JP2005071063A - Icタグ及びicタグの製造方法 - Google Patents
Icタグ及びicタグの製造方法 Download PDFInfo
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- JP2005071063A JP2005071063A JP2003299499A JP2003299499A JP2005071063A JP 2005071063 A JP2005071063 A JP 2005071063A JP 2003299499 A JP2003299499 A JP 2003299499A JP 2003299499 A JP2003299499 A JP 2003299499A JP 2005071063 A JP2005071063 A JP 2005071063A
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Abstract
この発明は、柔軟性を持たせて物品の曲面部への貼付けを可能にし、さらに袋状に密封して耐水性を持たせ、しかも薄型でありながら十分な耐外力性を有するICタグを提供する。
【解決手段】
この発明は、誘導電磁界を用いて非接触にデータ通信するアンテナコイルと認証情報を記録したICとの電子部品を備えた柔軟性を有する電子部品保持フィルムを設け、この電子部品保持フィルムを中心層にして、その上下面を電子部品よりも厚い柔軟性を有する内層保護フィルムと、その外側全体を覆う柔軟性および熱可塑性を有する外層保護フィルムとで覆い、前記外層保護フィルムの外周縁部を加熱圧着して袋状に密封したICタグを設ける。
【選択図】 図3
Description
図面はICタグを示し、図1において、このICタグ11は先に述べた物品の外面に貼付けて使用され、貼付けたICタグ11の認証情報を読取って物品の管理を行う。
先ず、アンテナコイル12bとIC12cとを備えた電子部品保持フィルム12を設けておき、この電子部品保持フィルム12を中心層にして、図4(A)に示すように、その上下面に、上内層保護フィルム13と下内層保護フィルム14とを対設させて3層に重ね合わせる。このとき、IC12cの周辺を空間部13a,14aで保護できるように、IC12cと各空間部13a,14aの位置を位置合せして重ね合せる。
12…電子部品保持フィルム
12c…IC
13,14…内層保護フィルム
13a,14a…空間部
15,16…外層保護フィルム
Claims (3)
- 誘導電磁界を用いて非接触にデータ通信するアンテナコイルと認証情報を記録したICとの電子部品を備えた柔軟性を有する電子部品保持フィルムと、
前記電子部品保持フィルムを覆う大きさと前記電子部品よりも厚い柔軟性を有する上下2枚の内層保護フィルムと、
前記上下2枚の内層保護フィルムの上下面を覆う柔軟性および熱可塑性を有する上下2枚の外層保護フィルムとを設け、
前記電子部品保持フィルムを中心層にして、その上下面を前記内層保護フィルムと外層保護フィルムとで覆い、前記外層保護フィルムの外周縁部を加熱圧着して袋状に密封した
ICタグ。 - 前記内層保護フィルムは、該内層保護フィルムを前記電子部品保持フィルムに重ね合わせたとき、前記電子部品保持フィルムに搭載されているICに接触しないIC保護用の空間部を形成した
請求項1記載のICタグ。 - 前記内層保護フィルムは、少なくとも前記中心層としての電子部品保持フィルムとの対接面間を固定せずに重ね合わせた
請求項1記載のICタグ。
Priority Applications (1)
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JP2003299499A JP3836096B2 (ja) | 2003-08-25 | 2003-08-25 | Icタグ及びicタグの製造方法 |
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JP2003299499A JP3836096B2 (ja) | 2003-08-25 | 2003-08-25 | Icタグ及びicタグの製造方法 |
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JP2005071063A true JP2005071063A (ja) | 2005-03-17 |
JP3836096B2 JP3836096B2 (ja) | 2006-10-18 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007034474A (ja) * | 2005-07-25 | 2007-02-08 | Dainippon Printing Co Ltd | Icタグの貼付構造 |
JP2007123859A (ja) * | 2005-09-30 | 2007-05-17 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
WO2008047630A1 (fr) * | 2006-10-12 | 2008-04-24 | Dai Nippon Printing Co., Ltd. | Étiquette à marqueur à circuits imprimés |
JP2008204380A (ja) * | 2007-02-22 | 2008-09-04 | Nozaki Insatsu Shigyo Kk | 個人識別用非接触icタグおよび個人識別機能付き靴 |
JP2009295936A (ja) * | 2008-06-09 | 2009-12-17 | Ricoh Co Ltd | 電子デバイスチップ及びパターン配線シート |
JP2012221421A (ja) * | 2011-04-13 | 2012-11-12 | Toppan Printing Co Ltd | Icタグ |
US8357567B2 (en) | 2005-09-30 | 2013-01-22 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
KR101326194B1 (ko) | 2012-10-19 | 2013-11-20 | 이진재 | Rfid 태그 조립체 및 이를 구비한 전자 보호대 |
JP2017027502A (ja) * | 2015-07-27 | 2017-02-02 | 富士通株式会社 | Rfidタグ |
-
2003
- 2003-08-25 JP JP2003299499A patent/JP3836096B2/ja not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007034474A (ja) * | 2005-07-25 | 2007-02-08 | Dainippon Printing Co Ltd | Icタグの貼付構造 |
JP2007123859A (ja) * | 2005-09-30 | 2007-05-17 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US8357567B2 (en) | 2005-09-30 | 2013-01-22 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
WO2008047630A1 (fr) * | 2006-10-12 | 2008-04-24 | Dai Nippon Printing Co., Ltd. | Étiquette à marqueur à circuits imprimés |
JPWO2008047630A1 (ja) * | 2006-10-12 | 2010-02-25 | 大日本印刷株式会社 | Icタグラベル |
US8120496B2 (en) | 2006-10-12 | 2012-02-21 | Dai Nippon Printing Co., Ltd. | IC tag label |
JP2008204380A (ja) * | 2007-02-22 | 2008-09-04 | Nozaki Insatsu Shigyo Kk | 個人識別用非接触icタグおよび個人識別機能付き靴 |
JP2009295936A (ja) * | 2008-06-09 | 2009-12-17 | Ricoh Co Ltd | 電子デバイスチップ及びパターン配線シート |
JP2012221421A (ja) * | 2011-04-13 | 2012-11-12 | Toppan Printing Co Ltd | Icタグ |
KR101326194B1 (ko) | 2012-10-19 | 2013-11-20 | 이진재 | Rfid 태그 조립체 및 이를 구비한 전자 보호대 |
JP2017027502A (ja) * | 2015-07-27 | 2017-02-02 | 富士通株式会社 | Rfidタグ |
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JP3836096B2 (ja) | 2006-10-18 |
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