JP2007005003A - Led照明装置 - Google Patents
Led照明装置 Download PDFInfo
- Publication number
- JP2007005003A JP2007005003A JP2005180433A JP2005180433A JP2007005003A JP 2007005003 A JP2007005003 A JP 2007005003A JP 2005180433 A JP2005180433 A JP 2005180433A JP 2005180433 A JP2005180433 A JP 2005180433A JP 2007005003 A JP2007005003 A JP 2007005003A
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- JP
- Japan
- Prior art keywords
- led
- substrate body
- light
- lighting device
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 熱可塑性の耐熱フィルムを、全体として目的とする照射範囲を反映した所定の三次元的形状に成形して基板本体14を得ると共に、その表面に光を反射する反射面16を設けているので、外部からの信号または応力を利用して基板本体14の形状を変え、LED12の発する光の配光を容易に変化させる事ができる。また、基板本体14に表面実装型のLED12の発光領域Lと略同等の大きさの開孔26を設け、この開孔26とLED12表面の発光領域Lとが一致するようにして基板本体14裏面側にLED12の表面側を固定しているので、回路作製が簡単であると共に、LED12で発生した熱を何らの抵抗もなく直ちに外気中へと放熱する事ができる。
【選択図】 図3
Description
12…LED
14…基板本体
16…反射面
18…導電回路
20…透明樹脂
22…放熱板
24…接着剤
26…開孔
28…凹部
30…外縁部
32…応力吸収部
32a,32d…スリット
32b,32c…溝
34…フランジ
36…ハンダ
38…レンズ部
L…発光領域
Claims (4)
- 熱可塑性の耐熱フィルムを所定の三次元的形状に成形した基板本体と、前記基板本体の所定位置に取り付けられた複数個の表面実装型のLEDと、前記基板本体の表面に設けられ、前記LEDの発する光を反射する反射面と、前記基板本体の裏面に設けられ、前記LEDを外部回路に接続して点灯させる導電回路とを備えたLED照明装置であって、
前記基板本体には、前記LED表面の発光領域と略同等の大きさの開孔が設けられており、
前記開孔と前記LED表面の発光領域とが一致するようにして前記基板本体裏面に前記LEDの表面側が固定されていることを特徴とするLED照明装置。 - 前記耐熱フィルムが芳香族ポリイミドフィルムであることを特徴とする請求項1に記載のLED照明装置。
- 前記基板本体のLED実装部分に、反射効率を高めるため前記LEDの発光領域を囲繞する部分的な凹部が設けられていることを特徴とする請求項1または2に記載のLED照明装置。
- 前記基板本体の少なくとも一部にスリットや溝などの折り曲げ構造で構成された応力吸収部を設けたことを特徴とする請求項1乃至3のいずれかに記載のLED照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005180433A JP4469308B2 (ja) | 2005-06-21 | 2005-06-21 | Led照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005180433A JP4469308B2 (ja) | 2005-06-21 | 2005-06-21 | Led照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007005003A true JP2007005003A (ja) | 2007-01-11 |
JP4469308B2 JP4469308B2 (ja) | 2010-05-26 |
Family
ID=37690431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005180433A Expired - Fee Related JP4469308B2 (ja) | 2005-06-21 | 2005-06-21 | Led照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4469308B2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009060113A (ja) * | 2007-08-30 | 2009-03-19 | Osram Opto Semiconductors Gmbh | ケーシング下部を備えたケーシング |
EP2107858A2 (en) | 2008-03-31 | 2009-10-07 | Yamagata Promotional Organization for Industrial Technology | Power supply apparatus for lighting device |
JP2011222942A (ja) * | 2010-04-12 | 2011-11-04 | Tyntek Corp | 反射性発光ダイオードランプ |
AT509676B1 (de) * | 2010-04-08 | 2012-08-15 | Ernst Mag Helldorff | Leuchtkörper mit mindestens einem led-chip |
WO2013108431A1 (ja) * | 2012-01-17 | 2013-07-25 | Jx日鉱日石金属株式会社 | 銅-ポリイミド積層体、立体成型体、及び立体成型体の製造方法 |
JP2014232586A (ja) * | 2013-05-28 | 2014-12-11 | 株式会社アイテックシステム | 発光素子用の基板及びこれを用いた照明装置 |
US9373425B2 (en) | 2011-03-30 | 2016-06-21 | Jx Nippon Mining & Metals Corporation | Copper alloy sheet with excellent heat dissipation and workability in repetitive bending |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6417524U (ja) * | 1987-07-21 | 1989-01-27 | ||
JPH0511718A (ja) * | 1991-07-02 | 1993-01-22 | Mitsubishi Cable Ind Ltd | 発光装置 |
JP2003151328A (ja) * | 2001-11-15 | 2003-05-23 | Du Pont Toray Co Ltd | 照明用反射装置 |
JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
-
2005
- 2005-06-21 JP JP2005180433A patent/JP4469308B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6417524U (ja) * | 1987-07-21 | 1989-01-27 | ||
JPH0511718A (ja) * | 1991-07-02 | 1993-01-22 | Mitsubishi Cable Ind Ltd | 発光装置 |
JP2003151328A (ja) * | 2001-11-15 | 2003-05-23 | Du Pont Toray Co Ltd | 照明用反射装置 |
JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009060113A (ja) * | 2007-08-30 | 2009-03-19 | Osram Opto Semiconductors Gmbh | ケーシング下部を備えたケーシング |
EP2107858A2 (en) | 2008-03-31 | 2009-10-07 | Yamagata Promotional Organization for Industrial Technology | Power supply apparatus for lighting device |
AT509676B1 (de) * | 2010-04-08 | 2012-08-15 | Ernst Mag Helldorff | Leuchtkörper mit mindestens einem led-chip |
JP2011222942A (ja) * | 2010-04-12 | 2011-11-04 | Tyntek Corp | 反射性発光ダイオードランプ |
US9373425B2 (en) | 2011-03-30 | 2016-06-21 | Jx Nippon Mining & Metals Corporation | Copper alloy sheet with excellent heat dissipation and workability in repetitive bending |
WO2013108431A1 (ja) * | 2012-01-17 | 2013-07-25 | Jx日鉱日石金属株式会社 | 銅-ポリイミド積層体、立体成型体、及び立体成型体の製造方法 |
JP2013146870A (ja) * | 2012-01-17 | 2013-08-01 | Jx Nippon Mining & Metals Corp | 銅−ポリイミド積層体、立体成型体、及び立体成型体の製造方法 |
KR20140099533A (ko) * | 2012-01-17 | 2014-08-12 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법 |
CN104010811A (zh) * | 2012-01-17 | 2014-08-27 | Jx日矿日石金属株式会社 | 铜-聚酰亚胺层叠体、立体成型体、及立体成型体的制造方法 |
KR101586599B1 (ko) | 2012-01-17 | 2016-01-18 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법 |
JP2014232586A (ja) * | 2013-05-28 | 2014-12-11 | 株式会社アイテックシステム | 発光素子用の基板及びこれを用いた照明装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4469308B2 (ja) | 2010-05-26 |
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