JP2005129019A - Ic card - Google Patents

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JP2005129019A
JP2005129019A JP2004257029A JP2004257029A JP2005129019A JP 2005129019 A JP2005129019 A JP 2005129019A JP 2004257029 A JP2004257029 A JP 2004257029A JP 2004257029 A JP2004257029 A JP 2004257029A JP 2005129019 A JP2005129019 A JP 2005129019A
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card
mica
chip
capacitor
film
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Shinichi Kuroda
信一 黒田
Kazuaki Suzuki
和明 鈴木
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Dexerials Corp
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Sony Chemicals Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the thickness of an IC card, and to reduce the manufacturing cost, and to stabilize the resonance frequency. <P>SOLUTION: This IC card 10A is provided with a mica film 1 and a mica capacitor 5, constituted of electrodes 6a and 6b formed on the both faces, and the mica film 1 is used as the mounting substrate of a mica coil 2 and an IC chip 3. The IC chip 3 is mounted through anisotropic conductive adhesive on the mica film in a face-down type. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ＲＦＩＤ(Radio Frequency Identification)等の非接触型ＩＣカードに関する。   The present invention relates to a non-contact type IC card such as RFID (Radio Frequency Identification).

質問器（リーダ／ライタ）が発した電磁波により、非接触で応答器（非接触型ＩＣカード）のアンテナコイルに誘導電圧を発生させ、信号の送受信を行うデータキャリアシステムが普及している。   2. Description of the Related Art Data carrier systems that transmit and receive signals by generating an induced voltage in an antenna coil of a responder (non-contact type IC card) in a non-contact manner by an electromagnetic wave emitted from an interrogator (reader / writer) have become widespread.

この非接触型ＩＣカードの基本的な回路要素は、図９に示すように、アンテナコイル及びコンデンサーからなる共振回路とＩＣチップとからなるので、その具体的構造は、基板上にアンテナコイル、コンデンサー及びＩＣチップを配設したものとなっている。   As shown in FIG. 9, the basic circuit elements of this non-contact type IC card are composed of a resonance circuit composed of an antenna coil and a capacitor, and an IC chip. And an IC chip.

このアンテナコイルとしては、従前は、金属の細線を同一面上でリング状に巻回したものが使用されていたが、近年は、アンテナ特性や機械的強度の向上、組立工程数の削減の点から、絶縁基板の片面に積層されている銅箔等の導電層をリング状にエッチングしたものが多く使用されている。   As this antenna coil, a metal thin wire wound in a ring shape on the same surface has been used in the past, but in recent years, the antenna characteristics and mechanical strength have been improved, and the number of assembly processes has been reduced. Therefore, a material obtained by etching a conductive layer such as a copper foil laminated on one side of an insulating substrate into a ring shape is often used.

また、アンテナコイルを形成する積層板の絶縁基板、あるいはコンデンサーの誘電体としては、一般にポリイミドフィルムが使用されている。   In general, a polyimide film is used as an insulating substrate of a laminated plate forming an antenna coil or a dielectric of a capacitor.

しかしながら、ポリイミドは吸水率が大きく、その誘電率は吸湿により変化するため、ポリイミドフィルムを誘電体とするコンデンサーは、吸湿により静電容量が変化し、ＩＣカードの共振周波数がずれるという問題がある。   However, since polyimide has a large water absorption rate and its dielectric constant changes due to moisture absorption, a capacitor using a polyimide film as a dielectric has a problem that the capacitance changes due to moisture absorption and the resonance frequency of the IC card shifts.

特に、ポリイミドフィルムと銅箔を接着剤により貼着した積層板からコンデンサーを形成した場合には、ポリイミドフィルムに加えて接着剤も誘電率の変動の原因になるので、ＩＣカードの共振周波数がいっそう不安定になる。   In particular, when a capacitor is formed from a laminated board in which a polyimide film and copper foil are bonded with an adhesive, the adhesive frequency in addition to the polyimide film also causes fluctuations in the dielectric constant. It becomes unstable.

本発明は以上のような従来技術の問題点を解決しようとするものであり、共振周波数が安定化し、アンテナ特性が向上したＩＣカードを安価に製造できるようにすることを目的としている。   An object of the present invention is to solve the above-described problems of the prior art, and an object of the present invention is to make it possible to inexpensively manufacture an IC card having a stabilized resonance frequency and improved antenna characteristics.

本発明者らは、コンデンサーとして、マイカフィルムを誘電体とするマイカコンデンサーを使用すると、マイカフィルムは吸水率が著しく低いためにＩＣカードの共振周波数が安定すること、また、マイカコンデンサーの誘電体となるマイカフィルムを、アンテナコイルやＩＣチップを形成あるいは実装する基板としても使用すると、ＩＣカードを薄型化でき、また低コストに製造できることを見出し本発明を完成させるに至った。   The present inventors use a mica capacitor having a mica film as a dielectric as a capacitor. Since the mica film has a remarkably low water absorption, the resonance frequency of the IC card is stabilized, and the dielectric of the mica capacitor When the mica film is used as a substrate for forming or mounting an antenna coil or an IC chip, it was found that the IC card can be thinned and manufactured at a low cost, and the present invention has been completed.

即ち、本発明は、マイカフィルムとその両面に形成された電極からなるマイカコンデンサー、ならびに前記マイカフィルムを基板として設けられているアンテナコイル及びＩＣチップを有することを特徴とするＩＣカードを提供する。   That is, the present invention provides an IC card comprising a mica capacitor comprising a mica film and electrodes formed on both sides thereof, and an antenna coil and an IC chip provided with the mica film as a substrate.

本発明のＩＣカードによれば、マイカコンデンサーを使用するので共振周波数を安定させることができ、また、マイカコンデンサーの誘電体となるマイカフィルムをアンテナコイルやＩＣチップを実装する基板としても使用するので、ＩＣカードを薄型化し、製造コストも低下させることができる。   According to the IC card of the present invention, since a mica capacitor is used, the resonance frequency can be stabilized, and a mica film serving as a dielectric of the mica capacitor is also used as a substrate for mounting an antenna coil or an IC chip. The IC card can be made thinner and the manufacturing cost can be reduced.

以下、本発明を図面に基づいて詳細に説明する。なお、各図中、同一符号は同一又は同等の構成要素を表している。   Hereinafter, the present invention will be described in detail with reference to the drawings. In each figure, the same numerals indicate the same or equivalent components.

図５は、本発明の一態様のＩＣカード１０Ｂの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。また、図６は、このＩＣカード１０Ｂの、ＩＣチップ３の実装前の上面図（同図（ａ））及び下面図（同図（ｂ））である。   5A is a plan view of the IC card 10B according to one embodiment of the present invention (FIG. 5A) and FIG. 5B is a cross-sectional view thereof. FIG. 6 is a top view (FIG. 6A) and a bottom view (FIG. 6B) of the IC card 10B before the IC chip 3 is mounted.

このＩＣカード１０Ｂは、透明なマイカフィルム１の片面にアンテナコイル２及びＩＣチップ３を有している。また、マイカフィルム１の両面に電極６ａ、６ｂを有し、この電極６ａ、６ｂとこの電極６ａ、６ｂで挟まれたマイカフィルム１とからマイカコンデンサー５が構成されている。なお、図５（ａ）において、マイカコンデンサー５内のドットで塗りつぶしした部分は、マイカフィルム１の下面に形成されている電極６ａを表している。   This IC card 10B has an antenna coil 2 and an IC chip 3 on one side of a transparent mica film 1. The mica film 1 has electrodes 6a and 6b on both surfaces, and a mica condenser 5 is constituted by the electrodes 6a and 6b and the mica film 1 sandwiched between the electrodes 6a and 6b. In FIG. 5A, the portion filled with dots in the mica capacitor 5 represents the electrode 6 a formed on the lower surface of the mica film 1.

このＩＣカード１０Ｂにおいて、アンテナコイル２は、銀ペースト等の導電ペーストを用いてマイカフィルム１にコイルパターンを印刷したものでもよく、あるいはマイカフィルム１とその表面に形成された銅等の導電層からなる積層板の当該導電層をエッチングすることにより形成したものでもよい。   In this IC card 10B, the antenna coil 2 may be one obtained by printing a coil pattern on the mica film 1 using a conductive paste such as a silver paste, or from a conductive layer such as copper formed on the mica film 1 and its surface. It may be formed by etching the conductive layer of the laminate.

ＩＣチップ３は、異方導電性接着剤４を用いてフェイスダウン式にマイカフィルム１上に実装されている。この場合、ＩＣチップ３はその二つの端子３ａ、３ｂでアンテナコイル２を跨ぐように実装されており、一方の端子３ａがアンテナコイル２の内側端子２ａと接続し、他方の端子３ｂがアンテナコイル２の外側端子２ｂと接続している。   The IC chip 3 is mounted on the mica film 1 in a face-down manner using an anisotropic conductive adhesive 4. In this case, the IC chip 3 is mounted so that the two terminals 3a and 3b straddle the antenna coil 2, one terminal 3a is connected to the inner terminal 2a of the antenna coil 2, and the other terminal 3b is the antenna coil. 2 is connected to the outer terminal 2b.

マイカコンデンサー５は、マイカフィルム１とその両面に形成された電極６ａ、６ｂから構成されている。この電極６ａ、６ｂのうち、マイカフィルム１の下面に形成されている電極６ａにはコンデンサー端子５ａが形成されており、そのコンデンサー端子５ａがスルーホール８ａを介してアンテナコイルの内側端子２ａａと接続している。また、マイカフィルム１の上面に形成されたマイカコンデンサー５の電極６ｂにはコンデンサー端子５ｂが形成されており、このコンデンサー端子５ｂがスルーホール８ｂを介してマイカフィルム１の下面に形成されている配線７と接続し、さらにその配線７がスルーホール８ｃでアンテナコイル２の外側端子２ｂｂと接続している。   The mica capacitor 5 includes a mica film 1 and electrodes 6a and 6b formed on both sides thereof. Of these electrodes 6a and 6b, a capacitor terminal 5a is formed on the electrode 6a formed on the lower surface of the mica film 1, and the capacitor terminal 5a is connected to the inner terminal 2aa of the antenna coil through the through hole 8a. doing. A capacitor terminal 5b is formed on the electrode 6b of the mica capacitor 5 formed on the upper surface of the mica film 1, and the capacitor terminal 5b is formed on the lower surface of the mica film 1 through the through hole 8b. 7 and the wiring 7 is connected to the outer terminal 2bb of the antenna coil 2 through the through hole 8c.

この図５のＩＣカード１０Ｂは、例えば、次のようにして製造することができる。   The IC card 10B of FIG. 5 can be manufactured as follows, for example.

まず、図６（ａ）に示すように、マイカフィルム１にスルーホール８ａ、８ｂ、８ｃ用の孔をあけ、次に銀ペースト等の導電ペーストを用いて、マイカフィルム１の片面にマイカコンデンサー５の上面の電極６ｂとアンテナコイル２とを印刷する。また、マイカフィルム１の他面には、図６（ｂ）に示すように、マイカコンデンサー５の下面の電極６ａと配線７を印刷する。この導電ペーストの印刷により、スルーホール８ａ、８ｂ、８ｃ用の孔に導電ペーストが充填され、スルーホール８ａ、８ｂ、８ｃが導通し、アンテナコイル２とマイカコンデンサー５との接続も完了したことになる。   First, as shown in FIG. 6A, holes for through holes 8a, 8b, and 8c are formed in the mica film 1, and then a mica condenser 5 is formed on one side of the mica film 1 using a conductive paste such as silver paste. The electrode 6b and the antenna coil 2 on the upper surface of the are printed. Further, on the other surface of the mica film 1, as shown in FIG. 6B, electrodes 6a and wirings 7 on the lower surface of the mica capacitor 5 are printed. By printing this conductive paste, the holes for the through holes 8a, 8b, 8c are filled with the conductive paste, the through holes 8a, 8b, 8c are conducted, and the connection between the antenna coil 2 and the mica capacitor 5 is completed. Become.

次に、ＩＣチップ３をマイカフィルム１の上面に異方導電性接着剤４を用いてフェイスダウン式に実装する。なお、ここで使用する異方導電性接着剤４としては、公知のものを使用することができ、その形態もフィルム状、ペースト状等のいずれでもよい。   Next, the IC chip 3 is mounted on the upper surface of the mica film 1 using an anisotropic conductive adhesive 4 in a face-down manner. In addition, as the anisotropic conductive adhesive 4 used here, a well-known thing can be used and the form may be either a film form, a paste form, etc.

こうして得られたＩＣカード１０Ｂは、コンデンサー５の誘電体としてマイカフィルム１が使用されているので、吸湿による共振周波数のずれがなく、アンテナ特性が向上したものとなる。また、このマイカフィルム１がアンテナコイル２やＩＣチップ３の実装基板にもなっているので、コンデンサー５の誘電体と別個に実装基板が使用される従来のＩＣチップに比してＩＣチップの薄型化を図ることができる。さらに、アンテナコイル２やコンデンサー５の電極６ａ、６ｂだけでなく、それらの接続に必要な配線７やスルーホール８ａ、８ｂ、８ｃが導電ペーストの印刷により同時に形成でき、それらの接続作業も不要となるので、製造工程を簡略化できＩＣチップを低コストで製造することが可能となる。   The IC card 10B thus obtained uses the mica film 1 as the dielectric of the capacitor 5, so that there is no shift in the resonance frequency due to moisture absorption, and the antenna characteristics are improved. Since the mica film 1 is also a mounting substrate for the antenna coil 2 and the IC chip 3, the IC chip is thinner than the conventional IC chip in which the mounting substrate is used separately from the dielectric of the capacitor 5. Can be achieved. Furthermore, not only the electrodes 6a and 6b of the antenna coil 2 and the capacitor 5, but also the wiring 7 and through-holes 8a, 8b, and 8c necessary for connecting them can be formed simultaneously by printing a conductive paste, and their connection work is unnecessary. As a result, the manufacturing process can be simplified and the IC chip can be manufactured at low cost.

図１は、本発明の他の態様のＩＣカード１０Ａの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。なお、図１（ａ）においても、マイカコンデンサー５内のドットで塗りつぶした部分は、マイカフィルム１の下面に形成されている電極６ａを表している。また、図２は、このＩＣカード１０Ａの、ＩＣチップ３の実装前の上面図（同図（ａ））及び下面図（同図（ｂ））である。   FIG. 1 is a plan view (FIG. 1 (a)) and sectional views (FIG. 1 (b), (c)) of an IC card 10A according to another embodiment of the present invention. In FIG. 1A as well, the portion filled with dots in the mica capacitor 5 represents the electrode 6 a formed on the lower surface of the mica film 1. FIG. 2 is a top view (FIG. 2A) and a bottom view (FIG. 2B) of the IC card 10A before the IC chip 3 is mounted.

このＩＣカード１０Ａは、上述のＩＣカード１０Ｂと略同様に製造されるが、マイカフィルム１の下面の電極６ａからは、アンテナコイル２の外側端子２ｂとスルーホール８ｃを介して接続するコンデンサー端子５ｂの他に、ＩＣチップ３の端子３ｂと配線７及びスルーホール８ｂを介して接続するコンデンサー端子５ｃも設けられている。一方、マイカフィルム１の上面の電極６ｂからは、ＩＣチップ３の他方の端子３ａと接続するコンデンサー端子５ａが形成されており、このコンデンサー端子５ａはアンテナコイル２の内側端子２ａと連続している。したがって、このＩＣカード１０Ａによれば、ＩＣチップ３の二つの端子３ａ、３ｂをそれぞれアンテナコイル２の内側端子２ａ、外側端子２ｂと接続するにあたり、ＩＣチップ３の二つの端子３ａ、３ｂでアンテナコイル２を跨ぐことが不要となり、アンテナコイル２の全巻幅をＩＣチップ３の二つの端子３ａ、３ｂの間に納めることが不要となっている。よって、このＩＣカード１０Ａによれば、アンテナコイル２の設計の自由度を高めることができる。   This IC card 10A is manufactured in substantially the same manner as the above-described IC card 10B, but a capacitor terminal 5b connected from the electrode 6a on the lower surface of the mica film 1 to the outer terminal 2b of the antenna coil 2 through the through hole 8c. In addition, a capacitor terminal 5c connected to the terminal 3b of the IC chip 3 via the wiring 7 and the through hole 8b is also provided. On the other hand, a capacitor terminal 5a connected to the other terminal 3a of the IC chip 3 is formed from the electrode 6b on the upper surface of the mica film 1, and this capacitor terminal 5a is continuous with the inner terminal 2a of the antenna coil 2. . Therefore, according to the IC card 10A, when the two terminals 3a and 3b of the IC chip 3 are connected to the inner terminal 2a and the outer terminal 2b of the antenna coil 2, respectively, the two terminals 3a and 3b of the IC chip 3 are connected to the antenna. It is not necessary to straddle the coil 2, and it is not necessary to fit the entire winding width of the antenna coil 2 between the two terminals 3a, 3b of the IC chip 3. Therefore, according to the IC card 10A, the degree of freedom in designing the antenna coil 2 can be increased.

本発明のＩＣカードは、必要に応じて樹脂封止したり、ＩＣカードの上面あるいは下面に任意のシート材を積層することができる。例えば、図３は、図１に示したＩＣカード１０Ａを、エポキシ樹脂等の熱硬化性樹脂、ポリエステル等のホットメルト樹脂等からなる封止樹脂１１で封止し、その一方の面にアクリル系樹脂等の粘着剤１２を介してポリエステルフィルム等の外層フィルム１３を積層し、他方の面に粘着剤１４を介して剥離紙１５を積層することにより、ビデオフィルムその他種々の物品に貼着するＩＤ機能付きのラベル１０Ｘとして構成したものである。即ち、ラベル１０Ｘを物品に貼り付ける時に剥離紙１５は剥がされ、粘着剤１４が物品への貼付面となり、一方、外層フィルム１３が筆記性を有するラベル面となる。   The IC card of the present invention can be resin-sealed as required, or an arbitrary sheet material can be laminated on the upper surface or lower surface of the IC card. For example, FIG. 3 shows a case where the IC card 10A shown in FIG. 1 is sealed with a sealing resin 11 made of a thermosetting resin such as an epoxy resin, a hot melt resin such as polyester, or the like, ID which sticks to video film and other various articles by laminating outer layer film 13 such as polyester film via adhesive 12 such as resin and laminating release paper 15 via adhesive 14 on the other side This is configured as a function-equipped label 10X. That is, when the label 10X is attached to the article, the release paper 15 is peeled off, and the pressure-sensitive adhesive 14 becomes an attachment surface to the article, while the outer layer film 13 becomes a label surface having a writing property.

このようなＩＣカード１０Ａを用いたラベル１０Ｘの製造方法としては、図４に示すように、ＩＣカード１０Ａの一方の面に外層フィルム１３を粘着剤（図示せず）で貼着し、反対側に封止樹脂１１を塗布し、その上に粘着剤付きの剥離紙１５をローラー１６を用いて被せると共に、加熱加圧する。この場合、外層フィルム１３と剥離紙１５との間隔を所定のギャップ幅ｄに調整する。これにより図３に示したラベル１０Ｘを得ることができる。   As shown in FIG. 4, as a method of manufacturing the label 10X using such an IC card 10A, an outer layer film 13 is attached to one surface of the IC card 10A with an adhesive (not shown), and the opposite side. The sealing resin 11 is applied to the substrate, and a release paper 15 with an adhesive is placed thereon using a roller 16 and heated and pressurized. In this case, the interval between the outer layer film 13 and the release paper 15 is adjusted to a predetermined gap width d. Thereby, the label 10X shown in FIG. 3 can be obtained.

図７は、本発明の他の態様のＩＣカード１０Ｃをラベル１０Ｙの形態にしたものの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。また、図８は、このＩＣカード１０Ｃの、ＩＣチップ３の実装前の上面図（同図（ａ））及び下面図（同図（ｂ））である。   FIG. 7 is a plan view (FIG. 7 (a)) and sectional views (FIG. 7 (b), (c)) of an IC card 10C according to another embodiment of the present invention in the form of a label 10Y. FIG. 8 is a top view (FIG. 8A) and a bottom view (FIG. 8B) of the IC card 10C before the IC chip 3 is mounted.

このＩＣカード１０Ｃは、上述のＩＣカード１０Ａが矩形に巻回したアンテナコイル２を有しているのに対し、円形に巻回したアンテナコイル２を有している以外は、ＩＣカード１０Ａと略同様の構成を有している。即ち、マイカフィルム１の下面の電極６ａからは、アンテナコイル２の外側端子２ｂとスルーホール８ｃを介して接続するコンデンサー端子５ｂの他に、ＩＣチップ３の端子３ｂと配線７及びスルーホール８ｂを介して接続するコンデンサー端子５ｃが設けられている。一方、マイカフィルム１の上面の電極６ｂからは、ＩＣチップ３の他方の端子３ａと接続するコンデンサー端子５ａが形成されており、このコンデンサー端子５ａはアンテナコイル２の内側端子２ａと連続している。したがって、このＩＣカード１０Ｃにおいても、ＩＣチップ３の二つの端子３ａ、３ｂでアンテナコイル２を跨ぐことが不要となり、アンテナコイル２の全巻幅をＩＣチップ３の二つの端子３ａ、３ｂの間に納めることが不要となり、アンテナコイル２の設計の自由度を高めることができる。   The IC card 10C is substantially the same as the IC card 10A except that the IC card 10A has the antenna coil 2 wound in a rectangular shape, but has the antenna coil 2 wound in a circle. It has the same configuration. That is, from the electrode 6a on the lower surface of the mica film 1, in addition to the capacitor terminal 5b connected to the outer terminal 2b of the antenna coil 2 via the through hole 8c, the terminal 3b of the IC chip 3, the wiring 7 and the through hole 8b are connected. A capacitor terminal 5c to be connected via the terminal is provided. On the other hand, a capacitor terminal 5a connected to the other terminal 3a of the IC chip 3 is formed from the electrode 6b on the upper surface of the mica film 1, and this capacitor terminal 5a is continuous with the inner terminal 2a of the antenna coil 2. . Therefore, also in this IC card 10C, it is not necessary to straddle the antenna coil 2 with the two terminals 3a, 3b of the IC chip 3, and the entire winding width of the antenna coil 2 is set between the two terminals 3a, 3b of the IC chip 3. Therefore, the degree of freedom in designing the antenna coil 2 can be increased.

なお、このＩＣカード１０Ｃのマイカフィルム１上には、ＩＣチップ３の端子が載るランド９が形成されている。このランド９は、アンテナコイル２やコンデンサー５と直接的には接続しないが、アース等の他の配線端子として使用することができ、また、ＩＣチップ３の実装時にＩＣチップが不要に傾かないようにするための足として作用する。   A land 9 on which the terminal of the IC chip 3 is placed is formed on the mica film 1 of the IC card 10C. The land 9 is not directly connected to the antenna coil 2 or the capacitor 5 but can be used as another wiring terminal such as a ground, and the IC chip does not tilt unnecessarily when the IC chip 3 is mounted. Acts as a foot to make.

本発明のＩＣカードは、上述の例に限らず、種々の態様をとることができる。マイカコンデンサーの誘電体となるマイカフィルムが、アンテナコイルやＩＣチップの実装基板としても使用されている限り、マイカコンデンサー５の電極６ａ、６ｂやアンテナコイル２について、それらの形状や端子形状、形成位置等は適宜定めることができる。   The IC card of the present invention is not limited to the above example, and can take various forms. As long as the mica film serving as the dielectric of the mica capacitor is also used as a mounting substrate for the antenna coil or IC chip, the shape, terminal shape, and formation position of the electrodes 6a and 6b of the mica capacitor 5 and the antenna coil 2 Etc. can be determined as appropriate.

本発明のＩＣカードによれば、マイカコンデンサーを使用するので共振周波数を安定させることができ、また、マイカコンデンサーの誘電体となるマイカフィルムをアンテナコイルやＩＣチップを実装する基板としても使用するので、ＩＣカードを薄型化し、製造コストも低下させることができる。   According to the IC card of the present invention, since a mica capacitor is used, the resonance frequency can be stabilized, and a mica film serving as a dielectric of the mica capacitor is also used as a substrate for mounting an antenna coil or an IC chip. The IC card can be made thinner and the manufacturing cost can be reduced.

本発明のＩＣカードの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。It is the top view (the figure (a)) and sectional drawing (the figure (b), (c)) of the IC card of this invention. ＩＣチップの実装前のＩＣカードの上面図（同図（ａ））及び下面図（同図（ｂ））である。It is the upper side figure (the figure (a)) and bottom view (the figure (b)) of the IC card before mounting of an IC chip. 本発明のＩＣカードを用いたラベルの断面図である。It is sectional drawing of the label using the IC card of this invention. 本発明のＩＣカードを用いてラベルを製造する方法の説明図である。It is explanatory drawing of the method of manufacturing a label using the IC card of this invention. 本発明のＩＣカードの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。It is the top view (the figure (a)) and sectional drawing (the figure (b), (c)) of the IC card of this invention. ＩＣチップの実装前のＩＣカードの上面図（同図（ａ））及び下面図（同図（ｂ））である。It is the upper side figure (the figure (a)) and bottom view (the figure (b)) of the IC card before mounting of an IC chip. 本発明のＩＣカードを用いたラベルの平面図（同図（ａ））及び断面図（同図（ｂ）、（ｃ））である。It is the top view (the figure (a)) and sectional drawing (the figure (b), (c)) of the label using the IC card of this invention. ＩＣチップの実装前のＩＣカードの上面図（同図（ａ））及び下面図（同図（ｂ））である。It is the upper side figure (the figure (a)) and bottom view (the figure (b)) of the IC card before mounting of an IC chip. ＩＣカードにおける基本的な回路要素の説明図である。It is explanatory drawing of the basic circuit element in an IC card.

符号の説明Explanation of symbols

１ マイカフィルム
２ アンテナコイル
２ａ 内側端子
２ｂ 外側端子
３ ＩＣチップ
３ａ、３ｂ ＩＣチップの端子
４ 異方導電性接着剤
５ マイカコンデンサー
５ａ、５ｂ、５ｃ コンデンサー端子
６ａ、６ｂ マイカコンデンサーの電極
７ 配線
８ａ、８ｂ、８ｃ スルーホール
１０Ａ、１０Ｂ、１０Ｃ ＩＣカード
１０Ｘ、１０Ｙ ＩＣカードからなるラベル
DESCRIPTION OF SYMBOLS 1 Mica film 2 Antenna coil 2a Inner terminal 2b Outer terminal 3 IC chip 3a, 3b IC chip terminal 4 Anisotropic conductive adhesive 5 Mica capacitor 5a, 5b, 5c Capacitor terminal 6a, 6b Mica capacitor electrode 7 Wiring 8a, 8b, 8c Through hole 10A, 10B, 10C IC card 10X, 10Y Label consisting of IC card

Claims (2)

マイカフィルムとその両面に形成された電極からなるマイカコンデンサー、ならびに前記マイカフィルムを基板として設けられているアンテナコイル及びＩＣチップを有し、ＩＣチップが異方性導電接着剤を介してフェイスダウン式にマイカフィルム上に実装されていることを特徴とするＩＣカード。   A mica capacitor comprising a mica film and electrodes formed on both sides thereof, and an antenna coil and an IC chip provided with the mica film as a substrate, the IC chip being face-down type via an anisotropic conductive adhesive The IC card is mounted on a mica film. アンテナコイルとマイカコンデンサーの一方の電極が、マイカフィルムへの導電ペーストの印刷により同時に形成されたものである請求項１記載のＩＣカード。
2. The IC card according to claim 1, wherein one electrode of the antenna coil and the mica capacitor is formed simultaneously by printing a conductive paste on a mica film.
JP2004257029A 2004-09-03 2004-09-03 Ic card Pending JP2005129019A (en)

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