JP2006315901A - Method and apparatus for cutting and splitting glass substrate - Google Patents

Method and apparatus for cutting and splitting glass substrate Download PDF

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JP2006315901A
JP2006315901A JP2005139616A JP2005139616A JP2006315901A JP 2006315901 A JP2006315901 A JP 2006315901A JP 2005139616 A JP2005139616 A JP 2005139616A JP 2005139616 A JP2005139616 A JP 2005139616A JP 2006315901 A JP2006315901 A JP 2006315901A
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glass substrate
cutting line
cutting
cutter
dividing
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JP4907104B2 (en
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Akira Shirai
明 白井
Kiyotaka Yamato
清孝 大和
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Shirai Tech Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently carry out a series of work of supplying a large sized glass substrate, cutting it into large pieces and cutting into small pieces of a product size. <P>SOLUTION: The glass substrate X having a film surface on the upper surface is transported to a fixed position on a 1st table A. A 1st cutting line is formed on the lower surface of the glass by traveling a 1st cutter 3 at least on one line of a traveling path 2 along the glass substrate carrying in direction on the 1st table. The glass substrate is conveyed by a prescribed length onto a 2nd table in front of the 1st table and a 2nd cutting line crossing the 1st cutting line is formed on the lower surface of the glass substrate by a 2nd cutter traveling between the 1st table and the 2nd table. After that, the glass substrate is split by applying stress right on the 2nd cutting line by a 1st splitting means. The split large piece of the glass substrate is taken out by a taking-out means and after being turned by 90° by a turning means on the way of the taking-out, the large piece glass substrate reaching a splitting position is split by applying the stress of a 2nd splitting means 41 right on the 1st cutting line of the large piece glass substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、大判なガラス基板に大割の切断線を入れて大割し、この大割したガラス基板に小割の切断線を入れて製品サイズに小割するガラス基板の切断、分断方法及びその装置に関する。   The present invention relates to a method for cutting and dividing a glass substrate by dividing a large glass substrate with a large cutting line and dividing the large glass substrate with a small cutting line to make a product size. It relates to the device.

大判なガラス基板（片面に膜を設けてある例えば液晶パネル）から製品サイズのガラス基板を得るには、ガラス基板の膜のない面、すなわち、下面に切断線を入れたのち、ガラス基板の上面に応力を加えて割断する（特許文献１）。   In order to obtain a product-sized glass substrate from a large glass substrate (for example, a liquid crystal panel provided with a film on one side), a cutting line is made on the surface of the glass substrate without a film, that is, the lower surface, and then the upper surface of the glass substrate. The material is cleaved by applying stress (Patent Document 1).

また、切断線を入れたガラス基板は、ガラス基板の保持ステージの切断線の片側を上昇方向に傾動しながら、切断線を分断して大割する（特許文献２）。
特開平８−１３３７７４号公報 特開平８−２８３０３３号公報 Moreover, the glass substrate into which the cutting line is put is divided by cutting the cutting line while tilting one side of the cutting line of the holding stage of the glass substrate in the upward direction (Patent Document 2).
JP-A-8-133774 JP-A-8-283033

ところで、特許文献１の割断方法は、テーブル上にガラスパネルを載置したのち、テーブルに沿って移動するカッタによってガラスパネルの下面でテーブルにより覆われない部分にカッタによりガラスパネルの一端縁から他端縁にまで達するように条痕を形成し、次いでガラスパネルの上面側から上記条痕の形成部分に応力を加えて大割割断する方式のため、大判なガラスパネルから大割パネルの分断のみで、大割パネルをさらに製品サイズの小割パネルに分断するには、次の小割加工機（条痕加工及び応力を加える割断加工を行なう）に搬入しなければならない。   By the way, the cleaving method of Patent Document 1 is such that after placing the glass panel on the table, the cutter moves from the one end edge of the glass panel to the portion that is not covered by the table on the lower surface of the glass panel. Since the striations are formed so as to reach the edge, and then the crevice formation is performed by applying stress to the formation of the streaks from the upper surface side of the glass panel, only the division of the large panel from the large glass panel. In order to further divide the large panel into product-sized small panels, it must be carried into the next small cutting machine (which performs streaking and cleaving that applies stress).

このため、大割から小割迄の加工能率が著しく低下すると共に、大割と小割の二台の加工機を必要とするため、設備費が大幅に高騰する問題もあった。   For this reason, the machining efficiency from the large part to the small part is remarkably lowered, and two processing machines, a large part and a small part, are required, so that there is a problem that the equipment cost is significantly increased.

また、特許文献２のガラス基板のカット方法は、ガラス基板の電極パターンの形成されていない面を吸着保持すると共に、保持状況下に保持側面にスクライブラインを入れたのち、カット位置の両側を吸着保持ステージの上昇傾動により相対的に折り曲げて大割分割する方式のため、大割から製品サイズの小割迄の一連の分断が一台の加工機ではできない。   In addition, the glass substrate cutting method of Patent Document 2 sucks and holds the surface of the glass substrate where the electrode pattern is not formed, and puts a scribe line on the holding side surface under the holding state, and sucks both sides of the cutting position. Because of the method of relatively bending and dividing into large parts by ascending tilt of the holding stage, a series of divisions from a large part to a small part of the product size cannot be performed with a single processing machine.

このため、大割、小割の二台の加工機が必要になると共に、大幅な能率低下やコストのアップになるなどの問題が発生した。   For this reason, two processing machines, large and small, are required, and problems such as a significant reduction in efficiency and an increase in cost have occurred.

そこで、この発明は、大判なガラス基板を供給することで、まず切断線（スクライブライン）を入れて、この切断線の部分を分断して大割ガラス基板に分割し、この分割された大割ガラス基板に切断線（スクライブライン）を入れて、この切断線の部分を分断して製品サイズの小割ガラス基板に分割するようにしたガラス基板の切断、分断装置を提供する。   Therefore, the present invention supplies a large glass substrate, first puts a cutting line (scribe line), divides the cutting line portion and divides it into a large glass substrate. Provided is a glass substrate cutting and cutting apparatus in which a cutting line (scribe line) is inserted into a glass substrate, and the portion of the cutting line is divided to divide into a small glass substrate having a product size.

上記の課題を解決するために、この発明は、第１テーブル上の定位置に上面に膜面を有するガラス基板を搬入したのち、上記第１テーブルのガラス基板搬入方向に沿う少なくとも１条の走行路内の第１カッタの走行により前記ガラスの下面に第１切断線を入れ、次いで前方の第２テーブル上に搬出手段により、上記ガラス基板を所定の長さ搬出後、上記第１テーブルと第２テーブルとの間で走行する第２カッタによりガラス基板の下面に上記第１切断線を横切る第２切断線を入れ、その後に上記第２切断線の直上に第１分断手段の応力を加えて分断し、分断された大割ガラス基板を搬出手段により搬出し、搬出途中に大割ガラス基板を旋回手段により９０度旋回したのち、分断位置に到達した上記大割ガラス基板の第１切断線の直上に第２分断手段の応力を加えて分断することを特徴とするガラス基板の切断、分断方法を採用する。   In order to solve the above-mentioned problems, the present invention carries at least one run along the glass substrate loading direction of the first table after loading a glass substrate having a film surface on the upper surface at a fixed position on the first table. A first cutting line is made on the lower surface of the glass by traveling of the first cutter in the road, and then the glass substrate is unloaded for a predetermined length by the unloading means on the second table in front, and then the first table and the first table. A second cutting line that crosses the first cutting line is put on the lower surface of the glass substrate by a second cutter that travels between two tables, and then the stress of the first dividing means is applied immediately above the second cutting line. The divided glass substrate is unloaded by the unloading means, and the unfolded glass substrate is turned 90 degrees by the turning means in the middle of unloading, and then the first cutting line of the above-mentioned broken glass substrate that has reached the dividing position. The second minute directly above Cutting of the glass substrate, which comprises dividing by adding stress means, adopting the cutting method.

また、上面に膜面を有するガラス基板を荷受けする第１テーブルと、この第１テーブルに上記ガラス基板を定位置迄の搬入及び上記第１テーブルの前方に設けてある第２テーブル上への搬入をするように設けた第１搬送手段と、上記第１テーブルに上記ガラス基板の搬入方向に沿う少なくとも１条の走行路内で往復走行すると共に、前記ガラス基板の下面前後縁間に第１切断線を入れるように設けた第１カッタと、上記第１テーブルと第２テーブルとの間で往復走行すると共に、上記ガラス基板の両側縁間に第２切断線を入れるように設けた第２カッタと、この第２切断線に上方から応力を加えて分断するように設けた第１分断手段と、第１テーブル上の大割ガラス基板を前方に搬送するように設けた第２搬送手段と、この第２搬送手段により搬送された上記大割ガラス基板を荷受け、荷受け後に９０度旋回させるように設けた旋回装置と、この旋回した大割ガラス基板を搬出するように設けた第３搬送手段と、この第３搬送手段により搬出した上記停止時の大割ガラス基板の第１切断線に上方から応力を加えて分断するように設けた第２分断手段とからなるガラス基板の切断、分断装置を採用する。   Also, a first table for receiving a glass substrate having a film surface on the upper surface, and carrying the glass substrate to a fixed position on the first table and carrying it onto a second table provided in front of the first table. And a first cutting means between the front and rear edges of the lower surface of the glass substrate, and a reciprocating travel in at least one travel path along the loading direction of the glass substrate to the first table. A first cutter provided so as to insert a wire, and a second cutter provided so as to reciprocate between the first table and the second table and to insert a second cutting line between both side edges of the glass substrate. And a first dividing means provided to apply a stress to the second cutting line from above, and a second conveying means provided to convey the large glass substrate on the first table forward, By this second transport means Receiving the above-mentioned large glass substrate conveyed, swiveling device provided to turn 90 degrees after receiving, third conveying means provided to carry out the swiveled large glass substrate, this third conveying means A glass substrate cutting and cutting apparatus comprising a second cutting means provided to apply a stress from above to the first cutting line of the large glass substrate at the time of stopping carried out by the above is adopted.

すると、大判なガラス基板を供給することで、第１カッタにより第１切断線を入れ、次いで第２カッタにより第１切断線を横切る第２切断線を入れ、この第２切断線を分断して大割ガラス基板を得る。   Then, by supplying a large glass substrate, a first cutting line is put by the first cutter, then a second cutting line crossing the first cutting line is put by the second cutter, and the second cutting line is divided. A large glass substrate is obtained.

そして、得られた大割ガラス基板を搬出し、かつ搬出途中に９０度旋回したのち、第１切断線を分断して製品サイズの小割ガラス基板を一台の機械で能率よく得る。   And after carrying out the obtained large glass substrate and turning 90 degree | times in the middle of carrying out, a 1st cutting line is parted and the small glass substrate of a product size is efficiently obtained with one machine.

以上のように、この発明のガラス基板の切断、分断方法及びその装置によれば、一枚の大判なガラス基板に製品サイズの小割用の第１切断線を入れ、次いでガラス基板に大割用の第２切断線を入れて、この第２切断線を分断して大割ガラス基板に分断し、この分断した大割ガラス基板を搬出しながら、まず９０度旋回し、次いで分断位置に送り込んで第１切断しながら製品サイズの小割ガラス基板に分断する一連の作業を一台の機械で行なうことができる。   As described above, according to the method and apparatus for cutting and dividing a glass substrate according to the present invention, a first cutting line for a product size is placed on one large glass substrate, and then the glass substrate is roughly divided. A second cutting line is inserted, and the second cutting line is divided into large glass substrates, and then the divided large glass substrate is unloaded and turned 90 degrees first, and then sent to the dividing position. Thus, a series of operations for dividing into a small glass substrate having a product size while performing the first cutting can be performed by one machine.

このため、切断線を入れて大判なガラス基板から大割ガラス基板を分断し、この分断しした大割ガラス基板に切断線を入れ、次に切断線を分断して製品サイズの小割ガラス基板とする大幅な能率低下をまねく二台の機械が不要になると共に、著しい能率の向上をはかる効果がある。   For this reason, a cutting glass is used to divide a large glass substrate from a large glass substrate, a cutting line is inserted into the divided large glass substrate, and then the cutting line is divided to produce a small glass substrate of a product size. This eliminates the need for two machines that cause a significant reduction in efficiency and significantly improves efficiency.

また、膜面を上側にしてガラス基板の裏面（下面）に大割、小割用の切断線を入れると共に、膜面の分断応力作用面を無接触で処理できるので、膜面の汚れや傷がつくようなこともない。   In addition, with the film surface facing upward, cutting lines for large and small portions are placed on the back surface (bottom surface) of the glass substrate, and the dividing stress acting surface of the film surface can be processed without contact. There's no such thing as

以下、この発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

この発明の実施形態では、図１から図６に示すように、ローラコンベヤ１により第１テーブルＡに搬入するガラス基板Ｘは、第１テーブルＡに設けてある第１搬送手段Ｄにより前方の定位置迄送り込まれ、この送り込んだガラス基板Ｘを数値制御により大割ガラス基板Ｙに見合う長さ順次送り出されるようになっている。   In the embodiment of the present invention, as shown in FIGS. 1 to 6, the glass substrate X carried into the first table A by the roller conveyor 1 is fixed in front by the first transport means D provided on the first table A. The glass substrate X is fed to the position, and the fed glass substrate X is sequentially sent out by the numerical control to the length corresponding to the large glass substrate Y.

そして、第１テーブルＡ上に搬入したガラス基板Ｘは、第１テーブルＡに設けてある搬入方向に沿う少なくとも１条の走行路２内で往復走行する第１カッタ３によりガラス基板Ｘの下面に小割用の第１切断線４が入るようになっている。   And the glass substrate X carried in on the 1st table A is made into the lower surface of the glass substrate X by the 1st cutter 3 which reciprocates in the at least 1 running path 2 along the carrying-in direction provided in the 1st table A. A first cutting line 4 for splitting is inserted.

勿論、第１カッタ３は、小割の枚数に応じて（図示１条から２条など）増設することもある。   Of course, the first cutter 3 may be added according to the number of pieces (one or two in the figure).

上記の第１搬送手段Ｄは、例えば図３に示すように、第１テーブルＡの両側部にガラス基板Ｘの搬入方向に沿う走行路５を設けて、この走行路５の両端に片方をモーター（図示省略）により可逆駆動するスプロケット６と、このスプロケット６間にかけ渡したタイミングベルトなどの無端体７と、この無端体７に据え付けたシリンダ８の伸長作用により上昇してガラス基板Ｘの下面（膜のない裏面）を吸引する吸盤９とで構成し、吸盤９によるガラス基板Ｘの下面を吸引したのち、無端体７を走行させてガラス基板Ｘを搬入、搬出するようにしたが、その他の構成によって目的を達成するようにしてもよい。   For example, as shown in FIG. 3, the first transport means D is provided with a traveling path 5 along the loading direction of the glass substrate X on both sides of the first table A, and one motor is provided at both ends of the traveling path 5. The sprocket 6 reversibly driven (not shown), the endless body 7 such as a timing belt spanned between the sprockets 6, and the cylinder 8 installed on the endless body 7 are lifted by the extending action to lower the bottom surface of the glass substrate X ( The suction plate 9 sucks the back surface without the film), and after sucking the lower surface of the glass substrate X by the suction cup 9, the endless body 7 is moved to carry the glass substrate X in and out. You may make it achieve the objective by structure.

上記の走行路２内で往復走行する第１カッタ３は、図２に示すように、モーター１０により可逆駆動する定位置での軸承雄ネジ１１と、ガイドレール１２により不回転状態にして雄ネジ１１にねじ込む雌ネジ１３と、この雌ネジ１３の上面に据え付けたシリンダ１４の伸長作用により上昇してガラス基板Ｘの下面に第１カッタ３を押し付けると共に、押し付け状態を維持しながらモーター１０の正転運転により雄ネジ１１をドライブしながら、雌ネジ１３を前進させながら第１切断線４を入れるようにしてある。   As shown in FIG. 2, the first cutter 3 that reciprocates in the traveling path 2 has a male screw 11 in a non-rotating state with a bearing male screw 11 at a fixed position that is reversibly driven by a motor 10 and a guide rail 12. 11 and the cylinder 14 installed on the upper surface of the female screw 13 is lifted by the extending action to press the first cutter 3 against the lower surface of the glass substrate X, and the motor 10 is adjusted while maintaining the pressed state. While driving the male screw 11 by rolling operation, the first cutting line 4 is inserted while the female screw 13 is advanced.

上記の走行路２、５は、図示の場合並列四枚のテーブルを並べて、センターに第１カッタ３用の一本の走行路２を、両サイドに吸盤９用の計二本の走行路５を設けたが、並列間隙にかえて第１テーブルＡに上下面が開放する長孔を設けて、この長孔内で第１カッタ３、吸盤９を走行させてもよい。   In the illustrated case, the traveling paths 2 and 5 are arranged in parallel with four tables, one traveling path 2 for the first cutter 3 at the center and two traveling paths 5 for the suction cups 9 on both sides. However, instead of the parallel gap, a long hole whose upper and lower surfaces are opened may be provided in the first table A, and the first cutter 3 and the suction cup 9 may be run in the long hole.

なお、ガラス基板Ｘの下面に第１切断線４を入れる要因は、液晶パネルなどのガラス基板Ｘの上面（表面）に膜（電極パターンなどの）が設けてあることによる。   The reason for putting the first cutting line 4 on the lower surface of the glass substrate X is that a film (such as an electrode pattern) is provided on the upper surface (front surface) of the glass substrate X such as a liquid crystal panel.

また、第１テーブルＡの搬出端両側部にシリンダ１５の伸長作用により上方に突出させるストッパ１６を設けて、このストッパ１６にガラス基板Ｘの搬入方向辺縁を当接させて、搬入したガラス基板Ｘの停止位置決めを行なうようにしてある。   In addition, a stopper 16 is provided on both sides of the carry-out end of the first table A so as to protrude upward by the extension action of the cylinder 15, and the glass substrate X carried in is brought into contact with the stopper 16 at the edge in the carry-in direction of the glass substrate X. X stop positioning is performed.

そして、周知のように（図示のように）、両ストッパ１６の手前上方にカメラ１７、１７を配置して、カメラ１７、１７によりガラス基板Ｘの搬入先行辺の両角の印（図示省略）を読み取って第１切断線４を入れる正確な位置決めを、第１テーブルＡの下面中心の旋回軸１８の時計、反時計方向の駆動により修正するように（第１のテーブルＡの旋回にかえて、第１カッタ３の走行ラインを変更してもよい）なっている。   Then, as is well known (as shown), the cameras 17 and 17 are arranged in front of the stoppers 16 and both corners (not shown) of the leading edge of the glass substrate X are introduced by the cameras 17 and 17. Correct positioning by reading and inserting the first cutting line 4 is corrected by driving the pivot shaft 18 at the center of the lower surface of the first table A in the clockwise and counterclockwise directions (instead of pivoting the first table A, The travel line of the first cutter 3 may be changed).

さらに、図示のように、第１テーブルＡを中空のボックスとし、かつ頂壁に小孔１９群を設けてボックス内の吸引により第１テーブルＡにガラス基板Ｘを吸引保持する。   Further, as shown in the figure, the first table A is a hollow box, and a small hole 19 group is provided on the top wall, and the glass substrate X is sucked and held on the first table A by suction in the box.

すると、切断線を入れる加工時のガラス基板Ａの移動をなくすることができる。   Then, the movement of the glass substrate A at the time of the process which puts a cutting line can be eliminated.

また、第１テーブルＡの前方に第２テーブルＢを設けると共に、この第１テーブルＡと第２テーブルＢとの間には、第１テーブルＡ上から第２テーブルＢ上に所定の長さ搬出され、搬出停止後のガラス基板Ｘの下面に第１切断線４に対し直角に交差する第２切断線２１を入れる往復走行の第２カッタ２２が設けてある。   In addition, a second table B is provided in front of the first table A, and a predetermined length is carried out from the first table A to the second table B between the first table A and the second table B. In addition, a second cutter 22 for reciprocating is provided on the lower surface of the glass substrate X after the carry-out is stopped, and a second cutting line 21 that intersects the first cutting line 4 at a right angle.

上記第２カッタ２２の往復走行の構成は、第１カッタ３の往復走行の構成と同様につき説明を省略する。   The configuration of the reciprocating travel of the second cutter 22 is the same as that of the reciprocating travel of the first cutter 3, and the description thereof is omitted.

さらに、第２カッタ２２の走行ラインの上側には、ガラス基板Ｘの第２切断線２１上に応力を加えて第２切断線２１の部分を分断する第１分断手段２３が設けてある。   Further, on the upper side of the travel line of the second cutter 22, first dividing means 23 is provided for applying stress on the second cutting line 21 of the glass substrate X to divide the portion of the second cutting line 21.

上記の第１分断手段２３は、図２、４、５に示すように、ガイド軸２４によりガイドされて昇降する水平な折割バー材２５と、この折割バー材２５を昇降するシリンダ２６とで構成され、シリンダ２６の伸長作用によって降送する折割バー材２５をガラス基板Ｘの上面第２切断線２１の直上に押し付けながら応力を加えて第２切断線２１を分断する。   As shown in FIGS. 2, 4, and 5, the first dividing means 23 includes a horizontal folding bar member 25 that is guided by a guide shaft 24 and moves up and down, and a cylinder 26 that lifts and lowers the folding bar member 25. The second cutting line 21 is divided by applying stress while pressing the folding bar member 25 that is lowered by the extending action of the cylinder 26 directly above the upper surface second cutting line 21 of the glass substrate X.

すると、ガラス基板Ｘから大割ガラス基板Ｙを分割する。   Then, the large glass substrate Y is divided from the glass substrate X.

上記の分断された第２テーブルＢ上の大割ガラス基板Ｙは、第２テーブルＢの第１テーブルＡ側辺縁から前途中迄の前半第２搬送手段Ｅによって搬出されて荷受けすると共に、荷受後に９０度の旋回手段３１に旋回させる。   The large glass substrate Y on the divided second table B is unloaded and received by the first half second conveying means E from the first table A side edge of the second table B to the front halfway. Later, the turning means 31 is turned 90 degrees.

上記の旋回手段３１は、図１、６に示すように、第２テーブルＢの中間中央にモーター３２の運転により９０度回転し、かつシリンダ３３の作用により昇降する回転軸３４の上端旋回座３５の上面に吸盤３６を設けて構成し、旋回座３５の直上に大割ガラス基板Ｙが搬入されると、シリンダ３３の伸長作用により旋回座３５を上昇させて大割ガラス基板Ｙの下面に吸盤３６を当接し、次いでモーター３２の運転により回転軸３４を９０度回転させて、大割ガラス基板Ｙを旋回する。   As shown in FIGS. 1 and 6, the turning means 31 is rotated 90 degrees by the operation of the motor 32 in the middle center of the second table B and is moved upward and downward by the action of the cylinder 33, and the upper turning seat 35 of the rotating shaft 34. The suction glass 36 is provided on the upper surface of the glass substrate Y. When the large glass substrate Y is loaded immediately above the swivel seat 35, the swivel seat 35 is raised by the extension action of the cylinder 33, and the suction glass is placed on the lower surface of the large glass substrate Y. Then, the rotary shaft 34 is rotated 90 degrees by the operation of the motor 32, and the large glass substrate Y is turned.

しかして、旋回後にシリンダ３３の収縮作用により回転軸３４と共に大割ガラス基板Ｙを降下させて、第２テーブルＢの途中から前方の第３テーブルＣの向う後半第２搬送手段Ｅ′に荷受け後搬出する。   Then, after turning, the large glass substrate Y is lowered together with the rotating shaft 34 by the contraction action of the cylinder 33, and after receiving the second half transfer means E 'facing the third table C ahead from the middle of the second table B. Take it out.

上記の前半搬送手段Ｅ及び後半搬送手段Ｅ′は、第１搬送手段Ｄと同形式を採用のため構成の説明を省略する。   The above-mentioned first half transport means E and second half transport means E ′ adopt the same format as the first transport means D, and the description of the configuration is omitted.

そして、第１分断手段２３により分断された大割ガラス基板Ｙを、前半搬送手段Ｅのシリンダ８の伸長作用により上昇する吸盤９により荷受けして搬送し、旋回座３５の直上に大割ガラス基板Ｙが到着すると、シリンダ３３の伸長作用により旋回座３５を上昇させて、大割ガラス基板Ｙの下面に吸盤３６を当接させて吸引する。   Then, the large glass substrate Y divided by the first dividing means 23 is received and conveyed by the suction cup 9 which is lifted by the extension action of the cylinder 8 of the first half conveying means E, and is conveyed immediately above the swivel seat 35. When Y arrives, the swivel seat 35 is raised by the extension action of the cylinder 33, and the suction cup 36 is brought into contact with the lower surface of the large glass substrate Y for suction.

上記の吸引後に、吸盤９による吸引を解除し、次いでシリンダ８の収縮作用により吸盤９を降下後、旋回の動作を行なう。   After the above suction, the suction by the suction cup 9 is released, and then the suction cup 9 is lowered by the contracting action of the cylinder 8, and then the turning operation is performed.

旋回後に、後半搬送手段Ｅ′の吸盤９をシリンダ８の伸長作用により上昇させて、吸引した吸盤９に大割ガラス基板Ｙを荷受けしたのち、シリンダ３３の収縮作用によって吸盤３６を降下する。   After the turn, the suction cup 9 of the second half transport means E ′ is raised by the extension action of the cylinder 8 and the large glass substrate Y is received by the sucked suction cup 9, and then the suction cup 36 is lowered by the contraction action of the cylinder 33.

しかして、後半搬送手段Ｅ′によって大割ガラス基板Ｙを搬出するようになっている。   Accordingly, the large glass substrate Y is unloaded by the latter half transport means E ′.

そして、第２テーブルＢと第３テーブルＣとの間に大割ガラス基板Ｙの第１切断線４が到着すると、第１切断線４の直上に設けてある第２分断手段４１により大割ガラス基板Ｙの上面第１切断線４の部分に応力を作用させる。   And when the 1st cutting line 4 of the large glass substrate Y arrives between the 2nd table B and the 3rd table C, the large glass is carried out by the 2nd dividing means 41 provided immediately above the 1st cutting line 4. Stress is applied to the portion of the upper surface first cutting line 4 of the substrate Y.

この応力の作用により大割ガラス基板Ｙを分断して、製品サイズの小割ガラス基板Ｚを得る。   The large glass substrate Y is divided by the action of the stress to obtain a small glass substrate Z having a product size.

上記の第２分断手段４１は、第１分断手段２３と同様につき構成並びに作用の説明を省略する。   Since the second dividing means 41 is the same as the first dividing means 23, the description of the configuration and operation is omitted.

また、第３テーブルＣを第１搬送手段Ｄや第２搬送手段Ｅ、Ｅ′と同様の第３搬送手段Ｆを設けて、小割ガラス基板Ｚを取り下ろすようにしたが、その他の手段で取り下ろすこともある。   Further, the third table C is provided with the third transport means F similar to the first transport means D and the second transport means E and E ′, and the small glass substrate Z is taken down, but other means are used. May be withdrawn.

なお、第２テーブルＢ及び第３テーブルＣを第１テーブルＡと同様に小孔１９群を設けて、エアーの噴出によりスムーズな搬送を行なうようにしてもよい。   The second table B and the third table C may be provided with a group of small holes 19 similarly to the first table A so as to perform smooth conveyance by blowing air.

次に前述の構成に基づいて図９の切断、分断工程図により切断、分断方法を説明する。   Next, based on the above-described configuration, the cutting and dividing method will be described with reference to the cutting and dividing process diagram of FIG.

図９の（イ）に示すように、第１テーブルＡの定位置に搬入したガラス基板Ｘは、まず第１カッタ３によりガラス基板Ｘの下面搬入方向辺縁と反対の辺縁との間に小割用（製品サイズ）の第１切断線４を入れる。   As shown in FIG. 9A, the glass substrate X carried into the fixed position of the first table A is first placed between the opposite edge of the glass substrate X in the lower surface loading direction by the first cutter 3. Insert the first cutting line 4 for splitting (product size).

次にガラス基板Ｘを大割寸法に見合う長さを前方に搬出したのち、第２カッタ２２によりガラス基板Ｘの下面に第１切断線４に交差する第２切断線２１を図９の（ロ）に示すように入れ、その後に第２切断線２１の部分の上面に第１分断手段２３により応力を加えて図９の（ハ）に示すように分断して、大割ガラス基板Ｙを得る。   Next, after the glass substrate X is carried forward to a length corresponding to the major dimension, a second cutting line 21 intersecting the first cutting line 4 is formed on the lower surface of the glass substrate X by the second cutter 22 in FIG. ), And thereafter, stress is applied to the upper surface of the portion of the second cutting line 21 by the first dividing means 23 and divided as shown in FIG. 9C to obtain a large glass substrate Y. .

この大割ガラス基板Ｙは、ガラス基板Ｘを順次送り出して分割する。   The large glass substrate Y sequentially feeds and divides the glass substrate X.

その後に大割ガラス基板Ｙを図９の実線から鎖線に示すように９０度旋回させて、次の第２分断手段４１の位置に図９の（ニ）に示すように第１切断線４が到達するように搬送後、第２分断手段４１により大割ガラス基板Ｙの上面第１切断線４の部分に応力を加えて分断する。   Thereafter, the large glass substrate Y is turned 90 degrees from the solid line in FIG. 9 as indicated by the chain line, and the first cutting line 4 is formed at the position of the next second dividing means 41 as shown in FIG. After conveying so as to reach, the second dividing means 41 divides the portion of the upper surface first cutting line 4 of the large glass substrate Y by applying stress.

すると、図９のホに示すように、製品サイズの小割ガラス基板Ｚを得ることができる。   Then, as shown in FIG. 9E, a small glass substrate Z having a product size can be obtained.

この発明の実施形態を示す平面図The top view which shows embodiment of this invention 同上の第１テーブルの部分を示す縦断拡大側面図Longitudinal enlarged side view showing a portion of the first table same as above 同縦断拡大側面図Same vertical enlarged side view 同上の縦断拡大正面図Longitudinal enlarged front view 第２、第３テーブルの部分を示す側面図Side view showing portions of second and third tables 同上の要部を示す縦断正面図Longitudinal front view showing the main part 切断線を入れる一部切欠拡大側面図Partial cutaway side view of cutting line 分断を示す一部切欠拡大側面図Partial cutaway enlarged side view showing segmentation 切断、分断の工程図Cutting and parting process diagram

符号の説明Explanation of symbols

Ｘ ガラス基板
Ｙ 大割ガラス基板
Ｚ 小割ガラス基板
Ａ 第１テーブル
Ｂ 第２テーブル
Ｃ 第３テーブル
Ｄ 第１搬送手段
Ｅ、Ｅ′ 第２搬送手段
Ｆ 第３搬送手段
１ ローラコンベヤ
２ 走行路
３ 第１カッタ
４ 第１切断線
５ 走行路
６ スプロケット
７ 無端体
８ シリンダ
９ 吸盤
１０ モーター
１１ 雄ネジ
１２ ガイドレール
１３ 雌ネジ
１４ シリンダ
１５ シリンダ
１６ ストッパ
１７ カメラ
１８ 旋回軸
１９ 小孔
２１ 第２切断線
２２ 第２カッタ
２３ 第１分断手段
２４ ガイド軸
２５ 折割バー材
２６ シリンダ
３１ 旋回手段
３２ モーター
３３ シリンダ
３４ 回転軸
３５ 旋回座
３６ 吸盤
４１ 第２分断手段 X glass substrate Y large glass substrate Z small glass substrate A first table B second table C third table D first conveying means E, E ′ second conveying means F third conveying means 1 roller conveyor 2 travel path 3 First cutter 4 First cutting line 5 Running path 6 Sprocket 7 Endless body 8 Cylinder 9 Suction cup 10 Motor 11 Male screw 12 Guide rail 13 Female screw 14 Cylinder 15 Cylinder 16 Stopper 17 Camera 18 Rotating shaft 19 Small hole 21 Second cutting line 22 Second cutter 23 First dividing means 24 Guide shaft 25 Folding bar material 26 Cylinder 31 Rotating means 32 Motor 33 Cylinder 34 Rotating shaft 35 Rotating seat 36 Suction cup 41 Second dividing means

Claims (2)

第１テーブル上の定位置に上面に膜面を有するガラス基板を搬入したのち、上記第１テーブルのガラス基板搬入方向に沿う少なくとも１条の走行路内の第１カッタの走行により前記ガラスの下面に第１切断線を入れ、次いで前方の第２テーブル上に搬出手段により、上記ガラス基板を所定の長さ搬出後、上記第１テーブルと第２テーブルとの間で走行する第２カッタによりガラス基板の下面に上記第１切断線を横切る第２切断線を入れ、その後に上記第２切断線の直上に第１分断手段の応力を加えて分断し、分断された大割ガラス基板を搬出手段により搬出し、搬出途中に大割ガラス基板を旋回手段により９０度旋回したのち、分断位置に到達した上記大割ガラス基板の第１切断線の直上に第２分断手段の応力を加えて分断することを特徴とするガラス基板の切断、分断方法。 After carrying in a glass substrate having a film surface on the upper surface at a fixed position on the first table, the lower surface of the glass is caused by running of the first cutter in at least one running path along the glass substrate loading direction of the first table. A first cutting line is inserted into the second table, and then the glass substrate is unloaded for a predetermined length by the unloading means on the front second table, and then the glass is moved by the second cutter that travels between the first table and the second table. A second cutting line that crosses the first cutting line is put on the lower surface of the substrate, and then divided by applying the stress of the first dividing means immediately above the second cutting line, and the divided large glass substrate is carried out. , And the major glass substrate is turned 90 degrees by the turning means in the middle of unloading, and then divided by applying the stress of the second dividing means immediately above the first cutting line of the larger glass substrate that has reached the dividing position. With features Glass cutting of the substrate, cutting how. 上面に膜面を有するガラス基板を荷受けする第１テーブルと、この第１テーブルに上記ガラス基板を定位置迄の搬入及び上記第１テーブルの前方に設けてある第２テーブル上への搬入をするように設けた第１搬送手段と、上記第１テーブルに上記ガラス基板の搬入方向に沿う少なくとも１条の走行路内で往復走行すると共に、前記ガラス基板の下面前後縁間に第１切断線を入れるように設けた第１カッタと、上記第１テーブルと第２テーブルとの間で往復走行すると共に、上記ガラス基板の両側縁間に第２切断線を入れるように設けた第２カッタと、この第２切断線に上方から応力を加えて分断するように設けた第１分断手段と、第１テーブル上の大割ガラス基板を前方に搬送するように設けた第２搬送手段と、この第２搬送手段により搬送された上記大割ガラス基板を荷受け、荷受け後に９０度旋回させるように設けた旋回装置と、この旋回した大割ガラス基板を搬出するように設けた第３搬送手段と、この第３搬送手段により搬出した上記停止時の大割ガラス基板の第１切断線に上方から応力を加えて分断するように設けた第２分断手段とからなるガラス基板の切断、分断装置。 A first table for receiving a glass substrate having a film surface on the upper surface, and carrying the glass substrate to a fixed position on the first table and a second table provided in front of the first table. The first conveying means provided as described above, and the first table reciprocally travels in at least one running path along the loading direction of the glass substrate, and a first cutting line is formed between the front and rear edges of the lower surface of the glass substrate. A first cutter provided to enter, and a second cutter provided to reciprocate between the first table and the second table and to insert a second cutting line between both side edges of the glass substrate, A first dividing means provided so as to divide the second cutting line by applying stress from above; a second conveying means provided to convey the large glass substrate on the first table forward; Transported by 2 transport means The swivel device provided to receive the large glass substrate received and swivel 90 degrees after receiving, the third transport means provided to carry out the swiveled large glass substrate, and the third transport means A glass substrate cutting and dividing apparatus comprising second dividing means provided to apply a stress from above to the first cutting line of the large glass substrate at the time of stopping that has been unloaded.
JP2005139616A 2005-05-12 2005-05-12 Glass substrate cutting and dividing method and apparatus Expired - Fee Related JP4907104B2 (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100901818B1 (en) 2007-10-26 2009-06-09 주식회사 에스에프에이 Glass cutting system
EP2100860A2 (en) * 2008-03-13 2009-09-16 Macotec S.R.L. Machine for cutting glass sheets in general and laminated glass sheets in particular
US8323797B2 (en) 2007-02-22 2012-12-04 Dow Corning Corporation Composite article having excellent fire and impact resistance and method of making the same
KR20140056162A (en) 2011-09-02 2014-05-09 니폰 덴키 가라스 가부시키가이샤 Device for splitting sheet glass
KR20140057198A (en) 2011-09-02 2014-05-12 니폰 덴키 가라스 가부시키가이샤 Sheet glass goods separation device
CN106405887A (en) * 2016-06-13 2017-02-15 江西合力泰科技有限公司 Bar breaking device on liquid crystal display panel bar breaking equipment and bar breaking method for same
CN109384035A (en) * 2018-11-23 2019-02-26 博众精工科技股份有限公司 Middle breaking device
KR102064891B1 (en) 2017-08-29 2020-01-10 한국미쯔보시다이아몬드공업(주) Panel breaking device of brittle material substrate and panel breaking method using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185987A (en) * 2001-12-19 2003-07-03 Shirai Tekkosho:Kk Device for folding and dividing liquid crystal panel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185987A (en) * 2001-12-19 2003-07-03 Shirai Tekkosho:Kk Device for folding and dividing liquid crystal panel

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8323797B2 (en) 2007-02-22 2012-12-04 Dow Corning Corporation Composite article having excellent fire and impact resistance and method of making the same
KR100901818B1 (en) 2007-10-26 2009-06-09 주식회사 에스에프에이 Glass cutting system
EP2100860A2 (en) * 2008-03-13 2009-09-16 Macotec S.R.L. Machine for cutting glass sheets in general and laminated glass sheets in particular
EP2100860A3 (en) * 2008-03-13 2013-08-21 Macotec S.R.L. Machine for cutting glass sheets in general and laminated glass sheets in particular
KR20140056162A (en) 2011-09-02 2014-05-09 니폰 덴키 가라스 가부시키가이샤 Device for splitting sheet glass
KR20140057198A (en) 2011-09-02 2014-05-12 니폰 덴키 가라스 가부시키가이샤 Sheet glass goods separation device
CN106405887A (en) * 2016-06-13 2017-02-15 江西合力泰科技有限公司 Bar breaking device on liquid crystal display panel bar breaking equipment and bar breaking method for same
KR102064891B1 (en) 2017-08-29 2020-01-10 한국미쯔보시다이아몬드공업(주) Panel breaking device of brittle material substrate and panel breaking method using the same
CN109384035A (en) * 2018-11-23 2019-02-26 博众精工科技股份有限公司 Middle breaking device

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