JP2006093331A - 半導体装置、フレキシブル基板、及び半導体装置を備えた電子機器 - Google Patents
半導体装置、フレキシブル基板、及び半導体装置を備えた電子機器 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 176
- 239000000758 substrate Substances 0.000 title claims abstract description 86
- 239000000463 material Substances 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 abstract description 129
- 238000000034 method Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 230000009467 reduction Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
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- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
【解決手段】 液晶ドライバチップ15がフレキシブル基板11に実装されている。該基板11には、出力側アウターリード22と入力側アウターリード23とが相対する2辺に分かれて形成され、チップ15との接続用のインナーリード24が形成されている。チップ15における4辺のエッジのうちの出力側アウターリード22に最も近い1辺と直角をなす2辺に出力端子28が配設され、該出力端子28と接続されたインナーリード24から出力側アウターリード22ヘと配線12aが引き出されている。
【選択図】 図1
Description
シャープ株式会社ニュースリリース No.2001-103 2001年12月1日発表
また、本発明の電子機器は、上記課題を解決するために、本発明の半導体装置を備えたことを特徴としている。
2 液晶パネル
3 回路基板
10 テープキャリア
11 フレキシブル基板
15 液晶ドライバチップ(半導体チップ)
20 スプロケットホール
22 出力側アウターリード(出力側接続端子)
23 入力側アウターリード(入力側接続端子)
24 インナーリード(接続電極)
28 出力端子
29 入力端子
30 テープキャリア
31 半導体装置
32 フレキシブル基板
33 第1の液晶ドライバチップ(半導体チップ)
34 第2の液晶ドライバチップ(半導体チップ)
12e 分岐配線(共通配線)
Claims (13)
- 少なくとも1つの半導体チップがフレキシブル基板に実装されており、該フレキシブル基板には、入力側接続端子と出力側接続端子とが相対する2辺に分かれて形成されると共に、上記半導体チップが電気的に接続される接続電極が形成されている半導体装置において、
上記半導体チップにおける4辺のエッジのうちの上記出力側接続端子に最も近い1辺と直角をなす2辺に出力端子が配設され、上記フレキシブル基板では上記出力端子と接続された上記接続電極から上記出力側接続端子ヘと配線が引き出されていることを特徴とする半導体装置。 - 上記半導体チップにおける上記出力側接続端子に最も近い1辺にも上記出力端子が配設され、上記フレキシブル基板では上記出力端子と接続された上記接続電極から上記出力側接続端子ヘと配線が引き出されていることを特徴とする請求項1に記載の半導体装置。
- 上記半導体チップは略矩形であり、その長手方向と上記出力側接続端子の列とが直角を成していることを特徴とする請求項1又は2に記載の半導体装置。
- 上記半導体チップにおける4辺のエッジのうちの上記入力側接続端子に最も近い1辺に入力端子が配設され、上記フレキシブル基板では上記入力端子と接続された上記接続電極から上記入力側接続端子ヘと配線が引き出されていることを特徴とする請求項1又は2に記載の半導体装置。
- 上記半導体チップにおける4辺のエッジのうちの上記入力側接続端子に最も近い1辺と該1辺と直角をなす2辺とに入力端子が配設され、上記フレキシブル基板では上記入力端子と接続された上記接続電極から上記入力側接続端子ヘと配線が引き出されていることを特徴とする請求項1又は2に記載の半導体装置。
- 複数の上記半導体チップが、上記出力側接続端子の列と直角を成す方向に並んで配置されていることを特徴とする請求項1又は2に記載の半導体装置。
- 複数の上記半導体チップが、上記出力側接続端子の列と直角を成す方向に並んで配置されており、各半導体チップに形成された上記入力端子と接続された上記接続電極から上記入力側接続端子へと引き出される配線の一部が、複数の半導体チップ間で共通化されていることを特徴とする請求項4に記載の半導体装置。
- 少なくとも1つの半導体チップが実装されるフレキシブル基板であって、入力側接続端子と出力側接続端子とが相対する2辺に分かれて形成されると共に、上記半導体チップが電気的に接続される接続電極が形成されているフレキシブル基板において、
上記半導体チップの4辺に対応して配列された上記接続電極は、上記半導体チップの4辺に対応して配列されており、このうちの上記出力側接続端子に最も近い1辺と直角を成す2辺に設けられた接続電極から引き出された配線が、上記出力側接続端子に接続されていることを特徴とするフレキシブル基板。 - 上記半導体チップが略矩形であり、上記半導体チップの4辺に対応して配列された上記接続電極は、上記半導体チップの長手方向と上記出力側接続端子の列とが直角を成すように形成されていることを特徴とする請求項8に記載のフレキシブル基板。
- 長尺状のベース基材を有すると共に該ベース基材における長尺方向に沿う両端部にスプロケット列が形成され、各半導体装置の外形形状にて分断されることで、入力側接続端子と出力側接続端子とが相対する2辺に分かれて形成されると共に、半導体チップが電気的に接続される接続電極が形成されたフレキシブル基板を複数取得できるテープキャリアにおいて、
上記半導体チップの4辺に対応して配列された上記接続電極は、上記半導体チップの4辺に対応して配列されており、このうちの上記出力側接続端子に最も近い1辺と直角を成す2辺に設けられた接続電極から引き出された配線が、上記出力側接続端子に接続されていることを特徴とするテープキャリア。 - 上記半導体チップが略矩形であり、上記半導体チップの4辺に対応して配列された上記接続電極は、上記半導体チップの長手方向と上記出力側接続端子の列とが直角を成すように形成されていることを特徴とする請求項9に記載のテープキャリア。
- 上記半導体チップが略矩形であり、上記半導体チップの4辺に対応して配列された上記接続電極は、上記半導体チップの長手方向と上記出力側接続端子の列とが直角を成し、かつ、上記半導体チップの長手方向とテープキャリアのスプロケットホールの列とが直角を成すように形成されていることを特徴とする請求項11に記載のテープキャリア。
- 上記請求項1〜7の何れか1項に記載の半導体装置を備えたことを特徴とする電子機器
。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004275637A JP4073903B2 (ja) | 2004-09-22 | 2004-09-22 | 半導体装置、フレキシブル基板、及び半導体装置を備えた電子機器 |
US11/229,786 US7368805B2 (en) | 2004-09-22 | 2005-09-20 | Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
KR1020050087554A KR100752453B1 (ko) | 2004-09-22 | 2005-09-21 | 반도체 장치, 플렉시블 기판, 테이프 캐리어, 및 반도체장치를 구비한 전자 기기 |
CNB2005101063545A CN100472771C (zh) | 2004-09-22 | 2005-09-22 | 半导体装置、柔性基板、带载体和具备半导体装置的电子设备 |
TW094132874A TWI321242B (en) | 2004-09-22 | 2005-09-22 | Semiconductor device, flexible substrate, tape carrier, and liquid crystal panel module including the semiconductor device |
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JP2004275637A JP4073903B2 (ja) | 2004-09-22 | 2004-09-22 | 半導体装置、フレキシブル基板、及び半導体装置を備えた電子機器 |
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JP2006093331A true JP2006093331A (ja) | 2006-04-06 |
JP2006093331A5 JP2006093331A5 (ja) | 2007-04-12 |
JP4073903B2 JP4073903B2 (ja) | 2008-04-09 |
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US (1) | US7368805B2 (ja) |
JP (1) | JP4073903B2 (ja) |
KR (1) | KR100752453B1 (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20180003243A (ko) * | 2016-06-30 | 2018-01-09 | 엘지디스플레이 주식회사 | 면적이 감소된 연성필름 및 이를 구비한 표시장치 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20090067744A (ko) * | 2007-12-21 | 2009-06-25 | 엘지전자 주식회사 | 연성 필름 |
KR100896439B1 (ko) * | 2007-12-26 | 2009-05-14 | 엘지전자 주식회사 | 연성 필름 |
KR100889002B1 (ko) * | 2007-12-27 | 2009-03-19 | 엘지전자 주식회사 | 연성 필름 |
KR100939550B1 (ko) * | 2007-12-27 | 2010-01-29 | 엘지전자 주식회사 | 연성 필름 |
KR100947608B1 (ko) * | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
CN102231014B (zh) * | 2011-06-16 | 2013-03-13 | 深圳市华星光电技术有限公司 | 用于液晶面板的软板上芯片构造 |
US20130063912A1 (en) * | 2011-09-14 | 2013-03-14 | Liang-Chan Liao | Cof packaging method and structure for lcd driver chips |
CN102508371B (zh) * | 2011-12-01 | 2014-05-21 | 深圳市华星光电技术有限公司 | 液晶面板的软板上芯片构造的卷带基板 |
US20130141686A1 (en) * | 2011-12-01 | 2013-06-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Tape substrate with chip on film structure for liquid crystal display panel |
KR20140123852A (ko) * | 2013-04-15 | 2014-10-23 | 삼성디스플레이 주식회사 | 칩 온 필름 및 이를 포함하는 표시 장치 |
US10159155B2 (en) * | 2013-12-11 | 2018-12-18 | Joled Inc. | Display device |
JP6213776B2 (ja) * | 2014-01-22 | 2017-10-18 | 株式会社オートネットワーク技術研究所 | スイッチング基板 |
KR102330537B1 (ko) * | 2017-07-14 | 2021-11-23 | 엘지디스플레이 주식회사 | Cof 패키지 및 이를 포함하는 표시 장치 |
US11322427B2 (en) * | 2018-07-20 | 2022-05-03 | Novatek Microelectronics Corp. | Chip on film package |
CN111029325A (zh) * | 2019-11-26 | 2020-04-17 | 武汉华星光电半导体显示技术有限公司 | 覆晶薄膜基板及柔性有机发光二极管显示器件 |
TWI766532B (zh) * | 2021-01-06 | 2022-06-01 | 南茂科技股份有限公司 | 可撓性線路基板 |
Family Cites Families (4)
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JP2553615B2 (ja) | 1988-03-17 | 1996-11-13 | 松下電器産業株式会社 | フィルムキャリア |
US5436745A (en) * | 1994-02-23 | 1995-07-25 | Ois Optical Imaging Systems, Inc. | Flex circuit board for liquid crystal display |
US6433414B2 (en) * | 2000-01-26 | 2002-08-13 | Casio Computer Co., Ltd. | Method of manufacturing flexible wiring board |
JP3696512B2 (ja) * | 2001-02-13 | 2005-09-21 | シャープ株式会社 | 表示素子駆動装置およびそれを用いた表示装置 |
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2004
- 2004-09-22 JP JP2004275637A patent/JP4073903B2/ja active Active
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2005
- 2005-09-20 US US11/229,786 patent/US7368805B2/en not_active Expired - Fee Related
- 2005-09-21 KR KR1020050087554A patent/KR100752453B1/ko active IP Right Grant
- 2005-09-22 CN CNB2005101063545A patent/CN100472771C/zh active Active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180003243A (ko) * | 2016-06-30 | 2018-01-09 | 엘지디스플레이 주식회사 | 면적이 감소된 연성필름 및 이를 구비한 표시장치 |
KR102662960B1 (ko) | 2016-06-30 | 2024-05-02 | 엘지디스플레이 주식회사 | 면적이 감소된 연성필름 및 이를 구비한 표시장치 |
Also Published As
Publication number | Publication date |
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JP4073903B2 (ja) | 2008-04-09 |
KR20060051452A (ko) | 2006-05-19 |
CN1770438A (zh) | 2006-05-10 |
CN100472771C (zh) | 2009-03-25 |
TW200615625A (en) | 2006-05-16 |
KR100752453B1 (ko) | 2007-08-24 |
US20060060949A1 (en) | 2006-03-23 |
US7368805B2 (en) | 2008-05-06 |
TWI321242B (en) | 2010-03-01 |
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