JP2004200253A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
JP2004200253A
JP2004200253A JP2002364516A JP2002364516A JP2004200253A JP 2004200253 A JP2004200253 A JP 2004200253A JP 2002364516 A JP2002364516 A JP 2002364516A JP 2002364516 A JP2002364516 A JP 2002364516A JP 2004200253 A JP2004200253 A JP 2004200253A
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Japan
Prior art keywords
metal plate
light emitting
insulating base
base material
emitting device
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JP2002364516A
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Japanese (ja)
Inventor
Kazutaka Hori
和宇 堀
Naoji Yokota
直司 横田
Hiroshi Aoki
博司 青木
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Publication date
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Priority to JP2002364516A priority Critical patent/JP2004200253A/en
Publication of JP2004200253A publication Critical patent/JP2004200253A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Abstract

<P>PROBLEM TO BE SOLVED: To reduce warpage being generated by the junction between a metal plate and an insulating base material in a light-emitting device using a light emitting diode element. <P>SOLUTION: The light-emitting device 100 comprises a metal plate 1, an insulating base material 2 joined to the metal plate 1, and the light-emitting diode element 3 mounted to the metal plate 1. The insulating base material 2 is in a shape where an aspect ratio differs, and a plurality of light-emitting diode elements 3 are arranged along the longitudinal direction of the insulating base material 2. The metal plate 1 is divided into three metal plates 11, 12, 13, and the metal plates 11, 12, 13 are joined to the insulating base material 2 while being aligned in the longitudinal direction of the insulating base material 2. Warpage being generated in the junction between the metal plate 1 and the insulating base material 2 becomes partial at the junction between respective metal plates 11, 12, 13 and the insulating base material 2, and warpage at the junction section between respective metal plates 11, 12, 13, and the insulating base material 2 also becomes small. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード素子を用いた発光装置に関するものである。
【０００２】
【従来の技術】
従来より、発光ダイオード素子の放熱性を高めるため、金属板上に発光ダイオード素子を実装し、その金属板上に導体パターンを有する絶縁基材を貼り合せて、発光ダイオード素子と導体パターンとをワイヤボンディングした構成の発光装置が提案されている（特願２００１−２５８６８０号参照）。
【０００３】
この発光装置の構成を図９に示す。発光装置９０は、アルミ製の金属板１と、一方の面が金属板１に接合材（不図示）を用いて接合されたガラスエポキシ製の絶縁基材２と、絶縁基材２の他方の面に形成された導体パターン６と、金属板１に搭載されて熱的に結合され、導体パターン６にボンディングワイヤ７を介して接続された発光ダイオード素子３と、発光ダイオード素子３を封止する封止樹脂９と、封止樹脂９の周囲を囲む封止樹脂枠１０とを備えている。金属板１と絶縁基材２とを接合する接合材には、一般に作業時間短縮のため熱硬化性の接着剤を使用している。この発光装置９０では、発光ダイオード素子３が金属板１に直接実装されて金属板１と熱的に結合されているため、発光ダイオード素子３の放熱性が高められる。
【０００４】
また、この発光装置９０は、図１０に示すように、細長い形状の金属板１と絶縁基材２を接合し、その長手方向に複数の発光ダイオード素子３を配列した構成のものも提案されている。なお、図１０では、導体パターン及びボンディングワイヤを図示省略している。
【０００５】
また、発光ダイオード素子を用いた光源装置に関し、絶縁部材に銅のような導電性材料から成る互いに電気的に絶縁された複数の金属板を接合し、各金属板に発光ダイオード素子を１個ずつ、発光ダイオード素子の一方の電極を配線パターンに接触させると共に他方の電極を金属板に接触させるようにフェースダウン実装したものが知られている（例えば、特許文献１参照）。この光源装置は、金属板を発光ダイオード素子への給電部の一部として利用し、配線パターンと金属板との間に電源を接続して発光ダイオード素子に給電することにより配線パターンの簡略化を図るものであり、複数の発光ダイオード素子を直列接続するために金属板を互いに電気的に絶縁した複数の領域に分割したものである。
【０００６】
【特許文献１】
特開２００２−９４１２２号公報
（図１０、段落００８４〜段落００８６）
【０００７】
【発明が解決しようとする課題】
ところで、アルミの熱膨張率はガラスエポキシ樹脂の熱膨張率よりも大きい。従って、アルミ製の金属板１とガラスエポキシ製の絶縁基材２とを熱硬化性の接着剤を塗布して貼り合わせ、加熱して接着剤を硬化させて両者を接合した後に常温に戻すと、金属板１と絶縁基材２とが接合された状態で金属板１の方が絶縁基材２よりも大きく縮んでしまう。
【０００８】
このため、上述した従来の絶縁基材２の長手方向に複数の発光ダイオード素子３を配列した発光装置９０では、金属板１と絶縁基材２とを加熱して接合した後に常温に戻すと、図１１に示すように、長手方向に沿って反りを生じるという問題がある。なお、上述の特許文献１に記載の光源装置は、金属板を発光ダイオード素子への給電部の一部として利用するために金属板を銅のような導電性材料とし、また、複数の発光ダイオード素子を直列接続するために金属板を互いに電気的に絶縁した複数の領域に分割したものである。すなわち、特許文献１に記載の光源装置は、金属板と絶縁部材の接合により生じる反りを防止するために金属板を複数の領域に分割したものではなく、また、特許文献１には、金属板を絶縁部材の長手方向に分割することについての記載がない。従って、この特許文献１に記載の内容を適用したとしても、上述の課題を解決することはできない。
【０００９】
本発明は、上記課題を解決するためになされたものであり、金属板と絶縁基材との接合により生じる反りを軽減できる発光装置を提供することを目的とする。
【００１０】
【課題を解決するための手段】
上記目的を達成するために請求項１の発明は、金属板と、一方の面が金属板に重ねた形で金属板に接合材を用いて接合された絶縁基材と、絶縁基材の他方の面に形成された導体パターンと、金属板に搭載されて熱的に結合され、導体パターンに接続された発光ダイオード素子と、を備えた発光装置であって、絶縁基材は、縦横比が異なる形状を有しており、発光ダイオード素子は、複数のものが絶縁基材の長手方向に沿って金属板に搭載されており、金属板は、複数に分割されており、分割された金属板の並び方向が絶縁基材の長手方向であるものである。
【００１１】
この構成においては、発光ダイオード素子は金属板に搭載されて金属板と熱的に結合されているため、発光ダイオード素子で発生した熱は、速やかに金属板に熱伝導され金属板から放熱される。また、分割された複数の金属板を絶縁基材の長手方向に並んで絶縁基材に接合することで、各金属板は、互いに分離され、しかも、絶縁基材の長手方向に対する長さが短くなる。これにより、金属板と絶縁基材とを接合したときに生じる反りは、各金属板と絶縁基材との接合箇所での部分的なものとなり、しかも各接合箇所での反りも小さくなる。その結果、分割された複数の金属板の並び方向である絶縁基材の長手方向に沿った発光装置全体としての反りが軽減される。
【００１２】
請求項２の発明は、請求項１に記載の発光装置において、金属板の分割部分の形状は、傾きの異なる複数の直線から成るものである。この構成においては、金属板の分割部分の形状を傾きの異なる複数の直線とすることで、隣り合う金属板は、その一部が絶縁基材の長手方向に垂直な方向に互いに重なり合うことになる。これにより、絶縁基材の長手方向と垂直な方向に見て、金属板が絶縁基材に接合されていない箇所がなくなり、金属板が絶縁基材の長手方向に沿った撓みに対する補強材の役割を果たす。
【００１３】
請求項３の発明は、請求項１に記載の発光装置において、金属板の分割部分の形状は、曲線から成るものである。この構成においては、金属板の分割部分の形状を曲線とすることで、隣り合う金属板は、その一部が絶縁基材の長手方向に互いに重なり合うことになる。これにより、請求項２の発明と同様の作用が得られる。
【００１４】
請求項４の発明は、請求項１に記載の発光装置において、金属板の分割部分の形状は、曲線と直線から成るものである。この構成においては、金属板の分割部分の形状を曲線と直線から構成することで、隣り合う金属板は、その一部が絶縁基材の長手方向に互いに重なり合うことになる。これにより、請求項２の発明と同様の作用が得られる。
【００１５】
請求項５の発明は、請求項１に記載の発光装置において、金属板の分割部分の形状は、絶縁基材の長手方向に対して斜めに傾いた直線から成るものである。この構成においては、金属板の分割部分の形状を絶縁基材の長手方向に対して斜めに傾いた直線とすることで、隣り合う金属板は、その一部が絶縁基材の長手方向に互いに重なり合うことになる。これにより、請求項２の発明と同様の作用が得られる。
【００１６】
請求項６の発明は、１枚の絶縁基材シート上に、請求項１乃至請求項５のいずれかに記載の発光装置の複数個が、各発光装置における分割された金属板の並び方向が互いに異なる方向になるように配置されているものである。この構成においては、金属板と絶縁基材シートとの接合時の反りを生じさせる応力は、複数の発光装置の金属板を各発光装置における金属板の並び方向を同じ方向にして１枚の絶縁基材シートに接合した場合よりも小さくなる。従って、１枚の絶縁基材シート上に形成される各発光装置の反りが軽減される。
【００１７】
【発明の実施の形態】
以下、本発明を具体化した実施形態について図面を参照して説明する。
＜第１の実施形態＞
本発明の第１の実施形態について、図１及び図２を参照して説明する。発光装置１００は、アルミ製の金属板１とガラスエポキシ製の絶縁基材２とが接合されて構成されている。絶縁基材２は、縦横比が異なる細長い形状をしており、その長手方向（図中、Ｘ方向）に並んで複数の発光ダイオード素子３が配列されている。
【００１８】
金属板１は、３つの金属板１１，１２，１３に分割されており、これらの金属板１１，１２，１３は、絶縁基材２の長手方向に並んで絶縁基材２の裏面に重ねた形で接合されている。分割部分Ｌの形状は、絶縁基材２の長手方向に垂直な方向（図中、Ｙ方向）に沿った直線状となっている。また、各金属板１１，１２，１３は、各々前方に突出した２つの突出部１ａを有しており、これらの突出部１ａは、絶縁基材２の長手方向に並んで設けられた複数の納入孔２ａに各々挿入されている。各突出部１ａの前面には、発光ダイオードチップ３を搭載するための収納凹所１ｂが形成されている。
【００１９】
発光ダイオード素子３は、金属板１１，１２，１３の突出部１ａに形成された各収納凹所１ｂの底面に直接実装されており、これにより、複数の発光ダイオード素子３が絶縁基材２の長手方向に並んで配列された構成となっている。また、発光ダイオード素子３は、収納凹所１ｂの底面に直接実装されているため、突出部１ａ（すなわち金属板１１，１２，１３）と熱的に結合している。
【００２０】
絶縁基材２は、表面（金属板１が接合されていない側の面）に、銅箔から成る導体パターン６（図１では図示を省略している）と封止樹脂枠１０を有している。発光ダイオード素子３と導体パターン６は、ボンディングワイヤ７により接続されている。封止樹脂９は、納入孔２ａ及び封止樹脂枠１０内に充填されており、発光ダイオード素子３とボンディングワイヤ７を封止している。この封止樹脂９は、エポキシ樹脂やシリコン樹脂等から成り、透光性を有している。
【００２１】
上記構成の発光装置１００は、以下の工程で作成される。まず、絶縁基材２に納入孔２ａを形成し、絶縁基材２の表面に導体パターン６、及び封止樹脂枠１０を形成する。一方、別工程により、突出部１ａを有し突出部１ａに収納凹所１ｂが形成された３つの金属板１１，１２，１３を形成しておく。
【００２２】
次に、金属板１１，１２，１３の突出部１ａが設けられている側の面、又は絶縁基材２の裏面（導体パターン６が形成されていない側の面）に、熱硬化性の接着剤（接合材）を塗布する。そして、金属板１１，１２，１３の突出部１ａを絶縁基材２の裏面側から納入孔２ａに挿入して、金属板１１，１２，１３と絶縁基材２とを貼り合わせ、加熱して接着剤を硬化させて金属板１１，１２，１３と絶縁基材２とを接合し、その後、常温に戻す。
【００２３】
このとき、金属板１１，１２，１３の材料であるアルミは絶縁基材２の材料であるガラスエポキシ樹脂よりも熱膨張率が大きいため、常温に戻すときに金属板１１，１２，１３の方が絶縁基材２よりも大きく縮んでしまう。その結果、接合された金属板１１，１２，１３と絶縁基材２は、常温に戻すときに反りを生じてしまう。しかし、その反りは、図３に示すように、各金属板１１，１２，１３が互いに分離しているため、各金属板１１，１２，１３と絶縁基材２との接合箇所における部分的なものとなる。しかも、その部分的な反りは、絶縁基材２の長手方向に対する各金属板１１，１２，１３の長さが短いため、小さなものとなる。その結果、接合された金属板１１，１２，１３と絶縁基材２は、全体としての反りが小さく抑えられる。
【００２４】
その後、発光ダイオード素子３を金属板１の収納凹所１ｂの底部に直接実装し、発光ダイオード素子３と導体パターン６をボンディングワイヤ７で接続する。最後に、封止樹脂９を封止樹脂枠１０及び納入孔２ａ内に流し込んで硬化させ、発光ダイオード素子３とボンディングワイヤ７を封止する。
【００２５】
上記構成の発光装置１００によれば、発光ダイオード素子３を金属板１の突出部１ａに形成された収納凹所１ｂに直接実装しているため、発光ダイオード素子３は金属板１と熱的に結合されている。これにより、発光ダイオード素子３で発生した熱は、速やかに金属板１の突出部１ａに熱伝導され、突出部１ａを通じて金属板１全体に広がり、金属板１全体から放熱される。また、金属板１は、３つの金属板１１，１２，１３に分割されて、絶縁基材２の長手方向に並んで絶縁基材２に接合されている。このため、各金属板１１，１２，１３は、互いに分離され、しかも、絶縁基材２の長手方向に対する長さが短くなる。これにより、金属板１と絶縁基材２とを接合したときに生じる反りは、部分的かつ小さなものとなり、全体としての反りが小さく抑えられる。なお、金属板１は、３つに限らず、２つ又は４つ以上に分割してもよい。
【００２６】
＜第２の実施形態＞
本発明の第２の実施形態について、図４を参照して説明する。本実施形態では、発光装置１００は、金属板１の分割部分Ｌの形状が傾きの異なる複数の直線から成っている。図示の例では、金属板１の分割部分Ｌの形状は、絶縁基材２の長手方向（図中、Ｘ方向）に沿った直線と長手方向に垂直な方向（図中、Ｙ方向）に沿った直線から成っており、隣り合う金属板１１と金属板１２、及び金属板１２と金属板１３が、絶縁基材２の長手方向と垂直な方向に互いに重なり合う部分Ｐ１、Ｐ２を有している。本実施形態における他の構成については、第１の実施形態の構成と同様である。
【００２７】
本実施形態の発光装置１００によれば、隣り合う金属板１１と金属板１２、及び金属板１２と金属板１３が絶縁基材２の長手方向に垂直な方向に互いに重なり合う部分Ｐ１、Ｐ２を有することで、絶縁基材２の長手方向と垂直な方向に見て、金属板１が絶縁基材２に接合されていない箇所がなくなる。その結果、金属板１が絶縁基材２の長手方向に沿った撓みに対する補強材の役割を果たすため、上記第１の実施形態と同様に反りが小さく抑えられることに加え、絶縁基材２の長手方向に沿った撓みに対して強くなる。
【００２８】
＜第３の実施形態＞
本発明の第３の実施形態について、図５を参照して説明する。本実施形態では、発光装置１００は、金属板１の分割部分Ｌの形状が曲線から成っている。図示の例では、金属板１の分割部分Ｌの形状は、波形状の曲線から成っており、隣り合う金属板１１と金属板１２、及び金属板１２と金属板１３が、絶縁基材２の長手方向と垂直な方向に互いに重なり合う部分Ｐ１、Ｐ２を有している。本実施形態における他の構成については、第１の実施形態の構成と同様である。
【００２９】
本実施形態の発光装置１００によれば、第１の実施形態と同様に反りが小さく抑えられることに加え、第２の実施形態と同様に絶縁基材２の長手方向に沿った撓みに対して強くなる。
【００３０】
＜第４の実施形態＞
本発明の第４の実施形態について、図６を参照して説明する。本実施形態では、発光装置１００は、金属板１の分割部分Ｌの形状が曲線と直線から成っている。図示の例では、金属板１の分割部分Ｌの形状は、半円形状の曲線と絶縁基材２の長手方向に垂直な方向（図中、Ｙ方向）に沿った直線から成っており、隣り合う金属板１１と金属板１２、及び金属板１２と金属板１３が、絶縁基材２の長手方向と垂直な方向に互いに重なり合う部分Ｐ１、Ｐ２を有している。本実施形態における他の構成については、第１の実施形態の構成と同様である。
【００３１】
本実施形態の発光装置１００によれば、第１の実施形態と同様に反りが小さく抑えられることに加え、第２の実施形態と同様に絶縁基材２の長手方向に沿った撓みに対して強くなる。
【００３２】
＜第５の実施形態＞
本発明の第５の実施形態について、図７を参照して説明する。本実施形態では、発光装置１００は、金属板１の分割部分Ｌの形状が絶縁基材２の長手方向（図中、Ｘ方向）に対して斜めに傾いた直線から成っている。図示の例では、金属板１の分割部分Ｌの形状は、絶縁基材２の長手方向に対して略４５°斜めに傾いた直線から成っており、隣り合う金属板１１と金属板１２、及び金属板１２と金属板１３が、絶縁基材２の長手方向と垂直な方向に互いに重なり合う部分Ｐ１、Ｐ２を有している。本実施形態における他の構成については、第１の実施形態の構成と同様である。
【００３３】
本実施形態の発光装置１００によれば、第１の実施形態と同様に反りが小さく抑えられることに加え、第２の実施形態と同様に絶縁基材２の長手方向に沿った撓みに対して強くなる。
【００３４】
＜第６の実施形態＞
本発明の第６の実施形態について、図８を参照して説明する。本実施形態では、複数の発光装置１００が、１枚のガラスエポキシ製の絶縁基材シート２０に作成されている。複数の発光装置１００は、各発光装置１００における金属板１１，１２，１３の並び方向が互いに異なる方向になるように、絶縁基材シート２０に配置されている。図示の例では、４つの発光装置１００がロの字を形成するように絶縁基材シート２０に配置されて、各発光装置１００における金属板１１，１２，１３の並び方向が互いに異なった方向になっている。各発光装置１００の構成は、第１の実施形態の構成と同様である。
【００３５】
４つの発光装置１００を１枚の絶縁基材シート２０に作成するにあたって、４つの発光装置１００の金属基板１１，１２，１３は、熱硬化性の樹脂（接合材）を介して絶縁基材シート２０に貼り合わせ、一度の加熱工程により絶縁基材シート２０に接合する。このとき、隣り合う発光装置１００の金属板１１，１２，１３の並び方向が互いに異なるため、隣り合う発光装置１００間では、金属板１１，１２，１３が大きく膨張する方向は、互いに異なった方向となる。その結果、加熱後に常温に戻すときに発生する金属板１１，１２，１３と絶縁基材シート２０を反らせる応力は、４つの発光装置１００の金属板１１，１２，１３を全て同じ方向に並べて絶縁基材シート２０に接合した場合よりも小さくなり、絶縁基材シート２０に作成される各発光装置１００の反りが軽減される。
【００３６】
【発明の効果】
以上説明したように請求項１の発明によれば、金属板は複数に分割されて絶縁基材に接合され、その分割された金属板の並び方向が絶縁基材の長手方向であるため、金属板と絶縁基材とを接合したときに生じる反りは、部分的かつ小さなものとなり、これにより、発光装置全体としての反りを少なくできる。
【００３７】
請求項２の発明によれば、金属板の分割部分の形状が傾きの異なる複数の直線から成るため、隣り合う金属板の一部が絶縁基材の長手方向に垂直な方向に互いに重なり合い、これにより、金属板が補強の役割を果たし、撓みに対する強度を高めることができる。
【００３８】
請求項３の発明によれば、金属板の分割部分の形状が曲線から成るため、隣り合う金属板の一部が絶縁基材の長手方向に垂直な方向に互いに重なり合い、請求項２と同様の効果が得られる。
【００３９】
請求項４の発明によれば、金属板の分割部分の形状が曲線と直線から成るため、隣り合う金属板の一部が絶縁基材の長手方向に垂直な方向に互いに重なり合い、請求項２と同様の効果が得られる。
【００４０】
請求項５の発明によれば、金属板の分割部分の形状が絶縁基材の長手方向に対して斜めに傾いた直線から成るため、隣り合う金属板の一部が絶縁基材の長手方向に垂直な方向に互いに重なり合い、請求項２と同様の効果が得られる。
【００４１】
請求項６の発明によれば、複数の発光装置の金属板が、各発光装置における金属板の並び方向が互いに異なる方向になるように１枚の絶縁基材シート上に配置されているため、金属板と絶縁基材シートの反りを生じさせる応力が小さくなり、１枚の絶縁基材シートに形成される各発光装置の反りが軽減される。
【図面の簡単な説明】
【図１】本発明の第１の実施形態による発光装置の構成を示す上面図。
【図２】同発光装置の断面図。
【図３】同発光装置の反りを生じた状態を示す側面図。
【図４】本発明の第２の実施形態による発光装置の構成を示す上面図。
【図５】本発明の第３の実施形態による発光装置の構成を示す上面図。
【図６】本発明の第４の実施形態による発光装置の構成を示す上面図。
【図７】本発明の第５の実施形態による発光装置の構成を示す上面図。
【図８】本発明の第６の実施形態による発光装置の構成を示す上面図。
【図９】従来の発光装置の構成を示す断面図。
【図１０】別の従来の発光装置の構成を示す上面図。
【図１１】従来の発光装置の反りを生じた状態を示す側面図。
【符号の説明】
１ 金属板
１ａ 突出部
１ｂ 収納凹所
２ 絶縁基材
２ａ 納入孔
３ 発光ダイオード素子
６ 導体パターン
７ ボンディングワイヤ
９ 封止樹脂
１０ 封止樹脂枠
１１，１２，１３ 金属板
１００ 発光装置[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting device using a light emitting diode element.
[0002]
[Prior art]
Conventionally, in order to enhance the heat dissipation of the light emitting diode element, the light emitting diode element is mounted on a metal plate, an insulating base material having a conductor pattern is bonded on the metal plate, and the light emitting diode element and the conductor pattern are wired. A light emitting device having a bonded configuration has been proposed (see Japanese Patent Application No. 2001-258680).
[0003]
FIG. 9 shows the configuration of this light emitting device. The light emitting device 90 includes a metal plate 1 made of aluminum, an insulating substrate 2 made of glass epoxy having one surface joined to the metal plate 1 using a joining material (not shown), and the other of the insulating substrate 2. The light emitting diode element 3 mounted on the metal plate 1 and thermally coupled to the conductor pattern 6 formed on the surface, and connected to the conductor pattern 6 via the bonding wire 7, and seals the light emitting diode element 3. There is provided a sealing resin 9 and a sealing resin frame 10 surrounding the periphery of the sealing resin 9. In general, a thermosetting adhesive is used as a bonding material for bonding the metal plate 1 and the insulating base material 2 in order to shorten the working time. In the light emitting device 90, since the light emitting diode element 3 is directly mounted on the metal plate 1 and is thermally coupled to the metal plate 1, the heat dissipation of the light emitting diode element 3 is improved.
[0004]
As shown in FIG. 10, the light emitting device 90 has a configuration in which an elongated metal plate 1 and an insulating base material 2 are joined and a plurality of light emitting diode elements 3 are arranged in the longitudinal direction. I have. In FIG. 10, the conductor patterns and the bonding wires are not shown.
[0005]
Further, regarding a light source device using a light emitting diode element, a plurality of electrically insulated metal plates made of a conductive material such as copper are joined to an insulating member, and one light emitting diode element is attached to each metal plate. There is also known a light emitting diode element in which one electrode is mounted face down so that one electrode is in contact with a wiring pattern and the other electrode is in contact with a metal plate (for example, see Patent Document 1). This light source device uses a metal plate as a part of a power supply unit for a light emitting diode element, and connects a power supply between the wiring pattern and the metal plate to supply power to the light emitting diode element, thereby simplifying the wiring pattern. In order to connect a plurality of light emitting diode elements in series, a metal plate is divided into a plurality of regions that are electrically insulated from each other.
[0006]
[Patent Document 1]
JP-A-2002-94122 (FIG. 10, paragraphs 0084 to 008)
[0007]
[Problems to be solved by the invention]
By the way, the coefficient of thermal expansion of aluminum is larger than that of glass epoxy resin. Therefore, when the metal plate 1 made of aluminum and the insulating base material 2 made of glass epoxy are bonded by applying a thermosetting adhesive, the adhesive is cured by heating, and after joining the two, the temperature is returned to room temperature. In a state where the metal plate 1 and the insulating base material 2 are joined, the metal plate 1 shrinks more than the insulating base material 2.
[0008]
For this reason, in the above-described conventional light emitting device 90 in which a plurality of light emitting diode elements 3 are arranged in the longitudinal direction of the insulating base material 2, when the metal plate 1 and the insulating base material 2 are heated and joined, and then returned to room temperature, As shown in FIG. 11, there is a problem that warpage occurs in the longitudinal direction. In the light source device described in Patent Document 1 described above, a metal plate is made of a conductive material such as copper in order to use the metal plate as a part of a power supply unit for a light emitting diode element. In order to connect elements in series, a metal plate is divided into a plurality of regions that are electrically insulated from each other. That is, the light source device described in Patent Literature 1 does not divide the metal plate into a plurality of regions in order to prevent warpage caused by joining the metal plate and the insulating member. There is no description about splitting in the longitudinal direction of the insulating member. Therefore, even if the contents described in Patent Document 1 are applied, the above-described problem cannot be solved.
[0009]
The present invention has been made to solve the above problem, and has as its object to provide a light emitting device that can reduce warpage caused by joining a metal plate and an insulating base material.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 includes a metal plate, an insulating base material joined to the metal plate by using a bonding material in a state where one surface is overlapped with the metal plate, and the other of the insulating base material. A light emitting device comprising: a conductor pattern formed on the surface of the substrate; and a light emitting diode element mounted on the metal plate and thermally coupled to the conductor pattern, wherein the insulating base material has an aspect ratio of The light emitting diode elements have different shapes, a plurality of light emitting diode elements are mounted on a metal plate along the longitudinal direction of the insulating base, and the metal plate is divided into a plurality of divided metal plates. Are the longitudinal directions of the insulating base material.
[0011]
In this configuration, since the light emitting diode element is mounted on the metal plate and is thermally coupled to the metal plate, heat generated in the light emitting diode element is quickly conducted to the metal plate and radiated from the metal plate. . In addition, by joining a plurality of divided metal plates to the insulating base material side by side in the longitudinal direction of the insulating base material, each metal plate is separated from each other, and the length of the insulating base material in the longitudinal direction is reduced. Become. As a result, the warpage that occurs when the metal plate and the insulating base material are joined becomes partial at the joint between the metal plate and the insulating base material, and the warpage at each joint is also reduced. As a result, warpage of the light emitting device as a whole along the longitudinal direction of the insulating base, which is the direction in which the plurality of divided metal plates are arranged, is reduced.
[0012]
According to a second aspect of the present invention, in the light emitting device according to the first aspect, the shape of the divided portion of the metal plate includes a plurality of straight lines having different inclinations. In this configuration, by dividing the shape of the divided portion of the metal plate into a plurality of straight lines having different inclinations, adjacent metal plates partially overlap each other in a direction perpendicular to the longitudinal direction of the insulating base material. . As a result, when viewed in a direction perpendicular to the longitudinal direction of the insulating base material, there is no place where the metal plate is not joined to the insulating base material, and the metal plate serves as a reinforcing member for bending along the longitudinal direction of the insulating base material. Fulfill.
[0013]
According to a third aspect of the present invention, in the light emitting device according to the first aspect, the shape of the divided portion of the metal plate is a curve. In this configuration, by making the shape of the divided portion of the metal plate a curved line, adjacent metal plates partially overlap each other in the longitudinal direction of the insulating base material. Thereby, the same operation as the second aspect of the invention can be obtained.
[0014]
According to a fourth aspect of the present invention, in the light emitting device according to the first aspect, the shape of the divided portion of the metal plate includes a curve and a straight line. In this configuration, by forming the shape of the divided portion of the metal plate from a curve and a straight line, adjacent metal plates partially overlap each other in the longitudinal direction of the insulating base material. Thereby, the same operation as the second aspect of the invention can be obtained.
[0015]
According to a fifth aspect of the present invention, in the light emitting device according to the first aspect, the shape of the divided portion of the metal plate is a straight line obliquely inclined with respect to the longitudinal direction of the insulating base material. In this configuration, by dividing the shape of the divided portion of the metal plate into a straight line obliquely inclined with respect to the longitudinal direction of the insulating base material, the adjacent metal plates are partially separated from each other in the longitudinal direction of the insulating base material. Will overlap. Thereby, the same operation as the second aspect of the invention can be obtained.
[0016]
According to a sixth aspect of the present invention, a plurality of the light emitting devices according to any one of the first to fifth aspects are arranged on one insulating base material sheet in a direction in which the divided metal plates in each light emitting device are arranged. They are arranged so as to be in mutually different directions. In this configuration, the stress that causes the warpage at the time of joining the metal plate and the insulating base sheet is such that the metal plates of the plurality of light emitting devices are arranged in the same direction in each of the light emitting devices so that one insulating plate is formed. It becomes smaller than when it is joined to the base sheet. Therefore, warpage of each light emitting device formed on one insulating base sheet is reduced.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
<First embodiment>
A first embodiment of the present invention will be described with reference to FIGS. The light emitting device 100 is configured by joining a metal plate 1 made of aluminum and an insulating base material 2 made of glass epoxy. The insulating base 2 has an elongated shape with different aspect ratios, and a plurality of light emitting diode elements 3 are arranged in the longitudinal direction (X direction in the figure).
[0018]
The metal plate 1 is divided into three metal plates 11, 12, and 13, and these metal plates 11, 12, and 13 are arranged on the back surface of the insulating base material 2 in the longitudinal direction of the insulating base material 2. Are joined in shape. The shape of the divided portion L is a straight line along a direction perpendicular to the longitudinal direction of the insulating base material 2 (Y direction in the figure). Each of the metal plates 11, 12, and 13 has two protruding portions 1 a that protrude forward, and these protruding portions 1 a are provided in a plurality in the longitudinal direction of the insulating base 2. Each is inserted in the delivery hole 2a. A storage recess 1b for mounting the light emitting diode chip 3 is formed on the front surface of each protrusion 1a.
[0019]
The light emitting diode elements 3 are directly mounted on the bottom surfaces of the respective storage recesses 1b formed on the protruding portions 1a of the metal plates 11, 12, and 13, whereby the plurality of light emitting diode elements 3 are It has a configuration arranged side by side in the longitudinal direction. Further, since the light emitting diode element 3 is directly mounted on the bottom surface of the storage recess 1b, it is thermally coupled to the protrusion 1a (that is, the metal plates 11, 12, 13).
[0020]
The insulating base material 2 has a conductor pattern 6 (not shown in FIG. 1) made of copper foil and a sealing resin frame 10 on the surface (the surface on the side where the metal plate 1 is not bonded). I have. The light emitting diode element 3 and the conductor pattern 6 are connected by a bonding wire 7. The sealing resin 9 is filled in the delivery hole 2a and the sealing resin frame 10, and seals the light emitting diode element 3 and the bonding wire 7. The sealing resin 9 is made of an epoxy resin, a silicone resin, or the like, and has translucency.
[0021]
The light emitting device 100 having the above configuration is manufactured by the following steps. First, the delivery hole 2a is formed in the insulating base material 2, and the conductor pattern 6 and the sealing resin frame 10 are formed on the surface of the insulating base material 2. On the other hand, three metal plates 11, 12, and 13 having the protrusions 1a and having the storage recesses 1b formed in the protrusions 1a are formed in separate steps.
[0022]
Next, a thermosetting adhesive is attached to the surface of the metal plates 11, 12, 13 on which the protruding portions 1a are provided, or to the back surface of the insulating base material 2 (the surface on which the conductor pattern 6 is not formed). Apply agent (joining material). Then, the protruding portions 1a of the metal plates 11, 12, 13 are inserted into the delivery holes 2a from the back surface side of the insulating base material 2, and the metal plates 11, 12, 13 and the insulating base material 2 are bonded together and heated. The adhesive is cured to join the metal plates 11, 12, and 13 to the insulating base material 2, and then returned to room temperature.
[0023]
At this time, aluminum, which is the material of the metal plates 11, 12, 13 has a higher coefficient of thermal expansion than glass epoxy resin, which is the material of the insulating base material 2, so that when returning to normal temperature, the metal plates 11, 12, 13 Will shrink more than the insulating substrate 2. As a result, the bonded metal plates 11, 12, and 13 and the insulating base material 2 are warped when the temperature is returned to normal temperature. However, as shown in FIG. 3, since the metal plates 11, 12, and 13 are separated from each other, the warp is partially generated at the joint between the metal plates 11, 12 and 13 and the insulating base material 2. It will be. In addition, the partial warpage is small because the length of each of the metal plates 11, 12, and 13 in the longitudinal direction of the insulating base 2 is short. As a result, the bonded metal plates 11, 12, 13 and the insulating base material 2 are restrained from warping as a whole.
[0024]
After that, the light emitting diode element 3 is directly mounted on the bottom of the storage recess 1 b of the metal plate 1, and the light emitting diode element 3 and the conductor pattern 6 are connected by the bonding wire 7. Finally, the sealing resin 9 is poured into the sealing resin frame 10 and the delivery hole 2a to be cured, and the light emitting diode element 3 and the bonding wire 7 are sealed.
[0025]
According to the light emitting device 100 having the above configuration, since the light emitting diode element 3 is directly mounted on the storage recess 1b formed in the protruding portion 1a of the metal plate 1, the light emitting diode element 3 is thermally connected to the metal plate 1. Are combined. Thus, the heat generated in the light emitting diode element 3 is quickly conducted to the protrusion 1a of the metal plate 1, spreads through the protrusion 1a to the entire metal plate 1, and is radiated from the entire metal plate 1. Further, the metal plate 1 is divided into three metal plates 11, 12, and 13, and is joined to the insulating base 2 along the longitudinal direction of the insulating base 2. For this reason, the metal plates 11, 12, 13 are separated from each other, and the length of the insulating base material 2 in the longitudinal direction is reduced. Thereby, the warpage that occurs when the metal plate 1 and the insulating base material 2 are joined becomes partial and small, and the warp as a whole is suppressed to be small. The metal plate 1 is not limited to three, and may be divided into two or four or more.
[0026]
<Second embodiment>
A second embodiment of the present invention will be described with reference to FIG. In the present embodiment, in the light emitting device 100, the shape of the divided portion L of the metal plate 1 is composed of a plurality of straight lines having different inclinations. In the illustrated example, the shape of the divided portion L of the metal plate 1 is along a straight line along the longitudinal direction (X direction in the figure) of the insulating base material 2 and a direction perpendicular to the longitudinal direction (Y direction in the figure). And the adjacent metal plates 11 and 12, and the metal plates 12 and 13 have portions P1 and P2 that overlap with each other in a direction perpendicular to the longitudinal direction of the insulating base material 2. . Other configurations in the present embodiment are the same as the configurations in the first embodiment.
[0027]
According to the light emitting device 100 of the present embodiment, the adjacent metal plates 11 and 12 and the portions where the metal plate 12 and the metal plate 13 overlap each other in a direction perpendicular to the longitudinal direction of the insulating base 2 have portions P1 and P2. Thus, when viewed in a direction perpendicular to the longitudinal direction of the insulating base 2, there is no place where the metal plate 1 is not joined to the insulating base 2. As a result, the metal plate 1 plays a role of a reinforcing material against the bending of the insulating base material 2 along the longitudinal direction, so that the warpage is suppressed to be small as in the first embodiment, and the insulating base material 2 It becomes strong against bending along the longitudinal direction.
[0028]
<Third embodiment>
A third embodiment of the present invention will be described with reference to FIG. In the present embodiment, in the light emitting device 100, the shape of the divided portion L of the metal plate 1 is formed by a curve. In the illustrated example, the shape of the divided portion L of the metal plate 1 is formed of a wavy curve, and the adjacent metal plates 11 and 12 and the metal plates 12 and 13 It has portions P1 and P2 overlapping each other in a direction perpendicular to the longitudinal direction. Other configurations in the present embodiment are the same as the configurations in the first embodiment.
[0029]
According to the light emitting device 100 of the present embodiment, in addition to suppressing the warpage as in the first embodiment, the light emitting device 100 is capable of preventing the insulating substrate 2 from bending along the longitudinal direction as in the second embodiment. Become stronger.
[0030]
<Fourth embodiment>
A fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, in the light emitting device 100, the shape of the divided portion L of the metal plate 1 is composed of a curve and a straight line. In the illustrated example, the shape of the divided portion L of the metal plate 1 is composed of a semicircular curve and a straight line along a direction (Y direction in the figure) perpendicular to the longitudinal direction of the insulating base material 2. The matching metal plates 11 and 12, and the metal plates 12 and 13 have portions P1 and P2 that overlap each other in a direction perpendicular to the longitudinal direction of the insulating base material 2. Other configurations in the present embodiment are the same as the configurations in the first embodiment.
[0031]
According to the light emitting device 100 of the present embodiment, in addition to suppressing the warpage as in the first embodiment, the light emitting device 100 is capable of preventing the insulating substrate 2 from bending along the longitudinal direction as in the second embodiment. Become stronger.
[0032]
<Fifth embodiment>
A fifth embodiment of the present invention will be described with reference to FIG. In the present embodiment, in the light emitting device 100, the shape of the divided portion L of the metal plate 1 is formed of a straight line that is obliquely inclined with respect to the longitudinal direction (the X direction in the figure) of the insulating base material 2. In the illustrated example, the shape of the divided portion L of the metal plate 1 is formed of a straight line that is inclined at an angle of approximately 45 ° with respect to the longitudinal direction of the insulating base material 2, and the adjacent metal plate 11 and the metal plate 12, and The metal plate 12 and the metal plate 13 have portions P1 and P2 overlapping each other in a direction perpendicular to the longitudinal direction of the insulating base material 2. Other configurations in the present embodiment are the same as the configurations in the first embodiment.
[0033]
According to the light emitting device 100 of the present embodiment, in addition to suppressing the warpage as in the first embodiment, the light emitting device 100 is capable of preventing the insulating substrate 2 from bending along the longitudinal direction as in the second embodiment. Become stronger.
[0034]
<Sixth embodiment>
A sixth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the plurality of light emitting devices 100 are formed on one insulating substrate sheet 20 made of glass epoxy. The plurality of light emitting devices 100 are arranged on the insulating base sheet 20 such that the arrangement directions of the metal plates 11, 12, and 13 in each light emitting device 100 are different from each other. In the illustrated example, four light emitting devices 100 are arranged on the insulating base sheet 20 so as to form a square, and the arrangement directions of the metal plates 11, 12, and 13 in each light emitting device 100 are different from each other. Has become. The configuration of each light emitting device 100 is the same as the configuration of the first embodiment.
[0035]
When the four light emitting devices 100 are formed on one insulating base sheet 20, the metal substrates 11, 12, and 13 of the four light emitting devices 100 are separated from each other by a thermosetting resin (joining material). 20 and bonded to the insulating base sheet 20 by one heating step. At this time, since the arrangement directions of the metal plates 11, 12, and 13 of the adjacent light emitting devices 100 are different from each other, the directions in which the metal plates 11, 12, and 13 greatly expand between the adjacent light emitting devices 100 are different from each other. It becomes. As a result, the stress that causes the metal plates 11, 12, and 13 and the insulating base sheet 20 to be warped when the temperature is returned to normal temperature after heating is increased by arranging the metal plates 11, 12, and 13 of the four light emitting devices 100 in the same direction. It becomes smaller than when joined to the base material sheet 20, and the warpage of each light emitting device 100 formed on the insulating base material sheet 20 is reduced.
[0036]
【The invention's effect】
As described above, according to the first aspect of the present invention, the metal plate is divided into a plurality of pieces and joined to the insulating base material, and the direction in which the divided metal plates are arranged is the longitudinal direction of the insulating base material. The warpage that occurs when the plate and the insulating base material are joined becomes partial and small, thereby reducing the warpage of the entire light emitting device.
[0037]
According to the invention of claim 2, since the shape of the divided portion of the metal plate is composed of a plurality of straight lines having different inclinations, a part of the adjacent metal plates overlap each other in a direction perpendicular to the longitudinal direction of the insulating base material. Thereby, the metal plate plays a role of reinforcement, and the strength against bending can be increased.
[0038]
According to the third aspect of the present invention, since the shape of the divided portion of the metal plate is formed by a curve, a part of the adjacent metal plates overlaps each other in a direction perpendicular to the longitudinal direction of the insulating base material. The effect is obtained.
[0039]
According to the invention of claim 4, since the shape of the divided portion of the metal plate is formed of a curve and a straight line, a part of adjacent metal plates overlap each other in a direction perpendicular to the longitudinal direction of the insulating base material. Similar effects can be obtained.
[0040]
According to the invention of claim 5, since the shape of the divided portion of the metal plate is a straight line obliquely inclined with respect to the longitudinal direction of the insulating base material, a part of the adjacent metal plate is formed in the longitudinal direction of the insulating base material. The layers overlap with each other in the vertical direction, and the same effect as that of the second aspect is obtained.
[0041]
According to the invention of claim 6, since the metal plates of the plurality of light emitting devices are arranged on one insulating base sheet so that the arrangement direction of the metal plates in each light emitting device is different from each other, The stress that causes warpage between the metal plate and the insulating base sheet is reduced, and the warpage of each light emitting device formed on one insulating base sheet is reduced.
[Brief description of the drawings]
FIG. 1 is a top view showing a configuration of a light emitting device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of the light-emitting device.
FIG. 3 is a side view showing a state in which the light emitting device is warped.
FIG. 4 is a top view illustrating a configuration of a light emitting device according to a second embodiment of the present invention.
FIG. 5 is a top view illustrating a configuration of a light emitting device according to a third embodiment of the present invention.
FIG. 6 is a top view illustrating a configuration of a light emitting device according to a fourth embodiment of the present invention.
FIG. 7 is a top view illustrating a configuration of a light emitting device according to a fifth embodiment of the present invention.
FIG. 8 is a top view showing a configuration of a light emitting device according to a sixth embodiment of the present invention.
FIG. 9 is a cross-sectional view illustrating a configuration of a conventional light emitting device.
FIG. 10 is a top view showing the configuration of another conventional light emitting device.
FIG. 11 is a side view showing a state in which a conventional light emitting device is warped.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal plate 1a Projecting part 1b Storage recess 2 Insulating base material 2a Delivery hole 3 Light emitting diode element 6 Conductive pattern 7 Bonding wire 9 Sealing resin 10 Sealing resin frame 11, 12, 13 Metal plate 100 Light emitting device

Claims (6)

金属板と、一方の面が前記金属板に重ねた形で前記金属板に接合材を用いて接合された絶縁基材と、前記絶縁基材の他方の面に形成された導体パターンと、前記金属板に搭載されて熱的に結合され、前記導体パターンに接続された発光ダイオード素子と、を備えた発光装置であって、
前記絶縁基材は、縦横比が異なる形状を有しており、
前記発光ダイオード素子は、複数のものが前記絶縁基材の長手方向に沿って前記金属板に搭載されており、
前記金属板は、複数に分割されており、分割された金属板の並び方向が前記絶縁基材の長手方向であることを特徴とする発光装置。A metal plate, an insulating substrate joined to the metal plate using a joining material in a form where one surface is overlapped with the metal plate, and a conductor pattern formed on the other surface of the insulating substrate, A light emitting diode element mounted on a metal plate and thermally coupled, and a light emitting diode element connected to the conductor pattern,
The insulating base material has a shape having a different aspect ratio,
A plurality of the light emitting diode elements are mounted on the metal plate along a longitudinal direction of the insulating base material,
The light emitting device according to claim 1, wherein the metal plate is divided into a plurality of portions, and a direction in which the divided metal plates are arranged is a longitudinal direction of the insulating base material. 前記金属板の分割部分の形状は、傾きの異なる複数の直線から成ることを特徴とする請求項１に記載の発光装置。The light emitting device according to claim 1, wherein the shape of the divided portion of the metal plate includes a plurality of straight lines having different inclinations. 前記金属板の分割部分の形状は、曲線から成ることを特徴とする請求項１に記載の発光装置。The light emitting device according to claim 1, wherein the shape of the divided portion of the metal plate is a curve. 前記金属板の分割部分の形状は、曲線と直線から成ることを特徴とする請求項１に記載の発光装置。2. The light emitting device according to claim 1, wherein the shape of the divided portion of the metal plate includes a curve and a straight line. 前記金属板の分割部分の形状は、前記絶縁基材の長手方向に対して斜めに傾いた直線から成ることを特徴とする請求項１に記載の発光装置。The light emitting device according to claim 1, wherein the shape of the divided portion of the metal plate is a straight line that is obliquely inclined with respect to a longitudinal direction of the insulating base. １枚の絶縁基材シート上に、前記請求項１乃至請求項５のいずれかに記載の発光装置の複数個が、各発光装置における分割された金属板の並び方向が互いに異なる方向になるように配置されていることを特徴とする発光装置。A plurality of the light emitting devices according to any one of claims 1 to 5 are arranged on one insulating base sheet so that the arrangement directions of the divided metal plates in each light emitting device are different from each other. A light-emitting device, wherein the light-emitting device is disposed on
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KR100610275B1 (en) 2004-12-16 2006-08-09 알티전자 주식회사 Power LED package and method for producing the same
KR100646093B1 (en) 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
JP2006324392A (en) * 2005-05-18 2006-11-30 Kyocera Corp Substrate for mounting light emitting element, package for storing light emitting element, light emitting device, and lighting system
JP2007059678A (en) * 2005-08-25 2007-03-08 Toshiba Lighting & Technology Corp Light-emitting diode device
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JP2008053571A (en) * 2006-08-28 2008-03-06 Nichia Chem Ind Ltd Light emitting device, and planar light emitting device using same
JP2016027620A (en) * 2014-06-27 2016-02-18 日亜化学工業株式会社 Light emitting device

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Publication number Priority date Publication date Assignee Title
KR100610275B1 (en) 2004-12-16 2006-08-09 알티전자 주식회사 Power LED package and method for producing the same
KR100646093B1 (en) 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
JP2006324392A (en) * 2005-05-18 2006-11-30 Kyocera Corp Substrate for mounting light emitting element, package for storing light emitting element, light emitting device, and lighting system
JP4659515B2 (en) * 2005-05-18 2011-03-30 京セラ株式会社 Light-emitting element mounting substrate, light-emitting element storage package, light-emitting device, and lighting device
JP2007059678A (en) * 2005-08-25 2007-03-08 Toshiba Lighting & Technology Corp Light-emitting diode device
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US7968980B2 (en) 2006-03-02 2011-06-28 Nichia Corporation Support member for mounting a semiconductor device, conductive materials, and its manufacturing method
JP2008053571A (en) * 2006-08-28 2008-03-06 Nichia Chem Ind Ltd Light emitting device, and planar light emitting device using same
JP2016027620A (en) * 2014-06-27 2016-02-18 日亜化学工業株式会社 Light emitting device
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