測定することができない固形物となるからである。   The upper limit value of the melt viscosity at the temperature showing the minimum melt viscosity + 50 ° C. is not particularly limited. That is, if curing proceeds completely at this temperature, it becomes a cured product and a solid material whose melt viscosity can no longer be measured.

本発明に係るシート状接着剤は、上記最小溶融粘度範囲及び最小溶融粘度を示す温度＋５０℃の温度における上記溶融粘度を満たす限り、その組成については特に限定されない。すなわち、様々な熱硬化性の接着剤組成物により、本発明のシート状接着剤を構成することができる。従って、熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂、ユリア樹脂などの適宜の熱硬化性樹脂を用いることができる。   The composition of the sheet adhesive according to the present invention is not particularly limited as long as it satisfies the melt viscosity at a temperature of the minimum melt viscosity range and the minimum melt viscosity + 50 ° C. That is, the sheet-like adhesive of the present invention can be constituted by various thermosetting adhesive compositions. Accordingly, an appropriate thermosetting resin such as an epoxy resin, a phenol resin, or a urea resin can be used as the thermosetting resin.

好ましくは、熱硬化性樹脂としてエポキシ樹脂が用いられる。この場合には、硬化物の機械的強度が高いので、被着体同士を強固に接合することができる。   Preferably, an epoxy resin is used as the thermosetting resin. In this case, since the mechanical strength of the cured product is high, the adherends can be firmly bonded to each other.

使用し得るエポキシ樹脂としては特に限定されず、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂等のビスフェノール型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂等のノボラック型エポキシ樹脂、トリスフェノールメタントリグリシジルエーテル等のような芳香族エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、並びにこれらの水添化物、上記各種エポキシ基含有化合物にＮＢＲ、ＣＴＢＮ、ポリブタジエン、アクリルゴム等のゴム成分を含有させたゴム変成エポキシ樹脂；等、従来公知の各種エポキシ基含有化合物が挙げられる。   Epoxy resins that can be used are not particularly limited. For example, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, bisphenol S type epoxy resins and other bisphenol type epoxy resins, phenol novolac type epoxy resins, Novolak-type epoxy resins such as cresol novolak-type epoxy resins, aromatic epoxy resins such as trisphenolmethane triglycidyl ether, naphthalene-type epoxy resins, dicyclopentadiene-type epoxy resins, and their hydrogenated products, the above various epoxy groups Various conventionally known epoxy group-containing compounds such as a rubber-modified epoxy resin in which a rubber component such as NBR, CTBN, polybutadiene, or acrylic rubber is contained in the containing compound;

上記エポキシ樹脂は、単独で用いられても良いし、２種類以上が併用されても良い。   The said epoxy resin may be used independently and 2 or more types may be used together.

上記エポキシ樹脂系のシート状接着剤は、好ましくは、エポキシ樹脂とエポキシ樹脂硬化剤と、エポキシ含有ポリマーを含む。   The epoxy resin-based sheet-like adhesive preferably includes an epoxy resin, an epoxy resin curing agent, and an epoxy-containing polymer.

エポキシ樹脂硬化剤についても特に限定されず、従来より周知のフェノール系硬化剤、酸無水物系硬化剤、潜在性硬化剤（ジシアンジアミド等）、ジアミン系硬化剤、イミダゾール系、ホスフィン系などを用いることができる。   The epoxy resin curing agent is not particularly limited, and a conventionally known phenolic curing agent, acid anhydride curing agent, latent curing agent (such as dicyandiamide), diamine curing agent, imidazole, phosphine, or the like is used. Can do.

また、上記エポキシ樹脂含有ポリマーとしては、特に限定されず、エポキシ基を有するアクリルポリマー、エポキシ含有ブタジエンゴム、ビスフェノール型高分子エポキシ樹脂、エポキシ含有フェノキシ樹脂、エポキシ含有ウレタン樹脂、エポキシ含有ポリエステル樹脂などを挙げることができる。   The epoxy resin-containing polymer is not particularly limited, and includes an acrylic polymer having an epoxy group, an epoxy-containing butadiene rubber, a bisphenol-type polymer epoxy resin, an epoxy-containing phenoxy resin, an epoxy-containing urethane resin, an epoxy-containing polyester resin, and the like. Can be mentioned.

前記エポキシ基含有ポリマーは、発明に係るシート状接着剤の溶融粘度を調整するために配合されている。すなわち、上記エポキシ基含有ポリマーを適宜配合することにより、シート状接着剤の硬化物性にさほど影響を与えることなく、上記最小溶融粘度を上記特定の範囲と補正することが容易となる。   The epoxy group-containing polymer is blended in order to adjust the melt viscosity of the sheet adhesive according to the invention. That is, by appropriately blending the epoxy group-containing polymer, the minimum melt viscosity can be easily corrected to the specific range without significantly affecting the cured physical properties of the sheet adhesive.

また、エポキシ基含有ポリマーは、官能基としてエポキシ基（グリシジル基）を有するので、シート状接着剤の加熱硬化に際し、エポキシ樹脂と同様に加熱により硬化反応に寄与し、強固な硬化物を与える。加えて、エポキシ樹脂と同様にエポキシ基を有するため、シート状接着剤中に含有されたとしても、貯蔵安定性を損ない難い。   In addition, since the epoxy group-containing polymer has an epoxy group (glycidyl group) as a functional group, it contributes to a curing reaction by heating in the same manner as an epoxy resin when a sheet-like adhesive is heated and cured, and gives a strong cured product. In addition, since it has an epoxy group like the epoxy resin, even if it is contained in the sheet-like adhesive, it is difficult to impair the storage stability.

上記エポキシ基含有ポリマーの分子量は、好ましくは数平均分子量で１０万〜２５万の範囲である。また、エポキシ樹脂１００重量部に対し、数平均分子量１０万〜２５万のエポキシ含有ポリマーは、好ましくは、１０〜５０重量部、より好ましくは１５〜３０部の割合で配合されることが望ましい。これは、アクリルポリマーが５０重量部を超えると、流動性が低下するからである。また１０重量部未満になると、流動が激しくシート製作が困難になったり、チップ端部からのはみ出た樹脂がきれいなフィレットを形成し難くなり、下層の他の電子部品素子や上層の他の電子部品素子へ薄く塗れ拡がったりする。   The molecular weight of the epoxy group-containing polymer is preferably in the range of 100,000 to 250,000 in number average molecular weight. The epoxy-containing polymer having a number average molecular weight of 100,000 to 250,000 is preferably 10 to 50 parts by weight, more preferably 15 to 30 parts, based on 100 parts by weight of the epoxy resin. This is because if the acrylic polymer exceeds 50 parts by weight, the fluidity decreases. On the other hand, if the amount is less than 10 parts by weight, it is difficult to produce a sheet due to the strong flow, or the resin protruding from the end of the chip is difficult to form a clean fillet. It spreads thinly on the element.

数分子量が２５万を超えると、流動性が低下するだけでなく、接続語の信頼性が低下することがある。数分子量が１０万未満では、流動が激しくシート製作が困難になり、また、チップ端部からのはみ出た樹脂がきれいなフィレットを形成し難くなり、下層の他の電子部品素子や上層の他の電子部品素子へ薄く塗れ拡がったりする。   When the number molecular weight exceeds 250,000, not only the fluidity is lowered, but the reliability of the connected word may be lowered. If the number molecular weight is less than 100,000, the flow is so strong that it is difficult to produce a sheet, and the resin protruding from the end of the chip is difficult to form a clean fillet, and other electronic component elements in the lower layer and other electrons in the upper layer It spreads thinly on the component elements.

また、発明に係るシート状接着剤では、詳しくは、上記硬化剤としてイミダゾール系硬化剤が用いられる。該イミダゾール系硬化剤は、エポキシ樹脂１００重量部に対し、好ましくは、０．５〜３０重量部の割合で配合される。０．５重量部未満では、硬化が十分に促進されないことがあり、３０重量部を超えると、促進作用は飽和し、硬化物の物性が損なわれることがある。   In the sheet adhesive according to the invention, specifically, an imidazole curing agent is used as the curing agent. The imidazole curing agent is preferably blended at a ratio of 0.5 to 30 parts by weight with respect to 100 parts by weight of the epoxy resin. If the amount is less than 0.5 part by weight, curing may not be sufficiently promoted. If the amount exceeds 30 parts by weight, the accelerating action may be saturated and the physical properties of the cured product may be impaired.

従って、本発明においては、より好ましくは、上記シート状接着剤は、エポキシ樹脂１００重量部に対し、分子量１０万〜２５万の上記エポキシ含有ポリマー１０〜５０重量部とイミダゾール系硬化剤０．５〜３０重量部とを含む組成を有する。   Therefore, in the present invention, more preferably, the sheet-like adhesive is 10 to 50 parts by weight of the epoxy-containing polymer having a molecular weight of 100,000 to 250,000 and 0.5 to imidazole curing agent with respect to 100 parts by weight of the epoxy resin. And a composition containing -30 parts by weight.

本発明に係るシート状接着剤では、仕様に応じて、さらに、硬化促進剤、シランカップリング剤などの他の添加剤が添加されてもよい。   In the sheet-like adhesive according to the present invention, other additives such as a curing accelerator and a silane coupling agent may be further added according to specifications.

必要に応じて添加される硬化促進剤についても、従来より公知のエポキシ樹脂系接着剤において用いられる２−メチルイミダゾール、２−エチルイミダゾール、２−ウンデシルイミダゾール、２，４-ジメチルイミダゾール、２−へプタデシルイミダゾール、１，２-ジメチルイミダゾール、１，２-ジエチルイミダゾール、２−フェニル−４−メチルイミダゾール、２，４，５−トリフェニルイミダゾール、２−エチル−４−メチルイミダゾール、２−フェニルイミダゾール、１−ベンジル−２−フェニルイミダゾール、１−シアノエチル−２−メチルイミダゾール、１−シアノエチル−２−ウンデシルイミダゾール、１−ベンジル−２−メチルイミダゾール、２−フェニル−４，５−ジヒドロキシメチルイミダゾール、２−アリール−４，５−ジフェニルイミダゾール、２，４−ジアミノ−６−［２'−メチルイミダゾリル−（１）'］−エチル−Ｓ−トリアジン、２，４−ジアミノ−６−［２'−エチル−４'−メチルイミダゾリル−（１）'］−エチル−Ｓ−トリアジン、２，４−ジアミノ−６−［２'−メチルイミダゾリル−（１）'］−エチル−Ｓ−トリアジンイソシアヌール酸付加物、２−フェニル−４−メチル−５−ヒドロキシメチルイミダゾールなどの硬化促進剤を用いることができる。   As for the curing accelerator added as needed, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2,4-dimethylimidazole, 2- Heptadecylimidazole, 1,2-dimethylimidazole, 1,2-diethylimidazole, 2-phenyl-4-methylimidazole, 2,4,5-triphenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl Imidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole 2-aryl-4,5 Diphenylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1) ']-ethyl-S-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1) ']-ethyl-S-triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1)']-ethyl-S-triazine isocyanuric acid adduct, 2-phenyl-4- A curing accelerator such as methyl-5-hydroxymethylimidazole can be used.

また、前記シランカップリング剤としても特に限定されず、適宜のシランカップリング剤を用いることができる。シランカップリング剤を配合することにより、シリコンチップや基板の接着性をより一層高めることができ、望ましい。   Further, the silane coupling agent is not particularly limited, and an appropriate silane coupling agent can be used. By blending a silane coupling agent, the adhesiveness of the silicon chip and the substrate can be further enhanced, which is desirable.

本発明に係るシート状接着剤では、上記のように、コーンプレート粘度計を用いて回転数１Ｈｚ、昇温速度１０℃で２５℃以上から２００℃程度まで昇温した場合の最小溶融粘度が、４０〜５１００ＰａＳ、上記最小溶融粘度を示した温度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上である条件を満たしているため、硬化前にはある程度の柔軟性を有し、被着体同士をシート状接着剤を介して圧接させた際に、シート状接着剤が被着体の接合面に無理なく追随する。加えて、加熱により初期段階では流動性が高くなり、最小溶融粘度が上記特定の範囲とされていることにより上記隙間に無理なく充填され、しかも隙間から側方へのはみ出しは生じ難い。そして、さらに加熱を進めることにより、被着体同士が強固に接合される。   In the sheet-like adhesive according to the present invention, as described above, the minimum melt viscosity when the temperature is increased from 25 ° C. to about 200 ° C. at a rotation speed of 1 Hz and a temperature increase rate of 10 ° C. using a cone plate viscometer, 40-5100 PaS, the temperature showing the above-mentioned minimum melt viscosity + 50 ° C. The melt viscosity at the temperature of 0.1 MPaS or more is satisfied, so that it has some flexibility before curing, When press-contacting via a sheet-like adhesive, the sheet-like adhesive follows the bonding surface of the adherend without difficulty. In addition, the fluidity is increased in the initial stage by heating, and the minimum melt viscosity is within the specific range, so that the gap is easily filled, and the protrusion from the gap hardly occurs sideways. Further, the adherends are firmly bonded to each other by further heating.

従って、電子部品素子と、支持部材または他の電子部品素子との接合に用いた場合には、上記隙間の側方への接着剤へのはみ出しが生じ難いので、電子部品素子あるいは上記支持部材または他の電子部品素子の外表面の電極等が接着剤により被覆され難い。従って、電気的接続不良を確実に防止することができる。これを、本発明の実施形態を参照して、より具体的に説明する。   Therefore, when used for joining the electronic component element and the support member or another electronic component element, it is difficult for the adhesive to protrude to the side of the gap, so the electronic component element or the support member or The electrodes on the outer surface of other electronic component elements are not easily covered with an adhesive. Therefore, electrical connection failure can be reliably prevented. This will be described more specifically with reference to an embodiment of the present invention.

本実施形態では、図１に示すように、シート状接着剤１は、図示しない半導体素子の矩形の底辺の４辺近傍に配置された外部電極に該当する位置を除くように、矩形形状から台形の切欠を１ａ〜１ｄを形成した形状を有する。この場合、シート状接着剤１の面積Ｓは、台形状の切欠が形成されている分だけ、切欠１ｃ，１ｄが設けられていない場合の仮想電子部品素子の面積に比べ、その面積が小さくされている。そして、この面積Ｓとシート厚みＨで形成される体積は、隙間体積Ｖの０．９Ｖ〜１．１Ｖの範囲であればよい。   In this embodiment, as shown in FIG. 1, the sheet-like adhesive 1 is trapezoidal from a rectangular shape so as to exclude positions corresponding to external electrodes arranged in the vicinity of four sides of a rectangular base of a semiconductor element (not shown). The cutouts 1a to 1d are formed. In this case, the area S of the sheet-like adhesive 1 is made smaller than the area of the virtual electronic component element when the notches 1c and 1d are not provided by the amount of the trapezoidal notch. ing. And the volume formed with this area S and sheet | seat thickness H should just be the range of 0.9V-1.1V of the clearance volume V. FIG.

本実施形態では、切欠１ａ〜１ｄは、台形形状としているが、使用する半導体素子電極位置によって任意に設定することが可能である。図示しないが、半導体素子は、フェースダウン工法で基板上に圧接される。半導体素子の下面には、下方に突出している複数の金属バンプが設けられている。また、半導体素子は、上面側から吸引治具に保持される。吸引治具は、下面に開いた複数の吸引孔を有する。吸引孔から吸引することによって、半導体素子が下面に保持される。   In the present embodiment, the notches 1a to 1d are trapezoidal, but can be arbitrarily set depending on the position of the semiconductor element electrode to be used. Although not shown, the semiconductor element is pressed onto the substrate by a face-down method. A plurality of metal bumps projecting downward are provided on the lower surface of the semiconductor element. The semiconductor element is held by the suction jig from the upper surface side. The suction jig has a plurality of suction holes opened on the lower surface. The semiconductor element is held on the lower surface by suction from the suction hole.

接合に際しては、吸引治具により保持された半導体素子を下面側からシート状接着剤１上に圧接する。その結果、金属バンプが硬化前のシート状接着剤１を押し退け、金属バンプの先端が基板の上面の電極ランドに当接され、電気的接続が果たされる。しかる後、加熱または光の照射等によりシート状接着剤１が硬化される。その結果、金属バンプが基板の上面に接着された状態で、半導体素子が基板上に確実に接着剤硬化物により接合される。   At the time of joining, the semiconductor element held by the suction jig is pressed onto the sheet adhesive 1 from the lower surface side. As a result, the metal bumps push away the sheet-like adhesive 1 before being cured, and the tips of the metal bumps are brought into contact with the electrode lands on the upper surface of the substrate to achieve electrical connection. Thereafter, the sheet adhesive 1 is cured by heating or light irradiation. As a result, in a state where the metal bumps are bonded to the upper surface of the substrate, the semiconductor element is securely bonded to the substrate with the cured adhesive.

この場合、上記シート状接着剤１の硬化前の面積Ｓが上記のように選ばれ、官能基含有アクリルポリマーを含み粘度を制御することで、接着剤の側方へのはみ出しが生じ難く、特に硬化物の半導体素子の上面への回り込みを確実に抑制することができる。よって、半導体素子の上面上に、外部と電気的接続を行うための電極等が形成されていたとしても、該電極等が接着剤硬化物により被覆され難い。   In this case, the area S before curing of the sheet-like adhesive 1 is selected as described above, and by controlling the viscosity including the functional group-containing acrylic polymer, it is difficult for the adhesive to protrude laterally. It is possible to reliably suppress the wraparound of the cured product to the upper surface of the semiconductor element. Therefore, even if an electrode or the like for electrical connection with the outside is formed on the upper surface of the semiconductor element, the electrode or the like is hardly covered with the cured adhesive.

上記実施形態では、シート状接着剤１を用いたが、予めシート状にされている必要はなく、支持部材または他の電子部品素子に接着剤を塗布することにより設けられたペースト状接着剤もしくはＢステージ化されたペースト状接着剤であってもよい。もっとも、その場合においても、硬化前には、上記粘度が本発明の範囲にあり保形性を有することが必要であり、すなわち面積Ｓが上記範囲となるようにその形状が保たれるペースト状接着剤であることが必要である。   In the above embodiment, the sheet-like adhesive 1 is used. However, the sheet-like adhesive 1 does not have to be preliminarily formed into a sheet, and a paste-like adhesive provided by applying an adhesive to a support member or another electronic component element or It may be a B-stage paste adhesive. However, even in such a case, before curing, the viscosity is in the range of the present invention and it is necessary to have shape retention, that is, a paste shape in which the shape is maintained so that the area S is in the above range. It must be an adhesive.

また、上記実施形態では、底辺の４辺近傍にペリフェラル状に配置された外部電極を有する半導体素子を用いたため、シート状接着剤１は、電極該当位置を除くように矩形から台形の切欠１ａ〜１ｄを入れた形状とされていたが、本発明においては、シート状接着剤の平面形状は特に限定されない。すなわち、上記シート状接着剤は、長方形や正方形のような四角形の平面形状を有するものに限らず、三角形や五角形の平面形状を有するものであってもよい。   Moreover, in the said embodiment, since the semiconductor element which has the external electrode arrange | positioned in the periphery shape in the 4 side vicinity of the base was used, the sheet-like adhesive 1 is rectangular to trapezoidal notch 1a ~ so that an electrode applicable position may be excluded. Although it was set as the shape which put 1d, in this invention, the planar shape of a sheet-like adhesive agent is not specifically limited. That is, the sheet-like adhesive is not limited to a rectangular planar shape such as a rectangle or a square, and may have a triangular or pentagonal planar shape.

また、電極がチップ中央などにある場合はその部分を孔として切り抜いてもよい。   If the electrode is in the center of the chip or the like, that portion may be cut out as a hole.

なお、切欠は、コーナー部分を除いた辺の部分に切欠を設けることが、望ましい。これは、コーナー部分を除いた辺の部分が圧接に際し最も側方にはみ出し易い部分であるためである。従って、好ましくは、切欠は、辺の中央部分に設けられることが望ましい。   In addition, it is desirable to provide a notch in the side part except a corner part. This is because the side portion excluding the corner portion is the portion that most easily protrudes to the side during the press contact. Therefore, it is preferable that the notch is provided in the central portion of the side.

また、上記切欠の形状は、特に限定されず、台形に限定されず、円弧と弦とで囲まれた形状の逆ポアソンの組み合わせ、四角形や三角形等の直線を組み合わせてなる形状の切欠が設けられてもよい。   In addition, the shape of the notch is not particularly limited and is not limited to a trapezoid, but is provided with a combination of reverse Poisson in a shape surrounded by an arc and a string, and a notch having a shape formed by combining straight lines such as a rectangle and a triangle. May be.

上記実施形態の半導体装置の製造方法では、電子部品素子として半導体素子が用いられたが、本発明は、半導体素子以外の電子部品素子の製造方法にも用いることができ、それによって様々な電子部品装置を本発明により製造することができる。   In the method for manufacturing a semiconductor device of the above embodiment, a semiconductor element is used as an electronic component element. However, the present invention can also be used in a method for manufacturing an electronic component element other than a semiconductor element, thereby various electronic components. A device can be manufactured according to the invention.

また、支持部材に代えて他の電子部品素子に電子部品素子がシート状接着剤により接合される用途にも本発明を適用することができる。   Further, the present invention can be applied to an application in which an electronic component element is bonded to another electronic component element with a sheet-like adhesive instead of the support member.

次に、具体的な実施例及び比較例を挙げることにより、本発明をより明らかにする。   Next, the present invention will be further clarified by giving specific examples and comparative examples.

（実施例１）
半導体素子として、下面の寸法が１５ｍｍ×８ｍｍの長方形であり、厚みが０．１ｍｍの半導体素子を用意した。この半導体素子の下面から、複数の金属バンプが突出高さ０．０２５ｍｍ、径０．０８０ｍｍとなるように設けられている。 Example 1
As a semiconductor element, a semiconductor element having a rectangular shape with a bottom surface dimension of 15 mm × 8 mm and a thickness of 0.1 mm was prepared. From the lower surface of the semiconductor element, a plurality of metal bumps are provided with a protruding height of 0.025 mm and a diameter of 0.080 mm.

他方、半導体素子が搭載される基板として、すなわち、支持部材としてガラス基板を別途用意した。また、下記の表１に示すように、固形のジシクロペンタジエン型エポキシ樹脂（大日本インキ化学工業社製、品番：ＨＰ７２００ＨＨ）４５重量部と、液状のナフタレン型エポキシ樹脂（大日本インキ化学工業社製、品番：ＨＰ４０３２Ｄ）２５重量部と、エポキシ基含有ポリマー（日本油脂社製、品番：Ｇ２０５０Ｍ、数平均分子量＝２０万）３０重量部と、イミダゾール系硬化剤（ジャパンエポキシレジン社製、品番：ＹＨ−３０７）４０重量部と、硬化促進剤としてのイソシアヌル変性固体分散型イミダゾール（四国化成社製、品番：２ＭＡＯＫ）０．３重量部と、シランカップリング剤（チッソ社製、品番：Ｓ３２０）２重量部と、ゴム粒子（アクリル系ゴム粒子、ガンツ化成社製、品番：ＡＣ４０３０）５重量部と、ヒュームドシリカ（トクヤマ社製、品番：ＭＴ１０）４重量部とを混練してなるエポキシ接着剤組成物からなり、その寸法のシート状接着剤を用意した。   On the other hand, a glass substrate was separately prepared as a substrate on which the semiconductor element is mounted, that is, as a support member. In addition, as shown in Table 1 below, 45 parts by weight of a solid dicyclopentadiene type epoxy resin (manufactured by Dainippon Ink and Chemicals, product number: HP7200HH) and a liquid naphthalene type epoxy resin (Dainippon Ink and Chemicals, Inc.) Manufactured, product number: HP4032D) 25 parts by weight, epoxy group-containing polymer (manufactured by NOF Corporation, product number: G2050M, number average molecular weight = 200,000), and imidazole-based curing agent (manufactured by Japan Epoxy Resin Co., product number: YH-307) 40 parts by weight, 0.3 part by weight of isocyanur-modified solid dispersion type imidazole (manufactured by Shikoku Kasei Co., Ltd., product number: 2MAOK) as a curing accelerator, and silane coupling agent (manufactured by Chisso Corp., product number: S320) 2 parts by weight, 5 parts by weight of rubber particles (acrylic rubber particles, manufactured by Ganz Kasei Co., Ltd., product number: AC4030), and fumed Ca (manufactured by Tokuyama Corp., product number: MT 10) 4 consists parts and made by kneading an epoxy adhesive composition was prepared a sheet-like adhesive of the dimensions.

上記シート状接着剤は、コーンプレート粘度測定において回転数１Ｈｚ、昇温速度１０℃／分の条件で２５℃から２００℃まで昇温した際の溶融粘度は、最小溶融粘度は、１７０℃の温度で１２０ＰａＳであり、かつ該最小溶融粘度を示した温度である１７０℃＋５０℃＝２２０℃における溶融粘度は０．２３ＭＰａＳであった。   The above-mentioned sheet-like adhesive has a minimum melt viscosity of 170 ° C. when the temperature is raised from 25 ° C. to 200 ° C. at a rotation speed of 1 Hz and a heating rate of 10 ° C./min in cone plate viscosity measurement. The melt viscosity at 170 ° C. + 50 ° C. = 220 ° C., which is the temperature showing the minimum melt viscosity, was 0.23 MPaS.

上記エポキシ樹脂系のシート状接着剤１を上記ガラス基板上に配置し、トムソン刃により、半導体素子の長辺に対応する辺には、下底寸法が１３ｍｍ、上底寸法が１０ｍｍ、高さが１．０ｍｍの台形の切欠１ａ，１ｂを、半導体素子の短辺に対応する辺には下底寸法が５ｍｍ、上底寸法が３ｍｍ、高さが１．５ｍｍの台形部分の切欠１ｃ，１ｄを形成した。次に、シート状接着剤に、半導体素子を圧接させ、フリップチップボンダー（澁谷工業株式会社製ＤＢ−１００）により半導体素子下面の複数の金属バンプがガラス基板に当接するように加圧し、加熱により硬化させた。   The epoxy resin sheet adhesive 1 is placed on the glass substrate, and the bottom side dimension is 13 mm, the top base dimension is 10 mm, and the height is long on the side corresponding to the long side of the semiconductor element by the Thomson blade. The trapezoidal cutouts 1a and 1b of 1.0 mm are formed on the side corresponding to the short side of the semiconductor element. Formed. Next, the semiconductor element is press-contacted to the sheet-like adhesive, and a plurality of metal bumps on the lower surface of the semiconductor element are pressed against the glass substrate by a flip chip bonder (DB-100, manufactured by Kasuya Kogyo Co., Ltd.). Cured.

上記のようにして接合して得られた半導体装置について、光学顕微鏡を用いて接着剤の側方へのはみ出し、特に半導体素子の上面への回り込みの有無を観察したところ、上面への回り込みは認められなかった。   About the semiconductor device obtained by bonding as described above, the adhesive protruded to the side using an optical microscope, and in particular, the presence or absence of the semiconductor element on the upper surface was observed. I couldn't.

また、上記隙間への充填状態について、超音波探傷画像装置により評価した。その結果、充填状態は良好であった。なお、下記の表１においては充填状態の評価について、チップの充填率９０〜１００％である場合には良好であるとして、〇を付し、９０％未満である場合には不良であるとして、×を付した。   Further, the filling state in the gap was evaluated by an ultrasonic flaw detection image apparatus. As a result, the filling state was good. In Table 1 below, regarding the evaluation of the filling state, when the tip filling rate is 90 to 100%, it is assumed that it is good, ◯ is attached, and when it is less than 90%, it is bad. X was attached.

また、上記シート状接着剤の加熱硬化に際しての濡れ広がりを以下の要領で評価した。濡れ広がり：チップ端部からの最大ぬれ幅。下記の表１に結果を示す。なお、表１では、１０μｍ以下である場合、濡れ広がりが良好であるとして〇を付し、１０μｍを超える場合には、濡れ広がり不良として×を付した。   Further, wetting and spreading during the heat curing of the sheet adhesive was evaluated in the following manner. Wetting and spreading: Maximum wetting width from the tip end. The results are shown in Table 1 below. In Table 1, when the thickness was 10 μm or less, ◯ was marked as good wetting spread, and when it exceeded 10 μm, x was marked as poor wetting spread.

（実施例２〜５及び比較例１〜３）
使用したエポキシ樹脂系接着剤組成物を下記の表１に示すように変更したことを除いては、実施例１と同様にして、半導体素子をガラス基板上に接合し、評価した。結果を下記の表１に示す。 (Examples 2-5 and Comparative Examples 1-3)
A semiconductor element was bonded onto a glass substrate and evaluated in the same manner as in Example 1 except that the used epoxy resin adhesive composition was changed as shown in Table 1 below. The results are shown in Table 1 below.

Figure 2007009022
Figure 2007009022

表１から明らかなように、最小溶融粘度が１５ＰａＳに留まっている比較例１では、濡れ広がり性が十分でなかった。これに対して、最小溶融粘度が４０ＰａＳ以上である実施例１〜４では、濡れ広がり性が良好であった。   As is clear from Table 1, in Comparative Example 1 where the minimum melt viscosity remained at 15 PaS, the wet spreadability was not sufficient. On the other hand, in Examples 1 to 4 having a minimum melt viscosity of 40 PaS or more, the wet spreading property was good.

また、比較例２では、最小溶融粘度が１１０００ＰａＳと高すぎたためか、充填状態が良好ではなかった。これに対して、実施例１〜４では、最小溶融粘度が５１００ＰａＳ以下であるため、隙間に確実に接着剤が充填されていた。   Moreover, in the comparative example 2, since the minimum melt viscosity was too high with 11000 PaS, the filling state was not favorable. On the other hand, in Examples 1-4, since the minimum melt viscosity was 5100 PaS or less, the gap was surely filled with the adhesive.

また、比較例３では、最小溶融粘度を示した温度＋５０℃の温度における粘度が０．０５ＭＰａＳと低かったためか濡れ広がり性が十分でなかった。これに対して、実施例１〜４では、最小溶融粘度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上であるため、濡れ広がり性も良好であった。   In Comparative Example 3, the wet spreadability was not sufficient because the viscosity at the temperature of the minimum melt viscosity + 50 ° C. was as low as 0.05 MPaS. On the other hand, in Examples 1-4, since the melt viscosity at the temperature of the minimum melt viscosity + 50 ° C. is 0.1 MPaS or more, the wetting and spreading property was also good.

本発明の一実施形態に得るシート状接着剤の模式的平面図。The schematic plan view of the sheet-like adhesive obtained in one Embodiment of this invention. （ａ），（ｂ）は、従来の電子部品装置の製造方法の一例を示す部分切欠正面図であり、（ｃ）は従来の製造方法により得られた電子部品装置を示す正面断面図である。(A), (b) is a partial notch front view which shows an example of the manufacturing method of the conventional electronic component apparatus, (c) is front sectional drawing which shows the electronic component apparatus obtained by the conventional manufacturing method. .

符号の説明Explanation of symbols

１…シート状接着剤
１ａ〜１ｄ…切欠
DESCRIPTION OF SYMBOLS 1 ... Sheet-like adhesive 1a-1d ... Notch

Claims (4)

熱硬化性樹脂を含むシート状接着剤であって、コーンプレート粘度計を用いて回転数１Ｈｚ及び昇温速度１０℃／分で２５℃から昇温しつつ粘度を測定した場合の最小溶融粘度が４０ＰａＳ〜５１００ＰａＳの範囲にあり、上記最小溶融粘度を示した温度＋５０℃の温度における溶融粘度が０．１ＭＰａＳ以上であることを特徴とする、シート状接着剤。   A sheet-like adhesive containing a thermosetting resin having a minimum melt viscosity when the viscosity is measured from a temperature of 25 ° C. with a cone plate viscometer at a rotation speed of 1 Hz and a temperature increase rate of 10 ° C./min. A sheet-like adhesive having a melt viscosity in the range of 40 PaS to 5100 PaS and a temperature of the above-mentioned minimum melt viscosity + 50 ° C. of 0.1 MPaS or more. 前記シート状接着剤が、熱硬化性樹脂としてのエポキシ樹脂を含み、エポキシ樹脂１００重量部に対し、平均分子量１０万〜２５万のエポキシ含有ポリマー１０〜５０重量部と、イミダゾール系硬化剤０．５〜３０重量部とを含むことを特徴とする、請求項１に記載のシート状接着剤。   The sheet-like adhesive includes an epoxy resin as a thermosetting resin, and 10 to 50 parts by weight of an epoxy-containing polymer having an average molecular weight of 100,000 to 250,000 with respect to 100 parts by weight of the epoxy resin; The sheet-like adhesive according to claim 1, comprising 5 to 30 parts by weight. 請求項１または２に記載のシート状接着剤を、電子部品素子の一面と、電子部品素子が搭載される支持部材または他の電子部品素子との間に介在させ、電子部品素子を支持部材または他の電子部品素子と圧接させる工程と、
前記シート状接着剤を硬化させる工程とを備えることを特徴とする、電子部品装置の製造方法。 The sheet-like adhesive according to claim 1 or 2 is interposed between one surface of the electronic component element and a support member or another electronic component element on which the electronic component element is mounted, and the electronic component element is supported by the support member or A process of press-contacting with other electronic component elements;
And a step of curing the sheet-like adhesive. 請求項１または２に記載のシート状接着剤の硬化物により電子部品素子が支持部材または他の電子部品素子に接合されていることを特徴とする、電子部品装置。
An electronic component device, wherein the electronic component element is bonded to a support member or another electronic component element by the cured product of the sheet-like adhesive according to claim 1.
JP2005190219A 2005-06-29 2005-06-29 Sheet-like adhesive, method for producing electronic part device and electronic part device Pending JP2007009022A (en)

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