JP2006156964A5 - - Google Patents
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- JP2006156964A5 JP2006156964A5 JP2005298384A JP2005298384A JP2006156964A5 JP 2006156964 A5 JP2006156964 A5 JP 2006156964A5 JP 2005298384 A JP2005298384 A JP 2005298384A JP 2005298384 A JP2005298384 A JP 2005298384A JP 2006156964 A5 JP2006156964 A5 JP 2006156964A5
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- epoxy resin
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Claims (36)
２５０μｍ未満の直径をもつガラス粒子から本質的になり、ガラス粒子が１．４８から１．６０の範囲の値のガラス屈折率をもち、ホウケイ酸から本質的になり、かつ封止剤の全容積の１０容量％から５０容量％を構成することを特徴とする充填剤と、
硬化段階のエポキシ組成物の屈折率を特徴とする、硬化段階のエポキシ樹脂組成物を含む封止剤であって、
その際、封止剤の熱膨張係数が、５０ｐｐｍ／℃未満の平均値を有し、±３０％未満のばらつきであり、
ガラスの屈折率及び硬化段階のエポキシ樹脂組成物の屈折率が、封止剤の光透過率が４００ｎｍから９００ｎｍの範囲の波長で約１ｍｍの封止剤厚さで測定した時に少なくとも２０％になるように、十分に近似した値を有し、かつ
封止剤がエポキシ樹脂組成物を充填剤と混合して調製され、混合前のエポキシ樹脂組成物の粘度が３００ｃＰから４００００ｃＰの範囲の値を有し、かつエポキシ樹脂組成物が少なくとも１種の硬化剤、少なくとも１種の硬化促進剤、及びビスフェノール−Ａエポキシ樹脂、脂環式エポキシ樹脂、トリグリシジルイソシアヌレート樹脂からなる三元エポキシ混合物を含有する封止剤。 A sealant for an optoelectronic device or optical component, characterized by a thermal expansion coefficient and a light transmittance,
Consisting essentially of glass particles having a diameter of less than 250 μm, the glass particles having a glass refractive index in the range of 1.48 to 1.60 , consisting essentially of borosilicate, and all of the sealant A filler, characterized in that it comprises 10% to 50% by volume of the volume ;
A sealant comprising a curing stage epoxy resin composition, characterized by the refractive index of the curing stage epoxy composition,
At that time, the thermal expansion coefficient of the sealant has an average value of less than 50 ppm / ° C., and is a variation of less than ± 30% ,
The refractive index of the glass and the epoxy resin composition in the curing stage is at least 20% when the light transmittance of the sealant is measured at a sealant thickness of about 1 mm at a wavelength in the range of 400 nm to 900 nm. as described above, it has a value that is sufficiently approximate, and
A sealant is prepared by mixing an epoxy resin composition with a filler, the viscosity of the epoxy resin composition before mixing has a value in the range of 300 cP to 40000 cP, and the epoxy resin composition is at least one cured , sealants having free at least one curing accelerator, and bisphenol -A epoxy resin, alicyclic epoxy resin, a ternary epoxy mixture consisting triglycidyl isocyanurate resin.
（１）３−グリシドキシプロピルトリメトキシシランでシリル化され、アルカリを含有しないホウケイ酸ガラスから形成されたガラス粒子から本質的になる、１５容量％から４０重量％の充填剤であって、この粒子が１μｍから２５０μｍの範囲の直径を有し、その１０容量％未満の粒子が１０μｍ未満の直径を有し、このガラスが約１．５２６の値及び約０．００１未満のばらつきのガラス屈折率を特徴とする充填剤、及び
（２）６０容量％から８５容量％の硬化段階のエポキシ樹脂組成物であって、ビスフェノール−Ａのジグリシジルエーテル樹脂、脂環式エポキシ樹脂、トリグリシジルイソシアヌレート樹脂、硬化剤、及び硬化促進剤を含む組成物から製造されたエポキシ樹脂組成物であって、ビスフェノール−Ａのジグリシジルエーテル樹脂、脂環式エポキシ樹脂及びトリグリシジルイソシアヌレート樹脂の総モル量に対するビスフェノール−Ａのジグリシジルエーテル樹脂のモル量の比が、０．１５から０．４０の範囲の値を有し、ビスフェノール−Ａのジグリシジルエーテルエポキシ樹脂、脂環式エポキシ樹脂及びトリグリシジルイソシアヌレート樹脂の総モル量に対する脂環式エポキシ樹脂のモル量の比が、０．１０から０．５５であり、ビスフェノール−Ａのジグリシジルエーテルエポキシ樹脂、脂環式エポキシ樹脂及びトリグリシジルイソシアヌレート樹脂の総モル量に対するトリグリシジルイソシアヌレート樹脂のモル量の比が、０．２０から０．６５であり、ビスフェノール−Ａのジグリシジルエーテルエポキシ樹脂、脂環式エポキシ樹脂及びトリグリシジルイソシアヌレート樹脂の総モル量に対する硬化剤のモル量の比が０．７０から１．００であり、ビスフェノール−Ａのジグリシジルエーテルエポキシ樹脂、脂環式エポキシ樹脂及びトリグリシジルイソシアヌレート樹脂の総モル量に対する硬化促進剤のモル量の比が０．００４から０．０３０である硬化段階のエポキシ樹脂組成物を含む封止剤であって、
その際、封止剤の熱膨張係数が、約４０ｐｐｍ／℃未満の平均値及び約±１０％未満のばらつきであり、かつ封止剤の光透過率が、４００ｎｍから９００ｎｍの波長範囲で１ｍｍの封止剤厚さで測定した時に、少なくとも２０％であって、
充填剤がエポキシ樹脂組成物内に分散され、かつ
充填剤のエポキシ樹脂組成物内への分散前のエポキシ樹脂組成物の粘度が３００ｃＰから４００００ｃＰの範囲の値を有する封止剤。 A sealant for an optoelectronic device or optical component, characterized by a thermal expansion coefficient and a light transmittance,
(1) 15% to 40% by weight filler consisting essentially of glass particles silylated with 3-glycidoxypropyltrimethoxysilane and formed from an alkali-free borosilicate glass, The particles have a diameter in the range of 1 μm to 250 μm, less than 10% by volume of the particles have a diameter of less than 10 μm, and the glass has a glass refraction with a value of about 1.526 and a variation of less than about 0.001. And (2) an epoxy resin composition in a curing stage of 60% to 85% by volume, comprising a diglycidyl ether resin of bisphenol-A, an alicyclic epoxy resin, and triglycidyl isocyanurate An epoxy resin composition manufactured from a composition comprising a resin, a curing agent, and a curing accelerator, the diglycidyl ether of bisphenol-A The ratio of the molar amount of diglycidyl ether resin of bisphenol-A to the total molar amount of resin, cycloaliphatic epoxy resin and triglycidyl isocyanurate resin has a value in the range of 0.15 to 0.40, and bisphenol- The ratio of the molar amount of the alicyclic epoxy resin to the total molar amount of the diglycidyl ether epoxy resin, alicyclic epoxy resin and triglycidyl isocyanurate resin of A is 0.10 to 0.55, and the bisphenol-A The ratio of the molar amount of triglycidyl isocyanurate resin to the total molar amount of diglycidyl ether epoxy resin, alicyclic epoxy resin and triglycidyl isocyanurate resin is 0.20 to 0.65, and diglycidyl of bisphenol-A Ether epoxy resin, cycloaliphatic epoxy resin and triglycidyl Ratio of molar amount of curing agent to total molar amount of sosocyanurate resin is 0.70 to 1.00, and total molar amount of diglycidyl ether epoxy resin, alicyclic epoxy resin and triglycidyl isocyanurate resin of bisphenol-A A sealant comprising a curing stage epoxy resin composition wherein the ratio of the molar amount of curing accelerator to 0.004 to 0.030,
At that time, the thermal expansion coefficient of the encapsulant is an average value of less than about 40 ppm / ° C. and a variation of less than about ± 10%, and the light transmittance of the encapsulant is 1 mm in a wavelength range of 400 nm to 900 nm. when measured with an encapsulant thickness, I at least 20% der,
A filler is dispersed in the epoxy resin composition, and
Rufutomezai the viscosity of the epoxy resin composition before the dispersion into the epoxy resin composition of the filler have a value in the range of 40000cP from 300 cP.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/967,646 US7381359B2 (en) | 2004-10-14 | 2004-10-14 | Method for making filled epoxy resin compositions |
| US10/967,115 US7311972B2 (en) | 2004-10-14 | 2004-10-14 | Filled epoxy resin compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006156964A JP2006156964A (en) | 2006-06-15 |
| JP2006156964A5 true JP2006156964A5 (en) | 2008-07-17 |
| JP4570547B2 JP4570547B2 (en) | 2010-10-27 |
Family
ID=36634803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005298384A Expired - Fee Related JP4570547B2 (en) | 2004-10-14 | 2005-10-13 | Filled epoxy resin composition and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4570547B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101056690B1 (en) * | 2007-06-28 | 2011-08-12 | 주식회사 엘지화학 | Method for producing a transparent plastic film and a transparent plastic film produced thereby |
| JP2010265415A (en) * | 2009-05-15 | 2010-11-25 | Sekisui Chem Co Ltd | Epoxy resin composition and laminate |
| CN103649160B (en) * | 2011-05-13 | 2016-01-13 | 陶氏环球技术有限责任公司 | Insulation preparation |
| JP2015054965A (en) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | Encapsulation resin, semiconductor device, and optical coupling device |
| WO2015159569A1 (en) | 2014-04-15 | 2015-10-22 | 信越化学工業株式会社 | Alkoxysilyl-vinylene group-containing silicon compound |
| JP5977794B2 (en) * | 2014-10-23 | 2016-08-24 | 株式会社ダイセル | Curable epoxy resin composition |
| WO2019087697A1 (en) | 2017-10-31 | 2019-05-09 | 信越化学工業株式会社 | Organopolysiloxane composition, and organic silicon compound and production method therefor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001261933A (en) * | 2000-03-15 | 2001-09-26 | Nitto Denko Corp | Epoxy resin for sealing optical semiconductor element and optical semiconductor device |
-
2005
- 2005-10-13 JP JP2005298384A patent/JP4570547B2/en not_active Expired - Fee Related
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