JP2006143552A - 多結晶シリコンの梱包方法 - Google Patents
多結晶シリコンの梱包方法 Download PDFInfo
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Abstract
【解決手段】(1)塊状多結晶シリコンを梱包する際に、前記塊状多結晶シリコンと梱包材との接触し得る面積を前記塊状多結晶シリコン1kgあたり580cm2以下とすることを特徴とする多結晶シリコンの梱包方法である。(2)上記塊状多結晶シリコンの粒径が3〜120mmであることを特徴とする上記(1)の多結晶シリコンの梱包方法である。(3)上記梱包材が平面、曲面およびそれらの組み合わせで構成される樹脂製であることを特徴とする上記(1)の多結晶シリコンの梱包方法である。
【選択図】図1
Description
Claims (3)
- 塊状多結晶シリコンを梱包する際に、前記塊状多結晶シリコンと梱包材との接触し得る面積を前記塊状多結晶シリコン1kgあたり580cm2以下とすることを特徴とする多結晶シリコンの梱包方法。
- 上記塊状多結晶シリコンの粒径が3〜120mmであることを特徴とする請求項1に記載の多結晶シリコンの梱包方法。
- 上記梱包材が平面、曲面およびそれらの組み合わせで構成される樹脂製であることを特徴とする請求項1に記載の多結晶シリコンの梱包方法。
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JP2004338719A JP4115986B2 (ja) | 2004-11-24 | 2004-11-24 | 多結晶シリコンの梱包方法 |
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JP2004338719A JP4115986B2 (ja) | 2004-11-24 | 2004-11-24 | 多結晶シリコンの梱包方法 |
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JP2006143552A true JP2006143552A (ja) | 2006-06-08 |
JP4115986B2 JP4115986B2 (ja) | 2008-07-09 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2030905A2 (en) | 2007-08-27 | 2009-03-04 | Mitsubishi Materials Corporation | Method of packing silicon and packing body |
JP2009249013A (ja) * | 2008-04-09 | 2009-10-29 | Osaka Titanium Technologies Co Ltd | シリコン梱包方法 |
JP2009298672A (ja) * | 2008-06-17 | 2009-12-24 | Osaka Titanium Technologies Co Ltd | 多結晶シリコン及びその製造方法 |
JP2013039977A (ja) * | 2011-08-18 | 2013-02-28 | Wacker Chemie Ag | 多結晶シリコンを包装する方法 |
WO2015007490A1 (de) * | 2013-07-18 | 2015-01-22 | Wacker Chemie Ag | Verpackung von polykristallinem silicium |
JP2016539069A (ja) * | 2013-11-22 | 2016-12-15 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | 多結晶シリコンを作製するための方法 |
CN106660694A (zh) * | 2014-09-26 | 2017-05-10 | 株式会社德山 | 多晶硅包装体 |
KR20170112992A (ko) * | 2016-03-28 | 2017-10-12 | 헴로크 세미컨덕터 오퍼레이션즈 엘엘씨 | 제품을 오염시키는 규소 에칭제에 의해 용해되지 않는 물질의 농도 측정 방법 |
US11230796B2 (en) | 2015-09-15 | 2022-01-25 | Shin-Etsu Chemical Co., Ltd. | Resin material, vinyl bag, polycrystalline silicon rod, polycrystalline silicon mass |
-
2004
- 2004-11-24 JP JP2004338719A patent/JP4115986B2/ja active Active
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9988188B2 (en) | 2007-08-27 | 2018-06-05 | Mitsubishi Materials Corporation | Method of packing silicon and packing body |
EP2030905A2 (en) | 2007-08-27 | 2009-03-04 | Mitsubishi Materials Corporation | Method of packing silicon and packing body |
JP2009249013A (ja) * | 2008-04-09 | 2009-10-29 | Osaka Titanium Technologies Co Ltd | シリコン梱包方法 |
JP2009298672A (ja) * | 2008-06-17 | 2009-12-24 | Osaka Titanium Technologies Co Ltd | 多結晶シリコン及びその製造方法 |
JP2013039977A (ja) * | 2011-08-18 | 2013-02-28 | Wacker Chemie Ag | 多結晶シリコンを包装する方法 |
US9981796B2 (en) | 2013-07-18 | 2018-05-29 | Wacker Chemie Ag | Packing polycrystalline silicon |
WO2015007490A1 (de) * | 2013-07-18 | 2015-01-22 | Wacker Chemie Ag | Verpackung von polykristallinem silicium |
JP2016539069A (ja) * | 2013-11-22 | 2016-12-15 | ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG | 多結晶シリコンを作製するための方法 |
CN106660694A (zh) * | 2014-09-26 | 2017-05-10 | 株式会社德山 | 多晶硅包装体 |
US10518964B2 (en) | 2014-09-26 | 2019-12-31 | Tokuyama Corporation | Polysilicon package |
US11230796B2 (en) | 2015-09-15 | 2022-01-25 | Shin-Etsu Chemical Co., Ltd. | Resin material, vinyl bag, polycrystalline silicon rod, polycrystalline silicon mass |
KR20170112992A (ko) * | 2016-03-28 | 2017-10-12 | 헴로크 세미컨덕터 오퍼레이션즈 엘엘씨 | 제품을 오염시키는 규소 에칭제에 의해 용해되지 않는 물질의 농도 측정 방법 |
KR102594202B1 (ko) | 2016-03-28 | 2023-10-27 | 헴로크 세미컨덕터 오퍼레이션즈 엘엘씨 | 제품을 오염시키는, 규소 에칭제에 의해 용해되지 않는 물질의 농도 측정 방법 |
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