JP2004176124A - Alignment apparatus, film deposition system, and alignment method - Google Patents

Alignment apparatus, film deposition system, and alignment method Download PDF

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JP2004176124A
JP2004176124A JP2002343441A JP2002343441A JP2004176124A JP 2004176124 A JP2004176124 A JP 2004176124A JP 2002343441 A JP2002343441 A JP 2002343441A JP 2002343441 A JP2002343441 A JP 2002343441A JP 2004176124 A JP2004176124 A JP 2004176124A
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substrate
mask
alignment
holder
electrostatic
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JP4184771B2 (en
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Hideyuki Odagi
秀幸 小田木
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Ulvac Inc
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Ulvac Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment apparatus by which alignment can correctly be performed in a short period of time. <P>SOLUTION: The alignment apparatus 5 comprises a static electricity attracting device 72, and a substrate 7 relatively moves to a mask 8 in a state of being electrostatically attracted on the static electricity attracting device 71, and alignment is performed. The substrate 7 is electrostatically attracted not only in the edge parts, but also in the central part, so that deflection does not occur on the central part of the substrate 7 in a state where the substrate 7 is held, and misregistration does not occur on the alignment. Thus, the alignment can be performed more correctly than the conventional case, and there is no need of realignment, so that the time required for the alignment can be reduced. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明はアライメント装置に関し、特に基板とマスクとの位置合わせを行うアライメント装置に関する。
【０００２】
【従来の技術】
従来より、基板とマスクとの位置合わせを行うために、図８に示すようなアライメント装置１０５が用いられている。アライメント装置１０５はマスクホルダ１８０と、マスクホルダ１８０の上方に配置された基板ホルダ１７０とを有している。
【０００３】
基板ホルダ１７０は棒状の保持部材１７６を複数本有しており、各保持部材１７６は鉛直方向に向けられ、その下端にはフック１７９が形成されている。マスクホルダ１８０には板状のマスク１０８が水平に配置されており、各保持部材１７６の下端をマスク１０８上で同じ高さに配置し、各フック１７９に板状の基板１０７の縁部を乗せると、基板１０７がマスク１０８上で水平に保持される。
【０００４】
基板１０７を保持した状態で各保持部材１７６を一緒に下降させ、基板１０７をマスク１０８に乗せる。その状態で不図示のカメラにより位置ずれ量を測定した後、各保持部材１７６を一緒に上昇させて基板１０７をマスク１０８から離す。
【０００５】
測定された位置ずれ量に基づき、各保持部材１７６を水平方向に一緒に移動させて位置合わせを行った後、各保持部材１７６を一緒に下降させて基板１０７をマスク１０８に乗せる。その状態でカメラにより位置ずれ量を測定し、位置ずれ量が解消されていればアライメントを終了し、位置ずれ量が解消されていなければ、再び位置合わせを行う。
【０００６】
ところで、従来のアライメント装置１０５では、基板１０７の縁部をフック１７９で支えるため、基板１０７が大型の場合には基板１０７の中央部分がたわむことがある。基板１０７がたわんだ状態で位置合わせを行うと位置ずれが起こりやすく、また、基板１０７がたわんだ状態でマスク１０８に押し当てると、基板１０７がマスク１０８に押し当てられるときに、基板１０７のたわんだ部分がマスク１０８と擦れ、基板１０７のデバイスが損傷する場合がある。
【０００７】
【特許文献１】
特開２００２−２４１９２４号公報 （第３−４頁、第２図）
【特許文献２】
特開平９−２０９１２７号公報 （第４頁、第１図）
【０００８】
【発明が解決しようとする課題】
本発明は上記従来技術の要求に応じるために創作されたものであり、その目的は、大型の基板を位置合わせ可能なアライメント装置を提供することである。
【０００９】
【課題を解決するための手段】
上記課題を解決するために、請求項１記載の発明は、板状のマスクを保持可能なマスクホルダと、前記マスクホルダの上方に配置され、板状の基板を前記マスクに対して略平行に保持可能な基板ホルダとを有し、前記マスクホルダと前記基板ホルダとは相対的な移動が可能に構成され、前記マスクホルダと前記基板ホルダに、前記マスクと前記基板をそれぞれ保持させた状態で、前記相対的な移動を行い、前記基板と前記マスクとの位置合わせを行えるように構成されたアライメント装置であって、前記基板ホルダは静電吸着装置を有し、前記静電吸着装置は、前記マスクホルダに保持された前記マスク上方に前記基板を位置させた場合に、前記基板の上側表面に当接可能な吸着面を有するアライメント装置である。
請求項２記載の発明は、請求項１記載のアライメント装置であって、前記基板ホルダは棒状の仮保持部材を有し、前記仮保持部材の下端は、前記静電吸着装置よりも下方であって、前記マスクよりも上方位置に突き出され、前記仮保持部材の下端に前記基板を載置可能なフックが形成されたアライメント装置である。
請求項３記載の発明は、請求項１又は請求項２のいずれか１項記載のアライメント装置と、前記アライメント装置の下方に配置された成膜源とを有する成膜装置である。
請求項４記載の発明は、基板とマスクとを真空雰囲気中で位置合わせを行うアライメント方法であって、マスクホルダに配置されたマスクと、前記マスク上に配置された静電吸着装置との間に前記基板を配置した後、前記基板を前記静電吸着装置に静電吸着し、前記基板が前記基板ホルダに静電吸着された状態で、前記基板を前記マスクとを相対的に移動させ、位置合わせを行うアライメント方法である。
請求項５記載の発明は、請求項４記載のアライメント方法であって、前記静電吸着装置に前記基板が接触する平面である吸着面を設け、前記吸着面が前記マスクに対して平行になるように前記静電吸着装置を配置し、前記基板を前記吸着面に接触させた状態で前記静電吸着装置に静電吸着するアライメント方法である。請求項６記載の発明は、請求項４又は請求項５のいずれか１項記載のアライメント方法であって、前記基板を前記静電吸着装置に静電吸着した状態で、前記マスクに押し当てて位置ずれ量を測定した後、前記基板を前記静電吸着装置に静電吸着した状態で、前記マスクから離して位置合わせを行うアライメント方法である。
【００１０】
【発明の実施の形態】
以下で図面を参照し、本発明の実施形態について説明する。
図１の符号１は本発明の成膜装置の一例を示している。この成膜装置１は、搬送室２と、複数の成膜室３とを有している。ここでは成膜装置１は３台の成膜室３を有しており、各成膜室３はそれぞれ同じ搬送室２に接続されている。
【００１１】
図２は成膜室３を示す斜視図である。図２を参照し、成膜室３は装置本体である真空槽１２を有しており、真空槽１２内には、成膜源である蒸着源１３が真空槽１２内の底壁側に配置され、蒸着源１３の上方には本発明のアライメント装置５が配置されている。
【００１２】
図３はアライメント装置５の内部構成を示す図面である。アライメント装置５は、軸部６０と、ＸＹテーブル４０と、動力源５０と、基板ホルダ７０と、マスクホルダ８０とを有している。ＸＹテーブル４０は真空槽１２の天井の真空槽１２外部側の面に取り付けられている。
【００１３】
動力源５０は第一の昇降モータ５１と、第二の昇降モータ５２と、回転モータ５３とを有しており、それらのモータ５１〜５３はＸＹテーブル４０上に取り付けられた取り付け台４２に取り付けられている。従って、それらのモータ５１〜５３は取り付け台４２を介してＸＹテーブル４０に取り付けられている。
【００１４】
軸部６０は３重構造であって、最外周の外筒６１と、該外筒６１内に挿通された内筒６２と、内筒６２に挿通され、外筒６１及び内筒６２の中心軸線上に位置する棒状のロッド６３とで構成されている。真空槽１２上には筒状のベロース４４が鉛直に向けて取り付けられており、軸部６０全体はこのベロース４４に鉛直に挿通されている。
【００１５】
各モータ５１〜５３は、下方から回転モータ５３、第二の昇降モータ５２、第一の昇降モータ５１との順で位置しており、回転モータ５３は軸部６０の鉛直方向の中心部分に位置し、第二の昇降モータ５２は内筒６２の真上に位置し、第一の昇降モータ５１はロッド６３の真上に位置し、外筒６１の外周は回転モータ５３に接続され、内筒６２の上端は第二の昇降モータ５２に接続され、ロッド６３の上端は第一の昇降モータ５１に接続されることで、外筒６１、内筒６２及びロッド６３は各モータ５１〜５３によって吊り下げられている。
【００１６】
回転モータ５３の下方位置には封止部４３が取り付けられており、封止部４３は外筒６１の外周に気密に取り付けられ、ベロース４４の上端は封止部４３に気密に接続され、その下端は真空槽１２の天井に気密に接続されている。
【００１７】
真空槽１２天上のベロース４４の下端で囲まれた位置には開口１３が形成されており、ベロース４４内と真空槽１２内は開口１３を介して接続されている。即ち、封止部４３と外筒６１との間、封止部４３とベロース４４の上端との間、真空槽１２天上とベロース４４の下端との間は気密に構成され、真空槽１２の内部とベロース４４の内部は外部空間から遮断されている。
【００１８】
回転モータ５３を起動すると外筒６１がその中心軸線を中心として内筒６２及びロッド６３と一緒に回転し、第一のモータ５１を起動するとロッド６３が上下に移動し、第二のモータ６２を起動すると内筒６２が上下に移動するようになっている。
【００１９】
外筒６１、内筒６２、及びロッド６３の下端はそれぞれ真空槽１２内に突き出されている。外筒６１と封止部４３との間、外筒６１と内筒６２との間、及び内筒６２とロッド６３との間にはそれぞれ磁性流体シールが設けられているので、外筒６１が回転するときや、内筒６２及びロッド６３が上下に移動するときも真空槽１２内が気密に維持されるようになっている。
【００２０】
真空槽１２天井の真空槽１２内側の面にはアーム８５が固定されており、マスクホルダ８０はアーム８５によって真空槽１２内に吊り下げられている。図３はの符号８はマスクホルダ８０に乗せられたマスクを示している。
【００２１】
基板ホルダ７０は板状の装置本体７２と、装置本体７２に内蔵された正、負の電極７３とを有しており、装置本体７２と正、負の電極７３とで静電吸着装置７１が構成されている。
【００２２】
装置本体７２は絶縁物で構成されており、装置本体７２の下側の面を吸着面８９とし、後述する基板を吸着面８９に接触させた状態で、正、負の電極７３に正、負の電圧をそれぞれ印加すると、基板が吸着面８９に静電吸着されるようになっている。
【００２３】
ロッド６３の下部は真空槽１２内に突き出され、その下端がマスクホルダ８０上のマスク８よりも上方に配置されている。装置本体７２は、吸着面８９がマスク８に対して平行にされた状態で、ロッド６３の下端に取り付けられている。装置本体７２は、ロッド６３を上下させるとマスクホルダ８０上のマスク８よりも上方位置で上下に移動し、Ｘ−Ｙテーブル４０と回転モータ５３によって、マスク８と平行な平面内でＸ軸方向、Ｙ軸方向、及びθ方向に移動するようになっている。
【００２４】
装置本体７２上にはコイル状のバネ７７が複数個鉛直に配置されている。装置本体７２の各バネ７７の中心位置には、バネ７７の径よりも小径の貫通孔がそれぞれ形成されており、それらの貫通孔とバネ７７には棒状の仮保持部材７６が１本ずつ挿通されている。
【００２５】
各仮保持部材７６の上端には、バネ７７の径よりも大径のフランジが設けられており、フランジがバネ７７の上端に乗せられることで、仮保持部材７６全体がバネ７７に支持されている。
【００２６】
仮保持部材７６の下端はマスク８よりも上方位置であって、装置本体７２の吸着面８９よりも下方位置まで突き出され、その下端には後述する板状の基板を載置可能なフック７９が形成されており、フック７９と仮保持部材７６とでメカニカルチャック７５が構成されている。
【００２７】
内筒６２の下端は装置本体７２よりも位置し、その下端には、取り付け板９１を介して仮保持部材７６と同じ数の押圧部７８が取り付けられている。各押圧部７８は仮保持部材７６の鉛直上方位置にそれぞれ位置しており、装置本体７２を静止させた状態で、内筒６２を上方から降下させると、押圧部７８の下端部が仮保持部材７６上端のフランジに当接されるようになっている。
【００２８】
更に押圧部７８を降下させると、それに伴ってバネ７７が縮んで仮保持部材７６が下降し、フック７９と装置本体７２との間の隙間が大きくなり、後述する搬送ロボットにより基板をフック７９と装置本体７２との間に挿入される。図３の符号７はフック７９と装置本体７２との間に挿入された基板を示しており、その状態では基板７は吸着面８９と非接触な状態で、フック７９よりも上方に位置する。尚図３では搬送ロボットは省略した。
【００２９】
その状態で押圧部７８を上昇させると、復元力によりバネ７７が伸び、仮保持部材７６が上昇する。仮保持部材７６の上昇によってフック７９が上昇すると、フック７９が基板７の縁部に当接し、更にフック７９が上昇すると基板７が搬送ロボットからフック７９に乗せられる。フック７９に乗せられた基板７が、搬送ロボットのアームよりも高く持ち上げられると、搬送ロボットのアームを吸着面８９とマスク８の間から退避させることができる。
【００３０】
バネ７７はフランジが押圧されていなくても縮められた状態になっており、常にフランジに対して上向きの力を及ぼしているので、フック７９に基板が乗せられておらずフランジが押圧されていないときには、フック７９は上方に持ち上げられ、吸着面８９に接触するようになっている。従って、基板７がフック７９に乗せられた状態でバネ７７が伸びると、基板７が吸着面８９に接触する。
【００３１】
真空槽１２には真空排気系５９が接続されており、予め真空排気系５９により真空槽１２内に所定圧力の真空雰囲気を形成しておき、基板７の表面が吸着面８９に接触した状態で電極７３に正負の電圧を印加すると、基板７が吸着面８９に密着した状態で静電吸着される。
【００３２】
上述したように、吸着面８９は装置本体７２の下側の面で構成されているので、基板７が静電吸着された状態では、基板７は装置本体７２よりも下側で保持されるが、基板７は縁部分だけではなくその中央部分も静電吸着されるようになっているので、静電吸着された状態の基板７にたわみが生じることがない。
【００３３】
吸着面８９はマスク８に対して平行になっているので、吸着面８９に静電吸着された基板７は、マスク８に対して平行になっている。従って、装置本体７２をマスク８に対して垂直方向に下降させると、基板７がマスク８に対して平行な状態を維持したまま下降し、マスク８の表面に押し当てられる。
【００３４】
真空槽１２外部にはＣＣＤカメラ５５が設けられており、窓部５６を介して真空槽１２内を観察可能になっている。基板７とマスク８には不図示のアライメントマークが設けられており、真空槽１２内の真空雰囲気を維持し、基板７をマスク８に押し当てた状態で、基板７とマスク８のアライメントマークを観察し、マスク８と平行な平面内でも基板７とマスク８の位置ずれ量を求める。
位置ずれ量を求めた後、基板７を装置本体７２に静電吸着した状態でマスク８に対して垂直方向に上昇させ、マスク８から離す。
【００３５】
次いで、基板７を装置本体７２と共に、マスク８と平行な平面内でＸ軸方向、Ｙ軸方向、及びθ方向に位置ずれ量が無くなるように移動させて位置合わせを行う。位置合わせ終了後、基板７をマスク８に対して垂直に下降させると、位置ずれ量が無くなった状態で基板７がマスク８に押し当てられる。
【００３６】
本発明のアライメント装置５によれば、基板７は静電吸着装置７１に静電吸着された状態で位置合わせが行われる。上述したように基板７は静電吸着された状態ではたわみが生じないので、位置合わせのときに基板７の位置ずれが置き難い。
【００３７】
また、基板７はマスク８に対して平行な状態を維持したまま、マスク８に押し当てられるので、基板７とマスク８とが擦れにくく、予め基板に配線膜のようなデバイスが形成されてる場合でも、そのデバイスが損傷し難い。
【００３８】
次に、上述した成膜装置１を用いて薄膜を形成する工程について説明する。
予め、搬送室２内と真空槽１２内に所定圧力の真空雰囲気を形成しておき、図１に示すような基板搬送装置４を搬送室２に気密に接続し、成膜対象物である基板７を基板搬送装置４から搬送室２内に搬入する。
【００３９】
次いで、搬送室２を成膜室３に接続し、図６（ａ）に示すように、搬送室２内に設置された搬送ロボット９のアームに基板７を乗せ、真空槽１２内に搬入し、仮保持部材７６のフック７９と吸着面８９との間に挿入した後、基板７を仮保持部材７６のフック７９に乗せて、基板ホルダ７０に仮保持させる。
【００４０】
真空槽１２内の真空雰囲気を維持した状態で、図６（ｂ）に示すように基板７を吸着面８９に接触させて、静電吸着装置７１に静電吸着させた後、図６（ｃ）に示すように搬送ロボット９のアームを搬送室２に退避させる。
【００４１】
基板７を静電吸着装置７１に静電吸着させた状態で、マスク８の表面に押し当て（図６（ｄ））、図６（ｅ）に示すようにＣＣＤカメラ５５により位置ずれ量を求めた後、図７（ｆ）に示すように基板７を静電吸着装置７１に静電吸着させた状態でマスク８から離す。次いで、真空雰囲気中で、基板７をマスク８と平行な平面内でＸ軸方向、Ｙ軸方向、及びθ方向に移動させて位置合わせを行う（図７（ｇ））。
【００４２】
位置合わせ後、図７（ｈ）に示すように基板７を静電吸着装置７１に静電吸着させた状態でマスク８に押し当て、図７（ｉ）に示すようにＣＣＤカメラ５５により基板７とマスク８との位置ずれ量を再度求め、位置ずれ量が無くなったことが確認されたらアライメントを終了し、位置ずれ量が無くなっていなかったら、位置ずれ量が無くなるまで図７（ｆ）〜（ｉ）の工程を繰り返す。
【００４３】
上述したように、本発明のアライメント装置を用いれば、基板７を位置合わせするときに位置ずれが置き難く、正確に位置合わせが行われるので、位置合わせをやり直す必要がなく、結果としてアライメント工程に要する時間が短縮される。
【００４４】
蒸着源１３には蒸着材料が予め配置されており、アライメント終了後、蒸着材料を加熱すると、真空槽１２内に蒸着材料の蒸気が放出される。マスク８には所定パターンの開口が形成されており、放出された蒸気はマスク８の開口を通って基板７の表面に到達し、薄膜が成長する。
【００４５】
薄膜が所定膜厚まで成長したところで成膜を終了し、基板７をマスク８から離す。搬送ロボット９のアームを基板７の下方であって、マスク８よりも上方位置に配置した状態で、基板７への吸着力を解除し、フック７９を下降させると、基板７がフック７９から搬送ロボット９のアームに乗せられる。
【００４６】
その基板７を搬送ロボット９により搬送室２に一旦戻した後、新たな成膜室３に順次送り、成膜を行えば、基板７表面に複数の薄膜が積層される。各成膜室３での成膜が終了した後、基板７を搬送室２から基板搬送装置４に取り出せば、薄膜が積層された状態の基板７を得ることができる。
【００４７】
以上は、基板７をマスク８に対して平行な平面内で移動させて位置合わせを行う場合について説明したが、本発明はこれに限定されず、マスクホルダ８０が移動手段に接続され、基板７を静止させた状態で該移動手段によりマスク８を基板７に対して平行な平面内で移動させる場合や、基板７をマスク８に対して平行な平面内で移動させると共に、マスク８を基板７に対して平行な平面内で移動させる場合も含まれる。
【００４８】
基板７をマスク８に押し当てる方法も特に限定されず、基板７を静電吸着装置７１に静電吸着した状態で静止させておき、マスク８を基板７に対して垂直に上昇させる場合や、または基板７を下降させると共にマスクホルダ８０を上昇させる場合も含まれる。
【００４９】
静電吸着装置７１の正負の電極７３に電圧を印加するタイミングは特に限定されず、基板７が吸着面８９に密着した後に電圧を印加しても良いし、基板７が吸着面８９に密着する前に電圧を印加しておいてもよい。
【００５０】
吸着面８９を構成する装置本体７２の表面は平坦である必要はなく、基板７の上側表面が接触可能であって、基板の中央部分と縁部分の両方を同時に静電吸着可能なものであれば、例えば装置本体７２の凹凸が形成された面の、凸部先端が位置する平面で吸着面を構成してもよい。
成膜源の種類も蒸着源に限定されず、本発明の成膜装置の成膜源としては、スパッタ源などを用いることもできる。
【００５１】
【発明の効果】
本発明によれば、静電吸着装置に基板を静電吸着させた状態で位置合わせを行うので、基板のたわみが起こらず、位置ずれが置き難い。従って、従来に比べ正確に位置合わせが行われるので、位置合わせをやり直す必要がなく、アライメントに要する時間が短縮される。また、基板を静電吸着装置に静電吸着させた状態でマスクに押し当てるので、基板とマスクが擦れ難く、基板が損傷を受けにくい。
【図面の簡単な説明】
【図１】本発明に用いられる成膜装置の一例を説明する斜視図
【図２】成膜室の一例を説明する斜視図
【図３】本発明のアライメント装置の内部構成を説明する図
【図４】基板を静電吸着装置に静電吸着させた状態を説明する図
【図５】基板をマスクに押し当てた状態を説明する図
【図６】（ａ）〜（ｄ）：アライメント工程の前半を説明する図
【図７】（ｅ）〜（ｉ）：アライメント工程の後半を説明する図
【図８】従来技術のアライメント装置を説明する図
【符号の説明】
１……成膜装置 ５……アライメント装置 ７……基板 ８……マスク１２……真空槽 １３……成膜源（蒸着源） ７０……基板ホルダ ７１……静電吸着装置 ７２……装置本体 ７３……電極 ７５……メカニカルチャック ７６……仮保持部材 ７９……フック ８０……マスクホルダ ８９……吸着面[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an alignment apparatus, and more particularly, to an alignment apparatus that performs alignment between a substrate and a mask.
[0002]
[Prior art]
Conventionally, an alignment device 105 as shown in FIG. 8 has been used to perform alignment between a substrate and a mask. The alignment device 105 has a mask holder 180 and a substrate holder 170 disposed above the mask holder 180.
[0003]
The substrate holder 170 has a plurality of rod-shaped holding members 176, each holding member 176 is vertically oriented, and a hook 179 is formed at a lower end thereof. The plate-shaped mask 108 is horizontally arranged on the mask holder 180, the lower ends of the holding members 176 are arranged at the same height on the mask 108, and the edge of the plate-shaped substrate 107 is put on each hook 179. Then, the substrate 107 is held horizontally on the mask 108.
[0004]
While holding the substrate 107, each holding member 176 is lowered together, and the substrate 107 is placed on the mask 108. In this state, after the amount of displacement is measured by a camera (not shown), the holding members 176 are raised together to separate the substrate 107 from the mask 108.
[0005]
After the respective holding members 176 are moved together in the horizontal direction to perform positioning based on the measured positional shift amount, the respective holding members 176 are lowered together and the substrate 107 is placed on the mask 108. In this state, the amount of displacement is measured by a camera. If the amount of displacement is eliminated, the alignment is terminated. If the amount of displacement is not eliminated, the alignment is performed again.
[0006]
By the way, in the conventional alignment apparatus 105, since the edge of the substrate 107 is supported by the hook 179, when the substrate 107 is large, the central portion of the substrate 107 may be bent. If the substrate 107 is bent and the alignment is performed, misalignment is likely to occur, and if the substrate 107 is pressed against the mask 108 while being bent, the substrate 107 will bend when the substrate 107 is pressed against the mask 108. The lip may rub against the mask 108 and damage the device on the substrate 107.
[0007]
[Patent Document 1]
JP-A-2002-241924 (page 3-4, FIG. 2)
[Patent Document 2]
JP-A-9-209127 (page 4, FIG. 1)
[0008]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION The present invention has been made to meet the above-mentioned requirements of the related art, and an object of the present invention is to provide an alignment apparatus capable of aligning a large-sized substrate.
[0009]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 is a mask holder capable of holding a plate-shaped mask, and is disposed above the mask holder, and the plate-shaped substrate is substantially parallel to the mask. A substrate holder that can be held, the mask holder and the substrate holder are configured to be relatively movable, and the mask holder and the substrate holder hold the mask and the substrate, respectively. The alignment device is configured to perform the relative movement and perform alignment between the substrate and the mask, wherein the substrate holder includes an electrostatic suction device, and the electrostatic suction device includes: When the substrate is positioned above the mask held by the mask holder, the alignment device has an adsorption surface that can contact an upper surface of the substrate.
According to a second aspect of the present invention, in the alignment apparatus according to the first aspect, the substrate holder has a rod-shaped temporary holding member, and a lower end of the temporary holding member is below the electrostatic chuck. And a hook protruding above the mask and having a lower end of the temporary holding member on which the substrate can be placed.
According to a third aspect of the present invention, there is provided a film forming apparatus including the alignment apparatus according to any one of the first to second aspects, and a film forming source disposed below the alignment apparatus.
According to a fourth aspect of the present invention, there is provided an alignment method for aligning a substrate and a mask in a vacuum atmosphere, wherein the substrate and the mask are positioned between a mask disposed on a mask holder and an electrostatic suction device disposed on the mask. After arranging the substrate, the substrate is electrostatically attracted to the electrostatic attraction device, and the substrate is moved relative to the mask while the substrate is electrostatically attracted to the substrate holder, This is an alignment method for performing positioning.
The invention according to claim 5 is the alignment method according to claim 4, wherein the electrostatic attraction device is provided with a suction surface that is a flat surface with which the substrate is in contact, and the suction surface is parallel to the mask. Thus, an alignment method is provided in which the electrostatic suction device is arranged and the substrate is electrostatically suctioned to the electrostatic suction device while the substrate is in contact with the suction surface. The invention according to claim 6 is the alignment method according to any one of claims 4 or 5, wherein the substrate is pressed against the mask in a state where the substrate is electrostatically attracted to the electrostatic attraction device. This is an alignment method in which, after measuring the amount of displacement, the substrate is separated from the mask in a state where the substrate is electrostatically attracted to the electrostatic attraction device to perform alignment.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Reference numeral 1 in FIG. 1 indicates an example of a film forming apparatus of the present invention. The film forming apparatus 1 has a transfer chamber 2 and a plurality of film forming chambers 3. Here, the film forming apparatus 1 has three film forming chambers 3, and each of the film forming chambers 3 is connected to the same transfer chamber 2.
[0011]
FIG. 2 is a perspective view showing the film forming chamber 3. Referring to FIG. 2, the film forming chamber 3 has a vacuum chamber 12 as an apparatus main body. In the vacuum chamber 12, a deposition source 13 as a film forming source is arranged on a bottom wall side in the vacuum chamber 12. The alignment device 5 of the present invention is disposed above the evaporation source 13.
[0012]
FIG. 3 is a drawing showing the internal configuration of the alignment device 5. The alignment device 5 includes a shaft portion 60, an XY table 40, a power source 50, a substrate holder 70, and a mask holder 80. The XY table 40 is attached to a surface of the ceiling of the vacuum chamber 12 on the outside of the vacuum chamber 12.
[0013]
The power source 50 has a first elevating motor 51, a second elevating motor 52, and a rotating motor 53, and these motors 51 to 53 are mounted on a mounting table 42 mounted on the XY table 40. Have been. Therefore, those motors 51 to 53 are mounted on the XY table 40 via the mounting table 42.
[0014]
The shaft portion 60 has a triple structure, and includes an outermost outer cylinder 61, an inner cylinder 62 inserted into the outer cylinder 61, and a central axis of the outer cylinder 61 and the inner cylinder 62 inserted through the inner cylinder 62. And a rod-shaped rod 63 located on the line. A cylindrical bellows 44 is mounted vertically on the vacuum chamber 12, and the entire shaft portion 60 is vertically inserted through the bellows 44.
[0015]
Each of the motors 51 to 53 is located from the bottom in the order of the rotation motor 53, the second lifting / lowering motor 52, and the first lifting / lowering motor 51. The rotation motor 53 is located at the center of the shaft portion 60 in the vertical direction. The second elevating motor 52 is located directly above the inner cylinder 62, the first elevating motor 51 is located immediately above the rod 63, and the outer periphery of the outer cylinder 61 is connected to the rotary motor 53. The upper end of 62 is connected to the second elevating motor 52, and the upper end of the rod 63 is connected to the first elevating motor 51, so that the outer cylinder 61, the inner cylinder 62 and the rod 63 are suspended by the respective motors 51 to 53. Has been lowered.
[0016]
A sealing portion 43 is attached to a position below the rotary motor 53, and the sealing portion 43 is hermetically attached to the outer periphery of the outer cylinder 61, and an upper end of the bellows 44 is hermetically connected to the sealing portion 43. The lower end is airtightly connected to the ceiling of the vacuum chamber 12.
[0017]
An opening 13 is formed at a position surrounded by the lower end of the bellows 44 on the top of the vacuum tank 12, and the inside of the bellows 44 and the inside of the vacuum tank 12 are connected through the opening 13. That is, the space between the sealing portion 43 and the outer cylinder 61, the space between the sealing portion 43 and the upper end of the bellows 44, and the space between the top of the vacuum chamber 12 and the lower end of the bellows 44 are airtight. And the inside of the bellows 44 are isolated from the external space.
[0018]
When the rotation motor 53 is activated, the outer cylinder 61 rotates together with the inner cylinder 62 and the rod 63 about its central axis, and when the first motor 51 is activated, the rod 63 moves up and down, causing the second motor 62 to move. When activated, the inner cylinder 62 moves up and down.
[0019]
The lower ends of the outer cylinder 61, the inner cylinder 62, and the rod 63 project into the vacuum chamber 12, respectively. Magnetic fluid seals are provided between the outer cylinder 61 and the sealing portion 43, between the outer cylinder 61 and the inner cylinder 62, and between the inner cylinder 62 and the rod 63, respectively. The inside of the vacuum chamber 12 is also kept airtight when rotating or when the inner cylinder 62 and the rod 63 move up and down.
[0020]
An arm 85 is fixed to a surface of the ceiling of the vacuum chamber 12 inside the vacuum chamber 12, and the mask holder 80 is suspended in the vacuum chamber 12 by the arm 85. In FIG. 3, reference numeral 8 denotes a mask mounted on a mask holder 80.
[0021]
The substrate holder 70 has a plate-shaped device main body 72 and positive and negative electrodes 73 built in the device main body 72. The electrostatic attraction device 71 is formed by the device main body 72 and the positive and negative electrodes 73. It is configured.
[0022]
The device main body 72 is made of an insulating material, and the lower surface of the device main body 72 is used as a suction surface 89. Is applied, the substrate is electrostatically attracted to the attracting surface 89.
[0023]
The lower part of the rod 63 protrudes into the vacuum chamber 12, and the lower end thereof is disposed above the mask 8 on the mask holder 80. The apparatus main body 72 is attached to the lower end of the rod 63 with the suction surface 89 being parallel to the mask 8. When the rod 63 is moved up and down, the apparatus body 72 moves up and down at a position above the mask 8 on the mask holder 80, and is moved in the X-axis direction in a plane parallel to the mask 8 by the XY table 40 and the rotary motor 53. , Y-axis direction, and θ direction.
[0024]
A plurality of coiled springs 77 are vertically arranged on the apparatus main body 72. At the center position of each spring 77 of the apparatus main body 72, through holes each having a diameter smaller than the diameter of the spring 77 are formed, and a rod-shaped temporary holding member 76 is inserted into each of the through holes and the spring 77. Have been.
[0025]
A flange having a diameter larger than the diameter of the spring 77 is provided at the upper end of each temporary holding member 76, and the entire temporary holding member 76 is supported by the spring 77 by placing the flange on the upper end of the spring 77. I have.
[0026]
A lower end of the temporary holding member 76 is located above the mask 8 and protrudes below a suction surface 89 of the apparatus main body 72, and a hook 79 on which a plate-shaped substrate described later can be placed is provided at the lower end. The hook 79 and the temporary holding member 76 constitute a mechanical chuck 75.
[0027]
The lower end of the inner cylinder 62 is located at a position lower than the apparatus main body 72, and the same number of pressing portions 78 as the number of the temporary holding members 76 are attached to the lower end thereof via an attachment plate 91. Each pressing portion 78 is located vertically above the temporary holding member 76. When the inner cylinder 62 is lowered from above while the apparatus main body 72 is stationary, the lower end of the pressing portion 78 is temporarily held by the temporary holding member 76. The upper end 76 is in contact with the flange.
[0028]
When the pressing portion 78 is further lowered, the spring 77 is contracted and the temporary holding member 76 is lowered, and the gap between the hook 79 and the apparatus main body 72 is increased. It is inserted between the device main body 72. Reference numeral 7 in FIG. 3 indicates a substrate inserted between the hook 79 and the apparatus main body 72. In this state, the substrate 7 is located above the hook 79 in a state of not contacting the suction surface 89. In FIG. 3, the transfer robot is omitted.
[0029]
When the pressing portion 78 is raised in this state, the spring 77 is extended by the restoring force, and the temporary holding member 76 is raised. When the hook 79 is raised by the raising of the temporary holding member 76, the hook 79 comes into contact with the edge of the substrate 7, and when the hook 79 is further raised, the substrate 7 is put on the hook 79 from the transfer robot. When the substrate 7 placed on the hook 79 is lifted higher than the arm of the transfer robot, the arm of the transfer robot can be retracted from between the suction surface 89 and the mask 8.
[0030]
The spring 77 is in a contracted state even when the flange is not pressed, and always exerts an upward force on the flange, so that the substrate is not placed on the hook 79 and the flange is not pressed. Occasionally, the hook 79 is lifted upward and comes into contact with the suction surface 89. Therefore, when the spring 77 extends while the substrate 7 is placed on the hook 79, the substrate 7 comes into contact with the suction surface 89.
[0031]
A vacuum evacuation system 59 is connected to the vacuum chamber 12. A vacuum atmosphere of a predetermined pressure is formed in the vacuum chamber 12 by the vacuum evacuation system 59 in advance, and in a state where the surface of the substrate 7 is in contact with the suction surface 89. When a positive or negative voltage is applied to the electrode 73, the substrate 7 is electrostatically attracted while being in close contact with the attracting surface 89.
[0032]
As described above, since the suction surface 89 is formed by the lower surface of the apparatus main body 72, the substrate 7 is held below the apparatus main body 72 when the substrate 7 is electrostatically suctioned. Since the substrate 7 is electrostatically attracted not only at the edge but also at the center thereof, the substrate 7 in the electrostatically attracted state does not bend.
[0033]
Since the suction surface 89 is parallel to the mask 8, the substrate 7 electrostatically suctioned to the suction surface 89 is parallel to the mask 8. Therefore, when the apparatus main body 72 is lowered in a direction perpendicular to the mask 8, the substrate 7 is lowered while maintaining a state parallel to the mask 8, and is pressed against the surface of the mask 8.
[0034]
A CCD camera 55 is provided outside the vacuum chamber 12, and the inside of the vacuum chamber 12 can be observed through a window 56. An alignment mark (not shown) is provided on the substrate 7 and the mask 8, and the alignment mark between the substrate 7 and the mask 8 is maintained while the vacuum atmosphere in the vacuum chamber 12 is maintained and the substrate 7 is pressed against the mask 8. Observation is performed to determine the amount of displacement between the substrate 7 and the mask 8 even in a plane parallel to the mask 8.
After calculating the amount of displacement, the substrate 7 is vertically moved with respect to the mask 8 in a state where the substrate 7 is electrostatically attracted to the apparatus main body 72, and is separated from the mask 8.
[0035]
Next, the substrate 7 is moved together with the apparatus main body 72 in a plane parallel to the mask 8 by moving the substrate 7 in the X-axis direction, the Y-axis direction, and the θ-direction so as to eliminate the amount of displacement. When the substrate 7 is lowered vertically with respect to the mask 8 after the completion of the alignment, the substrate 7 is pressed against the mask 8 in a state where the amount of displacement has disappeared.
[0036]
According to the alignment device 5 of the present invention, the alignment is performed while the substrate 7 is electrostatically attracted to the electrostatic attraction device 71. As described above, since the substrate 7 does not bend when it is electrostatically attracted, it is difficult to displace the substrate 7 during alignment.
[0037]
Further, since the substrate 7 is pressed against the mask 8 while maintaining the state parallel to the mask 8, the substrate 7 and the mask 8 are hardly rubbed, and a device such as a wiring film is formed on the substrate in advance. But the device is hard to be damaged.
[0038]
Next, a process of forming a thin film using the above-described film forming apparatus 1 will be described.
A vacuum atmosphere of a predetermined pressure is formed in the transfer chamber 2 and the vacuum chamber 12 in advance, and a substrate transfer device 4 as shown in FIG. 7 is carried into the transfer chamber 2 from the substrate transfer device 4.
[0039]
Next, the transfer chamber 2 is connected to the film formation chamber 3, and the substrate 7 is placed on the arm of the transfer robot 9 installed in the transfer chamber 2 as shown in FIG. After being inserted between the hook 79 of the temporary holding member 76 and the suction surface 89, the substrate 7 is put on the hook 79 of the temporary holding member 76 and temporarily held by the substrate holder 70.
[0040]
In a state in which the vacuum atmosphere in the vacuum chamber 12 is maintained, the substrate 7 is brought into contact with the suction surface 89 as shown in FIG. The arm of the transfer robot 9 is retracted into the transfer chamber 2 as shown in FIG.
[0041]
In a state where the substrate 7 is electrostatically adsorbed on the electrostatic adsorption device 71, the substrate 7 is pressed against the surface of the mask 8 (FIG. 6D), and the amount of displacement is obtained by the CCD camera 55 as shown in FIG. After that, as shown in FIG. 7F, the substrate 7 is separated from the mask 8 in a state where the substrate 7 is electrostatically attracted to the electrostatic attraction device 71. Next, in a vacuum atmosphere, the substrate 7 is moved in a plane parallel to the mask 8 in the X-axis direction, the Y-axis direction, and the θ direction to perform positioning (FIG. 7G).
[0042]
After the alignment, the substrate 7 is pressed against the mask 8 in a state where the substrate 7 is electrostatically attracted to the electrostatic attraction device 71 as shown in FIG. 7H, and the substrate 7 is moved by the CCD camera 55 as shown in FIG. The positional deviation between the mask and the mask 8 is obtained again. When it is confirmed that the positional deviation has disappeared, the alignment is terminated. When the positional deviation has not disappeared, the alignment is continued until the positional deviation disappears. Repeat step i).
[0043]
As described above, when the alignment apparatus of the present invention is used, it is difficult to displace the substrate 7 when it is aligned, and accurate alignment is performed. The time required is reduced.
[0044]
A vapor deposition material is previously arranged in the vapor deposition source 13. After the alignment is completed, when the vapor deposition material is heated, the vapor of the vapor deposition material is released into the vacuum chamber 12. An opening having a predetermined pattern is formed in the mask 8, and the released vapor reaches the surface of the substrate 7 through the opening of the mask 8 to grow a thin film.
[0045]
When the thin film has grown to a predetermined thickness, the film formation is completed, and the substrate 7 is separated from the mask 8. With the arm of the transfer robot 9 placed below the substrate 7 and above the mask 8, the suction force on the substrate 7 is released and the hook 79 is lowered, and the substrate 7 is transferred from the hook 79. It is put on the arm of the robot 9.
[0046]
After the substrate 7 is once returned to the transfer chamber 2 by the transfer robot 9, the substrate 7 is sequentially sent to a new film formation chamber 3, and if a film is formed, a plurality of thin films are stacked on the surface of the substrate 7. After the film formation in each film forming chamber 3 is completed, the substrate 7 is taken out of the transfer chamber 2 to the substrate transfer device 4 to obtain the substrate 7 on which thin films are stacked.
[0047]
In the above, the case where the positioning is performed by moving the substrate 7 in a plane parallel to the mask 8 has been described. However, the present invention is not limited to this, and the mask holder 80 is connected to the moving unit, and the substrate 7 is moved. When the mask 8 is moved in a plane parallel to the substrate 7 by the moving means while the substrate 8 is kept stationary, or when the substrate 7 is moved in a plane Moving in a plane parallel to.
[0048]
The method of pressing the substrate 7 against the mask 8 is not particularly limited. For example, the substrate 7 may be stopped in a state where the substrate 7 is electrostatically attracted to the electrostatic attraction device 71, and the mask 8 may be vertically moved with respect to the substrate 7. Alternatively, the case where the mask 7 is raised while the substrate 7 is lowered is also included.
[0049]
The timing of applying a voltage to the positive and negative electrodes 73 of the electrostatic suction device 71 is not particularly limited, and the voltage may be applied after the substrate 7 is in close contact with the suction surface 89, or the substrate 7 may be in close contact with the suction surface 89. A voltage may be applied beforehand.
[0050]
The surface of the apparatus main body 72 constituting the suction surface 89 does not need to be flat, and the upper surface of the substrate 7 can be contacted and both the central portion and the edge portion of the substrate can be electrostatically attracted at the same time. For example, the suction surface may be formed by, for example, a flat surface of the device main body 72 on which the protrusions and protrusions are located, of the surface on which the unevenness is formed.
The type of the film forming source is not limited to the evaporation source, and a sputtering source or the like can be used as the film forming source of the film forming apparatus of the present invention.
[0051]
【The invention's effect】
According to the present invention, since the alignment is performed while the substrate is electrostatically attracted to the electrostatic attraction device, the substrate does not bend and the displacement is hard to be set. Therefore, since the alignment is performed more accurately than in the related art, there is no need to perform the alignment again, and the time required for the alignment is reduced. Further, since the substrate is pressed against the mask in a state where the substrate is electrostatically attracted to the electrostatic attraction device, the substrate and the mask are hardly rubbed, and the substrate is hardly damaged.
[Brief description of the drawings]
FIG. 1 is a perspective view illustrating an example of a film forming apparatus used in the present invention. FIG. 2 is a perspective view illustrating an example of a film forming chamber. FIG. 3 is a diagram illustrating an internal configuration of an alignment apparatus of the present invention. FIG. 4 is a diagram illustrating a state in which a substrate is electrostatically attracted to an electrostatic chuck device. FIG. 5 is a diagram illustrating a state in which the substrate is pressed against a mask. FIG. 6 (a) to (d): Alignment process 7 (e) to 7 (i): Diagrams illustrating the latter half of the alignment process [FIG. 8] Diagrams illustrating a conventional alignment apparatus [Description of symbols]
DESCRIPTION OF SYMBOLS 1 ... Film-forming apparatus 5 ... Alignment apparatus 7 ... Substrate 8 ... Mask 12 ... Vacuum tank 13 ... Film-forming source (vapor deposition source) 70 ... Substrate holder 71 ... Electrostatic adsorption apparatus 72 ... Equipment Main body 73 Electrode 75 Mechanical chuck 76 Temporary holding member 79 Hook 80 Mask holder 89 Suction surface

Claims (6)

板状のマスクを保持可能なマスクホルダと、
前記マスクホルダの上方に配置され、板状の基板を前記マスクに対して略平行に保持可能な基板ホルダとを有し、
前記マスクホルダと前記基板ホルダとは相対的な移動が可能に構成され、
前記マスクホルダと前記基板ホルダに、前記マスクと前記基板をそれぞれ保持させた状態で、前記相対的な移動を行い、前記基板と前記マスクとの位置合わせを行えるように構成されたアライメント装置であって、
前記基板ホルダは静電吸着装置を有し、
前記静電吸着装置は、前記マスクホルダに保持された前記マスク上方に前記基板を位置させた場合に、前記基板の上側表面に当接可能な吸着面を有するアライメント装置。A mask holder capable of holding a plate-shaped mask,
A substrate holder that is disposed above the mask holder and that can hold a plate-like substrate substantially parallel to the mask;
The mask holder and the substrate holder are configured to be capable of relative movement,
An alignment apparatus configured to perform the relative movement in a state where the mask and the substrate are held by the mask holder and the substrate holder, respectively, so that the substrate and the mask can be aligned. hand,
The substrate holder has an electrostatic suction device,
The alignment device, wherein the electrostatic suction device has a suction surface capable of contacting an upper surface of the substrate when the substrate is positioned above the mask held by the mask holder. 前記基板ホルダは棒状の仮保持部材を有し、前記仮保持部材の下端は、前記静電吸着装置よりも下方であって、前記マスクよりも上方位置に突き出され、前記仮保持部材の下端に前記基板を載置可能なフックが形成された請求項１記載のアライメント装置。The substrate holder has a rod-shaped temporary holding member, and a lower end of the temporary holding member is located below the electrostatic suction device and protrudes to a position above the mask. The alignment apparatus according to claim 1, wherein a hook on which the substrate can be placed is formed. 請求項１又は請求項２のいずれか１項記載のアライメント装置と、前記アライメント装置の下方に配置された成膜源とを有する成膜装置。3. A film forming apparatus, comprising: the alignment apparatus according to claim 1; and a film forming source disposed below the alignment apparatus. 基板とマスクとを真空雰囲気中で位置合わせを行うアライメント方法であって、
マスクホルダに配置されたマスクと、前記マスク上に配置された静電吸着装置との間に前記基板を配置した後、前記基板を前記静電吸着装置に静電吸着し、前記基板が前記基板ホルダに静電吸着された状態で、前記基板を前記マスクとを相対的に移動させ、位置合わせを行うアライメント方法。An alignment method for aligning a substrate and a mask in a vacuum atmosphere,
After arranging the substrate between a mask disposed on a mask holder and an electrostatic adsorption device disposed on the mask, the substrate is electrostatically adsorbed to the electrostatic adsorption device, and the substrate is An alignment method in which the substrate is relatively moved with respect to the mask in a state where the substrate is electrostatically attracted to a holder, and alignment is performed. 前記静電吸着装置に前記基板が接触する平面である吸着面を設け、前記吸着面が前記マスクに対して平行になるように前記静電吸着装置を配置し、前記基板を前記吸着面に接触させた状態で前記静電吸着装置に静電吸着する請求項４記載のアライメント方法。Providing the electrostatic suction device with a suction surface that is a plane contacting the substrate, disposing the electrostatic suction device such that the suction surface is parallel to the mask, and bringing the substrate into contact with the suction surface. 5. The alignment method according to claim 4, wherein the device is electrostatically attracted to the electrostatic attraction device in a state in which the alignment is performed. 前記基板を前記静電吸着装置に静電吸着した状態で、前記マスクに押し当てて位置ずれ量を測定した後、前記基板を前記静電吸着装置に静電吸着した状態で、前記マスクから離して位置合わせを行う請求項４又は請求項５のいずれか１項記載のアライメント方法。In a state where the substrate is electrostatically attracted to the electrostatic chuck, the amount of displacement is measured by pressing the substrate against the mask, and then the substrate is separated from the mask while the substrate is electrostatically attracted to the electrostatic chuck. The alignment method according to claim 4, wherein the alignment is performed by performing the alignment.
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