JP2004151009A - Temperature sensor mounting structure of driving integrated circuit, and temperature sensor mounting structure of printed wiring board - Google Patents

Temperature sensor mounting structure of driving integrated circuit, and temperature sensor mounting structure of printed wiring board Download PDF

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Publication number
JP2004151009A
JP2004151009A JP2002318283A JP2002318283A JP2004151009A JP 2004151009 A JP2004151009 A JP 2004151009A JP 2002318283 A JP2002318283 A JP 2002318283A JP 2002318283 A JP2002318283 A JP 2002318283A JP 2004151009 A JP2004151009 A JP 2004151009A
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Prior art keywords
temperature sensor
integrated circuit
wiring board
driving integrated
printed wiring
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JP4173717B2 (en
Inventor
Seiji Fukui
誠二 福井
Hitoshi Masuda
仁史 増田
Toshio Yabuki
俊生 矢吹
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Daikin Industries Ltd
Panasonic Holdings Corp
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Daikin Industries Ltd
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature sensor mounting structure of a driving integrated circuit capable of dismounting a temperature sensor simply and inexpensively, and measuring precisely the temperature of the driving integrated circuit, and a temperature sensor mounting structure of a printed wiring board. <P>SOLUTION: A plurality of lead pins 3 are inserted into holes on a printed wiring board 10 and fixed by solder in the state where one surface of an IPM 2 is fixed on a heat sink 1 and the other surface of the IPM 2 is faced to the printed wiring board 10 so as to cover the penetration holes 4 on the printed wiring board 10. Lead pins 7 of a temperature sensor 5 are inserted into lead pin mounting holes 9 on the printed wiring board 10 and electrically connected to the wiring by solder 8 in the state where a sensor body 6 of the temperature sensor 5 is in contact with a part facing to the penetration holes 4 on the other surface of the IPM 2. The sensor body 6 of the temperature sensor 5 is coated with a silicone resin 15. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
この発明は、駆動用集積回路の温度センサ取付構造およびプリント配線基板の温度センサ取付構造に関する。
【０００２】
【従来の技術】
従来、駆動用集積回路の温度センサ取付構造としては、図３に示すものがある。この駆動用集積回路の温度センサ取付構造は、図示しない複数の放熱フィンを有するヒートシンク７１と、駆動用集積回路としてのインテリジェントパワーモジュール（以下、ＩＰＭという）７２と、プリント配線基板７３と、温度センサ７４とを備える。
【０００３】
上記ＩＰＭ７２の一面を、ヒートシンク７１の一面に密着させて固定すると共に、ＩＰＭ７２の他面から延びる複数のリードピン７７を、プリント配線基板７３のリードピン用取付穴に挿入して、ハンダ７８でプリント配線基板７３の配線に電気接続している。このようにして、上記ＩＰＭ７２をヒートシンク７１で冷却すると共に、プリント配線基板７３に実装している。
【０００４】
一方、上記温度センサ７４は、センサ本体８０と、このセンサ本体８０の一端に連なる取付部８１と、センサ本体８０の他端から延びるリード線８２と、このリード線８２が連結されているコネクタ８３とを有する。上記温度センサ７４の取付部８１を、上記ヒートシンク７１の上記一面上、かつ、上記ＩＰＭ７２近傍にビス８５で固定して、上記センサ本体８０を上記ヒートシンク７１の上記一面に密着させている。また、図示しないが、上記コネクタ８３を、プリント配線基板７３のヒートシンク７１側の面に搭載して、ハンダ７８で配線に電気接続している。
【０００５】
上記温度センサ７４は、ヒートシンク７１の温度を測ることによって、ＩＰＭ７２の温度を間接的に測定している。
【０００６】
また、図示しないが、プリント配線基板にセンサを取り付けるセンサ取付構造としては、配線基盤に固定された熱容量の大きなブロック体の凹所に赤外線センサを収容して、この赤外線センサの周りをブロック体の内壁面で囲むと共に、この赤外線センサを台座部を介して、プリント配線基板に取り付けたものがある（特開平１１−２３７３３４号公報参照。）。
【０００７】
【特許文献１】
特開平１１−２３７３３４号公報（第１図）
【０００８】
【発明が解決しようとする課題】
しかしながら、図３に示す上記従来の駆動用集積回路の温度センサ取付構造では、故障等によって温度センサ７４を取り代える必要性が生じた場合、温度センサ７４がヒートシンク７１とプリント配線基板７３との間の狭い空間に配置されているため、温度センサ７４の取り外し作業の邪魔になるプリント配線基板７３をヒートシンク７１から引き離さなければならない。そのため、上記プリント配線基板７３の配線に接続されているＩＰＭ７２の多数のリードピン７７の全てをプリント配線基板７３からハンダ７８を溶かして取り外さなければならない。このように、上記従来の駆動用集積回路の温度センサ取付構造では、温度センサ７４を取り代えるために、ＩＰＭ７２の多数のリードピン７７のハンダ７８を溶かさなければならないため、温度センサ７４の取り代えに多大な労力を要して取り代えのコストが高くなるという問題がある。
【０００９】
また、上記温度センサ７４は、ヒートシンク７１の温度を測ることによって、ＩＰＭ７２の温度を間接的に測定するので、ＩＰＭ７２の温度を精密に測定できないという問題もある。
【００１０】
一方、上記特許文献１のセンサ取付構造は、赤外線センサ用で、しかも、ブロック体および台座部を有するため、駆動用集積回路の温度測定をするための温度センサには適用できないという問題がある。
【００１１】
そこで、この発明の目的は、簡単安価に温度センサを取り代えることができると共に、駆動用集積回路の温度を精密に測定できる駆動用集積回路の温度センサ取付構造、および、プリント配線基板の温度センサ取付構造を提供することにある。
【００１２】
【課題を解決するための手段】
上記目的を達成するため、請求項１の発明の駆動用集積回路の温度センサ取付構造は、
放熱手段に一面が固定された駆動用集積回路と、
上記駆動用集積回路が、その駆動用集積回路の他面が対向するようにして実装される一方、上記駆動用集積回路の上記他面に対向する貫通穴と、この貫通穴の側方に位置するリードピン用取付穴とを有するプリント配線基板と、
上記貫通穴に対向すると共に上記貫通穴に挿通可能な寸法を有し、かつ、上記駆動用集積回路の上記他面に直接または間接的に接触しているセンサ本体と、上記リードピン用取付穴に挿入されて上記プリント配線基板の配線に電気接続されたリードピンとを有する温度センサと
を備えたことを特徴としている。
【００１３】
尚、この明細書で「間接的に接触」とは、２つの部材の間に樹脂層、薄い金属層および接着層等が存して、その層を介して２つの部材が互いに接続されていることを言う。
【００１４】
上記請求項１の発明の駆動用集積回路の温度センサ取付構造において、駆動用集積回路の温度センサ取付構造を組み立てるときには、例えば、上記駆動用集積回路の一面を上記放熱手段に固定する一方、上記駆動用集積回路の他面を上記プリント配線基板の上記貫通穴および上記プリント配線基板に対向させて、上記駆動用集積回路を上記プリント配線基板に実装する。次に、上記プリント配線基板の上記駆動用集積回路側と反対側から、上記温度センサのセンサ本体を、上記貫通穴を挿通させて、上記駆動用集積回路の他面に直接または間接的に接触させた状態で、上記プリント配線基板の上記リードピン用取付穴に上記温度センサのリードピンを挿入して配線にハンダ等で固定して、上記プリント配線基板の配線に上記リードピンを電気接続する。
【００１５】
また、上記駆動用集積回路の温度センサ取付構造から温度センサを取り換えるときには、例えば、ハンダ等でプリント配線基板に固定されている温度センサのリードピンをプリント配線基板から取り外した上で、駆動用集積回路に接触している温度センサのセンサ本体を上記貫通穴を通して駆動用集積回路から取り外して、プリント配線基板および駆動用集積回路から温度センサを取り外す。次に、上記プリント配線基板における駆動用集積回路側と反対側から、新しい温度センサのセンサ本体を、上記貫通穴を挿通させて、上記駆動用集積回路の一面に直接または間接的に接触させた状態で、新しい温度センサのリードピンを上記リードピン取付穴に挿入してプリント配線基板の配線にハンダ等で固定して、上記リードピンを配線に電気接続する。
【００１６】
上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、駆動用集積回路の温度センサ取付構造から温度センサを取り代えるときに、従来の駆動用集積回路の温度センサ取付構造のように、プリント配線基板に実装されている駆動用集積回路を、プリント配線基板から取り外す必要がなくて、温度センサのリードピンをプリント配線基板から取り外すと共に、温度センサのセンサ本体を駆動用集積回路から取り外して上記貫通穴を通して取り出すだけで、駆動用集積回路から温度センサを取り外すことができる。また、新しい温度センサのセンサ本体を、上記貫通穴を挿通させて、駆動用集積回路に接触させた状態で、温度センサのリードピンを上記リードピン取付穴に挿入してハンダ等で固定するだけで、新しい温度センサを駆動用集積回路に取り付けることができる。したがって、温度センサを取り代えるときの労力とコストを大幅に低減できる。
【００１７】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサは、被温度測定物である駆動用集積回路に直接または間接的に接触するので、放熱手段の温度を介して駆動用集積回路の温度を間接的に測定する従来例と比較して、駆動用集積回路の温度を精密に測定できる。
【００１８】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、放熱手段、駆動用集積回路、プリント配線基板および温度センサのみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００１９】
また、請求項２の発明の駆動用集積回路の温度センサ取付構造は、請求項１に記載の駆動用集積回路の温度センサ取付構造において、上記リードピン用取付穴は、上記貫通穴に連通していることを特徴としている。
【００２０】
上記請求項２の発明の駆動用集積回路の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、温度センサのセンサ本体をプリント配線基板の反駆動用集積回路側から駆動用集積回路側へ貫通穴を挿通して、上記リードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、リードピン用取付穴に直接挿通してリードピン用取付穴に配置できる。したがって、リードピンを、単純かつ安価な例えばＬ字型であっても、簡単にリードピン用取付穴に挿通できて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００２１】
また、請求項３の発明の駆動用集積回路の温度センサ取付構造は、請求項１または２に記載の駆動用集積回路の温度センサ取付構造において、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたことを特徴としている。
【００２２】
上記請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたので、上記センサ本体を上記駆動用集積回路に確実に機械的に固定できると共に、温度センサおよび駆動用集積回路の絶縁性を向上できる。
【００２３】
また、上記請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体が絶縁部材で被覆されているので、駆動用集積回路からセンサ本体への熱伝導が向上し、かつ、熱容量が少なくなって温度測定精度が向上する。
【００２４】
また、請求項４の発明のプリント配線基板の温度センサ取付構造は、
貫通穴と、この貫通穴の側方に位置するリードピン用取付穴とを有するプリント配線基板と、
このプリント配線基板の貫通穴に対向すると共に上記貫通穴に挿通可能な寸法を有し、かつ、上記プリント配線基板の一方の側に露出するセンサ本体と、上記センサ本体から延びて上記リードピン用取付穴に挿入されて、上記プリント配線基板の配線と電気接続されるリードピンとを有する温度センサと
を備えたことを特徴としている。
【００２５】
上記請求項４の発明のプリント配線基板の温度センサ取付構造によれば、上記プリント配線基板の一方の側に露出する温度センサのセンサ本体の露出面を、駆動用集積回路等の被温度測定物の温度測定面に直接または間接的に接触固定して、被温度測定物の温度測定を行うことができる。したがって、被温度測定物にセンサ本体を直接または間接的に接触させた状態で被温度測定物の温度測定ができるので、被温度測定物の温度を正確に測定できる。
【００２６】
また、上記請求項４の発明のプリント配線基板の温度センサ取付構造のセンサ本体を、駆動用集積回路等の被温度測定物に直接または間接的に接触させた状態で、この被温度測定物をプリント配線基板に実装して被温度測定物の温度センサ取付構造を構成すれば、上記発明の駆動用集積回路の温度センサ取付構造と同様に、この被温度測定物の温度センサ取付構造から温度センサを簡単安価に取り代えることができる。
【００２７】
また、請求項５の発明のプリント配線基板の温度センサ取付構造は、請求項４に記載のプリント配線基板の温度センサ取付構造において、上記リードピン用取付穴は、上記貫通穴に連通していることを特徴としている。
【００２８】
上記請求項５の発明のプリント配線基板の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、プリント配線基板に温度センサを固定するとき、上記請求項２の発明の駆動用集積回路の温度センサ取付構造と同様に、上記温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、リードピン用取付穴に直接挿通してリードピン用取付穴に配置できて、リードピンを単純かつ安価な例えばＬ字型にすることができる。したがって、簡単にリードピン用取付穴にリードピンを挿通できて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００２９】
【発明の実施の形態】
図１（Ａ）は、この発明の一実施形態の駆動用集積回路の温度センサ取付構造の断面図である。
【００３０】
図１（Ａ）に示すように、この駆動用集積回路の温度センサ取付構造は、放熱手段の一例としてのヒートシンク１と、駆動用集積回路の一例としてのインテリジェントパワーモジュール（以下、ＩＰＭという）２と、温度センサ５と、プリント配線基板１０と、絶縁部材の一例としてのシリコン樹脂１５とを備える。
【００３１】
上記プリント配線基板１０は、図２（Ａ）に示す略楕円形状の貫通穴４と、この貫通穴４に連通する２つの略スリット形状のリードピン用取付穴９，９とを有する。このリードピン用取付穴９，９は、互いに対向している。
【００３２】
上記ＩＰＭ２は、図１（Ａ）に示すように、略直方体形状をしていて、ＩＰＭ２の一面は、ヒートシンク１に密着した状態で固定しており、他面は、貫通穴４を覆うようにプリント配線基板１０の非配線側に対向している。上記ＩＰＭ２の複数のリードピン３，３，３・・・・・を、プリント配線基板の図示しない穴に挿通して図示しない配線にハンダ８で電気接続している。これにより、上記ＩＰＭ２をプリント配線基盤１０に機械的に固定している。
【００３３】
一方、上記温度センサ５は、図２（Ｂ）に示すように、略直方体形状で上記貫通穴４に挿通できる大きさのセンサ本体６と、このセンサ本体６の両側から延びる略Ｌ字形状の２本のリードピン７からなる。上記温度センサ５のセンサ本体６を、上記ＩＰＭ２の上記他面の貫通穴４に対向する部分に密着させた状態で、二本の略Ｌ字状のリードピン７，７を上記リードピン用取付穴９，９に挿入している。そして、上記リードピン７，７の先端をハンダ８でプリント配線基板１０の図示しない配線と電気接続している。また、上記温度センサ５のセンサ本体６を絶縁部材の一例としてのシリコン樹脂１５でコーティングして、温度センサ５をＩＰＭ２に機械的に固定すると共に、絶縁保護している。
【００３４】
このシリコン樹脂１５は、図１（Ａ）および図１（Ｂ）に示すように、シリコン樹脂１５がセンサ本体６とＩＰＭ２との間に存在しない状態でセンサ本体６を被覆している。もっとも、上記シリコン樹脂１５の薄い層がセンサ本体６とＩＰＭ２との間に存在しても良い。
【００３５】
上記構成において、故障等によって駆動用集積回路の温度センサ取付構造から温度センサ５のみを取り代える必要性が生じたときには、プリント配線基板１０にハンダ８で固定されている温度センサ５のリードピン７を、ハンダ８を溶かしてリードピン取付穴９から取り外して、ヒートシンク１に接触している温度センサ５のセンサ本体６を貫通穴４を通してＩＰＭ２からシリコン樹脂１５ごと取り外す。その後、プリント配線基板１０のリードピン取付穴９付近に残っているハンダを取り除くと共に、ＩＰＭ２の表面に残ったシリコン樹脂１５をきれいに取り除く。
【００３６】
次に、上記プリント配線基板１０におけるＩＰＭ２に対向していない側から、新しい温度センサのセンサ本体を、上記略楕円形の貫通穴４を挿通させて、ＩＰＭ２に接触させた状態で、新しい温度センサのリードピンをリードピン取付穴９に挿入してハンダ等で固定して、上記リードピンをプリント配線基板１０の配線に電気接続する。その後、新しい温度センサのセンサ本体の周りをシリコン樹脂等の絶縁部材でコーティングして、新しい温度センサのセンサ本体をＩＰＭ２に直接または間接的に接触固定する。
【００３７】
上記実施形態の駆動用集積回路の温度センサ取付構造によれば、故障等によって駆動用集積回路の温度センサ取付構造から温度センサ５のみを取り代えるときに、従来の駆動用集積回路の温度センサ取付構造とは違って、プリント配線基板１０の複数のＩＰＭ実装用のリードピン用取付穴にハンダ付けされているＩＰＭ２の多数のリードピン３を、ハンダ８を溶かしてプリント配線基板１０から取り外す必要がなくて、プリント配線基板１０からＩＰＭ２を引き離す必要がなくて、温度センサ５の２本のリードピン７をプリント配線基板１０から取り外すと共に、温度センサ５のセンサ本体１０をシリコン樹脂１５と共に貫通穴４を通してＩＰＭ２から取り外すだけで、駆動用集積回路の温度センサ取付構造から温度センサ５を取り外すことができる。また、新しい温度センサのセンサ本体を貫通穴を４挿通させてＩＰＭ２の一面に接触させた状態で、新しい温度センサのリードピンをスリット形状のリードピン取付穴９に挿入してハンダ等で固定するだけで、駆動用集積回路の温度センサ取付構造に新しい温度センサを取り付けることができる。したがって、温度センサ５を取り代えるときの労力とコストを大幅に低減できる。
【００３８】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、温度センサ５は、被温度測定物であるＩＰＭ２に直接的に接触しているので、ヒートシンクの温度を測ることによってＩＰＭの温度を間接的に測定する従来例と比較して、ＩＰＭ２の温度を正確に測定できる。
【００３９】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、ヒートシンク１、ＩＰＭ２、プリント配線基板１０および温度センサ５のみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００４０】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、温度センサ５のセンサ本体６をプリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通して、温度センサ５のリードピン７をプリント配線基板１０の配線側から貫通穴４に連通しているリードピン用取付穴９に挿通配置できるので、リードピン７を、この実施形態のように単純で安価なＬ字型等の形状をしていても、簡単にリードピン用取付穴９，９に挿通できる。したがって、温度センサ５および駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００４１】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、センサ本体６をシリコン樹脂１５でコーティングしたので、センサ本体６をＩＰＭ２に確実に接触させて固定できると共に、温度センサ５およびＩＰＭ２の絶縁性を向上できる。また、上記ＩＰＭ２からセンサ本体６への伝導性が上記シリコン樹脂１５で向上するから温度測定精度が向上する。
【００４２】
尚、上記実施形態の駆動用集積回路の温度センサ取付構造では、温度センサ５のセンサ本体６を、プリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通すると共に、温度センサ５のＬ字形状のリードピン７を、リードピン用取付穴９に挿通配置した後、ハンダ８で固定してプリント配線基板１０の配線に電気接続したが、温度センサ５のセンサ本体６を、プリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通して、温度センサのＬ字形状のリードピン７を、貫通穴４からその貫通穴４に連通しているリードピン用取付穴９に移動させた後、ハンダ８で固定してプリント配線基板１の配線に電気接続しても良い。
【００４３】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、上記シリコン樹脂１５がセンサ本体６とＩＰＭ２との間に存在しない状態で、温度センサ５のセンサ本体６をＩＰＭ２に直接的に接触させたが、シリコン樹脂がセンサ本体とＩＰＭとの間に薄い層となって存在した状態で、温度センサのセンサ本体をＩＰＭ２に間接的に接触させても良い。また、センサ本体とＩＰＭを、接着層または薄い金属層を介して間接的に接触させても良い。
【００４４】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、図２（Ａ）に示すように、スリット形状のリードピン取付穴９を略楕円形状の貫通穴４に連通させていたが、図２（Ｃ）に示すように、プリント配線基板の貫通穴３４と、この貫通穴３４の側方の二つのリードピン取付穴３９とを連通しないようにすると共に、夫々略楕円形状と略丸穴形状にして、図２（Ｄ）に示す温度センサ５５のセンサ本体５６の側面から延びる鉤形状のリードピン５７の先端部を、プリント配線基板の配線側からリードピン取付穴３９に挿入して固定しても良い。
【００４５】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、プリント配線基板１０の貫通穴４を略楕円形状にすると共に、リードピン取付穴９をスリット形状にしたが、この発明の駆動用集積回路の温度センサ取付構造では、プリント配線基板のセンサ本体用の貫通穴とこの貫通穴の側方の二つのリードピン取付穴は、楕円、丸穴、スリット形状に限らずどのような形状であっても良い。
【００４６】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、絶縁部材としてシリコン樹脂１５を用いたが、絶縁部材としてガラス樹脂やエポキシ樹脂等を用いても良い。
【００４７】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、温度センサ５をシリコン樹脂１５でコーティングしたが、必ずしもシリコン樹脂等の絶縁部材でコーティングする必要はない。
【００４８】
図１（Ａ）において、ＩＰＭ２およびシリコン樹脂１５を取り除いた状態にすると、プリント配線基板の温度センサ取付構造になる。
【００４９】
このプリント配線基板の温度センサ取付構造を用いれば、センサ本体６をＩＰＭ等の被温度測定物に直接または間接的に接触させた状態で、ＩＰＭ等の被温度測定物の温度測定ができるので、被温度測定物の温度を正確かつ簡単に測定できて有益である。
【００５０】
また、このプリント配線基板の温度センサ取付構造によれば、温度センサを簡単安価に取り代えることができる。
【００５１】
上記実施形態では、プリント配線基板１０のＩＰＭ２に面する側と反対側を配線側としたが、プリント配線基板の両側に配線を設けても良い。
【００５２】
上記実施形態では、放熱手段の一例としてヒートシンクを述べたが、放熱手段は、熱を運んで放熱するヒートパイプ等の伝熱手段であっても良い。
【００５３】
【発明の効果】
以上より明らかなように、請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、駆動用集積回路の一面を放熱手段に固定する一方、駆動用集積回路の他面がプリント配線基板の貫通穴に対向した状態で駆動用集積回路をプリント配線基板に実装した上で、この貫通穴に挿通可能な寸法を有する温度センサのセンサ本体を、上記駆動用集積回路の上記他面に直接または間接的に接触させて、上記プリント配線基板のリードピン用取付穴に温度センサのリードピンを挿入固定したので、駆動用集積回路の温度センサ取付構造から温度センサを取り代えるときに、プリント配線基板に実装されている駆動用集積回路をプリント配線基板から取り外す必要がなくて、温度センサのリードピンをプリント配線基板から取り外すと共に、温度センサのセンサ本体を放熱手段から取り外して上記貫通穴を通して取り出すだけで、駆動用集積回路の温度センサ取付構造から温度センサを取り外すことができ、また、取り外すときの逆の動作を行って駆動用集積回路の温度センサ取付構造に新しい温度センサを取り付けることができる。したがって、温度センサを取り代えるときの労力とコストを大幅に低減できる。
【００５４】
また、請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、温度センサは、被温度測定物である駆動用集積回路に直接または間接的に接触するので、放熱手段の温度を測ることによって駆動用集積回路の温度を間接的に測定する場合と比較して、駆動用集積回路の温度を精密に測定できる。
【００５５】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、放熱手段、駆動用集積回路、プリント配線基板および温度センサのみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００５６】
また、請求項２の発明の駆動用集積回路の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、温度センサのセンサ本体をプリント配線基板の反駆動用集積回路側から駆動用集積回路側へ貫通穴を挿通して、温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、直接リードピン用取付穴に挿通してリードピン用取付穴に配置できる。したがって、リードピンを例えばＬ字形状のような単純かつ安価な形状であっても、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００５７】
また、請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたので、上記センサ本体を上記駆動用集積回路に確実に固定できると共に、温度センサおよび駆動用集積回路の絶縁性を向上でき、また、温度測定精度を向上できる。
【００５８】
また、請求項４の発明のプリント配線基板の温度センサ取付構造によれば、プリント配線基板の貫通穴に挿通可能な寸法を有する温度センサのセンサ本体の一面を、上記プリント配線基板の貫通穴の一方の側から露出させた状態で、上記温度センサのリードピンを、上記プリント配線基板のリードピン用取付穴に挿入固定して、温度センサのリードピンと上記プリント配線基板の配線とを電気接続したので、センサ本体を被温度測定物に直接または間接的に接触させることができて、被温度測定物の温度を正確に測定できる。
【００５９】
また、請求項４の発明のプリント配線基板の温度センサ取付構造によれば、温度センサを簡単安価に取り代えることができる。
【００６０】
また、請求項５の発明のプリント配線基板の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、プリント配線基板に温度センサを固定するとき、温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、直接リードピン用取付穴に挿通してリードピン用取付穴に配置して固定できる。したがって、リードピンを例えばＬ字形状のような単純かつ安価な形状にできて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【図面の簡単な説明】
【図１】図１（Ａ）は、この発明の一実施形態の駆動用集積回路の温度センサ取付構造の断面図である。図１（Ｂ）は、図１（Ａ）の駆動用集積回路の温度センサ取付構造の平面図である。
【図２】図２（Ａ）は、上記実施形態の駆動用集積回路の温度センサ取付構造のプリント配線基板の貫通穴とリードピン用取付穴の形状を示す図であり、図２（Ｂ）は、上記実施形態の駆動用集積回路の温度センサ取付構造の温度センサを示す図である。図２（Ｃ）は、この発明の他の実施形態の駆動用集積回路の温度センサ取付構造のプリント配線基板の貫通穴とリードピン用取付穴の形状を示す図であり、図２（Ｄ）は、上記他の実施形態の駆動用集積回路の温度センサ取付構造の温度センサを示す図である。
【図３】従来の駆動用集積回路の温度センサ取付構造の断面図である。
【符号の説明】
１ ヒートシンク
２ ＩＰＭ
４，３４ 貫通穴
５，５５ 温度センサ
６，５６ センサ本体
７，５７ リードピン
９，３９ リードピン用取付穴
１０ プリント配線基板
１５ シリコン樹脂[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a temperature sensor mounting structure for a driving integrated circuit and a temperature sensor mounting structure for a printed wiring board.
[0002]
[Prior art]
Conventionally, as a temperature sensor mounting structure of a driving integrated circuit, there is one shown in FIG. The temperature sensor mounting structure of the driving integrated circuit includes a heat sink 71 having a plurality of heat radiation fins (not shown), an intelligent power module (hereinafter, referred to as IPM) 72 as a driving integrated circuit, a printed wiring board 73, a temperature sensor, 74.
[0003]
One surface of the IPM 72 is fixed in close contact with one surface of the heat sink 71, and a plurality of lead pins 77 extending from the other surface of the IPM 72 are inserted into lead pin mounting holes of the printed wiring board 73, and the printed wiring board is 73 are electrically connected. Thus, the IPM 72 is cooled by the heat sink 71 and mounted on the printed wiring board 73.
[0004]
On the other hand, the temperature sensor 74 includes a sensor body 80, a mounting portion 81 connected to one end of the sensor body 80, a lead wire 82 extending from the other end of the sensor body 80, and a connector 83 to which the lead wire 82 is connected. And The mounting portion 81 of the temperature sensor 74 is fixed on the one surface of the heat sink 71 and in the vicinity of the IPM 72 with a screw 85 so that the sensor body 80 is in close contact with the one surface of the heat sink 71. Although not shown, the connector 83 is mounted on the surface of the printed wiring board 73 on the heat sink 71 side, and is electrically connected to the wiring by the solder 78.
[0005]
The temperature sensor 74 indirectly measures the temperature of the IPM 72 by measuring the temperature of the heat sink 71.
[0006]
Although not shown, as a sensor mounting structure for mounting the sensor on the printed wiring board, an infrared sensor is housed in a recess of a block body having a large heat capacity fixed to the wiring board, and the block body is surrounded around the infrared sensor. There is one in which this infrared sensor is attached to a printed wiring board via a pedestal portion while being surrounded by an inner wall surface (see Japanese Patent Application Laid-Open No. H11-237334).
[0007]
[Patent Document 1]
JP-A-11-237334 (FIG. 1)
[0008]
[Problems to be solved by the invention]
However, in the conventional temperature sensor mounting structure of the driving integrated circuit shown in FIG. 3, when the temperature sensor 74 needs to be replaced due to a failure or the like, the temperature sensor 74 is connected between the heat sink 71 and the printed wiring board 73. The printed wiring board 73, which hinders the work of removing the temperature sensor 74, must be separated from the heat sink 71. Therefore, all of the many lead pins 77 of the IPM 72 connected to the wiring of the printed wiring board 73 must be removed from the printed wiring board 73 by melting the solder 78. As described above, in the conventional temperature sensor mounting structure of the driving integrated circuit, in order to replace the temperature sensor 74, the solder 78 of the many lead pins 77 of the IPM 72 must be melted. There is a problem that the replacement cost is increased due to the large amount of labor required.
[0009]
Further, since the temperature sensor 74 indirectly measures the temperature of the IPM 72 by measuring the temperature of the heat sink 71, there is a problem that the temperature of the IPM 72 cannot be accurately measured.
[0010]
On the other hand, the sensor mounting structure disclosed in Patent Document 1 is for an infrared sensor and has a block body and a pedestal portion. Therefore, there is a problem that it cannot be applied to a temperature sensor for measuring the temperature of a driving integrated circuit.
[0011]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a temperature sensor mounting structure for a driving integrated circuit capable of easily and inexpensively replacing a temperature sensor and accurately measuring the temperature of the driving integrated circuit, and a temperature sensor for a printed wiring board. It is to provide a mounting structure.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, a temperature sensor mounting structure for a driving integrated circuit according to the first aspect of the present invention,
A driving integrated circuit having one surface fixed to the heat radiating means,
The driving integrated circuit is mounted such that the other surface of the driving integrated circuit faces the other surface, and a through hole facing the other surface of the driving integrated circuit, and a position located on a side of the through hole. A printed wiring board having a lead pin mounting hole,
The sensor body has a dimension facing the through hole and capable of being inserted into the through hole, and directly or indirectly in contact with the other surface of the driving integrated circuit, and the lead pin mounting hole. A temperature sensor having a lead pin inserted and electrically connected to the wiring of the printed wiring board; and
It is characterized by having.
[0013]
In this specification, "indirect contact" means that a resin layer, a thin metal layer, an adhesive layer, and the like exist between two members, and the two members are connected to each other via the layers. Say that.
[0014]
In the temperature sensor mounting structure for a driving integrated circuit according to the first aspect of the present invention, when assembling the temperature sensor mounting structure for the driving integrated circuit, for example, one surface of the driving integrated circuit is fixed to the heat radiating means, The driving integrated circuit is mounted on the printed wiring board with the other surface of the driving integrated circuit facing the through hole of the printed wiring board and the printed wiring board. Next, the sensor body of the temperature sensor is inserted through the through hole from the opposite side of the printed circuit board from the drive integrated circuit side to directly or indirectly contact the other surface of the drive integrated circuit. In this state, the lead pins of the temperature sensor are inserted into the mounting holes for the lead pins of the printed wiring board, fixed to the wiring with solder or the like, and the lead pins are electrically connected to the wiring of the printed wiring board.
[0015]
Further, when replacing the temperature sensor from the temperature sensor mounting structure of the driving integrated circuit, for example, after removing the lead pins of the temperature sensor fixed to the printed wiring board with solder or the like from the printed wiring board, The sensor body of the temperature sensor that is in contact with the device is removed from the driving integrated circuit through the through hole, and the temperature sensor is removed from the printed wiring board and the driving integrated circuit. Next, the sensor body of the new temperature sensor was directly or indirectly contacted with one surface of the driving integrated circuit by inserting the sensor body of the new temperature sensor through the through-hole from the side opposite to the driving integrated circuit side of the printed wiring board. In this state, the lead pins of the new temperature sensor are inserted into the lead pin mounting holes, fixed to the wiring of the printed wiring board with solder or the like, and the lead pins are electrically connected to the wiring.
[0016]
According to the temperature sensor mounting structure of the driving integrated circuit according to the first aspect of the present invention, when the temperature sensor is replaced from the temperature sensor mounting structure of the driving integrated circuit, the temperature sensor mounting structure of the conventional driving integrated circuit is replaced with the temperature sensor mounting structure. As described above, it is not necessary to remove the driving integrated circuit mounted on the printed wiring board from the printed wiring board, remove the lead pins of the temperature sensor from the printed wiring board, and remove the sensor body of the temperature sensor from the driving integrated circuit. The temperature sensor can be removed from the driving integrated circuit simply by removing it and taking it out through the through hole. Also, with the sensor body of the new temperature sensor inserted through the through hole and in contact with the driving integrated circuit, simply insert the lead pin of the temperature sensor into the lead pin mounting hole and fix it with solder or the like. A new temperature sensor can be attached to the driving integrated circuit. Therefore, labor and cost when replacing the temperature sensor can be significantly reduced.
[0017]
According to the temperature sensor mounting structure of the driving integrated circuit according to the first aspect of the present invention, the temperature sensor comes into direct or indirect contact with the driving integrated circuit which is the object to be measured. Compared with the conventional example in which the temperature of the driving integrated circuit is indirectly measured via the temperature, the temperature of the driving integrated circuit can be measured more accurately.
[0018]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the present invention, only the heat radiating means, the driving integrated circuit, the printed wiring board and the temperature sensor are required, and the connector is unnecessary. Cost can be reduced.
[0019]
According to a second aspect of the present invention, in the temperature sensor mounting structure of the driving integrated circuit according to the first aspect, the lead pin mounting hole communicates with the through hole. It is characterized by having.
[0020]
According to the temperature sensor mounting structure of the driving integrated circuit according to the second aspect of the present invention, since the mounting hole for the lead pin communicates with the through-hole, the sensor main body of the temperature sensor is used for counter-driving the printed wiring board. Insert the through-hole from the integrated circuit side to the driving integrated circuit side and move the lead pin from the through-hole to the lead-pin mounting hole communicating with the through-hole, or directly insert the lead pin into the mounting hole for the lead pin. And can be arranged in the mounting holes for lead pins. Therefore, even if the lead pin is simple and inexpensive, for example, L-shaped, the lead pin can be easily inserted into the lead pin mounting hole, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0021]
According to a third aspect of the present invention, there is provided a temperature sensor mounting structure for a driving integrated circuit according to the first or second aspect, wherein the sensor body of the temperature sensor is connected to the driving integrated circuit. And an insulating member fixed to the other surface.
[0022]
According to the temperature sensor mounting structure of the driving integrated circuit according to the third aspect of the present invention, since the sensor body of the temperature sensor is provided with an insulating member for fixing the sensor body to the other surface of the driving integrated circuit, In addition to being reliably mechanically fixed to the driving integrated circuit, the insulation of the temperature sensor and the driving integrated circuit can be improved.
[0023]
According to the temperature sensor mounting structure of the driving integrated circuit of the third aspect of the present invention, since the sensor body of the temperature sensor is covered with the insulating member, heat conduction from the driving integrated circuit to the sensor main body is prevented. In addition, the heat capacity is reduced and the temperature measurement accuracy is improved.
[0024]
The temperature sensor mounting structure for a printed wiring board according to the invention of claim 4 is as follows.
A printed wiring board having a through hole and a lead pin mounting hole located on the side of the through hole;
A sensor body facing the through hole of the printed wiring board and having a size capable of being inserted into the through hole, and being exposed on one side of the printed wiring board; and a lead pin extension extending from the sensor body. A temperature sensor having a lead pin inserted into the hole and electrically connected to the wiring of the printed wiring board;
It is characterized by having.
[0025]
According to the structure for mounting a temperature sensor on a printed wiring board of the invention, the exposed surface of the sensor body of the temperature sensor exposed on one side of the printed wiring board is connected to a temperature measuring object such as an integrated circuit for driving. The temperature of the object to be measured can be measured by directly or indirectly contacting and fixing to the temperature measurement surface of the object. Therefore, the temperature of the object to be measured can be measured while the sensor body is directly or indirectly in contact with the object to be measured, so that the temperature of the object to be measured can be accurately measured.
[0026]
Further, in a state where the sensor main body of the temperature sensor mounting structure of the printed wiring board according to the fourth aspect of the present invention is in direct or indirect contact with a temperature measuring object such as an integrated circuit for driving, the temperature measuring object is If the temperature sensor mounting structure of the object to be measured is configured by mounting on a printed wiring board, the temperature sensor mounting structure of the object to be measured can be replaced with the temperature sensor similarly to the temperature sensor mounting structure of the driving integrated circuit of the invention. Can be easily and inexpensively replaced.
[0027]
According to a fifth aspect of the present invention, in the temperature sensor mounting structure for a printed wiring board according to the fourth aspect, the mounting hole for the lead pin communicates with the through hole. It is characterized by.
[0028]
According to the temperature sensor mounting structure for a printed wiring board according to the fifth aspect of the present invention, since the mounting hole for the lead pin communicates with the through hole, the temperature sensor is fixed to the printed wiring board when the temperature sensor is fixed. Similarly to the temperature sensor mounting structure of the driving integrated circuit according to the second aspect, the lead pin of the temperature sensor is moved from the through hole to the lead pin mounting hole communicating with the through hole, or the lead pin mounting hole is moved. And can be arranged in the lead pin mounting hole, so that the lead pin can be made simple and inexpensive, for example, in an L-shape. Therefore, the lead pin can be easily inserted into the lead pin mounting hole, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1A is a sectional view of a temperature sensor mounting structure of a driving integrated circuit according to an embodiment of the present invention.
[0030]
As shown in FIG. 1A, the temperature sensor mounting structure of the driving integrated circuit includes a heat sink 1 as an example of a heat radiating unit and an intelligent power module (hereinafter, referred to as IPM) 2 as an example of the driving integrated circuit. , A temperature sensor 5, a printed wiring board 10, and a silicone resin 15 as an example of an insulating member.
[0031]
The printed wiring board 10 has a substantially elliptical through hole 4 shown in FIG. 2A and two substantially slit-shaped lead pin mounting holes 9, 9 communicating with the through hole 4. The lead pin mounting holes 9 are opposed to each other.
[0032]
As shown in FIG. 1A, the IPM 2 has a substantially rectangular parallelepiped shape. One surface of the IPM 2 is fixed in close contact with the heat sink 1, and the other surface covers the through hole 4. It faces the non-wiring side of the printed wiring board 10. The plurality of lead pins 3, 3, 3,... Of the IPM 2 are inserted into holes (not shown) of the printed wiring board and electrically connected to wiring (not shown) by solder 8. Thus, the IPM 2 is mechanically fixed to the printed wiring board 10.
[0033]
On the other hand, as shown in FIG. 2B, the temperature sensor 5 has a substantially rectangular parallelepiped sensor main body 6 having a size that can be inserted into the through hole 4 and a substantially L-shaped sensor main body 6 extending from both sides of the sensor main body 6. It consists of two lead pins 7. With the sensor body 6 of the temperature sensor 5 in close contact with the portion of the IPM 2 facing the through hole 4 on the other surface, the two substantially L-shaped lead pins 7 are attached to the mounting holes 9 for the lead pins. , 9 are inserted. The tips of the lead pins 7, 7 are electrically connected to wiring (not shown) of the printed wiring board 10 by solder 8. Further, the sensor main body 6 of the temperature sensor 5 is coated with a silicon resin 15 as an example of an insulating member, so that the temperature sensor 5 is mechanically fixed to the IPM 2 and is insulated and protected.
[0034]
As shown in FIGS. 1A and 1B, the silicon resin 15 covers the sensor main body 6 in a state where the silicon resin 15 does not exist between the sensor main body 6 and the IPM 2. However, a thin layer of the silicon resin 15 may be present between the sensor body 6 and the IPM 2.
[0035]
In the above configuration, when it becomes necessary to replace only the temperature sensor 5 from the temperature sensor mounting structure of the driving integrated circuit due to a failure or the like, the lead pins 7 of the temperature sensor 5 fixed to the printed wiring board 10 with the solder 8 are connected. Then, the solder 8 is melted and removed from the lead pin mounting hole 9, and the sensor body 6 of the temperature sensor 5 in contact with the heat sink 1 is removed together with the silicon resin 15 from the IPM 2 through the through hole 4. After that, the solder remaining near the lead pin mounting hole 9 of the printed wiring board 10 is removed, and the silicon resin 15 remaining on the surface of the IPM 2 is completely removed.
[0036]
Next, from the side of the printed wiring board 10 not facing the IPM 2, the sensor body of the new temperature sensor is inserted through the substantially elliptical through-hole 4 and is brought into contact with the IPM 2, and the new temperature sensor is The lead pins are inserted into the lead pin mounting holes 9 and fixed with solder or the like, and the lead pins are electrically connected to the wiring of the printed wiring board 10. Thereafter, the periphery of the sensor body of the new temperature sensor is coated with an insulating member such as a silicone resin, and the sensor body of the new temperature sensor is directly or indirectly contact-fixed to the IPM 2.
[0037]
According to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, when only the temperature sensor 5 is replaced from the temperature sensor mounting structure of the driving integrated circuit due to a failure or the like, the temperature sensor mounting of the conventional driving integrated circuit is performed. Unlike the structure, it is not necessary to melt the solder 8 and remove the lead pins 3 of the IPM 2 from the printed wiring board 10 by soldering the mounting holes for the lead pins for mounting a plurality of IPMs on the printed wiring board 10. It is not necessary to separate the IPM 2 from the printed wiring board 10, the two lead pins 7 of the temperature sensor 5 are removed from the printed wiring board 10, and the sensor main body 10 of the temperature sensor 5 is removed from the IPM 2 through the through hole 4 together with the silicon resin 15. Simply removing the temperature sensor 5 from the temperature sensor mounting structure of the driving integrated circuit It can be. Further, in a state where the sensor body of the new temperature sensor is inserted through four through holes and is in contact with one surface of the IPM 2, the lead pin of the new temperature sensor is simply inserted into the slit-shaped lead pin mounting hole 9 and fixed with solder or the like. Thus, a new temperature sensor can be mounted on the temperature sensor mounting structure of the driving integrated circuit. Therefore, labor and cost when replacing the temperature sensor 5 can be significantly reduced.
[0038]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the temperature sensor 5 is in direct contact with the IPM 2 which is the object to be measured. The temperature of the IPM 2 can be measured more accurately than the conventional example in which the temperature is measured indirectly.
[0039]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, only the heat sink 1, the IPM 2, the printed wiring board 10 and the temperature sensor 5 are required, and no connector is required. Can be reduced.
[0040]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the sensor body 6 of the temperature sensor 5 is inserted through the through hole 4 from the wiring side of the printed wiring board 10 to the driving integrated circuit side, and the temperature of the temperature sensor 5 is increased. Since the lead pins 7 of the sensor 5 can be inserted and arranged from the wiring side of the printed wiring board 10 to the lead pin mounting holes 9 communicating with the through holes 4, the lead pins 7 can be formed in a simple and inexpensive L-shape as in this embodiment. Even if it has such a shape, it can be easily inserted into the mounting holes 9 for lead pins. Therefore, the cost of the temperature sensor 5 and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0041]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, since the sensor main body 6 is coated with the silicon resin 15, the sensor main body 6 can be securely brought into contact with the IPM 2 and fixed. The insulation of the IPM 2 can be improved. In addition, since the conductivity from the IPM 2 to the sensor body 6 is improved by the silicon resin 15, the temperature measurement accuracy is improved.
[0042]
In the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the sensor body 6 of the temperature sensor 5 is inserted through the through hole 4 from the wiring side of the printed wiring board 10 to the driving integrated circuit side, and the temperature sensor is mounted. After the L-shaped lead pin 7 of FIG. 5 is inserted through the mounting hole 9 for the lead pin, it is fixed by the solder 8 and electrically connected to the wiring of the printed wiring board 10. The through hole 4 is inserted from the wiring side of the substrate 10 to the driving integrated circuit side, and the L-shaped lead pin 7 of the temperature sensor is inserted from the through hole 4 into the lead pin mounting hole 9 communicating with the through hole 4. After being moved, it may be fixed with solder 8 and electrically connected to the wiring of the printed wiring board 1.
[0043]
Further, in the temperature sensor mounting structure of the driving integrated circuit of the embodiment, the sensor body 6 of the temperature sensor 5 directly contacts the IPM 2 in a state where the silicon resin 15 is not present between the sensor body 6 and the IPM 2. However, the sensor body of the temperature sensor may be indirectly contacted with the IPM 2 in a state where the silicon resin exists as a thin layer between the sensor body and the IPM. Further, the sensor body and the IPM may be indirectly contacted via an adhesive layer or a thin metal layer.
[0044]
Further, in the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, as shown in FIG. 2A, the slit-shaped lead pin mounting hole 9 is communicated with the substantially elliptical through hole 4. As shown in FIG. 2C, the through hole 34 of the printed wiring board and the two lead pin mounting holes 39 on the side of the through hole 34 are not communicated with each other, and the substantially oval shape and the substantially round hole shape are respectively provided. 2D, the tip of the hook-shaped lead pin 57 extending from the side surface of the sensor body 56 of the temperature sensor 55 is inserted into the lead pin mounting hole 39 from the wiring side of the printed wiring board and fixed. good.
[0045]
Further, in the temperature sensor mounting structure of the driving integrated circuit according to the above embodiment, the through hole 4 of the printed wiring board 10 has a substantially elliptical shape, and the lead pin mounting hole 9 has a slit shape. In the temperature sensor mounting structure of the circuit, the through hole for the sensor body of the printed wiring board and the two lead pin mounting holes on the side of this through hole are not limited to elliptical, round holes, slit shapes, and any shape. Is also good.
[0046]
Further, in the temperature sensor mounting structure of the driving integrated circuit according to the above embodiment, the silicon resin 15 is used as the insulating member, but a glass resin, an epoxy resin, or the like may be used as the insulating member.
[0047]
Further, in the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the temperature sensor 5 is coated with the silicon resin 15, but it is not always necessary to coat with the insulating member such as the silicon resin.
[0048]
In FIG. 1A, when the IPM 2 and the silicon resin 15 are removed, a printed circuit board temperature sensor mounting structure is obtained.
[0049]
If this temperature sensor mounting structure for a printed wiring board is used, the temperature of an object to be measured such as an IPM can be measured while the sensor body 6 is in direct or indirect contact with the object to be measured such as an IPM. It is advantageous that the temperature of the object to be measured can be accurately and easily measured.
[0050]
Further, according to the temperature sensor mounting structure of the printed wiring board, the temperature sensor can be easily and inexpensively replaced.
[0051]
In the above embodiment, the side opposite to the side facing the IPM 2 of the printed wiring board 10 is the wiring side, but wiring may be provided on both sides of the printed wiring board.
[0052]
In the above embodiment, the heat sink has been described as an example of the heat radiating means. However, the heat radiating means may be a heat transfer means such as a heat pipe that carries heat and radiates heat.
[0053]
【The invention's effect】
As is clear from the above, according to the temperature sensor mounting structure of the driving integrated circuit of the present invention, one surface of the driving integrated circuit is fixed to the heat radiating means, and the other surface of the driving integrated circuit is printed wiring. After mounting the driving integrated circuit on the printed wiring board in a state facing the through hole of the substrate, the sensor main body of the temperature sensor having a size that can be inserted into this through hole is mounted on the other surface of the driving integrated circuit. Since the lead pins of the temperature sensor are inserted and fixed in the lead pin mounting holes of the printed wiring board by direct or indirect contact, when the temperature sensor is replaced from the temperature sensor mounting structure of the driving integrated circuit, the printed wiring board is It is not necessary to remove the driver integrated circuit mounted on the printed circuit board from the printed circuit board. The temperature sensor can be removed from the temperature sensor mounting structure of the driving integrated circuit simply by removing the sensor body of the sensor from the heat radiation means and taking it out through the through hole. A new temperature sensor can be mounted on the temperature sensor mounting structure of the circuit. Therefore, labor and cost when replacing the temperature sensor can be significantly reduced.
[0054]
Further, according to the temperature sensor mounting structure of the driving integrated circuit according to the first aspect of the present invention, the temperature sensor comes into direct or indirect contact with the driving integrated circuit which is the object to be measured. By measuring, the temperature of the driving integrated circuit can be measured more accurately than in the case of measuring the temperature of the driving integrated circuit indirectly.
[0055]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the present invention, only the heat radiating means, the driving integrated circuit, the printed wiring board and the temperature sensor are required, and the connector is unnecessary. Cost can be reduced.
[0056]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the present invention, since the mounting hole for the lead pin communicates with the through hole, the sensor main body of the temperature sensor is driven in the opposite direction of the printed wiring board. Through the through hole from the integrated circuit side to the drive integrated circuit side, and move the lead pin of the temperature sensor from the through hole to the lead pin mounting hole communicating with the through hole, or directly mount the lead pin. It can be inserted into the hole and placed in the lead pin mounting hole. Therefore, even if the lead pin has a simple and inexpensive shape such as an L-shape, the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0057]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the third aspect of the present invention, the sensor main body of the temperature sensor is provided with an insulating member for fixing the sensor main body to the other surface of the driving integrated circuit. Can be securely fixed to the driving integrated circuit, the insulation properties of the temperature sensor and the driving integrated circuit can be improved, and the temperature measurement accuracy can be improved.
[0058]
Further, according to the temperature sensor mounting structure of the printed wiring board of the fourth aspect of the invention, one surface of the sensor body of the temperature sensor having a dimension that can be inserted into the through hole of the printed wiring board is connected to the through hole of the printed wiring board. Since the lead pins of the temperature sensor were inserted into and fixed to the mounting holes for the lead pins of the printed wiring board while being exposed from one side, the lead pins of the temperature sensor and the wiring of the printed wiring board were electrically connected. The sensor body can be brought into direct or indirect contact with the object to be measured, and the temperature of the object to be measured can be accurately measured.
[0059]
According to the temperature sensor mounting structure of the printed wiring board of the invention of claim 4, the temperature sensor can be easily and inexpensively replaced.
[0060]
According to the temperature sensor mounting structure for a printed wiring board according to the fifth aspect of the present invention, the mounting hole for the lead pin communicates with the through hole. Can be moved from the through hole to the lead pin mounting hole communicating with the through hole, or can be directly inserted into the lead pin mounting hole and arranged in the lead pin mounting hole to be fixed. Therefore, the lead pins can be formed in a simple and inexpensive shape such as an L-shape, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[Brief description of the drawings]
FIG. 1A is a sectional view of a temperature sensor mounting structure of a driving integrated circuit according to an embodiment of the present invention. FIG. 1B is a plan view of the temperature sensor mounting structure of the driving integrated circuit of FIG. 1A.
FIG. 2A is a view showing the shapes of a through hole and a lead pin mounting hole of a printed wiring board of the temperature sensor mounting structure of the driving integrated circuit according to the embodiment, and FIG. FIG. 3 is a diagram showing a temperature sensor having a temperature sensor mounting structure of the driving integrated circuit according to the embodiment. FIG. 2C is a view showing the shapes of the through-holes and the mounting holes for the lead pins of the printed wiring board of the temperature sensor mounting structure of the driving integrated circuit according to another embodiment of the present invention, and FIG. FIG. 14 is a diagram showing a temperature sensor having a temperature sensor mounting structure for a driving integrated circuit according to another embodiment.
FIG. 3 is a cross-sectional view of a conventional temperature sensor mounting structure of a driving integrated circuit.
[Explanation of symbols]
1 heat sink
2 IPM
4,34 Through hole
5,55 temperature sensor
6,56 Sensor body
7,57 lead pin
9,39 Mounting holes for lead pins
10. Printed circuit board
15 Silicone resin

Claims (5)

放熱手段（１）に一面が固定された駆動用集積回路（２）と、
上記駆動用集積回路（２）が、その駆動用集積回路（２）の他面が対向するようにして実装される一方、上記駆動用集積回路（２）の上記他面に対向する貫通穴（４，３４）と、この貫通穴の側方に位置するリードピン用取付穴（９，３９）とを有するプリント配線基板（１０）と、
上記貫通穴（４，３４）に対向すると共に上記貫通穴（４，３４）に挿通可能な寸法を有し、かつ、上記駆動用集積回路（２）の上記他面に直接または間接的に接触しているセンサ本体（６，５６）と、上記リードピン用取付穴（９，３９）に挿入されて上記プリント配線基板（１０）の配線に電気接続されたリードピン（７，５７）とを有する温度センサ（５，５５）と
を備えたことを特徴とする駆動用集積回路の温度センサ取付構造。A driving integrated circuit (2) having one surface fixed to the heat radiating means (1);
The driving integrated circuit (2) is mounted so that the other surface of the driving integrated circuit (2) faces the other side, while the through hole (2) faces the other surface of the driving integrated circuit (2). 4,34) and a printed wiring board (10) having lead pin mounting holes (9,39) located on the sides of the through holes.
It has a dimension facing the through hole (4, 34) and capable of being inserted into the through hole (4, 34), and directly or indirectly contacts the other surface of the driving integrated circuit (2). A temperature having a sensor main body (6, 56) and a lead pin (7, 57) inserted into the mounting hole (9, 39) for the lead pin and electrically connected to the wiring of the printed wiring board (10). A temperature sensor mounting structure for a driving integrated circuit, comprising: a sensor (5, 55). 請求項１に記載の駆動用集積回路の温度センサ取付構造において、
上記リードピン用取付穴（９）は、上記貫通穴（４）に連通していることを特徴とする駆動用集積回路の温度センサ取付構造。The temperature sensor mounting structure for a driving integrated circuit according to claim 1,
The temperature sensor mounting structure for a driving integrated circuit, wherein the lead pin mounting hole (9) communicates with the through hole (4). 請求項１または２に記載の駆動用集積回路の温度センサ取付構造において、
上記温度センサ（５）のセンサ本体（６）を上記駆動用集積回路（２）の上記他面に固定する絶縁部材（１５）を備えたことを特徴とする駆動用集積回路の温度センサ取付構造。The temperature sensor mounting structure for a driving integrated circuit according to claim 1 or 2,
A temperature sensor mounting structure for a driving integrated circuit, comprising: an insulating member (15) for fixing a sensor body (6) of the temperature sensor (5) to the other surface of the driving integrated circuit (2). . 貫通穴（４，３４）と、この貫通穴（４，３４）の側方に位置するリードピン用取付穴（９，３９）とを有するプリント配線基板（１０）と、
このプリント配線基板（１０）の貫通穴（４，３４）に対向すると共に上記貫通穴（４，３４）に挿通可能な寸法を有し、かつ、上記プリント配線基板（１０）の一方の側に露出するセンサ本体（６，５６）と、上記センサ本体（６，５６）から延びて上記リードピン用取付穴（９，３９）に挿入されて、上記プリント配線基板（１０）の配線と電気接続されるリードピン（７，５７）とを有する温度センサ（５，５５）と
を備えたことを特徴とするプリント配線基板の温度センサ取付構造。A printed wiring board (10) having a through hole (4, 34) and a lead pin mounting hole (9, 39) located on the side of the through hole (4, 34);
The printed wiring board (10) has a dimension facing the through hole (4, 34) of the printed wiring board (10) and capable of being inserted into the through hole (4, 34), and is provided on one side of the printed wiring board (10). The sensor body (6, 56) which is exposed, extends from the sensor body (6, 56), is inserted into the mounting hole (9, 39) for the lead pin, and is electrically connected to the wiring of the printed wiring board (10). And a temperature sensor (5, 55) having lead pins (7, 57). 請求項４に記載のプリント配線基板の温度センサ取付構造において、
上記リードピン用取付穴（９）は、上記貫通穴（４）に連通していることを特徴とするプリント配線基板の温度センサ取付構造。The temperature sensor mounting structure for a printed wiring board according to claim 4,
The mounting structure for a temperature sensor of a printed wiring board, wherein the mounting hole (9) for a lead pin communicates with the through hole (4).
JP2002318283A 2002-10-31 2002-10-31 Temperature sensor mounting structure for driving integrated circuit Expired - Fee Related JP4173717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002318283A JP4173717B2 (en) 2002-10-31 2002-10-31 Temperature sensor mounting structure for driving integrated circuit

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006030606A1 (en) * 2004-09-17 2006-03-23 Kabushiki Kaisha Yaskawa Denki Motor control device and method for assembling motor control device
JP2007040786A (en) * 2005-08-02 2007-02-15 Daikin Ind Ltd Temperature sensor attaching structure for integrated circuit for drive
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner

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Publication number Priority date Publication date Assignee Title
KR101450950B1 (en) * 2011-10-04 2014-10-16 엘지디스플레이 주식회사 Driver package

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006030606A1 (en) * 2004-09-17 2006-03-23 Kabushiki Kaisha Yaskawa Denki Motor control device and method for assembling motor control device
JPWO2006030606A1 (en) * 2004-09-17 2008-05-08 株式会社安川電機 Motor control device and motor control device assembling method
US7679915B2 (en) 2004-09-17 2010-03-16 Kabushiki Kaisha Yaskawa Denki Motor control apparatus and method of assembling motor control apparatus
JP2010178625A (en) * 2004-09-17 2010-08-12 Yaskawa Electric Corp Motor control apparatus and method of assembling motor control apparatus
JP4548619B2 (en) * 2004-09-17 2010-09-22 株式会社安川電機 Motor control device
JP2007040786A (en) * 2005-08-02 2007-02-15 Daikin Ind Ltd Temperature sensor attaching structure for integrated circuit for drive
JP4677848B2 (en) * 2005-08-02 2011-04-27 ダイキン工業株式会社 Temperature sensor mounting structure for driving integrated circuit
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner

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