JP2006229075A - レーザ加熱装置 - Google Patents
レーザ加熱装置 Download PDFInfo
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- JP2006229075A JP2006229075A JP2005042927A JP2005042927A JP2006229075A JP 2006229075 A JP2006229075 A JP 2006229075A JP 2005042927 A JP2005042927 A JP 2005042927A JP 2005042927 A JP2005042927 A JP 2005042927A JP 2006229075 A JP2006229075 A JP 2006229075A
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- heated
- laser
- lens
- heating apparatus
- ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】 本発明のレーザ加熱装置は、レーザ光源と、このレーザ光源から出るレーザー光をリング状に集光せしめる曲面レンズとよりなる。上記曲面レンズは半径方向断面が凸レンズ状のリング体より成る円板状レンズである。上記リング体が同心円状に半径方向に複数隣接されている。上記各リング体の断面形状が互いに異なる。
【選択図】 図1
Description
2 レーザ光
3 レンズ
4 被加熱物
5 曲面レンズ
5a 凸レンズ状のリング体
6 曲面レンズ
6a 内側のリング体
6b 外側のリング体
7 外側リング
8 内側リング
9 曲面レンズ
10 シリンドリカルレンズ
11 凹レンズ
Claims (4)
- レーザ光源と、このレーザ光源から出るレーザー光をリング状に集光せしめる曲面レンズとよりなることを特徴とするレーザ加熱装置。
- 上記曲面レンズは半径方向断面が凸レンズ状のリング体より成る円板状レンズであることを特徴とする請求項1記載のレーザ加熱装置。
- 上記リング体が同心円状に半径方向に複数隣接されていることを特徴とする請求項2記載のレーザ加熱装置。
- 上記各リング体の断面形状が互いに異なることを特徴とする請求項2または3記載のレーザ加熱装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005042927A JP4247495B2 (ja) | 2005-02-18 | 2005-02-18 | レーザ加熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005042927A JP4247495B2 (ja) | 2005-02-18 | 2005-02-18 | レーザ加熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006229075A true JP2006229075A (ja) | 2006-08-31 |
JP4247495B2 JP4247495B2 (ja) | 2009-04-02 |
Family
ID=36990145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005042927A Expired - Fee Related JP4247495B2 (ja) | 2005-02-18 | 2005-02-18 | レーザ加熱装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4247495B2 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008168333A (ja) * | 2007-01-15 | 2008-07-24 | Japan Unix Co Ltd | レーザー式はんだ付け装置 |
DE112007003258T5 (de) | 2007-01-15 | 2009-11-19 | Japan Unix Co. Ltd. | Laserlötvorrichtung |
JP2011040670A (ja) * | 2009-08-18 | 2011-02-24 | Tokyo Electron Ltd | ポリマー除去装置およびポリマー除去方法 |
WO2012153785A1 (ja) * | 2011-05-11 | 2012-11-15 | 株式会社ブイ・テクノロジー | レンズおよびそのレンズを搭載したレーザ加工装置 |
WO2013051424A1 (ja) * | 2011-10-07 | 2013-04-11 | 株式会社ブイ・テクノロジー | ガラス基板のレーザ加工装置 |
EP2716398A1 (en) * | 2012-10-05 | 2014-04-09 | Mitsubishi Heavy Industries, Ltd. | Optical systems and laser processing apparatus comprising such optical system |
JP2014151326A (ja) * | 2013-02-05 | 2014-08-25 | V Technology Co Ltd | レーザ加工装置、レーザ加工方法 |
JP2016001642A (ja) * | 2014-06-11 | 2016-01-07 | 坂口電熱株式会社 | レーザ加熱処理装置 |
CN106405693A (zh) * | 2016-12-07 | 2017-02-15 | 厦门大学 | 一种直接产生环形空心聚焦光束的透镜 |
US10352545B2 (en) | 2016-03-04 | 2019-07-16 | Panasonic Intellectual Property Management Co., Ltd. | Wavelength conversion device and lighting apparatus |
WO2023221318A1 (zh) * | 2022-05-18 | 2023-11-23 | 上海嘉强自动化技术有限公司 | 自由曲面透镜、光学***及其激光焊接装置 |
-
2005
- 2005-02-18 JP JP2005042927A patent/JP4247495B2/ja not_active Expired - Fee Related
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8334478B2 (en) | 2007-01-15 | 2012-12-18 | Japan Unix Co., Ltd. | Laser type soldering apparatus |
DE112007003258T5 (de) | 2007-01-15 | 2009-11-19 | Japan Unix Co. Ltd. | Laserlötvorrichtung |
DE112007003258B4 (de) * | 2007-01-15 | 2011-12-29 | Japan Unix Co. Ltd. | Laserlötvorrichtung |
JP2008168333A (ja) * | 2007-01-15 | 2008-07-24 | Japan Unix Co Ltd | レーザー式はんだ付け装置 |
JP2011040670A (ja) * | 2009-08-18 | 2011-02-24 | Tokyo Electron Ltd | ポリマー除去装置およびポリマー除去方法 |
US8506718B2 (en) | 2009-08-18 | 2013-08-13 | Tokyo Electron Limited | Polymer removing apparatus and method |
KR20140050610A (ko) * | 2011-05-11 | 2014-04-29 | 브이 테크놀로지 씨오. 엘티디 | 렌즈 및 그 렌즈를 탑재한 레이저 가공장치 |
KR101993128B1 (ko) * | 2011-05-11 | 2019-06-26 | 브이 테크놀로지 씨오. 엘티디 | 렌즈 및 그 렌즈를 탑재한 레이저 가공장치 |
US9310531B2 (en) | 2011-05-11 | 2016-04-12 | V-Technology Co., Ltd. | Lens and laser processing apparatus equipped with the lens |
JP2012236204A (ja) * | 2011-05-11 | 2012-12-06 | V Technology Co Ltd | レンズおよびそのレンズを搭載したレーザ加工装置 |
CN103619527A (zh) * | 2011-05-11 | 2014-03-05 | 株式会社V技术 | 透镜及搭载该透镜的激光加工装置 |
TWI618592B (zh) * | 2011-05-11 | 2018-03-21 | V科技股份有限公司 | 透鏡及安裝此透鏡的雷射加工裝置 |
WO2012153785A1 (ja) * | 2011-05-11 | 2012-11-15 | 株式会社ブイ・テクノロジー | レンズおよびそのレンズを搭載したレーザ加工装置 |
CN103842305A (zh) * | 2011-10-07 | 2014-06-04 | 株式会社V技术 | 玻璃基板的激光加工装置 |
KR20140075765A (ko) * | 2011-10-07 | 2014-06-19 | 브이 테크놀로지 씨오. 엘티디 | 유리 기판의 레이저 가공 장치 |
WO2013051424A1 (ja) * | 2011-10-07 | 2013-04-11 | 株式会社ブイ・テクノロジー | ガラス基板のレーザ加工装置 |
JP2013082580A (ja) * | 2011-10-07 | 2013-05-09 | V Technology Co Ltd | ガラス基板のレーザ加工装置 |
KR101884966B1 (ko) | 2011-10-07 | 2018-08-02 | 브이 테크놀로지 씨오. 엘티디 | 유리 기판의 레이저 가공 장치 |
EP2716398A1 (en) * | 2012-10-05 | 2014-04-09 | Mitsubishi Heavy Industries, Ltd. | Optical systems and laser processing apparatus comprising such optical system |
US9500781B2 (en) | 2012-10-05 | 2016-11-22 | Mitsubishi Heavy Industries, Ltd. | Optical system and laser processing apparatus |
JP2014151326A (ja) * | 2013-02-05 | 2014-08-25 | V Technology Co Ltd | レーザ加工装置、レーザ加工方法 |
JP2016001642A (ja) * | 2014-06-11 | 2016-01-07 | 坂口電熱株式会社 | レーザ加熱処理装置 |
US10352545B2 (en) | 2016-03-04 | 2019-07-16 | Panasonic Intellectual Property Management Co., Ltd. | Wavelength conversion device and lighting apparatus |
CN106405693A (zh) * | 2016-12-07 | 2017-02-15 | 厦门大学 | 一种直接产生环形空心聚焦光束的透镜 |
WO2023221318A1 (zh) * | 2022-05-18 | 2023-11-23 | 上海嘉强自动化技术有限公司 | 自由曲面透镜、光学***及其激光焊接装置 |
Also Published As
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JP4247495B2 (ja) | 2009-04-02 |
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