JP2005342922A - Mold having diamond like carbon film and molding method using it - Google Patents
Mold having diamond like carbon film and molding method using it Download PDFInfo
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本発明は、ダイヤモンド状炭素被膜を有する金型を用いて、結晶性樹脂を特定の高温度で成形する方法に関し、この方法は、通常の成形のみならず、特に樹脂と金属の強い接合を要するインサート、アウトサート又は貼合わせ成形方法に好適である。 The present invention relates to a method of molding a crystalline resin at a specific high temperature using a mold having a diamond-like carbon coating, and this method requires not only normal molding but particularly strong bonding between the resin and the metal. Suitable for insert, outsert or laminating method.
ダイヤモンド状炭素（以下、ＤＬＣと略す場合がある。）被膜は、硬度が高く、表面粗さが極めて小さく、固有の化学的特性を示すことから、刃物、治具・工具；アルミ缶製造用金型、治具・工具；半導体製造用金型、治具・工具；セラミック粉末成形金型；非球面ガラスレンズ成形金型等に使用されている。 Diamond-like carbon (hereinafter sometimes abbreviated as DLC) coating has high hardness, extremely low surface roughness, and exhibits unique chemical properties. Molds, jigs / tools; molds for semiconductor manufacturing, jigs / tools; ceramic powder molding dies; aspheric glass lens molding dies, etc.
特開平１０−２０３８９６号公報には、基材との密着性の良い高硬度のＤＬＣ薄膜が形成された部材が開示されている。（特許文献１参照。）
上記公報には、該部材が耐摩耗性、耐食性に優れた金型、工具、機械部品に適用できることは記載されているが、樹脂の成形金型に使用されることは記載されていない。
Japanese Patent Application Laid-Open No. 10-203896 discloses a member on which a high-hardness DLC thin film having good adhesion to a substrate is formed. (See Patent Document 1.)
The above publication describes that the member can be applied to a mold, a tool, and a machine part having excellent wear resistance and corrosion resistance, but does not describe that the member is used for a resin mold.
まして、ＤＬＣ被膜を有する金型を、金型温度が樹脂の融点付近のような高温度で使用する例は知られていなかった。さらに、このような高温の金型温度で、樹脂と金属をインサート成形、アウトサート成形、又は貼合わせ成形する方法により樹脂と金属の接合強度を高めることができることは知られていなかった。 In addition, there has been no known example in which a mold having a DLC film is used at a high temperature such that the mold temperature is close to the melting point of the resin. Furthermore, it has not been known that the bonding strength between the resin and the metal can be increased by a method of insert molding, outsert molding, or bonding molding of the resin and the metal at such a high mold temperature.
離型性に与える因子としては、材料面では金型との摩擦係数、同密着性、成形収縮率、剛性など；成形品の形状面では抜き勾配、肉厚、アンダーカットの有無、全体の形状など；金型では表面粗さ、磨き方向；突き出し方式、位置；成形条件では保圧力、同時間、金型温度、冷却温度、同時間、突出し速度などが挙げられる。
特開２００２−２２５０８８号公報には、表面粗さＲｚ（十点平均粗さ）が０．００１〜０．５μｍである射出成形用の鏡面金型を使用する技術が開示されている。（特許文献２参照。）
しかし、この技術で、金型温度が樹脂の融点付近などの高温で射出成形を行うと、液晶ポリマー等の熱可塑性樹脂を射出成形する場合、成形品の離型性が充分でない場合があった。
Factors that affect mold release characteristics include the coefficient of friction with the mold on the material side, the same adhesion, the molding shrinkage rate, and the rigidity; on the shape side of the molded product, draft, wall thickness, presence or absence of undercut, overall shape In the mold, the surface roughness, the polishing direction; the extrusion method, the position; in the molding conditions, the holding pressure, the same time, the mold temperature, the cooling temperature, the same time, the protruding speed and the like can be mentioned.
Japanese Patent Laid-Open No. 2002-225088 discloses a technique using a mirror mold for injection molding having a surface roughness Rz (10-point average roughness) of 0.001 to 0.5 μm. (See Patent Document 2.)
However, with this technique, when injection molding is performed at a high mold temperature, such as near the melting point of the resin, when a thermoplastic resin such as a liquid crystal polymer is injection-molded, the releasability of the molded product may not be sufficient. .
可変温度金型を使用した成形では、射出時の金型温度を、結晶性樹脂では凝固点付近、非結晶性樹脂ではガラス転移温度以上にした成形方法が知られている。（非特許文献１参照。） In molding using a variable temperature mold, a molding method is known in which the mold temperature at the time of injection is set near the freezing point for a crystalline resin and above the glass transition temperature for an amorphous resin. (See Non-Patent Document 1.)
樹脂射出成形において、優れた光沢や外観あるいは薄肉成形品の流動性を求める場合、金型温度を上昇させる手段が用いられる。しかし従来は、金型温度を融点付近の温度範囲内に上昇させた場合、離型時に、金型温度を熱変形温度以下に降温させても、射出あるいは保圧工程中に、金型温度が融点付近のような高温にあると、離型性が充分でない場合があった。
従って、優れた光沢や外観あるいは薄肉成形品の流動性を求める場合、金型温度の上限は、離型を考慮すると、事実上、樹脂の熱変形温度が上限であった。
In resin injection molding, in order to obtain excellent gloss and appearance, or fluidity of a thin molded product, means for increasing the mold temperature is used. However, in the past, when the mold temperature was raised within the temperature range near the melting point, the mold temperature was reduced during the injection or pressure holding process even when the mold temperature was lowered below the heat distortion temperature at the time of mold release. If the temperature is high, such as near the melting point, the releasability may not be sufficient.
Therefore, in the case of obtaining excellent gloss and appearance or fluidity of a thin-walled molded product, the upper limit of the mold temperature is practically the upper limit of the heat distortion temperature of the resin in consideration of mold release.
本発明の目的は、樹脂成形品に優れた光沢や外観を与え、あるいは成形時に樹脂が良好な流動性を有する状態で、且つ離型性良く成形することである。他の目的は、液晶ポリマーのような樹脂と金型の線膨張係数が類似の温度挙動をする可塑樹脂を離型性良く成形することであり、他の目的は、熱可塑樹脂の融点付近のような高温度の金型温度で離型性良く成形することである。また他の目的は、樹脂と金属を高接合強度でインサート成形、アウトサートもしくはフープ成形、又は貼合わせ成形することである。 An object of the present invention is to provide a resin molded article with excellent gloss and appearance, or to mold with good releasability while the resin has good fluidity during molding. Another purpose is to mold a resin such as a liquid crystal polymer and a plastic resin having a similar temperature behavior with a linear expansion coefficient of the mold with a good mold releasability, and the other purpose is around the melting point of the thermoplastic resin. Molding is performed with such a high mold temperature and good releasability. Another object is to insert-mold, outsert or hoop-mold, or laminate-mold resin and metal with high bonding strength.
本発明者は、鋭意検討した結果、表面にダイヤモンド状炭素被膜を有し、表面粗さの極めて小さい樹脂成形用金型等を使用することにより、さらには特定の金型温度で成形を行うことにより、上記問題を解決できることを見出だし、本発明を完成するに至った。 As a result of intensive studies, the present inventor has performed molding at a specific mold temperature by using a resin mold having a diamond-like carbon coating on the surface and extremely low surface roughness. Thus, it has been found that the above problems can be solved, and the present invention has been completed.
即ち、本発明の第１は、表面にダイヤモンド状炭素被膜を有し、十点平均表面粗さＲｚが５μｍ以下で、かつ、表面荒れが０．１μｍ未満又は１．０μｍ超である樹脂成形用金型を使用し、結晶性樹脂の融点をＴｍ（℃）とすると、金型温度Ｔが下記範囲：
（Ｔｍ−９５℃）≦Ｔ＜Ｔｍ＋１０℃
で、樹脂を充填する成形方法を提供する。
本発明の第２は、樹脂充填時の金型寸法と、樹脂充填完了後に樹脂が冷却され金型温度に至った時点の樹脂成形品の寸法との差の金型寸法に対する比率、すなわち金型内での樹脂の線収縮率が、０．１％以下の条件で行う本発明の第１に記載の成形方法を提供する。
本発明の第３は、成形が射出成形または射出圧縮成形である本発明の第１又は２に記載の成形方法を提供する。
本発明の第４は、成形品の離型温度が、（熱変形温度−２０℃）以上、融点Ｔｍ未満である本発明の第１〜３のいずれかに記載の成形方法を提供する。
本発明の第５は、成形品の樹脂の厚みが０．１ｍｍ以下である本発明の第１〜４のいずれかに記載の成形方法を提供する。
本発明の第６は、樹脂が、液晶ポリマー、ポリフェニレンサルファイドまたはポリブチレンテレフタレートである本発明の第１〜５のいずれかに記載の成形方法を提供する。
本発明の第７は、樹脂と金属部品をインサート成形、アウトサート成形もしくはフープ成形、又は貼合わせ成形する本発明の第１〜６のいずれかに記載の成形方法を提供する。
本発明の第８は、金属部品の表面が無処理である本発明の第７に記載の成形方法を提供する。
本発明の第９は、金型表面に離型剤を塗布することなく成形を行うことを特徴とする本発明の第１〜８のいずれかに記載の成形方法を提供する。
本発明の第１０は、表面にダイヤモンド状炭素被膜を有し、十点平均表面粗さＲｚが５μｍ以下で、かつ、表面荒れが０．１μｍ未満又は１．０μｍ超である樹脂成形用金型を提供する。
本発明の第１１は、本発明の第１〜９のいずれかに記載の成形方法に使用される本発明の第１０に記載の金型を提供する。
That is, the first of the present invention is for resin molding having a diamond-like carbon coating on the surface, a ten-point average surface roughness Rz of 5 μm or less, and a surface roughness of less than 0.1 μm or more than 1.0 μm. If a mold is used and the melting point of the crystalline resin is Tm (° C.), the mold temperature T is in the following range:
(Tm−95 ° C.) ≦ T <Tm + 10 ° C.
Thus, a molding method for filling the resin is provided.
The second aspect of the present invention is the ratio of the difference between the mold dimensions at the time of resin filling and the dimensions of the resin molded product at the time when the resin is cooled and reaches the mold temperature after completion of the resin filling, that is, the mold. The molding method according to the first aspect of the present invention is performed under the condition that the linear shrinkage of the resin is 0.1% or less.
A third aspect of the present invention provides the molding method according to the first or second aspect of the present invention, wherein the molding is injection molding or injection compression molding.
According to a fourth aspect of the present invention, there is provided the molding method according to any one of the first to third aspects of the present invention, wherein a release temperature of the molded product is (thermal deformation temperature -20 ° C) or higher and lower than the melting point Tm.
5th of this invention provides the shaping | molding method in any one of 1st-4th of this invention whose resin thickness of a molded article is 0.1 mm or less.
A sixth aspect of the present invention provides the molding method according to any one of the first to fifth aspects of the present invention, wherein the resin is a liquid crystal polymer, polyphenylene sulfide, or polybutylene terephthalate.
A seventh aspect of the present invention provides the molding method according to any one of the first to sixth aspects of the present invention, in which a resin and a metal part are insert molded, outsert molded or hoop molded, or bonded molded.
The eighth aspect of the present invention provides the molding method according to the seventh aspect of the present invention, wherein the surface of the metal part is untreated.
9th of this invention provides the shaping | molding method in any one of 1st-8 of this invention characterized by performing shaping | molding, without apply | coating a mold release agent to a metal mold | die surface.
A tenth aspect of the present invention is a resin molding die having a diamond-like carbon coating on the surface, a ten-point average surface roughness Rz of 5 μm or less, and a surface roughness of less than 0.1 μm or more than 1.0 μm. I will provide a.
11th of this invention provides the metal mold | die as described in 10th of this invention used for the shaping | molding method in any one of 1-9 of this invention.
本発明によれば、光沢や外観に優れた樹脂成形品が得られる。薄肉成形品でも樹脂が良好な流動性を示し、光沢や外観に優れた樹脂成形品が得られる。また、液晶ポリマーのような樹脂と金型の線膨張係数が類似の温度挙動をする樹脂を離型性良く成形することができる。さらに、高温度の金型温度で離型性良く成形することができる。特には、樹脂と金属を高接合強度でインサート成形、アウトサートもしくはフープ成形、又は貼合わせ成形することができる。
加えて、本発明によれば、離型剤を殆どないし全く使用することなく、成形を行うことができる。
According to the present invention, a resin molded product excellent in gloss and appearance can be obtained. The resin exhibits good fluidity even in a thin molded product, and a resin molded product excellent in gloss and appearance can be obtained. In addition, a resin such as a liquid crystal polymer and a resin having a similar temperature behavior in the linear expansion coefficient of the mold can be molded with good releasability. Further, it can be molded with a high mold temperature and good releasability. In particular, it is possible to insert-mold, outsert or hoop-mold, or laminate-mold resin and metal with high bonding strength.
In addition, according to the present invention, molding can be performed with little or no release agent.
本発明で使用する樹脂成形用金型は、金型基材の表面にダイヤモンド状炭素被膜を有する。
ダイヤモンド状炭素被膜は、前記従来技術に記載した特開平１０−２０３８９６号公報などや特開昭６３−１８５８９３号公報に記載された技術などにより、金型基材上に形成される。
金型基材の材質には特に制限はなく、例えばＳＵＳ４２０Ｊ２等のステンレス鋼、ＳＫＤ１１，ＳＫＤ１２，ＳＫＤ６１，ＳＫ３等の合金工具鋼、ＳＫＨ１５１等のハイス鋼、Ｓ５５Ｃ，ＳＣＭ４４０等の構造用炭素鋼、アルミ合金、ベリリウム銅等の非鉄合金が挙げられる。
金型基材の表面硬度や表面粗さには特に制約はないが、ある程度表面硬度を高めておいたり、表面粗さを小さくしておくことが好ましい。
また、金型基材とＤＬＣ被膜の結合を強固にするために、金型基材表面を処理して各種の中間層を設けてもよい。
The mold for resin molding used in the present invention has a diamond-like carbon coating on the surface of a mold base.
The diamond-like carbon film is formed on the mold base by the technique described in JP-A-10-203896 described in the above prior art or the technique described in JP-A-63-185893.
There are no particular restrictions on the material of the mold base material. For example, stainless steel such as SUS420J2, alloy tool steel such as SKD11, SKD12, SKD61, and SK3, high-speed steel such as SKH151, structural carbon steel such as S55C and SCM440, aluminum Examples include alloys and non-ferrous alloys such as beryllium copper.
The surface hardness and surface roughness of the mold base are not particularly limited, but it is preferable to increase the surface hardness to some extent or reduce the surface roughness.
Further, in order to strengthen the bond between the mold base and the DLC film, the surface of the mold base may be processed to provide various intermediate layers.
本発明で使用する樹脂成形用金型は、ＪＩＳ Ｂ０６０１（１９９４年）により定められた十点平均表面粗さＲｚが５μｍ以下かつ０．１〜１．０μｍの大きさの表面荒れを有さない、即ち、表面荒れが０．１μｍ未満又は１．０μｍ超である、好ましくはＲｚが３μｍ以下かつ０．０５μｍ以下又は２．０μｍ以上である。
Ｒｚが上記範囲より大きすぎると、樹脂成形品の離型性、特に高温金型を使用して成形した場合の離型性が悪くなる。
樹脂が金型に密着する場合、比較的大きな粗さである十点平均表面粗さＲｚだけでなく、それに隠れてしまう更に細かな表面荒れも重要な要素であることが判った。表面荒れが上記範囲外であると離型性が悪くなる。
なお、Ｒｚおよび表面荒れは、表面処理により調整される。表面荒れは、位相補償型広域フィルターにより、１．０〜５．０μｍの表面うねり成分を除去したときのＲｚとして測定される。
The mold for resin molding used in the present invention does not have a surface roughness with a 10-point average surface roughness Rz defined by JIS B0601 (1994) of 5 μm or less and 0.1 to 1.0 μm. That is, the surface roughness is less than 0.1 μm or more than 1.0 μm, preferably Rz is 3 μm or less and 0.05 μm or less or 2.0 μm or more.
If Rz is larger than the above range, the mold release property of the resin molded product, particularly the mold release property when molded using a high temperature mold is deteriorated.
It has been found that not only the ten-point average surface roughness Rz, which is a relatively large roughness, but also the finer surface roughness that is hidden by the resin is an important factor when the resin is in close contact with the mold. If the surface roughness is outside the above range, the releasability is deteriorated.
Rz and surface roughness are adjusted by surface treatment. The surface roughness is measured as Rz when a surface waviness component of 1.0 to 5.0 μm is removed by a phase compensation type wide-area filter.
本発明において成形に使用される樹脂は、結晶性熱可塑性樹脂である。該熱可塑性樹脂としては、ポリエチレン、ポリプロピレン、ポリアミド、ポリアセタール、変性ポリフェニレンエーテル、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリフェニレンスルフィド、ポリイミド、ポリアミドイミド、ポリエーテルイミド、ポリサルフォン、ポリエーテルサルフォン、ポリエーテルケトン、ポリエーテルエーテルケトン、液晶ポリマー、弗素樹脂、熱可塑性エラストマー、ポリマーアロイ、各種の生分解性樹脂等が挙げられる。
好ましくは、液晶ポリマー、ポリフェニレンスルフィド、ポリブチレンテレフタレートである。
上記樹脂には、各種の樹脂添加剤、充填剤、樹脂改質剤、着色剤等が入っていてもよく、本発明では、これらの添加剤等が入った樹脂組成物も樹脂と略称する。
The resin used for molding in the present invention is a crystalline thermoplastic resin. Examples of the thermoplastic resin include polyethylene, polypropylene, polyamide, polyacetal, modified polyphenylene ether, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, poly Examples include ether ketone, polyether ether ketone, liquid crystal polymer, fluorine resin, thermoplastic elastomer, polymer alloy, and various biodegradable resins.
Preferred are liquid crystal polymer, polyphenylene sulfide, and polybutylene terephthalate.
The resin may contain various resin additives, fillers, resin modifiers, colorants, and the like. In the present invention, a resin composition containing these additives is also abbreviated as a resin.
本発明では、樹脂を充填する時の金型の温度が下記の特定の温度範囲内にあるとき、優れた光沢や外観の樹脂成形品が得られ、あるいは薄肉の樹脂成形品であっても、樹脂が良好な流動性を有する状態で成形できる。
結晶性樹脂の融点をＴｍとすると、金型温度Ｔが、（Ｔｍ−９５℃）≦Ｔ≦（Ｔｍ＋１０℃）、好ましくは、（Ｔｍ−７０℃）≦Ｔ≦（Ｔｍ＋１０℃）、さらに好ましくは、（Ｔｍ−４０℃）≦Ｔ≦（Ｔｍ＋１０℃）である。
In the present invention, when the temperature of the mold when filling the resin is within the following specific temperature range, a resin molded product with excellent gloss and appearance can be obtained, or even a thin resin molded product, The resin can be molded with good fluidity.
When the melting point of the crystalline resin is Tm, the mold temperature T is (Tm−95 ° C.) ≦ T ≦ (Tm + 10 ° C.), preferably (Tm−70 ° C.) ≦ T ≦ (Tm + 10 ° C.), more preferably (Tm−40 ° C.) ≦ T ≦ (Tm + 10 ° C.).
また、本発明は上記樹脂成形用金型を使用し、樹脂の充填完了時の寸法、すなわち樹脂充填時の金型寸法と、樹脂充填完了後に樹脂が冷却され金型温度に至った時点の樹脂成形品の寸法との差の該金型寸法に対する比率、即ち金型内での樹脂の線収縮率が、０．１％以下の条件で、インサート・アウトサートもしくはフープ成形等を行う時、インサート金属、アウトサート金属もしくはフープ基材と成形樹脂とが優れた密着性を有する状態で成形できる。
上記金型内での樹脂の線収縮率が、０．１％以下、好ましくは、０．０８％以下、更に好ましくは、０．０６％以下である。
Further, the present invention uses the above-mentioned resin molding die, the dimensions when the resin filling is completed, that is, the mold dimensions when the resin is filled, and the resin when the resin is cooled to the mold temperature after the resin filling is completed. When insert outsert or hoop molding is performed under the condition that the ratio of the difference from the dimension of the molded product to the mold dimension, that is, the linear shrinkage of the resin in the mold is 0.1% or less The metal, outsert metal or hoop base material and the molding resin can be molded with excellent adhesion.
The linear shrinkage rate of the resin in the mold is 0.1% or less, preferably 0.08% or less, and more preferably 0.06% or less.
本発明では、成形品の離型時の金型の温度が、融点Ｔｍ未満、好ましくは、（熱変形温度−２０℃）以上で、成形品を変形させることなく離型性良く、且つ経済的に、取り出すことができる。
金型温度は樹脂充填時後、離型までの間に所定の温度まで冷却し、離型後再度加熱し、所望の樹脂充填温度まで上昇させることができる。
In the present invention, the temperature of the mold at the time of releasing the molded product is less than the melting point Tm, preferably (thermal deformation temperature−20 ° C.) or more, and has good releasability without deforming the molded product and is economical. It can be taken out.
The mold temperature can be cooled to a predetermined temperature after resin filling and before mold release, and heated again after mold release, and can be raised to a desired resin filling temperature.
本発明の射出成形方法としては、本発明の効果が発揮できるものであれば特に制限はなく、通常の射出成形、射出圧縮成形の他に、サンドイッチ成形、多材・多色成形、インモールド成形、ガスアシスト成形、インサート・アウトサートもしくはフープ・貼付け成形、これらの発泡成形、超高速成形、低圧成形などであってもよい。 The injection molding method of the present invention is not particularly limited as long as the effects of the present invention can be exhibited. In addition to normal injection molding and injection compression molding, sandwich molding, multi-material / multicolor molding, in-mold molding , Gas assist molding, insert / outsert or hoop / paste molding, foam molding, ultrahigh speed molding, low pressure molding, and the like.
本発明の金型は、筒型入れ子を有する射出成形用金型に適用すると、特に効果を発揮する。
筒型入れ子の形状は、本発明の効果を発揮できる範囲内であれば特に制限はないが、例えば、筒型入れ子の直径５〜５０ｍｍ、好ましくは１０〜３０ｍｍ、筒部長さ１０〜３００ｍｍ、好ましくは２０〜２００ｍｍ、成形品の肉厚０．３〜２．０ｍｍ、好ましくは０．５〜１．０ｍｍである。筒型入れ子は、筒部の断面が円、長円、多角形、卵形など任意のものであってもよい。筒部の抜き勾配は、５度以内でも可能であり、特に０〜２度でも可能である。
金型表面は、上記表面粗さＲｚを示す部分は、キャビティ全面であってもよいが、少なくとも離型性が大きく影響する表面部分、例えば筒型入れ子の表面部分のみであってもよい。
The mold of the present invention is particularly effective when applied to an injection mold having a cylindrical insert.
The shape of the cylindrical nesting is not particularly limited as long as it is within the range in which the effects of the present invention can be exerted. For example, the diameter of the cylindrical nesting is 5 to 50 mm, preferably 10 to 30 mm, and the tube portion length is 10 to 300 mm, preferably Is 20 to 200 mm, and the thickness of the molded product is 0.3 to 2.0 mm, preferably 0.5 to 1.0 mm. The cylindrical insert may have an arbitrary cross section such as a circle, an ellipse, a polygon, or an egg. The draft angle of the tube part can be within 5 degrees, and in particular, 0 to 2 degrees is also possible.
In the mold surface, the portion showing the surface roughness Rz may be the entire cavity, or at least a surface portion where the releasability greatly affects, for example, a surface portion of a cylindrical insert.
本発明の特徴の一つは、高温金型で成形するので、インサート成形、アウトサートもしくはフープ成形、又は貼合わせ成形する場合に、樹脂と金属部品の接合強さを大きくできることである。金属部品にはアンダーカットやローレット等を設けてもよい。 One of the features of the present invention is that the bonding strength between the resin and the metal part can be increased in the case of insert molding, outsert or hoop molding, or laminating molding because it is molded with a high temperature mold. The metal part may be provided with an undercut or knurling.
本発明によれば、得られる成形品の樹脂の厚みを０．１ｍｍ以下とすることができる。
本発明では、金型表面がＤＬＣ処理されているので、高い金型温度であっても良好な離型性が得られる。成形品の樹脂厚みが薄く、充填不良が発生する場合、その対策として高い金型温度で成形を行うが、その場合充填不良は解消されるが離型不良が発生しやすい。しかし、本発明により、薄肉でも充填不良が発生せず且つ高い金型温度でも良好な離型性が得られる。
According to the present invention, the thickness of the resin of the obtained molded product can be 0.1 mm or less.
In the present invention, since the mold surface is DLC-treated, good releasability can be obtained even at a high mold temperature. In the case where the resin thickness of the molded product is thin and poor filling occurs, molding is performed at a high mold temperature as a countermeasure. In this case, the defective filling is resolved but a mold release failure is likely to occur. However, according to the present invention, even if it is thin, no filling failure occurs, and good releasability can be obtained even at a high mold temperature.
本発明によれば、離型剤を殆ど使用せずに、多くの場合に全く使用せずに、成形することが可能である。従って、本発明は、食品、薬品、化粧品などの容器；ＯＡ・ＡＶ機器、電子機器などのカバー、ハウジング、シャーシー類；ランプリフレクター、ランプエクステンションなどの光反射部品；コネクタ、リレーケースなどの電子部品；ＯＡ・ＡＶ機器、自動車用などの歯車等の成形に、殊に連続成形に有効である。 According to the present invention, molding can be performed with little or no use of a release agent in many cases. Accordingly, the present invention provides containers for food, medicine, cosmetics, etc .; covers, housings, chassis, etc. for OA / AV equipment, electronic equipment, etc .; light reflecting parts such as lamp reflectors, lamp extensions; electronic parts such as connectors, relay cases, etc. ; Effective for molding gears for OA / AV equipment, automobiles, etc., especially for continuous molding.
（実施例）
以下、実施例により本発明を具体的に説明するが、本発明はこれらに限定されるものではない。
離型抵抗は、離型時の破壊の有無で評価した。
(Example)
EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.
The mold release resistance was evaluated by the presence or absence of breakage at the time of mold release.
［比較例１］
樹脂：ポリプラスチックス(株)製、液晶ポリマー ベクトラＡ４６０（融点２７０℃）
成形品形状：縦５０ｍｍ×横５０ｍｍ×厚み１ｍｍ
成形機：ソディック（株）製ＴＲ４０ＶＲ
溶融樹脂温度：３００℃
金型鋼材：ＳＵＳ４２０Ｊ２（樹脂流動方向Ｒｚ３．０μｍ、同表面荒れ０．９μｍ；樹脂流動直角方向Ｒｚ３．０μｍ、同表面荒れ０．９μｍ）
射出速度：２００ｍｍ／秒
金型温度：１８０℃
保圧：５０ＭＰａ、１０秒
金型内での樹脂の線収縮率は０．２％である。
冷却：１６５秒
成形サイクル：１８０秒
樹脂が金型に密着し、成形品が離型時に破壊した。
[Comparative Example 1]
Resin: manufactured by Polyplastics Co., Ltd., liquid crystal polymer Vectra A460 (melting point 270 ° C.)
Molded product shape: 50 mm long x 50 mm wide x 1 mm thick
Molding machine: TR40VR manufactured by Sodick Co., Ltd.
Molten resin temperature: 300 ° C
Mold steel: SUS420J2 (resin flow direction Rz 3.0 μm, surface roughness 0.9 μm; resin flow direction Rz 3.0 μm, surface roughness 0.9 μm)
Injection speed: 200 mm / sec Mold temperature: 180 ° C
Holding pressure: 50 MPa, 10 seconds The linear shrinkage rate of the resin in the mold is 0.2%.
Cooling: 165 seconds Molding cycle: 180 seconds The resin was in close contact with the mold, and the molded product was destroyed when released.
［比較例２および３］
比較例１で使用した金型鋼材表面を、下記処理を施した金型を使用した以外は比較例１と同様に行った。
（比較例２）ＴｉＮ（窒化チタン）コーティング（Ｒｚ：樹脂流動方向および樹脂流動直角方向ともに３．０μｍ）
（比較例３）セラミックコーティング（樹脂流動方向Ｒｚ３．０μｍ、同表面荒れ０．９μｍ；樹脂流動直角方向Ｒｚ３．０μｍ、同表面荒れ０．９μｍ）
比較例２と３共に、樹脂が金型に密着し、成形品が離型時に破壊した。
[Comparative Examples 2 and 3]
The surface of the mold steel used in Comparative Example 1 was performed in the same manner as in Comparative Example 1 except that a mold subjected to the following treatment was used.
(Comparative Example 2) TiN (titanium nitride) coating (Rz: 3.0 μm in both resin flow direction and resin flow direction)
(Comparative Example 3) Ceramic coating (resin flow direction Rz 3.0 μm, surface roughness 0.9 μm; resin flow direction Rz 3.0 μm, surface roughness 0.9 μm)
In both Comparative Examples 2 and 3, the resin adhered to the mold, and the molded product was destroyed at the time of mold release.
［実施例１］
比較例１で使用した金型鋼材表面をＤＬＣ表面処理を施した下記金型を使用した他は、比較例１と同様に行った。
ＤＬＣ表面処理金型：鋼材ＳＵＳ４２０Ｊ２上に、ＤＬＣ厚み１．０μｍのコーティング処理を行い、樹脂流動方向Ｒｚ２．５μｍ、同表面荒れ０；樹脂流動直角方向Ｒｚ２．５μｍ、同表面荒れ０の金型が得られた。
成形品の離型不良は全くなく、優れた光沢や外観有する成形品が得られた。
[Example 1]
The same procedure as in Comparative Example 1 was performed, except that the following mold in which the DLC surface treatment was applied to the mold steel surface used in Comparative Example 1 was used.
DLC surface treatment mold: DLC thickness of 1.0μm is coated on steel material SUS420J2, and mold with resin flow direction Rz 2.5μm, same surface roughness 0; resin flow perpendicular direction Rz 2.5μm, same surface roughness 0 Obtained.
There was no mold release failure at all, and a molded product having excellent gloss and appearance was obtained.
［実施例２］
縦５０ｍｍ×横５０ｍｍ×厚み０．５ｍｍで鋼材ＳＵＳ４２０ＪＺ製の金属に同形状の樹脂を貼付け成形した他は、実施例１と同様に行った。
樹脂とインサート金属の界面からは一切破壊することのない成形品が、離型不良なく得られた。
[Example 2]
The same procedure as in Example 1 was performed except that the same shape of resin was applied to a metal made of steel material SUS420JZ with a length of 50 mm, a width of 50 mm, and a thickness of 0.5 mm.
A molded product that could not be destroyed at all from the interface between the resin and the insert metal was obtained without defective release.
［比較例４］
金型温度１７０℃で行った他は実施例２と同様に行った。樹脂と金属は密着せず、人の手で容易に剥がすことができた。
[Comparative Example 4]
The same procedure as in Example 2 was conducted except that the mold temperature was 170 ° C. The resin and metal did not adhere to each other and could be easily removed by human hands.
［比較例５］
金型温度１８０℃、保圧力２００ＭＰａとすることで金型内での樹脂の線収縮率を０．１％にした他は比較例１と同様に行った。樹脂が金属に密着し、成形品が離型時に破壊した。
[Comparative Example 5]
The same procedure as in Comparative Example 1 was conducted except that the linear shrinkage rate of the resin in the mold was set to 0.1% by setting the mold temperature to 180 ° C. and the holding pressure to 200 MPa. The resin adhered to the metal, and the molded product was destroyed at the time of mold release.
［実施例３］
金型温度１８０℃、保圧力２００ＭＰａとすることで金型内での樹脂の線収縮率を０．１％にした他は実施例１と同様に行った。離型不良なく、成形品を得ることができた。
[Example 3]
The same procedure as in Example 1 was performed except that the linear shrinkage rate of the resin in the mold was set to 0.1% by setting the mold temperature to 180 ° C. and the holding pressure to 200 MPa. A molded product could be obtained with no demolding failure.
［比較例６］
成形品の厚みを０．１ｍｍにした他は比較例１と同様に行った。充填不良は生じなかったが、樹脂が金型に密着し、成形品が離型時に破壊した。
[Comparative Example 6]
The same procedure as in Comparative Example 1 was performed except that the thickness of the molded product was 0.1 mm. Although no filling failure occurred, the resin adhered to the mold, and the molded product was destroyed at the time of mold release.
［実施例４］
成形品の厚みを０．１ｍｍにした他は実施例１と同様に行った。離型不良なく、且つ充填不良のない成形品を得ることができた。
[Example 4]
The same procedure as in Example 1 was performed except that the thickness of the molded product was 0.1 mm. It was possible to obtain a molded product having no mold release failure and no filling failure.
［比較例７］
金型温度１７０℃とした他は比較例６と同様に行った。離型不良は発生しなかったが、充填不良によるシートショットが発生した。
[Comparative Example 7]
The same procedure as in Comparative Example 6 was performed except that the mold temperature was 170 ° C. Although there was no mold release failure, sheet shots due to poor filling occurred.
［比較例８］
樹脂流動方向および同直角方向ともに、Ｒｚ５．２μｍとした他は、実施例１と同様に行った。樹脂が金型に密着しやすかった。
[Comparative Example 8]
The same procedure as in Example 1 was performed except that Rz was 5.2 μm in both the resin flow direction and the perpendicular direction. The resin was easy to adhere to the mold.
Claims (11)
（Ｔｍ−９５℃）≦Ｔ＜Ｔｍ＋１０℃
で、樹脂を充填する成形方法。 A crystalline resin having a diamond-like carbon coating on its surface, a ten-point average surface roughness Rz of 5 μm or less, and a surface roughness of less than 0.1 μm or more than 1.0 μm If the melting point of Tm is Tm (° C.), the mold temperature T is in the following range:
(Tm−95 ° C.) ≦ T <Tm + 10 ° C.
Then, a molding method for filling the resin.
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| JP2004162421A JP2005342922A (en) | 2004-05-31 | 2004-05-31 | Mold having diamond like carbon film and molding method using it |
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| JP2004162421A JP2005342922A (en) | 2004-05-31 | 2004-05-31 | Mold having diamond like carbon film and molding method using it |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008009035A1 (en) | 2007-03-06 | 2008-09-11 | Kabushiki Kaisha Kobe Seiko Sho, Kobe | mold |
| WO2009101822A1 (en) * | 2008-02-15 | 2009-08-20 | Polyplastics Co., Ltd. | Process for producing composite molding |
| WO2009101821A1 (en) * | 2008-02-15 | 2009-08-20 | Polyplastics Co., Ltd. | Process for producing composite molding |
| WO2010119606A1 (en) * | 2009-04-13 | 2010-10-21 | 信越半導体株式会社 | Method of preparing polishing head and polishng apparatus |
| WO2012043794A1 (en) * | 2010-09-30 | 2012-04-05 | 旭化成ケミカルズ株式会社 | Injection-molded object |
| WO2014002305A1 (en) * | 2012-06-26 | 2014-01-03 | ポリプラスチックス株式会社 | Light-reflecting component and method for producing same |
| KR101741635B1 (en) * | 2015-10-19 | 2017-06-01 | 한국생산기술연구원 | Aspherical lens molding device for infrared optics |
| CN111093932A (en) * | 2017-07-20 | 2020-05-01 | 宝理塑料株式会社 | Metal resin composite molded article and method for producing same |
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- 2004-05-31 JP JP2004162421A patent/JP2005342922A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008009035A1 (en) | 2007-03-06 | 2008-09-11 | Kabushiki Kaisha Kobe Seiko Sho, Kobe | mold |
| WO2009101822A1 (en) * | 2008-02-15 | 2009-08-20 | Polyplastics Co., Ltd. | Process for producing composite molding |
| WO2009101821A1 (en) * | 2008-02-15 | 2009-08-20 | Polyplastics Co., Ltd. | Process for producing composite molding |
| JP2009190293A (en) * | 2008-02-15 | 2009-08-27 | Polyplastics Co | Method for producing composite molding |
| JP2009190294A (en) * | 2008-02-15 | 2009-08-27 | Polyplastics Co | Method for producing composite molding |
| JP2010247254A (en) * | 2009-04-13 | 2010-11-04 | Shin Etsu Handotai Co Ltd | Method of preparing polishing head and polishing apparatus |
| WO2010119606A1 (en) * | 2009-04-13 | 2010-10-21 | 信越半導体株式会社 | Method of preparing polishing head and polishng apparatus |
| WO2012043794A1 (en) * | 2010-09-30 | 2012-04-05 | 旭化成ケミカルズ株式会社 | Injection-molded object |
| US9725587B2 (en) | 2010-09-30 | 2017-08-08 | Asahi Kasei Chemicals Corporation | Injection molded article |
| WO2014002305A1 (en) * | 2012-06-26 | 2014-01-03 | ポリプラスチックス株式会社 | Light-reflecting component and method for producing same |
| JP5853103B2 (en) * | 2012-06-26 | 2016-02-09 | ポリプラスチックス株式会社 | Light reflecting component and manufacturing method thereof |
| KR101741635B1 (en) * | 2015-10-19 | 2017-06-01 | 한국생산기술연구원 | Aspherical lens molding device for infrared optics |
| CN111093932A (en) * | 2017-07-20 | 2020-05-01 | 宝理塑料株式会社 | Metal resin composite molded article and method for producing same |
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