JP2005064379A - Wiring board and its manufacturing method - Google Patents

Wiring board and its manufacturing method Download PDF

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JP2005064379A
JP2005064379A JP2003295326A JP2003295326A JP2005064379A JP 2005064379 A JP2005064379 A JP 2005064379A JP 2003295326 A JP2003295326 A JP 2003295326A JP 2003295326 A JP2003295326 A JP 2003295326A JP 2005064379 A JP2005064379 A JP 2005064379A
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component
pin insertion
substrate
sided
components
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JP4225164B2 (en
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Hiroshi Kobayashi
洋 小林
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Teac Corp
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Teac Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To simply manufacture a substrate, on which a pin inserting component and a surface mounting part are mixed and loaded, at a low cost. <P>SOLUTION: A one-surface substrate 10 for the pin inserting parts in which surface-mounting component avoiding holes 11 are bored and the pin inserting components 12 are mounted on one surface while being inserted and soldered to pinholes, is superposed to the one-surface substrate 20 for the surface mounting components in which pin-inserting component avoiding holes 21 are bored and the surface mounting components 22 are fixed temporarily on one surface by soldering paste. The one-surface substrate 20 is inserted into a reflow furnace, heated and cooled and the surface mounting components 22 are soldered and mounted on the one-surface substrate 20 for the surface mounting parts while a pattern 14 for joining the substrate of the one-surface substrate 10 for the pin inserting components and the pattern for joining the substrate of the one-surface substrate 20 for the surface mounting components are soldered. The one-surface substrate 10 for the pin inserting components and the one-surface substrate 20 for the surface mounting components are unified. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ピン挿入部品と表面実装部品とを混載した配線基板、およびその製造方法に関するものである。   The present invention relates to a wiring board in which a pin insertion component and a surface mounting component are mixedly mounted, and a manufacturing method thereof.

この種の配線基板を廉価に製造するためには、配線パターンが片面にのみ形成される、いわゆる片面基板の採用が不可欠となる。その場合、例えば図６に示したように、表面実装部品２２は片面基板１の図示しない配線パターンが設けられた面に位置し、ピン１３をピン穴に嵌挿することで片面基板１に固定されるピン挿入部品１２はその反対側に位置することになる。   In order to inexpensively manufacture this type of wiring board, it is indispensable to adopt a so-called single-sided board in which a wiring pattern is formed only on one side. In this case, for example, as shown in FIG. 6, the surface mounting component 22 is positioned on the surface of the single-sided substrate 1 on which a wiring pattern (not shown) is provided, and is fixed to the single-sided substrate 1 by inserting the pins 13 into the pin holes. The pin insertion component 12 is positioned on the opposite side.

その製造工程としては、例えば図７に例示したように表面実装部品２２をボンド２により片面基板１の配線パターン側である半田面側に仮止めし、次にピン挿入部品１２のピン１３を片面基板１のピン穴に挿入してピン挿入部品１２をその反対側に仮止めする。続いて、半田面側にフラックスを塗布して溶融半田３Ａが貯留された半田槽３に浸漬し、ピン挿入部品１２と表面実装部品２２とを同時に片面基板１に半田付けして実装する。   As the manufacturing process, for example, as illustrated in FIG. 7, the surface mounting component 22 is temporarily fixed to the solder surface side which is the wiring pattern side of the single-sided substrate 1 by the bond 2, and then the pin 13 of the pin insertion component 12 is single-sided. It inserts into the pin hole of the board | substrate 1, and temporarily fixes the pin insertion component 12 to the other side. Subsequently, flux is applied to the solder surface side and immersed in the solder bath 3 in which the molten solder 3A is stored, and the pin insertion component 12 and the surface mounting component 22 are simultaneously soldered and mounted on the single-sided substrate 1.

しかし、上記製造方法においては、
１）専用のボンド塗布装置が必要になる。
汎用のボンド塗布装置では、表面実装する部品の実装精度・強度が不安定になり、また、高速実装する生産ラインに対応することができない。
２）専用のフラックス塗布装置が必要になる。
汎用のフラックス塗布装置では、多用な形状の表面実装部品の要部にフラックスを塗布することができないため、半田付け品質がばらつく。
３）表面実装部品の半田付け部に気泡が発生し、半田不良となり易い。
半田槽への浸漬時にフラックスより発生するガスは、ピン挿入部品ではピン穴を通って上方に抜けるが、表面実装部品ではガスが抜ける穴がないため、表面実装部品の近傍に滞留して半田不良を引き起こし易い。
４）溶融半田に浸漬される表面実装部品が鉛フリー半田の溶融温度に耐えられない。
鉛公害を廃絶するため、鉛入り半田から鉛フリー半田に切り換わりつつある。しかし、鉛フリー半田では鉛入り半田より半田槽の温度は２０〜５０℃も高くする必要があり、溶融半田に浸漬される表面実装部品の選択肢が狭まる(使用不能な部品もある)。
などと云った問題点があった。 However, in the above manufacturing method,
1) A dedicated bond coating device is required.
In general-purpose bond coating apparatuses, the mounting accuracy and strength of parts to be surface-mounted are unstable, and cannot be applied to a production line for high-speed mounting.
2) A dedicated flux application device is required.
In a general-purpose flux coating apparatus, the flux cannot be applied to the main part of the surface mount component having various shapes, so that the soldering quality varies.
3) Air bubbles are generated in the soldered portion of the surface mount component, and solder failure is likely to occur.
The gas generated from the flux when immersed in the solder bath passes upward through the pin hole in the pin insertion part, but there is no hole through which the gas escapes in the surface mount part. It is easy to cause.
4) Surface mount components immersed in molten solder cannot withstand the melting temperature of lead-free solder.
In order to eliminate lead pollution, lead-containing solder is being switched to lead-free solder. However, in the case of lead-free solder, the temperature of the solder bath needs to be 20 to 50 ° C. higher than that of lead-containing solder, and the options for surface-mounted components immersed in molten solder are narrowed (some components cannot be used).
There was a problem such as.

また、図８に示したように、チップ化印刷配線基板４に複数の図示しないスルーホールを設け、そのチップ化印刷配線基板４の裏面の端部に、スルーホールに対応する複数のパット５を形成し、そのパット５とスルーホールとを導体パターン６で接続した状態で、スルーホールにピン挿入部品であるディップ部品７のピンを挿入して半田槽に浸漬し、チップ化印刷配線基板４にピン挿入部品のディップ部品７を搭載し、そのディップ部品７が搭載されたチップ化印刷基板４を搭載するチップ部品搭載用基板８の所要部に、チップ部品搭載用穴８Ａを開設し、その周囲にチップ化印刷配線基板４に形成したパット５に対応するパット５Ａを設けた状態で、図示しないピン挿入部品と他の全ての表面実装部品を搭載して、半田リフローにより一工程で接着して、ピン挿入部品と表面実装部品と混載した基板を製造するようにした技術も周知である（特許文献１）。   Further, as shown in FIG. 8, a plurality of through holes (not shown) are provided in the chipped printed wiring board 4, and a plurality of pads 5 corresponding to the through holes are formed on the back end of the chipped printed wiring board 4. In the state where the pad 5 and the through hole are connected by the conductor pattern 6, the pin of the dip component 7, which is a pin insertion component, is inserted into the through hole and immersed in a solder bath, and the chip printed wiring board 4 is formed. A chip component mounting hole 8A is formed in a required part of the chip component mounting board 8 on which the dip part 7 of the pin insertion part is mounted, and the chip printed board 4 on which the dip part 7 is mounted is opened. In the state where the pad 5A corresponding to the pad 5 formed on the chip printed wiring board 4 is provided, a pin insertion part (not shown) and all other surface mounting parts are mounted, and one work is performed by solder reflow. In bonded, pin insertion component and surface mount components and mixed with the techniques so as to produce a substrate are also known (Patent Document 1).

図８に提案された基板の製造方法によれば、製造工数の減少と、部品実装時の作業能率の改善とが図れると記載されている。   According to the board manufacturing method proposed in FIG. 8, it is described that the number of manufacturing steps can be reduced and the work efficiency at the time of component mounting can be improved.

特開昭６１−７６９３号公報Japanese Patent Application Laid-Open No. 61-7693

しかし、特許文献１に提案された基板の製造方法においては、チップ部品搭載用基板にチップ化印刷配線基板を載置する工程が、実際には大変な作業になると云った問題点がある。すなわち、チップ部品搭載用基板に対し、通常はチップ化印刷配線基板が極めて小さいために、その位置決め載置を高精度で行うことが困難であった。   However, the substrate manufacturing method proposed in Patent Document 1 has a problem that the process of placing the chip printed wiring board on the chip component mounting board is actually a difficult task. That is, since the chip printed wiring board is usually extremely small with respect to the chip component mounting board, it has been difficult to position and place it with high accuracy.

加えて、１枚のチップ部品搭載用基板に１枚のチップ化印刷配線基板を搭載するだけでも大変な作業であるのに、１枚のチップ部品搭載用基板に大きさ・形状の異なる複数のチップ化印刷配線基板を搭載するときには、その作業を機械化することは資金効率の面から困難であるので、人手に頼ることになるが、１枚のチップ部品搭載用基板に多数のチップ化印刷配線基板を人手によって搭載する作業は困難を極めるだけでなく、そのような作業環境下で製造した基板は品質が磐石なものではなくなると云った問題点があった。   In addition, even if only one chip printed wiring board is mounted on one chip component mounting board, it is a difficult task, but a single chip component mounting board has a plurality of different sizes and shapes. When mounting a chip printed wiring board, it is difficult to mechanize the work from the viewpoint of financial efficiency, so it depends on human beings, but many chip printed wirings are mounted on one chip component mounting board. The work of manually mounting a substrate is not only extremely difficult, but there is a problem that the quality of a substrate manufactured in such a working environment is not so high.

そのため、ピン挿入部品と表面実装部品とが混載された基板が簡単に、且つ、廉価に製造できるようにする必要があり、それが解決すべき課題であった。   Therefore, it is necessary to make it possible to easily and inexpensively manufacture a substrate on which a pin insertion component and a surface mounting component are mixedly mounted, which is a problem to be solved.

本発明は、ピン挿入部品回避穴が開設されて片面に表面実装部品が半田ペーストにより仮止めされた表面実装部品用片面基板に、表面実装部品回避穴が開設されて片面にピン挿入部品が嵌挿半田付けされたピン挿入部品用片面基板を重ねてリフロー炉に挿入し、加熱・冷却して表面実装部品を表面実装部品用片面基板に半田付けすると共に、ピン挿入部品用片面基板と表面実装部品用片面基板とを半田付け一体化することを最も主要な特徴とする。   In the present invention, a surface-mounted component avoidance hole is opened and a pin insertion component is fitted on one side of a single-sided substrate for surface-mount component where a surface insertion component is temporarily fixed with solder paste on one side. The soldered single-sided board for pin insertion parts is stacked and inserted into a reflow furnace, heated and cooled to solder the surface-mounted parts to the single-sided board for surface-mounted parts, and the single-sided board for pin insertion parts and surface mounting The most important feature is that the component single-sided board is integrated by soldering.

本発明は、表面実装部品を基板の片面に半田付けにより固定して実装する従来確立された表面実装部品搭載基板の製造技術と、ピン挿入部品を基板の片面に嵌挿半田付けして固定実装する従来確立されたピン挿入部品搭載基板の製造技術とを併用して、表面実装部品とピン挿入部品とを混載する片面基板を製造する製造方法であるので、本発明により製造する基板の品質は従来技術により製造した基板の品質と同等である。   In the present invention, a surface-mount component mounting substrate manufacturing technology for mounting a surface-mount component on one side of a substrate by soldering and mounting, and a pin-inserted component on one side of the substrate, soldering and mounting Since this is a manufacturing method for manufacturing a single-sided substrate in which a surface mounting component and a pin insertion component are mixedly mounted in combination with a conventional technology for manufacturing a pin insertion component mounting substrate, the quality of the substrate manufactured according to the present invention is It is equivalent to the quality of the substrate manufactured by the prior art.

しかも、製造時に表面実装部品が溶融半田槽に浸漬されることがないので、溶融温度の高い鉛フリー半田を用いた部品の実装が制約を受けることなく実行できる。   Moreover, since the surface-mounted component is not immersed in the molten solder tank during manufacturing, mounting of the component using lead-free solder having a high melting temperature can be performed without any restrictions.

また、表面実装部品用片面基板にはピン挿入部品回避穴が開設され、ピン挿入部品用片面基板には表面実装部品回避穴が開設されて、表面実装部品用片面基板とピン挿入部品用片面基板とを一体化するときに、表面実装部品用片面基板の表面実装部品とピン挿入部品用片面基板のピン挿入部品とが干渉しない構造となっているので、設計の自由度が高い。   In addition, a pin insertion component avoidance hole is established in the single-sided substrate for surface mount components, and a surface mount component avoidance hole is established in the single-sided substrate for pin insertion components. Since the surface mounting component of the single-sided substrate for surface mounting components and the pin insertion component of the single-sided substrate for pin insertion components do not interfere with each other, the degree of freedom in design is high.

また、直交する２方向それぞれにおいて同一寸法となる部位があるように表面実装部品用片面基板とピン挿入部品用片面基板とを設ける発明においては、対応する各辺を重ねるだけで、表面実装部品用片面基板とピン挿入部品用片面基板との位置合せが行える。   Further, in the invention in which the single-sided board for surface mounting components and the single-sided board for pin insertion components are provided so that there are parts having the same dimensions in each of the two orthogonal directions, it is only necessary to overlap the corresponding sides for the surface mounting component. The single-sided board and the single-sided board for pin insertion parts can be aligned.

また、表面実装部品用片面基板の配線パターン端部とピン挿入部品用片面基板の配線パターン端部とが接合されて表面実装部品用片面基板とピン挿入部品用片面基板とが一体化される発明においては、表面実装部品用片面基板とピン挿入部品用片面基板とを接合するだけの部材を使用することがないので、コストの削減が図れる。   Further, the invention is such that the single-sided substrate for surface-mounting component and the single-sided substrate for pin insertion component are integrated by joining the wiring pattern end of the single-sided substrate for surface-mounting component and the wiring pattern end of the single-sided substrate for pin insertion component. In this case, it is not necessary to use a member that only joins the single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components, so that the cost can be reduced.

一方、表面実装部品用片面基板とピン挿入部品用片面基板とが、電気配線とは無関係に設けられた接合部において互いに接合されて一体化される発明においては、配線パターンを設計する際の自由度が高くると共に、表面実装部品用片面基板とピン挿入部品用片面基板との接合部を基板の周辺部に設けると、前記接合部を基板中央部に設けたときより接合部の加熱と冷却が速やかに行えるので、製造工程のスピードアップが図れる。   On the other hand, in the invention in which the single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components are joined together at a joint provided independently of the electrical wiring, the freedom in designing the wiring pattern When the joint between the single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components is provided at the periphery of the substrate, the heating and cooling of the joint is greater than when the joint is provided at the center of the substrate. Can be done quickly, so the manufacturing process can be speeded up.

なお、表面実装部品用基板とピン挿入部品用基板とを一体化する工程が必要となるが、表面実装部品用基板に表面実装部品を実装する工程、ピン挿入部品用基板にピン挿入部品を実装する工程は従来装置を使用して行うことが可能であり、特別な装置を作製したり、製造工数が大幅に増加することもないので、製造コストの増大を招くこともない。   In addition, it is necessary to integrate the surface mount component substrate and the pin insertion component substrate, but the step of mounting the surface mount component on the surface mount component substrate, mounting the pin insertion component on the pin insert component substrate This process can be performed using a conventional apparatus, and a special apparatus is not manufactured and the number of manufacturing steps is not significantly increased. Therefore, the manufacturing cost is not increased.

ピン挿入部品回避穴が開設されて片面に表面実装部品が半田ペーストにより仮止めされた表面実装部品用片面基板に表面実装部品回避穴が開設されて片面にピン挿入部品が半田付けにより固定されたピン挿入部品用片面基板を重ねて所定温度に昇温されているリフロー炉に投入し、所定温度に加熱して表面実装部品を表面実装部品用片面基板に半田付けすると共に、表面実装部品用片面基板とピン挿入部品用片面基板とを貼り合わせて一体化する。   A pin insertion component avoidance hole was opened, and a surface mount component avoidance hole was opened on one side of the surface mount component single-sided substrate, where the surface mount component was temporarily fixed on one side by solder paste, and the pin insertion component was fixed on one side by soldering Place the single-sided board for pin insertion parts into a reflow furnace that has been heated to a predetermined temperature, heat it to the specified temperature, and solder the surface-mounted parts to the single-sided board for surface-mounted parts. The substrate and the single-sided substrate for pin insertion parts are bonded together to be integrated.

本発明の一実施例を、図１〜図４に基づいて説明する。先ず、ピン挿入部品用片面基板１０に所要のピン挿入部品１２を実装する。なお、片面（図面においては下面）に所要の図示しない配線パターンを備えるピン挿入部品用片面基板１０は、外形が矩形に形成されており、表面実装部品回避穴１１が複数個開設されている。   An embodiment of the present invention will be described with reference to FIGS. First, the required pin insertion component 12 is mounted on the single-sided substrate 10 for pin insertion components. The single-sided board for pin insertion component 10 having a required wiring pattern (not shown) on one side (the lower side in the drawing) has a rectangular outer shape, and has a plurality of surface-mounted component avoidance holes 11.

また、ピン挿入部品用片面基板１０には図示しないピン穴が所要部所に多数開設されており、ピン挿入部品１２は配線パターンが形成されていない上面側からそのピン１３が該当するピン穴に挿し込まれて、配線パターンが形成されていない上面に仮止めされる。   In addition, the pin insertion component single-sided substrate 10 has a large number of pin holes (not shown) at required portions, and the pin insertion component 12 has its pin 13 in the corresponding pin hole from the upper surface side where no wiring pattern is formed. It is inserted and temporarily fixed to the upper surface where no wiring pattern is formed.

なお、ピン挿入部品用片面基板１０の図示しない配線パターンが形成されている下面には、導電性金属からなる基板接合用パターン１４が設けられている。この基板接合用パターン１４は、ピン１３がピン穴に嵌挿されて上面に実装されるピン挿入部品１２と図示しない配線パターンを介して電気的に接続される。   A substrate bonding pattern 14 made of a conductive metal is provided on the lower surface of the pin insertion component single-sided substrate 10 where a wiring pattern (not shown) is formed. The substrate bonding pattern 14 is electrically connected to a pin insertion component 12 that is mounted on the upper surface by inserting the pin 13 into the pin hole via a wiring pattern (not shown).

その後、所要のフラックスを塗布し、図示しない半田槽内の溶融半田にピン挿入部品用片面基板１０の下面を浸漬してピン挿入部品１２のピン１３と基板裏面の配線パターンとを接続し、ピン挿入部品１２をピン挿入部品用片面基板１０の上面に固定・実装する。   Thereafter, a required flux is applied, and the lower surface of the single-sided substrate 10 for pin insertion component is immersed in molten solder in a solder bath (not shown) to connect the pin 13 of the pin insertion component 12 and the wiring pattern on the back surface of the substrate. The insertion component 12 is fixed and mounted on the upper surface of the single-sided substrate 10 for pin insertion components.

なお、ピン挿入部品用片面基板１０の片面（上面）に所要のピン挿入部品１２を実装する上記技術は、ピン挿入部品を片面に実装する従来技術と何ら変るものではない。   The above-described technology for mounting the required pin insertion component 12 on one side (upper surface) of the single-sided substrate 10 for pin insertion component is not different from the conventional technology for mounting the pin insertion component on one side.

一方、表面実装部品用片面基板２０にも所要の表面実装部品２２を仮止めする。片面（上面）に所要の図示しない配線パターンが形成された表面実装部品用片面基板２０は、外形がピン挿入部品用片面基板１０と同形に形成されており、この表面実装部品用片面基板２０にもピン挿入部品回避穴２１が複数個開設されている。   On the other hand, the required surface mount component 22 is also temporarily fixed to the single-sided substrate 20 for surface mount components. The single-sided substrate 20 for surface mounting components having a required wiring pattern (not shown) formed on one side (upper surface) has the same outer shape as the single-sided substrate 10 for pin insertion components. Also, a plurality of pin insertion component avoidance holes 21 are opened.

なお、表面実装部品用片面基板２０の上面には導電性金属からなる基板接合用パターン２３が設けられている。この基板接合用パターン２３は、上面に実装される表面実装部品２２と図示しない配線パターンを介して電気的に接続される。また、この基板接合用パターン２３は、ピン挿入部品用片面基板１０の下面に設けられている基板接合用パターン１４に相当する部位に設けられている。   A substrate bonding pattern 23 made of a conductive metal is provided on the upper surface of the single-sided substrate 20 for surface mount components. The substrate bonding pattern 23 is electrically connected to a surface mounting component 22 mounted on the upper surface via a wiring pattern (not shown). The substrate bonding pattern 23 is provided at a portion corresponding to the substrate bonding pattern 14 provided on the lower surface of the single-sided substrate 10 for pin insertion component.

そして、表面実装部品用片面基板２０の図示しない配線パターンが形成された上面に図示しない半田ペースト（細粒化された半田粒を液状物に練り込んで、粘着性を有するペースト状にしたもの）を塗布し、さらにその上に表面実装部品２２を載置し、半田ペーストの粘着力により表面実装部品２２を表面実装部品用片面基板２０の所要部に仮止めする。   Then, a solder paste (not shown) is formed on the upper surface of the single-sided substrate 20 for surface mounting components on which a wiring pattern (not shown) is formed (a paste having adhesiveness by kneading finely divided solder grains into a liquid material). Furthermore, the surface mounting component 22 is mounted thereon, and the surface mounting component 22 is temporarily fixed to a required portion of the single-sided substrate 20 for surface mounting component by the adhesive force of the solder paste.

上記の表面実装部品用片面基板２０の片面（上面）に所要の表面実装部品２２を仮止めする技術も、表面実装部品を片面に実装する従来技術と何ら変るものではない。   The technology for temporarily fixing the required surface mounting component 22 to one surface (upper surface) of the single-sided substrate 20 for surface mounting components is not different from the conventional technology for mounting the surface mounting component on one surface.

そして、上面に多数の表面実装部品２２が仮止めされた表面実装部品用片面基板２０の上に、多数のピン挿入部品１２が上面に実装されたピン挿入部品用片面基板１０を重ね、重ね合わされたピン挿入部品用片面基板１０、表面実装部品用片面基板２０の例えば各辺中央部分に挟持部材４０を嵌合させることで、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは位置合わせされた状態で機械的に一体化される。   Then, the single-sided substrate 10 for pin insertion component with the many pin insertion components 12 mounted on the upper surface is superposed on the single-sided substrate 20 for surface mounting component with the numerous surface mounting components 22 temporarily fixed on the upper surface. The pin insertion component single-sided substrate 10 and the surface-mounted component single-sided substrate 20 are fitted to, for example, the center of each side of the pin insertion component single-sided substrate 10 and the surface-mounted component single-sided substrate 20. It is mechanically integrated in the aligned state.

その際、ピン挿入部品用片面基板１０には表面実装部品用片面基板２０に実装する表面実装部品２２に対する表面実装部品回避穴１１が開設され、表面実装部品用片面基板２０にはピン挿入部品用片面基板１０に実装するピン挿入部品１２に対するピン挿入部品回避穴２１が開設されているので、ピン挿入部品用片面基板１０を表面実装部品用片面基板２０に重ねても、ピン挿入部品用片面基板１０に実装されたピン挿入部品１２と表面実装部品用片面基板２０に仮止めされた表面実装部品２２とが干渉し合うことはない。   At that time, the surface-mounted component avoidance hole 11 for the surface-mounted component 22 to be mounted on the surface-mounted component single-sided substrate 20 is opened in the pin-inserted component single-sided substrate 10. Since the pin insertion component avoidance hole 21 for the pin insertion component 12 to be mounted on the single-sided substrate 10 is provided, even if the single-sided substrate 10 for pin-insertion component is overlapped with the single-sided substrate 20 for surface-mounted component, the single-sided substrate for pin insertion component The pin insertion component 12 mounted on 10 and the surface mounting component 22 temporarily fixed to the single-sided substrate 20 for surface mounting components do not interfere with each other.

また、ピン挿入部品用片面基板１０を表面実装部品用片面基板２０に重ねたとき、ピン挿入部品用片面基板１０の基板接合用パターン１４と表面実装部品用片面基板２０の基板接合用パターン２３とは、表面実装部品用片面基板２０に塗布された半田ペーストを介して接する。   Further, when the single-sided substrate 10 for pin insertion component is superimposed on the single-sided substrate 20 for surface mounting component, the substrate bonding pattern 14 of the single-sided substrate 10 for pin insertion component and the substrate bonding pattern 23 of the single-sided substrate 20 for surface mounting component Are in contact via a solder paste applied to the single-sided substrate 20 for surface mount components.

また、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは外形が同形に形成されているので、対応する辺を一致させて重ね合わせたピン挿入部品用片面基板１０、表面実装部品用片面基板２０の例えば各辺中央部分に挟持部材４０を嵌合させることで、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは位置合わせされた状態で機械的に一体化される。   Moreover, since the outer shape of the single-sided substrate 10 for pin insertion component and the single-sided substrate 20 for surface mount component is formed in the same shape, the single-sided substrate 10 for pin insertion component and the surface mount component which are overlapped with corresponding sides aligned with each other For example, the pin-inserting component single-side substrate 10 and the surface-mount component single-side substrate 20 are mechanically integrated in a state of being aligned by fitting the clamping member 40 to, for example, the center of each side of the single-side substrate 20 for use. The

また、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは外形が同形に形成されているので、ピン挿入部品用片面基板１０を表面実装部品用片面基板２０に重ね、平行な２辺の対向する部分に挟持部材４０を奥まで嵌め込む操作を行うことでも、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０との位置合せができる。   In addition, since the outer shape of the single-sided substrate for pin insertion component 10 and the single-sided substrate for surface-mount component 20 are formed in the same shape, the single-sided substrate for pin insertion component 10 is overlapped with the single-sided substrate for surface-mount component 20 and parallel 2 The pin insertion component single-sided substrate 10 and the surface-mounted component single-sided substrate 20 can also be aligned by performing an operation of fitting the clamping member 40 all the way into the opposing portions of the sides.

そして、４個の挟持部材４０により機械的に一体化されたピン挿入部品用片面基板１０と表面実装部品用片面基板２０とを、図示しないそれ自体は従来周知のリフロー炉に搬入して加熱し、その後冷却することにより、表面実装部品用片面基板２０の上面に塗布された半田ペーストによって表面実装部品用片面基板２０に仮止めされている表面実装部品２２を、半田ペーストの溶融・凝固により表面実装部品用片面基板２０に固定し実装する。   Then, the single-sided substrate for pin insertion component 10 and the single-sided substrate for surface mount component 20 mechanically integrated by the four clamping members 40 are carried into a conventionally known reflow furnace (not shown) and heated. Then, by cooling, the surface mount component 22 temporarily fixed to the surface mount component single-sided substrate 20 by the solder paste applied to the upper surface of the surface mount component single-sided substrate 20 is melted and solidified by the solder paste. It is fixed and mounted on the single-sided substrate 20 for mounting components.

また、この加熱・冷却工程により、ピン挿入部品用片面基板１０の基板接合用パターン１４と表面実装部品用片面基板２０の基板接合用パターン２３とが半田ペーストの溶融・凝固によって接合されるので、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは構造的に一体化され、同時にピン挿入部品用片面基板１０の図示しない配線パターンと表面実装部品用片面基板２０の図示しない配線パターンとの電気的接続もなされる。   Further, by this heating / cooling process, the substrate bonding pattern 14 of the single-sided substrate 10 for pin insertion component and the substrate bonding pattern 23 of the single-sided substrate 20 for surface mounting component are bonded by melting / solidification of solder paste, The single-sided substrate 10 for pin insertion component and the single-sided substrate 20 for surface mount component are structurally integrated, and at the same time, the unillustrated wiring pattern of the single-sided substrate 10 for pin insertion component and the unillustrated wiring pattern of the single-sided substrate 20 for surface mount component Is also electrically connected.

なお、本発明は上記実施例に限定されるものではないので、特許請求の範囲に記載の趣旨から逸脱しない範囲で各種の変形実施が可能である。   The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit described in the claims.

例えば、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは、例えば図５に示したようにピン挿入部品用片面基板１０の対角部分に凹み１５Ａ、１５Ｂが設けられたときにも、ピン挿入部品用片面基板１０の最大長さと表面実装部品用片面基板２０の最大長さは一致し、長さ方向と直交する方向の最大幅同士も一致するので、対応する各辺が辺と直交する方向に位置ずれしないようにピン挿入部品用片面基板１０を表面実装部品用片面基板２０に重ね合わせることで、容易に位置合わせすることができる（図５においては、表面実装部品回避穴１１、ピン挿入部品回避穴２１は図示していない）。   For example, the single-sided substrate for pin insertion component 10 and the single-sided substrate for surface mount component 20 are, for example, when the recesses 15A and 15B are provided in the diagonal portions of the single-sided substrate for pin insertion component 10 as shown in FIG. However, since the maximum length of the single-sided substrate 10 for pin insertion components and the maximum length of the single-sided substrate 20 for surface mount components are the same, and the maximum widths in the direction orthogonal to the length direction are also the same, Can be easily aligned by superimposing the single-sided substrate 10 for pin insertion components on the single-sided substrate 20 for surface mounting components so as not to be displaced in a direction perpendicular to the surface (in FIG. 11, pin insertion component avoidance hole 21 is not shown).

したがって、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは、位置合せを容易にするためには、外形形状を完全に一致させる必要はなく、原形が矩形であったとして表現すると、ピン挿入部品用片面基板１０、表面実装部品用片面基板２０は何れの周辺部に凹みがあっても良いが、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とは最大長さと最大幅とが一致するように形成するのが好ましい。   Therefore, the single-sided board for pin insertion component 10 and the single-sided board for surface mount component 20 do not have to have the same outer shape in order to facilitate alignment, and are expressed as if the original shape was a rectangle. The single-sided substrate for pin insertion component 10 and the single-sided substrate for surface mount component 20 may have a dent in any peripheral portion, but the single-sided substrate for pin insertion component and the single-sided substrate for surface mount component 20 have the maximum length. It is preferable to form so that the maximum width matches.

また、ピン挿入部品用片面基板１０と表面実装部品用片面基板２０との一体化を、ピン挿入部品１２、表面実装部品２２と電気的に接続される配線パターンとは無関係にピン挿入部品用片面基板１０、表面実装部品用片面基板２０それぞれの周辺部に設けた金属接合部同士を半田付けして一体化するようにしても良い。   In addition, the integration of the single-sided substrate 10 for the pin insertion component and the single-sided substrate 20 for the surface mount component is performed on the single side for the pin insertion component regardless of the wiring pattern electrically connected to the pin insertion component 12 and the surface mount component 22. The metal joints provided in the peripheral portions of the substrate 10 and the single-sided substrate 20 for surface mounting components may be integrated by soldering.

ピン挿入部品用片面基板１０と表面実装部品用片面基板２０とを上記のような金属接合部同士を半田付けして一体化するときには、配線パターンを設計する際の自由度が高くると共に、接合部を基板中央部に設けたときより接合部の加熱と冷却が速やかに行えるので、製造工程のスピードアップが図れると云った利点がある。   When the single-sided substrate for pin insertion component 10 and the single-sided substrate for surface mount component 20 are integrated by soldering the above-mentioned metal joints, the degree of freedom in designing the wiring pattern is increased and the bonding is performed. Since the bonding portion can be heated and cooled more quickly than when the portion is provided in the central portion of the substrate, there is an advantage that the manufacturing process can be speeded up.

また、ピン挿入部品用片面基板１０の基板接合用パターン１４および／または表面実装部品用片面基板２０の基板接合用パターン２３の一部にスルーホールを穿設しても良い。スルーホールを穿設することにより、ピン挿入部品用片面基板１０の基板接合用パターン１４と表面実装部品用片面基板２０の基板接合用パターン２３との間にある半田ペーストへの熱伝導率が向上し、リフロー炉の温度を必要以上に上げることなく接合することが可能になる。   Further, a through hole may be formed in a part of the substrate bonding pattern 14 of the single-sided substrate 10 for pin insertion components and / or the substrate bonding pattern 23 of the single-sided substrate 20 for surface mount components. By making the through hole, the thermal conductivity to the solder paste between the board bonding pattern 14 of the single-sided board 10 for pin insertion component and the board bonding pattern 23 of the single-sided board 20 for surface mounting components is improved. And it becomes possible to join without raising the temperature of a reflow furnace more than necessary.

斜視図で示す本発明の説明図であり、（Ａ）はピン挿入部品用片面基板の説明図、（Ｂ）は表面実装部品用片面基板の説明図、（Ｃ）は本発明により製造した配線基板の説明図である。It is explanatory drawing of this invention shown by a perspective view, (A) is explanatory drawing of the single-sided board for pin insertion components, (B) is explanatory drawing of the single-sided board for surface mount components, (C) is the wiring manufactured by this invention It is explanatory drawing of a board | substrate. 断面図で示す本発明の説明図であり、（Ａ）はピン挿入部品用片面基板の説明図、（Ｂ）は表面実装部品用片面基板の説明図、（Ｃ）は本発明により製造した配線基板の説明図である。It is explanatory drawing of this invention shown by sectional drawing, (A) is explanatory drawing of the single-sided board for pin insertion components, (B) is explanatory drawing of the single-sided board for surface mount components, (C) is the wiring manufactured by this invention It is explanatory drawing of a board | substrate. 本発明の製造方法の工程を示す説明図である。It is explanatory drawing which shows the process of the manufacturing method of this invention. 重ね合わせたピン挿入部品用片面基板と表面実装部品用片面基板とを機械的に一体化する一例を示す説明図である。It is explanatory drawing which shows an example which mechanically integrates the single-sided board for pin insertion components and the single-sided board for surface mount components which were piled up. 変形実施の一例を示す説明図である。It is explanatory drawing which shows an example of deformation | transformation implementation. 従来技術で製造した配線基板の説明図である。It is explanatory drawing of the wiring board manufactured with the prior art. 図６に示した配線基板を製造する工程を示す説明図である。It is explanatory drawing which shows the process of manufacturing the wiring board shown in FIG. 他の従来技術を示す説明図であり、（Ａ）はチップ化印刷配線基板の説明図、（Ｂ）はチップ部品搭載用基板の説明図である。It is explanatory drawing which shows another prior art, (A) is explanatory drawing of a chip-ized printed wiring board, (B) is explanatory drawing of the chip | tip component mounting board | substrate.

符号の説明Explanation of symbols

１ 片面基板
２ ボンド
３ 半田槽
３Ａ 溶融半田
４ チップ化印刷配線基板
５、５Ａ パット
６ 導体パターン
７ ディップ部品
８ チップ部品搭載用基板
８Ａ チップ部品搭載用穴
１０ ピン挿入部品用片面基板
１１ 表面実装部品回避穴
１２ ピン挿入部品
１３ ピン
１４ 基板接合用パターン
１５Ａ、１５Ｂ 凹み
２０ 表面実装部品用片面基板
２１ ピン挿入部品回避穴
２２ 表面実装部品
２３ 基板接合用パターン
４０ 挟持部材 DESCRIPTION OF SYMBOLS 1 Single-sided board 2 Bond 3 Solder tank 3A Molten solder 4 Chip printed wiring board 5, 5A pad 6 Conductor pattern 7 Dip component 8 Chip component mounting substrate 8A Chip component mounting hole 10 Single-sided substrate for pin insertion component 11 Surface mount component Avoidance hole 12 Pin insertion component 13 Pin 14 Substrate bonding pattern 15A, 15B Depression 20 Single-sided substrate for surface mounting component 21 Pin insertion component avoidance hole 22 Surface mounting component 23 Substrate bonding pattern 40

Claims (8)

ピン挿入部品回避穴が開設されて片面に表面実装部品が半田ペーストにより仮止めされた表面実装部品用片面基板に、表面実装部品回避穴が開設されて片面にピン挿入部品が嵌挿半田付けされたピン挿入部品用片面基板を重ねてリフロー炉に挿入し、加熱・冷却して表面実装部品を表面実装部品用片面基板に半田付けすると共に、ピン挿入部品用片面基板と表面実装部品用片面基板とを半田付け一体化することを特徴とする配線基板の製造方法。   A surface-mounted component avoidance hole is opened on one side of the surface-mounted component single-sided board where a surface-mounted component is temporarily fixed with solder paste on one side. The single-sided board for the pin insertion component and the single-sided board for the surface-mounting component and the single-sided substrate for the surface-mounting component are soldered to the single-sided substrate for the surface-mounting component by heating and cooling. And a method of manufacturing a wiring board, wherein: ピン挿入部品用片面基板のピン挿入部品は、ピン挿入部品用片面基板の下面が半田槽に浸漬して半田付けされることを特徴とする請求項１記載の配線基板の製造方法。   2. The method of manufacturing a wiring board according to claim 1, wherein the pin insertion component of the single-sided substrate for pin insertion component is soldered by immersing the lower surface of the single-sided substrate for pin insertion component in a solder bath. 表面実装部品用片面基板とピン挿入部品用片面基板とは直交する２方向それぞれにおいて同一寸法となる部位があることを特徴とする請求項１または２記載の配線基板の製造方法。   3. The method of manufacturing a wiring board according to claim 1, wherein the single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components have portions having the same dimensions in each of two orthogonal directions. 表面実装部品用片面基板の配線パターン端部とピン挿入部品用片面基板の配線パターン端部とが接合されて表面実装部品用片面基板とピン挿入部品用片面基板とが一体化されることを特徴とする請求項１〜３何れかに記載の配線基板の製造方法。   The wiring pattern end of the single-sided board for surface mounting components and the wiring pattern end of the single-sided board for pin insertion components are joined together to integrate the single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components. The manufacturing method of the wiring board in any one of Claims 1-3. 表面実装部品用片面基板とピン挿入部品用片面基板とは、電気配線とは無関係に設けられた接合部において互いに接合されて一体化されることを特徴とする請求項１〜３何れかに記載の配線基板の製造方法。   4. The single-sided substrate for surface mounting components and the single-sided substrate for pin insertion components are joined and integrated with each other at a joint provided regardless of electrical wiring. Wiring board manufacturing method. ピン挿入部品回避穴が開設されて片面に表面実装部品が半田付けされた表面実装部品用片面基板と、表面実装部品回避穴が開設されて片面にピン挿入部品が嵌挿半田付けされたピン挿入部品用片面基板とが重ねて一体化されたことを特徴とする配線基板。   A single-sided board for surface-mounted components with a pin insertion component avoidance hole opened and soldered on one side with a surface mount component, and a pin insertion with a surface mount component avoidance hole established on one side with a pin insertion component fitted and soldered A wiring board characterized by being integrated with a single-sided board for components. 表面実装部品用片面基板の配線パターン端部とピン挿入部品用片面基板の配線パターン端部とが接合されて表面実装部品用片面基板とピン挿入部品用片面基板とが一体化されたことを特徴とする請求項６記載の配線基板。   The wiring pattern edge of the single-sided board for surface mount components and the wiring pattern edge of the single-sided board for pin insertion parts are joined together, and the single-sided board for surface-mounting parts and the single-sided board for pin insertion parts are integrated. The wiring board according to claim 6. 表面実装部品用片面基板とピン挿入部品用片面基板とは、電気配線とは無関係に設けられた接合部において互いに接合されて一体化されたことを特徴とする請求項６記載の配線基板。   7. The wiring board according to claim 6, wherein the single-sided board for surface mount component and the single-sided board for pin insertion component are joined together at a joint provided independently of the electrical wiring.
JP2003295326A 2003-08-19 2003-08-19 Wiring board manufacturing method Expired - Fee Related JP4225164B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105307420A (en) * 2015-10-13 2016-02-03 惠州市蓝微电子有限公司 PCB and FPC welding method and surface mounting jig
US9935467B2 (en) 2013-01-30 2018-04-03 Huawei Technologies Co., Ltd. Power supply system, electronic device, and electricity distribution method of electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9935467B2 (en) 2013-01-30 2018-04-03 Huawei Technologies Co., Ltd. Power supply system, electronic device, and electricity distribution method of electronic device
CN105307420A (en) * 2015-10-13 2016-02-03 惠州市蓝微电子有限公司 PCB and FPC welding method and surface mounting jig

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