JP2006326408A - Micro mixer - Google Patents

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JP2006326408A
JP2006326408A JP2005150299A JP2005150299A JP2006326408A JP 2006326408 A JP2006326408 A JP 2006326408A JP 2005150299 A JP2005150299 A JP 2005150299A JP 2005150299 A JP2005150299 A JP 2005150299A JP 2006326408 A JP2006326408 A JP 2006326408A
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substrate
holes
hole
bottomed
liquid
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Itsuo Furukawa
逸雄 古川
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Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro mixer capable of efficiently mixing a plurality kinds of fluids, enabling size reduction and having less possibility of clogging of a fluid channel. <P>SOLUTION: The micro mixer comprises a plurality of substrates with holes 10 each having a plurality of bottomed holes 18 formed on a top surface, a plurality of through holes 20 formed in a circumference of each of the plurality of bottomed holes 18 and a connecting passage 22 connecting an upper edge portion of each of the plurality of bottomed holes 18 with a top end portion of the through hole 20 in a circumference of the upper edge portion in a channel shape formed thereon, wherein the plurality of substrates with holes 10 are tightly contacted with each other by laminating them so that the through hole 20 of the substrate with holes 10 in an upper side communicates with the bottomed holes 18 of the substrate with holes 10 in a lower side, and confluence of and diversion from fluids are repeated while fluids flow in a thickness/laminated direction of the substrates with holes 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、複数種類の液体等の流体を微少流量で流しながら、それらの流体を混合させるマイクロミキサに関し、このマイクロミキサは、化学薬品、化粧品、化学調味料、塗料等の合成などに使用される。   The present invention relates to a micromixer that mixes fluids such as a plurality of liquids at a minute flow rate and mixes the fluids. The micromixer is used for synthesis of chemicals, cosmetics, chemical seasonings, paints, and the like. The

この種のマイクロミキサは、複数種類の流体、例えば2種類の液体をそれぞれ微少流量で液体流路に流し、液体流路を途中で交差させたり分岐させたりして2種類の液体を混合させる、といったものである。このようなマイクロミキサは、従来、ガラス、シリコン、プラスチック、セラミックス、金属などで形成された基板の表面に微細な溝を加工形成し、その基板の表面にカバー板を密着させて溝を被覆し、基板の溝部分を液体流路とするとともに、カバー板に、2種類の液体を導入するための2つの入口通路と混合された液体を取り出すための出口通路とを形成した構造を有している。そして、液体流路を構成する基板表面の溝は、液体の混合効率を高めるために、途中で複数回、交差および分岐を繰り返すように形成されている(例えば、特許文献1参照。)。
特表2001−520112号公報(第6−7頁、図1、図2)
This type of micromixer allows a plurality of types of fluids, for example, two types of liquids, to flow through the liquid flow path at a minute flow rate, and the two liquids are mixed by crossing or branching the liquid flow path in the middle. It is something like that. Conventionally, such a micromixer is formed by processing fine grooves on the surface of a substrate made of glass, silicon, plastic, ceramics, metal, etc., and covering the grooves by bringing a cover plate into close contact with the surface of the substrate. The groove portion of the substrate is used as a liquid flow path, and the cover plate has a structure in which two inlet passages for introducing two kinds of liquid and an outlet passage for taking out the mixed liquid are formed. Yes. And the groove | channel of the substrate surface which comprises a liquid flow path is formed so that a crossing and a branch may be repeated several times in the middle in order to improve the mixing efficiency of a liquid (for example, refer patent document 1).
JP-T-2001-520112 (page 6-7, FIG. 1, FIG. 2)

従来のマイクロミキサのように、基板の表面に溝を形成して液体流路を平面的に構成する、といった構造では、2種類の液体の混合効率を高めようとすると、混合しようとする液体の粘性や性質に応じて流路長を長くすることが必要となってくる。この結果、マイクロミキサのサイズが大きくなる、といった問題点がある。また、生成された固形物が流路の交差部分などに徐々に堆積して流路を部分的に閉塞し、このため、液体の混合効率が大きく低下する、といった問題点もある。   In a structure in which a groove is formed on the surface of a substrate and a liquid flow path is configured in a plane like a conventional micromixer, if the mixing efficiency of two kinds of liquids is to be increased, the liquid to be mixed It is necessary to increase the flow path length according to the viscosity and properties. As a result, there is a problem that the size of the micromixer increases. In addition, the generated solid matter gradually accumulates at the intersections of the flow paths and partially closes the flow paths, so that the liquid mixing efficiency is greatly reduced.

この発明は、以上のような事情に鑑みてなされたものであり、複数種類の流体を効率良く混合させることができ、かつ、小型化が可能であって、流路の目詰まりを生じる恐れも少ないマイクロミキサを提供することを目的とする。   The present invention has been made in view of the circumstances as described above, and can efficiently mix a plurality of types of fluids, can be downsized, and may cause clogging of a flow path. The object is to provide a small number of micromixers.

請求項1に係る発明は、複数種類の流体を混合するマイクロミキサにおいて、主面に複数個の有底孔が形成されるとともに、各有底孔の周囲にそれぞれ複数個の貫通孔が、前記主面と前記主面とは反対側の反対面とを貫通するように形成され、各有底孔の周縁部とその周囲の貫通孔とを流路的に接続する連絡通路がそれぞれ形成された基板を複数枚、所定の基板の貫通孔が当該基板の反対面側に隣接する基板の有底孔に連通するように積層させて互いに密着させ、流体が複数の基板それぞれの主面側から反対面側へ順次流動しながら合流および分流を繰り返すようにしたことを特徴とする。   The invention according to claim 1 is a micromixer for mixing a plurality of types of fluids, wherein a plurality of bottomed holes are formed on a main surface, and a plurality of through holes are provided around each bottomed hole. The main surface and an opposite surface opposite to the main surface are formed so as to pass through, and communication passages that connect the peripheral edge of each bottomed hole and the surrounding through holes in a flow path are formed. A plurality of substrates are laminated so that a through hole of a predetermined substrate communicates with a bottomed hole of a substrate adjacent to the opposite surface side of the substrate, and is adhered to each other, and fluid is opposite from the main surface side of each of the plurality of substrates. It is characterized by repeating the merging and diversion while sequentially flowing to the surface side.

請求項2に係る発明は、請求項1に記載のマイクロミキサにおいて、積層された複数枚の基板と別の積層された複数枚の基板との間に、基板の複数個の貫通孔を通って流入する流体を合流させるための1つもしくは複数の大形透孔が形成された中間合流用基板を介挿したことを特徴とする。   According to a second aspect of the present invention, in the micromixer according to the first aspect, between the plurality of stacked substrates and another stacked plurality of substrates, the plurality of through holes of the substrate are passed. It is characterized by interposing an intermediate confluence substrate in which one or a plurality of large through holes for converging inflowing fluids are formed.

請求項3に係る発明は、請求項1または請求項2に記載のマイクロミキサにおいて、複数種類の流体の注入口が設けられるカバー板と最上層の基板との間に、複数種類の流体を予備混合するための混合流路が形設された予備混合用基板を介挿したことを特徴とする。   According to a third aspect of the present invention, in the micromixer according to the first or second aspect, a plurality of types of fluids are reserved between a cover plate provided with a plurality of types of fluid inlets and the uppermost substrate. It is characterized in that a premixing substrate having a mixing channel for mixing is inserted.

請求項1に係る発明のマイクロミキサにおいて、複数種類の流体は、基板の有底孔内へ流入して合流し、この有底孔内で相互に混合される。有底孔内で混合された流体は、有底孔の周縁部から連絡通路を通って流出し、有底孔の周囲の複数個の貫通孔へ分かれて流入する。所定の基板の貫通孔内へ流入した流体は、貫通孔内を通って流動し、当該基板の反対面側に隣接する基板の有底孔内へ流入する。このとき、反対面側に隣接した基板の有底孔内において、前記所定の基板の別々の貫通孔内から流入した流体同士が合流することにより、複数種類の流体の混合が促進される。このように合流と分流を繰り返しながら、流体が複数の基板それぞれの主面側から反対面側へ流動していくことにより、複数種類の流体が混合されていく。また、従来のマイクロミキサのように基板の表面に溝を形成して流路を平面的に構成する構造ではなく、積層された複数枚の基板に流路を立体的に構成する構造であるため、マイクロミキサの平面形状が小さくなる。さらに、基板表面に形成される微細な溝を途中で複数回、交差させたり分岐させたりする構造ではなく、1つの基板内において有底孔と複数個の貫通孔とを連絡通路を通して流路的に接続するとともに、所定の基板の貫通孔と当該基板の反対面側に隣接する基板の有底孔とを順次連通させていく構造であるため、生成された固形物によって流路が部分的に閉塞される、といった恐れが少ない。
したがって、請求項1に係る発明のマイクロミキサを使用すると、複数種類の流体を効率良く混合させることができ、また、流路の目詰まりを防止することができるとともに、マイクロミキサを小型化することが可能となる。
In the micromixer according to the first aspect of the present invention, a plurality of types of fluids flow into the bottomed hole of the substrate to join and are mixed with each other in the bottomed hole. The fluid mixed in the bottomed hole flows out from the peripheral portion of the bottomed hole through the communication passage, and flows into the plurality of through holes around the bottomed hole. The fluid that has flowed into the through hole of the predetermined substrate flows through the through hole, and flows into the bottomed hole of the substrate adjacent to the opposite surface side of the substrate. At this time, in the bottomed hole of the substrate adjacent to the opposite surface side, the fluids flowing in from the separate through-holes of the predetermined substrate join together, thereby promoting the mixing of a plurality of types of fluids. As described above, the fluid flows from the main surface side to the opposite surface side of each of the plurality of substrates while repeating the merging and branching, whereby a plurality of types of fluids are mixed. In addition, it is not a structure in which grooves are formed on the surface of a substrate and a flow path is configured in a planar manner as in a conventional micromixer, but a structure in which flow paths are three-dimensionally configured on a plurality of stacked substrates. The planar shape of the micromixer becomes smaller. Furthermore, it is not a structure in which minute grooves formed on the substrate surface are crossed or branched several times in the middle, but a bottomed hole and a plurality of through holes are flow-through through a connecting passage in one substrate. In addition, the through hole of a predetermined substrate and the bottomed hole of the substrate adjacent to the opposite surface side of the substrate are sequentially communicated with each other. There is little risk of being blocked.
Therefore, when the micromixer of the invention according to claim 1 is used, a plurality of types of fluids can be mixed efficiently, clogging of the flow path can be prevented, and the micromixer can be downsized. Is possible.

請求項2に係る発明のマイクロミキサでは、積層された複数枚の基板の有底孔および貫通孔を通って流動してきた流体が、中間合流用基板の大形透孔内で一旦合流して、その後に再び、合流と分流を繰り返しながら積層された複数枚の基板の有底孔および貫通孔を通って流動していくので、複数種類の流体をより均一に混合させることができるとともに、その混合効率をより高めることができる。   In the micromixer of the invention according to claim 2, the fluid that has flowed through the bottomed holes and the through holes of the plurality of stacked substrates once merges in the large through holes of the intermediate junction substrate, After that, since the fluid flows through the bottomed holes and through-holes of the plurality of stacked substrates while repeating the merging and splitting, it is possible to mix a plurality of types of fluids more uniformly and to mix them. Efficiency can be further increased.

請求項3に係る発明のマイクロミキサでは、予備混合用基板の混合流路において複数種類の流体が予備混合された後に、その混合流体が、積層された複数枚の基板の有底孔および貫通孔を通って流動していくので、複数種類の流体の混合効率をより高めることができる。   In the micromixer of the invention according to claim 3, after a plurality of kinds of fluids are premixed in the mixing flow path of the premixing substrate, the mixed fluid is provided with bottomed holes and through holes of the plurality of stacked substrates. Since it flows through, the mixing efficiency of multiple types of fluids can be further increased.

以下、この発明の最良の実施形態について図面を参照しながら説明する。
図1ないし図4は、この発明の実施形態の1例を示し、図1は、マイクロミキサの主要部の概略構成を示す分解斜視図であり、図2は、このマイクロミキサの構成要素である複数枚の基板の部分拡大縦断面図であり、図3および図4はそれぞれ、積層された複数枚の基板における有底孔、貫通孔および連絡通路の平面的配置を説明するための平面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
1 to 4 show an example of an embodiment of the present invention, FIG. 1 is an exploded perspective view showing a schematic configuration of a main part of the micromixer, and FIG. 2 is a component of the micromixer. FIG. 3 is a partially enlarged longitudinal sectional view of a plurality of substrates, and FIG. 3 and FIG. 4 are plan views for explaining a planar arrangement of bottomed holes, through holes, and communication passages in the plurality of stacked substrates, respectively. is there.

このマイクロミキサは、互いに密着する複数枚の基板10、最上位置の基板10の表面に密着する予備混合用基板12、この予備混合用基板12の表面に密着する上部カバー板14、および、最下位置の基板10の裏面に密着する下部カバー板16を積層して主要部が構成されている。上部カバー板14と予備混合用基板12、予備混合用基板12と基板10、基板10同士および基板10と下部カバー板16とはそれぞれ、図示しない固定具により互いに液密状態で密着させられ、上部カバー板14、予備混合用基板12、複数枚の基板10および下部カバー板16が一体化されている。   The micromixer includes a plurality of substrates 10 that are in close contact with each other, a premixing substrate 12 that is in close contact with the surface of the uppermost substrate 10, an upper cover plate 14 that is in close contact with the surface of the premixing substrate 12, and a lowermost substrate. A main part is configured by laminating a lower cover plate 16 that is in close contact with the back surface of the substrate 10 at a position. The upper cover plate 14 and the premixing substrate 12, the premixing substrate 12 and the substrate 10, the substrates 10 and each other, and the substrate 10 and the lower cover plate 16 are in close contact with each other in a liquid-tight state by a fixture (not shown). The cover plate 14, the premixing substrate 12, the plurality of substrates 10 and the lower cover plate 16 are integrated.

基板10は、ガラス、シリコン、プラスチック、セラミックス、金属などで形成されている。基板10には、その上面に複数個の有底孔18が並列して形設されている。各有底孔18の周囲にはそれぞれ、基板10の厚み方向に貫通する複数個、図示例では4個の貫通孔20が円周方向に等配されて形成されている。また、基板10の上面には、有底孔18と各貫通孔20との間にそれぞれ溝が形成されており、これらの溝が、有底孔18の上部周縁部と各貫通孔20の上端部とをそれぞれ流路的に接続する連絡通路22となる。そして、互いに隣り合う有底孔18、18の上部周縁部からそれぞれ延出する2本の連絡通路22、22が、両有底孔18、18の中間に配置された1個の貫通孔20の上端部位置で合流するように構成されている。また、上下方向において互いに接する基板10同士間では、図2に示すように、上方側の基板10の貫通孔20が下方側の基板10の有底孔18に連通するように、複数枚の基板10が積層されている。   The substrate 10 is made of glass, silicon, plastic, ceramics, metal, or the like. A plurality of bottomed holes 18 are formed in parallel on the upper surface of the substrate 10. Around each bottomed hole 18, a plurality of, in the illustrated example, four through holes 20 penetrating in the thickness direction of the substrate 10 are formed so as to be equally arranged in the circumferential direction. Further, grooves are formed between the bottomed hole 18 and each through hole 20 on the upper surface of the substrate 10, and these grooves are the upper peripheral edge of the bottomed hole 18 and the upper end of each through hole 20. It becomes the communication channel | path 22 which connects a part with each flow path. The two communication passages 22 and 22 extending from the upper peripheral edges of the bottomed holes 18 and 18 adjacent to each other have one through-hole 20 disposed between the bottomed holes 18 and 18. It is comprised so that it may merge at an upper end part position. Further, between the substrates 10 that are in contact with each other in the vertical direction, as shown in FIG. 2, a plurality of substrates are formed such that the through holes 20 of the upper substrate 10 communicate with the bottomed holes 18 of the lower substrate 10. 10 are stacked.

図3および図4に、積層された各基板10にそれぞれ形成された有底孔18、貫通孔20および連絡通路22の平面的配置関係を示す。図3の(a)が、第1層目の基板10に形成された有底孔18a、貫通孔20aおよび連絡通路22aを示し、図3の(b)が、第2層目の基板10に形成された有底孔18b、貫通孔20bおよび連絡通路22bを示し、図3の(c)が、第3層目の基板10に形成された有底孔18c、貫通孔20cおよび連絡通路22cを示している。また、図4は、基板10を透視した状態で有底孔18a、貫通孔20aおよび連絡通路22a;有底孔18b、貫通孔20bおよび連絡通路22b;有底孔18c、貫通孔20cおよび連絡通路22cをそれぞれ示している。これらの図に示したように、第1層目の基板10に形成された各貫通孔20aが、第2層目の基板10に形成された各有底孔18bの中心部にそれぞれ位置し、第2層目の基板10に形成された各貫通孔20bが、第3層目の基板10に形成された各有底孔18cの中心部にそれぞれ位置している。このように、上方側の基板10の各貫通孔20a(20b)が下方側の基板10の各有底孔18b(18c)の中心部にそれぞれ位置するように、複数枚の基板10が上下方向に積層されることにより、上方側の基板10の貫通孔20a(20b)と下方側の基板10の有底孔18b(18c)とが順次連通して、全体の流路が構成されている。   3 and 4 show a planar arrangement relationship between the bottomed holes 18, the through holes 20, and the communication passages 22 formed in each of the stacked substrates 10. FIG. 3A shows the bottomed hole 18a, the through hole 20a and the communication passage 22a formed in the first layer substrate 10, and FIG. 3B shows the second layer substrate 10. The formed bottomed hole 18b, the through hole 20b, and the communication passage 22b are shown. FIG. 3C shows the bottomed hole 18c, the through hole 20c, and the communication passage 22c formed in the substrate 10 of the third layer. Show. 4 shows the bottomed hole 18a, the through hole 20a and the communication passage 22a in a state where the substrate 10 is seen through; the bottomed hole 18b, the through hole 20b and the communication passage 22b; the bottomed hole 18c, the through hole 20c and the communication passage. 22c are shown. As shown in these drawings, each through hole 20a formed in the first layer substrate 10 is located at the center of each bottomed hole 18b formed in the second layer substrate 10, respectively. Each through-hole 20b formed in the second layer substrate 10 is located at the center of each bottomed hole 18c formed in the third layer substrate 10. As described above, the plurality of substrates 10 are arranged in the vertical direction so that each through-hole 20a (20b) of the upper substrate 10 is positioned at the center of each bottomed hole 18b (18c) of the lower substrate 10. As a result, the through hole 20a (20b) of the upper substrate 10 and the bottomed hole 18b (18c) of the lower substrate 10 are sequentially communicated to form the entire flow path.

なお、図2ないし図4においては、下層になるほど基板10に形成される有底孔18、貫通孔20および連絡通路22の数が多くなるように描かれているのに対し、図1においては、同数の有底孔18、貫通孔20および連絡通路22が形成された同一構成の基板10を複数枚積層している。これは単に、同一構成の基板10を出来るだけ共用する方が、製作コストを下げることができて製造上有利である、といった経済的な理由からである。したがって、有底孔18、貫通孔20および連絡通路22の数および形成位置の異なる複数種類の基板を用意して、それらを所定順序で積層するような構成としても、もちろん構わない。図1に示したように同一構成の基板10を複数枚積層するようにしたときは、上方側に位置する基板10においては全部の有底孔18、貫通孔20および連絡通路22に流体、例えば液体が流れる訳ではなく、特に最上位置の基板10においては数個所(図示例では2個所)の有底孔18ならびにその周囲の各4個の貫通孔20および各4本の連絡通路22だけに液体が流れることとなる。   In FIGS. 2 to 4, the number of bottomed holes 18, through-holes 20, and communication passages 22 formed in the substrate 10 increases in the lower layer, whereas in FIG. 1, A plurality of substrates 10 having the same configuration in which the same number of bottomed holes 18, through-holes 20 and communication passages 22 are formed are stacked. This is simply because of the economic reason that it is advantageous in manufacturing to share the same configuration of the substrates 10 as much as possible because the manufacturing cost can be reduced. Accordingly, it is of course possible to prepare a plurality of types of substrates having different numbers and formation positions of the bottomed holes 18, the through holes 20 and the communication passages 22 and laminate them in a predetermined order. When a plurality of substrates 10 having the same configuration are stacked as shown in FIG. 1, in the substrate 10 located on the upper side, all bottomed holes 18, through holes 20 and communication passages 22 are filled with fluid, for example The liquid does not flow, and in particular, in the uppermost substrate 10, only a few (two in the illustrated example) the bottomed holes 18, the four through holes 20 around them, and the four communication passages 22 only. The liquid will flow.

基板10の積層枚数や基板10に形成される有底孔18、貫通孔20および連絡通路22の寸法は、特に限定されず、混合しようとする液体の粘性や性質に応じて適宜設定すればよい。   The number of stacked substrates 10 and the dimensions of the bottomed holes 18, the through holes 20 and the communication passages 22 formed in the substrate 10 are not particularly limited, and may be set as appropriate according to the viscosity and properties of the liquid to be mixed. .

予備混合用基板12も、ガラス、シリコン、プラスチック、セラミックス、金属などで形成されている。予備混合用基板12には、4個の微小貫通孔が形成されており、この各微小貫通孔がそれぞれ第1の液体供給口24、第2の液体供給口26および2つの液体排出口28、30となる。基板10の表面には、一端(始端)が第1の液体供給口24および第2の液体供給口26にそれぞれ個別に連通する微細な2本の有底溝が形成されており、この各有底溝がそれぞれ第1の液体流路32および第2の液体流路34を構成する。第1の液体流路32を構成する有底溝と第2の液体流路34を構成する有底溝とは途中で交差して、その交差部分より下流側に1本の有底溝が形成されており、この有底溝が混合流路36を構成する。混合流路36を構成する有底溝は分岐して、その分岐部分より下流側に2本の有底溝が形成されており、この各有底溝がそれぞれ排出流路38、40を構成し、各排出流路38、40が各液体排出口28、30にそれぞれ個別に連通している。そして、予備混合基板12を最上位置の基板10の表面に密着させたときに、予備混合基板12の各液体排出口28、30が、基板10の2個所の有底孔18にそれぞれ個別に連通するようになっている。   The premixing substrate 12 is also formed of glass, silicon, plastic, ceramics, metal, or the like. The premixing substrate 12 is formed with four micro through holes, and each micro through hole has a first liquid supply port 24, a second liquid supply port 26, and two liquid discharge ports 28, respectively. 30. On the surface of the substrate 10, there are formed two fine bottomed grooves whose one ends (starting ends) individually communicate with the first liquid supply port 24 and the second liquid supply port 26, respectively. The bottom grooves constitute the first liquid channel 32 and the second liquid channel 34, respectively. The bottomed groove constituting the first liquid flow path 32 and the bottomed groove constituting the second liquid flow path 34 intersect in the middle, and one bottomed groove is formed downstream of the intersecting portion. The bottomed groove constitutes the mixing channel 36. The bottomed groove constituting the mixing flow path 36 is branched, and two bottomed grooves are formed on the downstream side of the branched portion. The bottomed grooves constitute discharge flow paths 38 and 40, respectively. The discharge channels 38 and 40 communicate with the liquid discharge ports 28 and 30, respectively. When the premixed substrate 12 is brought into close contact with the surface of the uppermost substrate 10, the liquid discharge ports 28 and 30 of the premixed substrate 12 individually communicate with the two bottomed holes 18 of the substrate 10. It is supposed to be.

上部カバー板14および下部カバー板16は、ステンレス鋼、プラスチック等でそれぞれ形成されている。上部カバー板14には、2個の微小貫通孔が形成されており、この各微小貫通孔がそれぞれ第1の液体供給通路42および第2の液体供給通路44となる。第1の液体供給通路42および第2の液体供給通路44にはそれぞれ、第1の液体供給管46および第2の液体供給管48が連通接続されている。また、上部カバー板14を予備混合基板12の表面に密着させたときに、第1の液体供給通路42および第2の液体供給通路44はそれぞれ、予備混合基板12の第1の液体供給口24および第2の液体供給口26に連通するようになっている。また、下部カバー板16の表面には、基板10の貫通孔20の形成区域に対応した平面形状を有する凹部50が形成されている。そして、凹部50内に1個の微小貫通孔が形成されており、この微小貫通孔が液体排出通路52となる。液体排出通路52には、液体排出管54が連通接続されている。   The upper cover plate 14 and the lower cover plate 16 are each formed of stainless steel, plastic, or the like. Two fine through holes are formed in the upper cover plate 14, and the fine through holes serve as a first liquid supply passage 42 and a second liquid supply passage 44, respectively. A first liquid supply pipe 46 and a second liquid supply pipe 48 are connected in communication with the first liquid supply path 42 and the second liquid supply path 44, respectively. Further, when the upper cover plate 14 is brought into close contact with the surface of the premixed substrate 12, the first liquid supply passage 42 and the second liquid supply passage 44 are respectively connected to the first liquid supply port 24 of the premixed substrate 12. And it communicates with the second liquid supply port 26. Further, a concave portion 50 having a planar shape corresponding to the formation area of the through hole 20 of the substrate 10 is formed on the surface of the lower cover plate 16. One minute through hole is formed in the recess 50, and this minute through hole becomes the liquid discharge passage 52. A liquid discharge pipe 54 is connected in communication with the liquid discharge passage 52.

なお、予備混合用基板12は、特に必要が無ければ設けなくてもよい。予備混合基板12を省略して、上部カバー板14を最上位置の基板10の表面に直接に密着させるときは、上部カバー板14に形成される第1の液体供給通路42および第2の液体供給通路44を、それら両液体供給通路42、44が基板10の1つの有底孔18にそれぞれ連通するように配置する。また、上部カバー板14に第1の液体供給通路42および第2の液体供給通路44を複数対設けて、各一対の液体供給通路42、44を基板10の複数個所の有底孔18にそれぞれ個別に連通させるようにしてもよい。   Note that the preliminary mixing substrate 12 may not be provided unless particularly required. When the premixed substrate 12 is omitted and the upper cover plate 14 is brought into direct contact with the surface of the uppermost substrate 10, the first liquid supply passage 42 and the second liquid supply formed in the upper cover plate 14 are used. The passage 44 is arranged so that both the liquid supply passages 42 and 44 communicate with one bottomed hole 18 of the substrate 10. In addition, a plurality of pairs of first liquid supply passages 42 and second liquid supply passages 44 are provided in the upper cover plate 14, and each pair of liquid supply passages 42, 44 is provided in the bottomed holes 18 at a plurality of locations of the substrate 10. You may make it communicate individually.

上記したように構成されたマイクロミキサを使用して、2種類の液体を混合させるときは、マイクロシリンジ、マイクロポンプ、マイクロバルブなどにより上部カバー板14の第1の液体供給通路42および第2の液体供給通路44を通して予備混合用基板12の第1の液体供給口24および第2の液体供給口26へ、第1の液体および第2の液体をそれぞれ個別に注入する。各液体供給口24、26へそれぞれ注入された第1の液体および第2の液体は、予備混合用基板12の第1の液体流路32および第2の液体流路34内をそれぞれ別々に流れ、第1の液体流路32と第2の液体流路34とが交差する部分で合流した後、混合流路36内を流れる。そして、第1の液体および第2の液体は、混合流路36内を流れる間に予備的に混合される。混合流路36内を流れる間に混合された液体は、混合流路36内から各排出流路38、40内へ分かれて流入し、各排出流路38、40内をそれぞれ流れて各液体排出口28、30へ到達する。そして、混合液体は、各液体排出口28、30をそれぞれ通り、最上位置の基板10の2個所において有底孔18内へ流入する。   When the two types of liquids are mixed using the micromixer configured as described above, the first liquid supply passage 42 and the second liquid of the upper cover plate 14 are provided by a microsyringe, a micropump, a microvalve, or the like. The first liquid and the second liquid are individually injected into the first liquid supply port 24 and the second liquid supply port 26 of the premixing substrate 12 through the liquid supply passage 44. The first liquid and the second liquid respectively injected into the liquid supply ports 24 and 26 flow separately in the first liquid channel 32 and the second liquid channel 34 of the premixing substrate 12, respectively. After the first liquid flow path 32 and the second liquid flow path 34 meet at a crossing point, they flow through the mixing flow path 36. The first liquid and the second liquid are preliminarily mixed while flowing in the mixing flow path 36. The liquid mixed while flowing in the mixing flow path 36 flows separately from the mixing flow path 36 into the discharge flow paths 38 and 40, and flows through the discharge flow paths 38 and 40, respectively. Reach the exits 28, 30. The mixed liquid flows through the liquid discharge ports 28 and 30 and flows into the bottomed hole 18 at two locations on the uppermost substrate 10.

最上位置の基板10の有底孔18内へ流入した混合液体は、図2に示すように、有底孔18の内底面で流れの方向が反転することにより、第1の液体と第2の液体との混合が促進される。そして、有底孔18内の混合液体は、有底孔18の上部周縁部から各連絡通路22をそれぞれ通って流出し、有底孔18の周囲の4個の貫通孔20の上端部へ分かれて流入する。基板10の貫通孔20内へ流入した混合液体は、貫通孔20内を通って流下し、当該基板10の下方側に隣接した基板10の有底孔18内へ流入する。このとき、下方側の基板10の有底孔18内において、上方側の基板10の別々の貫通孔20内から流入した液体同士が合流することにより、第1の液体と第2の液体との混合がさらに促進される。このように合流と分流を繰り返しながら、混合液体が基板10の厚み・積層方向へ流動していくことにより、第1の液体と第2の液体とが完全に混合される。   As shown in FIG. 2, the mixed liquid that has flowed into the bottomed hole 18 of the uppermost substrate 10 is reversed in the flow direction on the inner bottom surface of the bottomed hole 18, whereby the first liquid and the second liquid are mixed. Mixing with liquid is promoted. Then, the mixed liquid in the bottomed hole 18 flows out from the upper peripheral edge of the bottomed hole 18 through each communication passage 22 and is divided into upper ends of the four through holes 20 around the bottomed hole 18. Inflow. The mixed liquid flowing into the through hole 20 of the substrate 10 flows down through the through hole 20 and flows into the bottomed hole 18 of the substrate 10 adjacent to the lower side of the substrate 10. At this time, in the bottomed hole 18 of the lower substrate 10, the liquids that have flowed in from the separate through holes 20 of the upper substrate 10 merge to form the first liquid and the second liquid. Mixing is further promoted. As described above, the mixed liquid flows in the thickness / stacking direction of the substrate 10 while repeating the merging and splitting, whereby the first liquid and the second liquid are completely mixed.

基板に形成される有底孔の形状は、図1ないし図4に示したような形状のものに限らない。例えば、図5および図6に、積層された各基板にそれぞれ形成される有底孔、貫通孔および連絡通路の平面的配置関係を示すように、開口形状が正方形である有底孔56a、56b、56cを基板の上面に形成し、その有底孔56a、56b、56cの上部周縁の4つのコーナー部に連絡通路60a、60b、60cを介して4個の貫通孔58a、58b、58cを形成するようにしてもよい。図5の(a)は、第1層目の基板に形成される有底孔56a、貫通孔58aおよび連絡通路60aを示し、図5の(b)は、第2層目の基板に形成される有底孔56b、貫通孔58bおよび連絡通路60bを示し、図5の(c)は、第3層目の基板に形成される有底孔56c、貫通孔58cおよび連絡通路60cを示している。また、図6は、基板を透視した状態で有底孔56a、貫通孔58aおよび連絡通路60a;有底孔56b、貫通孔58bおよび連絡通路60b;有底孔56c、貫通孔58cおよび連絡通路60cをそれぞれ示している。この実施形態においても、第1層目の基板10に形成された各貫通孔58aが、第2層目の基板10に形成された各有底孔56bの中心部にそれぞれ位置し、第2層目の基板10に形成された各貫通孔58bが、第3層目の基板10に形成された各有底孔56cの中心部にそれぞれ位置している。このように、上方側の基板10の各貫通孔58a(58b)が下方側の基板10の各有底孔56b(56c)の中心部にそれぞれ位置するように、複数枚の基板10が上下方向に積層されることにより、上方側の基板10の貫通孔58a(58b)と下方側の基板10の有底孔56b(56c)とが順次連通して、全体の流路が構成される。   The shape of the bottomed hole formed in the substrate is not limited to the shape shown in FIGS. For example, FIG. 5 and FIG. 6 show bottomed holes 56a and 56b having a square opening shape so as to show a planar arrangement relationship of the bottomed holes, the through holes, and the communication passages formed in each of the stacked substrates. , 56c are formed on the top surface of the substrate, and four through holes 58a, 58b, 58c are formed at the four corners of the upper peripheral edge of the bottomed holes 56a, 56b, 56c via the communication passages 60a, 60b, 60c. You may make it do. FIG. 5A shows a bottomed hole 56a, a through hole 58a, and a communication passage 60a formed in the first layer substrate, and FIG. 5B is formed in the second layer substrate. The bottomed hole 56b, the through hole 58b, and the communication passage 60b are shown, and FIG. 5C shows the bottomed hole 56c, the through hole 58c, and the communication passage 60c formed in the substrate of the third layer. . 6 shows the bottomed hole 56a, the through hole 58a and the communication passage 60a in a state where the substrate is seen through; the bottomed hole 56b, the through hole 58b and the communication passage 60b; the bottomed hole 56c, the through hole 58c and the communication passage 60c. Respectively. Also in this embodiment, each through-hole 58a formed in the first layer substrate 10 is located in the center of each bottomed hole 56b formed in the second layer substrate 10, and the second layer Each through hole 58b formed in the substrate 10 of the eye is located at the center of each bottomed hole 56c formed in the substrate 10 of the third layer. As described above, the plurality of substrates 10 are arranged in the vertical direction so that each through hole 58a (58b) of the upper substrate 10 is positioned at the center of each bottomed hole 56b (56c) of the lower substrate 10. As a result, the through holes 58a (58b) of the upper substrate 10 and the bottomed holes 56b (56c) of the lower substrate 10 are sequentially communicated to form the entire flow path.

また、図7および図8に、積層された各基板にそれぞれ形成される有底孔、貫通孔および連絡通路の平面的配置関係を示すように、開口形状が正三角形である有底孔62a、62b、62cを基板の上面に形成し、その有底孔62a、62b、62cの上部周縁の3つのコーナー部に連絡通路66a、66b、66cを介して3個の貫通孔64a、64b、64cを形成するようにしてもよい。図7の(a)は、第1層目の基板に形成される有底孔62a、貫通孔64aおよび連絡通路66aを示し、図7の(b)は、第2層目の基板に形成される有底孔62b、貫通孔64bおよび連絡通路66bを示し、図7の(c)は、第3層目の基板に形成される有底孔62c、貫通孔64cおよび連絡通路66cを示している。また、図8は、基板を透視した状態で有底孔62a、貫通孔64aおよび連絡通路66a;有底孔62b、貫通孔64bおよび連絡通路66b;有底孔62c、貫通孔64cおよび連絡通路66cをそれぞれ示している。この実施形態においても、第1層目の基板10に形成された各貫通孔64aが、第2層目の基板10に形成された各有底孔62bの中心部にそれぞれ位置し、第2層目の基板10に形成された各貫通孔64bが、第3層目の基板10に形成された各有底孔62cの中心部にそれぞれ位置している。このように、上方側の基板10の各貫通孔64a(64b)が下方側の基板10の各有底孔62b(62c)の中心部にそれぞれ位置するように、複数枚の基板10が上下方向に積層されることにより、上方側の基板10の貫通孔64a(64b)と下方側の基板10の有底孔62b(62c)とが順次連通して、全体の流路が構成される。   7 and 8, the bottomed holes 62a whose opening shape is an equilateral triangle so as to show the planar arrangement relationship of the bottomed holes, the through holes and the communication passages formed in each of the stacked substrates, 62b and 62c are formed on the upper surface of the substrate, and three through holes 64a, 64b and 64c are formed in the three corners of the upper peripheral edge of the bottomed holes 62a, 62b and 62c via the communication passages 66a, 66b and 66c. You may make it form. FIG. 7A shows a bottomed hole 62a, a through hole 64a, and a communication passage 66a formed in the first layer substrate, and FIG. 7B shows a second layer substrate formed in the second layer substrate. A bottomed hole 62b, a through hole 64b, and a communication passage 66b are shown. FIG. 7C shows a bottomed hole 62c, a through hole 64c, and a communication passage 66c formed in the third layer substrate. . 8 shows a bottomed hole 62a, a through hole 64a, and a communication passage 66a; a bottomed hole 62b, a through hole 64b, and a communication passage 66b; a bottomed hole 62c, a through hole 64c, and a communication passage 66c in a state where the substrate is seen through. Respectively. Also in this embodiment, each through-hole 64a formed in the first layer substrate 10 is located in the center of each bottomed hole 62b formed in the second layer substrate 10, and the second layer Each through hole 64b formed in the substrate 10 of the eye is located at the center of each bottomed hole 62c formed in the substrate 10 of the third layer. In this way, the plurality of substrates 10 are arranged in the vertical direction so that each through hole 64a (64b) of the upper substrate 10 is positioned at the center of each bottomed hole 62b (62c) of the lower substrate 10. As a result, the through holes 64a (64b) of the upper substrate 10 and the bottomed holes 62b (62c) of the lower substrate 10 are sequentially communicated to form the entire flow path.

次に、図9および図10は、この発明の別の実施形態を示し、図9は、マイクロミキサの一部の概略構成を示す分解斜視図であり、図10は、このマイクロミキサの部分拡大縦断面図である。   Next, FIGS. 9 and 10 show another embodiment of the present invention, FIG. 9 is an exploded perspective view showing a schematic configuration of a part of the micromixer, and FIG. 10 is a partially enlarged view of the micromixer. It is a longitudinal cross-sectional view.

このマイクロミキサでは、積層された複数枚の基板68と別の積層された複数枚の基板70、68との間に中間合流用基板72を介挿して、中間合流用基板72の表面および裏面を基板68の裏面および基板70の表面にそれぞれ密着させるようにしている。基板68は、図1ないし図4に示した基板10と同様の構成であって、基板68には、その上面に複数個の有底孔74が並列して形設され、各有底孔74の周囲にそれぞれ4個の貫通孔76が形成されて、有底孔74の上部周縁部と各貫通孔76の上端部とがそれぞれ連絡通路78によって流路的に接続されている。また、中間合流用基板72の裏面に密着する基板70には、複数個の貫通孔80が形設されている。なお、複数個の貫通孔80が設けられた基板70に代えて、有底孔74、貫通孔76および連絡通路78が設けられた基板68を用いるようにしても差し支えない。中間合流用基板72には、基板68の貫通孔76の形成区域に対応した平面形状を有する大形透孔82が形成されている。なお、図示例では、中間合流用基板72に1つの大形透孔82を形成しているが、基板68の貫通孔76の形成区域に対応する区域内に、複数の大形透孔を形成するようにしてもよい。   In this micromixer, an intermediate confluence substrate 72 is interposed between a plurality of laminated substrates 68 and another plurality of laminated substrates 70, 68, so that the front and back surfaces of the intermediate confluence substrate 72 are inserted. The back surface of the substrate 68 and the front surface of the substrate 70 are in close contact with each other. The substrate 68 has the same configuration as that of the substrate 10 shown in FIGS. 1 to 4, and a plurality of bottomed holes 74 are formed in parallel on the upper surface of the substrate 68. Four through-holes 76 are formed around each of the two, and the upper peripheral edge portion of the bottomed hole 74 and the upper end portion of each through-hole 76 are connected to each other by a communication passage 78 in a flow path. A plurality of through holes 80 are formed in the substrate 70 that is in close contact with the back surface of the intermediate junction substrate 72. Instead of the substrate 70 provided with a plurality of through holes 80, a substrate 68 provided with a bottomed hole 74, a through hole 76, and a communication passage 78 may be used. A large through hole 82 having a planar shape corresponding to the formation area of the through hole 76 of the substrate 68 is formed in the intermediate junction substrate 72. In the illustrated example, one large through hole 82 is formed in the intermediate junction substrate 72, but a plurality of large through holes are formed in an area corresponding to the formation area of the through hole 76 of the substrate 68. You may make it do.

図9に示した構成を備えたマイクロミキサにおいては、図10に示すように、積層された複数枚の基板68の有底孔74および貫通孔76を通って流動してきた液体が、中間合流用基板72の大形透孔82内で一旦合流して、その後に再び、中間合流用基板72の大形透孔82内から基板70の貫通孔80内へ流入し、基板70の貫通孔80内を流下して、基板68の有底孔74内へ流入する。そして、基板68の有底孔74内へ流入した液体は、上記したように合流と分流を繰り返しながら、積層された複数枚の基板68の有底孔74および貫通孔76を通って流動していく。このため、2種類の液体がより均一に混合されるとともに、その混合効率がより高められる。   In the micromixer having the configuration shown in FIG. 9, as shown in FIG. 10, the liquid flowing through the bottomed holes 74 and the through holes 76 of the plurality of stacked substrates 68 is used for intermediate merging. After joining once in the large through hole 82 of the substrate 72, the flow then flows again into the through hole 80 of the substrate 70 from the large through hole 82 of the intermediate joining substrate 72 and into the through hole 80 of the substrate 70. And flows into the bottomed hole 74 of the substrate 68. Then, the liquid flowing into the bottomed hole 74 of the substrate 68 flows through the bottomed holes 74 and the through holes 76 of the plurality of stacked substrates 68 while repeating the merging and splitting as described above. Go. For this reason, two types of liquids are mixed more uniformly, and the mixing efficiency is further increased.

なお、上述の実施形態においては、マイクロミキサを構成する上部カバー板14、予備混合用基板12、複数枚の基板10、および下部カバー板16等は、この順に上方から下方へ配列され、すなわち、マイクロミキサの上方から液体を注入し下方から液体を注出するようになっている。しかしながら、基板10の各貫通孔20は非常に微細なために液体には界面張力が働くので、必ずしもマイクロミキサの上方から液体を注入し下方から液体を注出しなくても、マイクロミキサの内部を液体が流れることは可能である。たとえば、マイクロミキサを横置きにしてマイクロミキサの左方から液体を注入し右方から液体を注出したり、マイクロミキサを図1とは上下逆さまに配置してマイクロミキサの下方から液体を注入し上方から液体を注出してもよい。   In the above-described embodiment, the upper cover plate 14, the premixing substrate 12, the plurality of substrates 10, the lower cover plate 16 and the like constituting the micromixer are arranged in this order from top to bottom. The liquid is injected from above the micromixer, and the liquid is poured out from below. However, since each through hole 20 of the substrate 10 is very fine, an interfacial tension acts on the liquid. Therefore, even if the liquid is not necessarily injected from above and the liquid is not poured from below, the inside of the micromixer is not affected. It is possible for the liquid to flow. For example, with the micromixer placed horizontally, the liquid is injected from the left side of the micromixer and the liquid is poured out from the right side, or the micromixer is placed upside down from FIG. 1 and the liquid is injected from below the micromixer. The liquid may be poured out from above.

この発明の実施形態の1例を示し、マイクロミキサの主要部の概略構成を示す分解斜視図である。1 is an exploded perspective view showing a schematic configuration of a main part of a micromixer according to an embodiment of the present invention. 図1に示したマイクロミキサの構成要素である複数枚の基板の部分拡大縦断面図である。It is the elements on larger scale of the several board | substrate which is a component of the micromixer shown in FIG. 図1に示したマイクロミキサの、積層された複数枚の基板における有底孔、貫通孔および連絡通路の平面的配置を説明するための平面図である。It is a top view for demonstrating planar arrangement | positioning of a bottomed hole, a through-hole, and a communicating path in the laminated | stacked several board | substrate of the micromixer shown in FIG. 同じく、図1に示したマイクロミキサの、積層された複数枚の基板における有底孔、貫通孔および連絡通路の平面的配置を説明するための図であって、基板を透視した状態で有底孔、貫通孔および連絡通路を示す平面図である。Similarly, it is a figure for demonstrating planar arrangement | positioning of the bottomed hole in the some laminated | stacked board | substrate of the micromixer shown in FIG. 1, a through-hole, and a communicating path, Comprising: It is a top view which shows a hole, a through-hole, and a communicating path. 図1ないし図4に示した基板の有底孔とは異なる形状の有底孔を示す、図3と同様の平面図である。FIG. 5 is a plan view similar to FIG. 3 showing a bottomed hole having a shape different from the bottomed hole of the substrate shown in FIGS. 1 to 4. 積層された複数枚の基板における図5に示した有底孔、貫通孔および連絡通路の平面的配置を説明するための図であって、基板を透視した状態で有底孔、貫通孔および連絡通路を示す平面図である。FIG. 6 is a diagram for explaining a planar arrangement of the bottomed hole, the through hole, and the communication passage shown in FIG. 5 in a plurality of stacked substrates, and shows the bottomed hole, the through hole, and the communication in a state where the substrate is seen through. It is a top view which shows a channel | path. 図1ないし図4に示した基板の有底孔とは異なる形状の有底孔の別の例を示す、図3と同様の平面図である。FIG. 5 is a plan view similar to FIG. 3, showing another example of a bottomed hole having a shape different from the bottomed hole of the substrate shown in FIGS. 1 to 4. 積層された複数枚の基板における図7に示した有底孔、貫通孔および連絡通路の平面的配置を説明するための図であって、基板を透視した状態で有底孔、貫通孔および連絡通路を示す平面図である。FIG. 8 is a diagram for explaining a planar arrangement of the bottomed hole, the through hole, and the communication passage shown in FIG. 7 in a plurality of stacked substrates, and shows the bottomed hole, the through hole, and the communication in a state where the substrate is seen through. It is a top view which shows a channel | path. この発明の別の実施形態を示し、マイクロミキサの一部の概略構成を示す分解斜視図である。FIG. 5 is an exploded perspective view showing a schematic configuration of a part of a micromixer according to another embodiment of the invention. 図9に示したマイクロミキサの部分拡大縦断面図である。FIG. 10 is a partially enlarged longitudinal sectional view of the micromixer shown in FIG. 9.

符号の説明Explanation of symbols

10、68、70 基板
12 予備混合用基板
14 上部カバー板
16 下部カバー板
18、18a、18b、18c、56a、56b、56c、62a、62b、62c、74 有底孔
20、20a、20b、20c、58a、58b、58c、64a、64b、64c、76、80 貫通孔
22、22a、22b、22c、60a、60b、60c、66a、66b、66c、78 連絡通路
24、26 液体供給口
28、30 液体排出口
32、34 液体流路
36 混合流路
38、40 排出流路
42、44 液体供給通路
46、48 液体供給管
50 凹部
52 液体排出通路
54 液体排出管
72 中間合流用基板
82 大形透孔
10, 68, 70 Substrate 12 Premixing substrate 14 Upper cover plate 16 Lower cover plate 18, 18a, 18b, 18c, 56a, 56b, 56c, 62a, 62b, 62c, 74 Bottomed holes 20, 20a, 20b, 20c , 58a, 58b, 58c, 64a, 64b, 64c, 76, 80 Through hole 22, 22a, 22b, 22c, 60a, 60b, 60c, 66a, 66b, 66c, 78 Connecting passage 24, 26 Liquid supply port 28, 30 Liquid outlet 32, 34 Liquid passage 36 Mixing passage 38, 40 Discharge passage 42, 44 Liquid supply passage 46, 48 Liquid supply pipe 50 Recess 52 Liquid discharge passage 54 Liquid discharge pipe 72 Intermediate confluence substrate 82 Large transparent Hole

Claims (3)

複数種類の流体を混合するマイクロミキサにおいて、
主面に複数個の有底孔が形成されるとともに、各有底孔の周囲にそれぞれ複数個の貫通孔が、前記主面と前記主面とは反対側の反対面とを貫通するように形成され、各有底孔の周縁部とその周囲の貫通孔とを流路的に接続する連絡通路がそれぞれ形成された基板を複数枚、所定の基板の貫通孔が当該基板の反対面側に隣接する基板の有底孔に連通するように積層させて互いに密着させ、流体が複数の基板それぞれの主面側から反対面側へ順次流動しながら合流および分流を繰り返すようにしたことを特徴とするマイクロミキサ。
In a micromixer that mixes multiple types of fluids,
A plurality of bottomed holes are formed on the main surface, and a plurality of through holes are formed around each bottomed hole so as to pass through the main surface and the opposite surface opposite to the main surface. A plurality of substrates each having a communication passage connecting the peripheral edge of each bottomed hole and the surrounding through-holes in a flow path are formed on the opposite side of the substrate. It is characterized by being laminated so as to communicate with the bottomed holes of adjacent substrates and closely contacting each other, and repeating the merging and splitting while the fluid sequentially flows from the main surface side to the opposite surface side of each of the plurality of substrates. Micromixer to play.
積層された複数枚の基板と別の積層された複数枚の基板との間に、基板の複数個の貫通孔を通って流入する流体を合流させるための1つもしくは複数の大形透孔が形成された中間合流用基板が介挿された請求項1に記載のマイクロミキサ。 One or a plurality of large through holes for joining the fluid flowing in through the plurality of through holes of the substrate between the plurality of stacked substrates and the other plurality of stacked substrates. The micromixer according to claim 1, wherein the formed intermediate junction substrate is inserted. 複数種類の流体の注入口が設けられるカバー板と最上層の基板との間に、複数種類の流体を予備混合するための混合流路が形設された予備混合用基板が介挿された請求項1または請求項2に記載のマイクロミキサ。 A premixing substrate in which a mixing channel for premixing a plurality of types of fluids is inserted between a cover plate provided with a plurality of types of fluid inlets and the uppermost substrate. Item 3. The micromixer according to item 1 or 2.
JP2005150299A 2005-05-24 2005-05-24 Micro mixer Pending JP2006326408A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121020A (en) * 2009-12-14 2011-06-23 Isel Co Ltd Mixing element, mixing device, mixing method, stirring blade, stirring device, and stirring method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011121020A (en) * 2009-12-14 2011-06-23 Isel Co Ltd Mixing element, mixing device, mixing method, stirring blade, stirring device, and stirring method

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