【０００１】
【発明の属する技術分野】
本発明は、半導体素子での発熱を吸収し放射する放熱部材及びこれを備えた電子回路部品、電子機器に関し、より詳細には半導体素子を簡単に固着することができる放熱部材及びこれを備えた電子回路部品、電子機器に関するものである。
【０００２】
【従来の技術】
トランジスタやダイオードなどの半導体素子では作動によって熱が発生する。このため一般に、これらの半導体素子には放熱部材を取り付けて、発生した熱を周りに放出して半導体素子の温度上昇を抑えるようにしていた。半導体素子の放熱部材への従来の取り付け構造を図７及び図８に示す。図７では、半導体素子（例えばトランジスタ）２に当初から形成されてある固定用の孔２２にネジ７を挿通し、放熱部材６に形成されたネジ孔６１と螺合させることにより半導体素子２を放熱部材６に取り付けている。また図８では、弾性を有する板材を１８０°曲げ加工して挟持部材９とし、この挟持部材９を放熱部材８に取り付け、この挟持部材９の弾性力を利用して半導体素子２を固定している（例えば特許文献１）。
【０００３】
【特許文献１】
特開２０００−３２３８７６号公報（
【００１０】〜
【００１３】、図２、図３）
【０００４】
【発明が解決しようとする課題】
しかし図７に示したネジ止めする取り付け方法では、ドライバなどの工具を用いて半導体素子２を放熱部材１に取り付けなければならず生産性が上がらない。加えてネジを使用するため部品点数が増加し生産費が上昇する。また図８に示した挟持部材９を用いる取り付け方法では放熱部材８が大きくなり過ぎる。また、挟持部材９を使用するため前記と同様に部品点数が増加し生産費が上昇する。
【０００５】
そこで本発明はこのような従来の問題を解決すべくなされたものであり、その目的とするところは、サイズを大きくすることなく、またネジや挟持部材といった半導体素子を固定するための部品を用いることなく半導体素子を容易に取り付けられる放熱部材を提供することにある。
【０００６】
また本発明の目的は、放熱部材に固定された半導体素子を内蔵した電気回路部品および電子機器において、部品点数を少なくし、生産性を向上させると共に小型化を図ることにある。
【０００７】
【課題を解決するための手段】
前記目的を達成するため、本発明によれば、半導体素子が固定され、半導体素子での発熱を吸収し放射する板状の放熱部材であって、半導体素子の一部を挟入させる切り起こし部と、挟入させた半導体素子部分の対向側端が当接する突部とを有する特徴とする放熱部材が提供される。かかる構成により、本発明の放熱部材では、放熱部材の平面部と切り起こし部と間で半導体素子の一部を挟持する一方、切り起こし部による押圧力で半導体素子が切り起こし部から外れる方向に移動するのを前記突部で阻止し半導体素子を確実に固定する。
【０００８】
ここで、放熱部材に半導体素子を取り付ける際の半導体素子の位置決めを容易とすると共に、放熱部材から半導体素子が外れるのを一層防止する観点から、挟入させた半導体素子部分とその対向側端以外の半導体素子の側端が当接する第２突部をさらに形成するのが好ましい。
【０００９】
また、本発明によれば、前記の放熱部材に半導体素子が固着され、前記放熱部材が回路基板に固定されると共に、前記半導体素子が前記回路基板に実装されてなることを特徴とする電気回路部品が提供される。さらには、この電気回路部品を備えていることを特徴とする電子機器が提供される。
【００１０】
【発明の実施の形態】
以下、本発明の放熱部材について図に基づいて詳細に説明する。なお、本発明はこれらの実施形態に何ら限定されるものではない。
【００１１】
図１に、本発明に係る放熱部材の一実施形態を示す斜視図を示す。放熱部材１は、板状部材の両側部を略９０°に折り曲げ、平面視において「コ」字状に成形してなり、その中央部側面に切り起こし部１１が形成されている。また、切り起こし部１１の自由端側方向（図の下方）には突部１２が、そして切り起こし部１１と突部１２との略中間位置には突部（第２突部）１３，１４が半導体素子２の幅に相当する距離離れた対向位置に形成されている。一方、両側部の下端面には、放熱部材１を回路基板３（図５に図示）に固定するための取付け用脚部１５が形成されている。
【００１２】
図２に示すように、この放熱部材１に半導体素子２を取り付ける場合には、傾斜した切り起こし部１１と放熱部材１の側面とで形成される隙間に半導体素子２の一部をまず挟入させる（図の破線）。次に、挟入させた半導体素子部分の対向側部を放熱部材１の方向に押圧し、半導体素子２の背面が放熱部材１に側面に接触するようにする。この時、切り起こし部１１は半導体素子２によって押し上げられるので、切り起こし部１１の弾性力によって切り起こし部１１と放熱部材１の側面との間で半導体素子２を挟持する力が生じる。一方、切り起こし部１１から力を受けた半導体素子２は、切り起こし部１１と放熱部材１の側面との隙間から外れる方向（図の下方向）に移動しようとするが、挟入させた半導体素子部分の対向側端が、放熱部材１に形成された突部１２に当接しているため半導体素子２の移動は阻止される。これにより図３に示すように半導体素子２は放熱部材１にしっかりと安定して固定される。
【００１３】
また図１の放熱部材１では、半導体素子２の挟入部分とその対向側端以外の側端（図の左右側端）が当接するように突部１３，１４が形成されているため、図における左右方向の半導体素子２の動きも阻止され、放熱部材１への半導体素子２の固定が一層確実なものとされている。なお、この突部１３，１４は、半導体素子２を放熱部材１に取り付ける際に、半導体素子２を取付位置に案内する作用をも奏するのでその形成が推奨される。
【００１４】
また、熱伝導性を上げるために半導体素子２と放熱部材１との間にグリース（不図示）などを塗布するのが好ましい。グリースなどの潤滑剤は通常は粘着性を有しているので、半導体素子２を放熱部材１に固定する上でも好ましい。
【００１５】
このような構成の放熱部材は一体成形するのが生産性の観点からは望ましい。例えば一枚の金属平板を金型で打ち抜き加工して、図１の放熱部材１を平面に展開した形状に成形する。そして、突部１２，１３，１４を、いわゆるハーフパンチによって板厚の半分程度押し出し成形して形成する。次に、曲げ加工によって平板の両側部を略９０°に曲げるとともに切り起こし部１１に若干の傾斜を持たせる。
【００１６】
なお、図１の放熱部材１では、切り起こし部１１を１つそして突部１２を２つ設けているがこれに限定されるものではなく、図４（ａ）に示すように、固定する半導体素子の大きさや形状に合わせて、切り起こし部１１を２つ以上設けても構わない、また同様に、突部１２を１個又は３個以上設けてももちろん構わない。また、切り起こし部１１と突部１２との形成位置関係は必ずしも鉛直方向である必要はなく、同図（ｂ）に示すように、鉛直方向に垂直な方向であってももちろん構わない。
【００１７】
以上のようにして放熱部材に固定された半導体素子は次に回路基板に実装される。図５に、半導体素子２を回路基板３に実装した電気回路部品の一実施形態を示す組立斜視図を示す。回路基板３には、放熱部材１の取付け用脚部１５及び半導体素子２のリード２３がそれぞれ挿通するための２つの長孔３１及び３つの小孔３２がそれぞれ形成されている。なお、この図では回路基板３に形成されている表面電極パターンは省略してある。
【００１８】
この回路基板３に半導体素子２を実装する場合には、一体に固定された放熱部材１と半導体素子２とを、回路基板３の一方面側の垂直上方から回路基板方向に相対的に移動させる。そして、取付け用脚部１５とリード２３とを長孔３１と小孔３２にそれぞれ挿通させながら放熱部材１の底面が回路基板３の表面に当接するまで移動させる。次に、回路基板３の反対面側に突出している、放熱部材１の取付け用脚部１５を折り曲げる。これにより放熱部材１および半導体素子２は回路基板３に固定される。そして、必要によりリード２３を屈曲・切断した後、溶融ハンダ槽に浸漬してリード２３と回路基板３の表面電極（不図示）とをハンダで導通可能に固着する。なお、この図の半導体素子２はいわゆる基板実装型であるため小孔３２は必要であるが、本発明では表面実装型の半導体素子も使用することができ、この場合にはリードを挿通させる小孔３２は不要となる。
【００１９】
このように放熱部材および半導体素子を回路基板にそれぞれ固定したことによって、放熱部材と半導体素子との固定状態はより完全なものとなる。
【００２０】
このようにして作製された電気回路部品は、音響機器や家庭用電気機器をはじめ種々の電子機器に搭載される。図６に、放熱部材１に固定された半導体素子（トランジスタ）２を内蔵した音響機器の内部斜視図を示す。図６の音響機器では、一体に固定された放熱部材１と半導体素子２とが２組実装された回路基板３が、回路基板３の四隅に穿設された孔３３にネジ７が挿通されて機器内部に固定されている。
【００２１】
【発明の効果】
本発明の放熱部材では、半導体素子の一部を挟入させる切り起こし部と、挟入させた半導体素子部分の対向側端が当接する突部とを有する構成としたので、ネジや挟持部材といった半導体素子を固定するための部品を特に必要とせず半導体素子を容易に取り付けることができる。これにより放射部材の小型化が図れ、また生産性が向上する。
【００２２】
また挟入させた半導体素子部分とその対向側端以外の半導体素子の側端が当接する第２突部をさらに設けると、半導体素子の放熱部材への固定を一層安定させることができる。
【００２３】
本発明の電気回路部品では、前記放熱部材を回路基板に固定すると共に前記半導体素子を前記回路基板に実装してなる構成としたので、構成部品点数を少なくでき、また高い生産性が得られると共に小型化が図れる。
【００２４】
また本発明の電子機器では上記の電気回路部品を備えるので、同様の効果が得られる。
【図面の簡単な説明】
【図１】本発明に係る放熱部材の一実施形態を示す斜視図である。
【図２】図１の放熱部材に半導体素子を取り付けるときの説明図である。
【図３】図１の放熱部材に半導体素子を取り付けた場合の斜視図である。
【図４】本発明に係る放熱部材の他の実施形態を示す斜視図である。
【図５】本発明に係る電気回路部品の一実施形態を示す組立斜視図である。
【図６】本発明に係る電子機器の一実施形態を示す斜視図である。
【図７】従来の放熱部材の一例を示す組立斜視図である。
【図８】従来の放熱部材の他の例を示す斜視図である。
【符号の説明】
１，１’，１” 放熱部材
２ 半導体素子
３ 回路基板
６，８ 放熱部材
７ ネジ
９ 挟持部材
１１ 切り起こし部
１２ 突部
１３，１４ 突部（第２突部）
１５ 取付け用脚部
２１ 半導体素子本体
２２ 孔
２３ リード
３１ 長孔
３２ 小孔
３３ 取付用孔[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat radiating member that absorbs and radiates heat generated by a semiconductor element, and an electronic circuit component and an electronic device provided with the heat radiating member. The present invention relates to electronic circuit components and electronic devices.
[0002]
[Prior art]
In semiconductor devices such as transistors and diodes, heat is generated by operation. Therefore, generally, a heat radiating member is attached to these semiconductor elements, and the generated heat is released to the surroundings to suppress the temperature rise of the semiconductor elements. FIGS. 7 and 8 show a conventional mounting structure of a semiconductor element to a heat radiating member. In FIG. 7, the screw 7 is inserted into a fixing hole 22 formed in the semiconductor element (for example, a transistor) 2 from the beginning, and screwed into a screw hole 61 formed in the heat radiating member 6 to form the semiconductor element 2. It is attached to the heat radiation member 6. In FIG. 8, a plate member having elasticity is bent by 180 ° to form a holding member 9, the holding member 9 is attached to the heat radiating member 8, and the semiconductor element 2 is fixed using the elastic force of the holding member 9. (For example, Patent Document 1).
[0003]
[Patent Document 1]
JP-A-2000-323876 (
[0010]
(FIGS. 2 and 3)
[0004]
[Problems to be solved by the invention]
However, in the mounting method using screws shown in FIG. 7, the semiconductor element 2 must be mounted on the heat radiating member 1 using a tool such as a screwdriver, so that productivity is not improved. In addition, the use of screws increases the number of parts and increases production costs. In the mounting method using the holding member 9 shown in FIG. 8, the heat radiation member 8 is too large. In addition, since the holding member 9 is used, the number of parts is increased and the production cost is increased in the same manner as described above.
[0005]
Therefore, the present invention has been made to solve such a conventional problem, and its purpose is to use components for fixing a semiconductor element such as screws and holding members without increasing the size. It is an object of the present invention to provide a heat dissipating member to which a semiconductor element can be easily attached without using the same.
[0006]
Another object of the present invention is to reduce the number of components in an electric circuit component and an electronic device incorporating a semiconductor element fixed to a heat radiating member, improve productivity, and reduce the size.
[0007]
[Means for Solving the Problems]
To achieve the above object, according to the present invention, a semiconductor element is fixed, a plate-shaped heat radiating member that absorbs and radiates heat generated in the semiconductor element, and has a cut-and-raised portion for sandwiching a part of the semiconductor element. And a heat radiating member having a protruding portion with which the opposite side end of the semiconductor element portion sandwiched therebetween comes into contact. With such a configuration, in the heat radiating member of the present invention, while the semiconductor element is partially held between the flat portion and the cut-and-raised portion of the heat radiating member, the semiconductor element is displaced from the cut-and-raised portion by the pressing force of the cut and raised portion. The movement is prevented by the protrusions, and the semiconductor element is securely fixed.
[0008]
Here, from the viewpoint of facilitating the positioning of the semiconductor element when attaching the semiconductor element to the heat radiating member and further preventing the semiconductor element from coming off from the heat radiating member, the semiconductor element portion other than the sandwiched semiconductor element portion and the opposite end thereof It is preferable to further form a second protrusion with which the side end of the semiconductor element abuts.
[0009]
Further, according to the present invention, an electric circuit characterized in that a semiconductor element is fixed to the heat dissipation member, the heat dissipation member is fixed to a circuit board, and the semiconductor element is mounted on the circuit board. Parts are provided. Furthermore, there is provided an electronic device characterized by including the electric circuit component.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the heat radiation member of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to these embodiments.
[0011]
FIG. 1 is a perspective view showing one embodiment of a heat dissipation member according to the present invention. The heat dissipating member 1 is formed by bending both sides of a plate-like member at approximately 90 ° and forming a “C” shape in plan view, and a cut-and-raised portion 11 is formed on a side surface of a central portion thereof. Further, a protrusion 12 is provided in the free end side of the cut-and-raised portion 11 (downward in the figure), and the protrusions (second protrusions) 13 and 14 are provided at a substantially intermediate position between the cut-and-raised portion 11 and the protrusion 12. Are formed at opposing positions separated by a distance corresponding to the width of the semiconductor element 2. On the other hand, mounting legs 15 for fixing the heat radiation member 1 to the circuit board 3 (shown in FIG. 5) are formed on the lower end surfaces of both sides.
[0012]
As shown in FIG. 2, when the semiconductor element 2 is attached to the heat radiating member 1, a part of the semiconductor element 2 is first inserted into a gap formed by the inclined cut-and-raised portion 11 and a side surface of the heat radiating member 1. (Broken line in the figure). Next, the opposing side portion of the sandwiched semiconductor element portion is pressed in the direction of the heat radiating member 1 so that the back surface of the semiconductor element 2 comes into contact with the side surface of the heat radiating member 1. At this time, since the cut-and-raised portion 11 is pushed up by the semiconductor element 2, a force for holding the semiconductor element 2 between the cut-and-raised portion 11 and the side surface of the heat radiation member 1 is generated by the elastic force of the cut-and-raised portion 11. On the other hand, the semiconductor element 2 receiving the force from the cut-and-raised portion 11 tends to move in a direction (downward in the drawing) away from the gap between the cut-and-raised portion 11 and the side surface of the heat radiating member 1, Since the opposing end of the element portion is in contact with the protrusion 12 formed on the heat radiating member 1, the movement of the semiconductor element 2 is prevented. Thereby, the semiconductor element 2 is firmly and stably fixed to the heat radiating member 1 as shown in FIG.
[0013]
Further, in the heat radiation member 1 of FIG. 1, the projections 13 and 14 are formed so that the sandwiched portion of the semiconductor element 2 and the side end (the left and right side end in the figure) other than the opposite side end are in contact with each other. The movement of the semiconductor element 2 in the left-right direction is also prevented, and the fixing of the semiconductor element 2 to the heat radiating member 1 is further ensured. In addition, when the semiconductor elements 2 are attached to the heat radiating member 1, the projections 13 and 14 also have an effect of guiding the semiconductor element 2 to the attachment position, and therefore, the formation thereof is recommended.
[0014]
Further, it is preferable to apply grease (not shown) between the semiconductor element 2 and the heat radiating member 1 in order to increase the thermal conductivity. Since a lubricant such as grease usually has adhesiveness, it is preferable for fixing the semiconductor element 2 to the heat dissipation member 1.
[0015]
It is desirable from the viewpoint of productivity that the heat radiating member having such a configuration is integrally formed from the viewpoint of productivity. For example, one metal flat plate is stamped out with a die to form the heat dissipating member 1 of FIG. 1 into a flat shape. Then, the protrusions 12, 13, and 14 are formed by extruding about half the plate thickness using a so-called half punch. Next, both sides of the flat plate are bent to approximately 90 ° by bending, and the cut-and-raised portion 11 is slightly inclined.
[0016]
In the heat radiation member 1 of FIG. 1, one cut-and-raised portion 11 and two protrusions 12 are provided. However, the present invention is not limited to this. As shown in FIG. Two or more cut-and-raised portions 11 may be provided according to the size and shape of the element. Similarly, one or three or more protrusions 12 may be provided. Further, the formation positional relationship between the cut-and-raised portion 11 and the protruding portion 12 does not necessarily have to be in the vertical direction, but may be in the direction perpendicular to the vertical direction as shown in FIG.
[0017]
The semiconductor element fixed to the heat radiating member as described above is next mounted on a circuit board. FIG. 5 is an assembly perspective view showing one embodiment of an electric circuit component in which the semiconductor element 2 is mounted on the circuit board 3. The circuit board 3 is formed with two long holes 31 and three small holes 32 through which the mounting legs 15 of the heat radiating member 1 and the leads 23 of the semiconductor element 2 are inserted, respectively. In this figure, the surface electrode pattern formed on the circuit board 3 is omitted.
[0018]
When the semiconductor element 2 is mounted on the circuit board 3, the heat-dissipating member 1 and the semiconductor element 2, which are integrally fixed, are relatively moved in the direction of the circuit board from vertically above one surface of the circuit board 3. . Then, the mounting leg 15 and the lead 23 are moved until the bottom surface of the heat radiating member 1 contacts the surface of the circuit board 3 while being inserted through the long hole 31 and the small hole 32, respectively. Next, the mounting leg 15 of the heat radiating member 1 projecting to the opposite surface side of the circuit board 3 is bent. Thereby, the heat radiating member 1 and the semiconductor element 2 are fixed to the circuit board 3. Then, after the lead 23 is bent or cut as necessary, the lead 23 is immersed in a molten solder bath, and the lead 23 and a surface electrode (not shown) of the circuit board 3 are fixed in a conductive manner with solder. Although the semiconductor element 2 in this figure is a so-called substrate mounting type, the small holes 32 are necessary. However, in the present invention, a surface mounting type semiconductor element can also be used. The hole 32 becomes unnecessary.
[0019]
By fixing the heat radiating member and the semiconductor element to the circuit board in this way, the fixing state between the heat radiating member and the semiconductor element becomes more complete.
[0020]
The electric circuit component manufactured in this manner is mounted on various electronic devices including audio devices and home electric devices. FIG. 6 shows an internal perspective view of an acoustic device incorporating a semiconductor element (transistor) 2 fixed to a heat radiating member 1. In the acoustic device shown in FIG. 6, the circuit board 3 on which two sets of the heat radiating member 1 and the semiconductor element 2 fixed together are mounted, and the screw 7 is inserted into the holes 33 formed in the four corners of the circuit board 3. Fixed inside the device.
[0021]
【The invention's effect】
In the heat dissipation member of the present invention, the cut-and-raised portion for sandwiching a part of the semiconductor element and the projecting portion with which the opposite side end of the sandwiched semiconductor element portion abuts are used. The semiconductor element can be easily attached without requiring any special component for fixing the semiconductor element. As a result, the size of the radiation member can be reduced, and the productivity can be improved.
[0022]
Further, if a second projection is provided in which a side edge of the semiconductor element other than the sandwiched semiconductor element portion and the opposite side end abuts, the fixing of the semiconductor element to the heat radiating member can be further stabilized.
[0023]
In the electric circuit component of the present invention, since the heat dissipation member is fixed to the circuit board and the semiconductor element is mounted on the circuit board, the number of components can be reduced, and high productivity can be obtained. The size can be reduced.
[0024]
In addition, the electronic device of the present invention includes the above-described electric circuit components, and thus can provide similar effects.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a heat dissipation member according to the present invention.
FIG. 2 is an explanatory diagram when a semiconductor element is attached to the heat radiating member of FIG. 1;
FIG. 3 is a perspective view when a semiconductor element is attached to the heat radiating member of FIG. 1;
FIG. 4 is a perspective view showing another embodiment of the heat radiation member according to the present invention.
FIG. 5 is an assembled perspective view showing an embodiment of an electric circuit component according to the present invention.
FIG. 6 is a perspective view illustrating an embodiment of an electronic apparatus according to the invention.
FIG. 7 is an assembled perspective view showing an example of a conventional heat dissipation member.
FIG. 8 is a perspective view showing another example of a conventional heat dissipation member.
[Explanation of symbols]
1, 1 ', 1 "heat dissipating member 2 semiconductor element 3 circuit board 6, 8 heat dissipating member 7 screw 9 clamping member 11 cut-and-raised portion 12 projecting portion 13, 14 projecting portion (second projecting portion)
15 Mounting leg 21 Semiconductor element body 22 Hole 23 Lead 31 Long hole 32 Small hole 33 Mounting hole
