JP2005183424A - Thin substrate fixing jig - Google Patents

Thin substrate fixing jig Download PDF

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JP2005183424A
JP2005183424A JP2003417659A JP2003417659A JP2005183424A JP 2005183424 A JP2005183424 A JP 2005183424A JP 2003417659 A JP2003417659 A JP 2003417659A JP 2003417659 A JP2003417659 A JP 2003417659A JP 2005183424 A JP2005183424 A JP 2005183424A
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adhesive layer
weak
thin film
fixing jig
thin
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Hiroto Komatsu
博登 小松
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Priority to JP2003417659A priority Critical patent/JP2005183424A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To perform the repetitive formation of a weak adhesive layer on a plate material (a plate) simply and easily without damaging a base material, i.e. a plate, even when the weak adhesive layer of a thin substrate fixing jig is updated or altered. <P>SOLUTION: The thin substrate fixing jig 1 is composed of a plate 2 and a thin film 4 formed of a weak adhesive layer 3 and arranged such that the thin film 4 is applied removably to the plate 2. A securing means of the plate 2 and the thin film 4 is a second weak adhesive layer 7 formed on the plate 2 wherein the adhesive power of the second weak adhesive layer 7 is preferably stronger than that of the weak adhesive layer 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、薄型フレキシブルプリント配線基板を載置、固定する薄型基板固定治具に関する。   The present invention relates to a thin substrate fixing jig for mounting and fixing a thin flexible printed wiring board.

プリント配線基板は、生産性の向上や高信頼性により、近時、多くの電子機器に使用されている。近年、電子機器の小型化、軽量化に対応すべく、フィルム状の絶縁基板表面に導体パターンを備えたフレキシブルプリント配線基板（以下、ＦＰＣという）が多用されている。このＦＰＣにおいては、上記導体パターン表面に電子部品を実装する、いわゆる表面実装方式が広く採用されている。
ＦＰＣは、通常、搭載する電子部品の配設位置等に応じて、クリームハンダ塗布工程等を経た後、このクリームハンダ塗布部に電子部品を搭載し、その後、これらを加熱してクリームハンダを溶融、硬化し、上記電子部品をＦＰＣに接合する（特許文献１参照）。 Recently, printed wiring boards have been used in many electronic devices due to improved productivity and high reliability. In recent years, flexible printed wiring boards (hereinafter referred to as FPC) having a conductor pattern on the surface of a film-like insulating substrate are frequently used in order to cope with the reduction in size and weight of electronic devices. In this FPC, a so-called surface mounting method in which an electronic component is mounted on the surface of the conductor pattern is widely adopted.
FPCs usually go through a cream solder application process, etc., depending on the placement position of the electronic components to be mounted, etc., then mount the electronic components on this cream solder application part, and then heat them to melt the cream solder The electronic component is cured and bonded to the FPC (see Patent Document 1).

ＦＰＣは、フレキシブルであるが故に、また、最近の小型化の進行によっても、以上の各工程や、保管・移送等に際してその都度個別に取り扱うことは、繁雑であり、不安定でもあるので、剛性を有する板材（プレート）表面に弱粘着性接着剤パターンを形成し、その弱粘着性接着剤パターンにＦＰＣを装着・固定することが行われている（特許文献２参照）。   Because FPC is flexible, and due to recent progress in miniaturization, it is complicated and unstable to handle each of the above processes, storage, and transfer individually. It has been practiced to form a weak adhesive pattern on the surface of a plate material (plate) having, and to attach and fix an FPC to the weak adhesive pattern (see Patent Document 2).

特許文献２の保持搬送用治具２０は、図４に示すとおり、プレート２１の表面に突出させて、例えばシリコーン樹脂からなる弱粘着性接着剤２２を用いて弱粘着性接着剤パターン２３を形成したもので、弱粘着性接着剤パターン２３は、ＦＰＣ又は、該ＦＰＣを製造するための導電材料張積層板（共に図示せず）の非導通部、非導通部が形成される部分に対応する位置に形成され、ＦＰＣに電子部品が搭載される導通部に対応する位置２４には形成されないものである。
また、別の態様では、ＦＰＣ等に対応する部分に弱粘着性接着剤パターンを形成した上で、弱粘着性接着剤表面に電子部品が搭載される導通部に対応する位置には粘着力を有しないような措置を施すものも開示されている。
なお、形成された弱粘着性接着剤パターン２３中には、ＦＰＣの裏面（電子部品が搭載される面の反対側の面）に設けられる突出部を受け入れられるように、所要部に凹部２５が設けられている。
特開昭６３−２０４６９５号公報 特許第３４３５１５７号公報 As shown in FIG. 4, the holding / conveying jig 20 of Patent Document 2 protrudes from the surface of the plate 21 to form a weak adhesive pattern 23 using a weak adhesive 22 made of, for example, silicone resin. Thus, the weak adhesive pattern 23 corresponds to a portion where a non-conductive portion and a non-conductive portion of an FPC or a conductive material-clad laminate (not shown) for manufacturing the FPC are formed. It is formed at the position, and is not formed at the position 24 corresponding to the conduction portion where the electronic component is mounted on the FPC.
In another aspect, a weak adhesive pattern is formed on a portion corresponding to FPC or the like, and an adhesive force is applied to a position corresponding to a conductive portion on which an electronic component is mounted on the surface of the weak adhesive adhesive. Those that take measures that they do not have are also disclosed.
In the formed weak adhesive pattern 23, a recess 25 is formed in a required portion so that a protrusion provided on the back surface of the FPC (the surface opposite to the surface on which the electronic component is mounted) can be received. Is provided.
JP 63-204695 A Japanese Patent No. 3435157

この種のＦＰＣ固定治具は、その弱粘着剤表面にＦＰＣを接着・剥離を繰り返して多数回使用される。弱粘着剤表面の粘着力は、表面状態で大きく変わる。弱粘着剤パターンの同じ位置で繰り返し接着・剥離が繰り返されるので、その表面が次第に荒れ、粘着強度が低下する現象が発生する。また、工程内で付着したごみ等でもこれらの現象が発生し、固定治具の耐久寿命には限界がある。
あるいは、ＦＰＣの仕様・形状等が変更される場合もある。
固定治具が寿命に至り、あるいは仕様変更等があった場合には、固定治具そのものが交換されるか、弱粘着剤を板材から剥離して、再度弱粘着剤が形成・再生される。弱粘着剤の剥離は、物理的にスクレーパー等で掻き落とす方法が採られるが、この方法は多くの工数を必要とする作業であるとともに、板材自体を傷つけてしまう可能性が伴っている。特に熱量や反りの問題から高価なマグネシウムを板材として使用する場合は大きな問題となっている。 This type of FPC fixing jig is used many times by repeatedly bonding and peeling FPC on the surface of the weak adhesive. The adhesive strength of the weak adhesive surface varies greatly depending on the surface state. Since adhesion and peeling are repeated repeatedly at the same position of the weak pressure-sensitive adhesive pattern, the surface gradually becomes rough, and a phenomenon that the adhesive strength is reduced occurs. Moreover, these phenomena also occur in the dust attached in the process, and the durability life of the fixing jig is limited.
Alternatively, the FPC specification / shape and the like may be changed.
When the fixing jig reaches the end of its life or when the specification is changed, the fixing jig itself is replaced, or the weak adhesive is peeled off from the plate material, and the weak adhesive is formed and regenerated again. The weak adhesive is peeled off by physically scraping it off with a scraper or the like, but this method requires a lot of man-hours and may damage the plate itself. In particular, when expensive magnesium is used as a plate material, it is a big problem due to problems of heat quantity and warpage.

本発明は、上記の問題に対処するもので、薄型基板固定治具の弱粘着剤層の更新・変更の際にも基盤材たる板材（平板）を傷付けることなく、平板への弱粘着剤層の形成が繰り返し簡略・容易に行われ得るようにすることを課題とするものである。   The present invention addresses the above-described problems, and does not damage the base material (flat plate) even when the weak adhesive layer of the thin substrate fixing jig is updated or changed, and the weak adhesive layer on the flat plate is not damaged. It is an object of the present invention to be able to repeatedly and easily be formed.

本発明の薄型基板固定治具は、平板と弱粘着剤層が形成された薄膜からなる薄型基板固定治具であって、前記平板上に前記薄膜が着脱自在に固定されていることを特徴とする。前記平板と前記薄膜との固定手段が前記平板上に形成された第二の弱粘着剤層によるものであること、前記第二の弱粘着剤層の粘着力が前記弱粘着剤層の粘着力に比べ粘着力がより強いものであることが好ましい。   The thin substrate fixing jig of the present invention is a thin substrate fixing jig composed of a thin film on which a flat plate and a weak adhesive layer are formed, wherein the thin film is detachably fixed on the flat plate. To do. The fixing means for the flat plate and the thin film is based on the second weak adhesive layer formed on the flat plate, and the adhesive force of the second weak adhesive layer is the adhesive force of the weak adhesive layer. It is preferable that the adhesive strength is stronger than that.

本発明の薄型基板固定治具によれば、薄膜に形成された弱粘着剤層を更新・変更する必要がある場合に、薄膜それ自体を交換することによって行い得るので、弱粘着剤層の交換・再生、あるいは薄型基板の仕様変更への対応が極めて容易・簡便に行うことができ、その際に、スクレーパー等で物理的に掻き落とすことがないので、平板を傷付けることはない。
また、平板と薄膜との固定が第二の弱粘着剤層による場合であっても、第二の弱粘着剤層が常時薄膜で覆われているので、工程内でごみ等の付着もほとんどなく、第二の弱粘着剤層の耐用寿命も大幅に延びる。さらに、平板とは独立して、薄板上への弱粘着剤層の形成が可能であるので、各種の多様な薄型基板の仕様への対応も迅速に行うことができる。 According to the thin substrate fixing jig of the present invention, when it is necessary to update or change the weak adhesive layer formed on the thin film, it can be performed by replacing the thin film itself.・ Recycling or adapting to changes in the specifications of thin substrates can be performed very easily and simply. In this case, the scraper or the like is not physically scraped off, so that the flat plate is not damaged.
In addition, even when the flat plate and the thin film are fixed by the second weak adhesive layer, the second weak adhesive layer is always covered with the thin film, so there is almost no adhesion of dust or the like in the process. The service life of the second weak pressure-sensitive adhesive layer is also greatly extended. Furthermore, since it is possible to form a weak adhesive layer on a thin plate independently of a flat plate, it is possible to quickly respond to various specifications of various thin substrates.

ＦＰＣの薄型基板は、通常、フィルム状の薄型基板材に、印刷配線パターンを多数形成し、各印刷配線パターンの精度・欠陥等をチェックして選択・切り離して、合格したものだけを個別の薄型基板として用いられる。この個別の薄型基板を個々に取り扱うのでは不便なので、一定数の合格薄型基板を薄型基板工程治具に配列・固定して、保管・移動から、クリームハンダの印刷、フリップチップの載置、クリームハンダの溶融・固化によるフリップチップのＦＰＣへの接合等を行うものである。   FPC's thin substrates are usually formed on a thin film-like substrate material, and many printed wiring patterns are formed. Each printed wiring pattern is checked for accuracy, defects, etc., selected and separated, and only those that have passed are individually thinned. Used as a substrate. It is inconvenient to handle each individual thin substrate individually, so a certain number of acceptable thin substrates can be arranged and fixed on a thin substrate process jig, stored and moved, cream solder printing, flip chip placement, cream The flip chip is joined to the FPC by melting and solidifying the solder.

本発明は、ＦＰＣを固定して保管・移送したり、ＩＣチップ等の電子機器を表面実装するときに用いる薄型基板固定治具の弱粘着剤層を、薄膜を介して平板上に形成することを基本とする。
以下、図面を用いて本発明を詳細に説明する。
図１は、本発明の薄型基板固定治具を示す平面説明図である。
図２は、本発明の第１の実施の形態における薄型基板固定治具の、図１のＸ−Ｘ線に沿う断面説明図である。
図３は、本発明の第２の実施の形態における薄型基板固定治具の、図１のＸ−Ｘ線に沿う断面説明図である。 The present invention forms a weak adhesive layer of a thin substrate fixing jig used on a flat plate through a thin film, which is used when an FPC is fixed and stored and transported, or an electronic device such as an IC chip is surface-mounted. Based on.
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory plan view showing a thin substrate fixing jig of the present invention.
FIG. 2 is a cross-sectional explanatory view taken along the line XX of FIG. 1 of the thin substrate fixing jig in the first embodiment of the present invention.
FIG. 3 is a cross-sectional explanatory view taken along the line XX of FIG. 1 of the thin substrate fixing jig in the second embodiment of the present invention.

図１において、本発明の薄型基板固定治具１は、平板２（図３）の片面の表面のほぼ全面に弱粘着剤層３を設けた薄膜が覆っている。弱粘着剤層３は、ほぼＦＰＣ（図示せず）の形状に合わせて、薄型基板（ＦＰＣ）を接着・固定するに足る適宜の弱粘着剤層パターン５とすることができる。通常は、薄膜４上に複数の弱粘着剤層パターン５が配置される。従来技術においては、平板に直接弱粘着剤層パターンが形成されるのが通例であった。
本発明の第１の実施の形態においては、図２に示されるように、薄膜は平板にネジ止め６されている。
また、薄膜の外周を額縁のような枠で固定しても良く、その場合の枠の厚みは０．２ｍｍ以下とすることが好ましい。
ネジ止めに替えて、適宜の位置に形成した接着剤によって、あるいは両面接着テープによって、薄膜は平板に固定する、等、適宜の固定手段を用いることもできる。 In FIG. 1, a thin substrate fixing jig 1 of the present invention is covered with a thin film provided with a weak adhesive layer 3 on almost the entire surface of one side of a flat plate 2 (FIG. 3). The weak pressure-sensitive adhesive layer 3 can be an appropriate weak pressure-sensitive adhesive layer pattern 5 that is sufficient to adhere and fix a thin substrate (FPC) in accordance with the shape of an FPC (not shown). Usually, a plurality of weak adhesive layer patterns 5 are disposed on the thin film 4. In the prior art, a weak pressure-sensitive adhesive layer pattern is usually formed directly on a flat plate.
In the first embodiment of the present invention, as shown in FIG. 2, the thin film is screwed 6 to a flat plate.
Further, the outer periphery of the thin film may be fixed with a frame such as a frame. In that case, the thickness of the frame is preferably 0.2 mm or less.
Instead of screwing, an appropriate fixing means such as fixing the thin film to a flat plate with an adhesive formed at an appropriate position or with a double-sided adhesive tape can be used.

弱粘着剤層３は、ほぼＦＰＣ（図示せず）の形状に合わせて、薄型基板（ＦＰＣ）を接着・固定するに足る適宜の弱粘着剤層パターン５とすることができる。通例通り、薄膜４上に複数の弱粘着剤層パターン５が配置されることが好ましい。
弱粘着剤層パターン５は、フリップチップ（電子部品）が薄型基板に実装される位置に対応する位置には弱粘着剤層が形成されないことを原則とし、その対応する位置の粘着力を低下させるような措置、例えば非粘着性の層を形成する措置、とか、その位置部分だけ選択的に硬化させて粘着力を減殺させる措置、を施すこともできる。 The weak pressure-sensitive adhesive layer 3 can be an appropriate weak pressure-sensitive adhesive layer pattern 5 that is sufficient to adhere and fix a thin substrate (FPC) in accordance with the shape of an FPC (not shown). As usual, it is preferable that a plurality of weak pressure-sensitive adhesive layer patterns 5 are arranged on the thin film 4.
The weak adhesive layer pattern 5 is based on the principle that the weak adhesive layer is not formed at a position corresponding to the position where the flip chip (electronic component) is mounted on the thin substrate, and reduces the adhesive force at the corresponding position. Such a measure, for example, a measure for forming a non-adhesive layer, or a measure for selectively curing only a portion of the layer to reduce the adhesive force can be applied.

また、弱粘着剤層パターン５には、ＦＰＣの裏面（電子部品が搭載される面の反対側の面）に設けられる突出部を受け入れられるように、弱粘着剤層３を設けないようにすることの他に、弱粘着剤層３の所要部に凹部を設けることもできる。
さらに、フリップチップ（電子部品）が薄型基板に実装される位置に対応する位置に、平板に貫通孔を設ける、等の態様を採用するものでも差し支えない。
弱粘着剤層３の表面は、自己密着性を高めるために、鏡面に仕上げられていることが望ましい。 Further, the weak pressure-sensitive adhesive layer pattern 5 is not provided with the weak pressure-sensitive adhesive layer 3 so as to accept the protrusion provided on the back surface of the FPC (the surface opposite to the surface on which the electronic component is mounted). In addition to this, a concave portion can be provided in a required portion of the weak pressure-sensitive adhesive layer 3.
Further, it may be possible to adopt a mode in which a through hole is provided in a flat plate at a position corresponding to a position where a flip chip (electronic component) is mounted on a thin substrate.
The surface of the weak pressure-sensitive adhesive layer 3 is preferably finished to a mirror surface in order to improve self-adhesion.

本発明の第２の実施の形態においては、図３に示されるように、本発明の薄型基板固定治具１は、平板２の片面の表面のほぼ全面に第二の弱粘着剤層７が設けられ、さらにその上に、表面に弱粘着剤層３を形成した薄膜４が載置・貼付されている。この場合の弱粘着剤層３においても、弱粘着剤層パターンを構成すること、また、フリップチップ（電子部品）が薄型基板に実装される位置に対応する位置には弱粘着層が形成されないことや、その対応する位置の粘着力を低下させるような措置を採ること、さらにはＦＰＣの裏面（電子部品が搭載される面の反対側の面）に設けられる突出部を受け入れられるように、弱粘着剤層３を設けないようにすることや、弱粘着剤層３の所要部に凹部を設けること、フリップチップ（電子部品）が薄型基板に実装される位置に対応する位置に、平板に貫通孔を設ける、等のバリエーションを採用すること、弱粘着剤層３の表面は、自己密着性を高めるために、鏡面に仕上げられていることが望ましいことは、本発明の第１の実施の形態におけるのと同様である。   In the second embodiment of the present invention, as shown in FIG. 3, the thin substrate fixing jig 1 of the present invention has the second weak adhesive layer 7 on almost the entire surface of one surface of the flat plate 2. Further, a thin film 4 having a weak pressure-sensitive adhesive layer 3 formed on the surface thereof is placed and pasted thereon. In this case, the weak pressure-sensitive adhesive layer 3 also forms a weak pressure-sensitive adhesive layer pattern, and the weak pressure-sensitive adhesive layer is not formed at a position corresponding to the position where the flip chip (electronic component) is mounted on the thin substrate. Take measures to reduce the adhesive strength at the corresponding position, and weaken it so that the protrusion provided on the back surface of the FPC (the surface opposite to the surface on which the electronic component is mounted) can be received. Do not provide the adhesive layer 3, provide a recess in the required part of the weak adhesive layer 3, and penetrate the flat plate at a position corresponding to the position where the flip chip (electronic component) is mounted on the thin substrate In the first embodiment of the present invention, it is desirable to adopt a variation such as providing a hole, and that the surface of the weak pressure-sensitive adhesive layer 3 is preferably mirror-finished in order to enhance self-adhesion. In It is like.

このように構成された本発明の薄型基板固定治具に接着・固定された薄型基板は、保管・移送に供される他、薄型基板への電子部品の表面実装のためのクリームハンダ等の印刷、クリームハンダの溶融・固化・接着等の諸措置に供される。
平板２の材質としては、クリームハンダによるフリップチップの実装のための加熱に耐え得る耐熱性を有する剛体であれば、格別の制限はないが、例えば、アルミニウム合金、ガラスエポキシ複合板、マグネシウム合金などが好適なものとして挙げられる。
薄型基板を直接接着する弱粘着剤層３を形成させる材質としては、耐熱性、耐寒性、電気絶縁性を有し、自己密着性を有し、繰り返し粘着することができるものが望ましく、例えば、シリコーン、ポリイミドシリコーン、末端に硬化性官能基を有するフッ素化ポリエーテル骨格を有するフッ素系エラストマーを硬化せしめたものなど耐熱性の高いエラストマー材料が挙げられる。 The thin substrate bonded and fixed to the thin substrate fixing jig of the present invention configured as described above is used for storage and transfer, and printing such as cream solder for surface mounting of electronic components on the thin substrate It is used for various measures such as melting, solidifying and bonding cream solder.
The material of the flat plate 2 is not particularly limited as long as it is a rigid body having heat resistance capable of withstanding heating for flip chip mounting by cream solder. For example, aluminum alloy, glass epoxy composite plate, magnesium alloy, etc. Are mentioned as preferred.
As a material for forming the weak pressure-sensitive adhesive layer 3 for directly bonding a thin substrate, a material having heat resistance, cold resistance, electrical insulation, self-adhesion, and capable of repeatedly adhering is desirable. Examples include silicone, polyimide silicone, and elastomer materials having high heat resistance such as those obtained by curing a fluorine-based elastomer having a fluorinated polyether skeleton having a curable functional group at the terminal.

弱粘着剤層３の厚さは適宜に決定することができるが、フリップチップの裏面の突出部に対応するに足る厚さとする場合には、その部分を薄板と共にトムソン刃等による打ち抜き加工で簡便に行い得るので、従来行われていた弱粘着剤層への形成後のザグリ加工等の熟練を要する加工工程を簡易化することができる。
平板２上に形成され、処理される薄膜４を接着する第二の弱粘着剤層７を形成させる材質としては、弱粘着剤層３と同様に、耐熱性、耐寒性、電気絶縁性を有し、自己密着性を有し、繰り返し粘着することができるものが望ましく、例えば、シリコーン、ポリイミドシリコーン、末端に硬化性官能基を有するフッ素化ポリエーテル骨格を有するフッ素系エラストマーを硬化せしめたものなど耐熱性の高いエラストマー材料が挙げられる。 The thickness of the weak pressure-sensitive adhesive layer 3 can be determined as appropriate. However, when the thickness is sufficient to correspond to the protruding portion on the back surface of the flip chip, the portion can be easily punched with a Thomson blade together with a thin plate. Therefore, it is possible to simplify processing steps that require skill, such as counterboring after formation on the weak pressure-sensitive adhesive layer, which has been conventionally performed.
As a material for forming the second weak pressure-sensitive adhesive layer 7 formed on the flat plate 2 and adhering the thin film 4 to be processed, the material has heat resistance, cold resistance, and electrical insulation, similar to the weak pressure-sensitive adhesive layer 3. It is desirable that it has self-adhesiveness and can repeatedly adhere, for example, silicone, polyimide silicone, a cured fluorinated elastomer having a fluorinated polyether skeleton having a curable functional group at the end, etc. An elastomer material having high heat resistance can be used.

第二の弱粘着剤層７は、平板２の片面の表面のほぼ全面に設けられることを原則とするが、クリームハンダの溶融・固化に超音波加熱方式を用いる場合等で、超音波加熱装置のツールを挿通するための平板に設ける貫通孔に対応する位置に、（弱）粘着剤層を設けないようにすることもできる。   In principle, the second weak pressure-sensitive adhesive layer 7 is provided on almost the entire surface of one side of the flat plate 2. However, when an ultrasonic heating method is used for melting and solidifying cream solder, an ultrasonic heating device is used. It is also possible not to provide the (weak) pressure-sensitive adhesive layer at a position corresponding to the through hole provided in the flat plate for inserting the tool.

弱粘着剤層３と第二の弱粘着剤層７との接着力は、弱粘着剤層３が薄膜４と接触する面積が、個々に形成される第二の弱粘着剤層７が薄膜４と接触する面積と比較して、大きな差があるので、同等でも差し支えないが、フリップチップを第二の弱粘着剤層７から剥離するときに弱粘着剤層３と平板２との間の接着状態に影響を与えないことをより重視する場合には、弱粘着剤層３の粘着力に比較して第二の弱粘着剤層７の粘着力の方がより強いものであるようにすることが好ましい。   The adhesive force between the weak pressure-sensitive adhesive layer 3 and the second weak pressure-sensitive adhesive layer 7 is such that the area where the weak pressure-sensitive adhesive layer 3 is in contact with the thin film 4 is individually formed by the second weak pressure-sensitive adhesive layer 7 being the thin film 4. Since there is a large difference compared to the area in contact with the substrate, it may be equivalent, but when the flip chip is peeled off from the second weak adhesive layer 7, the adhesion between the weak adhesive layer 3 and the flat plate 2 When more importance is given to not affecting the state, the adhesive strength of the second weak adhesive layer 7 should be stronger than the adhesive strength of the weak adhesive layer 3. Is preferred.

薄膜４の材料としては、薄膜でありながら弱粘着剤層を保持することが可能で、かつ耐熱性が高いものが望まれる。こうした点からアルミニウム、銅、鉄などの金属箔で厚みは１０μｍ〜１００μｍ程度が望ましい。また、ポリイミド、ポリアミド、ポリエーテルイミド等耐熱性の高い樹脂フィルムを採用することも可能である。この際の厚みも１０μｍ〜１００μｍ程度が望ましい。   As a material of the thin film 4, a material that can hold the weak pressure-sensitive adhesive layer while being a thin film and has high heat resistance is desired. From these points, a metal foil such as aluminum, copper, or iron is desirable and has a thickness of about 10 to 100 μm. Moreover, it is also possible to employ | adopt resin films with high heat resistance, such as a polyimide, polyamide, polyether imide. The thickness at this time is preferably about 10 μm to 100 μm.

［実施例１］
厚み０．０５ｍｍのポリイミドフィルムの片面にプライマー処理を施した後、スクリーン印刷機により液状シリコーン：ＫＥ−１８００（商品名：信越化学工業（株）製）を厚み０．０４ｍｍで部分的に塗布を行い、１２０℃−１０分間の加熱を行うことでシリコーンゴムの硬化を行い、薄膜上の弱粘着剤層を形成した。
薄膜上に形成された弱粘着剤層は、別途作製した、外径１５０ｍｍ×１５０ｍｍ厚み１．５ｍｍのアルミニウム板に対峙した形状に外径抜き加工を施し、アルミニウムと弱粘着剤層を形成した薄膜とをネジ止めにて一体化し、薄型固定治具を作製した。 [Example 1]
After applying a primer treatment on one side of a polyimide film having a thickness of 0.05 mm, a liquid silicone: KE-1800 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd.) is partially applied with a thickness of 0.04 mm by a screen printer. The silicone rubber was cured by heating at 120 ° C. for 10 minutes to form a weak adhesive layer on the thin film.
The weak pressure-sensitive adhesive layer formed on the thin film is a thin film in which aluminum and a weak pressure-sensitive adhesive layer are formed by applying an outer diameter to a separately formed aluminum plate having an outer diameter of 150 mm × 150 mm and a thickness of 1.5 mm. Were integrated by screwing to produce a thin fixture.

［実施例２］
厚み０．０５ｍｍのポリイミドフィルムの片面にプライマー処理を施した後、スクリーン印刷機により液状シリコーン：ＫＥ−１８００（商品名：信越化学工業（株）製）を厚み０．０４ｍｍで部分的に塗布を行い、１２０℃−１０分間の加熱を行うことでシリコーンゴムの硬化を行い、薄膜上の弱粘着剤層を形成した。
これとは別に、外径１５０ｍｍ×１５０ｍｍ厚み１．５ｍｍのアルミニウム板の片面にプライマー処理を施し、スクリーン印刷法を用いて液状シリコーン：ＫＥ−１８００（商品名：信越化学工業（株）製）を厚み０．１ｍｍで全面塗布を行った。このものは、薄膜上に形成した弱粘着剤層と同一の材料であるが、厚みを厚くすることで粘着力を高めている。
こうして作製した、平板と薄膜上の弱粘着剤層とを貼り合わせることで、薄型基板固定治具を作製した。 [Example 2]
After applying a primer treatment on one side of a polyimide film having a thickness of 0.05 mm, a liquid silicone: KE-1800 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd.) is partially applied with a thickness of 0.04 mm by a screen printer. The silicone rubber was cured by heating at 120 ° C. for 10 minutes to form a weak adhesive layer on the thin film.
Separately, primer treatment is applied to one side of an aluminum plate having an outer diameter of 150 mm × 150 mm and a thickness of 1.5 mm, and liquid silicone: KE-1800 (trade name: manufactured by Shin-Etsu Chemical Co., Ltd.) is used by screen printing. The entire surface was applied with a thickness of 0.1 mm. This is the same material as the weak pressure-sensitive adhesive layer formed on the thin film, but the adhesive strength is increased by increasing the thickness.
A thin substrate fixing jig was prepared by bonding the flat plate and the weak adhesive layer on the thin film thus produced.

実施例１、実施例２で作製した薄型基盤固定治具に薄型基板を固定し、メタルマスクによるクリームハンダの印刷工程に供した。ＦＰＣがメタルマスクに取られることもなく、また、メタルマスクが粘着剤層に張り付いて取りにくいこともなく、問題なく加工できることが確認された。
さらに、部品（フリップチップ）マウント工程、ハンダリフロー工程に供しても、ＦＰＣのずれや剥がれが発生することがなく、かつ、部品実装後のＦＰＣを弱粘着剤層から剥がす際にも、ＦＰＣのカールの発生や裂け等のトラブルもなく、順調に各工程を遂行することができることが確認された。 The thin substrate was fixed to the thin substrate fixing jig produced in Example 1 and Example 2, and was subjected to a cream solder printing process using a metal mask. It was confirmed that the FPC was not taken on the metal mask, and the metal mask was not stuck on the adhesive layer and was difficult to remove, so that it could be processed without problems.
Furthermore, even if it is subjected to a component (flip chip) mounting process and a solder reflow process, the FPC is not displaced or peeled off, and also when the FPC after component mounting is peeled off from the weak adhesive layer, It was confirmed that each process can be performed smoothly without problems such as curling and tearing.

本発明により、第二の弱粘着剤層の劣化寿命への対応や、薄型基板の仕様変更への対応が、簡便に即時迅速に行えるようになったので、電子機器製造の分野で非常に望ましい薄型基板固定治具として利用され得る。   According to the present invention, it has become possible to cope with the deterioration life of the second weak pressure-sensitive adhesive layer and the specification change of the thin substrate easily and immediately, which is very desirable in the field of electronic equipment manufacturing. It can be used as a thin substrate fixing jig.

本発明の薄型基板固定治具を示す平面説明図である。It is a plane explanatory view showing a thin substrate fixing jig of the present invention. 本発明の第１の実施の形態における薄型基板固定治具の第１の発明の形態を示す、図１のＸ−Ｘ線に沿う断面説明図である。It is sectional explanatory drawing which follows the XX line of FIG. 1 which shows the form of 1st invention of the thin board | substrate fixing jig in the 1st Embodiment of this invention. 本発明の第２の実施の形態における薄型基板固定治具の第１の発明の形態を示す、図１のＹ−Ｙ線に沿う断面説明図である。It is sectional explanatory drawing which follows the YY line of FIG. 1 which shows the form of 1st invention of the thin board | substrate fixing jig in the 2nd Embodiment of this invention. 従来の保持搬送治具を示す説明図で、（イ）は平面図、（ロ）は（イ）のＸ−Ｘ線に沿う部分断面説明図である。It is explanatory drawing which shows the conventional holding | maintenance conveyance jig | tool, (A) is a top view, (B) is fragmentary sectional explanatory drawing which follows the XX line of (A).

符号の説明Explanation of symbols

１：薄型基板固定治具
２：平板
３：弱粘着剤層
４：薄膜
５：弱粘着剤層パターン
６：ネジ止め
７：第二の弱粘着剤層
２０：保持搬送治具
２１：プレート
２２：弱粘着性接着剤
２３：弱粘着性接着剤パターン
２４：（ＦＰＣの）導通部に対応する位置
２５：凹部 1: thin substrate fixing jig 2: flat plate 3: weak adhesive layer 4: thin film 5: weak adhesive layer pattern 6: screwing 7: second weak adhesive layer 20: holding conveyance jig 21: plate 22: Weak adhesive 23: Weak adhesive pattern 24: Position corresponding to the conductive part (of FPC) 25: Recess

Claims (3)

平板と弱粘着剤層が形成された薄膜からなる薄型基板固定治具であって、前記平板上に前記薄膜が着脱自在に固定されていることを特徴とする薄型基板固定治具。   A thin substrate fixing jig comprising a thin film on which a flat plate and a weak adhesive layer are formed, wherein the thin film is detachably fixed on the flat plate. 前記平板と前記薄膜との固定手段が前記平板上に形成された第二の弱粘着剤層によるものである請求項１に記載の薄型基板固定治具。   The thin substrate fixing jig according to claim 1, wherein a fixing means for fixing the flat plate and the thin film is a second weak adhesive layer formed on the flat plate. 前記第二の弱粘着剤層の粘着力が前記弱粘着剤層の粘着力に比べ粘着力がより強いものである請求項２に記載の薄型基板固定治具。   The thin substrate fixing jig according to claim 2, wherein an adhesive force of the second weak adhesive layer is higher than an adhesive force of the weak adhesive layer.
JP2003417659A 2003-12-16 2003-12-16 Thin substrate fixing jig Pending JP2005183424A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027411A (en) * 2005-07-15 2007-02-01 Shin Etsu Polymer Co Ltd Fixed carrier for wiring board
JP2008244046A (en) * 2007-03-27 2008-10-09 Shin Etsu Polymer Co Ltd Elastic member, holding tool, set of holding tools, and compact component holder
JP2010045086A (en) * 2008-08-11 2010-02-25 Shin Etsu Polymer Co Ltd Holding jig
JP2013138152A (en) * 2011-12-28 2013-07-11 Toshin Sangyo Co Ltd Transfer jig, transfer method, and transfer jig material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027411A (en) * 2005-07-15 2007-02-01 Shin Etsu Polymer Co Ltd Fixed carrier for wiring board
JP4703297B2 (en) * 2005-07-15 2011-06-15 信越ポリマー株式会社 Fixed carrier for circuit boards
JP2008244046A (en) * 2007-03-27 2008-10-09 Shin Etsu Polymer Co Ltd Elastic member, holding tool, set of holding tools, and compact component holder
JP2010045086A (en) * 2008-08-11 2010-02-25 Shin Etsu Polymer Co Ltd Holding jig
JP2013138152A (en) * 2011-12-28 2013-07-11 Toshin Sangyo Co Ltd Transfer jig, transfer method, and transfer jig material

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