JP2004343112A - 電気コンポーネントの冷却が改良されたプリント回路基板 - Google Patents
電気コンポーネントの冷却が改良されたプリント回路基板 Download PDFInfo
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- 238000001816 cooling Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Y10T29/49117—Conductor or circuit manufacturing
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y10T29/49002—Electrical device making
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- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
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- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
【解決手段】 基板本体の上側3と下側7との間にスルーホール6を備え、上側3に取り付けられた少なくとも1つの電気コンポーネント2と、スルーホール6内に挿入され、上
側3から下側7に延在し、電気コンポーネント2に熱的に結合されている少なくとも1つの熱伝導部材8とを備え、熱伝導部材8は、平坦な上部部分と、テーパが付いているかまたは凹部が設けられた下部部分とを備えている。
【選択図】 図1
Description
2 コンポーネント
2 電気コンポーネント
3 上側
3 側部
4 下面
5 層
6 スルーホール
7 下側
8 熱伝導部材
9 上面
10 下面
11 半径方向隙間
12 ヒートシンク
13 冷却デバイス
14 上面
15 上部部分、閉鎖ディスク形上部部分
16 下部部分、開放リング形下部部分
17 外縁(外縁部)
18 突出部
19 内壁
20 圧入ツール
21 圧入デバイス
22 マンドレル
23 キャビティ、中心キャビティ
24 上部
25 圧入ツール
26 矢印
27 矢印
28 距離
29 距離
Claims (18)
- 基板本体の上側と下側との間にスルーホールが設けられ、
前記上側に取り付けられた少なくとも1つの電気コンポーネントと、
前記スルーホール内に挿入され、前記上側から前記下側に延在し、前記電気コンポーネントに熱的に結合されている少なくとも1つの熱伝導部材とを備え、
前記熱伝導部材は、平坦な上部部分と、テーパが付いているかまたは凹部が設けられた下部部分とを備えているプリント回路基板。 - 前記スルーホールが前記電気コンポーネントの下側の中心に配置され、
前記熱伝導部材の上側が、前記電気コンポーネントの下側と熱的に結合されている、請求項1に記載のプリント回路基板。 - 前記熱伝導部材が、ディスク形の上部部分と、前記上部部分から延在するリング形の下部部分とを備え、
前記上部部分が前記電気コンポーネントと熱的に結合されている、請求項1または請求項2に記載のプリント回路基板。 - 前記上部部分は、前記上部部分の外縁部から半径方向に延在する複数個の突出部を備え、
前記スルーホールを囲む内壁内に前記突出部が侵入して入り込むことにより、前記熱伝導部材が前記プリント回路基板に取り付けられている、請求項3に記載のプリント回路基板。 - 前記下部部分と前記スルーホールを囲む内壁との間にリング形の隙間が形成されている、請求項1から請求項4の何れか1項に記載のプリント回路基板。
- 平面を備えた圧入ツールを用いて前記熱伝導部材を前記上部部分に対して垂直に前記下部部分に圧迫することにより、前記下部部分の本来の形状を可塑的に変形させ、前記下部部分を最終的な形状に形成している、請求項1から請求項5の何れか1項に記載のプリント回路基板。
- 前記熱伝導部材の上側が、前記プリント回路基板の前記上側と面一に配置され、および/または、前記熱伝導部材の下側が、前記プリント回路基板の下側と面一に配置されている、請求項1から請求項6の何れか1項に記載のプリント回路基板。
- 前記熱伝導部材が回転対称形に形成されている、請求項1から請求項7の何れか1項に記載のプリント回路基板。
- 前記熱伝導部材が、ヒートシンクと、前記プリント回路基板の下側に取り付けられた冷却デバイスとの少なくとも一方と熱的に接触している、請求項1から請求項8の何れか1項に記載のプリント回路基板。
- 請求項1から請求項9の何れか1項に記載のプリント回路基板を製造する方法であって、
少なくとも1個のスルーホールを備えた前記プリント回路基板を用意するステップと、
熱伝導部材を前記スルーホール内に挿入するステップであって、前記熱伝導部材が実質的に平坦な上部部分と、テーパが付いているか、または凹部が形成された下部部分とを備えるステップと、
前記熱伝導部材の上側から離れる方向に向いた領域のみが変形するように、前記熱伝導部材を圧力嵌めするステップと、
前記電気コンポーネントが前記熱伝導部材と熱的に結合するように、電気コンポーネントをプリント回路基板に取り付けるステップとを含む方法。 - 前記圧入の力が制御されている、請求項10に記載の方法。
- 前記熱伝導部材が前記スルーホール内に圧力嵌めされる前に、本来の形状を用意するステップであって、本来の形状では、前記熱伝導部材の上側と、前記熱伝導部材の下側との間の距離が、前記プリント回路基板の上側と前記プリント回路基板の下側との間の距離より大きいステップと、
前記熱伝導部材が前記スルーホール内に圧力嵌めされた後に最終的な形状を有するように圧力嵌めを行なうステップであって、前記最終的な形状は、前記熱伝導部材の上側と下側との間の距離が、前記プリント回路基板の上側と下側との間の距離と同程度の大きさであるステップとを含む、請求項10または請求項11に記載の方法。 - 前記熱伝導部材の本来の形状が、
前記熱伝導部材の上側と下側との間の距離が、前記プリント回路基板の上側と下側との間の許容可能な距離の製造公差範囲の最大値より大きく、および/または、
前記熱伝導部材を前記スルーホール内に圧入した後に、リング形の隙間が、前記熱伝導部材の最終的な形状の下部部分と、前記スルーホールを囲む内壁との間に形成されている、請求項12に記載の方法。 - 前記熱伝導部材には切頭円錐プロファイルを有するリング形の下部部分が設けられ、前記切頭円錐プロファイルには、前記熱伝導部材のディスク形の上部部分からの距離が増加すると共にテーパが形成されている、請求項10から請求項13の何れか1項に記載の方法。
- 前記スルーホール内への前記熱伝導部材の圧力嵌めが、前記プリント回路基板の一方の側に配置された第1圧入ツールと、前記プリント回路基板の反対側に配置された第2圧入ツールとにより行なわれ、
前記第2圧入ツールが前記プリント回路基板を支持し、前記第1圧入ツールが前記プリント回路基板の側に接触することにより、前記第1圧入ツールが前記熱伝導部材を前記スルーホール内に圧入する、請求項10から請求項14の何れか1項に記載の方法。 - 前記第1圧入ツールがマンドレルを備え、前記マンドレルは、前記第1圧入ツールから突出して前記熱伝導部材の中心キャビティ内を貫通し、前記熱伝導部材が前記スルーホールと整列されており、
前記マンドレルは、前記整列した熱伝導部材を前記スルーホール内に圧入する前に、前記第1圧入ツール内に後退している、請求項15に記載の方法。 - 請求項1から請求項16の何れか1項に記載のプリント回路基板用の熱伝導部材であって、
前記熱伝導部材が、前記熱伝導部材を前記プリント回路基板の前記スルーホール内に挿入する前に本来の形状を有し、挿入後、可塑的に変形する最終的な形状を有し、
前記熱伝導部材が、ディスク形の上部部分と、前記上部部分から延在するリング形の下部部分とを備えている熱伝導部材。 - 前記上部部分が、前記上部部分の外縁部から半径方向に延在する数個の突出部を備え、
本来の形状では、前記下部部分が、前記上部部分からの距離の増加と共にテーパが付いている切頭円錐プロファイルに形成され、
前記熱伝導部材が、実質的に回転対称形に形成され、
前記熱伝導部材が一体形の要素として製造されている、請求項17に記載の熱伝導部材。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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EP03101323A EP1480269A1 (en) | 2003-05-13 | 2003-05-13 | Printed Circuit Board with improved cooling of electrical component |
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JP2004343112A true JP2004343112A (ja) | 2004-12-02 |
JP3758175B2 JP3758175B2 (ja) | 2006-03-22 |
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JP2004141294A Expired - Lifetime JP3758175B2 (ja) | 2003-05-13 | 2004-05-11 | 電気コンポーネントの冷却が改良されたプリント回路基板およびその製造方法 |
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US (2) | US7151229B2 (ja) |
EP (1) | EP1480269A1 (ja) |
JP (1) | JP3758175B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008126564A1 (ja) | 2007-03-12 | 2008-10-23 | Toyo Tanso Co., Ltd. | 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法 |
JP2010105640A (ja) * | 2008-10-31 | 2010-05-13 | Nsk Ltd | 電動パワーステアリング装置 |
JP2017108044A (ja) * | 2015-12-11 | 2017-06-15 | 株式会社Daiwa | 配線基板積層体及びその製造方法 |
JPWO2016063695A1 (ja) * | 2014-10-23 | 2017-08-10 | 住友ベークライト株式会社 | 金属箔張基板、回路基板および発熱体搭載基板 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US7817434B2 (en) * | 2004-10-14 | 2010-10-19 | Agere Systems Inc. | Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board |
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2004
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- 2004-05-11 JP JP2004141294A patent/JP3758175B2/ja not_active Expired - Lifetime
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2006
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WO2008126564A1 (ja) | 2007-03-12 | 2008-10-23 | Toyo Tanso Co., Ltd. | 放熱部材、それを用いた回路基板、電子部品モジュール及びその製造方法 |
EP2498288A2 (en) | 2007-03-12 | 2012-09-12 | Toyo Tanso Co., Ltd. | Circuit board using heat radiating member, electronic module and method for manufacturing the module |
JP2010105640A (ja) * | 2008-10-31 | 2010-05-13 | Nsk Ltd | 電動パワーステアリング装置 |
JPWO2016063695A1 (ja) * | 2014-10-23 | 2017-08-10 | 住友ベークライト株式会社 | 金属箔張基板、回路基板および発熱体搭載基板 |
JP2017108044A (ja) * | 2015-12-11 | 2017-06-15 | 株式会社Daiwa | 配線基板積層体及びその製造方法 |
Also Published As
Publication number | Publication date |
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JP3758175B2 (ja) | 2006-03-22 |
US20040228096A1 (en) | 2004-11-18 |
US7151229B2 (en) | 2006-12-19 |
EP1480269A1 (en) | 2004-11-24 |
US20070067987A1 (en) | 2007-03-29 |
US7552530B2 (en) | 2009-06-30 |
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