JP2005023356A

JP2005023356A - Mask device for wet treatment

Info

Publication number: JP2005023356A
Application number: JP2003188302A
Authority: JP
Inventors: Masahiro Hara; 昌宏原; Ken Iyoda; 憲伊與田; Hideyo Osanai; 英世小山内
Original assignee: Dowa Mining Co Ltd
Current assignee: Dowa Holdings Co Ltd
Priority date: 2003-06-30
Filing date: 2003-06-30
Publication date: 2005-01-27
Anticipated expiration: 2023-06-30
Also published as: JP4057481B2

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mask device for wet treatment by which the body to be treated such as a base-integrated type joined member can efficiently be treated, and, even in the case where the warpage of the body to be treated is large or it has a complicated shape, the phenomenon that a treatment liquid infiltrates into the part other than the part to be treated in the body to be treated and unrequired wet treatment is performed can be prevented. <P>SOLUTION: The mask device for wet treatment comprises: a mask member 24 covering the peripheral part of a metal circuit plate 14 (the part around the part to be treated of the metal circuit plate 14) of a base-integrated joined member 10 and having opening parts from which the parts to be treated of the metal circuit board 14 are exposed; a support plate 26 having opening parts from which the parts to be treated of the metal circuit plate 14 are exposed; and a plurality of magnets 28 allowing the support plate 26 to support the mask member 24 and allowing the mask member 24 to be abutted on the peripheral part of the metal circuit plate 14 (the part around the part to be treated of the metal circuit plate 14) in a watertight way. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、湿式処理用マスク装置に関し、特に、金属材料に対してめっきやエッチングなどの湿式処理を行う湿式処理装置に使用するマスク装置に関する。
【０００２】
【従来の技術】
従来、各種の基板上に設けられた導電性の金属膜に回路パターンを形成するために、エッチングやめっきなどの湿式処理が行われている。このような湿式処理では、金属膜の湿式処理を必要としない部分に、ラミネート被覆またはスクリーン印刷によって予めレジスト膜などを形成して、エッチング液やめっき液などの処理液が金属膜と接触するのを防止している（例えば、特許文献１参照）。
【０００３】
また、基板上に設けられた回路パターンに大電流を流したいという要請に応えるため、セラミックス基板上に金属回路板を接合した金属−セラミックス接合部材や、この金属回路板を接合した面と反対側の面にベース部材を接合した、所謂ベース一体型接合部材などが開発されている。
【０００４】
【特許文献１】
特開昭６３−６５６５３号公報（第３頁）
【０００５】
【発明が解決しようとする課題】
しかし、このようなベース一体型接合部材の金属回路板または回路形成用金属板に湿式処理を行う場合に、特許文献１に開示された方法を用いると、以下のような問題がある。
【０００６】
すなわち、ベース一体型接合部材のベース部材には熱伝導性や機械的強度が求められるため、ベース部材の材料としてアルミニウムや銅などの金属またはこれらの金属とセラミックスとの複合材料が用いられている。このベース部材が湿式処理用の処理液に接触して不要な湿式処理が行われるのを回避するため、予めベース一体型接合部材全体にフィルム状レジストのラミネート被覆または液状レジストの塗布を行って、湿式処理を行う部分からレジストを除去した後、処理液に浸漬または処理液を噴射する方法などにより湿式処理が行われる。
【０００７】
しかし、ベース一体型接合部材を構成する金属回路板または回路形成用金属板とセラミックス基板はいずれも相当な厚さ（例えば、金属回路板または回路形成用金属板の厚さは１５０〜５００μｍ程度、セラミックス基板の厚さは０．２〜２ｍｍ程度）を有するため、ベース一体型接合部材全体にフィルム状レジストのラミネート被覆や液状レジストの塗布を行うと、平坦部分では問題ないが、ベース部材からセラミックス基板への立ち上がり部分などでは、レジストがその立ち上がり部分の段差に追従できず、ベース一体型接合部材とレジストの間に隙間が生じる場合がある。
【０００８】
この隙間が生じた状態でベース一体型接合部材上のレジストを所望の回路パターンに除去した後に湿式処理を行うと、レジストを除去した部分やレジストが追従できなかった部分から隙間に処理液が侵入し、ベース部材に対して不要な処理が行われる可能性がある。また、ベース部材の側面にレジスト被膜を設けることは、通常のラミネートやスクリーン印刷による方法では困難である。
【０００９】
特に、ベース一体型接合部材は、ベース部材と金属−セラミックス接合部材との熱膨張差によって反り易く、この反りが大きい場合や複雑な形状になると、フィルム状レジストのラミネート被覆や液状レジストの塗布が困難になり、処理を必要としない部分に処理液が侵入して不要な処理が行なわれ易い。
【００１０】
このような事態を回避するために、ベース一体型接合部材全体にラミネート被膜の形成またはレジストの塗布を行った後に、隙間が生じている可能性がある部分に、作業者が筆などを用いて再度レジストを塗布する、所謂手直し工程を行うことが考えられる。しかし、このような手直し工程を行うと、ベース一体型接合部材の湿式処理工程の生産性が悪くなり、ベース一体型接合部材の生産コストが上昇する要因になる。
【００１１】
したがって、本発明は、このような従来の問題点に鑑み、ベース一体型接合部材などの被処理体を効率的に処理することができ、被処理体の反りが大きい場合や複雑な形状になる場合にも、被処理体の被処理部分以外の部分に処理液が侵入して不要な湿式処理が行われるのを防止することができる、湿式処理用マスク装置を提供することを目的とする。
【００１２】
【課題を解決するための手段】
上記の目的を達成するため、本発明による湿式処理用マスク装置は、湿式処理が行われる被処理体の被処理部の周囲の部分を覆うとともに被処理部を露出させる開口部を有するマスク部材と、このマスク部材の開口部に対向して被処理部を露出させる開口部を有する支持体と、この支持体にマスク部材を支持させてマスク部材を被処理体の被処理部の周囲の部分に液密に当接させる磁力を発生する磁力発生手段とからなる。
【００１３】
この湿式処理用マスク装置において、磁力発生手段として、マスク部材の支持体に対向する面に少なくとも一つの磁石が設けられるとともに、支持体のマスク部材に対向する面に少なくとも一つの磁石が設けられ、これらの少なくとも一対の磁石の斥力によって、マスク部材が所望の位置に保持されるのが好ましい。この場合、マスク部材に設けられた少なくとも一つの磁石がマスク部材の開口部付近に配置され、あるいはマスク部材の開口部を取り囲むように配置され、支持体に設けられた少なくとも一つの磁石がマスク部材に設けられた少なくとも一つの磁石と対向するように配置するのが好ましい。
【００１４】
また、上記の湿式処理用マスク装置において、被処理体が、セラミックス基板の少なくとも一方の面に金属板が接合された金属−セラミックス接合基板、またはセラミックス基板の一方の面に金属回路板が接合されるとともに他方の面にベース板が接合されたベース一体型金属−セラミックス接合基板であるのが好ましい。また、湿式処理が、電気めっきや無電解めっきなどのめっきまたはエッチングであるのが好ましい。
【００１５】
【発明の実施の形態】
本発明による湿式処理用マスク装置の実施の形態は、湿式処理が行われる被処理体の被処理部の周囲の部分を覆うとともに被処理部を露出させる開口部を有するマスク部材と、このマスク部材の開口部に対向して被処理部を露出させる開口部を有する支持体と、この支持体にマスク部材を支持させてマスク部材を被処理体の被処理部の周囲の部分に液密に当接させる複数の磁石とからなる。これらの磁石は、支持体の開口部の周囲に配置されるとともに、マスク部材の開口部の周囲に配置され、それぞれの対の磁石の斥力によって、支持体にマスク部材を支持させ、マスク部材の開口部の周囲の部分を被処理体の被処理部の周囲の部分に液密に当接させることにより、めっき液が被処理部以外の部分に侵入するのを阻止する。このような構成により、被処理体の反りが大きい場合でも、その反りに沿うようにマスク部材を被処理体の被処理部の周囲の部分に液密に当接させることができ、マスク部材によって覆われた部分に処理液が浸透するのを阻止することができる。なお、湿式処理は、めっきやエッチングに代表されるが、これらの処理は、当然にその前処理や後処理としての化学研磨液処理や活性化液処理などの工程も含む広い意味である。
【００１６】
【実施例】
以下、添付図面を参照して、本発明による湿式処理用マスク装置の実施例について詳細に説明する。
【００１７】
本発明による湿式処理用マスク装置を使用して湿式処理を行う被処理体として、例えば、図１に示すようなベース一体型接合部材１０を使用することができる。このベース一体型接合部材１０は、セラミックス基板１２上に所望の回路パターンの金属回路板１４を接合することにより形成された所望の数（図１に示す例では４つ）の金属−セラミックス接合部材１６と、これらの金属−セラミックス接合部材１６のセラミックス基板１２側が接合されたベース板１８とからなる。
【００１８】
セラミックス基板１２の材料として、電気的耐性が高く且つ熱伝導性が高い窒化アルミニウムなどのセラミックスを使用するのが好ましい。また、金属回路板１４の材料として、電気伝導性の高いアルミニウムや銅などの金属またはこれらの合金を使用するのが好ましい。さらに、ベース板１８の材料として、熱伝導性が高く且つ機械的強度が高いアルミニウムや銅などの金属またはこれらの金属とセラミックスとの複合材料を使用するのが好ましい。
【００１９】
次に、本発明による湿式処理用マスク装置の実施例として、ベース一体型接合部材１０の金属回路板１４に対して電気めっきを行う場合に使用する湿式処理用マスク装置について説明する。
【００２０】
図２に示すように、本発明による湿式処理用マスク装置は、第１のマスク部２０と第２のマスク部２２からなるマスク部材２４と、支持板２６と、マスク部材２４の下面と支持体２６の上面にそれぞれ対向するように設けられた複数組の磁石２８とから構成されている。
【００２１】
マスク部材２４には、各々の金属回路板１４に対向する位置に開口部が形成されている。これらの開口部は、マスク部材２４が被処理体としてのベース一体型接合部材１０上に配置されたときに、各々の金属回路板１４の一部（被処理部）を露出させるとともに、金属回路板１４の被処理部以外の部分を覆うように配置されている。また、支持板２６にも、マスク部材２４の開口部に対向する位置に開口部が形成されている。
【００２２】
磁石２８は、支持板２６の各々の開口部を取り囲むように配置されるとともに、マスク部材２４の各々の開口部を取り囲むように配置し、それぞれの対の磁石２６の斥力（図２において矢印ａで示す方向の力）によって、支持板２６にマスク部材２４を支持させ、マスク部材２４の開口部の周囲の部分を金属回路板１４の周縁部（被処理部を取り囲む部分）に液密に当接させることにより、めっき液が被処理部以外の部分に侵入するのを阻止している。これらの磁石２８は、接着剤によりマスク部材２４および支持板２６に固定してもよいし、あるいはマスク部材２４および支持板２６に埋め込んでもよい。なお、磁石２８は、めっき液などの処理液に直接触れないように、樹脂でコーティングしたり、マスク部材２４および支持板２６の内部に埋め込むのが好ましい。また、対向する磁石２８の間に強い反発力を必要とするため、例えば、フェライト系またはレアメタル系の焼結またはボンド・ゴム磁石や、電磁石のように強い磁力をもつ磁石を使用するのが好ましい。
【００２３】
マスク部材２４の第１のマスク部２０は、めっき液などの処理液の侵入を阻止するために、被処理体との密着性に優れ、撥水性、弾力性および耐薬品性に優れたゴムやプラスチックなどの材料、例えば、シリコンゴム、フッ素ゴム、ポリプロピレンまたはテフロン（登録商標）などの材料からなるのが好ましい。また、マスク部材２４の第２のマスク部２２は、磁石２６の斥力によりベース板１８の反りに沿った変形が可能であり且つ耐薬品性に優れた材料、例えば、樹脂とガラス繊維の複合部材であるＧＦＲＰからなるのが好ましい。この第２のマスク部２２上に第１のマスク部２０が固定されてマスク部材２４を構成する。
【００２４】
支持板２６は、耐薬品性に優れ且つ荷重が加わっても実質的に変形しない材料、例えば、硬質塩化ビニルなどの硬質樹脂または耐食性金属の厚板からなるのが好ましい。
【００２５】
このような構成により、被処理体としてのベース一体型接合部材１０のベース板１８の反りが大きい場合や複雑な形状になる場合でも、その反りに沿うようにマスク部材２４を金属回路板１４に液密に当接させることができ、マスク部材２４によって覆われた部分にめっき液などの処理液が浸透するのを阻止することができる。
【００２６】
図２に示す湿式処理用マスク装置を使用してベース一体型接合部材１０の金属回路板１４にめっきを施す場合には、例えば、図３に示すような電気めっき装置を使用することができる。以下、この電気めっき装置を使用して金属回路板１４にめっきを施す方法について説明する。
【００２７】
まず、図３に示すように、マスク部材２４と支持板２６が所定距離以上に離反しないようにボルト３４によって支持板２６にマスク部材２４を取り付けた後、内部にアノード電極３０が配置されためっき槽３４の上部の開口部に対向するように、めっき槽３４の上部に支持板２６を配置させる。
【００２８】
次に、ベース一体型接合部材１０の金属回路板１４が下向きになるようにベース一体型接合部材１０をマスク部材２４上に配置させ、ベース一体型接合部材１０の上方から押圧する。
【００２９】
次に、めっき液貯留槽３６からめっき槽３４の底部にめっき液を供給し、このめっき液を図３において矢印ｂで示す方向に流して、めっき液が支持板２６およびマスク部材２４の開口部を通って金属回路板１４の被処理部に接触するようにする。この状態で、ベース一体型接合部材１０の各々の金属回路板１４をカソード電極として使用して、このカソード電極とアノード電極３０の間に電流を流す（図３では一つの金属回路板１４とアノード電極３０の間に電流を流すように省略して示されているが、実際には全ての金属回路板１４とアノード電極３０の間に電流を流す）と、金属回路板１４の被処理部にめっきが施される。なお、金属回路板１４上に（図示しない）保護パターンを形成しておけば、所望の形状にめっきを施すことができる。
【００３０】
なお、本発明による湿式処理用マスク装置の実施例として、電気めっき装置に使用する場合について説明したが、本発明による湿式処理用マスク装置は、電気めっきのみならず、無電解めっきなどの他のめっきやエッチングなどの湿式処理に使用することができる。また、本発明による湿式処理用マスク装置を電気めっき装置に使用する例では、金属回路板の一部にめっきする場合について説明したが、本発明による湿式処理用マスク装置は、マスク部材および支持板の開口部の形状を変えることにより、金属回路板の全面にめっきする場合にも適用することができる。さらに、本発明による湿式処理用マスク装置をベース一体型接合部材の湿式処理に使用する場合について説明したが、本発明による湿式処理用マスク装置は、他の被処理体の湿式処理においても使用することができる。
【００３１】
【発明の効果】
上述したように、本発明によれば、ベース一体型接合部材などの被処理体を効率的に湿式処理することができ、被処理体の反りが大きい場合や複雑な形状になる場合にも、被処理体の被処理部分以外の部分に処理液が侵入して不要な湿式処理が行われるのを防止することができる。
【図面の簡単な説明】
【図１】本発明による湿式処理用マスク装置を使用して湿式処理を行う被処理体としてのベース一体型接合部材を示す図であり、図１（ａ）はその平面図、図１（ｂ）は図１（ａ）のＩＢ−ＩＢ線断面図。
【図２】本発明による湿式処理用マスク装置の実施例を概略的に示す図。
【図３】図２に示す湿式処理用マスク装置を使用する電気めっき装置の例を概略的に示す図。
【符号の説明】
１０ベース一体型接合部材（カソード電極）
１２セラミックス基板
１４金属回路板
１６金属−セラミックス接合部材
１８ベース板
２０第１のマスク部
２２第２のマスク部
２４マスク部材
２６支持板
２８磁石
３０アノード電極
３２ボルト
３４めっき槽
３６めっき液貯留槽[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wet processing mask apparatus, and more particularly to a mask apparatus used in a wet processing apparatus that performs wet processing such as plating and etching on a metal material.
[0002]
[Prior art]
Conventionally, wet processing such as etching and plating has been performed in order to form a circuit pattern on conductive metal films provided on various substrates. In such wet processing, a resist film or the like is formed in advance by lamination coating or screen printing on a portion that does not require wet processing of the metal film, and a processing solution such as an etching solution or a plating solution comes into contact with the metal film. (For example, refer to Patent Document 1).
[0003]
In addition, in order to meet the demand for flowing a large current through a circuit pattern provided on a substrate, a metal-ceramic bonding member in which a metal circuit plate is bonded on a ceramic substrate, or the side opposite to the surface on which the metal circuit plate is bonded A so-called base-integrated joining member, in which a base member is joined to the surface, has been developed.
[0004]
[Patent Document 1]
JP-A-63-65653 (page 3)
[0005]
[Problems to be solved by the invention]
However, when wet processing is performed on the metal circuit plate or circuit forming metal plate of such a base-integrated joining member, there are the following problems when the method disclosed in Patent Document 1 is used.
[0006]
That is, since the base member of the base-integrated joining member is required to have thermal conductivity and mechanical strength, a metal such as aluminum or copper or a composite material of these metals and ceramics is used as the material of the base member. . In order to avoid unnecessary wet processing from being performed when the base member comes into contact with the processing liquid for wet processing, a film resist laminate coating or a liquid resist is applied to the entire base-integrated joining member in advance. After removing the resist from the portion where the wet processing is performed, the wet processing is performed by a method of immersing in the processing solution or spraying the processing solution.
[0007]
However, each of the metal circuit board or circuit forming metal plate and the ceramic substrate constituting the base-integrated joining member has a considerable thickness (for example, the thickness of the metal circuit board or circuit forming metal plate is about 150 to 500 μm, Since the thickness of the ceramic substrate is about 0.2 to 2 mm), when a laminate coating of a film-like resist or a liquid resist is applied to the entire base-integrated joining member, there is no problem in the flat portion, but the ceramic from the base member At the rising portion to the substrate, the resist cannot follow the step at the rising portion, and a gap may be formed between the base-integrated joining member and the resist.
[0008]
When wet processing is performed after removing the resist on the base-integrated joining member to a desired circuit pattern in the state where the gap is generated, the processing liquid enters the gap from the portion where the resist is removed or the portion where the resist cannot follow. However, unnecessary processing may be performed on the base member. In addition, it is difficult to provide a resist film on the side surface of the base member by a normal lamination or screen printing method.
[0009]
In particular, the base-integrated joining member is likely to warp due to a difference in thermal expansion between the base member and the metal-ceramic joining member. If this warp is large or has a complicated shape, a laminate coating of a film-like resist or a liquid resist is applied. It becomes difficult, and the processing liquid enters a portion that does not require processing, and unnecessary processing is likely to be performed.
[0010]
In order to avoid such a situation, an operator uses a brush or the like in a portion where a gap may be formed after forming a laminate film or applying a resist to the entire base-integrated joining member. It is conceivable to perform a so-called reworking process in which a resist is applied again. However, when such a reworking process is performed, the productivity of the wet processing step for the base-integrated joining member is deteriorated, and the production cost of the base-integrating joining member is increased.
[0011]
Therefore, in view of such a conventional problem, the present invention can efficiently process a target object such as a base-integrated joining member, and the target object has a large warp or a complicated shape. Even in such a case, an object is to provide a wet processing mask apparatus capable of preventing the processing liquid from entering a portion other than the processing target portion of the target object and performing unnecessary wet processing.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, a mask apparatus for wet processing according to the present invention includes a mask member having an opening that covers a portion around a processing target portion of a target object to be wet processed and exposes the processing target portion. A support having an opening that exposes the portion to be processed facing the opening of the mask member, and a mask member that is supported by the support on the periphery of the portion to be processed of the object to be processed. It comprises magnetic force generating means for generating a magnetic force that makes liquid-tight contact.
[0013]
In this wet processing mask device, as the magnetic force generating means, at least one magnet is provided on the surface of the support member facing the support member, and at least one magnet is provided on the surface of the support member facing the mask member, It is preferable that the mask member is held at a desired position by the repulsive force of at least one pair of magnets. In this case, at least one magnet provided on the mask member is disposed in the vicinity of the opening of the mask member, or is disposed so as to surround the opening of the mask member, and at least one magnet provided on the support is the mask member. It is preferable to arrange so as to face at least one magnet provided on the surface.
[0014]
In the wet processing mask apparatus, the object to be processed is a metal-ceramic bonding substrate in which a metal plate is bonded to at least one surface of a ceramic substrate, or a metal circuit plate is bonded to one surface of a ceramic substrate. And a base-integrated metal-ceramic bonding substrate having a base plate bonded to the other surface. Further, the wet treatment is preferably plating or etching such as electroplating or electroless plating.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of a mask apparatus for wet processing according to the present invention includes a mask member having an opening that covers a portion around a target portion of a target object to be wet processed and exposes the target portion, and the mask member. A support having an opening that exposes the portion to be processed facing the opening of the substrate, and a mask member supported by the support so that the mask member is liquid-tightly applied to a portion around the portion to be processed of the object to be processed. It consists of a plurality of magnets in contact. These magnets are arranged around the opening of the support body and around the opening of the mask member, and the support member supports the mask member by the repulsive force of each pair of magnets. By causing the portion around the opening to be in liquid-tight contact with the portion around the portion to be processed of the object to be processed, the plating solution is prevented from entering the portion other than the portion to be processed. With such a configuration, even when the warp of the object to be processed is large, the mask member can be brought into liquid-tight contact with the peripheral portion of the target portion of the object to be processed along the warp. It is possible to prevent the treatment liquid from penetrating into the covered portion. In addition, although wet processing is represented by plating and etching, these processing has a broad meaning including processes, such as chemical polishing liquid processing and activation liquid processing as the pre-processing and post-processing.
[0016]
【Example】
Hereinafter, embodiments of a wet processing mask apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0017]
For example, a base-integrated joining member 10 as shown in FIG. 1 can be used as an object to be wet-processed using the wet-processing mask apparatus according to the present invention. The base-integrated joining member 10 has a desired number (four in the example shown in FIG. 1) of metal-ceramic joining members formed by joining metal circuit boards 14 having a desired circuit pattern on the ceramic substrate 12. 16 and a base plate 18 to which the ceramic substrate 12 side of the metal-ceramic bonding member 16 is bonded.
[0018]
As a material of the ceramic substrate 12, it is preferable to use ceramics such as aluminum nitride having high electrical resistance and high thermal conductivity. Further, as the material of the metal circuit board 14, it is preferable to use a metal such as aluminum or copper having high electrical conductivity or an alloy thereof. Further, as the material of the base plate 18, it is preferable to use a metal such as aluminum or copper having a high thermal conductivity and a high mechanical strength or a composite material of these metals and ceramics.
[0019]
Next, as an embodiment of the wet processing mask device according to the present invention, a wet processing mask device used when electroplating the metal circuit board 14 of the base integrated joint member 10 will be described.
[0020]
As shown in FIG. 2, the mask apparatus for wet processing according to the present invention includes a mask member 24 including a first mask portion 20 and a second mask portion 22, a support plate 26, a lower surface of the mask member 24, and a support body. 26 and a plurality of sets of magnets 28 provided so as to face the upper surface of each.
[0021]
Openings are formed in the mask member 24 at positions facing the respective metal circuit boards 14. When the mask member 24 is disposed on the base-integrated joining member 10 as the object to be processed, these openings expose a part (processed part) of each metal circuit board 14 and the metal circuit. It arrange | positions so that parts other than the to-be-processed part of the board 14 may be covered. The support plate 26 also has an opening formed at a position facing the opening of the mask member 24.
[0022]
The magnets 28 are arranged so as to surround the respective openings of the support plate 26 and are arranged so as to surround the respective openings of the mask member 24, and the repulsive force (arrow a in FIG. 2) of each pair of magnets 26. The force of the direction indicated by (1) is used to support the mask member 24 on the support plate 26, and the portion around the opening of the mask member 24 is liquid-tightly applied to the peripheral portion of the metal circuit board 14 (the portion surrounding the portion to be processed). By contacting, the plating solution is prevented from penetrating into portions other than the portion to be processed. These magnets 28 may be fixed to the mask member 24 and the support plate 26 with an adhesive, or may be embedded in the mask member 24 and the support plate 26. The magnet 28 is preferably coated with a resin or embedded in the mask member 24 and the support plate 26 so that the magnet 28 is not in direct contact with a processing solution such as a plating solution. Further, since a strong repulsive force is required between the opposing magnets 28, it is preferable to use a magnet having a strong magnetic force such as a ferrite-based or rare metal-based sintered or bonded rubber magnet, or an electromagnet. .
[0023]
The first mask portion 20 of the mask member 24 has excellent adhesion to the object to be processed and prevents the penetration of a processing solution such as a plating solution, and has excellent water repellency, elasticity and chemical resistance. It is preferably made of a material such as plastic, for example, a material such as silicon rubber, fluororubber, polypropylene or Teflon (registered trademark). In addition, the second mask portion 22 of the mask member 24 can be deformed along the warp of the base plate 18 by the repulsive force of the magnet 26 and is excellent in chemical resistance, for example, a composite member of resin and glass fiber. It is preferable to consist of GFRP. The first mask portion 20 is fixed on the second mask portion 22 to constitute a mask member 24.
[0024]
The support plate 26 is preferably made of a material that is excellent in chemical resistance and does not substantially deform even when a load is applied, for example, a hard resin such as hard vinyl chloride or a thick plate of corrosion-resistant metal.
[0025]
With such a configuration, even when the base plate 18 of the base-integrated joining member 10 as the object to be processed has a large warp or a complicated shape, the mask member 24 is placed on the metal circuit board 14 along the warp. The liquid-tight contact can be made, and the treatment liquid such as the plating liquid can be prevented from penetrating into the portion covered with the mask member 24.
[0026]
When the metal circuit board 14 of the base-integrated joining member 10 is plated using the wet processing mask device shown in FIG. 2, for example, an electroplating device as shown in FIG. 3 can be used. Hereinafter, a method for plating the metal circuit board 14 using this electroplating apparatus will be described.
[0027]
First, as shown in FIG. 3, after the mask member 24 is attached to the support plate 26 with bolts 34 so that the mask member 24 and the support plate 26 are not separated from each other by a predetermined distance or more, the anode electrode 30 is disposed therein. The support plate 26 is disposed on the upper part of the plating tank 34 so as to face the opening at the upper part of the tank 34.
[0028]
Next, the base-integrated joining member 10 is disposed on the mask member 24 so that the metal circuit board 14 of the base-integrated joining member 10 faces downward, and is pressed from above the base-integrated joining member 10.
[0029]
Next, the plating solution is supplied from the plating solution storage tank 36 to the bottom of the plating tank 34, and this plating solution is allowed to flow in the direction indicated by the arrow b in FIG. 3 so that the plating solution is opened in the support plate 26 and the mask member 24. It is made to contact the to-be-processed part of the metal circuit board 14 through. In this state, each metal circuit board 14 of the base-integrated joining member 10 is used as a cathode electrode, and a current flows between the cathode electrode and the anode electrode 30 (in FIG. 3, one metal circuit board 14 and an anode (Although abbreviate | omitting and showing so that an electric current may be passed between the electrodes 30, in reality, an electric current is sent between all the metal circuit boards 14 and the anode electrodes 30), it will be in the to-be-processed part of the metal circuit board 14 Plating is applied. In addition, if a protective pattern (not shown) is formed on the metal circuit board 14, plating can be performed in a desired shape.
[0030]
In addition, although the case where it used for an electroplating apparatus was demonstrated as an Example of the mask apparatus for wet processing by this invention, the mask apparatus for wet processing by this invention is not only electroplating but other electroless plating etc. It can be used for wet processing such as plating and etching. Further, in the example in which the wet processing mask device according to the present invention is used in the electroplating device, the case of plating on a part of the metal circuit board has been described. However, the wet processing mask device according to the present invention includes a mask member and a support plate. By changing the shape of the opening, it can be applied to the case where the entire surface of the metal circuit board is plated. Furthermore, although the case where the wet processing mask device according to the present invention is used for the wet processing of the base integrated joint member has been described, the wet processing mask device according to the present invention is also used in the wet processing of other objects to be processed. be able to.
[0031]
【The invention's effect】
As described above, according to the present invention, an object to be processed such as a base-integrated joining member can be efficiently wet processed, and even when the object to be processed has a large warp or a complicated shape, It is possible to prevent the processing liquid from entering a portion other than the processing target portion of the target object and performing unnecessary wet processing.
[Brief description of the drawings]
FIG. 1 is a view showing a base-integrated joining member as an object to be processed using a wet processing mask device according to the present invention, FIG. 1 (a) is a plan view thereof, and FIG. ) Is a cross-sectional view taken along line IB-IB in FIG.
FIG. 2 schematically shows an embodiment of a wet processing mask device according to the present invention.
FIG. 3 is a diagram schematically showing an example of an electroplating apparatus using the wet processing mask apparatus shown in FIG. 2;
[Explanation of symbols]
10 Base-integrated joining member (cathode electrode)
DESCRIPTION OF SYMBOLS 12 Ceramic substrate 14 Metal circuit board 16 Metal-ceramic joining member 18 Base board 20 1st mask part 22 2nd mask part 24 Mask member 26 Support plate 28 Magnet 30 Anode electrode 32 Bolt 34 Plating tank 36 Plating solution storage tank

Claims

湿式処理が行われる被処理体の被処理部の周囲の部分を覆うとともに被処理部を露出させる開口部を有するマスク部材と、このマスク部材の開口部に対向して被処理部を露出させる開口部を有する支持体と、この支持体にマスク部材を支持させてマスク部材を被処理体の被処理部の周囲の部分に液密に当接させる磁力を発生する磁力発生手段とからなることを特徴とする、湿式処理用マスク装置。A mask member that has an opening that covers a portion around the target portion of the target object to be wet processed and exposes the target portion, and an opening that exposes the target portion facing the opening of the mask member And a magnetic force generating means for generating a magnetic force for supporting the mask member on the support and bringing the mask member into liquid-tight contact with the peripheral portion of the target portion of the target object. A mask apparatus for wet processing, which is characterized.

前記磁力発生手段として、前記マスク部材の前記支持体に対向する面に少なくとも一つの磁石が設けられるとともに、前記支持体の前記マスク部材に対向する面に少なくとも一つの磁石が設けられ、これらの少なくとも一対の磁石の斥力によって、前記マスク部材が所望の位置に保持されることを特徴とする、請求項１に記載の湿式処理用マスク装置。As the magnetic force generating means, at least one magnet is provided on a surface of the mask member facing the support member, and at least one magnet is provided on a surface of the support member facing the mask member. 2. The wet processing mask apparatus according to claim 1, wherein the mask member is held at a desired position by a repulsive force of a pair of magnets.

前記マスク部材に設けられた少なくとも一つの磁石が前記マスク部材の開口部付近に配置され、前記支持体に設けられた少なくとも一つの磁石が前記マスク部材に設けられた少なくとも一つの磁石と対向するように配置されることを特徴とする、請求項２に記載の湿式処理用マスク装置。At least one magnet provided on the mask member is disposed in the vicinity of the opening of the mask member, and at least one magnet provided on the support is opposed to at least one magnet provided on the mask member. The mask apparatus for wet processing according to claim 2, wherein the mask apparatus is wet-processed.

前記マスク部材に設けられた少なくとも一つの磁石が前記マスク部材の開口部を取り囲むように配置され、前記支持体に設けられた少なくとも一つの磁石が前記マスク部材に設けられた少なくとも一つの磁石と対向するように配置されることを特徴とする、請求項２に記載の湿式処理用マスク装置。At least one magnet provided on the mask member is disposed so as to surround the opening of the mask member, and at least one magnet provided on the support member is opposed to at least one magnet provided on the mask member. The wet-process mask apparatus according to claim 2, wherein the wet-process mask apparatus is arranged as described above.

前記被処理体が、セラミックス基板の少なくとも一方の面に金属板が接合された金属−セラミックス接合基板であることを特徴とする、請求項１乃至４のいずれかに記載の湿式処理用マスク装置。5. The wet processing mask device according to claim 1, wherein the object to be processed is a metal-ceramic bonding substrate in which a metal plate is bonded to at least one surface of a ceramic substrate.

前記被処理体が、セラミックス基板の一方の面に金属回路板が接合されるとともに他方の面にベース板が接合されたベース一体型金属−セラミックス接合基板であることを特徴とする、請求項１乃至４のいずれかに記載の湿式処理用マスク装置。2. The substrate-integrated metal / ceramic bonding substrate, wherein the object to be processed is a base plate integrated with a metal circuit plate bonded to one surface of a ceramic substrate and a base plate bonded to the other surface. 5. The wet processing mask device according to any one of 1 to 4.

前記湿式処理が、めっきまたはエッチングであることを特徴とする、請求項１乃至６のいずれかに記載の湿式処理用マスク装置。The wet processing mask device according to claim 1, wherein the wet processing is plating or etching.