JP2006310177A - Discharge lamp starting device, discharge lamp device, vehicular headlight, and vehicle - Google Patents

Discharge lamp starting device, discharge lamp device, vehicular headlight, and vehicle Download PDF

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JP2006310177A
JP2006310177A JP2005133121A JP2005133121A JP2006310177A JP 2006310177 A JP2006310177 A JP 2006310177A JP 2005133121 A JP2005133121 A JP 2005133121A JP 2005133121 A JP2005133121 A JP 2005133121A JP 2006310177 A JP2006310177 A JP 2006310177A
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discharge lamp
circuit
starting device
conductive plate
pulse
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Japanese (ja)
Inventor
健一 ▲高▼松
Kenichi Takamatsu
Masanori Sato
昌紀 佐藤
Masaaki Nakada
公明 中田
Kazuhiko Kinutani
和彦 絹谷
Mizuhito Ida
瑞人 井田
Hideki Hamada
英毅 濱田
Hisanao Kajiura
久尚 梶浦
Tomoyuki Nakano
智之 中野
Hisao Seto
学雄 瀬戸
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Priority to JP2005133121A priority Critical patent/JP2006310177A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a discharge lamp starting device with damage of a jointing member between circuit components and a circuit board restrained, as well as a discharge lamp device, a vehicular headlight, and a vehicle using the discharge lamp starting device. <P>SOLUTION: Semicircular convex parts 51a protruded in a direction crossing an aligning direction of terminals of circuit components mounted on a mounting part 52 in the vicinity of the mounting part 52 is provided at a buried part 51 of a conductive plate 5 covered by a molded body 6. Even in case temperature of a three-dimensionally molded circuit board 2 rises, deformation of the molded body 6 is restrained by the convex part 51a of the conductive plate 5, so that stress applied on the jointing member is alleviated, and therefore, damage of the jointing member is restrained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、パルストランスを用いた放電灯始動装置、及びこの放電灯始動装置を備える放電灯装置、車両用前照灯並びに車両に関するものである。   The present invention relates to a discharge lamp starting device using a pulse transformer, a discharge lamp device including the discharge lamp starting device, a vehicle headlamp, and a vehicle.

従来から、パルス電圧を生成するパルス回路とパルス回路で生成されたパルス電圧を増幅して放電灯に加えるパルストランスとを備え、放電灯に高電圧パルスを加えることにより放電灯を始動させる放電灯始動装置が提供されている。この種の放電灯始動装置において、放電灯が取り付けられるソケットを一体に設けることにより、放電灯を用いた照明器具を小型化することが提案されている(例えば、特許文献1参照)。
特開2002−216534号公報
2. Description of the Related Art Conventionally, a discharge lamp having a pulse circuit that generates a pulse voltage and a pulse transformer that amplifies the pulse voltage generated by the pulse circuit and applies the pulse voltage to the discharge lamp, and starts the discharge lamp by applying a high voltage pulse to the discharge lamp. A starter is provided. In this type of discharge lamp starting device, it has been proposed to downsize a luminaire using a discharge lamp by integrally providing a socket to which the discharge lamp is attached (see, for example, Patent Document 1).
JP 2002-216534 A

ところで、パルス回路を構成する回路部品が実装される回路基板は、主に回路部品よりも線膨張率が高い合成樹脂から構成される。   By the way, the circuit board on which the circuit components constituting the pulse circuit are mounted is mainly composed of a synthetic resin having a higher linear expansion coefficient than the circuit components.

また、上記のように放電灯が取り付けられるソケットが一体に設けられた放電灯始動装置では、回路基板が放電灯に近接する。従って、点灯時には放電灯の熱によって回路基板が熱膨張し、消灯時には回路基板が収縮することになる。回路基板が膨張・収縮すると、回路基板において回路部品の端子が実装された部位間の距離が変化するため、回路基板に表面実装された回路部品と回路基板との接合に用いられる例えばはんだからなる接合部材が、放電灯の点灯・消灯の度に繰り返して応力を受け、破損することがあった。特に、車両用前照灯に用いる場合、屋外で使用されるため、放電灯の点灯時と消灯時との温度差が大きくなりやすい。   In the discharge lamp starting device in which the socket to which the discharge lamp is attached is integrally provided as described above, the circuit board is close to the discharge lamp. Therefore, the circuit board is thermally expanded by the heat of the discharge lamp when the lamp is turned on, and the circuit board is contracted when the lamp is turned off. When the circuit board expands / contracts, the distance between the parts where the circuit component terminals are mounted on the circuit board changes, so that the circuit board is made of, for example, solder used to join the circuit board surface-mounted to the circuit board. The joining member was repeatedly subjected to stress each time the discharge lamp was turned on / off, and sometimes damaged. In particular, when used for a vehicle headlamp, since it is used outdoors, the temperature difference between when the discharge lamp is turned on and when it is turned off tends to increase.

本発明は上記事由に鑑みて為されたものであり、その目的は、回路部品と回路基板との間の接合部材の破損が抑制される放電灯始動装置を提供することにある。   This invention is made | formed in view of the said reason, The objective is to provide the discharge lamp starter by which the failure | damage of the joining member between a circuit component and a circuit board is suppressed.

請求項1の発明は、パルス電圧を生成するパルス回路と、両端間にパルス回路が接続される1次巻線と放電灯の両端間に接続される2次巻線とを有しパルス回路が生成したパルス電圧を増幅して放電灯に加え始動させるパルストランスと、それぞれ導電材料からなる複数個の導電板がそれぞれ合成樹脂にインサート成形されてなりパルス回路を構成する各回路部品がそれぞれ実装された立体成形回路基板とを備え、各導電板は、それぞれ立体成形回路基板の合成樹脂部分である成形体から露出して回路部品の端子が表面実装される実装部と、成形体に覆われる埋込部とを有し、導電板と合成樹脂との機械的結合を強めるための起伏を、各導電板の埋込部にそれぞれ設けたことを特徴とする。   The invention of claim 1 includes a pulse circuit for generating a pulse voltage, a primary winding having a pulse circuit connected between both ends, and a secondary winding connected between both ends of a discharge lamp. A pulse transformer that amplifies the generated pulse voltage and starts it by adding it to the discharge lamp, and a plurality of conductive plates each made of a conductive material are insert-molded in synthetic resin, and each circuit component constituting the pulse circuit is mounted. Each conductive plate is exposed from a molded body, which is a synthetic resin portion of the three-dimensional molded circuit board, and a mounting portion on which a terminal of a circuit component is surface-mounted, and a buried portion covered with the molded body. And an undulation for strengthening the mechanical coupling between the conductive plate and the synthetic resin is provided in each embedded portion of each conductive plate.

この発明によれば、一般的に線膨張率が合成樹脂よりも低い導体板に対する機械的結合が起伏で強化されることにより成形体の変形が抑制されるから、導電板の実装部と回路部品との間の接合部材にかかる応力が低減され、従って接合部材の破損が抑制される。   According to the present invention, since the deformation of the molded body is suppressed by strengthening the mechanical connection to the conductor plate whose linear expansion coefficient is generally lower than that of the synthetic resin by undulations, the mounting portion of the conductive plate and the circuit component The stress applied to the bonding member between the two is reduced, and therefore the breakage of the bonding member is suppressed.

請求項2の発明は、請求項1の発明において、各導電板の実装部において、回路部品の端子が結合する部位と埋込部との間に、回路部品の端子が並ぶ方向に弾性を有する弾性部が設けられていることを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, the mounting portion of each conductive plate has elasticity in the direction in which the terminals of the circuit component are arranged between the portion where the terminal of the circuit component is coupled and the embedded portion. An elastic part is provided.

この発明によれば、成形体の変形が弾性部によって吸収されるから、導電板の実装部と回路部品との間の接合部材にかかる応力がさらに低減され、接合部材がより破損しにくくなる。   According to this invention, since the deformation of the molded body is absorbed by the elastic portion, the stress applied to the joining member between the mounting portion of the conductive plate and the circuit component is further reduced, and the joining member is more difficult to break.

請求項3の発明は、請求項2の発明において、弾性部は、回路部品の端子が並ぶ方向に交差する方向から見てU字形状に実装部が曲げられてなることを特徴とする。   According to a third aspect of the present invention, in the second aspect of the present invention, the elastic portion is formed by bending the mounting portion in a U shape when viewed from a direction intersecting the direction in which the terminals of the circuit components are arranged.

請求項4の発明は、請求項2の発明において、弾性部は、実装部に貫通穴が設けられることにより形成されることを特徴とする。   According to a fourth aspect of the present invention, in the second aspect of the present invention, the elastic portion is formed by providing a through hole in the mounting portion.

請求項5の発明は、請求項1〜4のいずれかの発明において、実装部において回路部品が実装される面の反対面に、導電板の材料よりも線膨張率の高い材料からなり導電板に機械的に結合して導電板の反りを抑制する変形抑制体を備えることを特徴とする。   The invention according to claim 5 is the conductive plate according to any one of claims 1 to 4, wherein the conductive plate is made of a material having a higher linear expansion coefficient than the material of the conductive plate on the surface opposite to the surface on which the circuit component is mounted in the mounting portion. And a deformation suppressing body that is mechanically coupled to the conductive plate to suppress warping of the conductive plate.

この発明によれば、回路部品の発する熱による導電板の反りが変形抑制体によって抑制されるから、導電板の反りにより導電板の実装部と回路部品との間の接合部材にかかる応力が低減され、接合部材がより破損しにくくなる。   According to the present invention, since the warpage of the conductive plate due to the heat generated by the circuit component is suppressed by the deformation suppressing body, the stress applied to the joining member between the mounting portion of the conductive plate and the circuit component is reduced by the warpage of the conductive plate. As a result, the joining member is less likely to be damaged.

請求項6の発明は、請求項1〜5のいずれかの発明において、回路部品の端子が並ぶ方向に交差する断面での断面積を小さくする凹部が成形体に設けられていることを特徴とする。   The invention of claim 6 is characterized in that, in the invention of any one of claims 1 to 5, a recess for reducing the cross-sectional area in the cross section intersecting the direction in which the terminals of the circuit components are arranged is provided in the molded body. To do.

この発明によれば、成形体の熱膨張に伴って生じる応力であって回路部品の端子が並ぶ方向の応力が低減されるから、導電板の実装部と回路部品との間の接合部材にかかる応力が低減され、接合部材がより破損しにくくなる。   According to the present invention, since the stress in the direction in which the terminals of the circuit component are arranged is reduced due to the thermal expansion of the molded body, the stress is applied to the joining member between the mounting portion of the conductive plate and the circuit component. The stress is reduced, and the joining member is more difficult to break.

請求項7の発明は、請求項1〜6のいずれかの発明において、パルストランスにおいて、1次巻線と2次巻線との少なくとも一方は磁性体からなるコアに直接巻回されていることを特徴とする。   The invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein in the pulse transformer, at least one of the primary winding and the secondary winding is directly wound around a core made of a magnetic material. It is characterized by.

この発明によれば、1次巻線や2次巻線とコアとの間にボビンを挟む場合に比べて小型化が可能となる。   According to the present invention, it is possible to reduce the size as compared with the case where the bobbin is sandwiched between the primary winding or the secondary winding and the core.

請求項8の発明は、請求項1〜7のいずれかの発明において、パルストランスと立体成形回路基板とは、パルストランスと立体成形回路基板との少なくとも一方に設けられた結合手段により機械的に結合することを特徴とする。   According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the pulse transformer and the three-dimensional molded circuit board are mechanically connected by a coupling means provided on at least one of the pulse transformer and the three-dimensional molded circuit board. It is characterized by combining.

この発明によれば、立体成形回路基板にパルストランスをインサート成形する場合に比べ、立体成形回路基板に不良が発生した場合のリスクが低減されるから、製造コストの低減が可能となる。   According to the present invention, compared with the case where the pulse transformer is insert-molded on the three-dimensionally molded circuit board, the risk when a defect occurs in the three-dimensionally molded circuit board is reduced, and thus the manufacturing cost can be reduced.

請求項9の発明は、請求項1〜8のいずれかの発明において、放電灯を保持するとともに放電灯とパルストランスとを電気的に接続するソケットを有することを特徴とする。   A ninth aspect of the invention is characterized in that, in any of the first to eighth aspects of the invention, the discharge lamp is held and a socket for electrically connecting the discharge lamp and the pulse transformer is provided.

請求項10の発明は、請求項1〜9のいずれか記載の放電灯始動装置と、放電灯始動装置によって始動される放電灯とを備えることを特徴とする。   A tenth aspect of the invention includes the discharge lamp starting device according to any one of the first to ninth aspects, and a discharge lamp started by the discharge lamp starting device.

請求項11の発明は、請求項10記載の放電灯装置と、放電灯を点灯維持させる電力を生成する放電灯点灯装置と、放電灯点灯装置と放電灯装置とを保持し車両に取り付けられるハウジングとを備えることを特徴とする。   An eleventh aspect of the invention is the discharge lamp device according to the tenth aspect, a discharge lamp lighting device that generates electric power for maintaining the lighting of the discharge lamp, and a housing that holds the discharge lamp lighting device and the discharge lamp device and is attached to the vehicle. It is characterized by providing.

請求項12の発明は、請求項11記載の車両用前照灯を備えることを特徴とする。   According to a twelfth aspect of the present invention, the vehicle headlamp according to the eleventh aspect is provided.

本発明によれば、導体板と成形体との機械的結合を強化するための起伏を導体板に設けたので、導体板は線膨張率が合成樹脂よりも低いことにより成形体の変形が抑制されるから、導電板の実装部と回路部品との間の接合部材にかかる応力が低減され、従って接合部材の破損が抑制される。また、接合部材が温度変化による応力を繰り返して受けて破損するまでの寿命を延長することができる。   According to the present invention, since the conductor plate is provided with undulations for strengthening the mechanical coupling between the conductor plate and the molded body, the conductor plate has a lower coefficient of linear expansion than the synthetic resin, thereby suppressing deformation of the molded body. As a result, the stress applied to the joining member between the mounting portion of the conductive plate and the circuit component is reduced, and therefore, the breakage of the joining member is suppressed. Further, it is possible to extend the life until the joining member is repeatedly damaged by temperature stress.

以下、本発明を実施するための最良の形態について、図面を参照しながら説明する。   The best mode for carrying out the present invention will be described below with reference to the drawings.

まず、本実施形態に係る放電灯始動装置1(図4参照)の回路構成について、図2を用いて説明する。本実施形態は、3個の入力端子TI1〜TI3と3個の出力端子TO1〜TO3とを有する。第1の出力端子TO1、第2の出力端子TO2並びに第3の出力端子TO3はそれぞれ放電灯としてのHIDランプ(高輝度放電灯)Laの互いに異なる端子に接続され、第2の出力端子TI1と第3の出力端子TI3とは放電灯Laの端子を介して互いに電気的に接続される。   First, the circuit configuration of the discharge lamp starting device 1 (see FIG. 4) according to the present embodiment will be described with reference to FIG. This embodiment has three input terminals TI1 to TI3 and three output terminals TO1 to TO3. The first output terminal TO1, the second output terminal TO2, and the third output terminal TO3 are respectively connected to different terminals of an HID lamp (high-intensity discharge lamp) La as a discharge lamp, and are connected to the second output terminal TI1. The third output terminal TI3 is electrically connected to each other via the terminal of the discharge lamp La.

第1の入力端子TI1と第2の出力端子TO2との間には、パルストランス3の1次巻線N1とスパークギャップSGとの直列回路と充電コンデンサCvとの並列回路が接続されている。   Between the first input terminal TI1 and the second output terminal TO2, a series circuit of a primary winding N1 of the pulse transformer 3 and a spark gap SG and a parallel circuit of a charging capacitor Cv are connected.

第2の入力端子TO2は、フィルターチョークLcの一方の巻線を介して第3の出力端子TO3に接続されている。また、第3の入力端子TI3は、フィルターチョークLcの他方の巻線とパルストランス3の2次巻線N2とを介して第1の出力端子TI1に接続されている。さらに、フィルターチョークLcの後段には、フィルターチョークLcとともにフィルタ回路を構成するラインバイパスコンデンサ(以下、「Yコンデンサ」と呼ぶ。)Cyとアクロスザラインコンデンサ(以下、「Xコンデンサ」と呼ぶ。)Cxとが設けられている。   The second input terminal TO2 is connected to the third output terminal TO3 via one winding of the filter choke Lc. The third input terminal TI3 is connected to the first output terminal TI1 via the other winding of the filter choke Lc and the secondary winding N2 of the pulse transformer 3. Furthermore, a line bypass capacitor (hereinafter referred to as “Y capacitor”) Cy and an across-the-line capacitor (hereinafter referred to as “X capacitor”) that form a filter circuit together with the filter choke Lc are provided at the subsequent stage of the filter choke Lc. Cx.

図2の回路の動作を説明する。HIDランプLaを始動するには、出力端子TO1〜TO3にHIDランプLaが接続された状態で、第2の入力端子TI2に対して第1の入力端子TI1と第3の入力端子TI3とにそれぞれ正の電圧を加える。例えば、第1の入力端子TI1,第2の入力端子TI2、第3の入力端子TI3の電位をそれぞれ例えば−380V,600V,0Vとする。すると、充電コンデンサCvが充電され、やがて充電コンデンサCvの両端電圧が所定値を越えることによりスパークギャップSGが導通し、パルストランス3の1次巻線N1にパルス電圧が出力される。このときパルストランス3の2次巻線N2に生じたパルス電圧が、第2の入力端子TI2と第3の入力端子TI3との間の電圧に重畳してHIDランプLaに加えられ、HIDランプLaを始動させる。つまり、スパークギャップSGと充電コンデンサCvとが請求項におけるパルス回路を構成している。第2の出力端子TO2と第3の出力端子TO3とがHIDランプLaの端子を介して電気的に接続されていなければ充電コンデンサCvは充電されないので、HIDランプLaが取り付けられていない状態での高電圧パルスの発生を防ぐことができる。   The operation of the circuit of FIG. 2 will be described. To start the HID lamp La, with the HID lamp La connected to the output terminals TO1 to TO3, the first input terminal TI1 and the third input terminal TI3 are respectively connected to the second input terminal TI2. Apply a positive voltage. For example, the potentials of the first input terminal TI1, the second input terminal TI2, and the third input terminal TI3 are set to, for example, −380V, 600V, and 0V, respectively. Then, the charging capacitor Cv is charged. Eventually, the voltage across the charging capacitor Cv exceeds a predetermined value, whereby the spark gap SG becomes conductive, and a pulse voltage is output to the primary winding N1 of the pulse transformer 3. At this time, the pulse voltage generated in the secondary winding N2 of the pulse transformer 3 is superimposed on the voltage between the second input terminal TI2 and the third input terminal TI3 and applied to the HID lamp La, and the HID lamp La Start. That is, the spark gap SG and the charging capacitor Cv constitute a pulse circuit in the claims. Since the charging capacitor Cv is not charged unless the second output terminal TO2 and the third output terminal TO3 are electrically connected via the terminal of the HID lamp La, the HID lamp La is not attached. Generation of high voltage pulses can be prevented.

次に、本実施形態に係る放電灯始動装置1の構造について説明する。本実施形態に係る放電灯始動装置1は、図3に示すように、パルス回路を構成する各回路部品とYコンデンサCyとXコンデンサCxとがそれぞれ実装されパルストランス3が機械的且つ電気的に結合する立体成形回路基板2と、図4に示すように立体成形回路基板2とパルストランス3とが結合したものを覆うケース4と、ケース4に収納されるチョークコイルLc(図2にのみ図示)とを備える。   Next, the structure of the discharge lamp starting device 1 according to this embodiment will be described. As shown in FIG. 3, the discharge lamp starting device 1 according to the present embodiment has each circuit component constituting a pulse circuit, a Y capacitor Cy, and an X capacitor Cx mounted thereon, and the pulse transformer 3 is mechanically and electrically connected. A solid molded circuit board 2 to be coupled, a case 4 covering a combination of the solid molded circuit board 2 and the pulse transformer 3 as shown in FIG. 4, and a choke coil Lc accommodated in the case 4 (shown only in FIG. 2) ).

ここで、立体成形回路基板2にパルストランス3をインサート成形する場合、回路部品を実装する際のミスなどの不良によって立体成形回路基板2を破棄するときにパルストランス3をも破棄することになる。しかし、本実施形態では、パルストランス3を立体成形回路基板2とは別体に形成することにより、立体成形回路基板2にパルストランス3をインサート成形する場合と違い、不良が発生した立体成形回路基板2を破棄する場合にもパルストランス3が破棄されることはなく、不良の発生によるリスクが低減されるから、製造コストを低減することができる。   Here, when the pulse transformer 3 is insert-molded on the three-dimensionally molded circuit board 2, the pulse transformer 3 is also discarded when the three-dimensionally molded circuit board 2 is discarded due to a defect such as a mistake in mounting circuit components. . However, in the present embodiment, unlike the case in which the pulse transformer 3 is formed on the three-dimensional molded circuit board 2 by forming the pulse transformer 3 separately from the three-dimensional molded circuit board 2, the three-dimensional molded circuit in which a defect has occurred. Even when the substrate 2 is discarded, the pulse transformer 3 is not discarded, and the risk due to the occurrence of defects is reduced, so that the manufacturing cost can be reduced.

また、ケース4には、図5に示すようにハーネスL1に設けられたプラグPLが接続されるプラグ接続部41が設けられている。さらに、パルストランス3には、ケース4に設けられたソケット穴42から露出して図6に示すようにHIDランプLaの口金La1が挿入されるソケット部3aが設けられている。放電灯始動装置1とHIDランプLaとは、ソケット穴42の内面とHIDランプLaの口金La1に設けられたピン(図示せず)とで構成される周知のバヨネット締結構造によって機械的に結合する。つまり、ソケット穴42の内面と、パルストランス3のソケット部3aとで請求項におけるソケットが構成される。なお、HIDランプLaを着脱自在とする代わりに、図7に示すように、HIDランプLaの口金La1に一体に形成してもよい。   Further, the case 4 is provided with a plug connecting portion 41 to which a plug PL provided in the harness L1 is connected as shown in FIG. Further, the pulse transformer 3 is provided with a socket portion 3a which is exposed from a socket hole 42 provided in the case 4 and into which a cap La1 of the HID lamp La is inserted as shown in FIG. The discharge lamp starting device 1 and the HID lamp La are mechanically coupled by a well-known bayonet fastening structure including an inner surface of the socket hole 42 and a pin (not shown) provided on the base La1 of the HID lamp La. . That is, the inner surface of the socket hole 42 and the socket portion 3a of the pulse transformer 3 constitute a socket in the claims. Instead of making the HID lamp La detachable, it may be formed integrally with the base La1 of the HID lamp La as shown in FIG.

まず、パルストランス3について説明する。パルストランス3は、図8に示すように、磁性体からなる円柱形状のコア31に、平角線からなる2次巻線N2を巻回し、これに2個の内側端子板33,34が合成樹脂にインサート成形されてなるホルダ32を取り付けたものを、さらに合成樹脂にインサート成形し、1次巻線N1と外側端子板35,36とを追加してなる。パルストランス3は、長手方向の一端に一方の内側端子板33が露出するとともに1次巻線N1が巻回される本体部3bを有し、ソケット部3aは、本体部3bの長手方向の他端部から本体部3bの短手方向に突出する有底円筒形状に形成されている。外側端子板35,36は、ソケット部3aの外周に保持され、ソケット部3aに取り付けられたHIDランプLaの口金La1と立体成形回路基板2とを電気的に接続する。また、ソケット部3aの内底面の中央には、円筒形状の内筒3cが突設されている。   First, the pulse transformer 3 will be described. As shown in FIG. 8, in the pulse transformer 3, a secondary winding N2 made of a rectangular wire is wound around a cylindrical core 31 made of a magnetic material, and two inner terminal plates 33 and 34 are made of synthetic resin. Further, the insert 32 and the holder 32 attached thereto are further insert-molded into a synthetic resin, and the primary winding N1 and the outer terminal plates 35 and 36 are added. The pulse transformer 3 has a main body portion 3b in which one inner terminal plate 33 is exposed at one end in the longitudinal direction and the primary winding N1 is wound, and the socket portion 3a is the other in the longitudinal direction of the main body portion 3b. It is formed in the bottomed cylindrical shape which protrudes from the edge part to the transversal direction of the main-body part 3b. The outer terminal plates 35 and 36 are held on the outer periphery of the socket portion 3a, and electrically connect the base La1 of the HID lamp La attached to the socket portion 3a and the three-dimensional molded circuit board 2. In addition, a cylindrical inner cylinder 3c projects from the center of the inner bottom surface of the socket portion 3a.

内側端子板33,34は、それぞれ、2次巻線N2の一端を挟むことにより2次巻線N2に電気的且つ機械的に接続される挟み部33a,34aと、パルストランス3の外面に露出する端子部33b,34bとを有する。一方の内側端子板34の端子部34bは、ホルダ32の連結部32bから短手方向に突設された台座部32dから突出し互いに対向する2個の板ばねとなっており、ソケット部3aの内筒33の内側に露出する。上記一方の内側端子板34と各外側端子板35,36とは、それぞれ、HIDランプLaの口金La1に設けられた端子(図示せず)に接触導通する。   The inner terminal plates 33 and 34 are respectively exposed to pinching portions 33a and 34a that are electrically and mechanically connected to the secondary winding N2 by pinching one end of the secondary winding N2, and to the outer surface of the pulse transformer 3. Terminal portions 33b and 34b. The terminal portion 34b of one inner terminal plate 34 is formed of two leaf springs that protrude from a pedestal portion 32d projecting in the short direction from the connecting portion 32b of the holder 32 and are opposed to each other. It is exposed inside the tube 33. The one inner terminal plate 34 and the outer terminal plates 35 and 36 are brought into contact with a terminal (not shown) provided on the base La1 of the HID lamp La.

次に、立体成形回路基板2について説明する。立体成形回路基板2は、図9及び図10に示すように、それぞれ金属板に打ち抜き加工と曲げ加工とが施されてなる複数個の導電板5が、合成樹脂にインサート成形されてなる。立体成形回路基板2のうち合成樹脂からなる部分を、以下では成形体6と呼ぶ。ここで、導電板5と成形体6とを結合させる方法としては、図11(a)に示すように導電板5に設けた貫通穴5aに成形体6に設けた突起6aを挿入し、図11(b)に示すように突起6aをかしめるという方法もあるが、本実施形態のようにインサート成形によって結合させたほうが機械的強度が得られる。   Next, the three-dimensional molded circuit board 2 will be described. As shown in FIGS. 9 and 10, the three-dimensionally formed circuit board 2 is formed by insert-molding a plurality of conductive plates 5 each formed by punching and bending a metal plate into a synthetic resin. A portion made of synthetic resin in the three-dimensional molded circuit board 2 is hereinafter referred to as a molded body 6. Here, as a method of joining the conductive plate 5 and the molded body 6, as shown in FIG. 11A, the protrusion 6 a provided on the molded body 6 is inserted into the through hole 5 a provided in the conductive plate 5, Although there is also a method of caulking the protrusions 6a as shown in FIG. 11 (b), mechanical strength can be obtained by bonding by insert molding as in this embodiment.

立体成形回路基板2は、全体として扁平に形成され、C字形状に窪んでパルストランス3のソケット部3aが内側に挿入されるソケット受け部2aが設けられている。また、図12に示すように、成形体6の一面には、それぞれ2方向に弾性的に撓み可能な2個のばね部61,62が立体成形回路基板2の厚さ方向であって互いに同じ方向に突設されている。各ばね部61,62の先部には、それぞれ撓み方向の一方へ係合爪61a,62aが突設されており、一方のばね部61の係合爪61aがパルストランス3のソケット部3aに係合し、他方のばね部62の係合爪62aがパルストランス3の本体部3bに係合することにより、立体成形回路基板2とパルストランス3とは機械的に結合する。つまり、ばね部61,62及び係合爪61a,62aが請求項における結合手段である。   The three-dimensionally molded circuit board 2 is formed in a flat shape as a whole, and is provided with a socket receiving portion 2a into which the socket portion 3a of the pulse transformer 3 is inserted inside by being recessed in a C shape. Further, as shown in FIG. 12, on one surface of the molded body 6, there are two spring portions 61 and 62 that can be elastically bent in two directions, respectively, in the thickness direction of the three-dimensional molded circuit board 2 and the same. Projected in the direction. Engaging claws 61a and 62a project from one end of each spring part 61 and 62 in one of the bending directions. The engaging claw 61a of one spring part 61 is connected to the socket part 3a of the pulse transformer 3. The three-dimensionally molded circuit board 2 and the pulse transformer 3 are mechanically coupled to each other by engaging the engaging claw 62a of the other spring portion 62 with the main body portion 3b of the pulse transformer 3. That is, the spring portions 61 and 62 and the engaging claws 61a and 62a are the coupling means in the claims.

各導電板5は、それぞれ、図13に示すように、成形体6に覆われる埋込部51と、回路部品が例えばはんだのような接合部材Sを用いて表面実装される実装部52とを有する。成形体6の複数箇所(図では5箇所)にはそれぞれ実装穴63が貫設されており、各実装穴63にはそれぞれ2個ずつの実装部52が露出する。実装部52において回路部品が実装される面は、実装穴63の開口面に対して窪んでいる。つまり、実装穴63の内周面によって回路部品の位置決めがなされるようになっている。また、共通の回路部品の異なる端子が実装される各実装部52は、同じ実装穴63の互いに対向する内面からそれぞれ突出している。ここで、本文中に単に回路部品とある説明に用いる図に、以下では回路部品の例として図13のように充電コンデンサCvを示しているが、XコンデンサCxやYコンデンサCy等の他の回路部品でも同様である。本実施形態では、回路部品として表面実装型のものを用いているから、回路部品としてピン実装型のものを用いる場合に比べ、回路部品の実装高さが小さいことにより小型化が可能となり、かつスルーホールが不要であることにより製造コストが低減される。   As shown in FIG. 13, each conductive plate 5 includes an embedded portion 51 covered with the molded body 6 and a mounting portion 52 on which a circuit component is surface-mounted using a joining member S such as solder. Have. Mounting holes 63 are provided in a plurality of locations (five locations in the drawing) of the molded body 6, and two mounting portions 52 are exposed in each mounting hole 63. The surface on which the circuit component is mounted in the mounting portion 52 is recessed with respect to the opening surface of the mounting hole 63. That is, the circuit component is positioned by the inner peripheral surface of the mounting hole 63. In addition, each mounting portion 52 on which different terminals of common circuit components are mounted protrudes from the mutually facing inner surfaces of the same mounting hole 63. Here, in the figure used for explanation which is simply a circuit component in the text, a charging capacitor Cv is shown below as an example of the circuit component as shown in FIG. 13, but other circuits such as an X capacitor Cx and a Y capacitor Cy are used. The same applies to parts. In this embodiment, since the surface mounting type is used as the circuit component, the mounting height of the circuit component is small compared with the case where the pin mounting type is used as the circuit component, and the size can be reduced. Manufacturing costs are reduced by eliminating the need for through holes.

接合部材Sとしてはんだを用いる場合、図14に示すように銅板Cuの一面にニッケルメッキNiと錫メッキSnとが重ねて形成されたものを用い、錫メッキSn上に回路部品を実装することが望ましい。ニッケルメッキNiの厚さは例えば3〜5μmとし、錫メッキSnの厚さは例えば0.5〜1μmとする。また、接合部材Sとして導電性接着剤を用いる場合は上記錫メッキSnに代えて金メッキ(図示せず)を用いることが望ましい。この場合、金メッキの厚さは例えば0.05〜0.15μmとする。   When solder is used as the joining member S, it is possible to mount a circuit component on the tin plating Sn by using a material obtained by superimposing nickel plating Ni and tin plating Sn on one surface of the copper plate Cu as shown in FIG. desirable. The thickness of the nickel plating Ni is, for example, 3 to 5 μm, and the thickness of the tin plating Sn is, for example, 0.5 to 1 μm. Further, when a conductive adhesive is used as the joining member S, it is desirable to use gold plating (not shown) instead of the tin plating Sn. In this case, the thickness of the gold plating is, for example, 0.05 to 0.15 μm.

ところで、スパークギャップSGは円柱形状の部品であって、スパークギャップSGの軸方向の両端部にはそれぞれ表面実装される端子(図示せず)が設けられている。そして、スパークギャップSGが実装される各実装部52において、それぞれ実装面52に直交する方向から見てスパークギャップSGの軸の両側には、図15に示すように、それぞれスパークギャップSGの外周面に当接してスパークギャップの回転を防止する回転止め部52aが設けられている。   By the way, the spark gap SG is a cylindrical part, and terminals (not shown) that are surface-mounted are provided at both ends in the axial direction of the spark gap SG. And in each mounting part 52 in which the spark gap SG is mounted, as shown in FIG. 15, on the both sides of the axis of the spark gap SG when viewed from the direction orthogonal to the mounting surface 52, the outer peripheral surface of the spark gap SG, respectively. Is provided with a rotation stopper 52a that prevents the spark gap from rotating.

また、立体成形回路基板2において、回路部品はそれぞればね部61,62が突出する側の面に実装されている。つまり、図3のようにパルストランス3を取り付けるに当たっては、立体成形回路基板2において、回路部品が実装された面をパルストランス3に向けることになる。さらに、回路部品のうち比較的小型であるXコンデンサCxとYコンデンサCyとを互いに近接させ、回路部品のうち比較的大型であるスパークギャップSGと充電コンデンサCvとを互いに近接させて実装している。また、立体成形回路基板2には、回路部品が実装された面から見て、XコンデンサCxとYコンデンサCyとが実装された小型部品実装部21を、スパークギャップSGと充電コンデンサCvとが実装された大型部品実装部22に対して窪ませる段2bを設けてある。パルストランス3が取り付けられた状態では、小型部品実装部21がパルストランス3の本体部3bに対向する。さらに、導電板6のうち2個には、それぞれソケット受け部2aの内周面から突出するソケット端子部53a,53bが設けられている。パルストランス3と立体成形回路基板2が結合した状態では、ソケット端子部53a,53bはそれぞれパルストランス3の外側端子板35,36に接触導通する。実装部52やソケット端子部53a,53b以外にも、各導電板5はそれぞれ電気的接続のために複数箇所で成形体6から突出させてある。   In the three-dimensional molded circuit board 2, the circuit components are mounted on the surfaces on which the spring portions 61 and 62 protrude, respectively. That is, when the pulse transformer 3 is attached as shown in FIG. 3, the surface on which the circuit components are mounted is directed to the pulse transformer 3 in the three-dimensional molded circuit board 2. Further, the X capacitor Cx and the Y capacitor Cy, which are relatively small among the circuit components, are mounted close to each other, and the spark gap SG and the charging capacitor Cv, which are relatively large among the circuit components, are mounted close to each other. . The three-dimensionally molded circuit board 2 has a small component mounting portion 21 in which an X capacitor Cx and a Y capacitor Cy are mounted, and a spark gap SG and a charging capacitor Cv as viewed from the surface on which circuit components are mounted. A step 2b is provided to be recessed with respect to the large component mounting portion 22 formed. In a state where the pulse transformer 3 is attached, the small component mounting portion 21 faces the main body portion 3 b of the pulse transformer 3. Further, two of the conductive plates 6 are provided with socket terminal portions 53a and 53b protruding from the inner peripheral surface of the socket receiving portion 2a. In a state where the pulse transformer 3 and the three-dimensional molded circuit board 2 are coupled, the socket terminal portions 53a and 53b are brought into contact with the outer terminal plates 35 and 36 of the pulse transformer 3, respectively. In addition to the mounting portion 52 and the socket terminal portions 53a and 53b, each conductive plate 5 is protruded from the molded body 6 at a plurality of locations for electrical connection.

以下、本実施形態の特徴部分について説明する。図1に示すように、本実施形態の導電板5の埋込部51において、実装部52の近傍には、実装部52に実装される回路部品の端子が並ぶ方向(すなわち、実装穴63内で実装部52が並ぶ方向)に交差する方向に突出した半円形状の凸部51aを設けている。凸部51aは通常の分岐とは別に、導電板5と成形体6との機械的結合を強化するために設けられている。   Hereafter, the characteristic part of this embodiment is demonstrated. As shown in FIG. 1, in the embedded portion 51 of the conductive plate 5 of the present embodiment, in the vicinity of the mounting portion 52, the terminal of the circuit component mounted on the mounting portion 52 is arranged (that is, in the mounting hole 63. In the direction in which the mounting parts 52 are arranged) is provided with a semicircular convex part 51a protruding in a direction intersecting with the mounting part 52. The convex portion 51 a is provided to reinforce the mechanical coupling between the conductive plate 5 and the molded body 6 separately from the normal branch.

上記構成によれば、導電板5に凸部51aを設けない場合に比べて導電板5と成形体6との機械的結合が強くなっているので、立体成形回路基板2の温度が上昇した場合にも、成形体6よりも線膨張率が低い導電板5によって成形体6の変形が抑制されるから、接合部材Sにかかる応力が低減され、従って接合部材Sの破損が抑制され、また、接合部材Sが温度変化による応力を繰り返して受けて破損するまでの寿命を延長することができる。さらに、凸部51aの突出方向を、実装穴63内で実装部52が並ぶ方向に交差する方向としたことにより、実装部52間の距離が変化する方向への成形体6の変形を抑制しやすく、接合部材Sにかかる応力を有効に低減することができる。   According to the above configuration, since the mechanical coupling between the conductive plate 5 and the molded body 6 is stronger than when the convex portion 51a is not provided on the conductive plate 5, the temperature of the three-dimensional molded circuit board 2 rises. In addition, since the deformation of the molded body 6 is suppressed by the conductive plate 5 having a lower linear expansion coefficient than that of the molded body 6, the stress applied to the joining member S is reduced, and therefore the breakage of the joining member S is suppressed. It is possible to extend the life until the joining member S is repeatedly damaged by the stress due to the temperature change. Further, the projecting direction of the convex portion 51a is set to a direction intersecting the direction in which the mounting portions 52 are arranged in the mounting holes 63, thereby suppressing the deformation of the molded body 6 in the direction in which the distance between the mounting portions 52 changes. It is easy and the stress applied to the joining member S can be effectively reduced.

なお、凸部51aの形状は半円形状に限られず、図16に示すように矩形状としてもよい。さらに、図17に示すように埋込部51に貫通穴51bを設けたり、図18に示すように回路部品の端子が並ぶ方向に突出した凸部51cを設けるとともに、凸部51cの両側に凹部51dを設けてもよい。この構成を採用すれば、貫通穴51bや凹部51dの内側に成形体6が形成されることにより成形体6の変形が抑制されるから、さらに高い効果が得られる。   In addition, the shape of the convex part 51a is not restricted to a semicircle shape, It is good also as a rectangular shape as shown in FIG. Furthermore, as shown in FIG. 17, the through hole 51b is provided in the embedded part 51, or the convex part 51c protruding in the direction in which the terminals of the circuit components are arranged as shown in FIG. 18, and the concave part is formed on both sides of the convex part 51c. 51d may be provided. By adopting this configuration, since the deformation of the molded body 6 is suppressed by forming the molded body 6 inside the through holes 51b and the recesses 51d, a higher effect can be obtained.

さらに、図18の例では、回路部品の端子が並ぶ方向に交差する方向での断面積を小さくする凹部64を、成形体6において実装穴63の内面に設けている。この構成により、接合部材Sにかかる応力がより低減されている。   Further, in the example of FIG. 18, a recess 64 that reduces the cross-sectional area in the direction intersecting the direction in which the terminals of the circuit components are arranged is provided on the inner surface of the mounting hole 63 in the molded body 6. With this configuration, the stress applied to the joining member S is further reduced.

また、図19に示すように、封止樹脂SRで各回路部品をそれぞれ封止してもよい。この場合、図20(a)のように実装面側のみ封止してもよいし、図20(b)のように両側を封止してもよい。また、図21のように複数個の回路部品を一括して封止してもよい。この構成を採用すれば、接合部材Sが封止樹脂SRで保護されるから、封止樹脂SRを設けない場合に比べて接合部材Sが更に破損しにくくなり、従って寿命がより延長される。封止樹脂SRとしては、成形体6を構成する合成樹脂よりも線膨張係数が小さい合成樹脂を用いれば、熱による成形体6の変形が封止樹脂SRによってさらに抑制されるから望ましい。また、接合部材Sの周囲への水の侵入が封止樹脂SRにより防止されるから、接合部材Sとして銀粒子を含む導電接着剤を用いる場合に、水を媒体とする銀のマイグレーションを防止することができる。   Further, as shown in FIG. 19, each circuit component may be sealed with a sealing resin SR. In this case, only the mounting surface side may be sealed as shown in FIG. 20A, or both sides may be sealed as shown in FIG. Further, as shown in FIG. 21, a plurality of circuit components may be sealed together. If this configuration is adopted, the bonding member S is protected by the sealing resin SR, and therefore, the bonding member S is more unlikely to be damaged than the case where the sealing resin SR is not provided, and thus the life is further extended. As the sealing resin SR, if a synthetic resin having a smaller linear expansion coefficient than the synthetic resin constituting the molded body 6 is used, it is desirable that the deformation of the molded body 6 due to heat is further suppressed by the sealing resin SR. In addition, since the sealing resin SR prevents water from entering the periphery of the bonding member S, when using a conductive adhesive containing silver particles as the bonding member S, silver migration using water as a medium is prevented. be able to.

さらに、回路部品を封止樹脂SRで封止する場合において、図22(a)(b)に示すように、封止の際に封止樹脂SRの漏れを防ぐ壁65を設けてもよい。壁65の形状は、図22(a)のように封止する範囲を全周にわたって囲む角筒形状でもよいし、図22(b)のように一部が欠けた形状であってもよい。この構成を採用すれば、必要な封止樹脂SRの量を減らすことができる。   Further, when the circuit component is sealed with the sealing resin SR, as shown in FIGS. 22A and 22B, a wall 65 that prevents leakage of the sealing resin SR at the time of sealing may be provided. The shape of the wall 65 may be a rectangular tube shape that surrounds the entire range to be sealed as shown in FIG. 22A, or may be a shape that is partially cut out as shown in FIG. 22B. If this configuration is adopted, the amount of the required sealing resin SR can be reduced.

また、図23(b)に示すように、逆U字形状に曲げられて回路部品の端子が並ぶ方向(図23の左右方向)に弾性を有する弾性部52bを、導電板5の実装部52において回路部品に結合する位置と埋込部51との間に設けてもよい。この構成を採用すれば、成形体6の変形によって発生する応力が弾性部52bによって吸収されるから、接合部材Sがさらに破損しにくくなる。または、図24に示すように実装部52の一部の幅寸法を大きくするとともに、幅寸法を大きくした部位に、導電板5の幅方向での寸法が導電板5の他の部位の幅寸法よりもわずかに大きい寸法とされた貫通穴52cを設けることにより、導電板5の幅方向で貫通穴52cを挟む両側にそれぞれ弾性部52bを形成してもよい。ここで、弾性部52bは図23(b)に示すように回路部品の端子が並ぶ方向に厚さ方向を向けるように曲げられた段形状とすることもできる。しかし、図23(a)の形状では弾性部52bを設けた分だけ回路部品が突出してしまい、立体成形基板2の厚さ方向(図23(a)の上下方向)での寸法が大きくなってしまうので、弾性部52bの形状は、図23(b)のような逆U字形状ないしU字形状か、図24のようにすることが望ましい。なお、図24の方法で弾性部52bを形成する場合、貫通穴52cの長手方向の寸法をより大きくすれば弾性部52bをより変形しやすくすることができ、貫通穴52cの短手方向の寸法をより小さくすれば実装部52の寸法をより小さくすることができる。   Further, as shown in FIG. 23B, the mounting portion 52 of the conductive plate 5 is provided with an elastic portion 52b which is bent in an inverted U shape and has elasticity in the direction in which the terminals of the circuit components are arranged (left and right direction in FIG. 23). 2 may be provided between the position where the circuit component is coupled to the embedded portion 51. By adopting this configuration, the stress generated by the deformation of the molded body 6 is absorbed by the elastic portion 52b, so that the joining member S is further hardly damaged. Alternatively, as shown in FIG. 24, the width dimension of a part of the mounting portion 52 is increased, and the width dimension of the conductive plate 5 is the width dimension of other portions of the conductive plate 5 at the increased width dimension. The elastic portions 52b may be formed on both sides of the through hole 52c in the width direction of the conductive plate 5 by providing the through hole 52c having a slightly larger dimension than the conductive plate 5. Here, as shown in FIG. 23 (b), the elastic portion 52b may have a step shape bent so that the thickness direction is directed in the direction in which the terminals of the circuit components are arranged. However, in the shape of FIG. 23A, the circuit component protrudes by the amount of the elastic portion 52b provided, and the dimension in the thickness direction (vertical direction of FIG. 23A) of the three-dimensionally molded substrate 2 increases. Therefore, the shape of the elastic portion 52b is preferably an inverted U shape or a U shape as shown in FIG. 23B, or as shown in FIG. In addition, when forming the elastic part 52b by the method of FIG. 24, if the dimension in the longitudinal direction of the through hole 52c is made larger, the elastic part 52b can be more easily deformed, and the dimension in the short direction of the through hole 52c. If the size is made smaller, the size of the mounting portion 52 can be made smaller.

ところで、成形体6だけでなく導電板5も熱膨張するため、図25(a)に示すように接合部材Sを用いて表面実装された回路部品が発熱した場合、導電板5は回路部品が実装される実装面側(図25(a)〜(d)における上面側)が反対面側よりも膨張することにより、図25(b)に示すように先端を回路部品から離す向きの反りが発生する。すると接合部材Sには図25(c)に矢印で示すような引張り応力がかかり、やがてクラックS1が発生することになる。   Incidentally, since not only the molded body 6 but also the conductive plate 5 is thermally expanded, when the circuit component mounted on the surface using the joining member S generates heat as shown in FIG. When the mounting surface side to be mounted (the upper surface side in FIGS. 25A to 25D) expands more than the opposite surface side, as shown in FIG. 25B, the warp in the direction of separating the tip from the circuit component is caused. appear. Then, a tensile stress as indicated by an arrow in FIG. 25C is applied to the joining member S, and a crack S1 is eventually generated.

そこで、図25(d)のように、導電板5において実装面の反対面側に、導電板5よりも熱膨張率の大きい材料からなる変形抑制体5bを設けてもよい。この構成を採用すれば、回路部品の発熱による導電板5の反りが変形抑制体5bによって抑制されるから、クラックS1の発生を防ぐことができる。   Therefore, as shown in FIG. 25D, a deformation suppressing body 5b made of a material having a larger thermal expansion coefficient than that of the conductive plate 5 may be provided on the opposite side of the mounting surface of the conductive plate 5. If this configuration is adopted, warping of the conductive plate 5 due to heat generation of the circuit components is suppressed by the deformation suppressing body 5b, and therefore the generation of the crack S1 can be prevented.

上述した放電灯始動装置1は、例えば図26(b)に示すように車両7に搭載される図26(a)に示すような車両用前照灯8に用いることができる。この車両用前照灯8は、放電灯始動装置1と、放電灯始動装置1に接続されたHIDランプLaとが収納される収納凹部81aが前面に設けられ例えばねじ止めによって車両7に取り付けられるハウジング81と、例えばガラスのような透明な材料からなりハウジング81の前側に取り付けられて収納凹部81aを覆うレンズ82とを備える。また、ハウジング81の後面には、メンテナンス時に放電灯始動装置1を出し入れするための放電灯挿入穴81bを設けてある。放電灯挿入穴81bは、放電灯始動装置1を避ける凹部83aが前面に設けられハウジング81に着脱自在に結合するキャップ83によって覆われる。さらに、ハウジング83の下側には、HIDランプLaを点灯維持させる放電灯点灯装置(図示せず)を収納した放電灯点灯ブロック84が取り付けられる。放電灯点灯装置は、例えば周知のインバータ回路からなり、ハーネスL2を介してバッテリー(図示せず)に接続され、バッテリーから得られる例えば12Vの直流電力を電源としてHIDランプLaを点灯維持させる交流電力を生成し、ハーネスL1と放電灯始動装置1とを介してHIDランプLaに供給する。ハウジング81の下面には、放電灯始動装置1とインバータ回路とを接続するハーネスL1が挿通される電線挿通穴81cが貫設されている。また、ハウジング81の収納凹部81aには、HIDランプLaの後側に配置されHIDランプLaの光を配光する反射板85が収納されている。さらに、ハウジング81には、反射板85に機械的に結合した光軸調整ねじ86が螺合しており、光軸調整ねじ86の締め付けを調整することにより、反射板85の向きを調整することができるようになっている。なお、車両7及び車両用前照灯8の各構成は周知技術で実現可能であるので、詳細な図示及び説明は省略する。   The discharge lamp starting device 1 described above can be used for a vehicle headlamp 8 as shown in FIG. 26 (a) mounted on the vehicle 7 as shown in FIG. 26 (b), for example. The vehicle headlamp 8 is provided with a storage recess 81a in the front for storing the discharge lamp starter 1 and the HID lamp La connected to the discharge lamp starter 1, and is attached to the vehicle 7 by, for example, screwing. The housing 81 includes a lens 82 made of a transparent material such as glass and attached to the front side of the housing 81 so as to cover the housing recess 81a. In addition, a discharge lamp insertion hole 81b for inserting / removing the discharge lamp starting device 1 during maintenance is provided on the rear surface of the housing 81. The discharge lamp insertion hole 81b is covered with a cap 83 provided on the front surface with a recess 83a that avoids the discharge lamp starting device 1 and detachably coupled to the housing 81. Furthermore, a discharge lamp lighting block 84 that houses a discharge lamp lighting device (not shown) for maintaining the HID lamp La on is attached to the lower side of the housing 83. The discharge lamp lighting device includes, for example, a well-known inverter circuit, is connected to a battery (not shown) via a harness L2, and uses, for example, 12V DC power obtained from the battery as a power source to maintain lighting of the HID lamp La. Is supplied to the HID lamp La via the harness L1 and the discharge lamp starting device 1. An electric wire insertion hole 81c through which the harness L1 connecting the discharge lamp starting device 1 and the inverter circuit is inserted is provided in the lower surface of the housing 81. The housing recess 81a of the housing 81 houses a reflector 85 that is disposed on the rear side of the HID lamp La and distributes the light of the HID lamp La. Further, an optical axis adjusting screw 86 mechanically coupled to the reflecting plate 85 is screwed into the housing 81, and the direction of the reflecting plate 85 is adjusted by adjusting the tightening of the optical axis adjusting screw 86. Can be done. In addition, since each structure of the vehicle 7 and the vehicle headlamp 8 is realizable by a well-known technique, detailed illustration and description are abbreviate | omitted.

本発明の実施形態の立体成形回路基板の要部を示す斜視図である。It is a perspective view which shows the principal part of the solid molded circuit board of embodiment of this invention. 同上の回路を示す回路図である。It is a circuit diagram which shows a circuit same as the above. 同様の要部を示す分解斜視図である。It is a disassembled perspective view which shows the same principal part. 同上を示す斜視図である。It is a perspective view which shows the same as the above. 同上にプラグを接続した状態を示す斜視図である。It is a perspective view which shows the state which connected the plug to the same as the above. 同上とHIDランプとを示す斜視図である。It is a perspective view which shows the same as the above and an HID lamp. 同上にHIDランプの口金を一体化したものを示す正面図である。It is a front view which shows what integrated the nozzle | cap | die of the HID lamp on the same as the above. 同上のパルストランスの構成を示す説明図である。It is explanatory drawing which shows the structure of a pulse transformer same as the above. 同上の要部を示す分解斜視図である。It is a disassembled perspective view which shows the principal part same as the above. 同上の要部を示す斜視図である。It is a perspective view which shows the principal part same as the above. 成形体と導電板とを結合する別の方法の例の説明図であり、(a)(b)はそれぞれ異なる段階を示す。It is explanatory drawing of the example of another method of couple | bonding a molded object and a conductive plate, (a) (b) shows a different step, respectively. 同上の要部を示す斜視図である。It is a perspective view which shows the principal part same as the above. 同上の要部を示す断面図である。It is sectional drawing which shows the principal part same as the above. 同上の導電板の構造を示す説明図である。It is explanatory drawing which shows the structure of a conductive plate same as the above. 同上の立体成形回路基板の要部を示す斜視図である。It is a perspective view which shows the principal part of a solid molded circuit board same as the above. 同上の別の形態の導電板の要部を示す斜視図である。It is a perspective view which shows the principal part of the electroconductive board of another form same as the above. 同上の別の形態の要部を示す斜視図である。It is a perspective view which shows the principal part of another form same as the above. 同上の更に別の形態の立体成形回路基板の要部を示す斜視図である。It is a perspective view which shows the principal part of the solid molded circuit board of another form same as the above. 同上の別の形態の要部を示す斜視図である。It is a perspective view which shows the principal part of another form same as the above. 同上の別の形態の要部を示す断面図であり、(a)は回路部品の片側を封止した状態を示し、(b)は回路部品の両側を封止した状態を示す。It is sectional drawing which shows the principal part of another form same as the above, (a) shows the state which sealed the one side of the circuit component, (b) shows the state which sealed the both sides of the circuit component. 同上の更に別の形態の要部を示す斜視図である。It is a perspective view which shows the principal part of another form same as the above. 同上の別の形態を示す説明図であり、(a)(b)は壁の形状が互いに異なる例を示す。It is explanatory drawing which shows another form same as the above, (a) (b) shows the example from which the shape of a wall differs mutually. 同上の更に別の形態の要部を示す断面図であり、(a)(b)は弾性部の形状が互いに異なる例を示す。It is sectional drawing which shows the principal part of another form same as the above, (a) (b) shows the example from which a shape of an elastic part differs mutually. 同上の別の形態の要部を示す斜視図である。It is a perspective view which shows the principal part of another form same as the above. 同上の更に別の形態を示す説明図であり、(a)〜(c)はそれぞれ課題の異なる段階を示し、(d)は課題の解決方法を示す。It is explanatory drawing which shows another form same as the above, (a)-(c) shows the stage from which each subject differs, (d) shows the solution method of a subject. (a)は同上を用いた車両用前照灯を示し、(b)は(a)の車両用前照灯を用いた車両を示す。(A) shows a vehicle headlamp using the above, and (b) shows a vehicle using the vehicle headlamp of (a).

符号の説明Explanation of symbols

1 放電灯始動装置
2 立体成形回路基板
3 パルストランス
3a ソケット部
5 導電板
5b 変形抑制体
6 成形体
7 車両
8 車両用前照灯
31 コア
51 埋込部
51a 凸部
52 端子部
52b 弾性部
52c 貫通穴
61,62 ばね部
61a,62a 係合爪
64 凹部
81 ハウジング
Cv 充電コンデンサ
SG スパークギャップ
La HIDランプ
N2 2次巻線
DESCRIPTION OF SYMBOLS 1 Discharge lamp starter 2 Solid molded circuit board 3 Pulse transformer 3a Socket part 5 Conductive plate 5b Deformation suppression body 6 Molded body 7 Vehicle 8 Vehicle headlamp 31 Core 51 Embedded part 51a Protrusion part 52 Terminal part 52b Elastic part 52c Through hole 61, 62 Spring portion 61a, 62a Engaging claw 64 Recessed portion 81 Housing Cv Charging capacitor SG Spark gap La HID lamp N2 Secondary winding

Claims (12)

パルス電圧を生成するパルス回路と、
両端間にパルス回路が接続される1次巻線と放電灯の両端間に接続される2次巻線とを有しパルス回路が生成したパルス電圧を放電灯に伝達して始動させるパルストランスと、
それぞれ導電材料からなる複数個の導電板がそれぞれ合成樹脂にインサート成形されてなりパルス回路を構成する各回路部品がそれぞれ実装された立体成形回路基板とを備え、
各導電板は、それぞれ立体成形回路基板の合成樹脂部分である成形体から露出して回路部品の端子が表面実装される実装部と、成形体に覆われる埋込部とを有し、
導電板と合成樹脂との機械的結合を強めるための起伏を、各導電板の埋込部にそれぞれ設けたことを特徴とする放電灯始動装置。
A pulse circuit for generating a pulse voltage;
A pulse transformer having a primary winding to which a pulse circuit is connected between both ends and a secondary winding connected to both ends of the discharge lamp, and transmitting the pulse voltage generated by the pulse circuit to the discharge lamp to start ,
A plurality of conductive plates each made of a conductive material are each formed by insert molding into a synthetic resin, and each circuit component constituting a pulse circuit is mounted on a three-dimensional molded circuit board,
Each conductive plate has a mounting portion that is exposed from a molded body that is a synthetic resin portion of a three-dimensional molded circuit board and surface-mounted with terminals of circuit components, and an embedded portion that is covered with the molded body,
A discharge lamp starter characterized in that undulations for strengthening the mechanical coupling between the conductive plate and the synthetic resin are provided in the embedded portions of the respective conductive plates.
各導電板の実装部において、回路部品の端子が結合する部位と埋込部との間に、回路部品の端子が並ぶ方向に弾性を有する弾性部が設けられていることを特徴とする請求項1記載の放電灯始動装置。   The elastic portion having elasticity in the direction in which the terminals of the circuit components are arranged is provided between the portion where the terminals of the circuit components are coupled and the embedded portion in the mounting portion of each conductive plate. The discharge lamp starting device according to 1. 弾性部は、回路部品の端子が並ぶ方向に交差する方向から見てU字形状に実装部が曲げられてなることを特徴とする請求項2記載の放電灯始動装置。   3. The discharge lamp starting device according to claim 2, wherein the elastic portion is formed by bending the mounting portion in a U shape when viewed from a direction intersecting with a direction in which the terminals of the circuit components are arranged. 弾性部は、実装部に貫通穴が設けられることにより形成されていることを特徴とする請求項2記載の放電灯始動装置。   The discharge lamp starting device according to claim 2, wherein the elastic portion is formed by providing a through hole in the mounting portion. 実装部において回路部品が実装される面の反対面に、導電板の材料よりも線膨張率の高い材料からなり導電板に機械的に結合して導電板の反りを抑制する変形抑制体を備えることを特徴とする請求項1〜4のいずれか記載の放電灯始動装置。   The mounting part is provided with a deformation suppressing body that is made of a material having a linear expansion coefficient higher than that of the material of the conductive plate and is mechanically coupled to the conductive plate and suppresses the warp of the conductive plate on the surface opposite to the surface on which the circuit component is mounted The discharge lamp starting device according to any one of claims 1 to 4. 回路部品の端子が並ぶ方向に交差する断面での断面積を小さくする凹部が成形体に設けられていることを特徴とする請求項1〜5のいずれか記載の放電灯始動装置。   The discharge lamp starting device according to any one of claims 1 to 5, wherein a concave portion for reducing a cross-sectional area in a cross section intersecting with a direction in which terminals of circuit parts are arranged is provided in the molded body. パルストランスにおいて、1次巻線と2次巻線との少なくとも一方は磁性体からなるコアに直接巻回されていることを特徴とする請求項1〜6のいずれか記載の放電灯始動装置。   7. The discharge lamp starting device according to claim 1, wherein at least one of the primary winding and the secondary winding is directly wound around a core made of a magnetic material. パルストランスと立体成形回路基板とは、パルストランスと立体成形回路基板との少なくとも一方に設けられた結合手段により機械的に結合することを特徴とする請求項1〜7のいずれか記載の放電灯始動装置。   8. The discharge lamp according to claim 1, wherein the pulse transformer and the three-dimensional molded circuit board are mechanically coupled by a coupling means provided on at least one of the pulse transformer and the three-dimensional molded circuit board. Starter. 放電灯を保持するとともに放電灯とパルストランスとを電気的に接続するソケットを有することを特徴とする請求項1〜8のいずれか記載の放電灯始動装置。   9. The discharge lamp starting device according to claim 1, further comprising a socket for holding the discharge lamp and electrically connecting the discharge lamp and the pulse transformer. 請求項1〜9のいずれか記載の放電灯始動装置と、放電灯始動装置によって始動される放電灯とを備えることを特徴とする放電灯装置。   A discharge lamp device comprising: the discharge lamp starting device according to any one of claims 1 to 9; and a discharge lamp started by the discharge lamp starting device. 請求項10記載の放電灯装置と、放電灯を点灯維持させる電力を生成する放電灯点灯装置と、放電灯点灯装置と放電灯装置とを保持し車両に取り付けられるハウジングとを備えることを特徴とする車両用前照灯。   11. A discharge lamp device according to claim 10, a discharge lamp lighting device that generates electric power for maintaining the discharge lamp, and a housing that holds the discharge lamp lighting device and the discharge lamp device and is attached to the vehicle. Vehicle headlamps. 請求項11記載の車両用前照灯を備えることを特徴とする車両。   A vehicle comprising the vehicle headlamp according to claim 11.
JP2005133121A 2005-04-28 2005-04-28 Discharge lamp starting device, discharge lamp device, vehicular headlight, and vehicle Pending JP2006310177A (en)

Priority Applications (1)

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JP2005133121A JP2006310177A (en) 2005-04-28 2005-04-28 Discharge lamp starting device, discharge lamp device, vehicular headlight, and vehicle

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JP2014096487A (en) * 2012-11-09 2014-05-22 Toyoda Gosei Co Ltd Electronic module
JP2015218650A (en) * 2014-05-16 2015-12-07 株式会社ミツバ Electric pump
WO2016017094A1 (en) * 2014-08-01 2016-02-04 株式会社デンソー Electronic circuit component
KR101831781B1 (en) 2015-12-14 2018-02-27 엘지전자 주식회사 Lighting source module
US10228119B2 (en) 2015-12-14 2019-03-12 Lg Electronics Inc. Light source module
US10317068B2 (en) 2015-12-14 2019-06-11 Lg Electronics Inc. Light source module
US10401015B2 (en) 2015-07-06 2019-09-03 Lg Electronics Inc. Light source module, fabrication method therefor, and lighting device including the same

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Publication number Priority date Publication date Assignee Title
JP2014096487A (en) * 2012-11-09 2014-05-22 Toyoda Gosei Co Ltd Electronic module
JP2015218650A (en) * 2014-05-16 2015-12-07 株式会社ミツバ Electric pump
WO2016017094A1 (en) * 2014-08-01 2016-02-04 株式会社デンソー Electronic circuit component
US10401015B2 (en) 2015-07-06 2019-09-03 Lg Electronics Inc. Light source module, fabrication method therefor, and lighting device including the same
KR101831781B1 (en) 2015-12-14 2018-02-27 엘지전자 주식회사 Lighting source module
US10228119B2 (en) 2015-12-14 2019-03-12 Lg Electronics Inc. Light source module
US10317068B2 (en) 2015-12-14 2019-06-11 Lg Electronics Inc. Light source module

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