JP2006310215A - Thermal fuse - Google Patents

Thermal fuse Download PDF

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JP2006310215A
JP2006310215A JP2005133980A JP2005133980A JP2006310215A JP 2006310215 A JP2006310215 A JP 2006310215A JP 2005133980 A JP2005133980 A JP 2005133980A JP 2005133980 A JP2005133980 A JP 2005133980A JP 2006310215 A JP2006310215 A JP 2006310215A
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fusible alloy
thermal fuse
lead conductors
fusible
lead
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Noriyuki Katsumoto
憲幸 勝本
Hiroshi Nakajima
博司 中島
Masayuki Fukazawa
真之 深澤
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Anzen Dengu KK
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Anzen Dengu KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermal fuse surely fusing at a predetermined fusing point and showing a stable operation temperature. <P>SOLUTION: This thermal fuse includes: a pair of lead conductors 10a and 10b arranged facing each other by separating facing inner ends from each other; a pair of intermediate fusible alloy layers 12a and 12b, used as plated layers for covering surfaces of inner ends of the respective lead conductors 10a and 10b; and a fusible alloy body 13 used as an fuse element connecting both the lead conductors to each other, by welding both its ends to the pair of intermediate fusible alloy layers 12a and 12b at the facing inner ends of the lead conductors 10a and 10b. The intermediate fusible alloy layers 12a and 12b and the fusible alloy body 13 are formed of low-fusing-point fusible alloys, having the same component composition. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、周囲温度の異常な上昇により溶断する温度ヒューズ、特に、低融点の可溶合金体とリード導体との間に中間可溶合金層を有し、小型電子機器等の回路内に挿入して例えば２次電池の過充電や過放電時の異常温度上昇を検知して可溶合金体が溶断し、回路を遮断して電子機器等を保護する温度ヒューズに関する。   The present invention is a thermal fuse that blows due to an abnormal increase in ambient temperature, particularly an intermediate fusible alloy layer between a fusible alloy body having a low melting point and a lead conductor, and is inserted into a circuit of a small electronic device or the like. For example, the present invention relates to a temperature fuse that detects an abnormal temperature rise during overcharge or overdischarge of a secondary battery, melts a fusible alloy body, cuts off a circuit, and protects an electronic device or the like.

この種の公知の温度ヒューズとしては、例えば図３に示すヒューズが提案されている。このヒューズでは、絶縁性基体１の上に錫、銅、銀、金、ニッケル、亜鉛などの金属材料でなるメッキ層３ａ，３ｂが上面に設けられた一対の帯状のリード導体２ａ，２ｂの内端を所定間隔５で対向させて配置し、板状のヒューズエレメント４を二つのメッキ層３ａ，３ｂの間にまたがらせて溶接することにより、両リード導体２ａ，２ｂが接続される。ヒューズエレメント４は錫、ビスマス、インジウム等の低融点金属を単独で用いるか、またはそれらの複数の合金、例えば融点を９６℃とする錫とビスマスと鉛の３元素合金とする。
特開２００５−２６０３６号公報 As this type of known temperature fuse, for example, a fuse shown in FIG. 3 has been proposed. In this fuse, a pair of strip-shaped lead conductors 2a and 2b, in which plating layers 3a and 3b made of a metal material such as tin, copper, silver, gold, nickel, and zinc are provided on an insulating base 1, are provided on the upper surface. The ends of the lead conductors 2a and 2b are connected to each other by placing the ends facing each other at a predetermined interval 5 and welding the plate-like fuse element 4 across the two plated layers 3a and 3b. The fuse element 4 is made of a low melting point metal such as tin, bismuth, or indium, or a plurality of alloys thereof, for example, a three element alloy of tin, bismuth, and lead having a melting point of 96 ° C.
JP-A-2005-26036

上記した温度ヒューズにおいて、メッキ層３ａ，３ｂはリード導体２ａ，２ｂとヒューズエレメント４の間の溶接を確実にすることによって両者間の電気的な接続を良好かつ確実にすると共に、温度ヒューズとしては特に動作温度、つまり融点が安定であるという特性を示すことがメッキ層に求められる。しかし、上記の温度ヒューズにおいてはメッキ層３ａ，３ｂとヒューズエレメント４とは、錫以外は互いに異なる金属成分でなるため、両者間の溶接の際にこれらの互いに異なる金属材がメッキ層の組成とも、またヒューズエレメントの組成とも異なる不純物層として別の溶接層を形成することになり、この不純物層は実際に使用する金属成分に応じて不均一に生じるから、動作温度の安定化を図ることができないという課題が在る。   In the above-described thermal fuse, the plated layers 3a and 3b ensure good electrical connection between the lead conductors 2a and 2b and the fuse element 4 to ensure good electrical connection between them. In particular, the plating layer is required to exhibit a characteristic that the operating temperature, that is, the melting point is stable. However, in the above-described thermal fuse, the plated layers 3a and 3b and the fuse element 4 are made of different metal components except for tin. In addition, another weld layer is formed as an impurity layer different from the composition of the fuse element, and this impurity layer is unevenly generated according to the metal component actually used, so that the operation temperature can be stabilized. There is a problem that we cannot do it.

また、リード導体として銅、鉄、ニッケルなどを材料とするときは、その純度が高いと通常はそのままでは可溶合金をこのリード導体と効率よく溶接することが非常に困難である。そのため、一般に従来からリード導体の表面に錫、銀（一部を銅とする）、半田等によるメッキ層を形成し、このメッキ層を介してリード導体に可溶合金を溶接するようにしてきた。これは、溶接の過程で瞬時に高温加熱され、可溶合金とメッキ層の成分が混ざって新たな合金を作るので、電気的特性と機械的強度が良好で安定した溶接が得られるためである。しかし、互いに異なる融点の可溶合金の成分が微量でも存在すれば、これがメッキ層成分と混ざり合って可溶合金の融点、つまり温度ヒューズの動作温度に変化を生じ、結果として温度ヒューズの特性が確実性、信頼性を失う、と言う課題がある。   Further, when copper, iron, nickel or the like is used as the lead conductor, if the purity is high, it is usually very difficult to efficiently weld a soluble alloy to the lead conductor as it is. Therefore, in general, a plating layer made of tin, silver (partly copper), solder or the like has been conventionally formed on the surface of the lead conductor, and a soluble alloy has been welded to the lead conductor through this plating layer. . This is because high-temperature heating is instantaneously performed during the welding process, and the soluble alloy and the components of the plating layer are mixed to form a new alloy, so that stable welding with good electrical characteristics and mechanical strength can be obtained. . However, if there are even a small amount of soluble alloy components with different melting points, they will mix with the plating layer components, causing a change in the melting point of the soluble alloy, that is, the operating temperature of the thermal fuse. There is a problem of losing certainty and reliability.

この発明は上記の課題を解決するために提案されたもので、その目的とするところは、所定の融点で確実に溶断して安定な動作温度を示す温度ヒューズを提供することにある。   The present invention has been proposed in order to solve the above-described problems, and an object of the present invention is to provide a thermal fuse that reliably melts at a predetermined melting point and exhibits a stable operating temperature.

請求項１に係る本発明は、互いに対向する内端を離間して対向配置した一対のリード導体と、一対のリード導体の少なくとも互いに対向する内端部の表面を被覆する中間可溶合金層と、これらの中間可溶合金層に両端部を溶接して一対のリード導体間を接続する低融点の可溶合金体と、中間可溶合金層を含む各リード導体の内端部分ならびに可溶合金体を収容するケースとよりなり、中間可溶合金層と可溶合金体とは実質的に同じ成分組成の低融点可溶性合金でなることを特徴とする温度ヒューズである。
請求項２の発明は、請求項１に記載の温度ヒューズにおいて、低融点可溶性合金は、錫（Ｓｎ）、ビスマス（Ｂｉ）、インジウム（Ｉｎ）、亜鉛（Ｚｎ）、銅（Ｃｕ）、銀（Ａｇ）または金（Ａｕ）のうちの複数の金属の合金でなることを特徴とする。
請求項３の発明は、請求項１に記載の温度ヒューズにおいて、中間可溶合金層はリード導体の内端部の表面と裏面ならびに端面を被覆して設けられることを特徴とする。 According to a first aspect of the present invention, a pair of lead conductors arranged to face each other with the inner ends facing each other being spaced apart, and an intermediate fusible alloy layer covering the surfaces of at least the inner ends facing each other of the pair of lead conductors, A low-melting-point fusible alloy body that welds both ends to these intermediate fusible alloy layers to connect a pair of lead conductors, inner end portions of the respective lead conductors including the fusible alloy layer, and fusible alloys The thermal fuse is characterized in that the intermediate fusible alloy layer and the fusible alloy body are made of a low melting point fusible alloy having substantially the same component composition.
According to a second aspect of the present invention, in the thermal fuse according to the first aspect, the low melting point soluble alloy is tin (Sn), bismuth (Bi), indium (In), zinc (Zn), copper (Cu), silver ( Ag) or an alloy of a plurality of metals of gold (Au).
According to a third aspect of the present invention, in the thermal fuse of the first aspect, the intermediate fusible alloy layer is provided so as to cover the front and back surfaces and the end surface of the inner end portion of the lead conductor.

本発明によれば、温度ヒューズにおいて間隔をおいて対向する一対のリード導体の内端部間を接続し、周囲温度の所定レベル以上の上昇時には溶断する可溶合金体と、リード導体および可溶合金体の間の接続を容易且つ確実にするために介在させる中間可溶合金層とを実質的に同じ成分組成の低融点可溶性合金で形成した。そのことにより可溶合金体を中間可溶合金層に対して溶接する際に、互いに異なる成分があればそれらによって不純物層が形成されるようなことがなく、両者は均一で均質な溶着組織をもって一体に溶接されるので、安定な動作温度を示す温度ヒューズが得られる。   According to the present invention, a fusible alloy body that connects between inner ends of a pair of lead conductors facing each other with a gap in a thermal fuse and melts when the ambient temperature rises above a predetermined level, the lead conductor, and the fusible element The intermediate fusible alloy layer interposed to facilitate and ensure the connection between the alloy bodies was formed of a low melting point soluble alloy having substantially the same composition. As a result, when welding the fusible alloy body to the intermediate fusible alloy layer, if there are different components from each other, there will be no formation of an impurity layer by them, and both have a uniform and homogeneous weld structure. Because they are welded together, a thermal fuse that exhibits a stable operating temperature is obtained.

以下、図面に示す実施例に沿って本発明を説明する。   The present invention will be described below with reference to embodiments shown in the drawings.

［実施の形態１］
図１（ａ）は本発明が適用される第１実施例の温度ヒューズの構成を示す側面図、（ｂ）は（ａ）におけるケース１４を除く他の部材の構成を示す斜視図である。 [Embodiment 1]
FIG. 1A is a side view showing the configuration of the thermal fuse of the first embodiment to which the present invention is applied, and FIG. 1B is a perspective view showing the configuration of other members excluding the case 14 in FIG.

図１（ａ），（ｂ）において、この温度ヒューズは、導電性金属材で帯状平板に形成してそれぞれ一端で間隔を置いて対向させた一対のリード導体１０ａ，１０ｂと、これらリード導体１０ａ，１０ｂの対向内端部に隣接する部分の表面に例えば電気メッキにより低融点可溶性合金で形成した中間可溶合金層１２ａ，１２ｂと、これら中間可溶合金層１２ａ，１２ｂのものと同じ組成の低融点可溶性合金で棒状に形成して中間可溶合金層を介し一対のリード導体１０ａ，１０ｂの対向内端部間を接続する可溶合金体１３と、リード導体１０ａ，１０ｂの対向内端部の可溶合金体１３による接続部分を収容するケース１４とでなる。   1 (a) and 1 (b), this thermal fuse is formed of a conductive metal material in a strip-like flat plate and is opposed to each other with a gap at one end, and these lead conductors 10a. , 10b, the intermediate soluble alloy layers 12a, 12b formed of a low melting point soluble alloy by, for example, electroplating on the surface of the portion adjacent to the opposed inner end, and the same composition as those of the intermediate soluble alloy layers 12a, 12b A fusible alloy body 13 which is formed in a rod shape with a low melting point soluble alloy and connects between the opposing inner end portions of the pair of lead conductors 10a, 10b via the intermediate soluble alloy layer, and the opposing inner end portions of the lead conductors 10a, 10b And a case 14 that accommodates a connecting portion of the soluble alloy body 13.

リード導体１０ａ，１０ｂは対向内端部にそれぞれ上方に向って折曲された立ち上げ部１１ａ，１１ｂを備え、切り欠き１１ｃ，１１ｄが各立ち上げ部の中央に形成される。中間可溶合金層１２ａ，１２ｂは、リード導体１０ａ，１０ｂの立ち上げ部１１ａ，１１ｂに隣接する一部に形成した例を示すが、立ち上げ部１１ａ、１１ｂも含めて、或いは少なくとも切り欠き１１ｃ，１１ｄの部分も含めて形成すれば、可溶合金体１３との接触面が増加する。   The lead conductors 10a and 10b are provided with rising portions 11a and 11b that are bent upward at opposite inner end portions, respectively, and notches 11c and 11d are formed at the centers of the rising portions. The intermediate fusible alloy layers 12a and 12b are shown as an example formed in a part adjacent to the rising portions 11a and 11b of the lead conductors 10a and 10b. , 11d, the contact surface with the fusible alloy body 13 increases.

中間可溶合金層１２ａ，１２ｂの形成には、電気メッキ以外に、化学メッキ、溶融メッキ、真空蒸着メッキ、クラッド法のいずれの被覆法をも採用可能であり、要は、銅、銀、鉄、ニッケル等の導電金属材でなるリード導体１０ａ，１０ｂの表面と密接強固に接合する低融点可溶性合金による被覆層を形成することである。中間可溶合金層１２ａ，１２ｂとしての被覆層の厚さは採用する被覆法によっても異なるが、後述する可溶合金体１３との溶接性や接合強度の点から見て、１〜３０μｍの範囲とすることが望ましい。   For the formation of the intermediate fusible alloy layers 12a and 12b, in addition to electroplating, any coating method such as chemical plating, hot dipping, vacuum deposition plating, and cladding can be employed. In short, copper, silver, iron Forming a coating layer of a low-melting-point soluble alloy that is intimately and firmly bonded to the surfaces of the lead conductors 10a and 10b made of a conductive metal material such as nickel. The thickness of the coating layer as the intermediate fusible alloy layers 12a and 12b varies depending on the coating method employed, but in the range of 1 to 30 μm from the viewpoint of weldability and bonding strength with the fusible alloy body 13 described later. Is desirable.

棒状の可溶合金体１３はその中央部分において、両リード導体１０ａ，１０ｂの立ち上げ部１１ａ，１１ｂの切り欠き１１ｃ，１１ｄに挿入される。したがって、所定の位置に容易、かつ確実に可溶合金体１３を取付けることができる。そして、可溶合金体１３の両端部分を中間可溶合金層１２ａ，１２ｂ上に載置して、例えばリード導体側からの加熱によって、可溶合金体１３の両端を中間可溶合金層１２ａ，１２ｂに溶接する。なお、可溶合金体１３の周囲には可溶合金体１３の溶接を促すために特に図示しないが周知のようにロジンが塗布される。溶接の際には熱で可溶合金体１３全般に溶解が生じないようにすることは言うまでもないが、溶接のための加熱法としては、ヒーターによるリード導体の加熱、通電によるリード導体の発熱、可溶合金体１３の端部と中間可溶合金層１２ａ，１２ｂに対する近赤外線レーザ光の照射等のいずれをも採用可能である。   The rod-shaped fusible alloy body 13 is inserted into the notches 11c and 11d of the rising portions 11a and 11b of the lead conductors 10a and 10b at the central portion thereof. Therefore, the soluble alloy body 13 can be easily and reliably attached to the predetermined position. Then, both end portions of the fusible alloy body 13 are placed on the intermediate fusible alloy layers 12a and 12b, and both ends of the fusible alloy body 13 are moved to the intermediate fusible alloy layers 12a and 12a by heating from the lead conductor side, for example. Weld to 12b. Note that rosin is applied around the fusible alloy body 13 as is well known, although not particularly shown, in order to promote welding of the fusible alloy body 13. Needless to say, the melting of the soluble alloy body 13 is not caused by heat during welding. As a heating method for welding, heating of the lead conductor by a heater, heating of the lead conductor by energization, Any of the irradiation of the near infrared laser beam to the end portion of the fusible alloy body 13 and the intermediate fusible alloy layers 12a and 12b can be employed.

前述したように中間可溶合金層１２ａ，１２ｂと可溶合金体１３とは同じ組成の低融点可溶性合金で作成される。この低融点可溶性合金としては、錫（Ｓｎ）、ビスマス（Ｂｉ）、インジウム（Ｉｎ）、亜鉛（Ｚｎ）、銅（Ｃｕ）、銀（Ａｇ）と金（Ａｕ）のいずれか、またはそれらのうち複数の金属の合金を用いるが、その成分ないし組成は温度ヒューズとして所定の動作温度、つまり低融点可溶性合金として必要とされる融点との関連において選択される。   As described above, the intermediate fusible alloy layers 12a and 12b and the fusible alloy body 13 are made of a low melting point soluble alloy having the same composition. As this low melting point soluble alloy, one of tin (Sn), bismuth (Bi), indium (In), zinc (Zn), copper (Cu), silver (Ag) and gold (Au), or among them An alloy of a plurality of metals is used, and its component or composition is selected in relation to a predetermined operating temperature as a thermal fuse, that is, a melting point required as a low melting point soluble alloy.

いずれの場合にも、本発明によれば、ヒューズエレメントとしての可溶合金体１３は同一の成分組成を有する中間可溶合金層１２ａ，１２ｂと溶接されてリード導体１０ａ，１０ｂに接続されるから、可溶合金体と中間可溶合金層とは、何等不純物層を介在させることなく、均質な組織をもって一体に溶接されるから、温度ヒューズの動作温度が確実に安定化される。   In any case, according to the present invention, the fusible alloy body 13 as the fuse element is welded to the intermediate fusible alloy layers 12a and 12b having the same component composition and connected to the lead conductors 10a and 10b. The fusible alloy body and the intermediate fusible alloy layer are welded together with a homogeneous structure without interposing any impurity layer, so that the operating temperature of the thermal fuse is reliably stabilized.

上記の実施の形態１ではリード導体として端部の立ち上げ部以外は平坦な帯状平板を用いた温度ヒューズの構成を示したが、本発明はこの構成に限定されることなく、例えば、同一出願人による特願２００５−０４３６４５に記載するように、立ち上げ部の他に折曲部を有するリード導体を用いる温度ヒューズにも適用される。以下にその例について説明する。   In the first embodiment described above, the configuration of the thermal fuse using the flat belt-like flat plate other than the rising portion at the end as the lead conductor is shown. However, the present invention is not limited to this configuration, and for example, the same application As described in Japanese Patent Application No. 2005-043645, the present invention is also applied to a thermal fuse using a lead conductor having a bent portion in addition to a rising portion. Examples thereof will be described below.

［実施の形態２］
図２は本発明を適用し得る第２実施例の温度ヒューズの構成を示す側面図である。 [Embodiment 2]
FIG. 2 is a side view showing the configuration of the thermal fuse of the second embodiment to which the present invention can be applied.

この第２実施例の温度ヒューズは、使用するリード導体１０ｃ，１０ｄが第１実施例のものが平板状であるに対して、対向端部の立ち上げ部１１ａ，１１ｂと平行な、それぞれ断面をほぼ逆Ｕ字形とした例えば二つの折曲部１５ａ，１５ｃと１５ｂ，１５ｄを形成し、強度を持たせた点で異なるが、他の構成は、使用する低融点可溶性合金の特徴を含めて第１実施例と同じなので，詳述は省略する。   In the thermal fuse of the second embodiment, the lead conductors 10c and 10d to be used are flat in the shape of the first embodiment, whereas the cross sections of the lead fuses 11a and 11b at the opposite end are parallel to each other. For example, two bent portions 15a, 15c and 15b, 15d having a substantially inverted U shape are formed and given strength, but other configurations include the characteristics of the low melting point soluble alloy used. Since it is the same as that of the first embodiment, detailed description is omitted.

図２において、リード導体１０ｃ，１０ｄの立ち上げ部１１ａ，１１ｂに近い側の第１の折曲部１５ａ，１５ｂは、中間可溶合金層１２ａ，１２ｂの外側においてケース１４内の位置に、遠い側の第２の折曲部１５ｃ，１５ｄはケース１４外の位置にそれぞれ設けられる。図２において一方のリード導体１０ｄの第２の折曲部１５ｄより外方の部分を曲げ脚部１０ｅとして示すように、リード導体の電子機器への取付けの際にケースより外方の部分を曲げ脚とする必要があるときは、外方部分に外力を加えねばならないが、リード導体が平板状であるとこの外力がケースとリード胴体間の封止部を介してケース内部に直接伝わり、中間可溶合金層１２ｂを有するリード導体１０ｄと可溶合金体１３の間の接続に影響を与えることになるが、本実施例によれば、ケースの外側の第２の折曲部１５ｄがこの外力に対する曲げ支点として働き、外力がケース内に伝わらないようにする。仮に伝わっても、ケース内において中間可溶合金層１２ｂの外側に位置する第１の折曲部１５ｂがこの外力を吸収するから、中間可溶合金層１２ｂを有する上記接続が影響を受けることはない。従って、第１実施例について述べたように強固な接合と安定な動作温度を保証する可溶合金体１３と中間可溶合金層１２ｂの間の均質な溶接は、本第２実施例のリード導体の外力吸収構成によって確実に保護され、信頼性の高い温度ヒューズが得られる。   In FIG. 2, the first bent portions 15a and 15b on the side close to the rising portions 11a and 11b of the lead conductors 10c and 10d are far from the positions in the case 14 outside the intermediate fusible alloy layers 12a and 12b. The second bent portions 15c and 15d on the side are provided at positions outside the case 14, respectively. As shown in FIG. 2, the portion outside the second bent portion 15d of one lead conductor 10d is shown as a bending leg portion 10e, and the portion outside the case is bent when the lead conductor is attached to an electronic device. When it is necessary to use the legs, external force must be applied to the outer part. However, if the lead conductor is flat, this external force is transmitted directly to the inside of the case via the sealing part between the case and the lead body, Although the connection between the lead conductor 10d having the fusible alloy layer 12b and the fusible alloy body 13 will be affected, according to the present embodiment, the second bent portion 15d outside the case has this external force. Acts as a bending fulcrum against the external force, preventing external force from being transmitted into the case Even if it is transmitted, since the first bent portion 15b located outside the intermediate soluble alloy layer 12b in the case absorbs this external force, the connection having the intermediate soluble alloy layer 12b is affected. Absent. Therefore, as described with respect to the first embodiment, the homogeneous welding between the fusible alloy body 13 and the intermediate fusible alloy layer 12b that guarantees strong bonding and a stable operating temperature is the lead conductor of the second embodiment. Thus, a reliable thermal fuse can be obtained that is reliably protected by the external force absorbing structure.

以上、本発明を二つの実施形態で説明したが、温度ヒューズの具体的な構成は記載の実施形態に限定されるものではなく、本発明の精紳を逸脱しない範囲で種々に設計変更することが可能である。即ち、上記実施の形態で説明した温度ヒューズは薄型の温度ヒューズとしているが、薄型に限定されるものではなく、通常の一般的な温度ヒューズにも適用し得ることは言うまでもない。また、リード導体として帯状平板の導電材料でなるものについてのみ説明したが、プラスチック、ガラス、セラミクス等の絶縁物でなる基体の表面にメッキ法等で形成した導電材層を用いることも可能である。さらに、リード導体の内端部に立ち上げ部１１ａ，１１ｂを形成したタイプを示したが、立ち上げ部１１ａ，１１ｂがなく、平板状のものとすることも可能である。また、中間可溶合金層は主としてリード導体の対向内端部の表面に設けられるものとして記載されているが、内端部の表面のみでなく、裏面にも、また端面にも設けることによってリード導体と可溶合金体間の溶接強度や電気特性を高めることができる。   Although the present invention has been described in the two embodiments, the specific structure of the thermal fuse is not limited to the described embodiment, and various design changes can be made without departing from the spirit of the present invention. Is possible. That is, although the thermal fuse described in the above embodiment is a thin thermal fuse, the thermal fuse is not limited to a thin thermal fuse and can be applied to a general general thermal fuse. Moreover, although only the thing which consists of a strip | belt-shaped flat conductive material was demonstrated as a lead conductor, it is also possible to use the electrically conductive material layer formed by the plating method etc. on the surface of the base | substrate which consists of insulators, such as a plastics, glass, and ceramics. . Furthermore, although the type in which the rising portions 11a and 11b are formed at the inner end portion of the lead conductor is shown, the rising portions 11a and 11b are not provided, and it may be a flat plate. The intermediate fusible alloy layer is mainly described as being provided on the surface of the opposed inner end of the lead conductor, but the lead is provided not only on the surface of the inner end, but also on the back and end surfaces. It is possible to improve the welding strength and electrical characteristics between the conductor and the soluble alloy body.

（ａ）は本発明の第１実施例における温度ヒューズの構成を示す側面図、（ｂ）は（ａ）のケースを取り除いた温度ヒューズの斜視図である。(A) is a side view showing the configuration of the thermal fuse in the first embodiment of the present invention, (b) is a perspective view of the thermal fuse with the case (a) removed. 本発明の第２実施例における温度ヒューズの構成を示す側面図である。It is a side view which shows the structure of the thermal fuse in 2nd Example of this invention. 一従来例における温度ヒューズの側断面図である。It is a sectional side view of the temperature fuse in a prior art example.

符号の説明Explanation of symbols

１ 基体
２ａ，２ｂ リード導体
３ａ，３ｂ メッキ層
４ ヒューズエレメント
１０ａ，１０ｂ リード導体
１１ａ，１１ｂ 立ち上げ部
１１ｃ 切り欠き
１２ａ，１２ｂ 中間可溶合金層
１３ 可溶合金体
１４ ケース
１０ｃ，１０ｄ リード導体
１０ｅ 曲げ脚部
１５ａ，１５ｃ；１５ｂ，１５ｄ 折曲部 DESCRIPTION OF SYMBOLS 1 Base | substrate 2a, 2b Lead conductor 3a, 3b Plating layer 4 Fuse element 10a, 10b Lead conductor 11a, 11b Rising part 11c Notch 12a, 12b Intermediate soluble alloy layer 13 Soluble alloy body 14 Case 10c, 10d Lead conductor 10e Bending leg portions 15a and 15c; 15b and 15d bent portions

Claims (3)

互いに対向する内端を離間して対向配置した一対のリード導体と、一対のリード導体の少なくとも互いに対向する内端部の表面を被覆する中間可溶合金層と、これらの中間可溶合金層に両端部を溶接して一対のリード導体間を接続する低融点の可溶合金体と、中間可溶合金層を含む各リード導体の内端部分ならびに可溶合金体を収容するケースとよりなり、
中間可溶合金層と可溶合金体とは実質的に同じ成分組成の低融点可溶性合金でなることを特徴とする
温度ヒューズ。 A pair of lead conductors that are arranged opposite to each other with their inner ends facing away from each other, an intermediate fusible alloy layer that covers at least the surfaces of the inner ends facing each other of the pair of lead conductors, and these intermediate fusible alloy layers It consists of a low melting point fusible alloy body that welds both ends to connect between a pair of lead conductors, and a case that houses the inner end portion of each lead conductor including the intermediate fusible alloy layer and the fusible alloy body,
A thermal fuse, wherein the intermediate fusible alloy layer and the fusible alloy body are low melting point fusible alloys having substantially the same component composition. 低融点可溶性合金は、錫（Ｓｎ）、ビスマス（Ｂｉ）、インジウム（Ｉｎ）、亜鉛（Ｚｎ）、銅（Ｃｕ）、銀（Ａｇ）または金（Ａｕ）のうちの複数の金属の合金でなることを特徴とする請求項１に記載の温度ヒューズ。   The low melting point soluble alloy is an alloy of a plurality of metals among tin (Sn), bismuth (Bi), indium (In), zinc (Zn), copper (Cu), silver (Ag) or gold (Au). The thermal fuse according to claim 1, wherein: 中間可溶合金層はリード導体の内端部の表面と裏面ならびに端面を被覆して設けられることを特徴とする請求項１に記載の温度ヒューズ。   2. The thermal fuse according to claim 1, wherein the intermediate fusible alloy layer is provided so as to cover a front surface, a back surface, and an end surface of the inner end portion of the lead conductor.
JP2005133980A 2005-05-02 2005-05-02 Thermal fuse Pending JP2006310215A (en)

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