JP2006311375A - 表面実装水晶発振器の実装方法 - Google Patents
表面実装水晶発振器の実装方法 Download PDFInfo
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- JP2006311375A JP2006311375A JP2005133487A JP2005133487A JP2006311375A JP 2006311375 A JP2006311375 A JP 2006311375A JP 2005133487 A JP2005133487 A JP 2005133487A JP 2005133487 A JP2005133487 A JP 2005133487A JP 2006311375 A JP2006311375 A JP 2006311375A
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- 239000013078 crystal Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 51
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 23
- 230000001737 promoting effect Effects 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/36—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator active element in amplifier being semiconductor device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
【構成】実装端子を底面に有する容器本体内にICチップと水晶片とを収容して密閉封入した表面実装用の水晶発振器備え、電子部品の搭載されるセット基板の回路端子に前記実装端子を電気的・機械的に接続して、前記水晶発振器を前記セット基板上に実装する水晶発振器の実装方法において、前記容器本体の外底面には前記ICチップと電気的に接続するチップコンデンサを装着し、前記セット基板に設けられた開口部内に前記コンデンサを埋設して、前記水晶発振器をセット基板上に実装した構成とする。
【選択図】図1
Description
本発明の請求項2に係る発明では、請求項1の前記チップコンデンサは、前記ICチップに集積化された温度補償機構の温度補償電圧を発生する補償電圧発生回路に接続して、前記温度補償電圧中の雑音成分を抑止するコンデンサと抵抗とからなるローパスフィルタの前記コンデンサとする。
上記実施例では、ローパスフィルタ7のコンデンサCの一方はアース電位に接続したが、例えば第2図に示したように、コンデンサCの両端を基準温度時に同電位とする電位設定回路20に接続してもよい(特許文献2参照)。電位設定回路20はICチップ11内の温度補償機構内に設けられる。この場合、コンデンサ自体の時定数による起動時の遅延を防止する効果がある。
Claims (2)
- 実装端子を底面に有する容器本体内にICチップと水晶片とを収容して密閉封入した表面実装水晶発振器を備え、電子部品の搭載されるセット基板の回路端子に前記実装端子を電気的・機械的に接続して、前記水晶発振器を前記セット基板上に実装する表面実装水晶発振器の実装方法において、前記容器本体の外底面には前記ICチップと電気的に接続するチップコンデンサを装着し、前記セット基板に設けられた開口部内に前記コンデンサを埋設して、前記水晶発振器をセット基板上に実装したことを特徴とする表面実装水晶発振器の実装方法。
- 前記チップコンデンサは、前記ICチップに集積化された温度補償機構の温度補償電圧を発生する補償電圧発生回路に接続して、前記温度補償電圧中の雑音成分を抑止するコンデンサと抵抗とからなるローパスフィルタの前記コンデンサである請求項1の表面実装水晶発振器の実装方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005133487A JP4713215B2 (ja) | 2005-04-28 | 2005-04-28 | 表面実装水晶発振器の実装方法 |
US11/380,585 US20060170510A1 (en) | 2005-04-28 | 2006-04-27 | Mounting structure and method of surface-mount crystal oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005133487A JP4713215B2 (ja) | 2005-04-28 | 2005-04-28 | 表面実装水晶発振器の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006311375A true JP2006311375A (ja) | 2006-11-09 |
JP4713215B2 JP4713215B2 (ja) | 2011-06-29 |
Family
ID=36755914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005133487A Expired - Fee Related JP4713215B2 (ja) | 2005-04-28 | 2005-04-28 | 表面実装水晶発振器の実装方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060170510A1 (ja) |
JP (1) | JP4713215B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194652A (ja) * | 2008-02-14 | 2009-08-27 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器及び電子カード用の基板 |
JP2010258946A (ja) * | 2009-04-28 | 2010-11-11 | Kyocera Kinseki Corp | 通信モジュール |
JP2014011663A (ja) * | 2012-06-29 | 2014-01-20 | Kyocera Crystal Device Corp | 圧電デバイス |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7602107B2 (en) * | 2005-11-30 | 2009-10-13 | Nihon Dempa Kogyo Co., Ltd. | Surface mount type crystal oscillator |
US9287882B2 (en) | 2013-11-07 | 2016-03-15 | Kyocera Crystal Device Corporation | Temperature compensated crystal oscillator |
JP2015122607A (ja) | 2013-12-24 | 2015-07-02 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
WO2015170484A1 (ja) * | 2014-05-07 | 2015-11-12 | 株式会社村田製作所 | 水晶振動装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000196356A (ja) * | 1998-12-28 | 2000-07-14 | Nippon Dempa Kogyo Co Ltd | 電圧制御型の水晶発振器 |
JP2001119244A (ja) * | 1999-10-21 | 2001-04-27 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
JP2002050928A (ja) * | 2000-08-01 | 2002-02-15 | Daishinku Corp | 圧電発振器 |
JP2002176318A (ja) * | 2000-09-27 | 2002-06-21 | Citizen Watch Co Ltd | 圧電発振器及びその実装構造 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6229404B1 (en) * | 1998-08-31 | 2001-05-08 | Kyocera Corporation | Crystal oscillator |
US6577490B2 (en) * | 2000-12-12 | 2003-06-10 | Ngk Spark Plug Co., Ltd. | Wiring board |
JP2004048600A (ja) * | 2002-07-15 | 2004-02-12 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶発振器 |
JP4271527B2 (ja) * | 2003-07-24 | 2009-06-03 | 日本電波工業株式会社 | 表面実装型の水晶発振器 |
-
2005
- 2005-04-28 JP JP2005133487A patent/JP4713215B2/ja not_active Expired - Fee Related
-
2006
- 2006-04-27 US US11/380,585 patent/US20060170510A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000196356A (ja) * | 1998-12-28 | 2000-07-14 | Nippon Dempa Kogyo Co Ltd | 電圧制御型の水晶発振器 |
JP2001119244A (ja) * | 1999-10-21 | 2001-04-27 | Nippon Dempa Kogyo Co Ltd | 水晶発振器 |
JP2002050928A (ja) * | 2000-08-01 | 2002-02-15 | Daishinku Corp | 圧電発振器 |
JP2002176318A (ja) * | 2000-09-27 | 2002-06-21 | Citizen Watch Co Ltd | 圧電発振器及びその実装構造 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009194652A (ja) * | 2008-02-14 | 2009-08-27 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器及び電子カード用の基板 |
JP2010258946A (ja) * | 2009-04-28 | 2010-11-11 | Kyocera Kinseki Corp | 通信モジュール |
JP2014011663A (ja) * | 2012-06-29 | 2014-01-20 | Kyocera Crystal Device Corp | 圧電デバイス |
Also Published As
Publication number | Publication date |
---|---|
US20060170510A1 (en) | 2006-08-03 |
JP4713215B2 (ja) | 2011-06-29 |
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