JP2006049827A - Cleaning member and method of cleaning substrate processor - Google Patents
Cleaning member and method of cleaning substrate processor Download PDFInfo
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- JP2006049827A JP2006049827A JP2005146522A JP2005146522A JP2006049827A JP 2006049827 A JP2006049827 A JP 2006049827A JP 2005146522 A JP2005146522 A JP 2005146522A JP 2005146522 A JP2005146522 A JP 2005146522A JP 2006049827 A JP2006049827 A JP 2006049827A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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Abstract
Description
本発明は、基板処理装置をクリーニングするためのクリーニング部材に関し、またこれを用いた基板処理装置のクリーニング方法に関する。
The present invention relates to a cleaning member for cleaning a substrate processing apparatus, and to a cleaning method for a substrate processing apparatus using the same.
半導体、フラットパネルディスプレイ、プリント基板などの製造装置や検査装置など、異物を嫌う各種の基板処理装置では、各搬送系と基板とを物理的に接触させながら搬送する。その際、基板や搬送系に異物が付着していると、後続の基板をつぎつぎに汚染することになるため、定期的に装置を停止して、洗浄処理する必要があった。このため、稼動率の低下や多大な労力が必要という問題があった。
In various substrate processing apparatuses that dislike foreign matters, such as manufacturing apparatuses and inspection apparatuses such as semiconductors, flat panel displays, and printed circuit boards, the respective transport systems and the substrate are transported while being physically contacted. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated. Therefore, it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there existed a problem that the operation rate fell and a lot of labor was required.
この問題を克服するため、基板処理装置内に、クリーニング部材として粘着性物質を固着した基板を搬送して、装置内に付着する異物をクリーニング除去する方法（特許文献１参照）や、板状部材を搬送して、基板裏面に付着する異物を除去する方法（特許文献２参照）が提案されている。
このうち、後者の板状部材を搬送する方法は、基板処理装置内への搬送は支障なく行えるが、肝心の異物除去性に劣っている。
In order to overcome this problem, a method of transporting a substrate having an adhesive substance fixed as a cleaning member into a substrate processing apparatus and cleaning and removing foreign substances adhering to the apparatus (see Patent Document 1), or a plate-like member Has been proposed (see Patent Document 2) for removing foreign substances adhering to the back surface of the substrate.
Among these, the latter method of transporting the plate-like member can be transported into the substrate processing apparatus without any problem, but it is inferior to the essential foreign matter removal property.
これに対して、前者の粘着性物質を固着した基板を搬送する方法は、異物除去性にすぐれており、前記稼動率の低下や多大な労力を回避する有効な方法といえる。しかし、この方法は、粘着性物質と装置接触部とが強く接着して剥がれなくなり、基板を確実に搬送できなくなることがあった。このため、粘着力を極力小さくして、異物除去性と搬送性との調整をはかるようにしている（特許文献３参照）。
クリーニングの対象となる基板処理装置内のチャックテーブルの温度は、その基板処理の種類によって室温から高温までの各種各様であり幅広い。したがって、幅広い温度範囲で使用できるクリーニング部材が理想的である。
しかし、従来のクリーニング部材は、高温のチャックテーブルに対し、クリーニングの際に温度を室温まで下げなければならなかった。これは、クリーニング部材が熱可塑性であり、室温で非粘着性であっても高温雰囲気下になると弾性率の低下とともに粘着力が大きくなるためである。そのため、チャックテーブルの温度制御（下温／昇温）に多大な時間を要し、装置の稼働率を下げてしまうことが問題であった。
The temperature of the chuck table in the substrate processing apparatus to be cleaned varies widely from room temperature to high temperature depending on the type of substrate processing. Therefore, a cleaning member that can be used in a wide temperature range is ideal.
However, in the conventional cleaning member, the temperature has to be lowered to room temperature when cleaning the hot chuck table. This is because the cleaning member is thermoplastic, and even if it is non-adhesive at room temperature, the adhesive force increases as the elastic modulus decreases in a high temperature atmosphere. Therefore, it takes a long time to control the temperature of the chuck table (lower temperature / temperature increase), and the operation rate of the apparatus is lowered.
本発明は、このような事情に照らし、基板処理装置のチャックテーブル温度が室温から高温でも（２５〜２００℃）、チャックテーブルに貼り付かず、良好な搬送性を維持し、しかも異物除去性にすぐれており、チャックテーブルに付着している異物を確実に除去できるクリーニング部材を提供することを目的としている。
In light of such circumstances, the present invention does not stick to the chuck table even when the chuck table temperature of the substrate processing apparatus is from room temperature to high temperature (25 to 200 ° C.), maintains good transportability, and has excellent foreign substance removal properties. An object of the present invention is to provide a cleaning member that is excellent and can reliably remove foreign matter adhering to the chuck table.
本発明者らは、上記目的を達成するため、鋭意検討した結果、室温から高温までの広い温度範囲で非粘着性でありかつ引っ張り弾性率が特定値以下となるクリーニング層を有するクリーニング部材によると、高温のチャックテーブルに対してその温度を室温まで下げなくとも、従来のように貼り付きなどの不都合をきたさず、基板処理装置内に室温から高温までの広い温度範囲で良好に搬送できるとともに、この搬送により装置内に付着する異物を簡便かつ確実に除去できることを見出し、本発明を完成した。
As a result of intensive studies to achieve the above object, the present inventors have found that the cleaning member has a cleaning layer that is non-adhesive in a wide temperature range from room temperature to high temperature and has a tensile elastic modulus of a specific value or less. , Without lowering the temperature of the high-temperature chuck table to room temperature, without causing inconvenience such as sticking as in the past, it can be transported well in a wide temperature range from room temperature to high temperature in the substrate processing apparatus, It has been found that foreign substances adhering to the inside of the apparatus can be easily and reliably removed by this conveyance, and the present invention has been completed.
本発明は、このような知見をもとにして、完成されたものである。
すなわち、本発明は、２５〜２００℃の温度範囲において非粘着性でかつ引っ張り弾性率が３，０００ＭＰａ以下であるクリーニング層を有することを特徴とするクリーニング部材に係るものであり、特に、上記クリーニング層の引っ張り弾性率が１００ＭＰａ以下である上記構成のクリーニング部材に係るものである。
また、本発明は、クリーニング層を有するクリーニングシートである上記構成のクリーニング部材、搬送部材上にクリーニング層を有するクリーニング機能付き搬送部材である上記構成のクリーニング部材、さらに上記のクリーニング機能付き搬送部材が、搬送部材上に上記のクリーニングシートが粘着剤層を介して設けられている上記構成のクリーニング部材、また上記のクリーニング機能付き搬送部材が、搬送部材上にクリーニング層が直接設けられている上記構成のクリーニング部材を提供できるものである。
さらに、本発明は、基板処理装置内に、上記各構成のクリーニング部材を搬送することを特徴とする基板処理装置のクリーニング方法、このクリーニング方法によりクリーニングされた基板処理装置を、提供できるものである。
The present invention has been completed based on such knowledge.
That is, the present invention relates to a cleaning member having a cleaning layer that is non-adhesive and has a tensile elastic modulus of 3,000 MPa or less in a temperature range of 25 to 200 ° C. The present invention relates to the cleaning member having the above-described configuration, in which the tensile elastic modulus of the layer is 100 MPa or less.
The present invention also includes a cleaning member having the above-described configuration that is a cleaning sheet having a cleaning layer, a cleaning member having the above-described configuration that is a transport member having a cleaning function having a cleaning layer on the transport member, and a transport member having the cleaning function. The cleaning member having the above configuration in which the cleaning sheet is provided on the transport member via the adhesive layer, and the transport member having the cleaning function described above is provided with the cleaning layer directly on the transport member. The cleaning member can be provided.
Furthermore, the present invention can provide a cleaning method for a substrate processing apparatus, which transports the cleaning members having the above-described configurations into the substrate processing apparatus, and a substrate processing apparatus cleaned by this cleaning method. .
このように、本発明においては、２５〜２００℃の温度範囲において、非粘着性でかつ引っ張り弾性率が３，０００ＭＰａ以下である、特に好ましくは１００ＭＰａ以下であるクリーニング層を有するクリーニング部材を使用したことにより、基板処理装置内に室温から高温までの広い温度範囲で良好に搬送できるとともに、装置内に付着する異物を簡便かつ確実にクリーニング除去することができる。
Thus, in the present invention, a cleaning member having a cleaning layer that is non-adhesive and has a tensile elastic modulus of 3,000 MPa or less, particularly preferably 100 MPa or less, in a temperature range of 25 to 200 ° C. is used. As a result, the substrate can be satisfactorily conveyed in a wide temperature range from room temperature to high temperature in the substrate processing apparatus, and foreign substances adhering to the apparatus can be easily and reliably removed by cleaning.
本発明において、クリーニング層は、２５〜２００℃の温度範囲において、非粘着性であり、かつ引っ張り弾性率が３，０００ＭＰａ以下であることが必要であり、好ましくは引っ張り弾性率が１００ＭＰａ以下、より好ましくは１〜１００ＭＰａ、特に好ましくは１０〜９０ＭＰａの範囲にあるのがよい。
このように、クリーニング層が室温から高温までの広い温度範囲で非粘着性であると、基板処理装置のチャックテーブル温度が高温の状態でも、このチャックテーブルに貼り付くという不具合が回避され、良好な搬送性を維持できる。
また、引っ張り弾性率が３，０００ＭＰａ以下であると、特に１００ＭＰａ以下であると、このクリーニング層へ異物が十分にめり込むことによる投錨効果により、異物を効率良く除去でき、高い異物除去性が得られる。
In the present invention, the cleaning layer needs to be non-adhesive in a temperature range of 25 to 200 ° C. and have a tensile elastic modulus of 3,000 MPa or less, preferably a tensile elastic modulus of 100 MPa or less, more The range is preferably 1 to 100 MPa, particularly preferably 10 to 90 MPa.
As described above, when the cleaning layer is non-adhesive in a wide temperature range from room temperature to high temperature, the problem of sticking to the chuck table is avoided even when the chuck table temperature of the substrate processing apparatus is high. Transportability can be maintained.
Further, when the tensile elastic modulus is 3,000 MPa or less, particularly 100 MPa or less, the foreign matter can be efficiently removed by the anchoring effect by the foreign matter sufficiently sinking into the cleaning layer, and high foreign matter removability is obtained. .
本発明において、このようなクリーニング層は、上記の特性を示す限り、その材料成分などにとくに限定はないが、たとえば、ポリテトラフルオロエチレン系、パーフロロアルコキシ系、フッ化エチレンプロピレン系、ポリエーテルエーテルケトン系、ポリサルフォン系、ポリエーテルサルフォン系、ナイロン系、ポリアセタール系、エポキシ系、ポリカーボネート系、環状ポリオレフイン系、アラミド系、ポリジメチルシロキサン系、ポリイミド系の高分子材料が好ましく用いられる。
とくに、ポリテトラフルオロエチレン系の高分子材料が最適である。すなわち、この種の材料は、フッ素の電子吸引性のため、結合エネルギーが高く、耐熱性にすぐれており、温度変化に対する物性の変化が極めて少なく、広い温度範囲で安定した物性を維持する。また、延伸条件により弾性率を任意に制御することができる。さらに、表面自由エネルギーが小さいため、広い温度範囲で非粘着性を示すものである。
In the present invention, such a cleaning layer is not particularly limited as long as it exhibits the above-mentioned characteristics. For example, polytetrafluoroethylene, perfluoroalkoxy, fluorinated ethylenepropylene, polyether Ether ketone, polysulfone, polyether sulfone, nylon, polyacetal, epoxy, polycarbonate, cyclic polyolefin, aramid, polydimethylsiloxane, and polyimide polymer materials are preferably used.
In particular, a polytetrafluoroethylene-based polymer material is optimal. That is, this type of material has high binding energy and excellent heat resistance due to the electron withdrawing property of fluorine, and changes in physical properties with respect to temperature changes are extremely small, and stable physical properties are maintained over a wide temperature range. Further, the elastic modulus can be arbitrarily controlled by the stretching conditions. Furthermore, since surface free energy is small, non-adhesiveness is exhibited in a wide temperature range.
本発明のクリーニング部材は、このようなクリーニング層を有するクリーニングシートであってもよいし、搬送部材上にこのようなクリーニング層を有するクリーニング機能付き搬送部材であってもよい。
クリーニングシートである場合、上記のクリーニング層をこれ単独でフィルム成形したものであってもよいし、ポリエステルフィルムやポリイミドフィルムなどの耐熱性支持体を使用し、この支持体上に上記のクリーニング層をコンマコート法、ファウンテン法、グラビア法などにより塗工形成した構成としてもよい。これらの態様において、クリーニング層の厚さは、５μｍ以上であれば前記機能を発現させることができるが、とくに好ましくは１０〜５０μｍであるのがよい。
The cleaning member of the present invention may be a cleaning sheet having such a cleaning layer, or may be a transport member with a cleaning function having such a cleaning layer on the transport member.
In the case of a cleaning sheet, the cleaning layer may be a film formed by itself, or a heat-resistant support such as a polyester film or a polyimide film is used, and the cleaning layer is formed on the support. It is good also as a structure formed by coating by the comma coat method, the fountain method, the gravure method, etc. In these embodiments, the thickness of the cleaning layer can exhibit the above function if it is 5 μm or more, but it is particularly preferably 10 to 50 μm.
また，クリーニング機能付き搬送部材である場合、搬送部材上に上記のクリーニングシートが粘着剤層を介して設けられている構成であってもよいし、搬送部材上にクリーニング層が直接設けられている構成であってもよい。
前者の構成では、使用する前記のクリーニングシートにあらかじ粘着剤層を形成して、粘着剤層付きのクリーニングシートを作製しておき、上記粘着剤層を利用して搬送部材上に貼り合わせればよい。また、後者の構成では、搬送部材上にクリーニング層形成材料をスピンコート法、スプレー法などにより直接塗工（コーティング）してクリーニング層を形成すればよい。
なおまた、前記した支持体上に塗工形成されたクリーニング層を、搬送部材上に転写、ラミネートして、クリーニング機能付き搬送部材を作製することもできる。
In the case of a transport member with a cleaning function, the cleaning sheet may be provided on the transport member via an adhesive layer, or the cleaning layer is directly provided on the transport member. It may be a configuration.
In the former configuration, an adhesive layer is formed in advance on the cleaning sheet to be used, a cleaning sheet with an adhesive layer is prepared, and the adhesive layer is used to bond the sheet onto a conveying member. Good. In the latter configuration, the cleaning layer may be formed by directly coating (coating) the cleaning layer forming material on the conveying member by spin coating, spraying, or the like.
It is also possible to produce a transport member with a cleaning function by transferring and laminating the cleaning layer coated and formed on the above-mentioned support on the transport member.
前者の構成において、粘着剤層は、シリコンウエハ（ミラー面）に対する１８０度引き剥がし粘着力が０．０１〜１０Ｎ／１０mm幅、好適には０．０５〜５Ｎ／１０mm幅であるのがよい。粘着力が高すぎると、クリーニングシートを搬送部材から剥離除去する際に、シートが裂けるおそれがある。粘着剤層の厚さは、とくに限定されないが、通常は５〜１００μｍ、好ましくは１０〜５０μｍ程度であるのがよい。
このような粘着剤層は、その材料構成について、とくに限定されず、アクリル系やゴム系などの通常の粘着剤がいずれも使用できる。その中でも、アクリル系の粘着剤として、重量平均分子量が１０万以下の成分が１０重量％以下であるアクリル系ポリマーを主剤としたものが、とくに好ましく用いられる。上記のアクリル系ポリマーは、（メタ）アクリル酸アルキルエステルを主モノマーとしこれに必要により共重合可能な他のモノマーを加えたモノマー混合物を、重合反応させることにより、合成できる。
In the former configuration, the pressure-sensitive adhesive layer has a 180-degree peeling adhesive strength to the silicon wafer (mirror surface) of 0.01 to 10 N / 10 mm width, preferably 0.05 to 5 N / 10 mm width. If the adhesive force is too high, the sheet may be torn when the cleaning sheet is peeled off from the conveying member. Although the thickness of an adhesive layer is not specifically limited, Usually, 5-100 micrometers, Preferably it is about 10-50 micrometers.
Such a pressure-sensitive adhesive layer is not particularly limited with respect to its material structure, and any of normal pressure-sensitive adhesives such as acrylic and rubber-based materials can be used. Among these, as the acrylic pressure-sensitive adhesive, those mainly composed of an acrylic polymer having a component having a weight average molecular weight of 100,000 or less and 10% by weight or less are preferably used. The above-mentioned acrylic polymer can be synthesized by polymerizing a monomer mixture in which (meth) acrylic acid alkyl ester is used as a main monomer and another monomer copolymerizable therewith is added if necessary.
本発明のクリーニング部材が上記のようなクリーニング機能付き搬送部材である場合、用いられる搬送部材は、特に限定されず、基板処理装置の種類に応じて、適宜のものが用いられる。具体的には、半導体ウエハ、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ用基板、その他コンパクトディスク、ＭＲヘッドなどの基板が挙げられる。
When the cleaning member of the present invention is a transport member with a cleaning function as described above, the transport member used is not particularly limited, and an appropriate one is used according to the type of the substrate processing apparatus. Specific examples include substrates for flat panel displays such as semiconductor wafers, LCDs, and PDPs, and other compact disks and MR heads.
本発明においては、基板処理装置内に、上記構成のクリーニング部材を搬送して、チャックテーブルなどの被洗浄部位に接触移動させることにより、上記装置内に付着する異物を搬送トラブルを生じることなく簡便かつ確実にクリーニング除去できる。
すなわち、本発明のクリーニング部材を使用することにより、搬送性と異物除去性との両立を容易にはかれるものである。
In the present invention, the cleaning member having the above-described configuration is transported into the substrate processing apparatus and moved to contact with a site to be cleaned such as a chuck table, so that foreign matter adhering to the apparatus can be easily transported without causing trouble. And it can be removed reliably.
That is, by using the cleaning member of the present invention, it is possible to easily achieve both transportability and foreign matter removability.
本発明において、クリーニングが行われる基板処理装置としては、高温チャックテーブルを有するものであればとくに限定されない。たとえば、露光装置、レジスト塗布装置、現像装置、アッシング装置、ドライエッチング装置、イオン注入装置、ＰＶＤ装置、ＣＶＤ装置、外観検査装置、ウェハプローバなどが挙げられる。
本発明においては、上記の方法によりクリーニングされた上記の各基板処理装置を提供することができるものである。
In the present invention, the substrate processing apparatus to be cleaned is not particularly limited as long as it has a high temperature chuck table. Examples include an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, an appearance inspection apparatus, and a wafer prober.
In the present invention, each substrate processing apparatus cleaned by the above method can be provided.
つぎに、本発明の実施例を記載して、より具体的に説明する。ただし、本発明は、以下の実施例にのみ限定されるものではない。
なお、以下において、部とあるのは重量部を意味するものとする。
Next, examples of the present invention will be described in more detail. However, the present invention is not limited only to the following examples.
In the following, “parts” means parts by weight.
クリーニング層として、厚さが２５μｍのポリテトラフルオロエチレン系フィルム〔三井フロロケミカル（株）製〕を用いた。引っ張り弾性率は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、８７ＭＰａ、７１ＭＰａおよび４５ＭＰａであった。ここで、引っ張り弾性率は、試験法ＪＩＳ Ｋ７１２７（試験速度５０mm／分、試験片幅１０mm、初期チャック間隔１０mm）に準じて測定した。また、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力（ＪＩＳ Ｚ０２３７に準じて測定）は、２５℃、１００℃および２００℃の雰囲気下で、ともに０Ｎ／１０mm幅であった。
A polytetrafluoroethylene film (manufactured by Mitsui Fluorochemical Co., Ltd.) having a thickness of 25 μm was used as the cleaning layer. The tensile elastic modulus was 87 MPa, 71 MPa, and 45 MPa in the atmospheres of 25 ° C., 100 ° C., and 200 ° C., respectively. Here, the tensile modulus was measured according to the test method JIS K7127 (test speed 50 mm / min, test piece width 10 mm, initial chuck interval 10 mm). Further, the 180 ° peel-off adhesive strength (measured according to JIS Z0237) with respect to the silicon wafer (mirror surface) was 0 N / 10 mm width under the atmospheres of 25 ° C., 100 ° C. and 200 ° C.
温度計、撹拌機、窒素導入管および還流冷却管を備えた内容量が５００ｍｌの３つ口フラスコ型の反応器内に、アクリル酸２−エチルヘキシル７３部、アクリル酸ｎ−ブチル１０部、Ｎ，Ｎ−ジメチルアクリルアミド１５部およびアクリル酸５部、重合開始剤として２，２′−アゾビスイソブチロニトリル０．１５部、酢酸エチル１００部を、全体が２００ｇになるように配合して投入した。これに窒素ガスを約１時間導入しながら撹拌して、内部の空気を窒素で置換した。その後、内部の温度を５８℃にし、この状態で約４時間保持して重合を行い、粘着剤ポリマー溶液を得た。
つぎに、このようにして得た粘着剤ポリマー溶液１００部に対して、架橋剤としてポリイソシアネート化合物〔日本ポリウレタン工業（株）製の商品名「コロネートＬ」〕３部を、均一に混合し、粘着剤溶液Ａを調製した。
In a three-necked flask type reactor having an internal volume of 500 ml equipped with a thermometer, a stirrer, a nitrogen introduction tube and a reflux condenser, 73 parts of 2-ethylhexyl acrylate, 10 parts of n-butyl acrylate, N, 15 parts of N-dimethylacrylamide and 5 parts of acrylic acid, 0.15 part of 2,2′-azobisisobutyronitrile as a polymerization initiator, and 100 parts of ethyl acetate were blended in a total amount of 200 g. . The mixture was stirred while introducing nitrogen gas for about 1 hour, and the air inside was replaced with nitrogen. Thereafter, the internal temperature was set to 58 ° C., and the polymerization was carried out in this state for about 4 hours to obtain an adhesive polymer solution.
Next, 3 parts of a polyisocyanate compound [trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.] as a crosslinking agent is uniformly mixed with 100 parts of the pressure-sensitive adhesive polymer solution thus obtained. An adhesive solution A was prepared.
セパレータとして、片面がシリコーン系剥離剤にて剥離処理された、厚さが３８μｍの長尺ポリエステルフィルムを使用した。このセパレータの剥離処理面に、上記の粘着剤溶液Ａを、乾燥後の厚さが１５μｍとなるように塗布し、乾燥したのち、その粘着剤層上にクリーニング層として上記のポリテトラフルオロエチレン系フィルム（厚さが２５μｍ）を積層し、クリーニングシートＡを作製した。
このクリーニングシートＡを、粘着剤層側のセパレータを剥がして、搬送部材である８インチシリコンウエハのミラー面にハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ａを作製した。なお、上記粘着剤層のシリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力は、１．５Ｎ／１０mm幅であった。
As the separator, a long polyester film having a thickness of 38 μm and having one surface peeled with a silicone-based release agent was used. The pressure-sensitive adhesive solution A is applied to the separation-treated surface of the separator so that the thickness after drying is 15 μm, and after drying, the polytetrafluoroethylene-based material is used as a cleaning layer on the pressure-sensitive adhesive layer. A film (having a thickness of 25 μm) was laminated to prepare a cleaning sheet A.
This cleaning sheet A was peeled off the separator on the pressure-sensitive adhesive layer side, and was adhered to the mirror surface of an 8-inch silicon wafer as a conveying member with a hand roller to produce a conveying member A with a cleaning function. In addition, the 180 degree peeling adhesive force with respect to the silicon wafer (mirror surface) of the said adhesive layer was 1.5 N / 10mm width.
半導体製造用のウエハ導通検査装置（チャックテーブル温度可変：２５〜２００℃）であるウエハプローバ〔東京精密（株）製の「ＵＦ２００」〕を用いて、以下のようにしてクリーニング評価を行った。
まず、１２台の装置Ａ〜Ｌにつき、クリーニング前のウエハ搬送系を確認したところ、すべての装置のチャックテーブル上に目視レベルで判別できる異物がみられた。つまり、装置Ａでは１４個、装置Ｂでは１５個、装置Ｃでは１５個、装置Ｄでは１６個、装置Ｅでは１４個、装置Ｆでは１３個、装置Ｇでは１３個、装置Ｈでは１５個、装置Ｉでは１３個、装置Ｊでは１２個、装置Ｋでは１５個、装置Ｌでは１３個であった。
Cleaning evaluation was performed as follows using a wafer prober (“UF200” manufactured by Tokyo Seimitsu Co., Ltd.) which is a wafer continuity inspection apparatus for semiconductor manufacturing (chuck table temperature variable: 25 to 200 ° C.).
First, for the 12 devices A to L, when the wafer transfer system before cleaning was checked, foreign matter that could be discriminated at the visual level was found on the chuck tables of all the devices. That is, 14 for device A, 15 for device B, 15 for device C, 16 for device D, 14 for device E, 13 for device F, 13 for device G, 15 for device H, There were 13 for device I, 12 for device J, 15 for device K, and 13 for device L.
装置Ａについて、チャックテーブル温度２００℃のままで、クリーニング機能付き搬送部材Ａを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ａについて、表面を目視観察した結果、異物が１４個（テーブル上１４個）捕集されており、異物を確実に捕集できていることがわかった。
Regarding the apparatus A, the conveying member A with a cleaning function was conveyed while the chuck table temperature was 200 ° C. while the cleaning layer side was in contact with the conveying system, and the conveying system such as the chuck table was cleaned. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the conveying member A with a cleaning function that came out of the apparatus, it was found that 14 foreign substances (14 on the table) were collected and the foreign substances could be reliably collected. It was.
また、装置Ｂについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング機能付き搬送部材Ａを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ａについて、表面を目視観察した結果、異物が１５個（テーブル上１５個）捕集されており、異物を確実に捕集できていることがわかった。
In addition, for the device B, after the chuck table temperature was lowered to room temperature (25 ° C.), the conveyance member A with a cleaning function was conveyed while the cleaning layer side was in contact with the conveyance system, and the conveyance system such as the chuck table was cleaned. . As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the conveying member A with a cleaning function that came out of the apparatus, 15 foreign substances (15 on the table) were collected, and it was found that the foreign substances could be collected reliably. It was.
クリーニング層として、ポリテトラフルオロエチレン系フィルムに代えて、厚さが２５μｍのポリエーテルサルフォン系フィルム〔住友ベークライト（株）製の「スミライト ＦＳ−１３００」〕を用いた以外は、実施例１と同様にして、クリーニングシートＢを作製した。
ポリエーテルサルフォン系フィルムの引っ張り弾性率は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、２，０３４ＭＰａ、１，８５０ＭＰａおよび１，６３４ＭＰａであった。また、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力は、２５℃、１００℃および２００℃の雰囲気下で、ともに０Ｎ／１０mm幅であった。
つぎに、上記のクリーニングシートＢを、粘着剤層側のセパレータを剥がして、搬送部材である８インチシリコンウエハのミラー面にハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ｂを作製した。
Example 1 except that a polyethersulfone film (“Sumilite FS-1300” manufactured by Sumitomo Bakelite Co., Ltd.) having a thickness of 25 μm was used as the cleaning layer instead of the polytetrafluoroethylene film. Similarly, a cleaning sheet B was produced.
The tensile elasticity modulus of the polyethersulfone film was 2,034 MPa, 1,850 MPa, and 1,634 MPa in an atmosphere of 25 ° C., 100 ° C., and 200 ° C., respectively. Further, the 180 ° peel-off adhesive strength to the silicon wafer (mirror surface) was 0 N / 10 mm width under the atmospheres of 25 ° C., 100 ° C. and 200 ° C.
Next, the cleaning sheet B was peeled off from the pressure-sensitive adhesive layer side separator and attached to the mirror surface of an 8-inch silicon wafer serving as a transport member with a hand roller, thereby preparing a transport member B with a cleaning function.
装置Ｃについて、チャックテーブル温度２００℃のままで、クリーニング機能付き搬送部材Ｂを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｂについて、表面を目視観察した結果、異物が１０個（テーブル上１５個）捕集されており、異物を捕集できていることがわかった。
Regarding the apparatus C, the conveyance member B with a cleaning function was conveyed while the chuck table temperature was 200 ° C. while the cleaning layer side was in contact with the conveyance system, and the conveyance system such as the chuck table was cleaned. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. In addition, as a result of visual observation of the surface of the transport member B with a cleaning function that came out of the apparatus, it was found that 10 foreign substances (15 on the table) were collected and the foreign substances could be collected.
また、装置Ｄについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング機能付き搬送部材Ｂを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｂについて、表面を目視観察した結果、異物が１１個（テーブル上１６個）捕集されており、異物を捕集できていることがわかった。
For apparatus D, after the chuck table temperature was lowered to room temperature (25 ° C.), transport member B with a cleaning function was transported while the cleaning layer side was in contact with the transport system to clean the transport system such as the chuck table. . As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the conveying member B with a cleaning function that came out of the apparatus, 11 foreign substances (16 on the table) were collected, and it was found that the foreign substances could be collected.
クリーニング層として、厚さが４００μｍのポリエーテルサルフォン系フィルム〔住友ベークライト（株）製の「スミライト ＦＳ−１３００」〕を使用した。このフィルムをクリーニングシートＣとし、このシートをこれ単独で８インチシリコンウエハ形状に打抜き加工して、クリーニング部材Ｃを作製した。
As the cleaning layer, a 400-μm thick polyethersulfone film (“Sumilite FS-1300” manufactured by Sumitomo Bakelite Co., Ltd.) was used. This film was used as a cleaning sheet C, and this sheet alone was punched into an 8-inch silicon wafer to produce a cleaning member C.
装置Ｅについて、チャックテーブル温度２００℃のままで、クリーニング部材Ｃを、クリーニング層を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング部材Ｃについて、表面を目視観察した結果、異物が９個（テーブル上１４個）捕集されており、異物を捕集できていることがわかった。
Regarding the apparatus E, the cleaning member C was transported while the cleaning layer was in contact with the transport system while the chuck table temperature was 200 ° C., and the transport system such as the chuck table was cleaned. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the cleaning member C coming out of the apparatus, it was found that nine foreign substances (14 on the table) were collected, and the foreign substances were collected.
また、装置Ｆについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング部材Ｃを、クリーニング層を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング部材Ｃについて、表面を目視観察した結果、異物が９個（テーブル上１３個）捕集されており、異物を捕集できていることがわかった。
In the apparatus F, after the chuck table temperature was lowered to room temperature (25 ° C.), the cleaning member C was transported while the cleaning layer was in contact with the transport system to clean the transport system such as the chuck table. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Moreover, as a result of visually observing the surface of the cleaning member C coming out of the apparatus, it was found that nine foreign substances (13 on the table) were collected and the foreign substances could be collected.
ＮＭＰ（Ｎ−メチル−２−ピロリドン）中で、４，４′−ジアミノジフェニルエーテルとピロメリット酸二無水物とを反応させた。冷却して得られた樹脂溶液を、スピンコーターにて、搬送部材である８インチシリコンウエハのミラー面に塗工し、１００℃で１０分加熱乾燥させた。これを、窒素雰囲気下、２８０℃で２時間熱処理して、厚さが２０μｍのクリーニング層を形成し、クリーニング機能付き搬送部材Ｄを作製した。
なお、上記クリーニング層の引っ張り弾性率は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、１，５８０ＭＰａ、１，２１０ＭＰａおよび９２０ＭＰａであった。また、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力は、２５℃、１００℃および２００℃の雰囲気下で、ともに０Ｎ／１０mm幅であった。
4,4'-Diaminodiphenyl ether and pyromellitic dianhydride were reacted in NMP (N-methyl-2-pyrrolidone). The resin solution obtained by cooling was applied to the mirror surface of an 8-inch silicon wafer as a conveying member with a spin coater, and heated and dried at 100 ° C. for 10 minutes. This was heat-treated at 280 ° C. for 2 hours in a nitrogen atmosphere to form a cleaning layer having a thickness of 20 μm, and a transport member D with a cleaning function was produced.
The tensile elastic modulus of the cleaning layer was 1,580 MPa, 1,210 MPa, and 920 MPa in the atmospheres of 25 ° C., 100 ° C., and 200 ° C., respectively. Further, the 180 ° peel-off adhesive strength to the silicon wafer (mirror surface) was 0 N / 10 mm width under the atmospheres of 25 ° C., 100 ° C. and 200 ° C.
装置Ｇについて、チャックテーブル温度２００℃のままで、クリーニング機能付き搬送部材Ｄを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｄについて、表面を目視観察した結果、異物が１０個（テーブル上１３個）捕集されており、異物を捕集できていることがわかった。
Regarding the apparatus G, the conveyance member D with a cleaning function was conveyed while the chuck table temperature was 200 ° C. while the cleaning layer side was in contact with the conveyance system to clean the conveyance system such as the chuck table. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. In addition, as a result of visual observation of the surface of the conveying member D with a cleaning function that came out of the apparatus, it was found that 10 foreign substances (13 on the table) were collected and the foreign substances could be collected.
また、装置Ｈについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング機能付き搬送部材Ｄを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｄについて、表面を目視観察した結果、異物が１１個（テーブル上１５個）捕集されており、異物を捕集できていることがわかった。
For the apparatus H, after the chuck table temperature was lowered to room temperature (25 ° C.), the conveyance member D with a cleaning function was conveyed while the cleaning layer side was in contact with the conveyance system, and the conveyance system such as the chuck table was cleaned. . As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. In addition, as a result of visual observation of the surface of the conveying member D with a cleaning function that came out of the apparatus, 11 foreign substances (15 on the table) were collected, and it was found that the foreign substances could be collected.
比較例１
クリーニング層として、ポリテトラフルオロエチレン系フィルムに代えて、厚さが２５μｍの熱可塑性ポリウレタンフィルム〔日本ミラクトラン（株）製の「Ｅ−６６０」〕を用いた以外は、実施例１と同様にして、クリーニングシートＥを作製した。
なお、上記クリーニング層の引っ張り弾性率は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、２５０ＭＰａ、４５ＭＰａおよび１１ＭＰａであった。ここで、引っ張り弾性率は、試験法ＪＩＳ Ｋ７１２７に準じて測定した。また、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力（ＪＩＳ Ｚ０２３７に準じて測定）は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、０Ｎ／１０mm幅、１．２Ｎ／１０mm幅および１．８Ｎ／１０mm幅であった。
つぎに、上記のクリーニングシートＥを、粘着剤層側のセパレータを剥がして、搬送部材である８インチシリコンウエハのミラー面にハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ｅを作製した。
Comparative Example 1
As the cleaning layer, a thermoplastic polyurethane film having a thickness of 25 μm (“E-660” manufactured by Nippon Milactolan Co., Ltd.) was used instead of the polytetrafluoroethylene-based film in the same manner as in Example 1. A cleaning sheet E was prepared.
The tensile modulus of the cleaning layer was 250 MPa, 45 MPa, and 11 MPa, respectively, in an atmosphere of 25 ° C., 100 ° C., and 200 ° C. Here, the tensile modulus was measured according to the test method JIS K7127. Moreover, 180 degree peeling adhesive strength (measured according to JIS Z0237) to the silicon wafer (mirror surface) is 0 N / 10 mm width and 1.2 N / 10 mm in an atmosphere of 25 ° C., 100 ° C. and 200 ° C., respectively. The width and the width were 1.8 N / 10 mm.
Next, the above-mentioned cleaning sheet E was peeled off the separator on the pressure-sensitive adhesive layer side and attached to the mirror surface of an 8-inch silicon wafer serving as a conveying member with a hand roller, thereby producing a conveying member E with a cleaning function.
装置Ｉについて、チャックテーブル温度２００℃のままで、クリーニング機能付き搬送部材Ｅを、クリーニング層側を搬送系に接触させながら搬送させようとしたが、クリーニング層が接触部位と強く接着して、搬送できなかった。
また、装置Ｊについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング機能付き搬送部材Ｅを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象はみられず、問題なく搬送できた。しかし、装置から出てきたクリーニング機能付き搬送部材Ｅについて、表面を目視観察した結果、異物が６個（テーブル上１２個）しか捕集されておらず、異物の捕集性が十分でなかった。
Regarding the device I, while the chuck table temperature was maintained at 200 ° C., the transport member E with the cleaning function was transported while the cleaning layer side was in contact with the transport system. could not.
For apparatus J, the chuck table temperature was lowered to room temperature (25 ° C.), and then the conveying member E with a cleaning function was conveyed while the cleaning layer side was in contact with the conveying system to clean the conveying system such as the chuck table. . As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed, and it could be transported without any problem. However, as a result of visual observation of the surface of the conveying member E with a cleaning function that came out of the apparatus, only 6 foreign substances (12 on the table) were collected, and the collection ability of foreign substances was not sufficient. .
比較例２
クリーニング層として、ポリテトラフルオロエチレン系フィルムに代えて、厚さが２５μｍのポリイミドフィルム〔（株）カネカ製の「アピカルＮＰＩ」〕を用いた以外は、実施例１と同様にして、クリーニングシートＦを作製した。
なお、上記クリーニング層の引っ張り弾性率は、２５℃、１００℃および２００℃の雰囲気下で、それぞれ、４，１００ＭＰａ、４，０５０ＭＰａおよび４，０００ＭＰａであった。また、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力は、２５℃、１００℃および２００℃の雰囲気下で、ともに０Ｎ／１０mm幅であった。
つぎに、上記のクリーニングシートＦを、粘着剤層側のセパレータを剥がして、搬送部材である８インチシリコンウエハのミラー面にハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ｆを作製した。
Comparative Example 2
A cleaning sheet F was prepared in the same manner as in Example 1 except that a polyimide film having a thickness of 25 μm (“Apical NPI” manufactured by Kaneka Corporation) was used instead of the polytetrafluoroethylene film as the cleaning layer. Was made.
The tensile modulus of the cleaning layer was 4,100 MPa, 4,050 MPa, and 4,000 MPa in the atmospheres of 25 ° C., 100 ° C., and 200 ° C., respectively. Further, the 180 ° peel-off adhesive strength to the silicon wafer (mirror surface) was 0 N / 10 mm width under the atmospheres of 25 ° C., 100 ° C. and 200 ° C.
Next, the above-mentioned cleaning sheet F was peeled off the separator on the pressure-sensitive adhesive layer side and attached to the mirror surface of an 8-inch silicon wafer serving as a conveying member with a hand roller, thereby producing a conveying member F with a cleaning function.
装置Ｋについて、チャックテーブル温度２００℃のままで、クリーニング機能付き搬送部材Ｆを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｆについて、表面を目視観察した結果、異物が５個（テーブル上１５個）しか捕集されておらず、異物の捕集性が十分でなかった。
With the apparatus K, the conveyance member F with a cleaning function was conveyed while the chuck table temperature was 200 ° C. while the cleaning layer side was in contact with the conveyance system, and the conveyance system such as the chuck table was cleaned. As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the conveying member F with the cleaning function that came out of the apparatus, only 5 foreign substances (15 on the table) were collected, and the collection ability of the foreign substances was not sufficient. .
また、装置Ｌについて、チャックテーブル温度を室温（２５℃）まで下げてから、クリーニング機能付き搬送部材Ｆを、クリーニング層側を搬送系に接触させながら搬送させ、チャックテーブルなどの搬送系をクリーニングした。その結果、クリーニング層が接触部位と強く接着する現象は全くみられず、問題なく搬送できた。また、装置から出てきたクリーニング機能付き搬送部材Ｆについて、表面を目視観察した結果、異物が３個（テーブル上１３個）しか捕集されておらず、異物の捕集性が十分でなかった。
For the device L, after the chuck table temperature was lowered to room temperature (25 ° C.), the conveyance member F with a cleaning function was conveyed while the cleaning layer side was in contact with the conveyance system, and the conveyance system such as the chuck table was cleaned. . As a result, the phenomenon that the cleaning layer strongly adhered to the contact site was not observed at all, and could be transported without any problem. Further, as a result of visual observation of the surface of the conveying member F with a cleaning function that came out of the apparatus, only three foreign matters (13 on the table) were collected, and the foreign matter collecting property was not sufficient. .
Claims (8)
A cleaning member having a cleaning layer that is non-adhesive in a temperature range of 25 to 200 ° C. and has a tensile elastic modulus of 3,000 MPa or less.
The cleaning member according to claim 1, wherein the cleaning layer has a tensile elastic modulus of 100 MPa or less.
The cleaning member according to claim 1, which is a cleaning sheet having a cleaning layer.
The cleaning member according to claim 1, wherein the cleaning member is a transport member with a cleaning function having a cleaning layer on the transport member.
The cleaning member according to claim 4, wherein the transport member with a cleaning function is provided with the cleaning sheet according to claim 3 on the transport member via an adhesive layer.
The cleaning member according to claim 4, wherein the transport member with a cleaning function is provided with a cleaning layer directly on the transport member.
A cleaning method for a substrate processing apparatus, comprising transporting the cleaning member according to claim 1 into the substrate processing apparatus.
A substrate processing apparatus cleaned by the cleaning method according to claim 7.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005146522A JP2006049827A (en) | 2004-07-08 | 2005-05-19 | Cleaning member and method of cleaning substrate processor |
| KR1020050061275A KR20060049928A (en) | 2004-07-08 | 2005-07-07 | Cleaning member and cleaning method of substrate processing equipment |
| TW094123130A TW200618082A (en) | 2004-07-08 | 2005-07-08 | Cleaning member and cleaning method of substrate processing equipment |
| US11/176,217 US20060005337A1 (en) | 2004-07-08 | 2005-07-08 | Cleaning member and cleaning method of substrate processing equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004201260 | 2004-07-08 | ||
| JP2005146522A JP2006049827A (en) | 2004-07-08 | 2005-05-19 | Cleaning member and method of cleaning substrate processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006049827A true JP2006049827A (en) | 2006-02-16 |
Family
ID=35539748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005146522A Pending JP2006049827A (en) | 2004-07-08 | 2005-05-19 | Cleaning member and method of cleaning substrate processor |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060005337A1 (en) |
| JP (1) | JP2006049827A (en) |
| KR (1) | KR20060049928A (en) |
| TW (1) | TW200618082A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111495878A (en) * | 2019-01-30 | 2020-08-07 | 日东电工株式会社 | Cleaning sheet and conveying member with cleaning function |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110108061A1 (en) * | 2009-11-12 | 2011-05-12 | John Squeri | Cleaning Article |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315377B2 (en) * | 1973-03-09 | 1978-05-24 | ||
| GB8507944D0 (en) * | 1985-03-27 | 1985-05-01 | Automation Facilities Ltd | Microfloppy disc drive head cleaner |
| JP2962843B2 (en) * | 1990-06-07 | 1999-10-12 | キヤノン株式会社 | Cleaning blade and device using the same |
| US5363182A (en) * | 1992-05-21 | 1994-11-08 | Canon Kabushiki Kaisha | Blade device and image forming apparatus |
| US5438400A (en) * | 1992-09-30 | 1995-08-01 | Canon Kabushiki Kaisha | Image forming apparatus having cleaning blade with surface coated layer at a tip end thereof |
| JPH08310080A (en) * | 1995-03-10 | 1996-11-26 | Seiko Epson Corp | Cleaning sheet and recording medium sheet including cleaning sheet |
| US5671119A (en) * | 1996-03-22 | 1997-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Process for cleaning an electrostatic chuck of a plasma etching apparatus |
| US5896157A (en) * | 1998-01-27 | 1999-04-20 | Eastman Kodak Company | Cleaning disc and method for cleaning a feed roller belonging to an imaging device |
| US6420032B1 (en) * | 1999-03-17 | 2002-07-16 | General Electric Company | Adhesion layer for metal oxide UV filters |
| AU4840300A (en) * | 1999-05-11 | 2000-11-21 | Audrey Muhr-Sweeney | Universal cleaning apparatus |
| JP3943797B2 (en) * | 2000-03-31 | 2007-07-11 | キヤノン株式会社 | Image forming apparatus |
| US7793668B2 (en) * | 2000-06-06 | 2010-09-14 | Nitto Denko Corporation | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| TW536751B (en) * | 2000-07-14 | 2003-06-11 | Nitto Denko Corp | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| US20030044569A1 (en) * | 2001-06-25 | 2003-03-06 | The Proctor & Gamble Company | Disposable cleaning sheets comprising a plurality of protrusions for removing debris from surfaces |
| US6776171B2 (en) * | 2001-06-27 | 2004-08-17 | International Business Machines Corporation | Cleaning of semiconductor wafers by contaminate encapsulation |
| US20050118414A1 (en) * | 2002-06-19 | 2005-06-02 | Nitto Denko Corporation | Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these |
| US20040111817A1 (en) * | 2002-12-17 | 2004-06-17 | Kimberly-Clark Worldwide, Inc. | Disposable scrubbing product |
| US7655316B2 (en) * | 2004-07-09 | 2010-02-02 | Applied Materials, Inc. | Cleaning of a substrate support |
-
2005
- 2005-05-19 JP JP2005146522A patent/JP2006049827A/en active Pending
- 2005-07-07 KR KR1020050061275A patent/KR20060049928A/en not_active Application Discontinuation
- 2005-07-08 US US11/176,217 patent/US20060005337A1/en not_active Abandoned
- 2005-07-08 TW TW094123130A patent/TW200618082A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111495878A (en) * | 2019-01-30 | 2020-08-07 | 日东电工株式会社 | Cleaning sheet and conveying member with cleaning function |
| JP2020121272A (en) * | 2019-01-30 | 2020-08-13 | 日東電工株式会社 | Cleaning sheet and carrying member with cleaning function |
| JP7165065B2 (en) | 2019-01-30 | 2022-11-02 | 日東電工株式会社 | Cleaning sheet and conveying member with cleaning function |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060005337A1 (en) | 2006-01-12 |
| KR20060049928A (en) | 2006-05-19 |
| TW200618082A (en) | 2006-06-01 |
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