TWI726074B - Breaking protective element - Google Patents
Breaking protective element Download PDFInfo
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- TWI726074B TWI726074B TW106109544A TW106109544A TWI726074B TW I726074 B TWI726074 B TW I726074B TW 106109544 A TW106109544 A TW 106109544A TW 106109544 A TW106109544 A TW 106109544A TW I726074 B TWI726074 B TW I726074B
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- soluble conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/574—Devices or arrangements for the interruption of current
- H01M50/583—Devices or arrangements for the interruption of current in response to current, e.g. fuses
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Fuses (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
提供一種藉由將來自發熱體之熱有效率的傳遞至可熔導體,而具有優異速熔斷性之保護元件。 Provided is a protection element with excellent quick-blow performance by efficiently transferring heat from a heating element to a soluble conductor.
熔絲元件1,具有絕緣基板2、設在絕緣基板2上之第1電極3及第2電極4、設在絕緣基板2上之發熱體5、連接在發熱體5之第1發熱體電極6及第2發熱體電極7、連接在第1發熱體電極6之第3電極8、連接在第2發熱體電極7之發熱體引出電極9、以及經由發熱體引出電極9分別連接第1電極3及第2電極4間之可熔導體10,至少在與可熔導體10重疊之位置,將第2發熱體電極7與發熱體引出電極9加以連接。 The fuse element 1 has an insulating substrate 2, a first electrode 3 and a second electrode 4 provided on the insulating substrate 2, a heating element 5 provided on the insulating substrate 2, and a first heating element electrode 6 connected to the heating element 5 And the second heating element electrode 7, the third electrode 8 connected to the first heating element electrode 6, the heating element extraction electrode 9 connected to the second heating element electrode 7, and the first electrode 3 respectively connected via the heating element extraction electrode 9 The soluble conductor 10 between and the second electrode 4 connects the second heating element electrode 7 and the heating element extraction electrode 9 at least at a position overlapping with the soluble conductor 10.
Description
本發明係關於構裝在電流路徑上,在超過額定之電流流過時因過電流產生之焦耳熱而熔斷,或因形成電流路徑之電路上之異常等而須遮斷電流路徑時,藉由加熱器之加熱使可熔導體熔斷以遮斷該電流路徑的保護元件。 The present invention relates to the installation on a current path, when a current exceeding the rated current flows due to Joule heat generated by the overcurrent, or when the current path needs to be interrupted due to an abnormality in the circuit forming the current path, by heating The heating of the device causes the fusible conductor to fuse to interrupt the protective element of the current path.
本申請案,以日本2016年3月23日提出申請之日本專利出願號特願2016-058423為基礎主張優先權,參照該申請案並援用於本申請案。 This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2016-058423 filed on March 23, 2016 in Japan, and refers to this application and applies to this application.
一直以來,有使用一種在因形成電流路徑之電路上之異常等而須遮斷電流路徑時藉由加熱器之加熱使可熔導體熔斷,以遮斷該電流路徑之保護元件。此種保護元件,較為人知的是形成為在絕緣基板上搭載電極及可熔導體之功能型晶片(片狀),將此晶片構裝在電路基板上之表面構裝型者。 In the past, there has been a protection element used to block the current path by heating the fusible conductor by heating the heater when the current path needs to be interrupted due to an abnormality in the circuit forming the current path. This type of protection element is well known as a functional chip (sheet-shaped) in which electrodes and soluble conductors are mounted on an insulating substrate, and the chip is mounted on a circuit substrate.
於上述保護元件,由於係根據來自外部電路之訊號對加熱器通電進行加熱以使可熔導體熔斷,因此能以基於外部電路控制之時機遮斷電流路徑之如開關般的使用方式。此種保護元件,係用作為例如鋰離子電池等二次電池之保護電路。 In the above-mentioned protection element, since the heater is energized and heated according to the signal from the external circuit to fuse the fusible conductor, it can be used in a switch-like manner to interrupt the current path based on the timing of the external circuit control. This type of protection element is used as a protection circuit for secondary batteries such as lithium ion batteries.
近年來,於鋰離子電池等二次電池之用途上被要求能有大電 流輸出,例如電動輔助自行車、以及充電式電動工具等日漸增加,而有使用保護電路之額定電流提高、能耐大電流之保護元件。 In recent years, the use of secondary batteries such as lithium-ion batteries has been required to have large power Current output, such as electric assisted bicycles, and rechargeable power tools, is increasing day by day, and there are protective components that use protection circuits to increase the rated current and can withstand large currents.
專利文獻1記載之技術,係揭示一種於絕緣基板表面設置加熱器,將從加熱器發出之熱透過絕緣層傳遞至可熔導體使可熔導體熔融,以遮斷電流路徑之元件。又,專利文獻1記載之技術,亦揭示了一種在絕緣基板背面設置加熱器,藉由將從加熱器發出之熱透過絕緣基板傳遞至可熔導體以使可熔導體熔融,以遮斷電流路徑之元件。
The technology described in
先行技術文獻Advanced technical literature
[專利文獻1]日本特開2011-060762號公報 [Patent Document 1] JP 2011-060762 A
然而,上述專利文獻1記載之技術,當是在絕緣基板表面設置加熱器之情形時,透過絕緣基板上之絕緣層形成從加熱器往可熔導體之熱傳導路徑,而產生熱傳導效率不佳的課題。又,當是在絕緣基板背面設置加熱器之情形時,透過絕緣基板形成從加熱器往可熔導體之熱傳導路徑,而會更加產生熱傳導效率不佳的課題。
However, the technique described in
又,上述專利文獻1記載之技術,隨著能夠因應大電流而使可熔導體之熔斷體積變大,恐有使用加熱器之加熱時間變長,導致可熔導體之速熔斷性惡化的情形。
In addition, as the technology described in
因此,本發明之目的在於提供一種能因應大電流、有效率的將熱從加熱器傳遞至可熔導體,速熔斷性優異之保護元件。 Therefore, the object of the present invention is to provide a protection element that can efficiently transfer heat from the heater to the soluble conductor in response to a large current, and has excellent rapid fusing.
為解決上述課題,本發明之保護元件,具有絕緣基板、設在該絕緣基板上之第1電極及第2電極、設在該絕緣基板上之發熱體、連接在該發熱體之第1發熱體電極及第2發熱體電極、連接在該第1發熱體電極及第2發熱體電極中之一方之發熱體引出電極、連接在該第1發熱體電極及第2發熱體電極中之另一方之第3電極、以及經由該發熱體引出電極分別連接該第1電極及第2電極間之可熔導體,至少在與該可熔導體重疊之位置,將該第1發熱體電極及第2發熱體電極中之一方或該發熱體與該發熱體引出電極加以連接。 In order to solve the above-mentioned problems, the protection element of the present invention has an insulating substrate, a first electrode and a second electrode provided on the insulating substrate, a heating element provided on the insulating substrate, and a first heating element connected to the heating element The electrode and the second heating element electrode, the heating element extraction electrode connected to one of the first heating element electrode and the second heating element electrode, and the other of the first heating element electrode and the second heating element electrode The third electrode and the soluble conductor between the first electrode and the second electrode are respectively connected to the first electrode and the second electrode through the heating element, and the first heating element electrode and the second heating element are at least overlapped with the soluble conductor. One of the electrodes or the heating body is connected to the heating body leading electrode.
又,為解決上述課題,本發明之保護元件,具有絕緣基板、設在該絕緣基板上之第1電極及第2電極、設在該絕緣基板上之發熱體、連接在該發熱體之第1發熱體電極、連接在該第1發熱體電極之第3電極、連接在該發熱體之發熱體引出電極、以及經由該發熱體引出電極分別連接該第1電極及第2電極間之可熔導體,至少在與該可熔導體重疊之位置,將該發熱體與該發熱體引出電極加以連接。 Furthermore, in order to solve the above-mentioned problems, the protection element of the present invention includes an insulating substrate, a first electrode and a second electrode provided on the insulating substrate, a heating element provided on the insulating substrate, and a first heating element connected to the heating element. The heating element electrode, the third electrode connected to the first heating element electrode, the heating element extraction electrode connected to the heating element, and the soluble conductor respectively connected between the first electrode and the second electrode via the heating element extraction electrode , At least at a position overlapping with the soluble conductor, the heating element is connected with the heating element lead electrode.
依據本發明,藉由提高從發熱體往可熔導體之熱傳導效率,能縮短藉由發熱體之發熱使可熔導體熔斷之時間,實現大電流額定之保護元件。 According to the present invention, by improving the efficiency of heat conduction from the heating element to the soluble conductor, the time for fusing the soluble conductor by the heating of the heating element can be shortened, and a large current rated protection element can be realized.
1、20、30、40、50:熔絲元件 1, 20, 30, 40, 50: fuse element
2:絕緣基板 2: Insulating substrate
2a:表面 2a: surface
2b:背面 2b: back
3:第1電極 3: The first electrode
3a:第1構裝電極 3a: The first structure electrode
3b:第1半通孔 3b: 1st half through hole
4:第2電極 4: The second electrode
4a:第2構裝電極 4a: The second structure electrode
4b:第2半通孔 4b: 2nd half through hole
5:發熱體 5: heating element
6:第1發熱體電極 6: The first heating element electrode
7:第2發熱體電極 7: The second heating element electrode
8:第3電極 8: 3rd electrode
8a:第3構裝電極 8a: 3rd structure electrode
8b:第3半通孔 8b: 3rd half through hole
9:發熱體引出電極 9: The heating element leads the electrode
9a:連接部 9a: Connection part
9b:通孔 9b: Through hole
9c:連接部 9c: Connection part
10:可熔導體 10: Fusible conductor
10a:熔融體 10a: melt
11:電阻測定電極 11: Resistance measuring electrode
12:第1絕緣體 12: The first insulator
12a:缺口部 12a: Notch
14:焊料 14: Solder
15:助焊劑 15: Flux
16:覆蓋構件 16: cover member
16a:側壁 16a: side wall
16b:頂面 16b: top surface
圖1係針對第1實施形態之熔絲元件顯示取下覆蓋構件的俯視圖。 Fig. 1 is a plan view showing the fuse element of the first embodiment with the cover member removed.
圖2係針對圖1中之熔絲元件顯示取下可熔導體之狀態的俯視圖。 FIG. 2 is a top view of the fuse element in FIG. 1 showing a state where the soluble conductor is removed.
圖3係圖1中A-A’線剖面圖。 Fig. 3 is a cross-sectional view taken along the line A-A' in Fig. 1.
圖4係說明熔絲元件之電路構成的等效電路圖,圖4(A)顯示熔絲元件動作前之狀態、圖4(B)顯示熔絲元件動作後、可熔導體熔融之狀態。 Fig. 4 is an equivalent circuit diagram illustrating the circuit configuration of the fuse element. Fig. 4(A) shows the state before the fuse element operates, and Fig. 4(B) shows the state of the fusible conductor after the fuse element operates.
圖5係顯示圖1中之熔絲元件作動、可熔導體熔融之狀態的俯視圖。 FIG. 5 is a plan view showing a state in which the fuse element in FIG. 1 is activated and the soluble conductor is melted.
圖6係針對第2實施形態之熔絲元件顯示取下覆蓋構件的俯視圖。 Fig. 6 is a plan view showing the fuse element of the second embodiment with the cover member removed.
圖7係針對圖6中之熔絲元件顯示取下可熔導體之狀態的俯視圖。 FIG. 7 is a top view of the fuse element in FIG. 6 showing a state where the soluble conductor is removed.
圖8係圖6中之A-A’線剖面圖。 Fig. 8 is a cross-sectional view taken along the line A-A' in Fig. 6.
圖9針對第3實施形態之熔絲元件顯示取下覆蓋構件的俯視圖。 Fig. 9 shows a plan view of the fuse element of the third embodiment with the cover member removed.
圖10係針對圖9中之熔絲元件顯示取下可熔導體之狀態的俯視圖。 FIG. 10 is a top view of the fuse element in FIG. 9 showing a state where the soluble conductor is removed.
圖11係圖9中之A-A’線剖面圖。 Fig. 11 is a cross-sectional view taken along the line A-A' in Fig. 9.
圖12係說明圖9中之熔絲元件之電路構成的等效電路圖,圖12(A)顯示熔絲元件動作前之狀態、圖12(B)顯示熔絲元件動作後、可熔導體熔融之狀態。 Fig. 12 is an equivalent circuit diagram illustrating the circuit configuration of the fuse element in Fig. 9, Fig. 12(A) shows the state before the fuse element operates, and Fig. 12(B) shows the fuse element after the operation, the fusible conductor melts status.
圖13係針對第4實施形態之熔絲元件顯示取下覆蓋構件的俯視圖。 Fig. 13 is a plan view showing the fuse element of the fourth embodiment with the cover member removed.
圖14係針對圖13中之熔絲元件顯示取下可熔導體之狀態的俯視圖。 FIG. 14 is a top view of the fuse element in FIG. 13 showing a state where the soluble conductor is removed.
圖15係圖13中之A-A’線剖面圖。 Fig. 15 is a cross-sectional view taken along the line A-A' in Fig. 13.
圖16係針對參考例之熔絲元件顯示取下覆蓋構件的俯視圖。 Fig. 16 is a plan view showing the cover member removed for the fuse element of the reference example.
圖17係針對圖16中之熔絲元件顯示取下可熔導體之狀態的俯視圖。 FIG. 17 is a top view of the fuse element in FIG. 16 showing a state where the soluble conductor is removed.
圖18係圖16中之A-A’線剖面圖。 Fig. 18 is a cross-sectional view taken along the line A-A' in Fig. 16.
圖19係說明圖16中之熔絲元件之電路構成的等效電路圖,圖19(A)顯示熔絲元件動作前之狀態、圖19(B)顯示熔絲元件動作後、可熔導體熔 融之狀態。 Fig. 19 is an equivalent circuit diagram illustrating the circuit configuration of the fuse element in Fig. 16, Fig. 19(A) shows the state before the fuse element is activated, and Fig. 19(B) shows the fuse element is fused after the fuse element is activated. The state of integration.
以下,針對適用本發明之熔絲元件,一邊參照圖面一邊詳細的說明之。又,本發明不僅限定於以下實施形態,在不脫離本發明要旨之範圍內,當然可有各種變化。此外,圖面係以示意方式顯示,各尺寸之比率等可能與實物有所差異。具體的尺寸等應參酌下述說明加以判斷。又,各圖面間當然亦有可能包含彼此之尺寸關係或比率相異之部分。 Hereinafter, the fuse element to which the present invention is applied will be described in detail while referring to the drawings. In addition, the present invention is not limited to the following embodiments. Of course, various changes can be made without departing from the scope of the present invention. In addition, the drawing is shown schematically, and the ratio of each size may be different from the actual product. The specific dimensions should be judged with reference to the following description. Moreover, it is of course possible that the various drawings may include parts with different dimensional relationships or ratios.
〔第1實施形態〕 [First Embodiment]
熔絲元件1,如圖1至圖3所示,例如係在鋰離子二次電池之保護電路等之電路基板藉由回流焊進行表面構裝,據以將可熔導體10組裝於鋰離子二次電池之充放電路徑上者。
The
此保護電路,當超過熔絲元件1之額定之大電流流過時,藉由可熔導體10因自我發熱(焦耳熱)熔斷以遮斷電流路徑。又,此保護電路,可藉由設在構裝有熔絲元件1之電路基板等之2次保護IC以既定時序對發熱體5通電,並藉由發熱體5之發熱使可熔導體10熔斷以遮斷電流路徑。
In this protection circuit, when a large current exceeding the rating of the
〔熔絲元件〕 〔Fuse element〕
熔絲元件1,如圖1至圖3所示,具有絕緣基板2、設在絕緣基板2上之第1電極3及第2電極4、設在絕緣基板2上之發熱體5、連接在發熱體5之第1發熱體電極6及第2發熱體電極7、連接在第1發熱體電極6及第2發熱體電極7中之一方之發熱體引出電極9、連接在第1發熱體電極6及第2發熱體電極7中之另一方之第3電極8、以及經由發熱體引出電極9分
別連接第1電極3及第2電極4間之可熔導體10,至少在與可熔導體10重疊之位置,將第2發熱體電極7或發熱體5與發熱體引出電極9加以連接。
The
具體而言,熔絲元件1中,第3電極8連接於第1發熱體電極6,在與可熔導體10重疊之位置,發熱體引出電極9朝向絕緣基板2延伸於垂直方向連接於第2發熱體電極7或發熱體5。又,熔絲元件1,於絕緣基板2上具有電阻測定電極11,電阻測定電極11連接於第2發熱體電極7。此電阻測定電極11係使用於製程中之電阻測定,並非作為製品所必須者。又,於熔絲元件1,亦可將第3電極8連接於第2發熱體電極7,此場合,可藉由在與可熔導體10重疊之位置,使發熱體引出電極9朝向絕緣基板2延伸於垂直方向連接於第1發熱體電極6或發熱體5,亦能獲得同等之構成。
Specifically, in the
又,熔絲元件1,具有將第1電極3及第2電極4、與設在絕緣基板2之背面2b之第1構裝電極3a及第2構裝電極4a加以連接,設在絕緣基板2側面之第1半通孔(half through hole)3b及第2半通孔4b。此外,熔絲元件1,在絕緣基板2之側面,具有將第3電極8與設在絕緣基板2之背面2b之第3構裝電極8a加以連接之第3半通孔8b。
In addition, the
發熱體引出電極9,具有在與可熔導體10重疊之位置與第2發熱體電極7電性連接之連接部9a,於連接部9a之前端與第2發熱體電極7連接,此外,其前端之一部分亦與發熱體5接觸。因此,由於發熱體引出電極9可將從發熱體5發出之熱朝可熔導體10傳遞於垂直方向,因此構成一至可熔導體10之最短路徑的熱傳導路徑。
The heating
〔絕緣基板〕 〔Insulating substrate〕
絕緣基板2,係使用例如氧化鋁、玻璃陶瓷、富鋁紅柱石、氧化鋯等具有絕緣性之構件形成為方形。除此之外,絕緣基板2亦可使用用於玻璃環氧基板、酚基板等印刷配線基板之材料。
The insulating
〔電極〕 〔electrode〕
第1電極3及第2電極4,係在絕緣基板2之表面2a上,分別配置在相對向之側緣近旁而開放,並藉由搭載可熔導體10,透過可熔導體10電性連接。又,第1電極3及第2電極4,係因在熔絲元件1流過超過額定之大電流而使可熔導體10因自我發熱(焦耳熱)而熔斷、或藉由發熱體5伴隨通電之發熱而使可熔導體10熔斷,據以遮斷電流路徑。
The
如圖1至圖3所示,第1電極3及第2電極4透過分別設在絕緣基板2側面之第1半通孔3b及第2半通孔4b,與設在背面2b之外部連接電極即第1構裝電極3a及第2構裝電極4a連接。熔絲元件1,透過此等第1構裝電極3a及第2構裝電極4a與形成有外部電路之電路基板連接,構成為該外部電路之電流路徑之一部分。
As shown in Figures 1 to 3, the
第1電極3及第2電極4可使用Cu或Ag等之一般電極材料形成。又,於第1電極3及第2電極4之表面上,最好是有以鍍敷處理等之公知手法塗有Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷等之被膜較佳。如此,熔絲元件1,即能防止第1電極3及第2電極4之氧化,防止伴隨導通電阻上升之額定變動。
The
又,當進行熔絲元件1之回流構裝時,在連接可熔導體10之連接用焊料或可熔導體10之外層形成有低熔點金屬層之情形時,可防止因該低熔點金屬之熔融而熔蝕(焊料浸蝕)第1電極3及第2電極4。
Moreover, when the reflow assembly of the
〔發熱體〕 〔heating stuff〕
發熱體5vu4係通電即發熱、具有導電性之構件,由例如鉻、W、Mo、Ru、Cu、Ag、或以此等為主成分之合金等構成。發熱體5,可藉由將此等之合金或組成物、化合物之粉狀體與樹脂黏合劑等混合後,將作成膏狀之物於絕緣基板2上使用網版印刷技術形成圖案,藉燒成等來形成。此外,發熱體5之一端與第1發熱體電極6連接、另一端與第2發熱體電極7連接。又,發熱體5之另一端與發熱體引出電極9之連接部9a前端之一部分連接。
The heating element 5vu4 is a member that generates heat when it is energized and has conductivity, and is made of, for example, chromium, W, Mo, Ru, Cu, Ag, or alloys with these as main components. The
發熱體5,藉由熔絲元件1被構裝於電路基板,透過第3構裝電極8a與形成在電路基板之外部電路連接。且,發熱體5可以遮斷外部電路之電流路徑的既定時機透過第3構裝電極8a被通電而發熱,據以熔斷連接第1電極3及第2電極4之可熔導體10。又,發熱體5,因可熔導體10熔斷而本身之電流路徑亦被遮斷,故停止發熱。
The
〔發熱體電極〕 〔Heating body electrode〕
第1發熱體電極6及第2發熱體電極7,在絕緣基板2之表面2a上,藉由相對向之側緣近旁分別分離配置而呈開放,並藉由搭載發熱體5而透過發熱體5電性連接。
The first
第1發熱體電極6,在絕緣基板2之表面2a上與第3電極8連接而與第3電極8形成為一體。又,第2發熱體電極7,在絕緣基板2之表面2a上與電阻測定電極11連接而與電阻測定電極11形成為一體。此等第1發熱體電極6、第2發熱體電極7、第3電極8及電阻測定電極11,可與第1電極3及第2電極4同樣使用Cu或Ag等之一般電極材料形成,亦可將該等以同一製程形成。
The first
又,電阻測定電極11係用以測定熔絲元件1之電阻值所使用之電極,即使是在構裝基板未構裝熔絲元件1之狀態下,亦能在第3電極8及電阻測定電極11間測定熔絲元件1之電阻值。因此,熔絲元件1,在不需要電阻值之測定之情形時,其構成可省略電阻測定電極11。
In addition, the
此處,第1構裝電極3a及第1半通孔3b可使用與第1電極3相同材料形成,第2構裝電極4a及第2半通孔4b可使用與第2電極4相同材料形成,第3構裝電極8a及第3半通孔8b可使用與第1發熱體電極6相同材料形成。又,第1半通孔3b、第2半通孔4b、第3半通孔8b並無須限定於半通孔形狀,亦可以是圓形及其他任意形狀之通孔。
Here, the
〔絕緣層〕 〔Insulation〕
熔絲元件1,具有積層在發熱體5與發熱體引出電極9之間之第1絕緣層12。第1絕緣層12覆蓋發熱體5,以阻礙發熱體5與發熱體引出電極9之接觸。作為第1絕緣層12,可使用例如玻璃材料。
The
又,熔絲元件1,為將發熱體5之熱以良好效率傳至可熔導體10,可在絕緣基板2與發熱體5之間積層未圖示之第2絕緣層。第2絕緣層,可避免從發熱體5發出之熱擴散至絕緣基板2。作為第2絕緣層,可使用例如玻璃材料。
In addition, the
此處,第1絕緣層12,在發熱體5與發熱體引出電極9之間形成有缺口部12a。此缺口部12a係對應發熱體引出電極9之連接部9a的解放區域,設有連接部9a。
Here, the first insulating
〔發熱體引出電極〕 〔Extracting electrode from heating element〕
發熱體引出電極9,可使用Cu或Ag等一般的電極材料形成。又,於
發熱體引出電極9之表面上,較佳是以鍍敷處理等之公知手法形成有Ni/Au鍍敷、Ni/Pd鍍敷、Ni/Pd/Au鍍敷等被膜之塗層。
The heating
發熱體引出電極9,雖可以塗布含有上述導電材料之糊膏來形成,但其形狀係形成為略T字形狀。發熱體引出電極9具有朝向第3電極8與電阻測定電極11往兩側擴張之幅寬部,寬度較幅寬部窄之區域作為連接部9a朝向第2發熱體電極7延伸。
The heating element lead-out
發熱體引出電極9,係構成為連接部9a之寬度W2較可熔導體10之寬度W1寬,在發熱體5發熱時,可將可熔導體10整體充分的加熱。因此,最好是將第1絕緣層12形成為第1絕緣層12之缺口部12a之寬度是W2以上。
The heating
〔可熔導體〕 〔Fusible Conductor〕
可熔導體10係由可藉由發熱體5之發熱迅速熔斷之材料構成,非常適合使用例如焊料、或以Sn為主成分之無鉛焊料等之低熔點金屬。
The
又,可熔導體10,可使用Pb、Ag、Cu或以此等中之任一種為主成分之合金等的高熔點金屬,或者亦可以是內層為低熔點金屬層、外層為高熔點金屬層等之低熔點金屬與高熔點金屬之積層體。因含有高熔點金屬與低熔點金屬,在回流構裝熔絲元件1時,即使回流温度超過低熔點金屬之熔融温度而使低熔點金屬熔融,亦能抑制低熔點金屬往外部之流出,維持可熔導體10之形狀。此外,在熔斷時,因低熔點金屬之熔融而熔蝕(焊料熔蝕)高熔點金屬,而能以高熔點金屬之熔點以下之温度迅速的熔斷。
In addition, the
此外,可熔導體10係對發熱體引出電極9、第1電極3及
第2電極4以焊料14加以連接。可熔導體10可藉由回流焊容易地加以連接。可熔導體10,因搭載在發熱體引出電極9上,而與發熱體引出電極9重疊、亦與發熱體5重疊。又,跨接在第1電極3及第2電極4之間之可熔導體10,在第1電極3與第2電極4之間熔斷,將第1電極3及第2電極4間遮斷。亦即,可熔導體10,其中央部被發熱體引出電極9支承,且發熱體引出電極9與第1電極3及第2電極4之各個之間為熔斷部。
In addition, the
又,可熔導體10為防止氧化、提升濕潤性等,塗布有助焊劑15。可熔導體10,藉由保持助焊劑15,能防止可熔導體10之氧化及伴隨氧化之熔斷温度之上升,抑制熔斷特性之變動,迅速地熔斷。
In addition, the
又,熔絲元件1可實現小型且高額定之保護元件,例如,絕緣基板2之尺寸為10mm×5mm程度之小型者,但卻能謀求電阻值為0.5~1mΩ、40~60A額定之高額定化。此外,本發明當然能適用於具備任何尺寸、電阻值及電流額定之保護元件。
In addition, the
又,熔絲元件1,於絕緣基板2之表面2a上安裝有保護內部且用以防止熔融之可熔導體10飛散之覆蓋構件16。覆蓋構件16,具有搭載在絕緣基板2之表面2a上的側壁16a、與構成熔絲元件1之上面的頂面16b。此覆蓋構件16,可使用例如熱可塑性塑膠、陶瓷、玻璃環氧基板等具有絕緣性之構件來形成。
In addition, the
〔電路構成〕 [Circuit configuration]
接著,說明熔絲元件1之電路構成、與通電路徑之遮斷動作。熔絲元件1,如圖4(A)所示,從第1電極3跨到第2電極4連接有可熔導體10,於可熔導體10之中途部分連接發熱體引出電極9。又,發熱體引出電極9,
在與可熔導體10連接側之相反側,依序連接有第2發熱體電極7、發熱體5、第1發熱體電極6。因此,熔絲元件1,可以說是將從第1電極3、第2電極4及第1發熱體電極6起分別透過第1半通孔3b、第2半通孔4b及第3半通孔8b連接之第1構裝電極3a、第2構裝電極4a及第3構裝電極8a作為外部端子的3端子元件。
Next, the circuit configuration of the
熔絲元件1,係構成為主電路之電流從第1電極3流向第2電極4,從第1發熱體電極6流過電流時,發熱體5發熱,將第2發熱體電極7及發熱體引出電極9之連接部9a作為主要之熱傳導路徑來加熱發熱體引出電極9,如圖4(B)及圖5所示,發熱體引出電極9上之可熔導體10熔融,熔融體10a凝結在發熱體引出電極9上,可熔導體10被切斷。據此,於熔絲元件1,第1電極3及第2電極4間之電流路徑被遮斷、且對發熱體5之電流路徑亦被遮斷。
The
從發熱體5發出之熱,雖亦透過第1絕緣層12傳遞至發熱體引出電極9,但藉由熱傳導率較第1絕緣層12高之發熱體引出電極9之連接部9a於垂直方向迅速地傳遞,迅速地加熱發熱體引出電極9、且亦迅速地加熱與連接部9a重疊配置之可熔導體10。因此,熔絲元件1與習知相較,可以說熱傳導效率變得非常高。
Although the heat emitted from the
又,於熔絲元件1,由於發熱體引出電極9之連接部9a亦直接與發熱體5接觸,因此熱傳導效率更高,而能更有效率的加熱可熔導體10。
In addition, in the
如以上所述,於熔絲元件1,由於能迅速有效率的將來自發熱體5之熱傳遞至可熔導體10,因此能提升可熔導體10之速熔斷性。
As described above, in the
〔第2實施形態〕 [Second Embodiment]
其次,說明第2實施形態。又,針對與第1實施形態中說明之熔絲元件1略同等之部位係賦予相同符號並省略說明,僅說明其差異。此外,作為等效電路,因與圖4所說明者相同,故省略說明。
Next, the second embodiment will be described. In addition, parts that are substantially equivalent to those of the
〔熔絲元件〕 〔Fuse element〕
第2實施形態之熔絲元件20,如圖6至圖8所示,具有貫通絕緣基板2之兩面用以進行電性連接之通孔9b,發熱體5、第1發熱體電極6及第2發熱體電極7設置在絕緣基板2之設置發熱體引出電極9之面的相反面,第2發熱體電極7與發熱體引出電極9透過通孔9b連接。
The
具體而言,於熔絲元件20,係將發熱體引出電極9與第2發熱體引出電極7,至少在與可熔導體10重疊位置,透過通孔9b加以電性連接。
Specifically, in the
於熔絲元件20,在絕緣基板2之背面2b設置第1發熱體電極6及第2發熱體電極7,並將發熱體5形成為連結第1發熱體電極6及第2發熱體電極7,將第1絕緣層12形成為覆蓋發熱體5。
In the
通孔9b係在發熱體引出電極9、第2發熱體引出電極7及可熔導體10重疊之位置設有複數個之圓筒形導電路徑,形成在設於絕緣基板2之貫通孔的內側面。
The through
通孔9b,可在絕緣基板2之貫通孔之內側面,使用Cu或Ag等之一般的導電材料形成,將導電材料行成為糊狀加以塗布據以和發熱體引出電極9一起形成。又,通孔9b,以充填有導電材料之被埋起的通孔較佳。被埋起之通孔,除能降低電阻值、亦能確保熱傳導路徑。
The through
又,於熔絲元件20,例示了設置3個通孔9b之構成,但通孔之數量當然是可以任意決定。通孔9b,為了將來自發熱體5之熱均勻地傳遞至發熱體引出電極9,以在與第2發熱體電極7重疊之位置,於第2發熱體電極7之引出方向以均等間隔配置較佳。
In addition, in the
熔絲元件20,在從第1發熱體電極6流過電流時,發熱體5即發熱,以第2發熱體電極7及通孔9b為主要之熱傳導路徑加熱發熱體引出電極9,以使發熱體引出電極9上之可熔導體10熔融。如此,於熔絲元件20,第1電極3及第2電極4間之電流路徑即被遮斷,且對發熱體5之電流路徑亦被遮斷。
The
從發熱體5發出之熱,雖亦透過絕緣基板2傳遞至表面2a之發熱體引出電極9,但藉由熱傳導率較絕緣基板2高之通孔9b於垂直方向迅速地傳遞,迅速地加熱發熱體引出電極9、並迅速地加熱與通孔9b重疊配置之可熔導體10。因此,熔絲元件20,與後述之參考例相較,可以說熱傳導效率非常的高。
The heat emitted from the
以上所述之熔絲元件20,由於能將來自發熱體5之熱迅速有效率的傳遞至可熔導體10,因此能提升可熔導體10之速熔斷性。
The above-mentioned
〔第3實施形態〕 [The third embodiment]
其次,說明第3實施形態。又,針對與第1實施形態中說明之熔絲元件1略同等之部位係賦予相同符號並省略說明,僅說明其差異。此外,作為等效電路,因與圖4所說明者大致相同,但因一部分有所差異,因此進行簡單的說明。
Next, the third embodiment will be described. In addition, parts that are substantially equivalent to those of the
〔熔絲元件〕 〔Fuse element〕
第3實施形態之熔絲元件30,如圖9至圖11所示,與熔絲元件1相較,係省略了連接在絕緣基板2上之發熱體5之第2發熱體電極7之構成,具有絕緣基板2、設在絕緣基板2上之第1電極3及第2電極4、設在絕緣基板2上之發熱體5、連接於發熱體5之第1發熱體電極6、連接於第1發熱體電極6之第3電極8、連接於發熱體5之發熱體引出電極9、以及經由發熱體引出電極9連接在第1電極3及第2電極4間之各個的可熔導體10,至少在與可熔導體10重疊之位置,將發熱體5與發熱體引出電極9加以連接。
The
發熱體引出電極9,在與可熔導體10重疊之位置,具有與發熱體5連接之連接部9a,於連接部9a之前端與發熱體5連接。因此,由於發熱體引出電極9係將從發熱體5發出之熱透過連接部9a朝可熔導體10傳遞於垂直方向,因此構成一到可熔導體10之最短路徑之熱傳導路徑。
The heating
熔絲元件30與熔絲元件1相較,由於係省略了第2發熱體電極7之構成,因此不但構成簡化、且能將從發熱體5發出之熱直接透過連接部9a傳遞至可熔導體10,因此能更為提高熱傳遞效率。熔絲元件30,可以是說將熔絲元件1中之第2發熱體電極7之功能賦予在發熱體引出電極9之連接部9a之前端者。
Compared with the
〔電路構成〕 [Circuit configuration]
接著,說明熔絲元件30之電路構成、與通電路徑之遮斷動作。熔絲元件30,如圖12(A)所示,從第1電極3跨至第2電極4連接有可熔導體10,於可熔導體10之途中部分連接有發熱體引出電極9。又,發熱體引出電極9,在與可熔導體10連接之側之相反側,依序連接於發熱體5、第1發熱體電極6。
Next, the circuit configuration of the
熔絲元件30,其構成為主電流從第1電極3流向第2電極4,在從第1發熱體電極6流過電流之情形時,發熱體5發熱、以連接部9a為主要的熱傳導路徑加熱發熱體引出電極9,如圖12(B)所示,發熱體引出電極9上之可熔導體10即熔融。如此,於熔絲元件30,第1電極3及第2電極4間之電流路徑即被遮斷、且對發熱體5之電流路徑亦被遮斷。
The
從發熱體5發出之熱雖亦透過第1絕緣層12傳遞至發熱體引出電極9,但因熱傳導率較第1絕緣層12高之發熱體引出電極9之連接部9a而迅速地於垂直方向傳遞,迅速地加熱發熱體引出電極9、且亦迅速地加熱與連接部9a重疊配置之可熔導體10。因此,熔絲元件30與後述之參考例相較,可以說熱傳導效率非常高。
Although the heat emitted from the
又,熔絲元件30,由於發熱體引出電極9之連接部9a直接與發熱體5接觸,因此熱傳導效率更高,能更有效率的加熱可熔導體10。
In addition, since the connecting
如以上之熔絲元件30,由於能將來自發熱體5之熱迅速、有效率的傳遞至可熔導體10,因此能提升可熔導體10之速熔斷性。
As the above-mentioned
〔第4實施形態〕 [Fourth Embodiment]
其次,說明第4實施形態。又,針對與第1實施形態中說明之熔絲元件1略同等之部位係賦予相同符號並省略說明,僅說明其差異。此外,作為等效電路,因與圖4所說明者相同,故省略說明。
Next, the fourth embodiment will be described. In addition, parts that are substantially equivalent to those of the
〔熔絲元件〕 〔Fuse element〕
第4實施形態之熔絲元件40,如圖13至圖15所示,具有貫通絕緣基板2之兩面用以進行電性連接之通孔9b,發熱體5、第1發熱體電極6及第2發熱體電極7被設置在絕緣基板2之設有發熱體引出電極9之面的相反
面,將第2發熱體電極7與發熱體引出電極9透過通孔9b加以連接。
The
具體而言,熔絲元件40,將發熱體引出電極9與發熱體5在與、可熔導體10重疊之位置,透過通孔9b電性連接。
Specifically, the
熔絲元件40,在絕緣基板2之背面2b設有發熱體5,於發熱體5上之相對向之兩端邊形成第1發熱體電極6及第2發熱體電極7,並以覆蓋發熱體5、第1發熱體電極6及第2發熱體電極7之方式形成有第1絕緣層12。
The
熔絲元件40,在從第1發熱體電極6流過電流之情形時,發熱體5發熱,以通孔9b為主要之熱傳導路徑加熱發熱體引出電極9,發熱體引出電極9上之可熔導體10即熔融。如此,於熔絲元件40,第1電極3及第2電極4間之電流路徑即被遮斷、且對發熱體5之電流路徑亦被遮斷。
The
從發熱體5發出之熱雖亦透過絕緣基板2傳遞至表面2a之發熱體引出電極9,但因熱傳導率較絕緣基板2高之通孔9b而迅速地往垂直方向傳遞,迅速地加熱發熱體引出電極9、且亦迅速地加熱與通孔9b重疊配置之可熔導體10。因此,熔絲元件40與後述參考例相較,可以說熱傳導效率非常的高。
The heat emitted from the
又,熔絲元件40,由於通孔9b直接與發熱體5接觸,因此熱傳導效率更高,能以良好效率加熱可熔導體10。
In addition, since the
如以上之熔絲元件40,由於能將來自發熱體5之熱迅速、有效率的傳遞至可熔導體10,因此能提升可熔導體10之速熔斷性。
As the
〔參考例〕 [Reference example]
此處,針對將第1實施形態至第4實施形態中說明之熔絲元件所具有
之熱傳導路徑不與可熔導體10重疊之構成,使用參考例加以說明之。又,針對與第1實施形態中說明之熔絲元件1略同等之部位係賦予相同符號並省略說明,僅說明其差異。此外,作為等效電路,因與圖4所說明者大致相同,但因一部分有所差異,因此進行簡單的說明。
Here, regarding the fuse elements described in the first embodiment to the fourth embodiment
The configuration in which the heat conduction path does not overlap with the
〔熔絲元件〕 〔Fuse element〕
參考例之熔絲元件50,如圖16至圖18所示,與熔絲元件1相較,係發熱體引出電極9之連接對象為電阻測定電極11,在與可熔導體10重疊之位置不與發熱體5及第2發熱體電極7連接之構成,具有絕緣基板2、設在絕緣基板2上之第1電極3及第2電極4、設在絕緣基板2上之發熱體5、連接於發熱體5之第1發熱體電極6、連接於第1發熱體電極6之第3電極8、連接於第2發熱體電極7之電阻測定電極11、連接於電阻測定電極11之發熱體引出電極9、以及將第1電極3及第2電極4間經由發熱體引出電極9分別連接之可熔導體10。
The
發熱體引出電極9,具有延伸至電阻測定電極11之連接部9c,透過連接部9c與電阻測定電極11電性連接。發熱體引出電極9,在與可熔導體10重疊之位置未與發熱體5及第2發熱體電極7連接。
The heating
因此,熔絲元件50,從發熱體5發出之熱之傳導路徑成為經由第2發熱體電極7、電阻測定電極11、連接部9c,非常的長。從而,於熔絲元件50,從發熱體5往可熔導體10之熱,係以第1絕緣層12為主要之熱傳導路徑進行傳遞。
Therefore, the
〔電路構成〕 [Circuit configuration]
接著,說明熔絲元件50之電路構成、與通電路徑之遮斷動作。熔絲元
件50,如圖19(A)所示,從第1電極3跨至第2電極4連接有可熔導體10,在可熔導體10之途中部分連接有發熱體引出電極9。又,發熱體引出電極9,在與可熔導體10連接之側之相反側,依序連接有電阻測定電極11、第2發熱體電極7、發熱體5、第1發熱體電極6。
Next, the circuit configuration of the
熔絲元件50,係構成為主電路之電流從第1電極3流向第2電極4,從第1發熱體電極6流過電流之情形時,發熱體5發熱,以第1絕緣層12為主要之熱傳導路徑加熱發熱體引出電極9,如圖19(B)所示,發熱體引出電極9上之可熔導體10即熔融。如此,於熔絲元件50,第1電極3及第2電極4間之電流路徑被遮斷,且對發熱體5之電流路徑亦被遮斷。
The
從發熱體5發出之熱雖亦透過第2發熱體電極7、電阻測定電極11、連接部9c傳遞至發熱體引出電極9,但如上所述,因熱傳導路徑長,因此對可熔導體10之加熱之助益是極少的。
Although the heat emitted from the
因此,當比較上述參考例與第1實施形態至第4實施形態時,能容易地理解第1實施形態至第4實施形態中之熔絲元件之熱傳導效率是非常高的。此外,第1實施形態至第4實施形態中之熔絲元件之熱傳導效率優異一事,對先前技術亦是相同的。 Therefore, when comparing the above-mentioned reference example with the first embodiment to the fourth embodiment, it can be easily understood that the heat conduction efficiency of the fuse element in the first embodiment to the fourth embodiment is very high. In addition, the excellent heat conduction efficiency of the fuse element in the first embodiment to the fourth embodiment is the same as the prior art.
〔總結〕 〔to sum up〕
上述第1實施形態至第4實施形態中說明之熔絲元件,將從發熱體連結至可熔導體之最短路徑藉由使用熱傳導率較絕緣基板及絕緣層高之發熱體引出電極形成熱傳導路徑,能將對熔導體迅速地傳遞發熱體之熱使可熔導體迅速熔斷,而獲得在對應大電流之同時、速熔斷性優異之保護元件。 In the fuse element described in the first to fourth embodiments, the shortest path connecting the heating element to the soluble conductor is formed by using the heating element lead electrode with higher thermal conductivity than the insulating substrate and insulating layer to form a thermal conduction path. It can quickly transfer the heat of the heating element to the fusible conductor to quickly fuse the fusible conductor, so as to obtain a protection element with excellent fast fusibility while responding to large currents.
又,第1實施形態至第4實施形態中之熔絲元件之構造,當 然是可適當地加以組合之構造。 In addition, the structure of the fuse element in the first embodiment to the fourth embodiment should be However, it is a structure that can be combined appropriately.
1:熔絲元件 1: Fuse element
2:絕緣基板 2: Insulating substrate
2a:表面 2a: surface
3:第1電極 3: The first electrode
3b:第1半通孔 3b: 1st half through hole
4:第2電極 4: The second electrode
4b:第2半通孔 4b: 2nd half through hole
5:發熱體 5: heating element
6:第1發熱體電極 6: The first heating element electrode
7:第2發熱體電極 7: The second heating element electrode
8:第3電極 8: 3rd electrode
8b:第3半通孔 8b: 3rd half through hole
9:發熱體引出電極 9: The heating element leads the electrode
9a:連接部 9a: Connection part
10:可熔導體 10: Fusible conductor
11:電阻測定電極 11: Resistance measuring electrode
12:第1絕緣體 12: The first insulator
12a:缺口部 12a: Notch
W1:可熔導體10之寬度
W1: width of
W2:連接部9a之寬度
W2: Width of connecting
Claims (13)
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JP7340979B2 (en) * | 2019-07-22 | 2023-09-08 | デクセリアルズ株式会社 | Protection elements and protection circuits |
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TWI503850B (en) * | 2013-03-22 | 2015-10-11 | Polytronics Technology Corp | Over-current protection device |
JP2015230804A (en) * | 2014-06-04 | 2015-12-21 | デクセリアルズ株式会社 | Short circuit element |
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JP2015230804A (en) * | 2014-06-04 | 2015-12-21 | デクセリアルズ株式会社 | Short circuit element |
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