JP2004232084A - Method of producing micro metallic ball - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 189
- 239000002184 metal Substances 0.000 claims abstract description 189
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 150000002739 metals Chemical class 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 claims description 42
- 229910001111 Fine metal Inorganic materials 0.000 claims description 17
- 239000002245 particle Substances 0.000 abstract description 15
- 230000008018 melting Effects 0.000 description 32
- 238000002844 melting Methods 0.000 description 32
- 239000007789 gas Substances 0.000 description 26
- 239000002994 raw material Substances 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 230000006698 induction Effects 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000012535 impurity Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
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- 239000007772 electrode material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000010334 sieve classification Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
本発明は、真球度が高く、粒径の揃った微小金属球を得る製造方法に関するものである。 The present invention relates to a method for producing fine metal spheres having a high sphericity and a uniform particle size.
近年、真球度が高く、粒径の揃った微小金属球が様々な分野で要求されている。例えば電子機器の製造分野では、ＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）やＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）と呼ばれる形態の接合方法が広く行われるようになっており、こられの接合方法では微小金属球が用いられる。ＢＧＡ、ＣＳＰは何れもパッケージの裏面に入出力用のパッドを並べたＩＣパッケージであり、金属球を予め搭載しているパッケージを、実装基板上に設置し、一括リフローによりパッケージと実装基板とを接合を行う技術である。 In recent years, fine metal spheres having high sphericity and uniform particle size have been demanded in various fields. For example, in the field of manufacturing electronic devices, a bonding method in a form called BGA (Ball Grid Array) or CSP (Chip Size Package) has been widely performed, and a small metal sphere is used in these bonding methods. Both BGA and CSP are IC packages in which input / output pads are arranged on the back of the package. A package in which metal balls are mounted in advance is placed on a mounting board, and the package and the mounting board are reflowed by batch reflow. This is a technique for joining.
電子機器の高性能化に伴い、ＢＧＡ、ＣＳＰ等により電子機器を構成する各部品を接合する際には、高精度な接合寸法が要求されている。従来、要求される接合寸法は、縦、横の平面方向についてであったが、一部の電子機器に用いられる電子部品では、平面方向に加え、高さ方向、すなわち部品を接合する基板と部品との間隔についても高精度な接合寸法が要求されるようになっている。言いかえると、このような電子機器では、接合部は単に電気的な導通部としての機能のみならず、スペーサとしての機能も要求されるようになっている。 2. Description of the Related Art As electronic devices become more sophisticated, high-precision bonding dimensions are required when components of an electronic device are joined by a BGA, a CSP, or the like. Conventionally, the required bonding dimensions are in the vertical and horizontal plane directions, but in the electronic components used in some electronic devices, in addition to the plane direction, the height direction, that is, the board and the component to be bonded are connected. With respect to the gap between the two, a high-precision joining dimension is required. In other words, in such an electronic device, the bonding part is required to have not only a function as an electrical conduction part but also a function as a spacer.
通常、ＢＧＡ、ＣＳＰ等の接続では融点の低いＳｎ基のはんだ合金からなる微小金属球が用いられているが、スペーサとしての機能が要求される上記の用途では、はんだ合金と比べて融点の高いＣｕ等の微小金属球にはんだ合金を被覆したものが用いられている。 Normally, small metal spheres made of a Sn-based solder alloy having a low melting point are used for connection of BGA, CSP and the like. However, in the above-mentioned applications that require a function as a spacer, the melting point is higher than that of a solder alloy. A metal sphere made of Cu or the like coated with a solder alloy is used.
例示したこれらの用途に用いられる微小金属球では、粒径が小さいのみならず、真球度が高く、粒径のばらつきが小さいことが併せて要求される。現在このような微小金属は、定尺に切断された金属細片を、上部がこの金属細片の融点より高く、下部が融点以下の油中に上部から投入し、表面張力を利用して球状化させる油中冷却法や、縦配列された炉芯管内で、金属細片を自由落下させながら金属細片をその融点以上に加熱して、球状化させる方法（例えば特許文献１、２参照。）などにより製造されている。 The micro-metal spheres used in these exemplified applications are required not only to have a small particle size but also to have a high sphericity and a small variation in the particle size. At present, such fine metal is made by cutting metal flakes cut into a fixed size into an oil whose upper part is higher than the melting point of this metal flake and whose lower part is lower than the melting point. Or a method of heating a metal strip to its melting point or higher while free falling the metal strip in a vertically arranged furnace core tube to form a spheroid (for example, see Patent Documents 1 and 2). ).
上述の方法は、定量に分断された金属片を溶解し、表面張力により球状化した後、凝固させるので、真球度が高く、粒径が揃った微小金属球を製造することが出来る。
しかしながら油中冷却法は、はんだ等の低融点の金属、換言すると融点が油の沸点以下の金属にしか適用することが出来ない為、Ｃｕや、Ｗ、Ｍｏ等の融点の高い金属を球状化することは不可能である。
According to the above-mentioned method, since the metal pieces divided into a fixed amount are melted, spheroidized by surface tension, and then solidified, fine metal spheres having a high sphericity and a uniform particle size can be manufactured.
However, since the cooling method in oil can be applied only to metals having a low melting point such as solder, in other words, metals having a melting point lower than the boiling point of oil, metals having a high melting point such as Cu, W, and Mo are spheroidized. It is impossible to do.
また、特許文献１、２に記載の方法は、油中冷却法と比べると金属片を高温に加熱することが可能であるものの、炉中を自由落下させる為、金属片は炉の高温部分を短時間で通過するため、十分な加熱が出来ない場合がある。また、微小な金属片の場合は、炉心管内部の対流の為、飛散したり、炉内部への付着が避けられない。これは炉の寿命を短くするほか、粉末を回収できないという問題がある。さらに、高融点の金属片を球状化する場合には金属片の融点と比較して十分な温度まで炉の温度を上げることが出来ない為、一層、金属片の加熱が不足し、球状化を達成することが困難である。 In addition, the methods described in Patent Documents 1 and 2 can heat metal pieces to a high temperature as compared with the cooling method in oil. Due to the short passage, sufficient heating may not be possible. Further, in the case of a small metal piece, because of convection inside the furnace core tube, it is inevitable that the metal piece scatters or adheres to the inside of the furnace. This not only shortens the life of the furnace but also has the problem that the powder cannot be recovered. Furthermore, when spheroidizing a high melting point metal piece, it is not possible to raise the temperature of the furnace to a sufficient temperature compared with the melting point of the metal piece. Difficult to achieve.
本発明は上記課題に鑑み、真球度が高く、粒径の揃った微小金属球を容易に得ることができる製造方法を提供することを目的とする。 In view of the above problems, an object of the present invention is to provide a manufacturing method capable of easily obtaining fine metal spheres having a high sphericity and a uniform particle size.
本発明者は、ワイヤ材を所定の寸法に切断した金属片をプラズマにより加熱・成形することにより上記問題を解決するに至った。 The present inventor has solved the above problem by heating and shaping a metal piece obtained by cutting a wire material to a predetermined size by plasma.
すなわち本発明は、直径φのワイヤ材を所定の間隔に切断し、切断後の長さＬが２ｍｍ以下、φとＬとの比が０．１≦Ｌ／φ≦３．０である金属片を得、ついで該金属片をプラズマ炎中に導入して球状化する微小金属球の製造方法である。
本発明において金属片はＣｕ、Ａｇ、Ａｕ、Ａｌの何れかの金属またはこれらを主体とする合金であることが好ましい。また、金属片の平均体積は５×１０−４ｃｍ３以下であることが好ましい。
That is, the present invention provides a metal piece in which a wire material having a diameter φ is cut at a predetermined interval, a length L after cutting is 2 mm or less, and a ratio of φ to L is 0.1 ≦ L / φ ≦ 3.0. And then introducing the metal pieces into a plasma flame to form spheres.
In the present invention, the metal piece is preferably a metal of Cu, Ag, Au, or Al or an alloy mainly containing these metals. The average volume of the metal piece is preferably 5 × 10 −4 cm 3 or less.
本発明によれば、真球度が高く、粒径の揃った微小金属球の製造が可能である。加えて、微小金属球の表面の清浄化も同時に達成することが可能である。このような特徴を具備する微小金属球は、電子部品やマイクロマシン等の製造において欠くことの出来ないものである。 According to the present invention, it is possible to produce fine metal spheres having high sphericity and uniform particle diameter. In addition, it is possible to simultaneously clean the surface of the fine metal sphere. The minute metal spheres having such features are indispensable in the production of electronic components, micromachines, and the like.
上述したように、本発明の重要な特徴は、ワイヤ材を所定の間隔に切断してなる金属片をプラズマ炎中に導入する構成を採用したことにある。 As described above, an important feature of the present invention is that a metal piece obtained by cutting a wire material at a predetermined interval is introduced into a plasma flame.
本発明で適用するプラズマ炎とは気体にエネルギを加える事で気体中の分子を原子の状態に解離し、原子をさらにイオンと電子に電離させた電離気体であり、電気炉により金属片の加熱を行う従来の製造方法と比べて非常に高い温度、具体的には、高温部では温度が５０００℃以上に加熱することが可能である。このようにプラズマ炎では極めて高温の雰囲気を、はんだ合金と比べて融点の高い融点が５００〜２０００℃、さらにはそれ以上の金属や合金からなる金属片であっても、プラズマ炎の高温部に金属片が導入さると、プラズマ炎の高い熱伝導率により、金属片は瞬時に溶解する。 The plasma flame applied in the present invention is an ionized gas in which molecules in a gas are dissociated into atoms by applying energy to the gas, and the atoms are further ionized into ions and electrons. Can be heated to a very high temperature, specifically, a temperature of 5,000 ° C. or more in a high-temperature portion as compared with the conventional manufacturing method of performing the above. As described above, in a plasma flame, an extremely high-temperature atmosphere is formed in a high-temperature portion of the plasma flame even if a metal piece having a melting point higher than that of a solder alloy, having a melting point of 500 to 2000 ° C., or even a metal or alloy higher than that. When the metal pieces are introduced, the metal pieces melt instantly due to the high thermal conductivity of the plasma flame.
加えて、プラズマ炎を用いた場合、高温となるのはプラズマ炎のみであり、プラズマ炎から外れた位置では急激に温度が低下する。言いかえると、局所的に極めて高温の雰囲気を達成でき、プラズマ炎とそれ以外の場所との間では急激な温度勾配を形成できる。この急激な温度勾配により、プラズマ炎の高温部において金属片は溶解、自身の表面張力により球状化し、球状化した金属片はプラズマ炎からはなれると、すばやく融点以下に冷却され、凝固して金属球を形成することができる。したがって、実質的に自由落下している短時間で、高融点の金属を効率的に球状化することが可能となる。 In addition, when a plasma flame is used, only the plasma flame has a high temperature, and the temperature rapidly drops at a position outside the plasma flame. In other words, an extremely high temperature atmosphere can be locally achieved, and a sharp temperature gradient can be formed between the plasma flame and other places. Due to this steep temperature gradient, the metal piece melts in the high temperature part of the plasma flame and turns into a sphere due to its own surface tension. A sphere can be formed. Therefore, the high melting point metal can be efficiently spheroidized in a short time during which it is substantially free falling.
このようなプラズマ炎中での溶解から凝固の過程では、溶解から凝固が単一の金属片で行われたものは短時間で溶解、凝固を行うので、溶融中の蒸発量が少なく、殆ど体積の変動を生じない。したがって、ワイヤ材を所定の間隔に切断してなる金属片、即ち体積の揃った金属片を用いることで、粒径の揃った微小金属球とすることができるのである。溶解から凝固の過程が単一の金属片で行われず、溶解中に他の金属片と接触して体積が変動するものもあるが、これらの金属球では、単一の金属片が凝固したものと比べて体積や形状が大きく異なる為、分級により容易に取り除くことが可能である。
以上に述べた製造方法により、粒径の揃った微小金属球を効率的に製造することができる。
In the process of melting and solidifying in such a plasma flame, the melting and solidifying performed in a single piece of metal melts and solidifies in a short time, so the amount of evaporation during melting is small and almost volume Does not fluctuate. Therefore, by using a metal piece obtained by cutting a wire material at a predetermined interval, that is, a metal piece having a uniform volume, a fine metal sphere having a uniform particle size can be obtained. The process from melting to solidification does not take place in a single piece of metal, and in some cases, the volume changes due to contact with other pieces of metal during melting, but in these metal spheres, a single piece of metal solidifies Since the volume and shape are greatly different from those of, they can be easily removed by classification.
According to the above-described manufacturing method, fine metal spheres having a uniform particle size can be efficiently manufactured.
加えて本発明の製造方法では、金属片に形成している酸化物を、溶融、球状化過程において低減することも可能であり、従来の製造方法と比べて表面の清浄な微小金属球を得ることができる。これは、本発明の製造方法では既に述べたようにプラズマ炎の高温部では温度が５０００℃以上に達するが、プラズマ炎中において金属片が５０００℃のような高温に加熱されると、金属片表面で酸化物を形成している酸素は解離し、雰囲気中に飛散するためである。 In addition, in the production method of the present invention, it is possible to reduce the oxides formed on the metal pieces in the melting and spheroidizing process, and obtain fine metal spheres with a clean surface as compared with the conventional production method. be able to. This is because, in the manufacturing method of the present invention, the temperature reaches 5000 ° C. or more in the high temperature part of the plasma flame as described above, but when the metal piece is heated to a high temperature such as 5000 ° C. in the plasma flame, the metal piece This is because oxygen forming an oxide on the surface is dissociated and scatters in the atmosphere.
微小金属球が電子機器に用いられる場合には、微小金属球の抵抗率を低くする等の理由から、表面の汚染や、酸化が少ないことが要求されるが、本発明の製造方法によればこのような用途に適した微小金属球を製造することが可能となる。したがって、本発明の製造方法は、導電性材料として用いられる金属や合金、具体的にはＣｕ、Ａｇ、Ａｕ、Ａｌの何れかの金属またはこれらを主体とする合金の球状化に適用することが特に好ましい。
さらに、金属片の溶融、球状化、凝固を還元雰囲気のプラズマ中で行うことで、より酸素含有量の低い金属球を得ることができる。
When small metal spheres are used in electronic devices, surface contamination and oxidation are required to be low for reasons such as lowering the resistivity of the small metal spheres, but according to the manufacturing method of the present invention, It is possible to manufacture a fine metal sphere suitable for such a use. Therefore, the manufacturing method of the present invention can be applied to spheroidizing a metal or an alloy used as a conductive material, specifically, any metal of Cu, Ag, Au, or Al or an alloy mainly containing these metals. Particularly preferred.
Further, by performing melting, spheroidization, and solidification of the metal pieces in plasma in a reducing atmosphere, metal spheres having a lower oxygen content can be obtained.
また逆に、表面を酸化被膜で構成した金属球が必要な場合には、酸素を導入した酸化雰囲気のプラズマ炎を用いることで金属球の表面を酸化させることも可能である。 Conversely, when a metal sphere whose surface is formed of an oxide film is required, the surface of the metal sphere can be oxidized by using a plasma flame in an oxidizing atmosphere into which oxygen has been introduced.
以上に述べた金属や合金の他にも、Ｆｅ、Ｔｉ、Ｗ、Ｎｉ、Ｃｒ等の金属またはこれらを主体とする合金からなる微小金属球を製造するにおいても本発明の製造方法は有効である。これらの金属または合金からなる微小金属球は、上記のように電子機器において電極材やスペーサとして用いられる他、小型ベアリング用のボールやコンタクトプローブ用のボールとして用いられる。 In addition to the metals and alloys described above, the production method of the present invention is also effective in producing minute metal spheres made of metals such as Fe, Ti, W, Ni, and Cr, or alloys mainly containing these metals. . The minute metal spheres made of these metals or alloys are used not only as electrodes and spacers in electronic devices as described above, but also as balls for small bearings and balls for contact probes.
また本発明では、金属片は長さＬが２ｍｍ以下、切断前のワイヤ材直径φ、長さＬの比が０．１≦Ｌ／φ≦３．０であることを要件とする。
直径φに対する長さＬの割合が小さいと、切断が困難であるのみならず、金属片の表面積における切断部面積の割合が大きくなる。切断はカッタ等により行われ、この場合切断部では塑性変形を生じるが、切断部及びその周辺は形状が不均一である。そのため切断部が占める面積割合が大きいと、金属片の体積が不均一となる。よって、切断後の金属片における体積のばらつきを小さくする為、０．１≦Ｌ／φとする。
Further, in the present invention, it is required that the metal piece has a length L of 2 mm or less and a ratio of the wire diameter φ to the length L before cutting is 0.1 ≦ L / φ ≦ 3.0.
If the ratio of the length L to the diameter φ is small, not only cutting is difficult, but also the ratio of the cut area to the surface area of the metal piece increases. Cutting is performed by a cutter or the like. In this case, plastic deformation occurs at the cut portion, but the cut portion and its periphery are not uniform in shape. For this reason, if the area ratio occupied by the cut portion is large, the volume of the metal piece becomes uneven. Therefore, in order to reduce the variation in the volume of the cut metal piece, 0.1 ≦ L / φ is set.
一方、直径φに対する長さＬの割合が大きすぎると、プラズマ炎中での球状化において、溶解時に金属片が長手方向に２以上に分断しやすくなり、均一な大きさの微小金属球を得ることが困難となる。よってＬ／φ≦３．０とする。好ましくは１．０≦Ｌ／φ≦２．０である。また、長く切断され体積が大きいワイヤ材は、プラズマ炎中を自由落下する短時間では溶解が不十分となる場合があるので、切断後のワイヤの長さを２ｍｍ以下とする。好ましくは１ｍｍ以下、より好ましくは０．５ｍｍである。 On the other hand, if the ratio of the length L to the diameter φ is too large, in the spheroidization in the plasma flame, the metal piece tends to be divided into two or more in the longitudinal direction at the time of melting, and a fine metal sphere of uniform size is obtained. It becomes difficult. Therefore, L / φ ≦ 3.0. Preferably, 1.0 ≦ L / φ ≦ 2.0. In addition, a wire material that is cut long and has a large volume may be insufficiently melted in a short time in which the wire material falls freely in the plasma flame. Therefore, the length of the cut wire is set to 2 mm or less. Preferably it is 1 mm or less, more preferably 0.5 mm.
本発明の製造方法では、金属片の平均体積は５×１０−４ｃｍ３以下であることが好ましい。既に述べたように本発明の特徴は、プラズマ炎を用いることにより金属片を短時間で溶解、球状化、凝固することである。金属片の寸法が微小なほどこのプロセスを短時間で行うことが可能となり好ましい。具体的には金属片の平均体積は５×１０−４ｃｍ３以下であることが好ましい。 In the production method of the present invention, the average volume of the metal pieces is preferably 5 × 10 −4 cm 3 or less. As described above, a feature of the present invention is that a metal piece is melted, spheroidized, and solidified in a short time by using a plasma flame. The smaller the size of the metal piece, the more preferably this process can be performed in a shorter time, which is preferable. Specifically, the average volume of the metal pieces is preferably 5 × 10 −4 cm 3 or less.
本発明では、金属片は体積のＣＶ値が５％以下であることが好ましい。
本発明で用いるＣＶ値とは、金属片の体積の均一さを表す値であり、金属片の平均体積Ｖａｖｅ及び、金属片の体積分布の標準偏差σＶから下記の式で算出される値である。
ＣＶ値＝σＶ／Ｖａｖｅ×１００ （％）
In the present invention, the metal piece preferably has a volume CV value of 5% or less.
The CV value used in the present invention is a value representing the uniformity of the volume of a metal piece, and is a value calculated by the following equation from the average volume V ave of the metal piece and the standard deviation σ V of the volume distribution of the metal piece. It is.
CV value = σ V / V ave × 100 (%)
先に述べたように、本発明の金属球の製造方法では、溶解から凝固の過程では、溶解から凝固が単一の金属片で行われたものでは、殆ど体積の変動を生じない。言いかえると、溶解から凝固の過程が単一の金属片で行われず、体積や形状が大きく異なる金属球を分級により取り除いた後の金属球のばらつきは、プラズマ炎中に導入する前の金属片のばらつきに依存する。
よって、本発明において直径の揃った金属球を得るには、体積の揃った金属片を用いることが好ましい。
As described above, in the method for manufacturing metal spheres according to the present invention, in the process from melting to solidification, if the melting and solidifying are performed with a single metal piece, there is almost no change in volume. In other words, the process from melting to solidification does not take place in a single piece of metal, and the variation in metal spheres after classification and removal of metal spheres that differ greatly in volume and shape is due to the metal flakes before being introduced into the plasma flame. Depends on the variation of
Therefore, in order to obtain a metal sphere having a uniform diameter in the present invention, it is preferable to use a metal piece having a uniform volume.
金属片の体積の均一さを表す値であるＣＶ値が５％以下の金属片を用いることで、より直径の揃った金属球を得ることができ、加えて金属球の表面における微粉末の付着を低減し、表面の清浄化を達成することができる。ＣＶ値が１％以下の金属片を用いることがより好ましい。さらに好ましくは０．５％以下である。 By using a metal piece having a CV value of 5% or less, which is a value representing the uniformity of the volume of the metal piece, a metal sphere having a more uniform diameter can be obtained, and in addition, adhesion of fine powder on the surface of the metal sphere , And surface cleaning can be achieved. It is more preferable to use a metal piece having a CV value of 1% or less. More preferably, it is 0.5% or less.
以上に述べたように、本発明の製造方法によれば、融点が高い為、従来、球状化が困難であった高融点の金属片を、表面の酸化や汚染を抑制した状態で効率的に球状化することが可能となる。従って、本発明の製造方法によれば、様々な材質の微小金属球を得ることができる。 As described above, according to the production method of the present invention, since the melting point is high, conventionally, a high melting point metal piece, which has been difficult to spheroidize, is efficiently treated in a state in which oxidation and contamination of the surface are suppressed. It becomes possible to make it spherical. Therefore, according to the manufacturing method of the present invention, fine metal spheres of various materials can be obtained.
本発明の金属球の製造方法は例えば図１に一例を示す装置により実施することができる。
図１において、水冷管１０により冷却されているＲＦプラズマトーチ８は、プラズマ動作ガス供給装置１１によりプラズマ動作ガス供給位置６から供給されるプラズマ動作ガスと、コイル７から発生する高周波エネルギによりプラズマ炎３を発生する。
原料供給装置１（例えば電磁振動原料供給装置）に投入された所定の寸法に切断された金属片は、キャリアガスと共に原料供給位置２よりプラズマ炎３内部の高温部（５０００〜１００００℃）に投入される。プラズマ炎中に投入された原料は瞬時に溶融し、表面張力により球状となる。
The method for producing metal spheres of the present invention can be carried out, for example, by an apparatus whose example is shown in FIG.
In FIG. 1, an RF plasma torch 8 cooled by a water cooling tube 10 forms a plasma flame by a plasma operation gas supplied from a plasma operation gas supply position 6 by a plasma operation gas supply device 11 and a high frequency energy generated from a coil 7. Generates 3.
The metal piece cut into a predetermined size and supplied to the raw material supply device 1 (for example, an electromagnetic vibration raw material supply device) is supplied to the high temperature part (5000 to 10000 ° C.) inside the plasma flame 3 from the raw material supply position 2 together with the carrier gas. Is done. The raw material charged into the plasma flame instantly melts and becomes spherical due to surface tension.
プラズマ炎の上流側に位置する原料供給位置２から供給された原料は、十分に加熱、溶融された状態で水素ガスを含有する精錬効果の高いプラズマ部分を通過し、酸化物などの不純物が低減される。
プラズマ炎内で処理された金属片はチャンバ４中を落下しながら不活性ガス雰囲気中で凝固し、微小金属球９として下部の微小金属球回収部５に集められ、回収される。
以上のようにして、表面酸化、汚染が少なく、粒径の揃った微小金属球を効率的に製造することができる。
The raw material supplied from the raw material supply position 2, which is located on the upstream side of the plasma flame, passes through a high-refining plasma portion containing hydrogen gas in a sufficiently heated and molten state, thereby reducing impurities such as oxides. Is done.
The metal pieces treated in the plasma flame are solidified in an inert gas atmosphere while falling in the chamber 4, collected as fine metal spheres 9 in the lower small metal sphere collection unit 5, and collected.
As described above, it is possible to efficiently produce fine metal spheres having a small particle diameter and uniform surface oxidation.
本発明に適用することができる、プラズマ炎には代表的なものとしてＤＣプラズマ、ＲＦプラズマがあるが、本発明にはＲＦプラズマを用いることが好ましい。ＲＦプラズマは、ＤＣプラズマと異なり、電極が不要で、電極材料等に起因する不純物の混入の少ない為である。加えて、ＲＦプラズマでは、ＤＣプラズマと比べて、プラズマ動作ガスのガス流速を低く出来る為、プラズマ炎中での金属片の滞留時間を長くすることで、十分に金属片を加熱することが可能である。 Although DC plasma and RF plasma are typical examples of the plasma flame that can be applied to the present invention, it is preferable to use RF plasma in the present invention. RF plasma is different from DC plasma in that an electrode is not required and impurities are less mixed due to an electrode material and the like. In addition, the RF plasma can lower the gas flow rate of the plasma operating gas compared to the DC plasma, so that the metal piece can be heated sufficiently by extending the residence time of the metal piece in the plasma flame. It is.
また、プラズマ炎を発生する為のプラズマ動作ガスには、一般にプラズマ動作ガスとして用いられているアルゴンガス、窒素ガス等を用いることができるが、これに水素ガスを含有させることが好ましい。
本発明では金属片をプラズマ炎中に導入することで微小金属球表面での酸素濃度を低減することができるが、さらに、プラズマ動作ガス中に水素を導入すれば、水素イオン、励起原子などの還元反応により酸素濃度を一層低下することが可能となる。プラズマ動作ガス中に水素ガスを含有させる場合、十分な効果を得る為にはプラズマ動作ガス中の水素ガスの濃度を１ｖｏｌ％以上とすることが好ましい。より好ましくは３ｖｏｌ％以上である。なお、水素ガスの濃度が高くすることで、より酸素濃度を低減することが出来るが、一方、水素ガスを過度に含有させるとプラズマ炎が不安定となり、金属片の球状化を達成できなくなる場合がある。よって水素ガスは２０ｖｏｌ％以下で含有することが好ましい。
In addition, as a plasma operating gas for generating a plasma flame, an argon gas, a nitrogen gas, or the like, which is generally used as a plasma operating gas, can be used, and it is preferable to include a hydrogen gas in the gas.
In the present invention, the oxygen concentration on the surface of the minute metal sphere can be reduced by introducing a metal piece into the plasma flame, but if hydrogen is further introduced into the plasma working gas, hydrogen ions, excited atoms, etc. Oxygen concentration can be further reduced by the reduction reaction. When a hydrogen gas is contained in the plasma operating gas, it is preferable that the concentration of the hydrogen gas in the plasma operating gas be 1 vol% or more in order to obtain a sufficient effect. More preferably, it is 3 vol% or more. In addition, the oxygen concentration can be further reduced by increasing the concentration of hydrogen gas. There is. Therefore, it is preferable to contain hydrogen gas at 20 vol% or less.
図１に記載のＲＦプラズマ装置を用いて、質量％でＡｇを７１％含有し、残部実質的にＣｕである金属片を用い、目標直径が３００．０μｍの微小金属球を以下に示す製造条件で作製した。プラズマ炎に導入するＡｇ−Ｃｕ合金（金属片）は直径０．２ｍｍのワイヤを回転刃により、一定寸法に切断して作製した。金属片のＣＶ値は、約６０ｐｃｓの金属片を用い、各金属片の側面（軸に水平な面）を写した画像から金属片の長さ、及び直径を測定し、その測定値より算出する値である。また、金属球のＣＶ値は、約６０ｐｃｓの微小金属球を用い、微小金属球を写した画像の任意の位置において直径を測定し、その測定値より算出する値である。 Using the RF plasma apparatus shown in FIG. 1, the following production conditions were used: a metal piece containing 71% by mass of Ag and substantially the remainder Cu was used to produce a small metal sphere having a target diameter of 300.0 μm. It was produced in. The Ag-Cu alloy (metal piece) to be introduced into the plasma flame was prepared by cutting a wire having a diameter of 0.2 mm into a predetermined size with a rotary blade. The CV value of the metal piece is calculated from the measured value by measuring the length and diameter of the metal piece from an image of a side surface (plane parallel to the axis) of each metal piece using a metal piece of about 60 pcs. Value. The CV value of the metal sphere is a value obtained by measuring the diameter of a metal sphere at an arbitrary position in an image of the metal sphere using a small metal sphere of about 60 pcs and calculating the measured value.
（製造条件）
金属片寸法：φ０．２ｍｍ×Ｌ０．４５０ｍｍ（体積１．４×１０−５ｃｍ３、Ｌ／φ＝２．２５）
金属片のＣＶ値：０．４７％
プラズマ動作ガス：Ａｒ ３０Ｌ／ｍｉｎ、Ｈ２ １Ｌ／ｍｉｎ、混合ガス
プラズマトーチ：水冷式石英管φ５０ｍｍ、高周波誘導コイルφ７０ｍｍ
チャンバ：最大内径φ８００ｍｍ、最大内高１５００
チャンバ内雰囲気：Ａｒガス雰囲気
原料供給装置：電磁フィーダー
高周波誘導コイル入力条件：４ＭＨｚ、１０ｋＷ
(Manufacturing conditions)
Metal piece dimensions: φ0.2 mm × L0.450 mm (volume 1.4 × 10 −5 cm 3 , L / φ = 2.25)
CV value of metal piece: 0.47%
Plasma operating gas: Ar 30 L / min, H 2 1 L / min, mixed gas plasma torch: water-cooled quartz tube φ50 mm, high frequency induction coil φ70 mm
Chamber: maximum inner diameter 800 mm, maximum inner height 1500
Chamber atmosphere: Ar gas atmosphere Raw material supply device: Electromagnetic feeder High frequency induction coil Input condition: 4 MHz, 10 kW
上述の製造条件により得られた金属球について、粒径が大きく異なる金属球を取り除く為のふるい分級、及び二以上の金属球が連なったものを取り除く転がし分級（傾斜させた平板上で金属球を転がし、直進しないものを取り除く分級方法）を行ない、プラズマ炎に導入した金属片の重量に対して、約３０％の重量の金属球を回収した。分級後の金属球から無作為に１００球を抽出し、平均直径、平均真円度を測定した。これらは抽出した微小金属球のＳＥＭ像について画像分析を行ない、投影面積を円と仮定した場合の直径（円相当径）から平均直径を、真球度＝円相当径／最大径から平均真円度を算出して求めた。また円相当径から、金属球の体積を算出して、金属球について体積のＣＶ値を求めた。加えてＩＣＰ法により金属球中の酸素含有量の分析を行った。結果を表１に示す。 For the metal spheres obtained under the above manufacturing conditions, sieve classification for removing metal spheres having significantly different particle diameters, and rolling classification for removing a series of two or more metal spheres (metal spheres on an inclined flat plate) (A classification method of removing rolling and non-moving objects) to collect metal balls of about 30% of the weight of the metal pieces introduced into the plasma flame. 100 balls were randomly extracted from the metal balls after classification, and the average diameter and average roundness were measured. These are subjected to image analysis on the SEM image of the extracted minute metal sphere, and the average diameter is calculated from the diameter (circle equivalent diameter) when the projected area is assumed to be a circle, and the average perfect circle is calculated from sphericity = equivalent circle diameter / maximum diameter. The degree was calculated and determined. Further, the volume of the metal sphere was calculated from the equivalent circle diameter, and the CV value of the volume was obtained for the metal sphere. In addition, the oxygen content in the metal sphere was analyzed by the ICP method. Table 1 shows the results.
表１に示すように、目標とする直径で、真球度の高い金属球を製造することができている。また、金属球のＣＶ値は０．４７となり、プラズマ炎中に導入した金属片のＣＶ値と同じ値となっている。加えて、酸素含有量も装置の検出限界である１ｐｐｍ以下と非常に低い値を達成することが出来ている。 As shown in Table 1, a metal sphere having a high sphericity with a target diameter can be manufactured. The CV value of the metal ball is 0.47, which is the same value as the CV value of the metal piece introduced into the plasma flame. In addition, the oxygen content can achieve a very low value of 1 ppm or less, which is the detection limit of the device.
上記の本発明の製造方法でははんだ合金等の低融点金属と比べて高融点の金属を球状化することが可能である。これにより得られる微小金属球は、例えばプリント基板と電子部品等を接合するにおいて、両者を電気的に接続すると共に、間隔を任意の寸法に固定する導電性スペーサ金属球として用いることができる。 In the manufacturing method of the present invention described above, it is possible to make a metal having a higher melting point than a low melting point metal such as a solder alloy into a sphere. For example, in joining a printed circuit board and an electronic component or the like, the obtained minute metal sphere can be used as a conductive spacer metal sphere that electrically connects the two and fixes the interval to an arbitrary size.
また、ＢＧＡ接続においても通常のはんだボールによる接続よりも融点が高いため、ＢＧＡ基板の周辺部に微小金属球を設置し、これらをＥＢ等であらかじめ溶融して接着しておけば、はんだボールを溶融するＢＧＡ基板のリフロー時にはんだと比べて融点が高いため溶融せず、結果として、潰れてしまうのを防ぐ機能を付加することができる。したがって、リフローによるＢＧＡ接続の信頼性の向上が得られる。
本発明の製造方法により得られる微小金属球は必要に応じ、表面にはんだなどの低融点の金属を被覆したり、Ａｕめっきを施すなどして用いることもできる。
Also, since the melting point of BGA connection is higher than that of normal solder ball connection, a small metal ball is placed around the BGA substrate and these balls are melted and bonded in advance using EB or the like, so that the solder ball can be bonded. Since the melting point of the BGA substrate to be melted is higher than that of the solder at the time of reflow, the BGA substrate is not melted, and as a result, a function of preventing collapse can be added. Therefore, the reliability of the BGA connection is improved by the reflow.
The fine metal spheres obtained by the production method of the present invention can be used by coating the surface with a metal having a low melting point such as solder, or by applying Au plating, if necessary.
図１に記載のＲＦプラズマ装置を用いて、実質的にＣｕ（不可避的不純物含む）からなる金属片を用い、目標直径が３００．０μｍの金属球を以下に示す製造条件で作製した。この際、金属片のＣＶ値が異なる２条件で製造を行った。なお、金属片の作製、及びＣＶ値の測定は実施例１と同様にして行った。 Using the RF plasma apparatus shown in FIG. 1, a metal sphere having a target diameter of 300.0 μm was produced under the following manufacturing conditions using a metal piece substantially made of Cu (including unavoidable impurities). At this time, the production was performed under two conditions where the CV values of the metal pieces were different. The production of the metal pieces and the measurement of the CV value were performed in the same manner as in Example 1.
（製造条件）
金属片寸法：φ０．２ｍｍ×Ｌ０．４５０ｍｍ（体積１．４×１０−５ｃｍ３、Ｌ／φ＝２．２５）
プラズマ動作ガス：Ａｒ ３０Ｌ／ｍｉｎ
プラズマトーチ：水冷式石英管φ５０ｍｍ、高周波誘導コイルφ７０ｍｍ
チャンバ：最大内径φ８００ｍｍ、最大内高１５００
チャンバ内雰囲気：Ａｒガス雰囲気
原料供給装置：電磁フィーダー
高周波誘導コイル入力条件：４ＭＨｚ、１２ｋＷ
(Manufacturing conditions)
Metal piece dimensions: φ0.2 mm × L0.450 mm (volume 1.4 × 10 −5 cm 3 , L / φ = 2.25)
Plasma operating gas: Ar 30 L / min
Plasma torch: water-cooled quartz tube φ50mm, high frequency induction coil φ70mm
Chamber: maximum inner diameter 800 mm, maximum inner height 1500
Chamber atmosphere: Ar gas atmosphere Raw material supply device: Electromagnetic feeder High frequency induction coil Input conditions: 4 MHz, 12 kW
上述の製造条件により得られた金属球について実施例１と同様の分級を行ない、プラズマ炎に導入した金属片の重量に対して、約４０％の重量の金属球を回収した。分級後の金属球から無作為に約６０球を抽出し、実施例１と同様の方法により金属球の平均粒径、金属球のＣＶ値、酸素含有量の測定を行った。結果を表２に示す。 The same classification as in Example 1 was performed on the metal spheres obtained under the above manufacturing conditions, and a metal sphere having a weight of about 40% with respect to the weight of the metal pieces introduced into the plasma flame was recovered. About 60 balls were randomly extracted from the metal balls after classification, and the average particle diameter of the metal balls, the CV value of the metal balls, and the oxygen content were measured in the same manner as in Example 1. Table 2 shows the results.
表２に示すように、プラズマ炎中に導入した金属片のＣＶ値と、分級後の金属球のＣＶ値は一致している。よって、金属片のばらつきを小さくすることにより、分級後の金属球における直径のばらつきを小さくすることが可能である。 As shown in Table 2, the CV value of the metal piece introduced into the plasma flame coincides with the CV value of the metal ball after classification. Therefore, by reducing the variation of the metal pieces, it is possible to reduce the variation of the diameter of the metal sphere after classification.
図１に記載のＲＦプラズマ装置を用いて、実質的にオーステナイト系ステンレス（Ｆｅ−１９．４５Ｃｒ−９．７７Ｎｉ−０．１Ｃ（ｍａｓｓ％）、ＪＩＳ ＳＵＳ３０４）からなる金属片を用い、目標直径が１００．０μｍの金属球を以下に示す製造条件で作製した。なお、金属片の作製、及びＣＶ値の測定は実施例１と同様にして行った。なお、金属片の組成の測定はＬＥＣＯ法により実施した。 Using the RF plasma apparatus shown in FIG. 1, a metal piece substantially made of austenitic stainless steel (Fe-19.45Cr-9.77Ni-0.1C (mass%), JIS SUS304) and having a target diameter of A metal sphere of 100.0 μm was produced under the following production conditions. The production of the metal pieces and the measurement of the CV value were performed in the same manner as in Example 1. The composition of the metal piece was measured by the LECO method.
（製造条件）
金属片寸法：φ０．２ｍｍ×Ｌ０．１３５ｍｍ（体積４．１×１０−６ｃｍ３、Ｌ／φ＝０．６７５）
金属片のＣＶ値：１．５７％
プラズマ動作ガス：Ａｒ ３０Ｌ／ｍｉｎ
プラズマトーチ：水冷式石英管φ５０ｍｍ、高周波誘導コイルφ７０ｍｍ
チャンバ：最大内径φ８００ｍｍ、最大内高１５００
チャンバ内雰囲気：Ａｒガス雰囲気
原料供給装置：電磁フィーダー
高周波誘導コイル入力条件：４ＭＨｚ、１０ｋＷ
(Manufacturing conditions)
Metal piece dimensions: φ0.2mm × L0.135mm (volume 4.1 × 10 −6 cm 3 , L / φ = 0.675)
CV value of metal piece: 1.57%
Plasma operating gas: Ar 30 L / min
Plasma torch: water-cooled quartz tube φ50mm, high frequency induction coil φ70mm
Chamber: maximum inner diameter 800 mm, maximum inner height 1500
Chamber atmosphere: Ar gas atmosphere Raw material supply device: Electromagnetic feeder High frequency induction coil Input condition: 4 MHz, 10 kW
上述の製造条件により得られた金属球について実施例１と同様の分級を行ない、プラズマ炎に導入した金属片の重量に対して、約９８％の重量の金属球を回収した。分級後の金属球から無作為に約６０球を抽出し、実施例１と同様の方法により金属球の平均粒径、金属球のＣＶ値の測定を行った。結果を表３に示す。 The same classification as in Example 1 was performed on the metal spheres obtained under the above manufacturing conditions, and about 98% of the metal spheres were recovered with respect to the weight of the metal pieces introduced into the plasma flame. About 60 balls were randomly extracted from the metal balls after classification, and the average particle diameter of the metal balls and the CV value of the metal balls were measured in the same manner as in Example 1. Table 3 shows the results.
表３に示すように、目標とする直径で、真球度の高い金属球を製造することができている。また、金属球のＣＶ値は１．５８％となり、プラズマ炎中に導入した金属片のＣＶ値と同じ値となっている。加えて、金属球の組成分析の結果、金属片と同じ組成の変動が無いことが確認された。 As shown in Table 3, a metal sphere having a high sphericity with a target diameter can be manufactured. Further, the CV value of the metal sphere is 1.58%, which is the same value as the CV value of the metal piece introduced into the plasma flame. In addition, as a result of the composition analysis of the metal sphere, it was confirmed that there was no change in the same composition as the metal piece.
図１に記載のＲＦプラズマ装置を用いて、実質的にＡｌ（不可避的不純物含む）からなりＣＶ値が０．７０％の金属片を用い、目標直径が３００．０μｍの金属球を以下に示す製造条件で作製した。なお、金属片の作製、及びＣＶ値の測定は実施例１と同様にして行った。 Using the RF plasma apparatus shown in FIG. 1, a metal sphere having a target diameter of 300.0 μm using a metal piece substantially made of Al (including unavoidable impurities) and having a CV value of 0.70% is shown below. It was manufactured under the manufacturing conditions. The production of the metal pieces and the measurement of the CV value were performed in the same manner as in Example 1.
（製造条件）
金属片寸法：φ０．３ｍｍ×Ｌ０．２００ｍｍ（体積１．４×１０−５ｃｍ３、Ｌ／φ＝０．６６７）
プラズマ動作ガス：Ａｒ ３０Ｌ／ｍｉｎ
プラズマトーチ：水冷式石英管φ５０ｍｍ、高周波誘導コイルφ７０ｍｍ
チャンバ：最大内径φ８００ｍｍ、最大内高１５００ｍｍ
チャンバ内雰囲気：Ａｒガス雰囲気
原料供給装置：電磁フィーダー
高周波誘導コイル入力条件：４ＭＨｚ、１９ｋＷ
(Manufacturing conditions)
Metal piece dimensions: φ0.3 mm × L0.200 mm (volume 1.4 × 10 −5 cm 3 , L / φ = 0.667)
Plasma operating gas: Ar 30 L / min
Plasma torch: water-cooled quartz tube φ50mm, high frequency induction coil φ70mm
Chamber: maximum inner diameter φ800mm, maximum inner height 1500mm
Chamber atmosphere: Ar gas atmosphere Raw material supply device: Electromagnetic feeder high frequency induction coil Input conditions: 4 MHz, 19 kW
上述の製造条件により得られた金属球について実施例１と同様の分級を行ない、プラズマ炎に導入した金属片の重量に対して、約９７％の重量の金属球を回収した。分級後の金属球から無作為に約６０球を抽出し、実施例１と同様の方法により金属球の平均粒径、金属球のＣＶ値の測定を行った。結果を表４に示す。また、得られた金属球の表面を示す走査電子顕微鏡像を図２に、金属球の断面を示す走査電子顕微鏡像を図３に示す。 The same classification as in Example 1 was performed on the metal spheres obtained under the above manufacturing conditions, and about 97% by weight of the metal spheres with respect to the weight of the metal pieces introduced into the plasma flame was recovered. About 60 balls were randomly extracted from the metal balls after classification, and the average particle diameter of the metal balls and the CV value of the metal balls were measured in the same manner as in Example 1. Table 4 shows the results. FIG. 2 shows a scanning electron microscope image showing the surface of the obtained metal sphere, and FIG. 3 shows a scanning electron microscope image showing a cross section of the metal sphere.
表４、図２に示すように真円度の高い金属球が得られている。また、プラズマ炎中に導入した金属片のＣＶ値と、分級後の金属球のＣＶ値は一致している。よって、金属片のばらつきを小さくすることにより、分級後の金属球における直径のばらつきを小さくすることが可能である。
また図３に示すように、本発明の製造方法によれば内部に空隙の無い金属球を得ることができている。従って、実施例１で述べるたように金属球を溶融して用いる場合でも、溶融前後で体積の変動を生じることが無く、非接合体同士の高さを正確に制御することを要するＢＧＡ接続の用途にも好適である。
As shown in Table 4 and FIG. 2, metal spheres having high roundness were obtained. In addition, the CV value of the metal piece introduced into the plasma flame and the CV value of the metal ball after classification match. Therefore, by reducing the variation of the metal pieces, it is possible to reduce the variation of the diameter of the metal sphere after classification.
Further, as shown in FIG. 3, according to the manufacturing method of the present invention, a metal sphere having no void therein can be obtained. Therefore, even when the metal sphere is melted and used as described in Embodiment 1, the volume of the metal ball does not fluctuate before and after the melting, and the height of the BGA connection that requires accurate control of the height of the non-joined bodies is required. It is also suitable for use.
１．原料供給装置、２．原料供給位置、３．プラズマ炎、４．チャンバ、５．微小金属球回収部、６．プラズマ動作ガス供給位置、７．コイル、８．ＲＦプラズマトーチ、９．微小金属球、１０．水冷管、１１．プラズマ動作ガス供給装置 1. Raw material supply device, 2. 2. Raw material supply position; 3. plasma flame; 4. chamber; 5. collection unit for minute metal spheres; 6. Plasma operation gas supply position; Coil, 8. 8. RF plasma torch, 10. micro metal sphere; 10. water-cooled tube; Plasma operating gas supply device
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