JP2005158856A - Method of transferring laminate and jig board for transfer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig board for transfer which has chemical resistance and can easily be attached and detached to a substrate which is a workpiece, and also to provide a method of transferring a laminate which can prevent faults such as a substrate being caught inside a conveyor inside the equipment, by using the jig board for transfer. <P>SOLUTION: In the method of transferring the laminate by means of the conveyor using a foregoing board, the jig board for transfer which is used as the foregoing board for the laminate is cut out, at least in one side. The laminate is transferred in a pinched manner with the cut-out portion of the jig board for transfer. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、積層板の搬送方法及び積層板の搬送用治具板に関する。   The present invention relates to a method for conveying a laminated plate and a jig plate for conveying the laminated plate.

印刷配線板又は銅張積層板の現像、エッチング、剥離などの回路加工処理は、槽内の搬送をコンベアによる水平搬送方式で行なっている。   Circuit processing such as development, etching, and peeling of a printed wiring board or copper clad laminate is carried out in a tank by a horizontal conveyance method using a conveyor.

印刷配線板又は銅張積層板の被処理体は、基板厚み（基材層厚み＋銅箔厚みをいう）が０．１０ｍｍｔから１．０ｍｍｔと厚み範囲が広い。特に基板厚みが０．１０ｍｍｔから０．２０ｍｍｔの基板の回路加工処理は、基板の銅箔がエッチング除去されることにより、基板の表裏の銅箔面積に差が生じることや基材層が薄くなることにより、基板の反りが大きくなる。その為にエッチング槽、剥離槽や水洗槽内の搬送コンベアロールに基板先端の反った部分が追突し、上面ロールに乗り上げ、基板のひっかかりが発生し、その装置内で基板が停滞し、基板折れや破壊等の不具合が発生している。   The substrate of the printed wiring board or the copper clad laminate has a wide substrate thickness range (referred to as base material layer thickness + copper foil thickness) of 0.10 mmt to 1.0 mmt. In particular, in circuit processing of a substrate having a substrate thickness of 0.10 mmt to 0.20 mmt, the copper foil of the substrate is etched away, thereby causing a difference in the copper foil areas on the front and back of the substrate and making the base material layer thin. As a result, the warpage of the substrate increases. Therefore, the warped part of the substrate collides with the transfer conveyor roll in the etching tank, peeling tank, and washing tank, climbs onto the upper surface roll, and the substrate is caught. Or a defect such as destruction has occurred.

その不具合を防止する為にエッチング槽内や剥離槽内への基板投入前に一時的に装置から基板を抜き出し、被処理体である基板先端に先行板（被処理体をテープで止め、基板の案内板をする板）を取り付けてから、再度、エッチング槽や剥離槽に投入する方法が一般的に用いられる。   In order to prevent such problems, the substrate is temporarily removed from the apparatus before the substrate is put into the etching tank or the peeling tank, and a leading plate (the object to be processed is taped to the substrate to be processed). A method is generally used in which a guide plate is attached, and then charged again into an etching tank or a peeling tank.

また、プリント配線板をコンベア設備で搬送しながら処理する場合に、コンベア設備のシャフト間へ、プリント配線板が巻きこまれるのを防止するため、配線板用基板の４つのコーナーのうち少なくとも進行方向にある２つのコーナー部を直線または円弧に切り落とす方法も開示されている（例えば特許文献１参照）。
特開平０５−１５２７９１号 In order to prevent the printed wiring board from being caught between the shafts of the conveyor equipment when the printed wiring board is processed while being conveyed by the conveyor equipment, at least in the traveling direction of the four corners of the wiring board substrate. A method of cutting off two corners into a straight line or an arc is also disclosed (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 05-152791

先行板をテープ等で取付ける場合、テープのカッテング、テープの貼り付けによる被処理体に対する先行板の取り付け、及びエッチング作業後の取り外しなどに、比較的時間を要し、またその作業スペースも特別に確保しなけばならないなど、作業工程の効率化の点では、好ましいことではない。また、先行板をテープ等で取付ける場合、取付けたテープなどから、液ダレが生じ、基板を汚染することがある。また、印刷配線板のコーナーを切り落とす方法も、印刷配線板の処理工程が増え、好ましくない。   When attaching the leading plate with tape, it takes a relatively long time to cut the tape, attach the leading plate to the workpiece by attaching the tape, and remove it after the etching work. It is not preferable in terms of improving the efficiency of the work process such as having to ensure it. In addition, when the preceding plate is attached with a tape or the like, dripping may occur from the attached tape or the like, and the substrate may be contaminated. Also, the method of cutting off the corners of the printed wiring board is not preferable because the number of processing steps for the printed wiring board increases.

また、先行板を取り付けず、被処理体のみを搬送コンベアに流すと、前述したように、基板の引っかかりや基板先端の角折れが発生する。   Further, if only the object to be processed is flowed to the conveyor without attaching the preceding plate, as described above, the substrate is caught or the substrate tip is bent.

本発明は、こうした問題点を解消するため、被処理体である基板への着脱が容易な搬送用治具板及び、搬送用治具板を用いることにより装置内搬送コンベア内での基板のひっかかりなどの不具合の発生のない積層板の搬送方法を提供することを目的とする。   In order to solve such problems, the present invention uses a transport jig plate that can be easily attached to and detached from a substrate, which is the object to be processed, and a substrate trap in the transport conveyor in the apparatus by using the transport jig plate. An object of the present invention is to provide a method for transporting a laminated board that does not cause problems such as the above.

本発明は、以下に記載の各事項に関する。
（１）先行板を用い積層板をコンベア装置で搬送する方法において、積層板の先行板として用いる搬送用治具板の少なくとも1辺を切り抜き加工し、積層板を搬送用治具板の切り抜き加工した部分で挟み込み搬送することを特徴とする積層板の搬送方法。
（２）搬送用治具板が、積層板に対し着脱可能であり、かつ、耐薬品性を有していることを特徴とする（１）に記載の積層板の搬送方法。
（３）積層板の搬送用治具板において、積層板を着脱自在に挟み込むように搬送用治具板の少なくとも1辺に切り抜き加工が施され、かつ、耐薬品性を有している積層板の搬送用治具板。 The present invention relates to each item described below.
(1) In a method of transporting a laminated plate using a preceding plate using a conveyor device, at least one side of a conveying jig plate used as a preceding plate of the laminated plate is cut out, and the laminated plate is cut out of the conveying jig plate A method for transporting a laminated board, wherein the sandwiched part is sandwiched and transported.
(2) The method for transporting a laminated board according to (1), wherein the transport jig plate is detachable from the laminated board and has chemical resistance.
(3) Laminate board having a chemical resistance in at least one side of the transport jig plate so as to detachably sandwich the laminate board in the transport jig plate of the laminate board Jig plate for conveyance.

被処理体である基板を本発明の搬送用治具板で挟み込み、回路加工処理設備に基板を流すことにより、搬送用治具板が基板から外れることなく、装置内搬送コンベアでの基板のひっかかりや角折れもなく、安定した品質の回路加工処理基板が得られる。   The substrate, which is the object to be processed, is sandwiched between the transfer jig plates of the present invention, and the substrate is flown through the circuit processing equipment, so that the transfer jig plate is caught on the transfer conveyor in the apparatus without being detached from the substrate. A stable quality circuit processing substrate can be obtained without any breakage.

本発明の搬送用治具板とは、積層板を装置内搬送コンベアで搬送し、回路加工処理する場合に、積層板先端に取付ける先行板のことである。本発明における積層板としては、印刷配線板、銅張積層板あるいは、配線回路が形成される前の樹脂板などが、挙げられる。また、積層板の厚みは、特に規定されないが、厚みが０．０１〜０．３０ｍｍ、さらには０．０３〜０．２０ｍｍ、特に０．０５〜０．１０ｍｍの積層板に適している。   The conveying jig plate of the present invention is a preceding plate that is attached to the leading end of the laminated plate when the laminated plate is conveyed by an in-device conveying conveyor and subjected to circuit processing. As a laminated board in this invention, a printed wiring board, a copper clad laminated board, a resin board before a wiring circuit is formed, etc. are mentioned. Further, the thickness of the laminate is not particularly specified, but is suitable for a laminate having a thickness of 0.01 to 0.30 mm, further 0.03 to 0.20 mm, and particularly 0.05 to 0.10 mm.

本発明の搬送用治具板は、耐薬品性を有していることが好ましい。エッチング、デスミア、めっきなどの配線板の製造工程に用いられる一般的な薬品に耐えられるならば、搬送用治具板の材質は問わない。搬送用治具板としては、樹脂板、セラミック板あるいは、金属板が挙げられる。また、耐薬品性と加工性などから、チタン、ニッケル，ステンレスなどの金属板が好ましく、チタンがより好ましい。なお、前記樹脂板に使用する樹脂成分、又はゴム成分の例としては、エポキシ樹脂、ポリアミドイミド樹脂、シリコーン樹脂、フェノール樹脂、ポリイミド樹脂、フッ素系樹脂、ポリフェニレンスルフィド樹脂、ビスマレイミドトリアジン樹脂、アクリル樹脂、ポリカーボネイト樹脂、ポリブチレンテレフタレート樹脂、ポリプロピレン樹脂、アクリルエポキシ樹脂、アクリロニトリル−ブタジエン−スチレン樹脂、エチレン、プロピレン、スチレン、ブタジエン、フッ素系ゴム、エチレンプロピレンターポリマーゴム、ビニルメチルシリコーンゴムなどが挙げられる。   The conveying jig plate of the present invention preferably has chemical resistance. Any material can be used for the transfer jig plate as long as it can withstand common chemicals used in the manufacturing process of the wiring board such as etching, desmear, and plating. Examples of the conveying jig plate include a resin plate, a ceramic plate, and a metal plate. Further, from the viewpoint of chemical resistance and workability, a metal plate such as titanium, nickel, and stainless steel is preferable, and titanium is more preferable. Examples of the resin component or rubber component used for the resin plate include epoxy resin, polyamideimide resin, silicone resin, phenol resin, polyimide resin, fluorine resin, polyphenylene sulfide resin, bismaleimide triazine resin, acrylic resin. Polycarbonate resin, polybutylene terephthalate resin, polypropylene resin, acrylic epoxy resin, acrylonitrile-butadiene-styrene resin, ethylene, propylene, styrene, butadiene, fluorine rubber, ethylene propylene terpolymer rubber, vinyl methyl silicone rubber and the like.

本発明の搬送用治具板の厚みは、特に限定されないが、搬送される積層板の厚み、及び搬送用治具板の材質により、決定することが好ましい。搬送される積層板の厚みが、０．０１〜０．５０ｍｍであり、搬送用治具板が、チタン、ニッケル，ステンレスなどの金属板であれば、搬送用治具板の厚みは、０．３〜２．０ｍｍが好ましく、０．５〜１．０ｍｍがより好ましい。   The thickness of the transport jig plate of the present invention is not particularly limited, but is preferably determined according to the thickness of the laminated plate to be transported and the material of the transport jig plate. If the thickness of the laminated plate to be conveyed is 0.01 to 0.50 mm and the conveying jig plate is a metal plate such as titanium, nickel, and stainless steel, the thickness of the conveying jig plate is 0.00. 3 to 2.0 mm is preferable, and 0.5 to 1.0 mm is more preferable.

本発明の搬送用治具板は、少なくとも1辺を切り抜き加工し、積層板を搬送用治具板の切り抜き加工した部分で挟み込むことを特徴としている。従って、積層板に対し着脱可能であること、そして着脱可能が容易であることが、好ましい。そのため、切り抜き加工した部分の形状は、積層板を切り抜き加工した部分で挟み込むことが可能であれば、特に限定しないが、図１に示したように、搬送用治具板１の1辺から突起した半円形状が好ましい。半円形状であれば、積層板の着脱の際、その端部で、積層板を傷つける可能性も低くまた、引っ掛かる可能性も低く、好ましい。また、切り抜き加工した部分の形状が、半円以外の、たとえば三角形状あるいは四角形状であれば、その端部を曲線状にしておくのが好ましい。   The transfer jig plate of the present invention is characterized in that at least one side is cut out and the laminated plate is sandwiched between cut portions of the transfer jig plate. Therefore, it is preferable that it can be attached to and detached from the laminated plate and can be easily attached and detached. Therefore, the shape of the cut-out portion is not particularly limited as long as it can be sandwiched between the cut-out portions of the laminated plate. However, as shown in FIG. A semicircular shape is preferred. The semicircular shape is preferable because the possibility of damaging the laminated plate at the end when the laminated plate is attached and detached is low and the possibility of being caught is low. Moreover, if the shape of the cut-out portion is other than a semicircle, for example, a triangular shape or a quadrangular shape, it is preferable that the end portion be curved.

よって、積層板を挟み込むことが可能な搬送用治具板１とは、搬送用治具板の1辺が、搬送される積層板の1辺の近傍に位置し、その搬送用治具板の1辺から半円形状の切り抜き加工した部分２が突起しており、かつ突起した半円に沿うように半円形状に切り抜き加工してあることが、好ましい。   Therefore, the conveying jig plate 1 that can sandwich the laminated plate is such that one side of the conveying jig plate is located in the vicinity of one side of the laminated plate to be conveyed, It is preferable that a semicircular cut-out portion 2 projects from one side and is cut into a semicircular shape along the projected semicircle.

突起した半円の直径３は、特に限定しないが、８〜５０ｍｍが好ましく、１０〜３０ｍｍがより好ましい。よって、突起した半円の突起の長さ、つまり半径４は、４〜２５ｍｍが好ましく、５〜１５ｍｍがより好ましい。また、半円形状の切り抜きの幅５は、１．０〜２．９ｍｍが好ましく、１．５〜２．０ｍｍがより好ましい。   The diameter 3 of the projected semicircle is not particularly limited, but is preferably 8 to 50 mm, and more preferably 10 to 30 mm. Therefore, the length of the protruding semicircular protrusion, that is, the radius 4, is preferably 4 to 25 mm, and more preferably 5 to 15 mm. Further, the width 5 of the semicircular cutout is preferably 1.0 to 2.9 mm, and more preferably 1.5 to 2.0 mm.

突起した半円の半径４が、４ｍｍ未満では、積層板をその切り抜き加工した部分で保持することができず、積層板が脱落するおそれがある。また、半円形状の切り抜きの幅５が、3．０mm以上では、積層板が薄く、腰が無いと、積層板をその切り抜き加工した部分２で保持することができず、積層板が脱落する。また、切り抜きの幅５を１．０mm未満にすると先行板である搬送用治具板１に積層板を挟み込むことが困難になり、脱落し易い状態になる。   If the radius 4 of the projected semicircle is less than 4 mm, the laminated plate cannot be held at the cut-out portion, and the laminated plate may fall off. If the width 5 of the semicircular cutout is 3.0 mm or more, if the laminated plate is thin and has no waist, the laminated plate cannot be held by the cut-out portion 2 and the laminated plate falls off. . Further, if the cutout width 5 is less than 1.0 mm, it becomes difficult to sandwich the laminated plate in the conveying jig plate 1 which is the preceding plate, and it becomes easy to drop off.

なお、切り抜き加工した部分の数は、搬送用治具板の1辺あたり、特に限定しないが、１〜５個が好ましく、２〜３個がより好ましい。搬送用治具板全体の形状は、長方形が好ましく、またその四辺の寸法は、搬送する積層板の寸法により、決定されることが、好ましい。少なくとも搬送用治具板の切り抜き加工した部分を有する辺の幅は、搬送される積層板の1辺の幅より、０〜４０ｍｍ大きいことが、好ましい。   The number of cut-out parts is not particularly limited per side of the conveying jig plate, but is preferably 1 to 5, more preferably 2 to 3. The overall shape of the conveying jig plate is preferably rectangular, and the dimensions of its four sides are preferably determined by the dimensions of the laminated plate to be conveyed. At least the width of the side having the cut-out portion of the conveying jig plate is preferably 0 to 40 mm larger than the width of one side of the laminated plate to be conveyed.

基材層厚み０．０６ｍｍｔ、銅箔厚み０．０１８ｍｍのガラスエポキシ基材の両面銅張積層板「ＭＣＬ−Ｅ−６７」（日立化成工業株式会社製、商品名）を用い、回路加工処理設備を使用して、回路加工処理（現像、エッチング、剥離）を行なった。図２に示したように、その回路加工処理前に被処理体６である両面銅張積層板を、先行板である本発明の搬送用治具板１（厚み１ｍｍのチタン板、切り抜きの幅は２ｍｍであり直径は１０ｍｍの半円形状の切り抜き加工した部分を２箇所有する）の切り抜き加工した部分２で、挟み込み、固定した。その後、搬送用治具板毎、２０枚を回路加工処理装置に投入し、処理し、基板の不具合（ひっかかり、基板先端の角折れ）の確認を行ない、数量を数えた。また、被処理体への1枚当たりの着脱時間を測定した。結果を表１に示した。   Circuit processing equipment using a glass epoxy base double-sided copper-clad laminate “MCL-E-67” (trade name, manufactured by Hitachi Chemical Co., Ltd.) with a base layer thickness of 0.06 mm and a copper foil thickness of 0.018 mm Was used to carry out circuit processing (development, etching, peeling). As shown in FIG. 2, before the circuit processing, the double-sided copper-clad laminate as the object to be processed 6 is transferred to the jig plate for conveyance 1 of the present invention, which is the preceding plate (a titanium plate having a thickness of 1 mm, the width of the cutout). Is 2 mm and has a diameter of 10 mm and has two semi-circular cut-out portions), and is sandwiched and fixed. Thereafter, 20 pieces of each jig plate for transfer were put into a circuit processing apparatus, processed, and checked for substrate defects (cracking and corner breakage at the tip of the substrate), and the quantity was counted. Moreover, the attachment / detachment time per sheet to the object to be processed was measured. The results are shown in Table 1.

（比較例１）
従来からの先行板を用い、被処理体をテープで２箇所固定した以外は実施例１と同様に、回路加工処理を行ない、実施例１と同様に処理基板の不具合の有無を確認し、数量及び着脱時間を測定した。結果を表１に示した。 (Comparative Example 1)
Circuit processing is performed in the same manner as in Example 1 except that a conventional leading plate is used and the object to be processed is fixed at two locations with tape, and the presence or absence of defects in the processing substrate is confirmed in the same manner as in Example 1. And the detachment time was measured. The results are shown in Table 1.

（比較例２）
先行板である搬送用治具板を用いない以外は実施例１と同様に回路加工処理を行ない、実施例１と同様に処理基板の不具合の有無を確認し、数量を測定した。結果を表１に示した。 (Comparative Example 2)
Circuit processing was performed in the same manner as in Example 1 except that the transport jig plate as the preceding plate was not used, and the presence or absence of defects in the processed substrate was confirmed in the same manner as in Example 1 and the quantity was measured. The results are shown in Table 1.

本発明による搬送用治具板（先行板）を使用することにより、比較例２と比べ、積層板（被処理体）のひっかかり不具合、基板先端の角折れのない、品質の安定した回路加工処理が達成でき、かつ、積層板（被処理体）への先行板取り付け、取り外しといった着脱時間が、比較例１と比べ大幅に短縮できた。   By using the transfer jig plate (preceding plate) according to the present invention, compared with Comparative Example 2, there is no catching trouble of the laminated plate (object to be processed), and there is no corner breakage of the substrate tip, and the circuit processing is stable in quality. In addition, the attaching / detaching time such as attaching / detaching the preceding plate to / from the laminated plate (object to be processed) can be significantly shortened as compared with Comparative Example 1.

本発明の搬送用治具板の切り抜き加工した部分の模式図である。It is a schematic diagram of the cut-out part of the jig plate for conveyance of this invention. 本発明の搬送用治具板を積層板（被処理体）に取り付けた場合の模式図である。It is a schematic diagram at the time of attaching the jig board for conveyance of this invention to a laminated board (to-be-processed object).

符号の説明Explanation of symbols

１・・搬送用治具板（先行板）
２・・半円形状の切り抜き加工した部分
３・・半円形状の切り抜き加工した部分の直径
４・・半円形状の切り抜き加工した部分の半径（突起の長さ）
５・・切り抜きの幅
６・・積層板（被処理体）

1 .. Jig plate for conveyance (preceding plate)
2 .. Semi-circular cut-out part 3.. Diameter of semi-circular cut-out part 4.. Radius of semi-circular cut-out part (projection length)
5. Width of cutout 6. Laminated board (object to be processed)

Claims (3)

先行板を用い積層板をコンベア装置で搬送する方法において、積層板の先行板として用いる搬送用治具板の少なくとも1辺を切り抜き加工し、積層板を搬送用治具板の切り抜き加工した部分で挟み込み搬送することを特徴とする積層板の搬送方法。   In a method of transporting a laminated board with a conveyor device using a preceding plate, at least one side of a conveying jig plate used as a preceding plate of the laminated plate is cut out, and the laminated plate is cut out of the conveying jig plate A method of transporting a laminated board, characterized in that it is sandwiched and transported. 搬送用治具板が、積層板に対し着脱可能であり、かつ、耐薬品性を有していることを特徴とする請求項１に記載の積層板の搬送方法。   The method for transporting a laminated board according to claim 1, wherein the jig plate for transportation is detachable from the laminated board and has chemical resistance. 積層板の搬送用治具板において、積層板を着脱自在に挟み込むように搬送用治具板の少なくとも1辺に切り抜き加工が施され、かつ、耐薬品性を有している積層板の搬送用治具板。

For transporting laminate boards that have chemical resistance and are cut out on at least one side of the transport jig board so that the laminate board is detachably sandwiched. Jig plate.

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