JP2005116815A - 液冷ジャケット - Google Patents
液冷ジャケット Download PDFInfo
- Publication number
- JP2005116815A JP2005116815A JP2003349701A JP2003349701A JP2005116815A JP 2005116815 A JP2005116815 A JP 2005116815A JP 2003349701 A JP2003349701 A JP 2003349701A JP 2003349701 A JP2003349701 A JP 2003349701A JP 2005116815 A JP2005116815 A JP 2005116815A
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- JP
- Japan
- Prior art keywords
- heat
- liquid
- cooling jacket
- liquid cooling
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】 発熱体に接合するベース201と、ベース201に対して垂直に立っている柱202と、柱202に取り付けられ、ベース201と平行に配置された複数の放熱フィン203と、複数の放熱フィン203の間を所定の幅で埋める仕切り204と、柱202および放熱フィン203を囲みベース201と接合し、仕切り204により冷却液の流れが分けられる位置に冷却液の入口および出口が取り付けられたケース205とを備え、複数の放熱フィン203は、その厚みに比べて狭い間隔で配置される。
このため、液冷ジャケット内部の冷却液流は、複数流路を確保しているので、流路抵抗が低く、かつ冷却液の出入口の大きさは、並んだ放熱フィン203の高さとほぼ同じにすることにより、各放熱フィン203間の流速を均一にすることができる。
【選択図】 図2
Description
Claims (5)
- 発熱体に接合するベースと、
前記ベースに対して垂直に立っている柱と、
前記柱に取り付けられ、前記ベースと平行に配置された複数の放熱フィンと、
前記複数の放熱フィンの間を所定の幅で埋める仕切りと、
前記柱および前記放熱フィンを囲み前記ベースと接合し、前記仕切りにより冷却液の流れが分けられる位置に前記冷却液の入口および出口が取り付けられたケースとを備え、
前記複数の放熱フィンは、その厚みに比べて狭い間隔で配置されることを特徴とする液冷ジャケット。 - 請求項1記載の液冷ジャケットにおいて、
前記柱は円柱であり、
前記放熱フィンは前記柱に対して同心円形状であることを特徴とする液冷ジャケット。 - 請求項1または2記載の液冷ジャケットにおいて、
前記柱は前記ケースの天面に接触し、前記柱の熱を前記天面に伝えることを特徴とする液冷ジャケット。 - 請求項3記載の液冷ジャケットにおいて、
前記ケースの天面に空冷のヒートシンクを取り付けたことを特徴とする液冷ジャケット。 - 請求項1、2、3または4記載の液冷ジャケットにおいて、
前記柱はヒートパイプの機能を有することを特徴とする液冷ジャケット。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003349701A JP3771233B2 (ja) | 2003-10-08 | 2003-10-08 | 液冷ジャケット |
TW093105571A TWI302242B (en) | 2003-10-08 | 2004-03-03 | Liquid cooling jacket |
EP04005471A EP1524692A3 (en) | 2003-10-08 | 2004-03-08 | Liquid cooled jacket for an electronic device |
KR1020040015680A KR100610293B1 (ko) | 2003-10-08 | 2004-03-09 | 액체 냉각 재킷 |
US10/796,045 US7021367B2 (en) | 2003-10-08 | 2004-03-10 | Liquid cooling jacket |
CNB2004100282502A CN100385653C (zh) | 2003-10-08 | 2004-03-10 | 液冷罩 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003349701A JP3771233B2 (ja) | 2003-10-08 | 2003-10-08 | 液冷ジャケット |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005116815A true JP2005116815A (ja) | 2005-04-28 |
JP2005116815A5 JP2005116815A5 (ja) | 2005-10-06 |
JP3771233B2 JP3771233B2 (ja) | 2006-04-26 |
Family
ID=34373532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003349701A Expired - Fee Related JP3771233B2 (ja) | 2003-10-08 | 2003-10-08 | 液冷ジャケット |
Country Status (6)
Country | Link |
---|---|
US (1) | US7021367B2 (ja) |
EP (1) | EP1524692A3 (ja) |
JP (1) | JP3771233B2 (ja) |
KR (1) | KR100610293B1 (ja) |
CN (1) | CN100385653C (ja) |
TW (1) | TWI302242B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343498A (ja) * | 2005-06-08 | 2006-12-21 | Nec Viewtechnology Ltd | 電子機器の冷却装置および投写型光学装置 |
JP2007116055A (ja) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | 電子機器および冷却モジュール |
JP2010190515A (ja) * | 2009-02-19 | 2010-09-02 | T Rad Co Ltd | ヒートシンク |
JP2013073934A (ja) * | 2011-09-26 | 2013-04-22 | Posco Led Co Ltd | 光半導体照明装置 |
JP2016225531A (ja) * | 2015-06-02 | 2016-12-28 | 昭和電工株式会社 | 液冷式冷却装置 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004012026B3 (de) * | 2004-03-11 | 2005-11-17 | Hüttinger Elektronik GmbH & Co. KG | Anordnung zum Kühlen |
TWM267825U (en) * | 2004-11-03 | 2005-06-11 | Forward Electronics Co Ltd | Improved heat sink structure of liquid-cooling type heat sink device |
JP2006286767A (ja) * | 2005-03-31 | 2006-10-19 | Hitachi Ltd | 冷却ジャケット |
CN100499974C (zh) * | 2005-08-10 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 整合式液冷散热装置 |
TWM289878U (en) * | 2005-11-11 | 2006-04-21 | Cooler Master Co Ltd | Heat-dissipation structure of water-cooling type parallel runner |
US20080310105A1 (en) * | 2007-06-14 | 2008-12-18 | Chia-Chun Cheng | Heat dissipating apparatus and water cooling system having the same |
KR100886951B1 (ko) * | 2007-07-12 | 2009-03-09 | 한국전기연구원 | 열전소자를 구비한 냉각장치 |
US9496200B2 (en) | 2011-07-27 | 2016-11-15 | Coolit Systems, Inc. | Modular heat-transfer systems |
US8746330B2 (en) * | 2007-08-09 | 2014-06-10 | Coolit Systems Inc. | Fluid heat exchanger configured to provide a split flow |
US9453691B2 (en) * | 2007-08-09 | 2016-09-27 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9943014B2 (en) | 2013-03-15 | 2018-04-10 | Coolit Systems, Inc. | Manifolded heat exchangers and related systems |
TW200910068A (en) * | 2007-08-20 | 2009-03-01 | Asustek Comp Inc | Heat dissipation apparatus |
US8000101B2 (en) * | 2009-07-23 | 2011-08-16 | Hewlett-Packard Development Company, L.P. | System and method for attaching liquid cooling apparatus to a chassis |
WO2012050696A1 (en) | 2010-10-14 | 2012-04-19 | Thermo Fisher Scientific Inc. | Optical chamber module assembly |
US9651488B2 (en) * | 2010-10-14 | 2017-05-16 | Thermo Fisher Scientific (Bremen) Gmbh | High-accuracy mid-IR laser-based gas sensor |
US20120103575A1 (en) * | 2010-11-03 | 2012-05-03 | Hon Hai Precision Industry Co., Ltd. | Cooling device |
US20120305218A1 (en) * | 2011-06-01 | 2012-12-06 | Benjamin Masefield | Heat Sink |
CN102819303A (zh) * | 2011-06-09 | 2012-12-12 | 鸿富锦精密工业(深圳)有限公司 | 计算机机箱 |
WO2014141162A1 (en) | 2013-03-15 | 2014-09-18 | Coolit Systems, Inc. | Sensors, multiplexed communication techniques, and related systems |
US10365667B2 (en) | 2011-08-11 | 2019-07-30 | Coolit Systems, Inc. | Flow-path controllers and related systems |
DE102011052707A1 (de) * | 2011-08-15 | 2013-02-21 | Pierburg Gmbh | Kühlvorrichtung für ein thermisch belastetes Bauteil |
TWM424749U (en) * | 2011-10-27 | 2012-03-11 | Enermax Technology Corp | Liquid-cooled heat exchange module improvement |
US10415597B2 (en) | 2014-10-27 | 2019-09-17 | Coolit Systems, Inc. | Fluid heat exchange systems |
US9818671B2 (en) * | 2015-02-10 | 2017-11-14 | Dynatron Corporation | Liquid-cooled heat sink for electronic devices |
US10107303B2 (en) * | 2015-05-22 | 2018-10-23 | Teza Technologies LLC | Fluid cooled server and radiator |
DE102016204895B4 (de) * | 2016-03-23 | 2020-11-12 | Phoenix Contact E-Mobility Gmbh | Ladestecker mit einem Leistungskontaktsystem und Ladestation zur Abgabe elektrischer Energie an einen Empfänger elektrischer Energie |
US10634335B2 (en) * | 2017-01-18 | 2020-04-28 | Fujian Sanan Sino-Science Photobiotech Co., Ltd. | Easily formed liquid cooling module of an LED lamp |
CN107425323B (zh) * | 2017-08-28 | 2022-07-05 | 深圳市沃尔新能源电气科技股份有限公司 | 一种插接母端子及应用该母端子的充电枪、充电枪用插座 |
US10582650B2 (en) * | 2017-10-13 | 2020-03-03 | Arista Networks, Inc. | Power supply with interchangeable fan module |
JP7041746B2 (ja) * | 2017-12-08 | 2022-03-24 | ケーエムダブリュ・インコーポレーテッド | 電子素子の放熱装置 |
KR101990592B1 (ko) | 2018-05-28 | 2019-06-18 | 한국기계연구원 | 상변화 냉각모듈 및 이를 이용하는 배터리팩 |
TWM575882U (zh) * | 2018-11-22 | 2019-03-21 | 訊凱國際股份有限公司 | 外接式水冷裝置 |
KR102091698B1 (ko) | 2019-01-08 | 2020-03-20 | 한국기계연구원 | 상변화 냉각장치 및 상변화 냉각방법 |
US11662037B2 (en) | 2019-01-18 | 2023-05-30 | Coolit Systems, Inc. | Fluid flow control valve for fluid flow systems, and methods |
US11473860B2 (en) | 2019-04-25 | 2022-10-18 | Coolit Systems, Inc. | Cooling module with leak detector and related systems |
US10874034B1 (en) * | 2019-11-05 | 2020-12-22 | Facebook, Inc. | Pump driven liquid cooling module with tower fins |
EP4150216A4 (en) | 2020-05-11 | 2023-11-01 | Coolit Systems, Inc. | LIQUID PUMPING UNITS, AND ASSOCIATED SYSTEMS AND METHODS |
US11725886B2 (en) | 2021-05-20 | 2023-08-15 | Coolit Systems, Inc. | Modular fluid heat exchange systems |
CN114485216B (zh) * | 2022-01-10 | 2023-06-23 | 中国科学院理化技术研究所 | 辐射翅片式换热器及自由活塞斯特林发电机 |
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-
2003
- 2003-10-08 JP JP2003349701A patent/JP3771233B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-03 TW TW093105571A patent/TWI302242B/zh not_active IP Right Cessation
- 2004-03-08 EP EP04005471A patent/EP1524692A3/en not_active Withdrawn
- 2004-03-09 KR KR1020040015680A patent/KR100610293B1/ko active IP Right Grant
- 2004-03-10 US US10/796,045 patent/US7021367B2/en not_active Expired - Lifetime
- 2004-03-10 CN CNB2004100282502A patent/CN100385653C/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006343498A (ja) * | 2005-06-08 | 2006-12-21 | Nec Viewtechnology Ltd | 電子機器の冷却装置および投写型光学装置 |
JP2007116055A (ja) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | 電子機器および冷却モジュール |
JP4593438B2 (ja) * | 2005-10-24 | 2010-12-08 | 富士通株式会社 | 電子機器および冷却モジュール |
US7934539B2 (en) | 2005-10-24 | 2011-05-03 | Fujitsu Limited | Electronic apparatus and cooling module |
JP2010190515A (ja) * | 2009-02-19 | 2010-09-02 | T Rad Co Ltd | ヒートシンク |
JP2013073934A (ja) * | 2011-09-26 | 2013-04-22 | Posco Led Co Ltd | 光半導体照明装置 |
US9109784B2 (en) | 2011-09-26 | 2015-08-18 | Posco Led Company Ltd. | LED-based lighting apparatus with heat pipe cooling structure |
JP2016225531A (ja) * | 2015-06-02 | 2016-12-28 | 昭和電工株式会社 | 液冷式冷却装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1524692A3 (en) | 2009-12-23 |
US20050077028A1 (en) | 2005-04-14 |
EP1524692A2 (en) | 2005-04-20 |
KR100610293B1 (ko) | 2006-08-09 |
CN100385653C (zh) | 2008-04-30 |
KR20050034526A (ko) | 2005-04-14 |
TWI302242B (en) | 2008-10-21 |
CN1606403A (zh) | 2005-04-13 |
JP3771233B2 (ja) | 2006-04-26 |
US7021367B2 (en) | 2006-04-04 |
TW200513832A (en) | 2005-04-16 |
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