JP2005086018A - Power module, and attaching method thereof - Google Patents

Power module, and attaching method thereof Download PDF

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JP2005086018A
JP2005086018A JP2003317170A JP2003317170A JP2005086018A JP 2005086018 A JP2005086018 A JP 2005086018A JP 2003317170 A JP2003317170 A JP 2003317170A JP 2003317170 A JP2003317170 A JP 2003317170A JP 2005086018 A JP2005086018 A JP 2005086018A
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power module
conductive grease
case
heat
inverter case
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JP4127166B2 (en
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Hisatomo Ishimatsu
久朋 石松
Nobuaki Inagaki
信明 稲垣
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Toyota Motor Corp
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

<P>PROBLEM TO BE SOLVED: To improve the heat radiating quality of a power module without increasing its cost, by so heating it previously that the warping shape of the surface of its heat radiating plate becomes protrusive, by making the extension of a heat conducting grease easy, by so preventing the cavity and gap generated between its heat radiating plate and a case when attaching it to the case as to adhere to each other both the plate and case, and by preventing both end portions of the plate from so receiving the reaction forces of the heat conducting grease as to deform the power module. <P>SOLUTION: The attaching method of a power module 1, whereby the power module 1 having a mounted heat radiating plate 12 is attached to an inverter case 3 via a heat conducting grease, has a process for heating previously the surface of the heat radiating plate 12 of the power module 1 before attaching the power module 1 to the case 3, a process for so forming the warp of the surface of the heat radiating plate of the power module 1 that the warp becomes protrusive, and a process wherein after fastening to the inverter case 3 one end-side of the plate 12 in the warp forming direction, the other end-side of plate 12 is fastened to the inverter case 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ＩＧＢＴモジュール等のパワーモジュール及びその組み付け方法に関し、特に、ケースに対する密着性を向上して放熱性を高めたパワーモジュール及びその組み付け方法に関する。   The present invention relates to a power module such as an IGBT module and an assembling method thereof, and more particularly, to a power module and an assembling method thereof having improved heat dissipation by improving adhesion to a case.

ＩＧＢＴ素子等の半導体素子を収納したパワーモジュール等のパッケージは、半導体素子からの発熱を放熱するために、冷却体として作用するインバータケース等のケース部材等に取り付けられることが多い。
例えば、パワーモジュールにインバータケースを取り付けた場合は、パワーモジュールとインバータケースとの間に熱伝導性グリスを充填して、パワーモジュールの熱を、熱伝導性グリスを通じてインバータケースへ効率良く伝達するように構成している。
また、特許文献１に記載されているように、マイクロプロセッサ等の半導体チップを収納するパッケージでは、ヒートスプレッダ及び熱伝導材を介してヒートシンクを取り付けて、半導体チップから発生する熱を放熱するように構成されている。 A package such as a power module housing a semiconductor element such as an IGBT element is often attached to a case member such as an inverter case that acts as a cooling body in order to dissipate heat generated from the semiconductor element.
For example, when an inverter case is attached to the power module, heat conductive grease is filled between the power module and the inverter case so that the heat of the power module is efficiently transferred to the inverter case through the heat conductive grease. It is configured.
Further, as described in Patent Document 1, in a package that houses a semiconductor chip such as a microprocessor, a heat sink is attached via a heat spreader and a heat conducting material, and heat generated from the semiconductor chip is radiated. Has been.

特開平１１−１６３２３１号公報JP-A-11-163231

前述の、パワーモジュールとインバータケースとの間に熱伝導性グリスを充填する場合には、図１２に示すように、熱伝動性グリス１０５を塗布したインバータケース１０３上にパワーモジュール１０１を載置して、両端をボルト１０６等により締結することで、パワーモジュール１０１をインバータケース１０３へ組み付けるようにしていた。   When the thermal conductive grease is filled between the power module and the inverter case, the power module 101 is placed on the inverter case 103 coated with the heat conductive grease 105 as shown in FIG. The power module 101 is assembled to the inverter case 103 by fastening both ends with bolts 106 or the like.

しかし、図１３に示すように、熱伝動性グリス１０５を塗布したインバータケース１０３にパワーモジュール１０１を組み付けた場合には、熱伝動性グリス１０５の流動性が悪いため、ボルト１０６によりパワーモジュール１０１を締結する際に、パワーモジュール１０１が熱伝動性グリス１０５からの反力を受け、熱伝動性グリス１０５の両端部を支点Ｐとして変形し、上に凸の形状となる。
このように、パワーモジュール１０１が上に凸となるように変形すると、パワーモジュール１０１の底面と熱伝動性グリス１０５との間に隙間Ｑが出来てしまって、パワーモジュール１０１とインバータケース１０３との密着性が確保できず、放熱性が低下してしまうこととなる。 However, as shown in FIG. 13, when the power module 101 is assembled to the inverter case 103 coated with the heat conductive grease 105, the fluidity of the heat conductive grease 105 is poor. When the power module 101 is fastened, the power module 101 receives a reaction force from the heat conductive grease 105 and deforms with both end portions of the heat conductive grease 105 as fulcrums P, resulting in an upwardly convex shape.
As described above, when the power module 101 is deformed so as to protrude upward, a gap Q is formed between the bottom surface of the power module 101 and the thermally conductive grease 105, and the power module 101 and the inverter case 103 are separated from each other. Adhesiveness cannot be ensured, and heat dissipation is reduced.

パワーモジュール１０１の底面と熱伝動性グリス１０５との間に隙間Ｑが生じないようにするためには、例えば、パワーモジュール１０１を、底面が下に凸の反り形状となるように予め形成しておき、組み付ける際には、熱伝動性グリス１０５に対してパワーモジュール１０１の中央部から先に接し、順次外側が接するように構成することで、隙間Ｑの発生を防ぐことが考えられる。
特許文献１にも、ヒートシンクに中央部が凸となる反りを予め形成しておいて、ヒートシンクと熱伝導材との間に隙間が生じることを防止する旨が記載されている。 In order to prevent the gap Q from being generated between the bottom surface of the power module 101 and the thermally conductive grease 105, for example, the power module 101 is formed in advance so that the bottom surface has a convex warped shape. When assembling, it is conceivable to prevent the generation of the gap Q by making contact with the heat conductive grease 105 first from the center of the power module 101 and sequentially contacting the outside.
Patent Document 1 also describes that a warp having a convex central portion is formed in advance on the heat sink to prevent a gap from being generated between the heat sink and the heat conducting material.

しかし、ヒートシンクやパワーモジュール１０１に、予め反りを形成するのでは、これらの材料等のコストが上昇することとなる。
また、単にパワーモジュール１０１底面の中央部に凸形状の反りを形成しただけで、インバータケース１０３に塗布される熱伝動性グリス１０５を均一な厚みに塗布していたのでは、
パワーモジュール１０１が熱伝動性グリス１０５の中央部から外側へ向けて接する際に、中央部の熱伝動性グリス１０５が外側へ押しやられて、端部の熱伝動性グリス１０５が厚くなってしまい、その端部の厚い熱伝動性グリス１０５の反力によりパワーモジュール１０１が変形して、結果的にパワーモジュール１０１とインバータケース１０３との間に隙間が生じてしまう恐れがある。 However, if the warp is formed on the heat sink or the power module 101 in advance, the cost of these materials and the like will increase.
In addition, by simply forming a convex warp at the center of the bottom of the power module 101 and applying the heat conductive grease 105 applied to the inverter case 103 to a uniform thickness,
When the power module 101 contacts the outer side from the central part of the heat conductive grease 105, the central heat conductive grease 105 is pushed outward, and the end part of the heat conductive grease 105 becomes thicker. The power module 101 may be deformed by the reaction force of the thick heat conductive grease 105 at the end, and as a result, a gap may be generated between the power module 101 and the inverter case 103.

上記課題を解決する本発明のパワーモジュール及びその組み付け方法は、以下の特徴を有する。
即ち、請求項１記載の如く、放熱板が装着されたパワーモジュールを、熱伝導性グリスを介してケースに組み付けるパワーモジュールの組み付け方法であって、パワーモジュールをケースに組み付ける前に、該パワーモジュールの放熱板面を予め加熱して、パワーモジュールに放熱板面が凸となる反りを形成し、該放熱板面の反り形成方向における一端側をケースに固定した後に、他端側をケースに固定する。
このように、予熱されたパワーモジュールにより熱伝導性グリスが加熱されて粘度が低下するため、熱伝導性グリスが広がり易くなる。
また、パワーモジュールは予熱により放熱板面が凸となる反り形状となっているので、ケースへ組み付けたとき、ケースと放熱板との間に空洞や隙間ができることがなく、両者が密着する。
これにより、コストを上昇させることなくパワーモジュールの放熱性を向上することができる。 The power module and the assembling method of the present invention for solving the above problems have the following features.
That is, according to the first aspect of the present invention, there is provided a method of assembling a power module to which a power module having a heat sink attached is attached to a case via a thermally conductive grease. The heat sink surface of the heat sink is pre-heated to form a warp on the power module with a convex heat sink surface, one end side of the heat sink surface in the warp forming direction is fixed to the case, and the other end side is then fixed to the case. To do.
Thus, since heat conductive grease is heated by the preheated power module and a viscosity falls, heat conductive grease becomes easy to spread.
Further, since the power module has a warped shape in which the heat radiating plate surface is convex due to preheating, when assembled to the case, there are no cavities or gaps between the case and the heat radiating plate, and both are in close contact.
Thereby, the heat dissipation of a power module can be improved, without raising cost.

また、請求項２記載の如く、前記熱伝導性グリスをケースに塗布する際には、パワーモジュールの前記反り形成方向における両端部の熱伝導性グリスを、中央部の熱伝導性グリスの厚みよりも薄く塗布する。
これにより、熱伝導性グリスの広がり抵抗が低減して薄く広がり易くなるとともに、熱伝導性グリスを全面に均一の厚さで塗布した場合のように、両端部で熱伝導性グリスの反力を受けてパワーモジュールが変形することもない。
そして、ケースと放熱板とが密着し、コストを上昇させることなくパワーモジュールの放熱性を向上することができる。 Further, as described in claim 2, when the thermally conductive grease is applied to the case, the thermal conductive grease at both ends in the warp forming direction of the power module is determined by the thickness of the thermally conductive grease at the center. Apply thinly.
This reduces the spreading resistance of the thermal conductive grease and makes it easier to spread thinly, and the reaction force of the thermal conductive grease is reduced at both ends as when the thermal conductive grease is applied to the entire surface with a uniform thickness. In response, the power module is not deformed.
And a case and a heat sink will closely_contact | adhere and can improve the heat dissipation of a power module, without raising a cost.

また、請求項３記載の如く、熱伝導性グリスを介してケースに組み付けられるパワーモジュールが、放熱板面を予熱することにより放熱板面が凸となる反りが形成されたパワーモジュールを、熱伝導性グリスがパワーモジュールの反り形成方向における中央部よりも両端部で薄く塗布されたケースに組み付けて構成される。
これにより、熱伝導性グリスが良く広がり、ケースと放熱板との間に空洞や隙間ができることがなく、パワーモジュールがケースへ組み付けられる。
また、両端部で熱伝導性グリスの反力を受けてパワーモジュールが変形することもない。
従って、パワーモジュールとケースとが密着して、コストを上昇させることなくパワーモジュールの放熱性を向上することができる。 According to a third aspect of the present invention, there is provided a power module that is assembled to the case via a heat conductive grease. The power module is formed by warping the heat sink plate with a convex shape by preheating the heat sink plate surface. The adhesive grease is assembled in a case where it is applied thinner at both ends than at the center in the warp forming direction of the power module.
Thereby, the heat conductive grease spreads well, and there is no space or gap between the case and the heat sink, and the power module is assembled to the case.
Further, the power module is not deformed by receiving the reaction force of the heat conductive grease at both ends.
Therefore, the power module and the case are in close contact with each other, and the heat dissipation of the power module can be improved without increasing the cost.

本発明によれば、パワーモジュールが予熱されていることにより、放熱板面が凸となる反り形状となるとともに、熱伝導性グリスが広がり易くなるので、ケースへ組み付けたとき、ケースと放熱板との間に空洞や隙間ができることがなく、両者が密着する。
また、両端部で熱伝導性グリスの反力を受けてパワーモジュールが変形することもない。
これにより、コストを上昇させることなくパワーモジュールの放熱性を向上することができる。 According to the present invention, since the power module is preheated, the heat sink surface has a warped shape with a convex shape, and the thermal conductive grease easily spreads. There are no cavities or gaps between them, and they are in close contact.
Further, the power module is not deformed by receiving the reaction force of the heat conductive grease at both ends.
Thereby, the heat dissipation of a power module can be improved, without raising cost.

次に、本発明を実施するための形態を、添付の図面を用いて説明する。
図１、図２に示すパワーモジュール１は、ＩＧＢＴ素子等の半導体素子が実装された基板（図示せず）を、合成樹脂等により構成されるハウジング１１にて覆い、さらに底部に放熱板１２を装着して構成されている。 Next, modes for carrying out the present invention will be described with reference to the accompanying drawings.
The power module 1 shown in FIG. 1 and FIG. 2 covers a substrate (not shown) on which a semiconductor element such as an IGBT element is mounted with a housing 11 made of synthetic resin or the like, and further has a heat sink 12 at the bottom. Installed and configured.

パワーモジュール１は、熱伝導性グリス５を介してインバータケース３に組み付けられており、熱伝導性グリス５によりパワーモジュール１の放熱板１２とインバータケース３とを密着させて、パワーモジュール１の半導体素子からの発熱をインバータケース３へ効率良く伝達するようにしている。   The power module 1 is assembled to the inverter case 3 via the heat conductive grease 5, and the heat radiation plate 12 of the power module 1 and the inverter case 3 are brought into close contact with the heat conductive grease 5, so that the semiconductor of the power module 1. Heat generated from the element is efficiently transmitted to the inverter case 3.

このように、パワーモジュール１を、熱伝導性グリス５を介してインバータケース３に組み付ける場合、まずインバータケース３に熱伝導性グリス５を塗布した上でパワーモジュール１を組み付けるが、この組み付けの際にパワーモジュール１と熱伝導性グリス５との間に隙間が生じてしまうと放熱性が悪くなってしまうため、隙間が生じないようにしてパワーモジュール１とインバータケース３との密着性を確保する必要がある。   As described above, when the power module 1 is assembled to the inverter case 3 via the heat conductive grease 5, first, the power module 1 is first assembled after applying the heat conductive grease 5 to the inverter case 3. If a gap is generated between the power module 1 and the thermally conductive grease 5, the heat dissipation is deteriorated. Therefore, the adhesion between the power module 1 and the inverter case 3 is ensured so that no gap is generated. There is a need.

そこで、本発明においては、次のようにパワーモジュール１をインバータケース３に組み付けて、パワーモジュール１とインバータケース３との密着性を向上させている。   Therefore, in the present invention, the power module 1 is assembled to the inverter case 3 as follows to improve the adhesion between the power module 1 and the inverter case 3.

まず、図３に示すように、インバータケース３上に、熱伝導性グリス５を塗布するためのマスク２１を載置し、図４に示すように、載置したマスク２１上に熱伝導性グリス５を滴下する。   First, as shown in FIG. 3, a mask 21 for applying the thermally conductive grease 5 is placed on the inverter case 3, and as shown in FIG. 4, the thermally conductive grease is placed on the placed mask 21. 5 is dropped.

その後、図５に示すように、スキージ２３により熱伝導性グリス５を広げて印刷する。スキージ２３により広げられた熱伝導性グリス５は、マスク２１の開口部２１ａを通じてインバータケース３上に転写され、マスク２１を取り外すと、図６に示すように、マスク２１の開口部２１ａの形状に応じて熱伝導性グリス５が塗布された状態となる。
なお、以降、パワーモジュール１やインバータケース３等の短手方向をＸ方向と称し、長手方向をＹ方向と称する（図１、図３等に図示）。 Thereafter, as shown in FIG. 5, the thermal conductive grease 5 is spread and printed by the squeegee 23. The thermally conductive grease 5 spread by the squeegee 23 is transferred onto the inverter case 3 through the opening 21a of the mask 21. When the mask 21 is removed, the shape of the opening 21a of the mask 21 is obtained as shown in FIG. Accordingly, the heat conductive grease 5 is applied.
Hereinafter, the short direction of the power module 1 and the inverter case 3 is referred to as the X direction, and the long direction is referred to as the Y direction (illustrated in FIGS. 1 and 3).

ここで、図７、図８に示すように、マスク２１は、例えばメタルマスクに構成されており、熱伝導性グリス５の塗布領域２１ｃに、複数の開口部２１ａが部分的に形成される部分開口マスクである。
開口部２１ａが形成される塗布領域２１ｃは、組み付けられるパワーモジュール１の放熱板１２の形状等に応じて設定されている。 Here, as shown in FIGS. 7 and 8, the mask 21 is configured, for example, as a metal mask, and a portion in which a plurality of openings 21 a are partially formed in the application region 21 c of the thermally conductive grease 5. It is an opening mask.
The application region 21c where the opening 21a is formed is set according to the shape of the heat sink 12 of the power module 1 to be assembled.

各開口部２１ａはマスク２１の短手方向（Ｘ方向）における中央部では開口面積が大きく形成されて、マスク２１の開口率が大きくなっており、中央部から両端部へいくにつれて各開口部２１ａの開口面積は小さくなって、マスク２１の開口率が減少している。   Each opening 21a has a large opening area at the center in the short direction (X direction) of the mask 21, and the opening ratio of the mask 21 increases, and each opening 21a increases from the center to both ends. The aperture area of the mask 21 is reduced, and the aperture ratio of the mask 21 is reduced.

このように構成されるマスク２１を用いて熱伝導性グリス５を塗布すると、Ｘ方向における中央部では開口率が大きいため熱伝導性グリス５の塗布量が多くなり、両端部では開口率が小さいため塗布量が少なくなる。   When the heat conductive grease 5 is applied using the mask 21 configured as described above, the amount of the heat conductive grease 5 applied is large because the opening ratio is large in the central portion in the X direction, and the opening ratio is small at both ends. Therefore, the application amount is reduced.

以上のように、熱伝導性グリス５をマスク２１を用いてインバータケース３に塗布する一方で、図９に示すように、組み付けるパワーモジュール１をホットプレート等の加熱器２８により予め加熱しておく。
パワーモジュール１の加熱器２８による予熱は、放熱板１２面側からの加熱のみを行う。これにより、放熱板１２面側の熱膨張度合いが他面側の熱膨張度合いよりも大きくなり、パワーモジュール１のＸ方向には、放熱板１２面が凸となる反りが生じる。すなわち、Ｘ方向は予熱による反り形成方向といえる。 As described above, the thermal conductive grease 5 is applied to the inverter case 3 using the mask 21, while the power module 1 to be assembled is preheated by the heater 28 such as a hot plate as shown in FIG. .
Preheating by the heater 28 of the power module 1 only performs heating from the surface of the heat radiating plate 12. Accordingly, the degree of thermal expansion on the surface side of the heat radiating plate 12 becomes larger than the degree of thermal expansion on the other side, and a warp in which the surface of the heat radiating plate 12 is convex occurs in the X direction of the power module 1. That is, the X direction can be said to be a warp formation direction due to preheating.

図１０に示すように、この予熱したパワーモジュール１を熱伝導性グリス５が塗布されたインバータケース３上に載置し、ボルト６にて締結して組み付ける。
このパワーモジュール１をインバータケース３上に載置して組み付ける場合は、次のように組み付けを行う。 As shown in FIG. 10, the preheated power module 1 is placed on the inverter case 3 to which the thermally conductive grease 5 is applied, and is fastened and assembled with bolts 6.
When this power module 1 is mounted on the inverter case 3 and assembled, it is assembled as follows.

つまり、図１１（ａ）に示すように、Ｘ方向においては、パワーモジュール１は放熱板１２面が凸となるように反っており、熱伝導性グリス５は中央部の塗布量が多くて厚くなっているため、載置されたパワーモジュール１は、中央部近辺に位置する支点Ｐにより支持されることとなる。この支点Ｐはパワーモジュール１にかかる熱伝導性グリス５の反力の支点である。   That is, as shown in FIG. 11A, in the X direction, the power module 1 is warped so that the surface of the heat radiating plate 12 is convex, and the thermal conductive grease 5 is thick with a large amount of coating in the central portion. Therefore, the placed power module 1 is supported by the fulcrum P located near the center. This fulcrum P is a fulcrum of reaction force of the heat conductive grease 5 applied to the power module 1.

図１１（ｂ）に示すように、この状態からＸ方向における一端側（図１１（ｂ）では左端側）のボルト６を締めると、パワーモジュール１の支点Ｐが一端側へ移動し、パワーモジュール１の一端部が熱伝導性グリス５に密着して、他端部（図１１（ｂ）では左端部）が反りにより浮き上がった姿勢となる。
なお、一端側のボルト６は、他端側のボルト６を締める前に全て締めておく。 As shown in FIG. 11 (b), when the bolt 6 on one end side in the X direction (left end side in FIG. 11 (b)) is tightened from this state, the fulcrum P of the power module 1 moves to one end side. One end of 1 is brought into close contact with the heat conductive grease 5, and the other end (left end in FIG. 11B) is lifted by warping.
The bolts 6 on one end side are all tightened before the bolts 6 on the other end side are tightened.

この状態からパワーモジュール１の他端部を押し下げてボルト６で締結すると、他端部を押し下げの押し下げ量に応じて支点Ｐが他端側に移動する。
支点Ｐが一端側から他端側へ移動する過程で熱伝導性グリス５を順次押し広げていくため、途中で気泡をかんだり空洞ができたりすることなく熱伝導性グリス５が一面に広がって、放熱板１２とインバータケース３とが密着する。 When the other end portion of the power module 1 is pushed down and fastened with the bolt 6 from this state, the fulcrum P moves to the other end side according to the amount by which the other end portion is pushed down.
As the fulcrum P moves from one end side to the other end side, the thermally conductive grease 5 is sequentially pushed and spread, so that the thermally conductive grease 5 spreads to one side without biting bubbles or forming cavities on the way. The heat sink 12 and the inverter case 3 are in close contact with each other.

図１１（ａ）〜（ｃ）に示すように、パワーモジュール１をインバータケース３に組み付ける際には、パワーモジュール１は予熱されているので、その熱により熱伝導性グリス５が加熱されて粘度が低下するため、熱伝導性グリス５が広がり易くなる。
また、パワーモジュール１は予熱により放熱板１２面が凸となる反り形状となっているので、インバータケース３へ組み付けたとき、インバータケース３と放熱板１２との間に空洞や隙間ができることがなく、両者が密着する。
これにより、パワーモジュール１の放熱性を向上することができる。 As shown in FIGS. 11A to 11C, when the power module 1 is assembled to the inverter case 3, since the power module 1 is preheated, the heat conductive grease 5 is heated by the heat and the viscosity is increased. Therefore, the heat conductive grease 5 is likely to spread.
Moreover, since the power module 1 has a warped shape in which the surface of the heat radiating plate 12 is convex due to preheating, when assembled to the inverter case 3, there is no space or gap between the inverter case 3 and the heat radiating plate 12. , Both are in close contact.
Thereby, the heat dissipation of the power module 1 can be improved.

さらに、マスク２１を部分開口型として、塗布領域２１ｃ内に熱伝導性グリス５の未塗布部分を形成するようにしているとともに、インバータケース３に塗布される熱伝導性グリス５の、中央部の塗布量に対する両端部の塗布量を少なくしているので、熱伝導性グリス５の広がり抵抗が低減して薄く広がり易くなるとともに、熱伝導性グリス５を全面に均一の厚さで塗布した場合のように、両端部で熱伝導性グリス５の反力を受けてパワーモジュール１が変形することもない。   Further, the mask 21 is a partial opening type so that an uncoated portion of the thermal conductive grease 5 is formed in the coating region 21c, and the central portion of the thermal conductive grease 5 applied to the inverter case 3 is formed. Since the coating amount at both ends with respect to the coating amount is reduced, the spreading resistance of the thermal conductive grease 5 is reduced and it becomes easy to spread thinly. Thus, the power module 1 is not deformed by receiving the reaction force of the heat conductive grease 5 at both ends.

本発明にかかるパワーモジュールを示す斜視図である。It is a perspective view which shows the power module concerning this invention. 同じくパワーモジュールを示す側面図である。It is a side view which similarly shows a power module. インバータケースに熱伝導性グリスを塗布するためのマスクを載置する様子を示す斜視図である。It is a perspective view which shows a mode that the mask for apply | coating heat conductive grease to an inverter case is mounted. マスクに熱伝導性グリスを滴下した様子を示す斜視図である。It is a perspective view which shows a mode that heat conductive grease was dripped at the mask. マスクに滴下した熱伝導性グリスをスキージにより広げる様子を示す斜視図である。It is a perspective view which shows a mode that the heat conductive grease dripped at the mask is extended with a squeegee. 熱伝導性グリスが塗布された状態のインバータケースを示す斜視図である。It is a perspective view which shows the inverter case of the state by which heat conductive grease was apply | coated. マスクを示す平面図である。It is a top view which shows a mask. マスクを示す側面断面図である。It is side surface sectional drawing which shows a mask. 加熱器によりパワーモジュールを予熱する様子を示す斜視である。It is a perspective view which shows a mode that a power module is pre-heated with a heater. パワーモジュールをインバータケースに組み付ける様子を示す斜視図である。It is a perspective view which shows a mode that a power module is assembled | attached to an inverter case. パワーモジュールのインバータケースへの組み付け時における支点の移動の様子を示す側面図である。It is a side view which shows the mode of the movement of the fulcrum at the time of the assembly | attachment to the inverter case of a power module. 従来の組み付け方でパワーモジュールをインバータケースに組み付ける様子を示す側面図である。It is a side view which shows a mode that a power module is assembled | attached to an inverter case by the conventional assembly method. 従来の組み付け方でパワーモジュールをインバータケースに組み付けた場合に生じるパワーモジュールの変形、及びその変形により発生する隙間を示す側面図である。It is a side view which shows the clearance gap which generate | occur | produces the deformation | transformation of the power module produced when the power module is assembled | attached to the inverter case by the conventional assembly method, and the deformation | transformation.

符号の説明Explanation of symbols

１ パワーモジュール
３ インバータケース
５ 熱伝導性グリス
１２ 放熱板
２１ マスク
２１ａ 開口部 DESCRIPTION OF SYMBOLS 1 Power module 3 Inverter case 5 Thermally conductive grease 12 Heat sink 21 Mask 21a Opening part

Claims (3)

放熱板が装着されたパワーモジュールを、熱伝導性グリスを介してケースに組み付けるパワーモジュールの組み付け方法であって、
パワーモジュールをケースに組み付ける前に、該パワーモジュールの放熱板面を予め加熱して、パワーモジュールに放熱板面が凸となる反りを形成し、
該放熱板面の反り形成方向における一端側をケースに固定した後に、他端側をケースに固定することを特徴とするパワーモジュールの組み付け方法。 A method for assembling a power module in which a power module equipped with a heat sink is assembled to a case via thermally conductive grease,
Before assembling the power module to the case, preheat the heat sink surface of the power module to form a warp on the power module with a convex heat sink surface,
A method for assembling a power module, comprising: fixing one end side of the heat sink surface in a warp forming direction to the case, and then fixing the other end side to the case. 前記熱伝導性グリスをケースに塗布する際には、
パワーモジュールの前記反り形成方向における両端部の熱伝導性グリスを、中央部の熱伝導性グリスの厚みよりも薄く塗布することを特徴とする請求項１に記載のパワーモジュールの組み付け方法。 When applying the thermally conductive grease to the case,
The method for assembling a power module according to claim 1, wherein the heat conductive grease at both ends in the warp forming direction of the power module is applied thinner than the thickness of the heat conductive grease at the center. 熱伝導性グリスを介してケースに組み付けられるパワーモジュールであって、
放熱板面を予熱することにより、放熱板面が凸となる反りが形成されたパワーモジュールを、
熱伝導性グリスがパワーモジュールの反り形成方向における中央部よりも両端部で薄く塗布されたケースに組み付けて構成されることを特徴とするパワーモジュール。
A power module that is assembled to the case via thermally conductive grease,
By preheating the heat sink surface, a power module with a warped heat sink surface is formed.
A power module characterized in that the heat conductive grease is assembled in a case where it is applied thinner at both ends than at the center in the warp forming direction of the power module.
JP2003317170A 2003-09-09 2003-09-09 Assembling the power module Expired - Fee Related JP4127166B2 (en)

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