JP2004281743A - Pressure-contact power semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To not only prevent the losing of mounting screws upon disassembling and assembling but also improve the reliability of mechanical strength as well as the productivity of a control substrate mounting equipment, in a pressure-contact power semiconductor device in which the control substrate for controlling the semiconductor element is mounted on the cooling fin of the same element by mounting screws through the control substrate mounting equipment. <P>SOLUTION: The control substrate mounting equipment is constituted of a control substrate connecting unit for connecting the control substrate mounting equipment to the main surface of the control substrate so as to be opposed to the same and the mounting unit for the cooling fin formed by bending the unit on one end extended from the control substrate connecting unit, while the mounting equipment is employed for a control substrate mounting plate for screwing the mounting screws to the mounting unit, and the mounting screws are prevented from being lost from the mounting unit upon removing the control substrate mounting plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電力用圧接型半導体素子を制御する制御基板を前記電力用圧接型半導体素子を冷却する放熱フィンに制御基板取り付け具を介し取り付ける電力用圧接型半導体装置の改良に関するものである。
【０００２】
【従来の技術】
従来のこの種の電力用圧接型半導体装置は、制御基板を冷却フィンに固定するためにＬ字形固定部材を用いたものである。
【０００３】
【特許文献１】
特開２００２−２０３９３１公報 （請求項１、図３）
【０００４】
【発明が解決しようとする課題】
従来のこの種の電力用圧接型半導体装置は、制御基板に結合したＬ字形固定部材の一端を貫通するビスおよびナットにより前記Ｌ字形固定部材を冷却フィンに結合しており、前記冷却フィンに対する前記Ｌ字形固定部材の取り付けおよび取り外しにおいてビスやナットが脱落し紛失する問題があった。
【０００５】
この発明は、上述のような課題を解決するためになされたもので、第１の目的は、制御基板の冷却フィンへの取り付け、取り外しに関し、その取り付けおよび取り外し、所謂分解組立時に前記取り付けに用いるねじ部品の脱落、紛失を防止するものである。
また、第２の目的は、前記取り付けに関する取り付け具の機械的強度の信頼性を高めるものである。
【０００６】
さらに、第３の目的は、前記取り付け具を構造簡単で安価に提供するものである。
また、第４の目的は、前記取り付け具に板状生産の薄板化を図るものである。
【０００７】
【課題を解決するための手段】
この発明は、電力用圧接型半導体素子、この電力用圧接型半導体素子の少なくとも一端の主電極に圧接する冷却フィン、前記電力用圧接型半導体素子を制御する制御部品が実装された制御基板、その主面が前記制御基板の主面と対向し互いに結合する制御基板結合板部と、該制御基板結合板部の一端部に配設された取り付け部とからなる制御基板取り付け板、および前記取り付け部を貫通し前記取り付け部を前記冷却フィンに固定する取り付け用雄ねじを備えた電力用圧接型半導体装置において、前記制御基板結合板部の一端部から前記制御基板結合板部と一体をなし前記制御基板から離れる方向に延在する延在部をＵ字状に折り曲げて形成した対向板部の雄ねじ挿入側に前記雄ねじが螺合する雌ねじを、前記冷却フィン側には前記雄ねじが遊嵌する雄ねじ遊嵌孔を形成すると共に、前記冷却フィンに対し制御基板取り付け具を取り外した状態において、前記雌ねじによって前記取り付け部からの前記雄ねじの脱落を阻止するようにしたものである。
【０００８】
また、制御基板取り付け板の制御基板取り付け延在部の先端近傍を折り曲げ、その先端を対向板部の面に当接させたものである。
【０００９】
【発明の実施の形態】
実施の形態１．
図１乃至図４は実施の形態１を示す図で、図１は電力用圧接型半導体装置の電力用圧接型半導体素子と制御基板部の平面図、図２は側面図、図３は部分側面図、図４は要部詳細図である、図において１は電力用圧接型半導体素子を構成するゲート転流形ターンオフ（Ｇａｔｅ Ｃｏｍｍｕｔａｔｅｄ Ｔｕｒｎ−ｏｆｆ：以下ＧＣＴと称す）サイリスタで両端に冷却フィン２が圧接するアノード電極１ａとカソード電極１ｂを、またリング状をなしその外周に等ピッチで突出する制御用カソード端子１ｂ１を、更にまた外周に等ピッチで突出するゲート端子１ｃを有するものである。３はＧＣＴサイリスタを制御する制御基板で、その表主面に制御回路を構成するコンデンサ４や、ヒートシンク機能を有する壁状部材５に支持されたトランジスタ６が実装されてなるもので、カソード端子１ｂ１およびゲート端子１ｃがビス７により制御基板３の所定の回路パターン（図示せず）にビス止めされたものである。８はＬ字状取り付け板で、その主面が制御基板３の表主面と対向する制御基板結合板部８ａと、該制御基板結合板部８ａの一端から制御基板３の表主面から離れる方向に延在し、その途中からＵ字状に折り曲げて形成され、冷却フィン２への取り付け部８ｂと、前記Ｕ字状の折り曲げにて形成された折り曲げ部８ｃと、該折り曲げ部８ｃの両端にて折り曲げられ、その先端が前記延在部の主面に当接する折り曲げ部８ｄ，８ｅとからなり、折り曲げ部８ｃにはその両主面に貫通する雌ねじ８ｃ１が形成され前記延在部にはその両主面を貫通するよう且つ雌ねじ８ｃ１と同心をなし雌ねじ８ｃ１に螺合する後述する雄ねじが遊嵌する孔８ｃ２が形成され、且つ制御基板結合板部８ａがビス９とナット１０とにより制御基板３と結合されてなるものである。１１は六角穴付きボルトからなる雄ねじで、雌ねじ８ｃ１に螺合した雄ねじ部が孔８ｃ２に遊嵌すると共に、平板状取り付け板１２に形成された孔１２ａを貫通した先端にナット１３が螺着し、平板状取り付け板１２と、Ｌ字状取り付け板８とを結合させてなるものである。なお、平板状取り付け板１２はＬ字状取り付け板１４の一端に結合ねじ部材（図示せず）結合されたもので、Ｌ字状取り付け板１４の他端が冷却フィン２のフィン部にビス１５により結合されてなるものである。なお、この実施の形態１はＧＣＴサイリスタ１の両端に冷却フィン２を配設すると共に、冷却フィンの一つを介し２個のＧＣＴサイリスタ１を互いに直列に電気的接続したもので、冷却フィン２の一部分２Ａがアノード端子、２Ｋがカソード端子、２ＡＫが中間端子として機能するものである。１５は一対の加圧板１５ａと、一対の加圧板１５ａ、１５ａを連結するタイバー１５ｂと、該タイバー１５ｂの両端に螺着したナット１５ｃとで構成された加圧機構で、ナット１５ｃをねじ込むことで、ＧＣＴサイリスタ１の両端の主電極と、冷却フィン２との当接部を圧接し圧接型半導体装置を構成するものである。
【００１０】
このように構成された圧接型半導体装置においては、制御基板３からの制御信号によりＧＣＴサイリスタ１がオンオフ動作を行い、アノード端子２Ａとカソード端子２Ｋとの間、アノード端子２Ａと中間端子２ＡＫとの間、および中間端子２ＡＫとカソード端子２Ｋとの間がオンオフ動作することは周知の通りである。また、ヒートシンク機能を有する壁状部材５に支持されたトランジスタ６の発熱は壁状部材５から放熱される。
【００１１】
次に制御基板３の冷却フィン２に対する着脱について説明する。先ず取り付けの場合について説明する。制御基板３と結合されたＬ字状取り付け板８の雌ねじ８ｃ１に六角穴付きボルト１１を螺合させ、その先端の雄ねじ部が孔８ｃ２に遊嵌すると共に、平板状取り付け板１２を貫通した先端にナット１３が螺着し、平板状取り付け板１２と、Ｌ字状取り付け板１４とを結合させて取り付け完了となる。次に取り外しの場合について説明する。取り外しに際しては、ナット１３を保持した状態で六角穴付きボルト１１をナット１３と分離するまで緩めることで取り外しが完了するだけでなく、雌ねじ８ｃ１によって六角穴付きボルト１１の落下が阻止される。
【００１２】
また、Ｌ字状取り付け板８の折り曲げ部８ｃの両端に配設された折り曲げ部８ｄ，８ｅの先端を延在部の主面に当接させ構成したので制御基板取り付け板８の板厚を厚くすることなく、六角穴付きボルト１１の締付けに対する取り付け部の剛性を高めることができ、結果的に制御基板取り付け板、延いては電力用圧接型半導体装置の軽量化、コスト低減を図り得る。
【００１３】
実施の形態２．
図５に基づき実施の形態２について説明する。なお、図５は実施の形態１における図４に相当するものである。図において、１６は実施の形態１における平板状取り付け板１２とナット１３の機能を有する平板状取り付け板で、その両主面に貫通する雌ねじ１６ａに六角穴付きボルト１１の先端の雄ねじ部を螺着したものである。なお、その他の構成は実施の形態１と同一につき説明を省略する。
【００１４】
このように構成されたものにおいては、平板状取り付け板１６が実施の形態１のナット１３の役目をなすので、冷却フィン２に対する制御基板３の着脱に際し実施の形態１のようにナット１３を保持する必要がなく、従って、分解組立時に落下する部品を無くすことができる。
【００１５】
なお、電気的な動作については、実施の形態１と同一につき説明を省略する。
【００１６】
このように構成されたものにおいては、制御基板３の冷却フィン２に対する着脱において、雌ねじ８ｃ１によって六角穴付きボルト１１の落下が阻止されることは実施の形態１と同様であるだけでなく、実施の形態１のようにナット１３を保持する必要がなく、従って、分解組立の作業性の向上と、ねじ部品の落下による紛失を防止することができる。
【００１７】
【発明の効果】
この発明は以上説明したように、放熱フィンに対し制御基板取り付け板の取り付け、取り外し時、即ち分解組立時において前記制御基板取り付け板からの雄ねじの脱落が防止されるので、分解組立時に雄ねじが行方不明になる不具合を防止できるだけでなく、前記脱落の防止を制御基板取り付け板にて行なうので、殊更、部品を要することが無く、コストアップを防止できる。また制御基板取り付け板を折り曲げ加工のみで構成したので、複数の部品を接合し構成するもののように接合の信頼性低下の不安を排除できるだけでなく、前記制御基板取り付け板、延いては電力用圧接型半導体装置の生産性を向上できる効果がある等実用上極めて優れた効果がある。
【図面の簡単な説明】
【図１】本発明の実施の形態１における電力用圧接型半導体素子と制御基板部の平面図である。
【図２】本発明の実施の形態１における電力用圧接型半導体装置の側面図である。
【図３】本発明の実施の形態１における電力用圧接型半導体装置の部分側面図である。
【図４】本発明の実施の形態１における電力用圧接型半導体装置の要部詳細図である。
【図５】本発明の実施の形態２における電力用圧接型半導体装置の要部詳細図である。
【符号の説明】
１ 電力用圧接型半導体素子、 ２ 冷却フィン、 ３ 制御基板、 ８ 制御基板取り付け板、 ８ｂ 取り付け部、 ８ｃ 折り曲げ部、 ８ｄ 折り曲げ部、 ８ｅ 折り曲げ部、 ８ｃ１ 雌ねじ、 ８ｃ２ 孔、 １１ 雄ねじ、 １２ 平板状取り付け板、 １３ ナット、 １４ 平板状取り付け板、 １４ａ 雌ねじ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement in a power pressure contact type semiconductor device in which a control board for controlling the power pressure contact type semiconductor element is attached to a heat radiation fin for cooling the power pressure contact type semiconductor element via a control board attachment.
[0002]
[Prior art]
This type of conventional power pressure contact type semiconductor device uses an L-shaped fixing member to fix a control board to a cooling fin.
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2002-203931 (Claim 1, FIG. 3)
[0004]
[Problems to be solved by the invention]
In this type of conventional power pressure contact type semiconductor device, the L-shaped fixing member is connected to the cooling fin by a screw and a nut penetrating one end of the L-shaped fixing member connected to the control board. There has been a problem that screws and nuts are dropped and lost when attaching and detaching the L-shaped fixing member.
[0005]
The present invention has been made in order to solve the above-described problems, and a first object is to attach and detach a control board to and from a cooling fin, and to use the attachment and detachment during the so-called disassembly and assembly. This prevents the screw parts from falling off or being lost.
A second object is to increase the reliability of the mechanical strength of the mounting tool for the mounting.
[0006]
Further, a third object is to provide the attachment with a simple structure and at low cost.
A fourth object is to reduce the thickness of the attachment to plate-like production.
[0007]
[Means for Solving the Problems]
The present invention provides a power press-contact type semiconductor element, a cooling fin press-contacting at least one main electrode of the power press-contact type semiconductor element, a control board on which a control component for controlling the power press-contact type semiconductor element is mounted, A control board mounting plate including a control board connecting plate portion having a main surface facing the main surface of the control board and connecting to each other, and a mounting portion provided at one end of the control board connecting plate portion; and the mounting portion A power press-contact type semiconductor device provided with a male screw for mounting which penetrates the control board and fixes the mounting portion to the cooling fin, wherein the control board is integrated with the control board bonding plate from one end of the control board bonding plate. A female screw to which the male screw is screwed is inserted into a male screw insertion side of an opposite plate portion formed by bending an extending portion extending in a direction away from the U-shape, and the male screw is screwed to the cooling fin side. To form a male screw loosely fitted hole for fitting, in a state removed control board fixture relative to the cooling fins, is obtained so as to prevent detachment of the male screw from the mounting portion by the internal thread.
[0008]
Further, the control board mounting plate is bent near the front end of the control board mounting extending portion, and the front end is brought into contact with the surface of the opposing plate portion.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiment 1 FIG.
FIGS. 1 to 4 show the first embodiment. FIG. 1 is a plan view of a power pressure contact type semiconductor element and a control board portion of a power pressure contact type semiconductor device, FIG. 2 is a side view, and FIG. FIG. 4 is a detailed view of a main part. In FIG. 1, reference numeral 1 denotes a gate commutated turn-off (hereinafter referred to as GCT) thyristor constituting a power pressure contact type semiconductor device, and cooling fins 2 at both ends. It has an anode electrode 1a and a cathode electrode 1b which are pressed against each other, a control cathode terminal 1b1 which has a ring shape and protrudes at an equal pitch on the outer periphery, and further has a gate terminal 1c which protrudes at an equal pitch on the outer circumference. Reference numeral 3 denotes a control board for controlling the GCT thyristor, on which a capacitor 4 constituting a control circuit and a transistor 6 supported by a wall-shaped member 5 having a heat sink function are mounted on its main surface, and a cathode terminal 1b1 And the gate terminal 1c is screwed to a predetermined circuit pattern (not shown) of the control board 3 by a screw 7. Reference numeral 8 denotes an L-shaped mounting plate, a control board connecting plate portion 8a having a main surface facing the front main surface of the control board 3, and an end of the control board connecting plate portion 8a separating from the front main surface of the control board 3. In the U-shape, and is formed to be bent into a U-shape from the middle thereof, and is attached to the cooling fin 2, a bent portion 8c formed by the U-shaped bend, and both ends of the bent portion 8c The bent portion 8c is formed with a female screw 8c1 penetrating both main surfaces of the bent portion 8c. A hole 8c2 is formed so as to penetrate both main surfaces and concentric with the female screw 8c1 and into which a male screw to be described later is loosely fitted and screwed to the female screw 8c1, and the control board coupling plate 8a is controlled by the screw 9 and the nut 10. Although it is combined with the substrate 3 It is. Reference numeral 11 denotes a male screw composed of a hexagon socket head bolt. A male screw part screwed into the female screw 8c1 is loosely fitted in the hole 8c2, and a nut 13 is screwed into a tip which penetrates a hole 12a formed in the flat mounting plate 12. , The flat mounting plate 12 and the L-shaped mounting plate 8 are combined. The flat mounting plate 12 is formed by connecting a coupling screw member (not shown) to one end of the L-shaped mounting plate 14, and the other end of the L-shaped mounting plate 14 is screwed to a fin portion of the cooling fin 2. Are connected by In the first embodiment, cooling fins 2 are disposed at both ends of a GCT thyristor 1 and two GCT thyristors 1 are electrically connected in series via one of the cooling fins. 2A functions as an anode terminal, 2K functions as a cathode terminal, and 2AK functions as an intermediate terminal. Reference numeral 15 denotes a pressing mechanism including a pair of pressing plates 15a, a tie bar 15b connecting the pair of pressing plates 15a, 15a, and nuts 15c screwed to both ends of the tie bar 15b, and by screwing the nut 15c. , The contact portions between the main electrodes at both ends of the GCT thyristor 1 and the cooling fins 2 are pressed to form a press-contact type semiconductor device.
[0010]
In the press-contact type semiconductor device configured as described above, the GCT thyristor 1 performs an on / off operation by a control signal from the control board 3 to connect the anode terminal 2A to the cathode terminal 2K and the anode terminal 2A to the intermediate terminal 2AK. It is well known that the ON / OFF operation is performed between the intermediate terminal 2AK and the cathode terminal 2K. Further, heat generated by the transistor 6 supported by the wall member 5 having a heat sink function is radiated from the wall member 5.
[0011]
Next, attachment and detachment of the control board 3 to and from the cooling fins 2 will be described. First, the case of mounting will be described. A hexagon socket head bolt 11 is screwed into the female screw 8c1 of the L-shaped mounting plate 8 coupled to the control board 3, and the male screw portion at the distal end thereof is loosely fitted into the hole 8c2 and the distal end penetrates the flat mounting plate 12. The nut 13 is screwed into the nut, and the flat mounting plate 12 and the L-shaped mounting plate 14 are joined to complete the mounting. Next, the case of removal will be described. At the time of removal, the hexagon socket head cap screw 11 is loosened until it is separated from the nut 13 while holding the nut 13, so that not only the removal is completed but also the female screw 8 c 1 prevents the hexagon socket head cap bolt 11 from dropping.
[0012]
Further, since the distal ends of the bent portions 8d and 8e provided at both ends of the bent portion 8c of the L-shaped mounting plate 8 are configured to contact the main surface of the extending portion, the thickness of the control board mounting plate 8 is increased. The rigidity of the mounting portion against the tightening of the hexagon socket head bolt 11 can be increased without the need to perform this, and as a result, the weight and cost of the control board mounting plate, and consequently, the power pressure contact type semiconductor device can be reduced.
[0013]
Embodiment 2 FIG.
Embodiment 2 will be described with reference to FIG. FIG. 5 corresponds to FIG. 4 in the first embodiment. In the figure, reference numeral 16 denotes a flat mounting plate having the functions of the flat mounting plate 12 and the nut 13 according to the first embodiment, and a female screw 16a penetrating both main surfaces thereof is screwed with a male screw portion at the tip of the bolt 11 having a hexagonal hole. It is what I wore. The other configuration is the same as that of the first embodiment, and the description is omitted.
[0014]
In such a configuration, the flat mounting plate 16 plays the role of the nut 13 of the first embodiment. Therefore, when the control board 3 is attached to and detached from the cooling fin 2, the nut 13 is held as in the first embodiment. Therefore, it is possible to eliminate parts that fall during disassembly and assembly.
[0015]
Note that the electrical operation is the same as in the first embodiment, and a description thereof will be omitted.
[0016]
In the structure configured as described above, when the control board 3 is attached to and detached from the cooling fins 2, the falling of the hexagon socket head cap screw 11 is prevented by the female screw 8c1 as in the first embodiment. It is not necessary to hold the nut 13 as in the first embodiment. Therefore, it is possible to improve the workability of disassembly and assembly and prevent the screw component from being lost due to dropping.
[0017]
【The invention's effect】
As described above, the present invention prevents the external screw from dropping off from the control board mounting plate when the control board mounting plate is attached to and detached from the radiating fins, that is, at the time of disassembly and assembly. In addition to preventing unclear problems, the above-mentioned drop-out is prevented by the control board mounting plate, so that there is no need for any special components, and an increase in cost can be prevented. In addition, since the control board mounting plate is formed only by bending, it is not only possible to eliminate the fear of lowering the reliability of bonding as in the case where a plurality of parts are bonded, but also to control the control board mounting plate, There is an effect that is extremely excellent in practical use, such as an effect that the productivity of the semiconductor device can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view of a power pressure contact type semiconductor device and a control board unit according to Embodiment 1 of the present invention.
FIG. 2 is a side view of the power pressure contact type semiconductor device according to the first embodiment of the present invention.
FIG. 3 is a partial side view of the power pressure contact type semiconductor device according to the first embodiment of the present invention.
FIG. 4 is a detailed view of a main part of the power pressure contact type semiconductor device according to the first embodiment of the present invention;
FIG. 5 is a detailed view of a main part of a power pressure contact type semiconductor device according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF REFERENCE NUMERALS 1 power pressure contact type semiconductor element, 2 cooling fin, 3 control board, 8 control board mounting plate, 8b mounting portion, 8c bent portion, 8d bent portion, 8e bent portion, 8c1 female screw, 8c2 hole, 11 male screw, 12 flat plate Mounting plate, 13 nut, 14 Flat mounting plate, 14a Female screw

Claims (2)

電力用圧接型半導体素子、この電力用圧接型半導体素子の少なくとも一端の主電極に圧接する冷却フィン、前記電力用圧接型半導体素子を制御する制御部品が実装された制御基板、その主面が前記制御基板の主面と対向し互いに結合する制御基板結合板部と、該制御基板結合板部の一端部に配設された取り付け部とからなる制御基板取り付け板、および前記取り付け部を貫通し前記取り付け部を前記冷却フィンに固定する取り付け用雄ねじを備えた電力用圧接型半導体装置において、前記制御基板結合板部の一端部から前記制御基板結合板部と一体をなし前記制御基板から離れる方向に延在する延在部をＵ字状に折り曲げて形成した対向板部の雄ねじ挿入側に前記雄ねじが螺合する雌ねじを、前記冷却フィン側には前記雄ねじが遊嵌する雄ねじ遊嵌孔を形成すると共に、前記冷却フィンに対し制御基板取り付け具を取り外した状態において、前記雌ねじによって前記取り付け部からの前記雄ねじの脱落を阻止するようにしたことを特徴とする電力用圧接型半導体装置。A power press-contact semiconductor element, a cooling fin press-contacting a main electrode at at least one end of the power press-contact semiconductor element, a control board on which a control component for controlling the power press-contact semiconductor element is mounted, and a main surface of the control board. A control board coupling plate portion facing the main surface of the control substrate and coupled to each other, and a control substrate attachment plate including a mounting portion provided at one end of the control substrate coupling plate portion; and In a power pressure contact type semiconductor device provided with a male screw for mounting for fixing a mounting portion to the cooling fin, in a direction away from the control substrate, being integral with the control substrate coupling plate portion from one end of the control substrate coupling plate portion. A male screw into which the male screw is screwed is inserted into the male screw insertion side of the opposite plate portion formed by bending the extending portion into a U-shape, and a male screw into which the male screw is loosely fitted on the cooling fin side. A press-fit type for electric power, wherein a loose fitting hole is formed and the female screw prevents the male screw from dropping off from the mounting portion when the control board mounting tool is removed from the cooling fin. Semiconductor device. 制御基板取り付け具の延在部の先端近傍を折り曲げ、その先端を対向板部の面に当接させたことを特徴とする請求項１記載の電力用圧接型半導体装置。2. The power pressure contact type semiconductor device according to claim 1, wherein a portion near an end of the extending portion of the control board attachment is bent, and the end is brought into contact with a surface of the opposing plate portion.

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