JP2005161416A - 搬送ロボット - Google Patents
搬送ロボット Download PDFInfo
- Publication number
- JP2005161416A JP2005161416A JP2003399684A JP2003399684A JP2005161416A JP 2005161416 A JP2005161416 A JP 2005161416A JP 2003399684 A JP2003399684 A JP 2003399684A JP 2003399684 A JP2003399684 A JP 2003399684A JP 2005161416 A JP2005161416 A JP 2005161416A
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- 238000012546 transfer Methods 0.000 title claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
- B25J9/009—Programme-controlled manipulators comprising a plurality of manipulators being mechanically linked with one another at their distal ends
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
- Y10T74/20305—Robotic arm
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 垂直状の旋回軸L0周りに回転可能な旋回ベース110と、板状ワークWを載置保持可能なハンド300A,300Bと、上記ハンド300A,300Bを支持するとともに上記旋回ベース110に設置され、上記ハンド300A,300Bを所定の水平直線状移動行程Trに沿って前進・後退移動可能な直線移動機構200A,200Bと、を備えた搬送ロボットであって、上記ハンド300A,300Bには、ワークWにおけるハンド移動方向前方側の縁を係止する係止部312が設けられている一方、上記旋回ベース110には、ワークWを載置したハンド300A,300Bがその移動行程の後退位置をとるとき、ワークWにおけるハンド移動方向後方側の縁に当接するワーク保持部400が設けられている。
【選択図】 図2
Description
上記ハンドには、ワークにおけるハンド移動方向前方側の縁を係止する係止部が設けられている一方、
上記旋回ベースには、ワークを載置したハンドがその移動行程の後退位置をとるとき、ワークにおけるハンド移動方向後方側の縁に当接するワーク保持部が設けられていることを特徴としている。
110 旋回ベース
200A,200B 直線移動機構
210 第1アーム
220 第2アーム
231 第1プーリ
232 第2プーリ
233 第3プーリ
234 第4プーリ
240 無端ベルト
250 無端ベルト
300A,300B ハンド
305 ブラケット
310,320 ブロック片
311,321 載置面
312,322 係止部
330 板バネ
331 切り込み
400 ワーク保持部
410 板バネ
L0 旋回軸
L1 第1軸
L2 第2軸
L3 第3軸
L4 第4軸
Tr 直線状移動行程
Claims (8)
- 垂直状の旋回軸周りに回転可能な旋回ベースと、板状ワークを載置保持可能なハンドと、上記ハンドを支持するとともに上記旋回ベースに設置され、上記ハンドを所定の水平直線状移動行程に沿って前進・後退移動可能な直線移動機構と、を備えた搬送ロボットであって、
上記ハンドには、ワークにおけるハンド移動方向前方側の縁を係止する係止部が設けられている一方、
上記旋回ベースには、ワークを載置したハンドがその移動行程の後退位置をとるとき、ワークにおけるハンド移動方向後方側の縁に当接するワーク保持部が設けられていることを特徴とする、搬送ロボット。 - 上記ハンドにおける係止部は、上記ハンドに対して固定状に設けられている一方、上記ワーク保持部は、自然状態から弾性的に後退可能に設けられている、請求項1に記載の搬送ロボット。
- 上記ワーク保持部は、下端が旋回ベース上に連結され、水平断面の長軸がハンド移動方向に対して直交する起立状の板バネの上端に連結されている、請求項2に記載の搬送ロボット。
- 上記ハンドにおける係止部は、自然状態から弾性的に前進可能に設けられている一方、上記ワーク保持部は、固定状に設けられている、請求項1に記載の搬送ロボット。
- 上記ハンドには、ワークにおけるハンド移動方向後方側の縁を係止する固定状の第2の係止部がさらに設けられている、請求項2ないし4のいずれかに記載の搬送ロボット。
- 上記第2の係止部は、ハンドの幅方向に離間して2箇所に設けられている一方、上記ハンドには、上記2箇所の第2の係止部間において、上記ワーク保持部が進入しうる切り込みが設けられている、請求項5に記載の搬送ロボット。
- 上記ハンドは、円形板状ワークを載置保持できる形態を有している、請求項1ないし6のいずれかに記載の搬送ロボット。
- 上記直線移動機構、これに支持されるハンド、このハンドに設けられる上記係止部、および、上記ワーク保持部からなるセットは、上記旋回軸に対して点対称をなすように2セット設けられており、各セットにおけるハンドの直線移動行程は、同一直線上に位置するように構成されている、請求項1ないし7のいずれかに記載の搬送ロボット。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003399684A JP4262064B2 (ja) | 2003-11-28 | 2003-11-28 | 搬送ロボット |
US10/999,307 US7114907B2 (en) | 2003-11-28 | 2004-11-29 | Transfer robot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003399684A JP4262064B2 (ja) | 2003-11-28 | 2003-11-28 | 搬送ロボット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005161416A true JP2005161416A (ja) | 2005-06-23 |
JP2005161416A5 JP2005161416A5 (ja) | 2006-11-24 |
JP4262064B2 JP4262064B2 (ja) | 2009-05-13 |
Family
ID=34616620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003399684A Expired - Fee Related JP4262064B2 (ja) | 2003-11-28 | 2003-11-28 | 搬送ロボット |
Country Status (2)
Country | Link |
---|---|
US (1) | US7114907B2 (ja) |
JP (1) | JP4262064B2 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010069559A (ja) * | 2008-09-17 | 2010-04-02 | Ulvac Japan Ltd | 搬送装置及び真空装置 |
CN101293348B (zh) * | 2007-04-27 | 2012-10-17 | 日本电产三协株式会社 | 工业用机器人和集合处理装置 |
WO2015098153A1 (ja) * | 2013-12-26 | 2015-07-02 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
JP2016505219A (ja) * | 2013-01-18 | 2016-02-18 | パーシモン テクノロジーズ コーポレイションPersimmon Technologies, Corp. | 不等リンク長を有するアームを有するロボット |
US9840004B2 (en) | 2013-01-18 | 2017-12-12 | Persimmon Technologies Corporation | Robot having arm with unequal link lengths and non-circular pulley |
US10950484B2 (en) | 2013-01-18 | 2021-03-16 | Persimmon Technologies Corporation | Robot having arm with unequal link lengths |
CN113601482A (zh) * | 2015-02-06 | 2021-11-05 | 柿子技术公司 | 具有不等连杆长度臂的机器人 |
US11691268B2 (en) | 2015-03-12 | 2023-07-04 | Persimmon Technologies Corporation | Robot having a variable transmission ratio |
Families Citing this family (21)
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JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
WO2007105310A1 (ja) * | 2006-03-14 | 2007-09-20 | Hirata Corporation | 移載ロボット |
JP4694436B2 (ja) * | 2006-07-28 | 2011-06-08 | 株式会社ダイヘン | 搬送ロボット |
US9117859B2 (en) * | 2006-08-31 | 2015-08-25 | Brooks Automation, Inc. | Compact processing apparatus |
USRE44567E1 (en) * | 2009-11-17 | 2013-11-05 | Ulvac, Inc. | Vacuum transfer robot |
USRE43781E1 (en) * | 2009-11-17 | 2012-11-06 | Ulvac, Inc. | Vacuum transfer robot |
USD639323S1 (en) * | 2010-05-06 | 2011-06-07 | Ulvac, Inc. | Vacuum transfer robot |
USD625748S1 (en) * | 2010-05-06 | 2010-10-19 | Ulvac, Inc. | Vacuum transfer robot |
JP6059156B2 (ja) | 2011-03-11 | 2017-01-11 | ブルックス オートメーション インコーポレイテッド | 基板処理ツール |
CN104380452B (zh) * | 2012-04-12 | 2016-10-19 | 应用材料公司 | 具有独立能旋转机身中段的机械手***、设备及方法 |
DE102012216632A1 (de) | 2012-09-18 | 2014-03-20 | Trumpf Laser Gmbh + Co. Kg | Bearbeitungsmaschine und Verfahren zum Bearbeiten eines Werkstücks |
US10692765B2 (en) * | 2014-11-07 | 2020-06-23 | Applied Materials, Inc. | Transfer arm for film frame substrate handling during plasma singulation of wafers |
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US10099377B2 (en) * | 2016-06-29 | 2018-10-16 | Applied Materials, Inc. | Methods and systems providing misalignment correction in robots |
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JP2000040728A (ja) * | 1998-07-22 | 2000-02-08 | Nippon Asm Kk | ウェハ搬送機構 |
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JP2003142572A (ja) | 2001-11-01 | 2003-05-16 | Kondo Seisakusho:Kk | ウエハ搬送用ハンド |
-
2003
- 2003-11-28 JP JP2003399684A patent/JP4262064B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-29 US US10/999,307 patent/US7114907B2/en active Active
Cited By (18)
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CN101293348B (zh) * | 2007-04-27 | 2012-10-17 | 日本电产三协株式会社 | 工业用机器人和集合处理装置 |
JP2010069559A (ja) * | 2008-09-17 | 2010-04-02 | Ulvac Japan Ltd | 搬送装置及び真空装置 |
US11491640B2 (en) | 2013-01-18 | 2022-11-08 | Persimmon Technologies Corporation | Robot having arm with offset |
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JP2016505219A (ja) * | 2013-01-18 | 2016-02-18 | パーシモン テクノロジーズ コーポレイションPersimmon Technologies, Corp. | 不等リンク長を有するアームを有するロボット |
US9840004B2 (en) | 2013-01-18 | 2017-12-12 | Persimmon Technologies Corporation | Robot having arm with unequal link lengths and non-circular pulley |
US9889557B2 (en) | 2013-01-18 | 2018-02-13 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
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JPWO2015098153A1 (ja) * | 2013-12-26 | 2017-03-23 | 川崎重工業株式会社 | エンドエフェクタおよび基板搬送ロボット |
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CN113601482A (zh) * | 2015-02-06 | 2021-11-05 | 柿子技术公司 | 具有不等连杆长度臂的机器人 |
CN113601482B (zh) * | 2015-02-06 | 2024-04-26 | 柿子技术公司 | 具有不等连杆长度臂的机器人 |
US11691268B2 (en) | 2015-03-12 | 2023-07-04 | Persimmon Technologies Corporation | Robot having a variable transmission ratio |
Also Published As
Publication number | Publication date |
---|---|
JP4262064B2 (ja) | 2009-05-13 |
US20050118010A1 (en) | 2005-06-02 |
US7114907B2 (en) | 2006-10-03 |
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