JP2005134284A - Visual inspection method and visual inspection system for tape carrier for semiconductor device - Google Patents

Visual inspection method and visual inspection system for tape carrier for semiconductor device Download PDF

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JP2005134284A
JP2005134284A JP2003371856A JP2003371856A JP2005134284A JP 2005134284 A JP2005134284 A JP 2005134284A JP 2003371856 A JP2003371856 A JP 2003371856A JP 2003371856 A JP2003371856 A JP 2003371856A JP 2005134284 A JP2005134284 A JP 2005134284A
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tape
wiring pattern
inspection apparatus
visual inspection
photoresist
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Toshibumi Yamazaki
俊文 山崎
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a visual inspection method and a visual inspection device for a tape carrier for a semiconductor device executing visual inspection on a line of a production process, without increasing the number of workers and an in-process inventory. <P>SOLUTION: A photoresist is applied on a conductive layer 14 in a three-layer material provided with the conductive layer 14 via an adhesive layer 12 on a tape base material 13, or a two-layer material with no adhesive layer 12, a wiring pattern 15 is formed thereafter through light exposure, development, etching and photoresist separation processes, an image recognition part 3 for an optical type automatic visual inspection device is provided in a downstream of the photoresist separation process 6 in the production line, in the production line for winding a tape material 2 formed with the wiring pattern, a shape of of the wiring pattern of the tape material 2 is read as a two-dimensional image in the image recognition part 3 to be compared with a master pattern, and the presence of a defect in the wiring pattern is visually inspected optically and automatically. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ＴＡＢ、ＢＧＡ、ＣＯＦテープ材に代表される半導体装置用テープキャリアにおける配線パターンの欠陥の有無を自動で検査する外観検査方法および外観検査装置に係り、詳しくは製造ラインに影響を与えずに外観検査を行う技術に関するものである。   The present invention relates to an appearance inspection method and an appearance inspection apparatus for automatically inspecting the presence or absence of a wiring pattern defect in a tape carrier for a semiconductor device represented by TAB, BGA, and COF tape materials, and specifically affects a production line. It is related with the technique which performs an external appearance inspection.

ＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）、ＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）、ＣＯＦ（Ｃｈｉｐ Ｏｎ Ｆｉｌｍ）テープ材に代表される半導体装置用テープキャリアは、一般的に次のような製造方法で製造される。図２および図３を用いて以下に説明する。   A tape carrier for a semiconductor device represented by TAB (Tape Automated Bonding), BGA (Ball Grid Array), and COF (Chip On Film) tape material is generally manufactured by the following manufacturing method. This will be described below with reference to FIGS.

図２（ａ）に示すように、接着剤層１２が形成されたテープ基材１３に接着剤層１２を介して導体層１４をラミネートした後、加熱処理により接着剤層１２を硬化させる。通常このようにテープ基材に接着剤を介して銅箔を接合した３層構造（三層基材）であることが多いが、最近では接着剤層を省略した２層構造（二層基材）のものもある。ここで、テープ基材１３にはポリイミドフィルムが用いられ、導体層１４には銅箔が用いられるのが一般的である。   As shown in FIG. 2A, after the conductor layer 14 is laminated on the tape base material 13 on which the adhesive layer 12 is formed via the adhesive layer 12, the adhesive layer 12 is cured by heat treatment. Usually, it is often a three-layer structure (three-layer substrate) in which a copper foil is bonded to a tape substrate via an adhesive in this way, but recently, a two-layer structure (two-layer substrate) in which the adhesive layer is omitted. ) Is also available. Here, a polyimide film is generally used for the tape substrate 13, and a copper foil is generally used for the conductor layer 14.

続いて導体層１４の上に感光性レジスト（フォトレジスト）を塗布したのち、露光、現像、エッチング、フォトレジスト剥離の各工程を経て、図２（ｂ）の如く配線パターン（回路）１５が形成される。   Subsequently, after a photosensitive resist (photoresist) is applied on the conductor layer 14, a wiring pattern (circuit) 15 is formed as shown in FIG. 2B through the steps of exposure, development, etching, and photoresist stripping. Is done.

更に、図２（ｃ）に示すように、回路上の所望のエリアにソルダーレジストに代表される絶縁層１６を形成するなどした後、金、銀、スズめっき等の表面処理層１７が施され、半導体装置用テープキャリア例えばＴＡＢテープ２の完成となる。   Further, as shown in FIG. 2C, after forming an insulating layer 16 typified by a solder resist in a desired area on the circuit, a surface treatment layer 17 such as gold, silver or tin plating is applied. Then, the tape carrier for semiconductor device, for example, the TAB tape 2 is completed.

そして、一つのＴＡＢテープ２には、上記のような構造の部分（ピース）が多数連続的に配設される。   A single TAB tape 2 is continuously provided with a large number of pieces (pieces) having the above structure.

ここで、最近では、前述の手順で製造される半導体装置用テープキャリアの品質保証のため、光学式自動外観検査装置（ＡＯＩ：Ａｕｔｏｍａｔｉｃ Ｏｐｔｉｃａｌ Ｉｎｓｐｅｃｔｉｏｎ）により各ピースの配線パターンの回路形状の確認を行うのが一般的となってきた（例えば、特許文献１参照）。   Here, recently, in order to assure the quality of the tape carrier for semiconductor devices manufactured by the above-described procedure, the circuit shape of the wiring pattern of each piece is confirmed by an optical automatic visual inspection device (AOI). Has become common (see, for example, Patent Document 1).

ＴＡＢテープの配線パターンの自動外観検査装置の概略図を図３に示す。   FIG. 3 shows a schematic diagram of an automatic visual inspection apparatus for a TAB tape wiring pattern.

送出し機１側から送り出され巻取り機５で巻き取られるＴＡＢテープ２に対し、その各ピースの配線パターンをＣＣＤカメラ３で取り込み、欠陥の有無検査を行い、検査結果が不良（ＮＧ）となった製品である不良ピース（ＮＧピース）に、インラインで設置されている不良マーキング装置（ＮＧマークユニット）４にて、所定の位置に自動で不良マーク（ＮＧマーク）を付け、巻取り機５側にて巻き取る。そして、ＴＡＢテープ２は巻き取られた状態で次工程に送られる。   For the TAB tape 2 sent out from the delivery machine 1 side and taken up by the take-up machine 5, the wiring pattern of each piece is captured by the CCD camera 3, the presence or absence of the defect is inspected, and the inspection result is NG (NG). The defective piece (NG piece), which is a product, is automatically marked with a defective mark (NG mark) at a predetermined position by a defective marking device (NG mark unit) 4 installed in-line. Wind up on the side. Then, the TAB tape 2 is sent to the next process in a wound state.

このように自動外観検査は通常オフラインにて作業を行っている。そして通常オフラインにて作業を行っている自動外観検査装置には専用のオペレーターが存在し、前工程であるフォトレジスト剥離工程から送られた製品（ＴＡＢテープ）をセットし、自動で検査し終了した製品を、次工程のソルダーレジスト塗布工程に送る作業がある。
特開２００３−８６６３７号公報 As described above, the automatic visual inspection is usually performed offline. And there is a dedicated operator in the automatic visual inspection equipment that usually works offline, set the product (TAB tape) sent from the photoresist stripping process, which was the previous process, and automatically inspected and finished There is work to send the product to the next solder resist coating process.
JP 2003-86637 A

しかしながら、上記のようにオフラインによる外観検査の場合、前工程から送られてきた製品をセットする専用のオペレーターが存在するため、その人員分のコストが掛かる。また、装置の稼働率を上げるために常に装置の作業能力以上の在庫を準備しておかなければ作業者が遊んでしまうこととなる為、製品の仕掛かり在庫量が増えてしまう。さらにまた、在庫を置くことにより、製造から検査までのタクトタイムが掛かり、その間に発生している不良に気づかずに大量不良を発生させる恐れがある。   However, in the case of an offline visual inspection as described above, there is a dedicated operator for setting the product sent from the previous process, so that the cost for the personnel is increased. Further, if an inventory exceeding the working capacity of the apparatus is not always prepared in order to increase the operating rate of the apparatus, the worker will be idle, and the in-process inventory amount of the product increases. Furthermore, the stocking takes a tact time from manufacture to inspection, and there is a risk of generating a large number of defects without noticing the defects occurring during that time.

そこで、本発明の目的は、上記課題を解決し、作業人員や仕掛在庫を増やすことなく、半導体装置用テープキャリアの製造工程ライン中で外観検査が実施できるようにした半導体装置用テープキャリアの外観検査方法および外観検査装置を提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems and to provide an appearance of a semiconductor device tape carrier that can be subjected to an appearance inspection in the manufacturing process line of the semiconductor device tape carrier without increasing the number of workers and in-process inventory. An object is to provide an inspection method and an appearance inspection apparatus.

上記目的を達成するため、本発明は、次のように構成したものである。   In order to achieve the above object, the present invention is configured as follows.

請求項１の発明に係る半導体装置用テープキャリアの外観検査方法は、テープ基材に接着剤層を介して導体層を設けた三層材又は接着剤層を省略した二層材における導体層の上にフォトレジストを塗布したのち、露光、現像、エッチング、フォトレジスト剥離の各工程を経て配線パターンを形成し、その配線パターンを形成したテープ材を巻き取る製造ラインに対し、上記製造ライン中のフォトレジスト剥離工程の後に光学式自動外観検査装置の画像認識部を設け、該画像認識部でテープ材の配線パターンの形状を２次元画像として取り込み、マスターパターンと比較することで、配線パターンの欠陥の有無を光学式に自動外観検査することを特徴とする。   According to a first aspect of the present invention, there is provided a method for inspecting a semiconductor device tape carrier comprising: a three-layer material in which a conductor layer is provided on a tape base material via an adhesive layer; After applying the photoresist on top, the wiring pattern is formed through the steps of exposure, development, etching, and photoresist stripping, and the manufacturing line for winding the tape material on which the wiring pattern is formed, By providing an image recognition unit of an optical automatic visual inspection device after the photoresist peeling process, the image recognition unit captures the shape of the wiring pattern of the tape material as a two-dimensional image, and compares it with the master pattern. It is characterized by optical appearance inspection automatically.

請求項２の発明に係る半導体装置用テープキャリアの外観検査装置は、テープ基材に接着剤層を介して導体層を設けた三層材又は接着剤層を省略した二層材における導体層の上にフォトレジストを塗布したのち、露光、現像、エッチング、フォトレジスト剥離の各工程を経て配線パターンを形成し、その配線パターンを形成したテープ材を巻き取る製造ラインに対し、上記製造ライン中のフォトレジスト剥離工程の後に光学式自動外観検査装置の画像認識部を設け、該画像認識部でテープ材の配線パターンの形状を２次元画像として取り込み、マスターパターンと比較することで、配線パターンの欠陥の有無を光学式に自動外観検査することを特徴とする。   The appearance inspection apparatus for a tape carrier for a semiconductor device according to the invention of claim 2 is a three-layer material in which a conductor layer is provided on a tape substrate via an adhesive layer, or a conductor layer in a two-layer material in which an adhesive layer is omitted. After applying the photoresist on top, the wiring pattern is formed through the steps of exposure, development, etching, and photoresist stripping, and the manufacturing line for winding the tape material on which the wiring pattern is formed, By providing an image recognition unit of an optical automatic visual inspection device after the photoresist peeling process, the image recognition unit captures the shape of the wiring pattern of the tape material as a two-dimensional image, and compares it with the master pattern. It is characterized by optical appearance inspection automatically.

請求項３の発明は、請求項２記載の半導体装置用テープキャリアの外観検査装置において、上記フォトレジスト剥離工程とそれ以降のテープ材搬送工程との間に、両者間の速度差を吸収するバッファーとして作用するアキュムレーターを設けたことを特徴とする。   According to a third aspect of the present invention, there is provided a visual inspection apparatus for a tape carrier for a semiconductor device according to the second aspect, wherein the buffer absorbs the speed difference between the photoresist peeling step and the subsequent tape material conveying step. It is characterized by providing an accumulator that acts as

請求項４の発明は、請求項３記載の半導体装置用テープキャリアの外観検査装置において、上記光学式自動外観検査装置の画像認識部を、上記アキュムレーターより下流のテープ材搬送工程中に設けたことを特徴とする。   According to a fourth aspect of the present invention, in the visual inspection apparatus for a semiconductor device tape carrier according to the third aspect, the image recognition unit of the optical automatic visual inspection apparatus is provided in the tape material transporting process downstream from the accumulator. It is characterized by that.

請求項５の発明は、請求項２〜４のいずれかに記載の半導体装置用テープキャリアの外観検査装置において、上記光学式自動外観検査装置が、検査を行った判定結果である、欠陥画像、欠陥マップデータ、欠陥内訳モードとカウント数等を集計できる機能を備えることを特徴とする。   According to a fifth aspect of the present invention, in the visual inspection apparatus for a semiconductor device tape carrier according to any one of the second to fourth aspects, the optical automatic visual inspection apparatus is a determination result obtained by performing an inspection, The present invention is characterized in that it has a function of counting defect map data, defect breakdown modes, count numbers, and the like.

本発明によれば、次のような優れた効果が得られる。   According to the present invention, the following excellent effects can be obtained.

本発明の半導体装置用テープキャリアの外観検査方法および外観検査装置では、製造ライン中のフォトレジスト剥離工程の後に光学式自動外観検査装置の画像認識部を設け、該画像認識部でテープ材の配線パターンの形状を２次元画像として取り込み、マスターパターンと比較することで、配線パターンの欠陥の有無を光学的に自動外観検査する。従って、本発明によれば、従来のオフライン検査と異なり、製造ライン作業と同時に検査を行うインライン検査が行われる為、オフラインで検査する場合に必要な専用オペレーターの人件費や、運搬時間、運搬人員のロス、仕掛かり在庫が無くなり、大幅なコスト削減が図れる。   In the visual inspection method and visual inspection device for a tape carrier for a semiconductor device according to the present invention, an image recognition unit of an optical automatic visual inspection device is provided after the photoresist peeling step in the production line, and the wiring of the tape material is provided in the image recognition unit. A pattern shape is captured as a two-dimensional image and compared with a master pattern, thereby automatically and visually inspecting the presence or absence of a defect in the wiring pattern. Therefore, according to the present invention, unlike the conventional off-line inspection, in-line inspection is performed simultaneously with the production line operation, so that the labor cost of the dedicated operator, the transportation time, and the transportation personnel required for the off-line inspection are performed. Loss and in-process inventory are eliminated, and significant cost reductions can be achieved.

またフォトレジスト剥離工程とそれ以降のテープ材搬送工程との間に、両者間の速度差を吸収するバッファーとして作用するアキュムレーターを、例えばダンサーロールの形で設けることにより、ロット切り替え作業時にもラインを止めることなく、ロット切り替え作業を行うことができる。   In addition, an accumulator that acts as a buffer that absorbs the difference in speed between the photoresist stripping process and the subsequent tape material transport process, for example, in the form of a dancer roll, is also used during lot switching operations. Lot switching work can be performed without stopping.

なお、製造ラインに影響を与えることなくインラインで検査を行う為には、上記光学式自動外観検査装置に、製造ラインの搬送速度よりも早く処理を行える検査装置を用いることが必要である。   In order to perform in-line inspection without affecting the production line, it is necessary to use an inspection apparatus capable of performing processing faster than the conveyance speed of the production line in the optical automatic visual inspection apparatus.

また、検査結果のデータ、例えばＮＧ欠陥画像や、欠陥モードの内訳データを統計的に活用する機能を入れることで、製造品質のモニター及び、前工程へのフィードバックをリアルタイムに行うことが可能となり、品質改善にも有効な手段となる。   In addition, by adding a function that statistically uses inspection result data, such as NG defect images and breakdown mode breakdown data, manufacturing quality monitoring and feedback to the previous process can be performed in real time. It becomes an effective means for quality improvement.

以下、本発明を図示の実施の形態に基づいて説明する。   Hereinafter, the present invention will be described based on the illustrated embodiments.

図１は、本発明の実施形態に係る半導体装置用テープキャリアの外観検査装置の概略図である。図において、６は半導体装置用テープキャリアの製造ラインの一部であるフォトレジスト剥離工程の部分を示す。すなわち、このフォトレジスト剥離工程６に進入して来るテープ材２ａは、ポリイミドフィルム等のテープ基材に接着剤層を介して導体層を設けた３層構造又は接着剤層を省略した２層構造のテープ材（ＴＡＢテープ２）に対し、その導体層の上にフォトレジストを塗布したのち、露光、現像、エッチングの各工程を経て配線パターンが形成されたものである。この実施形態の場合、フォトレジスト剥離工程６の前工程は省略されて描かれている。すなわち、テープ送出し機６１から直接にエッチング工程を終えたテープ材が送り出される形態と、そうでない形態の２形態がある。いずれにせよ、上記エッチング工程に次いでフォトレジスト剥離工程６が設けられる。   FIG. 1 is a schematic view of an appearance inspection apparatus for a tape carrier for a semiconductor device according to an embodiment of the present invention. In the figure, reference numeral 6 denotes a portion of a photoresist stripping process which is a part of a production line of a semiconductor device tape carrier. That is, the tape material 2a entering the photoresist stripping step 6 has a three-layer structure in which a conductor layer is provided on a tape base material such as a polyimide film via an adhesive layer, or a two-layer structure in which the adhesive layer is omitted. In this tape material (TAB tape 2), a photoresist is applied on the conductor layer, and then a wiring pattern is formed through the steps of exposure, development, and etching. In the case of this embodiment, the previous step of the photoresist stripping step 6 is omitted. That is, there are two forms, a form in which the tape material that has finished the etching process directly from the tape feeder 61 is sent out and a form in which the tape material is not. In any case, a photoresist stripping step 6 is provided after the etching step.

上記フォトレジスト剥離工程６の部分は、上記テープ送出し機６１を含むテープ巻出し部６ａ、薬液処理槽６ｂ、洗浄槽６ｃから構成されている。これに次いで、ダンサーロールから成るアキュムレーター７が設けられ、ＴＡＢテープ２はそれ以降のテープ材搬送工程８を経て、テープ巻取り機５に巻きとられる。フォトレジスト剥離工程６とテープ材搬送工程８の間に設けられているアキュムレーター７は、両者間の速度差を吸収するバッファーとして作用する。   The portion of the photoresist stripping step 6 includes a tape unwinding portion 6a including the tape feeder 61, a chemical treatment tank 6b, and a cleaning tank 6c. Following this, an accumulator 7 composed of dancer rolls is provided, and the TAB tape 2 is wound around the tape winder 5 through the subsequent tape material conveying step 8. The accumulator 7 provided between the photoresist stripping step 6 and the tape material transporting step 8 acts as a buffer that absorbs the speed difference between the two.

そして、上記アキュムレーター７より下流のテープ材搬送工程８中に、上記光学式自動外観検査装置の画像認識部たるＣＣＤカメラ３が設けられ、その下流にＮＧマークユニット４が設けられている。   A CCD camera 3 as an image recognition unit of the optical automatic visual inspection apparatus is provided in the tape material transporting process 8 downstream of the accumulator 7, and an NG mark unit 4 is provided downstream thereof.

図３との比較で見た場合、上記したＴＡＢテープ用インライン検査装置の実施形態は、図３の送出し機１の代わりに、製造ラインのフォトレジスト剥離工程６が設けられている。すなわち、フォトレジスト剥離工程６のプロセスが終わったＴＡＢテープ２を、アキュムレーター７を通してインラインで光学式自動外観検査装置に送り、ＣＣＤカメラ３にて各ピースの配線パターンを取り込み、マスターパターンと比較して、その欠陥の有無を検査する形態となっている。そして、ＮＧとなった製品ピースにインラインで設置されているＮＧマークユニット４にて所定の位置に自動でＮＧマークを付け、巻取り機５で巻き取る構成となっている。   When compared with FIG. 3, the embodiment of the in-line inspection apparatus for TAB tape described above is provided with a photoresist stripping process 6 in the production line instead of the feeder 1 of FIG. That is, the TAB tape 2 that has undergone the photoresist stripping process 6 is sent inline to the optical automatic visual inspection apparatus through the accumulator 7, and the wiring pattern of each piece is captured by the CCD camera 3 and compared with the master pattern. Thus, the presence or absence of the defect is inspected. Then, the NG mark unit 4 installed in-line on the product piece that has become NG is automatically attached with a NG mark at a predetermined position and wound by the winder 5.

上記の如く製造ライン中にインラインで光学式自動外観検査装置を設けた場合のポイントとしては、製造ラインを止められない為、品種切り替え作業やリールセット時に、アキュムレーター７で吸収できる程度のバッファーを持たせる必要があり、ＡＯＩ装置の検査速度は製造ラインよりも速く処理を行えることが必要である。   As described above, the point when the optical automatic visual inspection device is provided in-line in the production line is that the production line cannot be stopped. Therefore, a buffer that can be absorbed by the accumulator 7 during product change work or reel setting is provided. The inspection speed of the AOI apparatus must be faster than that of the production line.

上記構成によれば、設置する製造ラインの搬送速度よりも早く処理を行える検査装置を用いてインラインで検査を行う為、製造ラインに影響を与えることなく、配線パターンの良否の光学的自動外観検査を行うことができる。また、アキュムレーター７にて搬送速度差を吸収するバッファーを持たせる機構を持っているため、ロット切り替え作業時もラインを止める必要がなく、また専用のオペレーターを必要としない安易な操作性を持つ外観検査装置を構築することができる。   According to the above configuration, since an in-line inspection is performed using an inspection apparatus that can perform processing faster than the conveying speed of the installed production line, the optical automatic visual inspection of the quality of the wiring pattern is performed without affecting the production line. It can be performed. In addition, since the accumulator 7 has a mechanism for absorbing the transfer speed difference, there is no need to stop the line even when changing lots, and there is easy operation that does not require a dedicated operator. An appearance inspection apparatus can be constructed.

上記外観検査においてＮＧとなったピースには、ＮＧマークユニット４にて不良マークを付ける他に、ロット毎の不良マップデータを電子データとして保存し、後工程でそれを読み込ませる方式とすることも可能である。   In addition to attaching a defect mark to the NG piece in the appearance inspection, the defect map data for each lot may be stored as electronic data and read in a later process. Is possible.

本発明の半導体装置用テープキャリアのインライン外観検査装置の概略図を示す図である。It is a figure which shows the schematic of the in-line external appearance inspection apparatus of the tape carrier for semiconductor devices of this invention. ＴＡＢテープ等の半導体装置用テープキャリアの製造方法の説明に供する図である。It is a figure where it uses for description of the manufacturing method of the tape carriers for semiconductor devices, such as a TAB tape. 従来の半導体装置用テープキャリアのオフライン外観検査装置の概略を示す図である。It is a figure which shows the outline of the offline external appearance inspection apparatus of the conventional tape carrier for semiconductor devices.

符号の説明Explanation of symbols

２ ＴＡＢテープ（半導体装置用テープキャリア）
３ ＣＣＤカメラ（画像認識部）
４ ＮＧマークユニット
５ 巻取り機
６ フォトレジスト剥離工程
７ アキュムレーター
６１ テープ送出し機 2 TAB tape (Tape carrier for semiconductor devices)
3 CCD camera (image recognition unit)
4 NG mark unit 5 Winding machine 6 Photoresist peeling process 7 Accumulator 61 Tape feeder

Claims (5)

テープ基材に接着剤層を介して導体層を設けた三層材又は接着剤層を省略した二層材における導体層の上にフォトレジストを塗布したのち、露光、現像、エッチング、フォトレジスト剥離の各工程を経て配線パターンを形成し、その配線パターンを形成したテープ材を巻き取る製造ラインに対し、
上記製造ライン中のフォトレジスト剥離工程の後に光学式自動外観検査装置の画像認識部を設け、該画像認識部でテープ材の配線パターンの形状を２次元画像として取り込み、マスターパターンと比較することで、配線パターンの欠陥の有無を光学的に自動外観検査することを特徴とする半導体装置用テープキャリアの外観検査方法。 After applying the photoresist on the conductor layer in the three-layer material with the conductor layer provided on the tape base material via the adhesive layer or the two-layer material without the adhesive layer, exposure, development, etching, and photoresist removal For each manufacturing line that forms a wiring pattern through each process and winds up the tape material on which the wiring pattern is formed,
By providing an image recognition unit of an optical automatic visual inspection apparatus after the photoresist peeling process in the production line, capturing the shape of the wiring pattern of the tape material as a two-dimensional image in the image recognition unit, and comparing it with the master pattern A method for inspecting the appearance of a tape carrier for a semiconductor device, wherein an optically automatic appearance inspection is performed for the presence or absence of defects in the wiring pattern. テープ基材に接着剤層を介して導体層を設けた三層材又は接着剤層を省略した二層材における導体層の上にフォトレジストを塗布したのち、露光、現像、エッチング、フォトレジスト剥離の各工程を経て配線パターンを形成し、その配線パターンを形成したテープ材を巻き取る製造ラインに対し、
上記製造ライン中のフォトレジスト剥離工程の後に光学式自動外観検査装置の画像認識部を設け、該画像認識部でテープ材の配線パターンの形状を２次元画像として取り込み、マスターパターンと比較することで、配線パターンの欠陥の有無を光学的に自動外観検査することを特徴とする半導体装置用テープキャリアの外観検査装置。 After applying the photoresist on the conductor layer in the three-layer material with the conductor layer provided on the tape base material via the adhesive layer or the two-layer material without the adhesive layer, exposure, development, etching, and photoresist removal For each manufacturing line that forms a wiring pattern through each process and winds up the tape material on which the wiring pattern is formed,
By providing an image recognition unit of an optical automatic visual inspection apparatus after the photoresist peeling process in the production line, capturing the shape of the wiring pattern of the tape material as a two-dimensional image in the image recognition unit, and comparing it with the master pattern An appearance inspection apparatus for a tape carrier for a semiconductor device, characterized by optically automatically inspecting the presence or absence of a defect in a wiring pattern. 請求項２記載の半導体装置用テープキャリアの外観検査装置において、
上記フォトレジスト剥離工程とそれ以降のテープ材搬送工程との間に、両者間の速度差を吸収するバッファーとして作用するアキュムレーターを設けたことを特徴とする半導体装置用テープキャリアの外観検査装置。 In the appearance inspection apparatus of the tape carrier for semiconductor devices according to claim 2,
An appearance inspection apparatus for a tape carrier for a semiconductor device, wherein an accumulator acting as a buffer for absorbing a speed difference between the two is provided between the photoresist stripping step and the subsequent tape material transporting step. 請求項３記載の半導体装置用テープキャリアの外観検査装置において、
上記光学式自動外観検査装置の画像認識部を、上記アキュムレーターより下流のテープ材搬送工程中に設けたことを特徴とする半導体装置用テープキャリアの外観検査装置。 In the appearance inspection apparatus of the tape carrier for semiconductor devices according to claim 3,
An appearance inspection apparatus for a tape carrier for a semiconductor device, wherein the image recognition unit of the optical automatic appearance inspection apparatus is provided in a tape material transporting process downstream from the accumulator. 請求項２〜４のいずれかに記載の半導体装置用テープキャリアの外観検査装置において、
上記光学式自動外観検査装置が、検査を行った判定結果である、欠陥画像と欠陥マップデータと欠陥内訳モードとカウント数とを集計できる機能を備えることを特徴とする半導体装置用テープキャリアの外観検査装置。 In the external appearance inspection apparatus of the tape carrier for semiconductor devices in any one of Claims 2-4,
External appearance of a tape carrier for a semiconductor device, characterized in that the optical automatic appearance inspection apparatus has a function capable of aggregating a defect image, defect map data, a defect breakdown mode, and a count number, which are determination results of inspection. Inspection device.
JP2003371856A 2003-10-31 2003-10-31 Visual inspection method and visual inspection system for tape carrier for semiconductor device Pending JP2005134284A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100435291C (en) * 2006-06-12 2008-11-19 中芯国际集成电路制造(上海)有限公司 Method for removing defect on back side of chip
WO2011040560A1 (en) * 2009-09-30 2011-04-07 宇部興産株式会社 Modified urethane resin curable composition and cured product thereof
JP5741441B2 (en) * 2009-09-30 2015-07-01 宇部興産株式会社 Modified urethane resin curable composition and cured product thereof
JP2017068124A (en) * 2015-09-30 2017-04-06 日東電工株式会社 Inspection method of long-sized polarizer
JP2017068123A (en) * 2015-09-30 2017-04-06 日東電工株式会社 Method of inspecting elongate polarizers
JP2017068106A (en) * 2015-09-30 2017-04-06 日東電工株式会社 Inspection method, inspection system and manufacturing method of long-sized polarizer

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