JP2006278528A - Flexible printed board - Google Patents

Flexible printed board Download PDF

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JP2006278528A
JP2006278528A JP2005092663A JP2005092663A JP2006278528A JP 2006278528 A JP2006278528 A JP 2006278528A JP 2005092663 A JP2005092663 A JP 2005092663A JP 2005092663 A JP2005092663 A JP 2005092663A JP 2006278528 A JP2006278528 A JP 2006278528A
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flexible printed
circuit board
printed circuit
groove
conductor
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JP4645261B2 (en
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Manabu Kato
加藤　　学
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To eliminate a trouble that might occur upon conveyance of an electronic component to which a flexible printed board is connected without changing a manufacturing process of electronic equipment composed of a plurality of electronic components taking a process associated with mounting of the flexible printed board into consideration. <P>SOLUTION: In the flexible printed board composed of a film substrate 24, conductor circuits 26, 28 each formed on the film substrate 24, and a cover lay layer 22 for protecting the conductor circuits 26, 28; a groove 12 is provided in the conductor circuit 28. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、フィルム基板上に導体配線が形成されてなるフレキシブルプリント基板に関する。   The present invention relates to a flexible printed board in which a conductor wiring is formed on a film substrate.

近年、電子機器の高密度化にともない、これに用いる半導体チップ、表示素子やその他の電子部品の小型化が進められている。一方で、電子機器の多機能性化にともなって、内部で使用される電子部品点数が増加する傾向にあることから、高密度な状態でこれら電子部品を実装するような電子部品同士の接続を可能とするために、フィルム基板に導体回路を高密度に設けることのできるフレキシブルプリント基板の需要が拡大している。   In recent years, with the increase in the density of electronic devices, semiconductor chips, display elements, and other electronic components used therefor have been reduced in size. On the other hand, as the number of electronic components used inside tends to increase with the increase in functionality of electronic devices, it is necessary to connect electronic components that mount these electronic components in a high-density state. In order to make this possible, there is an increasing demand for flexible printed circuit boards in which conductor circuits can be provided on a film substrate at a high density.

特許文献１には、液晶パネルおよびこの液晶パネルに実装された液晶装置が開示されており、この液晶装置では補強用導体パターンを液晶装置との接続端子のフレキシブルプリント基板側の基板外縁に設けることで、フレキシブルプリント基板の外縁に亀裂が生じることを回避し、ひいてはこの亀裂による配線パターンの断線を回避する技術が開示されている。
特開２００２−２９９７７３号公報 Patent Document 1 discloses a liquid crystal panel and a liquid crystal device mounted on the liquid crystal panel. In this liquid crystal device, a reinforcing conductor pattern is provided on the outer edge of the flexible printed circuit board side of a connection terminal with the liquid crystal device. Thus, a technique for avoiding the occurrence of cracks at the outer edge of the flexible printed circuit board, and thus avoiding disconnection of the wiring pattern due to the cracks is disclosed.
JP 2002-299773 A

ところで、フレキシブルプリント基板を電子機器内で実装するときには、基板の接続端子を電子部品に接続させた状態で搬送させるのが一般的である。この搬送途中、または次の電子部品の搭載のときに、フレキシブルプリント基板に、自重に起因したたわみや、実装の際になされる加熱処理に起因するたわみが生じることがある。   By the way, when a flexible printed circuit board is mounted in an electronic device, it is generally conveyed with the connection terminals of the circuit board being connected to electronic components. During this conveyance or when the next electronic component is mounted, the flexible printed circuit board may bend due to its own weight or due to heat treatment performed during mounting.

このたわみが生じると、フレキシブルプリント基板の部分が搬送過程で搬送用の機材に引っかかるなどの不具合が生じるおそれがあった。   When this deflection occurs, there is a risk that a part of the flexible printed circuit board may be caught on the transporting equipment during the transporting process.

この電子部品の搬送中の不具合の原因となるフレキシブルプリント基板のたわみを防止するために、電子部品に接続した後にたわみが生じないようにフレキシブルプリント基板の表面に加重をかけて押さえつけるなどの物理的なアプローチがなされてきたが、電子部品への接続の際の加熱処理時のたわみを充分に解消するに至らなかった。   In order to prevent the flexible printed circuit board from being bent, which can cause problems during the transportation of electronic components, physical stress such as applying pressure to the surface of the flexible printed circuit board to prevent the flexible printed circuit board from being bent. However, it has not been possible to sufficiently eliminate the deflection at the time of heat treatment when connecting to an electronic component.

また、フレキシブルプリント基板の電子部品への接続を最後に行うなどのアプローチにより解消することが考えられるが、電子機器の各製造工程の順序に制約が加わるというプロセス的な問題があった。   In addition, it is conceivable to eliminate the approach by connecting the flexible printed circuit board to the electronic component last, but there is a process problem that the order of each manufacturing process of the electronic device is restricted.

そこで、本発明は、フレキシブルプリント基板が接続された電子部品の搬送時に生じるおそれのある不具合を、複数の電子部品からなる電子機器の製造工程をフレキシブルプリント基板の搭載にかかる工程を考慮して変更することなく、解消することを可能にするフレキシブルプリント基板を提供することを目的としている。   Therefore, the present invention changes a manufacturing process of an electronic device composed of a plurality of electronic components in consideration of a process related to mounting of the flexible printed circuit board, with respect to a problem that may occur when the electronic component to which the flexible printed circuit board is connected is conveyed. An object of the present invention is to provide a flexible printed circuit board that can be eliminated without doing so.

上記の課題を解決するために、本発明に係るフレキシブルプリント基板は、フィルム基板と、このフィルム基板上に形成された導体回路と、この導体回路を保護するカバーレイ層とを含むフレキシブルプリント基板において、導体回路上に溝が設けられたことを特徴としている。   In order to solve the above-described problems, a flexible printed board according to the present invention is a flexible printed board including a film substrate, a conductor circuit formed on the film substrate, and a coverlay layer that protects the conductor circuit. In addition, a groove is provided on the conductor circuit.

また、このフレキシブルプリント基板において、溝は、一方の端部に形成された電子部品との接続端子から他方の端部に形成された端子に向かって形成することができる。   Moreover, in this flexible printed circuit board, the groove can be formed from a connection terminal with an electronic component formed at one end portion toward a terminal formed at the other end portion.

また、このフレキシブルプリント基板において、溝の長さを、一方の端部に形成された電子部品との接続端子から他方の端部に形成された端子までの基板の長さに対して、３０％以上の大きさにすることができる。   In this flexible printed board, the length of the groove is 30% of the length of the board from the connection terminal with the electronic component formed at one end to the terminal formed at the other end. The size can be made larger.

また、このフレキシブルプリント基板において、溝は、カバーレイ層の上に設けることができる。   In this flexible printed board, the groove can be provided on the coverlay layer.

このような構成により、フレキシブルプリント基板は、表面に形成された溝の方向に容易にたわまなくなる。さらに、溝を、一方の接続端子から他方の接続端子に向かって形成することで、このフレキシブルプリント基板を接続端子で電子部品に接続したまま、この電子部品を搬送しても、フレキシブルプリント基板はたわみにくくなっているため、フレキシブルプリント基板が接続された電子部品の搬送時に生じるおそれのある不具合を低減することができる。   With such a configuration, the flexible printed board is not easily bent in the direction of the groove formed on the surface. Further, by forming the groove from one connection terminal toward the other connection terminal, even if this flexible printed circuit board is transported while the flexible printed circuit board is connected to the electronic component, the flexible printed circuit board is Since it becomes difficult to bend, the malfunction which may arise at the time of conveyance of the electronic component with which the flexible printed circuit board was connected can be reduced.

本発明によれば、フレキシブルプリント基板が接続された電子部品の搬送時に生じるおそれのある不具合を、複数の電子部品からなる電子機器の製造工程をフレキシブルプリント基板の搭載にかかる工程を考慮して変更する必要がなく、解消することが可能になる。   According to the present invention, a problem that may occur when transporting an electronic component connected to a flexible printed circuit board is changed in consideration of the process for mounting the flexible printed circuit board in the manufacturing process of an electronic device composed of a plurality of electronic components. There is no need to do so, and it becomes possible to eliminate it.

以下、本発明にかかるフレキシブルプリント基板の実施形態について説明する。なお、すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。
図１は、本実施形態のフレキシブルプリント基板を示す平面図であり、図２は、当該フレキシブルプリント基板のＡ−Ａ’断面図である。 Hereinafter, embodiments of a flexible printed circuit board according to the present invention will be described. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.
FIG. 1 is a plan view showing a flexible printed board according to the present embodiment, and FIG. 2 is a cross-sectional view taken along the line AA ′ of the flexible printed board.

図１および図２によれば、フレキシブルプリント基板１０は、フィルム基板２４と、フィルム基板２４の上に形成された導体回路２６，２８と、導体回路２６，２８を保護するカバーレイ層２２とを含むフレキシブルプリント基板において、導体回路２８上に溝１２が設けられたことを特徴としている。   1 and 2, the flexible printed circuit board 10 includes a film substrate 24, conductor circuits 26 and 28 formed on the film substrate 24, and a coverlay layer 22 that protects the conductor circuits 26 and 28. The flexible printed circuit board includes the groove 12 provided on the conductor circuit 28.

また、フレキシブルプリント基板１０は、他の電子部品、例えば表示装置との接続端子が形成される端子領域１６と、一方の端部に形成された電子部品との接続端子としての端子領域１６から他方の端部に形成された端子が形成された領域（不図示）までであり、前記導体回路が設けられる基板領域１４とから構成されている。この基板領域１４の端部に沿った方向を、基板の長さ方向Ａとする。   In addition, the flexible printed circuit board 10 includes a terminal region 16 in which connection terminals with other electronic components, for example, a display device are formed, and a terminal region 16 as a connection terminal with electronic components formed at one end, and the other. Up to a region (not shown) in which the terminal formed at the end of the substrate is formed, and is composed of a substrate region 14 provided with the conductor circuit. A direction along the end of the substrate region 14 is a length direction A of the substrate.

ここで、フィルム基板２４は、例えばポリイミドなどからなる可撓性を備えたものである。また、導体回路２６はフレキシブルプリント基板１０の両端に設けられた端子と端子との間を電気的に接続する配線であり、例えば銅が用いられる。導体回路２８は、導体回路２６と同様に端子と端子との間を電気的に接続する配線としての機能を有してもよく、両者を接続しないダミー配線としての機能を有していてもよいが、溝１２を形成することができるように一定の幅を有するものである。   Here, the film substrate 24 is provided with flexibility such as polyimide. The conductor circuit 26 is a wiring that electrically connects terminals provided at both ends of the flexible printed circuit board 10, and copper, for example, is used. The conductor circuit 28 may have a function as a wiring that electrically connects between the terminals similarly to the conductor circuit 26, or may have a function as a dummy wiring that does not connect the two. However, it has a certain width so that the groove 12 can be formed.

また、端子領域１６では、電子部品との接続に際して、一定の強度を確保するために、ガラスエポキシ板などの補強板を、カバーレイ層２２およびフィルム基板２４の少なくとも一方の上から接着させてもよい。   Further, in the terminal region 16, a reinforcing plate such as a glass epoxy plate may be adhered from at least one of the cover lay layer 22 and the film substrate 24 in order to ensure a certain strength when connecting to the electronic component. Good.

溝１２は、平面視して基板領域１４の導体回路２８が形成されている箇所に、前記端子領域１６に形成される接続端子から前記他方の端部に形成された端子（不図示）に向かって、すなわち長さ方向Ａに沿って形成されている。また、図２に示したように、溝１２は、カバーレイ層２２の上に設けられている。   The groove 12 extends from a connection terminal formed in the terminal region 16 to a terminal (not shown) formed at the other end at a location where the conductor circuit 28 of the substrate region 14 is formed in plan view. That is, it is formed along the length direction A. Further, as shown in FIG. 2, the groove 12 is provided on the coverlay layer 22.

また、図１を参照して、溝１２の長さＤは、基板領域１４の長さＬに対して、３０％以上、好ましくは５０％以上であることが好ましい。また、図２を参照して、溝１２の端部から端部の幅Ｗは、０．４ｍｍ以上であることが好ましい。溝１２をこのように構成することで、特にフレキシブルプリント基板を電子部品に接続した後での自重によるたわみ、すなわち基板の長さ方向Ａに垂直に折れ曲がるのを有効に抑制することができる。   Referring to FIG. 1, the length D of the groove 12 is 30% or more, preferably 50% or more with respect to the length L of the substrate region 14. In addition, referring to FIG. 2, the width W from the end to the end of the groove 12 is preferably 0.4 mm or more. By configuring the groove 12 in this way, it is possible to effectively suppress the bending due to its own weight after the flexible printed circuit board is connected to the electronic component, that is, bending in the direction perpendicular to the longitudinal direction A of the circuit board.

図３は、図１のフレキシブルプリント基板のＢ−Ｂ’断面図である。
図１および図３によれば、基板領域１４において、導体回路２８の上に設けられている溝１２の始点および終点には、カバーレイ層２２からフィルム基板２４まで貫通する穴１８が設けられている。この穴１８の径は、溝１２の幅Ｗ（図２）以上とすることができる。穴１８は任意の構成であるが、このような穴を設けることで、溝１２の形成時に端部の形状を明確にすることができるとともに、特に溝１２の形成時にこの端部にかかる応力、ひずみを逃がすことができ、フレキシブルプリント基板の強度を保持することができる。 3 is a cross-sectional view of the flexible printed board of FIG. 1 taken along the line BB ′.
According to FIG. 1 and FIG. 3, in the substrate region 14, holes 18 penetrating from the coverlay layer 22 to the film substrate 24 are provided at the start and end points of the groove 12 provided on the conductor circuit 28. Yes. The diameter of the hole 18 can be greater than or equal to the width W (FIG. 2) of the groove 12. Although the hole 18 has an arbitrary configuration, by providing such a hole, the shape of the end can be clarified when the groove 12 is formed, and stress applied to the end particularly when the groove 12 is formed, The strain can be released and the strength of the flexible printed circuit board can be maintained.

このようなフレキシブルプリント基板は、例えば以下のように製造することができる。
まず、フィルム基板２４上に金属箔を必要に応じてエポキシ樹脂などからなる接着層を介して形成する。続いて、エッチング技術などにより金属箔を所定のパターンで残して導体回路２６，２８を形成し、この導体回路２６，２８が形成されたフィルム基板２４を表面に、接着層が形成されたカバーレイ層２２で被覆して、加熱圧着処理して、カバーレイ層２２の積層成形を行う。さらに、基板領域１４の所定箇所に穴１８を開けて、フレキシブルプリント基板の外形を打ち抜く外形加工を行うときに併せて溝１２を形成して、フレキシブルプリント基板を得ることができる。また、穴１８を開ける工程を設けないで、直接外形加工を行って、溝１２を形成することも可能である。なお、溝１２は、外形加工の際に行う代わりに、穴１８を開ける工程で併せて形成してもよい。 Such a flexible printed circuit board can be manufactured as follows, for example.
First, a metal foil is formed on the film substrate 24 through an adhesive layer made of an epoxy resin or the like as necessary. Subsequently, the conductor circuits 26 and 28 are formed by leaving the metal foil in a predetermined pattern by an etching technique or the like, and the cover substrate on which the adhesive layer is formed on the film substrate 24 on which the conductor circuits 26 and 28 are formed. The cover lay layer 22 is laminated and formed by covering with the layer 22 and thermocompression-bonding. Furthermore, a hole 18 is formed in a predetermined portion of the substrate region 14 and the groove 12 is formed together with the outer shape processing for punching out the outer shape of the flexible printed circuit board, whereby a flexible printed circuit board can be obtained. In addition, it is possible to form the groove 12 by directly performing an outer shape process without providing a step of forming the hole 18. Note that the grooves 12 may be formed together in the step of forming the holes 18 instead of performing the outer shape processing.

以上説明したように、本実施形態によれば、フレキシブルプリント基板１０は、表面に形成された溝１２の方向に容易にたわまなくなる。さらに、フレキシブルプリント基板１０の長さ方向、すなわち一方の電子部品に接続する接続端子から他方の接続端子に向かって形成することで、このフレキシブルプリント基板１０を接続端子で電子部品に接続したまま、この電子部品を搬送しても、フレキシブルプリント基板１０はたわみにくくなっているため、フレキシブルプリント基板１０が接続された電子部品の搬送時に生じるおそれのある不具合、例えばフレキシブルプリント基板の自重によるたわみ、加熱処理時に生じるおそれのあるたわみを低減することができる。   As described above, according to the present embodiment, the flexible printed circuit board 10 is not easily bent in the direction of the groove 12 formed on the surface. Further, by forming the flexible printed circuit board 10 in the length direction, that is, from the connection terminal connected to one electronic component toward the other connection terminal, the flexible printed circuit board 10 is still connected to the electronic component with the connection terminal. Since the flexible printed circuit board 10 is difficult to bend even when this electronic component is transported, there is a problem that may occur when transporting the electronic component to which the flexible printed circuit board 10 is connected, for example, deflection due to the weight of the flexible printed circuit board, heating. Deflection that may occur during processing can be reduced.

したがって、複数の電子部品からなる電子機器の製造工程を、この不具合を回避するためにフレキシブルプリント基板１０の搭載にかかる工程を考慮して変更する必要がなくなる。   Therefore, it is not necessary to change the manufacturing process of the electronic device composed of a plurality of electronic components in consideration of the process for mounting the flexible printed circuit board 10 in order to avoid this problem.

なお、本実施形態では、片面のみに導体回路を配置したフレキシブルプリント基板について説明したが、これに限定されることはなく、フィルム基板２４の両面に導体回路を配置し、さらに両面をカバーレイ層で被覆したものであっても、本発明の効果を得ることができる。   In this embodiment, the flexible printed circuit board in which the conductor circuit is arranged only on one side has been described. However, the present invention is not limited to this, and the conductor circuit is arranged on both sides of the film substrate 24, and both sides are covered with the coverlay layer. Even if it coat | covers with, the effect of this invention can be acquired.

また、基板領域１４において溝１２を二本設けた例を示したが、一本であってもよいし、３本以上の複数本の溝を設けてもよい。また、図４に示したように、長さＤよりは短い複数の溝、例えば溝１２ａ，１２ｂ，１２ｃを、複数の導体回路２８のそれぞれの上に設けることができる。この場合、フレキシブルプリント基板１０の長さ方向Ａに直行する方向からみたときに、溝が形成されていない部分がないように設けることで、本発明の効果を得ることができる。また、溝１２ａ〜溝１２ｃの長さの合計が、長さＬに対して、３０％以上、好ましくは好ましくは５０％以上とすることができる。また、各溝の幅は前述したのと同様である。   Moreover, although the example which provided the two groove | channels 12 in the board | substrate area | region 14 was shown, one may be sufficient and a 3 or more multiple groove | channel may be provided. Further, as shown in FIG. 4, a plurality of grooves shorter than the length D, for example, grooves 12 a, 12 b, and 12 c can be provided on each of the plurality of conductor circuits 28. In this case, the effect of the present invention can be obtained by providing the flexible printed circuit board 10 so that there is no portion where no groove is formed when viewed from a direction perpendicular to the longitudinal direction A of the flexible printed circuit board 10. The total length of the grooves 12a to 12c is 30% or more, preferably 50% or more with respect to the length L. The width of each groove is the same as described above.

本実施形態のフレキシブルプリント基板を示す平面図である。It is a top view which shows the flexible printed circuit board of this embodiment. 図１のフレキシブルプリント基板のＡ−Ａ’断面図である。It is A-A 'sectional drawing of the flexible printed circuit board of FIG. 図１のフレキシブルプリント基板のＢ−Ｂ’断面図である。It is B-B 'sectional drawing of the flexible printed circuit board of FIG. フレキシブルプリント基板に設ける溝の他の形態を示す図である。It is a figure which shows the other form of the groove | channel provided in a flexible printed circuit board.

符号の説明Explanation of symbols

１０ フレキシブルプリント基板
１２，１２ａ，１２ｂ，１２ｃ 溝
１４ 基板領域
１６ 端子領域
１８ 穴
２２ カバーレイ層
２４ フィルム基板
２６，２８ 導体回路 DESCRIPTION OF SYMBOLS 10 Flexible printed circuit board 12, 12a, 12b, 12c Groove 14 Board | substrate area | region 16 Terminal area | region 18 Hole 22 Coverlay layer 24 Film board | substrate 26, 28 Conductor circuit

Claims (4)

フィルム基板と、当該フィルム基板上に形成された導体回路と、前記導体回路を保護するカバーレイ層とを含むフレキシブルプリント基板において、
前記導体回路上に溝が設けられたことを特徴とするフレキシブルプリント基板。 In a flexible printed board including a film substrate, a conductor circuit formed on the film substrate, and a coverlay layer that protects the conductor circuit,
A flexible printed circuit board, wherein a groove is provided on the conductor circuit. 請求項１に記載のフレキシブルプリント基板において、
前記溝は、一方の端部に形成された電子部品との接続端子から他方の端部に形成された端子に向かって形成されていることを特徴とするフレキシブルプリント基板。 The flexible printed circuit board according to claim 1,
The groove is formed from a connection terminal with an electronic component formed at one end to a terminal formed at the other end. 請求項１に記載のフレキシブルプリント基板において、
前記溝の長さが、一方の端部に形成された電子部品との接続端子から他方の端部に形成された端子までの基板の長さに対して、３０％以上の大きさであることを特徴とするフレキシブルプリント基板。 The flexible printed circuit board according to claim 1,
The length of the groove is 30% or more of the length of the substrate from the connection terminal with the electronic component formed at one end to the terminal formed at the other end. A flexible printed circuit board. 請求項１に記載のフレキシブルプリント基板において、
前記溝は、前記カバーレイ層の上に設けられていることを特徴とするフレキシブルプリント基板。 The flexible printed circuit board according to claim 1,
The flexible printed circuit board, wherein the groove is provided on the coverlay layer.
JP2005092663A 2005-03-28 2005-03-28 Flexible printed circuit board Expired - Fee Related JP4645261B2 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP2020204750A (en) * 2019-06-19 2020-12-24 株式会社ジャパンディスプレイ Electronic apparatus and flexible wiring board

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JPS6276555U (en) * 1985-11-01 1987-05-16
JPH06338185A (en) * 1993-05-25 1994-12-06 Sony Corp Flexible printed board and disk device
JPH10326848A (en) * 1997-05-26 1998-12-08 Yamaichi Electron Co Ltd Wiring plate for mounting semiconductor
JP2002141620A (en) * 2000-10-31 2002-05-17 Toshiba Corp Flexible wiring board
JP2003243778A (en) * 2002-02-15 2003-08-29 Matsushita Electric Ind Co Ltd Flexible wiring board and liquid crystal display device therewith

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JPS6276555U (en) * 1985-11-01 1987-05-16
JPH06338185A (en) * 1993-05-25 1994-12-06 Sony Corp Flexible printed board and disk device
JPH10326848A (en) * 1997-05-26 1998-12-08 Yamaichi Electron Co Ltd Wiring plate for mounting semiconductor
JP2002141620A (en) * 2000-10-31 2002-05-17 Toshiba Corp Flexible wiring board
JP2003243778A (en) * 2002-02-15 2003-08-29 Matsushita Electric Ind Co Ltd Flexible wiring board and liquid crystal display device therewith

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020204750A (en) * 2019-06-19 2020-12-24 株式会社ジャパンディスプレイ Electronic apparatus and flexible wiring board
JP7242439B2 (en) 2019-06-19 2023-03-20 株式会社ジャパンディスプレイ Electronic devices and flexible wiring boards

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