JP2006019364A

JP2006019364A - Substrate carrying fixture

Info

Publication number: JP2006019364A
Application number: JP2004193312A
Authority: JP
Inventors: Seiichi Ishii; 星一石井
Original assignee: Hiroshima Opt Corp; Kyocera Display Corp
Current assignee: Hiroshima Opt Corp; Kyocera Display Corp
Priority date: 2004-06-30
Filing date: 2004-06-30
Publication date: 2006-01-19

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate carrying fixture that can easily hold the mounting surface of a substrate in a flat state. <P>SOLUTION: The substrate carrying fixture is provided with a flat plate-like substrate 100 having a flat surface and adjusting members 101 (101a and 101b) provided on the surface of the substrate 100. The fixture is constituted in a state where, when a flexible substrate 200 fitted with a reinforcing plate 201 on the rear surface of its mounting surface is fixed on the surface side of the substrate 100, the mounting surface of the flexible substrate 200 is arranged in parallel with the surface of the substrate 100 through the adjusting members 101 having heights almost equal to that of the reinforcing plate 201 in an area other than the reinforcing plate 201 on the rear surface of the substrate 100. For the adjusting members 101, in addition, a double-sided adhesive material 101a is used. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、基板搬送用治具に関する。 The present invention relates to a substrate carrying jig.

通常、フレキシブル基板（ＦＰＣ）等の基板実装面には、複数の電子部品が表面実装技術（ＳＭＴ：ＳｕｒｆａｃｅＭｏｕｎｔｉｎｇＴｅｃｈｎｏｌｏｇｙ）を用いて実装される。例えば、ＦＰＣを電子部品実装工程（クリーム半田印刷工程、電子部品搭載工程、リフロー工程などを含む。）において搬送する際には、基板搬送用治具を用い、該治具の平坦面基体に基板実装面の裏面を載置し、ＦＰＣの端の数箇所を片面テープで上記平坦面に固定する方法が採用されてきた。この片面テープ固定方法は、ＦＰＣの固定（取り付けおよび取り外し）に手間がかかり、作業性が悪いとともに、ＦＰＣ実装面に片面テープの粘着材が接触・残留するという難点が認められる。 Usually, a plurality of electronic components are mounted on a substrate mounting surface such as a flexible substrate (FPC) by using a surface mounting technology (SMT). For example, when an FPC is transported in an electronic component mounting process (including a cream solder printing process, an electronic component mounting process, a reflow process, etc.), a substrate transport jig is used and the substrate is placed on the flat surface base of the jig. A method has been adopted in which the back surface of the mounting surface is placed and several ends of the FPC are fixed to the flat surface with single-sided tape. In this single-sided tape fixing method, it takes time to fix (attach and remove) the FPC, the workability is bad, and the difficulty that the adhesive material of the single-sided tape contacts and remains on the FPC mounting surface is recognized.

また、例えば特許文献１には、ＦＰＣ固定用接着シートを用いる方法が開示されている。この方法は、基材の両面に適度な弱粘着性を有する粘着剤層が形成されたＦＰＣ固定用接着シートを用い、該シートを基板搬送用治具の平坦面の基体全面または所定位置に配設し、該シート上にＦＰＣ実装面の裏面を載置して固定するものである。
特開２００３−２４３８１９号公報（図１） Further, for example, Patent Document 1 discloses a method using an FPC fixing adhesive sheet. This method uses an FPC fixing adhesive sheet in which a pressure-sensitive adhesive layer having appropriate weak adhesiveness is formed on both surfaces of a base material, and the sheet is disposed on the entire surface of the substrate on a flat surface of a substrate transport jig or at a predetermined position. And the back surface of the FPC mounting surface is placed and fixed on the sheet.
Japanese Patent Laying-Open No. 2003-243819 (FIG. 1)

一方、ＦＰＣにおいては、例えば、コネクタ、電子機器内でコネクタ接続する接続部分を補強するための補強板等の付加部品が、電子部品実装工程に先立って装着されている場合も多い。このような付加部品がＦＰＣ実装面の裏面に装着されている場合には、搬送用治具の平坦面に該裏面で固定するに際し、ＦＰＣ実装面を平坦に保持することができず、表面実装を効率的・安定的に行うことができなかった。背景技術に示したＦＰＣ固定用接着シートを用いる方法においても、同様の問題点が認められる。ＦＰＣ実装面を平坦に保持するために、搬送用治具の平坦面に上記付加部品を収納可能な凹部を形成することが考えられるが、付加部品の大きさや高さに正確に対応した凹部を形成することは現実的ではない。 On the other hand, in FPC, for example, additional components such as a connector and a reinforcing plate for reinforcing a connection portion to be connected to the connector in the electronic device are often mounted prior to the electronic component mounting step. When such an additional component is mounted on the back surface of the FPC mounting surface, the FPC mounting surface cannot be held flat when the back surface is fixed to the flat surface of the transfer jig. Could not be carried out efficiently and stably. The same problem is recognized also in the method using the adhesive sheet for FPC fixation shown in the background art. In order to hold the FPC mounting surface flat, it is conceivable to form a recess capable of accommodating the additional component on the flat surface of the conveying jig. However, a recess that accurately corresponds to the size and height of the additional component is considered. Forming is not realistic.

この発明は、このような問題点を解決するためになされたものであり、簡便に基板実装面を平坦に保持することができる基板搬送用治具を提供することを目的とする。 The present invention has been made to solve such a problem, and an object of the present invention is to provide a substrate carrying jig that can easily hold a substrate mounting surface flat.

本発明に係る基板搬送用治具は、基板実装面の裏面を両面粘着材で平坦面の基体に固定して搬送する基板搬送用治具であって、上記基板実装面の裏面には付加部品が装着されており、上記基体の平坦面と上記基板の裏面との間で、かつ、上記裏面の上記付加部品以外の領域に、上記付加部品の高さと略同一の高さを有する調整部材を介在させることにより、上記基板の実装面が上記基体の平坦面に対して平行に配置されることを特徴とするものである。このような構成により、基板実装面の裏面に付加部品が装着されている場合であっても、簡便に基板実装面を平坦に保持することができる。 The substrate transport jig according to the present invention is a substrate transport jig that transports the back surface of the substrate mounting surface fixed to a flat substrate with a double-sided adhesive material, and is provided with an additional component on the back surface of the substrate mounting surface. Is mounted between the flat surface of the base and the back surface of the substrate, and in an area other than the additional component on the back surface, an adjustment member having a height substantially the same as the height of the additional component. By interposing, the mounting surface of the substrate is arranged in parallel to the flat surface of the substrate. With such a configuration, even when an additional component is mounted on the back surface of the board mounting surface, the board mounting surface can be easily held flat.

本発明に係る基板搬送用治具は、上記調整部材が両面粘着材を含む部材であり、該調整部材によって上記基板の裏面が上記基体の平坦面に固定されるのが好ましい。 In the substrate transport jig according to the present invention, it is preferable that the adjustment member includes a double-sided adhesive material, and the back surface of the substrate is fixed to the flat surface of the substrate by the adjustment member.

本発明に係る基板搬送用治具は、上記調整部材が両面粘着材および高さ調整手段を含み、少なくとも該両面粘着材によって上記基板の裏面と該高さ調整手段とが固定され、該高さ調整手段と上記基体の平坦面とは両面粘着材により固定または所定の貼着手段により貼着されるのが好ましい。 In the substrate transport jig according to the present invention, the adjusting member includes a double-sided adhesive material and a height adjusting unit, and the back surface of the substrate and the height adjusting unit are fixed at least by the double-sided adhesive material, The adjusting means and the flat surface of the base are preferably fixed by a double-sided adhesive material or attached by a predetermined attaching means.

また、本発明に係る基板搬送用治具は、上記基体の平坦面に上記基板を所定位置に固定するための位置決め部が形成されているのが好ましく、これにより、基板搬送用治具の平坦面の所定位置に正確に基板を固定することができる。 In the substrate transfer jig according to the present invention, it is preferable that a positioning portion for fixing the substrate at a predetermined position is formed on the flat surface of the base body. The substrate can be accurately fixed at a predetermined position on the surface.

本発明に係る基板搬送用治具は、上記基板がフレキシブル基板である場合に特に有効である。 The substrate carrying jig according to the present invention is particularly effective when the substrate is a flexible substrate.

本発明により、簡便に基板実装面を平坦に保持することができる。 According to the present invention, the substrate mounting surface can be easily held flat.

発明の実施の形態１．
本発明の実施の形態１について、図に基づいて説明する。
図１（ａ）は、本発明にかかる基板搬送用治具の構成を示す平面図、図１（ｂ）は、図１（ａ）のＡ−Ａ断面図である。
図１において、基板搬送用治具１０００は、例えばアルミ等の金属で形成された平坦な平板状の基体１００の表面上に、調整部材１０１を備える。調整部材１０１は、例えば、耐熱性を有する両面粘着材にて形成される。調整部材１０１を上記両面粘着材で形成した場合、後述のフレキシブル基板２００の裏面を上記両面粘着材の粘着力で確実に保持することができる。 Embodiment 1 of the Invention
Embodiment 1 of the present invention will be described with reference to the drawings.
Fig.1 (a) is a top view which shows the structure of the jig | tool for board | substrate conveyance concerning this invention, FIG.1 (b) is AA sectional drawing of Fig.1 (a).
In FIG. 1, a substrate transport jig 1000 includes an adjustment member 101 on the surface of a flat plate-like substrate 100 made of a metal such as aluminum. The adjustment member 101 is formed of, for example, a heat-resistant double-sided adhesive material. When the adjustment member 101 is formed of the double-sided pressure-sensitive adhesive material, the back surface of the flexible substrate 200 described later can be reliably held by the adhesive force of the double-sided pressure-sensitive adhesive material.

なお、両面粘着材として、例えば、フレキシブル基板の取り付けおよび取り外しが容易となるように工夫された特開２００３−２４３８１９号公報に記載のＦＰＣ固定用粘着シートを用いれば、より好ましい。このＦＰＣ固定用粘着シートは、アルキル基の炭素数が４〜１４の（メタ）アクリル酸アルキルエステルを単量体主成分とし且つ分子ないに官能基を含有しているアクリル系ポリマーと、アルミニウム系架橋剤とからなる粘着剤層が、基材の両面に形成されているものである。このＦＰＣ固定用粘着シートは、特にフレキシブル基板に対する接着性や剥離性を保持しつつ、剥離後には接着剤成分がフレキシブル基板に残存せず、しかも、電子部品の実装時のリフロー工程などの加熱工程を経ても接着性及び剥離性が優れている。 As the double-sided pressure-sensitive adhesive material, for example, it is more preferable to use an FPC fixing pressure-sensitive adhesive sheet described in Japanese Patent Application Laid-Open No. 2003-243819 devised so that the flexible substrate can be easily attached and detached. This pressure-sensitive adhesive sheet for fixing an FPC is composed of an acrylic polymer containing a functional group in the molecular main component of (meth) acrylic acid alkyl ester having 4 to 14 carbon atoms in the alkyl group, and an aluminum-based polymer. The pressure-sensitive adhesive layer composed of a crosslinking agent is formed on both surfaces of the substrate. This pressure-sensitive adhesive sheet for fixing an FPC, particularly while maintaining the adhesiveness and peelability to the flexible substrate, the adhesive component does not remain on the flexible substrate after peeling, and a heating process such as a reflow process when mounting electronic components Even if it passes through, adhesiveness and peelability are excellent.

また、調整部材１０１は、２つの部材により構成されてもよく、一部に両面粘着材を含ませることもできる。すなわち、例えば、上面側に配設される第一の調整部材としての両面粘着材１０１ａと、下面側に配設される高さ調整手段としての金属板１０１ｂとで構成することもできる。なお、金属板１０１ｂは、基体１００と同じ材料で形成してもよいし、その他の材料で形成してもよい。また、金属板１０１ｂと基体１００の平坦面とは、両面粘着材１０１ａと同じ両面粘着材により固定または所定の貼着手段により貼着されていることが好ましい。 Moreover, the adjustment member 101 may be comprised by two members, and can also include a double-sided adhesive material in part. That is, for example, the double-sided pressure-sensitive adhesive material 101a as the first adjusting member disposed on the upper surface side and the metal plate 101b as the height adjusting means disposed on the lower surface side can also be configured. The metal plate 101b may be formed of the same material as that of the base body 100, or may be formed of other materials. Moreover, it is preferable that the metal plate 101b and the flat surface of the base body 100 are fixed by a double-sided adhesive material that is the same as the double-sided adhesive material 101a or bonded by a predetermined bonding means.

位置決め部１０３は、後述のフレキシブル基板２００を基体１００上の所定位置に位置決めする部材であり、図１に示される通り、例えば基体１００表面に２個配設される。この位置決め部１０３は、フレキシブル基板２００の形状に応じて、個数、配置が変更される。なお、図１では両位置決め部１０３はフレキシブル基板２００の特定辺に平行に配設されているが、対角線上に配設されてもよい。 The positioning unit 103 is a member that positions a flexible substrate 200 (described later) at a predetermined position on the base body 100. For example, two positioning parts 103 are disposed on the surface of the base body 100 as shown in FIG. The number and arrangement of the positioning portions 103 are changed according to the shape of the flexible substrate 200. In FIG. 1, both positioning portions 103 are disposed in parallel to a specific side of the flexible substrate 200, but may be disposed on a diagonal line.

次に、フレキシブル基板の構成を説明する。
図２は、フレキシブル基板の平面図であり、図２（ａ）は実装面側の平面図、図２（ｂ）は裏面側の平面図である。
図２（ｂ）に示されるように、フレキシブル基板２００の裏面には、補強板２０１が貼り付けられている。なお、補強板２０１の装着部位の実装面側に電子部品が実装されていてもよい。フレキシブル基板２００には、図１で示される基板搬送用治具１０００の位置決め部１０３の位置に対応して、位置決め穴２０３が設けられている。図２（ａ）に示されるように、フレキシブル基板２００の実装面には、電子部品を実装するための実装領域２０４が複数個設けられており、フレキシブル基板２００に配線された電極線と接続されている。また、この実装領域２０４には接続パッドが設けられており、電子部品をフレキシブル基板２００の電極線と電気的に接続するためのクリーム半田が接続パッド上に塗布されるようになっている。 Next, the configuration of the flexible substrate will be described.
2A and 2B are plan views of the flexible substrate. FIG. 2A is a plan view on the mounting surface side, and FIG. 2B is a plan view on the back surface side.
As shown in FIG. 2B, a reinforcing plate 201 is attached to the back surface of the flexible substrate 200. An electronic component may be mounted on the mounting surface side of the mounting portion of the reinforcing plate 201. The flexible substrate 200 is provided with positioning holes 203 corresponding to the positions of the positioning portions 103 of the substrate carrying jig 1000 shown in FIG. As shown in FIG. 2A, the mounting surface of the flexible substrate 200 is provided with a plurality of mounting regions 204 for mounting electronic components, which are connected to the electrode lines wired on the flexible substrate 200. ing. The mounting area 204 is provided with a connection pad, and cream solder for electrically connecting the electronic component to the electrode wire of the flexible substrate 200 is applied onto the connection pad.

次に、フレキシブル基板２００を基板搬送用治具１０００に取り付けた状態について、図に基づいて、フレキシブル基板２００の形状を簡略化し、説明する。
図３（ａ）は、実装面の裏面に補強板が装着されたフレキシブル基板を基板搬送用治具に取り付けた状態を示す平面図、図３（ｂ）は、図３（ａ）のＡ−Ａ断面図である。
図３において、位置決め部１０３に位置決め穴２０３を嵌号させることにより、フレキシブル基板２００が所定の位置に配置される。また、調整部材１０１（１０１ａ、１０１ｂ）は、基体１００の平坦面上に、実装面の裏面に付加部品が装着されているフレキシブル基板２００を貼着したとき、上記基板の裏面の付加部品以外の領域に介在し、上記部品の高さと略同一の高さとすることにより、フレキシブル基板２００の実装面が基体１００の平坦面に対して平行に配置されている。 Next, the state where the flexible substrate 200 is attached to the substrate carrying jig 1000 will be described with a simplified shape of the flexible substrate 200 based on the drawings.
FIG. 3A is a plan view showing a state in which a flexible substrate having a reinforcing plate attached to the back surface of the mounting surface is attached to a substrate transfer jig, and FIG. 3B is a cross-sectional view taken along line A- of FIG. It is A sectional drawing.
In FIG. 3, the flexible substrate 200 is disposed at a predetermined position by fitting the positioning hole 203 into the positioning portion 103. Further, the adjustment member 101 (101a, 101b), when the flexible substrate 200 having the additional component mounted on the back surface of the mounting surface is attached to the flat surface of the base 100, other than the additional component on the back surface of the substrate. The mounting surface of the flexible substrate 200 is arranged in parallel to the flat surface of the base body 100 by being interposed in the region and having a height substantially equal to the height of the component.

すなわち、フレキシブル基板２００の裏面に補強板２０１が取り付けられている場合、調整部材１０１（１０１ａ、１０１ｂ）は、補強板２０１の高さと略同一の高さのものを使用する。なお、両面粘着材１０１ａを含む調整部材１０１は、補強板２０１を避けて、フレキシブル基板２００の裏面の略全面と貼り付くようにされるが、略全面でなく一部であっても構わない。その際、フレキシブル基板２００と調整部材１０１との貼着面積を考慮して、最適な密着力が得られるようにするとより安定的かつ効率的である。 That is, when the reinforcing plate 201 is attached to the back surface of the flexible substrate 200, the adjustment member 101 (101 a, 101 b) uses a member having a height substantially the same as the height of the reinforcing plate 201. The adjustment member 101 including the double-sided pressure-sensitive adhesive material 101a is attached to substantially the entire back surface of the flexible substrate 200 while avoiding the reinforcing plate 201, but may be a part instead of the substantially entire surface. At this time, it is more stable and efficient if an optimum adhesion force is obtained in consideration of the bonding area between the flexible substrate 200 and the adjustment member 101.

このようにして、簡便にフレキシブル基板２００を平坦に保持することができる。 In this way, the flexible substrate 200 can be easily held flat.

なお、実際のフレキシブル基板２００に調整部材１０１を配置させた平面図を示す。
図４はフレキシブル基板裏面に調整部材を重ね合わせた平面図である。
図４において、フレキシブル基板２００の裏面上にて、補強板２０１および位置決め穴２０３を避けて、略全面に調整部材１０１が配設されている。 In addition, the top view which has arrange | positioned the adjustment member 101 to the actual flexible substrate 200 is shown.
FIG. 4 is a plan view in which an adjustment member is superimposed on the back surface of the flexible substrate.
In FIG. 4, the adjustment member 101 is disposed on substantially the entire surface of the flexible substrate 200, avoiding the reinforcing plate 201 and the positioning hole 203.

このようにして、基板搬送用治具１０００に貼着されたフレキシブル基板２００を電子部品実装工程、例えば、クリーム半田印刷工程において、フレキシブル基板の実装面の実装領域２０４にメタルマスクを介して、クリーム半田を印刷するとき、フレキシブル基板２００の実装面は平坦に保持されているので、効率的に安定して印刷を行うことができる。 In this way, in the electronic component mounting process, for example, the cream solder printing process, the flexible substrate 200 adhered to the substrate transfer jig 1000 is applied to the mounting region 204 on the mounting surface of the flexible substrate via the metal mask. When printing solder, the mounting surface of the flexible substrate 200 is held flat, so that printing can be performed efficiently and stably.

そして、その後、電子部品搭載工程において、自動実装機により、電子部品が実装領域２０４のそれぞれに対し、画像認識により実装位置等を確認しながら実装される。この際も、フレキシブル基板２００は常に平坦に保持されているので、確実に画像認識がなされ、効率的に安定して電子部品を実装することができる。なお、クリーム半田に熱を加えた後の半田付不良が低減できる。 Thereafter, in the electronic component mounting step, the electronic component is mounted on each mounting region 204 while confirming the mounting position and the like by image recognition in the automatic mounting machine. Also at this time, since the flexible substrate 200 is always held flat, the image recognition is surely performed, and the electronic component can be mounted efficiently and stably. In addition, poor soldering after applying heat to cream solder can be reduced.

本発明にかかる基板搬送用治具の構成を示す図である。It is a figure which shows the structure of the jig | tool for board | substrate conveyance concerning this invention. フレキシブル基板の平面図である。It is a top view of a flexible substrate. フレキシブル基板を基板搬送用治具に取り付けた状態を示す図である。It is a figure which shows the state which attached the flexible substrate to the jig | tool for board | substrate conveyance. フレキシブル基板裏面に調整部材を重ね合わせた平面図である。It is the top view which piled up the adjustment member on the flexible substrate back surface.

符号の説明Explanation of symbols

１００基体、１０１調整部材、１０１ａ両面粘着材、１０１ｂ金属板、１０３位置決め部、２００フレキシブル基板、２０１補強板、２０３位置決め穴、２０４実装領域、１０００基板搬送用治具。 DESCRIPTION OF SYMBOLS 100 Base body, 101 Adjustment member, 101a Double-sided adhesive material, 101b Metal plate, 103 Positioning part, 200 Flexible board, 201 Reinforcement board, 203 Positioning hole, 204 Mounting area, 1000 Substrate conveyance jig.

Claims

基板実装面の裏面を両面粘着材で平坦面の基体に固定して搬送する基板搬送用治具であって、上記基板実装面の裏面には付加部品が装着されており、上記基体の平坦面と上記基板の裏面との間で、かつ、上記裏面の上記付加部品以外の領域に、上記付加部品の高さと略同一の高さを有する調整部材を介在させることにより、上記基板の実装面が上記基体の平坦面に対して平行に配置されることを特徴とする基板搬送用治具。 A substrate transporting jig for transporting the back surface of the substrate mounting surface fixed to a flat substrate with a double-sided adhesive material, wherein additional components are mounted on the back surface of the substrate mounting surface, and the flat surface of the substrate And a back surface of the substrate, and an adjustment member having a height substantially the same as the height of the additional component is interposed in a region other than the additional component on the back surface, thereby mounting the mounting surface of the substrate. A substrate transporting jig, wherein the substrate transporting jig is arranged in parallel to the flat surface of the substrate.

上記調整部材が両面粘着材を含む部材であり、該調整部材によって上記基板の裏面が上記基体の平坦面に固定される請求項１に記載の基板搬送用治具。 The substrate transport jig according to claim 1, wherein the adjustment member is a member including a double-sided adhesive material, and the back surface of the substrate is fixed to the flat surface of the base by the adjustment member.

上記調整部材が両面粘着材および高さ調整手段を含み、少なくとも該両面粘着材によって上記基板の裏面と該高さ調整手段とが固定され、該高さ調整手段と上記基体の平坦面とは両面粘着材により固定または所定の貼着手段により貼着される請求項１または２に記載の基板搬送用治具。 The adjusting member includes a double-sided pressure-sensitive adhesive material and a height adjusting means, and the back surface of the substrate and the height adjusting means are fixed by at least the double-sided pressure-sensitive adhesive material, and the height adjusting means and the flat surface of the base are both surfaces. The substrate transport jig according to claim 1, wherein the substrate transport jig is fixed by an adhesive material or attached by a predetermined attaching means.

上記基体の平坦面には、上記基板を所定位置に固定するための位置決め部が形成されている請求項１、２または３に記載の基板搬送用治具。 4. The substrate transfer jig according to claim 1, wherein a positioning portion for fixing the substrate at a predetermined position is formed on the flat surface of the base.

上記基板がフレキシブル基板である請求項１〜４のいずれかに記載の基板搬送用治具。 The said board | substrate is a flexible substrate, The jig | tool for board | substrate conveyance in any one of Claims 1-4.