JP2006156612A - Positioning device - Google Patents

Positioning device Download PDF

Info

Publication number
JP2006156612A
JP2006156612A JP2004343412A JP2004343412A JP2006156612A JP 2006156612 A JP2006156612 A JP 2006156612A JP 2004343412 A JP2004343412 A JP 2004343412A JP 2004343412 A JP2004343412 A JP 2004343412A JP 2006156612 A JP2006156612 A JP 2006156612A
Authority
JP
Japan
Prior art keywords
substrate
positioning
positioning device
floating
levitating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004343412A
Other languages
Japanese (ja)
Inventor
Shinji Takase
真治 高瀬
Kazunobu Yamaguchi
和伸 山口
Atsuo Kajima
淳生 楫間
Tsuneo Tanimoto
恒夫 谷本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tatsumo KK filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2004343412A priority Critical patent/JP2006156612A/en
Priority to CNB2005101373310A priority patent/CN100505204C/en
Priority to KR1020050114650A priority patent/KR20060059835A/en
Publication of JP2006156612A publication Critical patent/JP2006156612A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positioning device which can accurately position a substrate without damaging it even if the substrate is made large. <P>SOLUTION: In a state where a slide member 6 is retreated, a cylinder unit 2 is operated to raise a supporting member 3, and a substrate W is received by the upper surface of the reception part 11 of a lifting member 8. Next, the cylinder unit 2 is operated to lower the supporting member 3 until the substrate W is on the same level of the slide member 6 of an alignment member 5, and a valve is changed over to connect the piping 12 of the lifting member 8 to a compressed air source. An air is allowed to be jetted from grooves 16 and 17 on the upper surface of the reception part 11 of the lifting member 8, so as to lift the substrate W from the upper surface of the reception part 11, move forward the slide member 6 of the alignment member 5, and bring a pusher 7 into contact with the edge of the substrate W for positioning. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は基板の処理装置の直前に配置される待機ユニットなどに適用される
位置決め装置に関する。 The present invention relates to a positioning device applied to a standby unit or the like disposed immediately before a substrate processing apparatus.

半導体ウェーハやガラス基板などの基板を浮上させた状態で位置決めする装置として、特許文献１及び特許文献２に開示される装置が知られている。   As apparatuses for positioning a substrate such as a semiconductor wafer or a glass substrate in a floating state, apparatuses disclosed in Patent Document 1 and Patent Document 2 are known.

特許文献１に開示される装置は、載置台に開口するエア噴出口からエアを噴出させてウェーハを浮上させ、この状態で側方に配置したエアノズルからのエアでウェーハをエアノズルと対向する箇所に設けた基準部材に押し付けることで位置決めを行い、特許文献２に開示される装置は、枠状テーブルの隅部または周縁に吸着パッドを設け、この吸着パッドにエア噴出機能を付加し、吸着パッドから噴出するエアでフォトマスク（基板）を浮上させストッパに押し当てることで位置決めする構成になっている。
特開平５−２９９４９２号公報 特開平９−８１０６号公報 In the apparatus disclosed in Patent Document 1, air is ejected from an air ejection opening that opens in the mounting table, and the wafer is floated. In this state, air from the air nozzle disposed on the side is placed at a location facing the air nozzle. Positioning is performed by pressing against the provided reference member, and the apparatus disclosed in Patent Document 2 is provided with a suction pad at the corner or the periphery of the frame-like table, and an air ejection function is added to this suction pad. The configuration is such that the photomask (substrate) is levitated by the jetted air and pressed against the stopper.
Japanese Patent Laid-Open No. 5-299492 JP-A-9-8106

特許文献１に開示される位置決め装置にあっては、ウェーハを浮上させるエア噴出口が直接載置台に形成されており、ウェーハ裏面が載置台の表面に接触して載置台からの熱影響を受けやく、また載置台の上面に開口するエア噴出口の径も小さいため、ウェーハ裏面に局所的にエアが当たり温度ムラを生じやすい。   In the positioning device disclosed in Patent Document 1, the air jet port for floating the wafer is directly formed on the mounting table, and the back surface of the wafer is in contact with the surface of the mounting table and is affected by the heat from the mounting table. In addition, since the diameter of the air jet opening opened on the upper surface of the mounting table is small, air easily hits the back surface of the wafer and easily causes temperature unevenness.

特許文献２に開示される位置決め装置にあっては、基板の周囲のみを支持しているので、基板が大型化すると、基板の中央部を支えることができず、中央部が撓んでしまい、アライメント時に基板を傷つけるおそれがある。また、基板が大型化すると特許文献２に開示される装置では、基板を浮上させることが困難となる。   In the positioning device disclosed in Patent Document 2, since only the periphery of the substrate is supported, when the substrate is enlarged, the central portion of the substrate cannot be supported, and the central portion is bent, and alignment is performed. At times, the substrate may be damaged. In addition, when the substrate is enlarged, it is difficult for the apparatus disclosed in Patent Document 2 to float the substrate.

上記課題を解消すべく、本発明に係る位置決め装置は、基板を浮上せしめる浮上部材と基板を位置決めするアライメント部材とを備え、前記浮上部材は基板の全域をカバーするように板状或いは格子状をなす支持部材に複数個取り付けられ、また浮上部材はその上面を基板受け面とし、この基板受け面は平坦で且つ所定の面積の流体噴出エリアが形成された構成とした。   In order to solve the above-described problems, a positioning apparatus according to the present invention includes a floating member that floats a substrate and an alignment member that positions the substrate, and the floating member has a plate shape or a lattice shape so as to cover the entire area of the substrate. A plurality of floating members are attached to the supporting member, and the upper surface of the floating member is a substrate receiving surface. The substrate receiving surface is flat and has a fluid ejection area having a predetermined area.

前記基板受け面にはエア噴出用兼エア吸引用の溝が環状に形成し、この溝によって囲まれる領域を浮上力或いは吸引力が作用する領域とすることが考えられる。
また、前記浮上部材の構成としては、支持部材に固定される本体部分と、この本体部分に摺動自在に挿入されるとともに弾発部材にて上方に付勢される受け部分とに分割することが考えられる。 It is conceivable that a groove for air ejection and air suction is formed in an annular shape on the substrate receiving surface, and a region surrounded by the groove is a region where levitation force or suction force acts.
The floating member may be divided into a main body portion fixed to the support member and a receiving portion that is slidably inserted into the main body portion and biased upward by the resilient member. Can be considered.

本発明によれば、浮上部材を基板の全域をカバーするように配置したことで、基板が大型化し重量が増えても中央部が垂れることを防げる。また基板受け面に比較的広い面積の流体噴出エリアを形成したことで、温度ムラを生じにくくすることができる。   According to the present invention, the levitation member is arranged so as to cover the entire area of the substrate, so that the central portion can be prevented from dripping even if the substrate is increased in size and weight. In addition, since a fluid ejection area having a relatively large area is formed on the substrate receiving surface, temperature unevenness can be made difficult to occur.

また、基板受け面に圧気源又は真空源に切替可能に接続される環状溝を形成することで、該溝によって囲まれる領域を浮上力或いは吸引力が作用する領域とすることができ、温度ムラを防ぐことができ、また浮上部材を支持部材に固定される本体部分とこの本体部分に摺動自在に挿入されるとともに弾発部材にて上方に付勢される受け部分とに分割することで、基板のうねりに対応して受け部分が昇降動し、受け面と基板との間隔を一定に保つことができる。   In addition, by forming an annular groove on the substrate receiving surface that is switchably connected to a pressure source or a vacuum source, a region surrounded by the groove can be made a region where levitation force or suction force acts, and temperature unevenness And the floating member is divided into a main body portion fixed to the support member and a receiving portion that is slidably inserted into the main body portion and is urged upward by the resilient member. The receiving portion moves up and down in response to the undulation of the substrate, and the distance between the receiving surface and the substrate can be kept constant.

以下に本発明の好適な実施例を添付図面に基づいて説明する。図１は本発明に係る位置決め装置の平面図、図２は同位置決め装置の側面図、図３は浮上部材の拡大断面図である。   Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a plan view of a positioning device according to the present invention, FIG. 2 is a side view of the positioning device, and FIG. 3 is an enlarged sectional view of a floating member.

位置決め装置はベース１上にシリンダユニットの昇降装置２を設け、この昇降装置２に支持部材３を取り付けている。この支持部材３は板状をなす縦方向メンバと棒状をなす横メンバーを組み合わせて全体として格子状をなし、モータ４によって水平面内で回転可能とされている。   The positioning device is provided with a lifting / lowering device 2 for a cylinder unit on a base 1, and a support member 3 is attached to the lifting / lowering device 2. The support member 3 is formed into a lattice shape as a whole by combining a plate-like longitudinal member and a bar-like transverse member, and can be rotated in a horizontal plane by a motor 4.

また支持部材３を囲むようにベース１上に複数のアライメント部材５を配置している。このアライメント部材５は上部にスライド部材６を備え、このスライド部材６はシリンダユニットの作動によって基板Ｗに対し、水平方向に進退動し、スライド部材６の先端には基板Ｗに当接した際に、基板Ｗを傷つけることがないように所定以上の圧力が作用した場合に後退するプッシャー７を取り付けている。   A plurality of alignment members 5 are arranged on the base 1 so as to surround the support member 3. The alignment member 5 is provided with a slide member 6 on the upper portion thereof. The slide member 6 is moved forward and backward in the horizontal direction with respect to the substrate W by the operation of the cylinder unit, and when the tip of the slide member 6 contacts the substrate W. The pusher 7 is attached so as to move backward when a predetermined pressure or more is applied so as not to damage the substrate W.

図示例にあっては矩形状基板Ｗの１つの辺に対し２つのアライメント部材５を配置し、残りの３つの辺については各1つのアライメント部材５を配置しているが、配置の数及び割り振りはこれに限らない。   In the illustrated example, two alignment members 5 are arranged for one side of the rectangular substrate W, and one alignment member 5 is arranged for each of the remaining three sides. Is not limited to this.

前記支持部材３の上面には基板Ｗを浮上せしめる浮上部材８を基板の全域をカバーするように複数個取り付けている。浮上部材８は柱状をなす本体部分９とこの本体部分９の上部にキャップ１０を介して摺動自在に保持される受け部分１１とからなる。   A plurality of floating members 8 for floating the substrate W are attached to the upper surface of the support member 3 so as to cover the entire area of the substrate. The levitation member 8 includes a columnar body portion 9 and a receiving portion 11 that is slidably held on the upper portion of the body portion 9 via a cap 10.

本体部分９には下方から配管１２が挿入され、この配管１２はバルブを介して圧気源または真空源に選択的に接続される。また本体部分９には配管１２につながる通気穴１３が形成され、更に本体部分９と受け部分１１との間にはスプリング（弾発部材）１４が配置され、受け部分１１を上方に付勢している。   A pipe 12 is inserted into the main body portion 9 from below, and this pipe 12 is selectively connected to a pressure source or a vacuum source via a valve. In addition, a vent hole 13 connected to the pipe 12 is formed in the main body portion 9, and a spring (bounce member) 14 is disposed between the main body portion 9 and the receiving portion 11 to urge the receiving portion 11 upward. ing.

また、受け部分１１には通気穴１５が貫通形成され、更に受け部分１１の上面は平坦面とされ、この上面には前記通気穴１５につながる径方向溝１６及び円環状溝１７が形成されている。その結果、外側の円環状溝１７で囲まれる領域が浮上力または吸引力が作用する領域になる。   A vent hole 15 is formed through the receiving portion 11, and the upper surface of the receiving portion 11 is a flat surface. A radial groove 16 and an annular groove 17 connected to the vent hole 15 are formed on the upper surface. Yes. As a result, a region surrounded by the outer annular groove 17 becomes a region where a levitation force or a suction force acts.

以上の構成からなる位置決め装置を用いて基板Ｗを位置決めする方法を説明する。
先ず、アライメント部材５のスライド部材６を後退させた状態で、シリンダユニット２を作動させて支持部材３を上昇せしめる。次いで、図示しない搬送治具から基板Ｗを支持部材３の浮上部材８に移載する。このときバルブを操作して浮上部材８の配管１２を真空源につなげ基板Ｗを浮上部材８の受け部分１１の上面で吸着する。 A method for positioning the substrate W using the positioning apparatus having the above configuration will be described.
First, with the slide member 6 of the alignment member 5 retracted, the cylinder unit 2 is operated to raise the support member 3. Next, the substrate W is transferred from the transfer jig (not shown) to the floating member 8 of the support member 3. At this time, the valve is operated to connect the pipe 12 of the floating member 8 to a vacuum source, and the substrate W is adsorbed on the upper surface of the receiving portion 11 of the floating member 8.

次いで、シリンダユニット２を作動させて支持部材３を下降せしめ、基板Ｗをアライメント部材５のスライド部材６と同一レベルとする。そして、バルブを切り替えて浮上部材８の配管１２を圧気源につなげ、浮上部材８の受け部分１１の上面の溝１６，１７からエアを噴出し、基板Ｗを受け部分１１の上面から浮上せしめる。   Next, the cylinder unit 2 is operated to lower the support member 3 so that the substrate W is at the same level as the slide member 6 of the alignment member 5. Then, the valve is switched to connect the pipe 12 of the levitation member 8 to a pressure source, and air is ejected from the grooves 16 and 17 on the upper surface of the receiving portion 11 of the levitation member 8, so that the substrate W is levitated from the upper surface of the receiving portion 11.

ここで、受け部分１１の上面と基板Ｗとの間隔は、受け部分１１の上面と基板Ｗとの間の圧力が一定になるように受け部分１１が昇降する。例えば図３において、基板Ｗの右側部分は下方に若干曲がっている。そのため右側の浮上部材８にあっては基板Ｗの下面に合わせて受け部分１１がスプリング１４を圧縮して下方に下がっている。このようにして基板Ｗに凹凸があっても常に受け部分１１の上面と基板Ｗとの間は一定に保たれ、受け部分１１が基板Ｗに当たって傷つけることがない。   Here, the interval between the upper surface of the receiving portion 11 and the substrate W is raised and lowered so that the pressure between the upper surface of the receiving portion 11 and the substrate W is constant. For example, in FIG. 3, the right portion of the substrate W is slightly bent downward. Therefore, in the right floating member 8, the receiving portion 11 compresses the spring 14 and falls downward in accordance with the lower surface of the substrate W. In this way, even if the substrate W is uneven, the space between the upper surface of the receiving portion 11 and the substrate W is always kept constant, and the receiving portion 11 does not hit the substrate W and be damaged.

上記の如くして基板を浮上せしめたならば、アライメント部材５のスライド部材６を前進せしめ、プッシャー７を基板Ｗの縁に当接させて位置決めを行う。位置決めが終了したならば、再びバルブを切り替えて受け部分１１の上面で基板Ｗを吸着し、搬送治具などによって処理装置に搬入する。   When the substrate is lifted as described above, the slide member 6 of the alignment member 5 is advanced, and the pusher 7 is brought into contact with the edge of the substrate W for positioning. When the positioning is completed, the valve is switched again and the substrate W is adsorbed on the upper surface of the receiving portion 11 and is carried into the processing apparatus by a transport jig or the like.

以上は実施の一例を示したものであり、基板としては矩形状に限らず円形でもよく、また図示例では浮上部材８の間隔については基板の周辺部に対応する箇所では狭く設定しているが、均等に配置してもよい。更に受け部分１１の上面に形成する溝は円環状に限らず矩形状でもよい。   The above is an example of implementation, and the substrate is not limited to a rectangular shape but may be a circle. In the illustrated example, the interval between the floating members 8 is set narrow at a location corresponding to the peripheral portion of the substrate. , They may be arranged evenly. Further, the groove formed on the upper surface of the receiving portion 11 is not limited to an annular shape but may be a rectangular shape.

本発明に係る位置決め装置の平面図Plan view of a positioning device according to the present invention 同位置決め装置の側面図Side view of the positioning device 浮上部材の拡大断面図Enlarged sectional view of the floating member 浮上部材の拡大上面図Enlarged top view of floating member

符号の説明Explanation of symbols

１…ベース、２…昇降装置、３…支持部材、４…モータ、５…アライメント部材、６…スライド部材、７…プッシャー、８…浮上部材、９…浮上部材の本体部分、１０…キャップ、１１…受け部分、１２…配管、１３…通気穴、１４…スプリング、１５…通気穴、１６…径方向溝、１７…円環状溝、Ｗ…基板。
DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Elevating device, 3 ... Support member, 4 ... Motor, 5 ... Alignment member, 6 ... Slide member, 7 ... Pusher, 8 ... Floating member, 9 ... Main part of floating member, 10 ... Cap, 11 DESCRIPTION OF SYMBOLS ... Receiving part, 12 ... Piping, 13 ... Vent hole, 14 ... Spring, 15 ... Vent hole, 16 ... Radial groove, 17 ... Circular groove, W ... Substrate.

Claims (3)

基板を浮上させて位置決めする位置決め装置において、この位置決め装置は基板を浮上せしめる浮上部材と基板を位置決めするアライメント部材とを備え、前記浮上部材は基板の全域をカバーするように板状或いは格子状をなす支持部材に複数個取り付けられ、また浮上部材はその上面を基板受け面とし、この基板受け面は平坦で且つ所定の面積の流体噴出エリアが形成されていることを特徴とする位置決め装置。 In a positioning device for levitating and positioning a substrate, the positioning device includes a levitating member for levitating the substrate and an alignment member for positioning the substrate, and the levitating member has a plate shape or a lattice shape so as to cover the entire area of the substrate. A positioning apparatus comprising: a plurality of supporting members attached to a supporting member; and a floating member having an upper surface as a substrate receiving surface, the substrate receiving surface being flat and having a fluid ejection area having a predetermined area. 請求項１に記載の位置決め装置において、前記基板受け面にはエア噴出用兼エア吸引用の溝及び穴が環状に形成され、この溝及び穴によって囲まれる領域を浮上力或いは吸引力が作用する領域としたことを特徴とする位置決め装置。 2. The positioning apparatus according to claim 1, wherein a groove and a hole for air ejection and air suction are formed in an annular shape on the substrate receiving surface, and a floating force or a suction force acts on a region surrounded by the groove and the hole. A positioning device characterized by being an area. 請求項１又は請求項２に記載の位置決め装置において、前記浮上部材は支持部材に固定される本体部分と、この本体部分に摺動自在に挿入されるとともに弾発部材にて上方に付勢される受け部分とからなることを特徴とする位置決め装置。
3. The positioning device according to claim 1, wherein the levitation member is slidably inserted into the main body portion fixed to the support member and urged upward by the resilient member. And a receiving portion.
JP2004343412A 2004-11-29 2004-11-29 Positioning device Pending JP2006156612A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004343412A JP2006156612A (en) 2004-11-29 2004-11-29 Positioning device
CNB2005101373310A CN100505204C (en) 2004-11-29 2005-11-29 Orientation equipment
KR1020050114650A KR20060059835A (en) 2004-11-29 2005-11-29 Positioning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004343412A JP2006156612A (en) 2004-11-29 2004-11-29 Positioning device

Publications (1)

Publication Number Publication Date
JP2006156612A true JP2006156612A (en) 2006-06-15

Family

ID=36634521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004343412A Pending JP2006156612A (en) 2004-11-29 2004-11-29 Positioning device

Country Status (3)

Country Link
JP (1) JP2006156612A (en)
KR (1) KR20060059835A (en)
CN (1) CN100505204C (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170797A (en) * 2008-01-18 2009-07-30 Disco Abrasive Syst Ltd Wafer transport device, and processing device
JP2013080851A (en) * 2011-10-05 2013-05-02 Dainippon Printing Co Ltd Substrate alignment method and device
JP2013175622A (en) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd Application device, substrate holding device, and substrate holding method
WO2019163191A1 (en) * 2018-02-26 2019-08-29 株式会社Ｓｃｒｅｅｎホールディングス Centering device, centering method, substrate processing device, and substrate processing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101442432B1 (en) * 2010-06-17 2014-09-17 닛산 지도우샤 가부시키가이샤 Workpiece-positioning device and workpiece manufacturing method
CN103367215B (en) * 2013-06-08 2016-08-24 天通吉成机器技术有限公司 A kind of substrate positioning-lifting device of plasma etching equipment
JP6842948B2 (en) * 2017-02-24 2021-03-17 リンテック株式会社 Positioning device and positioning method
JP7259476B2 (en) * 2019-03-27 2023-04-18 東京エレクトロン株式会社 Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009170797A (en) * 2008-01-18 2009-07-30 Disco Abrasive Syst Ltd Wafer transport device, and processing device
JP2013080851A (en) * 2011-10-05 2013-05-02 Dainippon Printing Co Ltd Substrate alignment method and device
JP2013175622A (en) * 2012-02-27 2013-09-05 Dainippon Screen Mfg Co Ltd Application device, substrate holding device, and substrate holding method
WO2013128710A1 (en) * 2012-02-27 2013-09-06 大日本スクリーン製造株式会社 Coating application device, substrate retaining device, and substrate retaining method
WO2019163191A1 (en) * 2018-02-26 2019-08-29 株式会社Ｓｃｒｅｅｎホールディングス Centering device, centering method, substrate processing device, and substrate processing method
JP2019149423A (en) * 2018-02-26 2019-09-05 株式会社Ｓｃｒｅｅｎホールディングス Centering device, centering method, substrate processing apparatus, and substrate processing method
TWI690015B (en) * 2018-02-26 2020-04-01 日商斯庫林集團股份有限公司 Centering device, centering method, substrate processing apparatus, and substrate processing method

Also Published As

Publication number Publication date
KR20060059835A (en) 2006-06-02
CN100505204C (en) 2009-06-24
CN1812073A (en) 2006-08-02

Similar Documents

Publication Publication Date Title
KR20070038467A (en) Transfer equipment
CN100505204C (en) Orientation equipment
US20150279716A1 (en) Apparatus and method for detaching chip
TW202002151A (en) Method and apparatus for correcting work
KR102372646B1 (en) Substrate processing apparatus
US20110042983A1 (en) Nozzle for holding a substrate and apparatus for transferring a substrate including the same
JP2005123583A5 (en)
JP4797027B2 (en) Substrate body sticking apparatus and substrate body handling method
JP2023054081A (en) Polishing head for holding base board and base board processing device
JP2007134433A (en) Method of degassing interspace between objects and degassing apparatus
JP6392510B2 (en) Wafer transfer system
JP2002127070A (en) Plate-like body holder
CN205944058U (en) Bear device, &#34;The reaction chamber&#34; and semiconductor processing equipment
JP2010157526A (en) Substrate mounting device with alignment function, and film forming device including substrate mounting device
JP2009071195A (en) Semiconductor manufacturing apparatus and method for manufacturing semiconductor
JP2003245886A (en) Adsorbing mechanism
JP6867226B2 (en) Vacuum suction member
JP4447497B2 (en) Board holder
KR101619876B1 (en) Suction pad for transferring device and the transferring device comprising the same
JP2007112031A (en) Apparatus and method for lamination
JP7216476B2 (en) Grinding method for plate-shaped work
CN108074848B (en) Gasket, wafer stacking structure, adsorption type moving device and wafer moving method
JP5449857B2 (en) Conveying apparatus and conveying method for plate member
JP2007073778A (en) Method and device for picking up semiconductor chip
KR101645723B1 (en) Structure of wafer storage

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071010

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091013

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091015

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100223