JP2004142136A - Ultrasonic welding method for resin package - Google Patents

Ultrasonic welding method for resin package Download PDF

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Publication number
JP2004142136A
JP2004142136A JP2002306882A JP2002306882A JP2004142136A JP 2004142136 A JP2004142136 A JP 2004142136A JP 2002306882 A JP2002306882 A JP 2002306882A JP 2002306882 A JP2002306882 A JP 2002306882A JP 2004142136 A JP2004142136 A JP 2004142136A
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Japan
Prior art keywords
positioning
package
package component
case
resin
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JP2002306882A
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Japanese (ja)
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JP4269638B2 (en
Inventor
Ryosuke Sakai
坂井　亮介
Akihiro Kitani
木谷　明弘
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2002306882A priority Critical patent/JP4269638B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B29C65/081—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations having a component of vibration not perpendicular to the welding surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7855—Provisory fixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322—Providing cavities in the joined article to collect the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic welding method for a resin package which reduces the damage of the resin package while performing highly accurate positioning when ultrasonic welding is performed. <P>SOLUTION: In the method for forming the resin package by ultrasonically welding the bonding surfaces of both of a resin case 1 and a cover 10, two positioning pins 5 capable of being broken by ultrasonic vibration are integrally formed to the bonding surface 4 of the case 1 and positioning holes 14, in which the positioning pins 5 are pressed and fitted, are formed to the bonding surface 13 of the cover 10. The positioning pins 5 are pressed and filled in the positioning holes 14 and ultrasonic vibration, of which the amplitude is larger than the fitting gap between each of the positioning pins 5 and each of the positioning holes 14, is applied to the case 1 and the cover 10 in the direction almost parallel to the bonding surfaces 4 and 13 of the case 1 and the cover 10 while pressing the case 1 and the cover 10 in an opposed direction not only to break the positioning pins 5 but also to weld the bonding surfaces 4 and 13. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は電子部品などの樹脂パッケージの超音波溶着方法に関するものである。
【０００２】
【従来の技術】
【特許文献１】特開平４−１０２３８８号公報
【特許文献２】特開平１１−３２８９１０号公報
従来、電子部品を樹脂パッケージ内に封入する場合、樹脂パッケージを封止する方法として超音波溶着方法が用いられる。
特許文献１には、電子部品素子をプリント基板に超音波溶着する方法が開示されている。すなわち、電子部品素子の底部に設けられた円柱状凸部と、プリント基板側に設けられた凹部とで位置決めし、超音波振動を与えることで、電子部品素子をプリント基板上に溶着させるとともに、電子部品素子の端子部をプリント基板に電気的に導通させたものである。
特許文献２には、ディスクカートリッジの上ケースと下ケースとを溶着するに際し、一方のケースの周壁近傍に挿入突起を設け、他方のケースの周壁近傍に挿入突起を挿入するための穴が設けられた受け突起を設け、両者を嵌合させた状態で、両ケースの突き合わせ面の何れかに設けた複数の突起を超音波溶着することで上下ケースを連結するものが開示されている。
【０００３】
【発明が解決しようとする課題】
ところが、いずれの溶着方法でも、使用される超音波の振動方向は縦方向、つまり位置決め用の凸部または突起の挿入方向に超音波振動が加えられる。このような縦振動による溶着方法では、接合部材（ケースなど）に加わる超音波振動によるダメージが大きく、薄肉なケースの溶着や、内部にデリケートな素子が収納されるケースの溶着には適さなかった。
【０００４】
一方、超音波の振動方向を横方向とすることも考えられる。横振動溶着方法では、気密溶着性が良好であるとともに、接合部材に与えるダメージが小さく、特に薄肉の接合部材の溶着に有効である。しかしながら、横振動のため、接合部材間に横方向のクリアランスが数十〜数百μｍ程度必要となる。
このように振動方向にクリアランスを必要とするため、接合部材同士が位置決めされておらず、超音波溶着前の搬送途中の振動や衝撃により、脱落や位置ずれが発生する。その結果、接合部材同士がずれた状態で溶着されることが多く、高品質なパッケージが得られないという欠点があった。
【０００５】
そこで、本発明の目的は、超音波溶着を行う場合に、高精度の位置決めを行いつつ、パッケージに対するダメージが少ない樹脂パッケージの超音波溶着方法を提供することにある。
【０００６】
【課題を解決するための手段】
上記目的を達成するため、請求項１に係る発明は、樹脂製の第１パッケージ部品と第２パッケージ部品との接合面を超音波溶着して樹脂パッケージを構成する方法において、上記第１パッケージ部品の接合面に超音波振動により折損し得る少なくとも２本の位置決めピンが一体に形成され、上記第２パッケージ部品の接合面に上記位置決めピンが嵌合される位置決め穴が形成されており、上記位置決めピンを位置決め穴に嵌合させ、第１パッケージ部品と第２パッケージ部品とを対向方向に加圧しつつ、上記接合面に対してほぼ平行な方向でかつ位置決めピンと位置決め穴との嵌合隙間より大きな振幅の超音波振動を与えることにより、上記位置決めピンを折るとともに、接合面を溶着することを特徴とする樹脂パッケージの超音波溶着方法を提供する。
【０００７】
本発明では、超音波振動の印加開始時点で第１パッケージ部品と第２パッケージ部品との位置決めができておればよい点に着目し、位置決めピンと位置決め穴との嵌合により高精度に位置決めした後、横方向の超音波振動を加えることにより、位置決めピンをわざと折損させる。そのため、超音波振動を阻害することなく溶着でき、高精度の位置決めを行いつつ、パッケージやその中に収納される部品に対するダメージが少ない溶着を実現することができる。
位置決めピンを少なくとも２本設けたのは、Ｘ，Ｙ，θ方向の位置決めを確実に行うためである。
超音波振動の振幅は、位置決めピンが確実に折損できる振幅とする必要がある。そのため、超音波振動の振幅は、位置決めピンと位置決め穴の横方向（接合面と平行な方向）の嵌合隙間より大きくする必要がある。例えば、位置決めピンを位置決め穴に圧入した場合、嵌合隙間が０となるので、超音波振動の振幅が４０μｍ以上であれば、位置決めピンを簡単に折ることができる。
位置決めピンは、搬送時などの振動や衝撃では折損せず、超音波振動（横振動）によって容易に折損できる程度の強度あるいは太さを持つものがよい。
【０００８】
請求項２のように、第１パッケージ部品および第２パッケージ部品の一方の接合面に、位置決めピンより低い超音波溶着用の小突起を、接合面のほぼ全周に連続的に形成し、小突起を超音波溶着することにより、第１パッケージ部品と第２パッケージ部品の接合面を封止するのがよい。
すなわち、超音波溶着を用いてパッケージを封止する場合に、超音波振動を集中させるための小突起を接合面に設けるが、この小突起を位置決めピンより低くすることで、位置決めピンによって位置決めした状態で超音波溶着を開始することができる。超音波溶着を終了すれば、小突起が溶融して第１パッケージ部品と第２パッケージ部品の接合面を封止し、封止構造の樹脂パッケージを得ることができる。
【０００９】
請求項３のように、第１パッケージ部品および第２パッケージ部品の一方の接合面に、超音波溶着時の溢出樹脂を吸収するための溝部を設けるのがよい。
すなわち、超音波溶着時に、溶融した樹脂の一部が接合面から外部へ溢れ出て外観を損なうことがある。そこで、溢出樹脂を吸収するための溝部を一方のパッケージ部品の接合面に形成することで、この溝部に樹脂が溜まり、外部に溢れ出ることがない。
【００１０】
本発明の樹脂パッケージは、必ずしも封止される必要はなく、少なくとも第１パッケージ部品と第２パッケージ部品とが正確に位置決めされかつ確実に溶着固定されるものであればよい。
樹脂パッケージの内部には、電子部品のような固体物のほか、流動体を封入することもできる。
【００１１】
【発明の実施の形態】
図１〜図３は本発明を電子部品の樹脂パッケージに適用した例を示し、図１はその外観図、図２はその分解図、図３は組立時の工程図である。
図において、１は第１パッケージ部品であるケース、１０は第２パッケージ部品であるカバーであり、両部品はＬＣＰ，ＰＰＳ，ＰＳ，ＰＥＴなどの超音波溶着可能な樹脂材料でそれぞれ一体成形されている。ケース１およびカバー１０は同一材料で形成するのがよい。
【００１２】
ケース１には、電子部品素子（図示せず）を収納するための凹部２と、この凹部２を取り囲む周壁３とが設けられ、周壁３の頂面には連続した接合面４が設けられている。ケース１の周壁３の一部には、厚肉な端子台部３ａが設けられ、この端子台部３ａに複数の端子６がインサート成形にて固定されている。ケースの接合面４上、特に端子台部３ａの上には２本の位置決めピン５が突設されている。これら位置決めピン５は、ケース１を構成する樹脂材料で一体成形されており、後述する超音波振動によって容易に折損できる太さに形成されている。ここでは、ケース１とカバー１０とを嵌合させた状態で搬送した時の振動や衝撃では折損せず、超音波振動が加わった時には容易に折損できるように、円柱状ピンとしたが、断面が多角形状のピンでもよい。
【００１３】
カバー１０は、ケース１の凹部２と対向する浅い凹部１１と、この凹部１１を取り囲む周壁１２とが設けられている。周壁１２の頂面にはケース４の接合面４と対面する接合面１３が形成されている。接合面１３には、上記位置決めピン５が圧入嵌合される２個の位置決め穴１４が設けられている。位置決めピン５と位置決め穴１４とは圧入嵌合されるので、その横方向の嵌合隙間は０である。この実施例では、ピン径をφ０．３７ｍｍ、穴径をφ０．３４ｍｍとした。位置決め穴１４を除く接合面１３上のほぼ全周に、超音波溶着用の断面三角形状の小突起１５が連続的に形成され、接合面１３の外周縁全周には、超音波溶着時の溢出樹脂を吸収するための溝１６が形成されている。小突起１５の突出高さｈは、位置決めピン５の突出高さＨより低い。すなわち、ｈ＜Ｈに設定されている。
なお、ここでは、溢出樹脂吸収溝１６をカバー１０に設けたが、ケース１に設けてもよいことは勿論である。また、吸収溝１６の位置は接合面１３の外周縁に限らず、内周縁でもよい。
【００１４】
ここで、上記ケース１とカバー１０との接合方法について、図３を参照して説明する。
（ａ）は、ケース１上にカバー１０を対向させた状態を示す。
（ｂ）は、ケース１の位置決めピン５をカバー１０の位置決め穴１４に圧入し、小突起１５をケース１の接合面４上に圧接させた状態を示す。位置決めピン５は小突起１５より長いので、位置決めピン５は位置決め穴１４に確実に圧入嵌合される。この状態で、ケース１とカバー１０は超音波印加装置の位置まで搬送されるが、位置決めピン５と位置決め穴１４との圧入嵌合によってケース１とカバー１０とがＸ，Ｙ，θ方向に固定されているので、位置ずれや脱落を確実に防止できる。
（ｃ）は超音波振動の印加直後を示す。すなわち、（ｂ）のように位置決めピン５を位置決め穴１４に圧入嵌合した状態で、ケース１を図示しない保持装置によって保持し、カバー１０を図示しない超音波印加装置（ホーン）によってすべりが生じないように保持する。そして、超音波印加装置によってカバー１０をケース１に向かって加圧しつつ、横方向の超音波振動、つまり接合面４，１３に対してほぼ平行な方向の超音波振動を与える。この実施例における超音波振動の条件は、次の通りである。
超音波振幅：８０μｍ
超音波周波数：２０ｋＨｚ
ホーン下降スピード：６０ｍｍ／ｓ
超音波振動の振幅は位置決めピン５と位置決め穴１４との嵌合隙間（ほぼ０である）より大きいので、超音波振動が位置決めピン５に対して直角方向に作用し、位置決めピン５はその根元付近で折れる。５ａは位置決めピン５の破断面である。しかし、ケース１とカバー１０との位置関係は、ケース保持装置と超音波印加装置とによって保持されているので、超音波振動の印加中にケース１とカバー１０とが超音波振幅以上の位置ずれを起こすことはない。位置決めピン５が折れた後も超音波振動を印加し続けることにより、接合面４と圧接している小突起１５が溶融し、接合面４，１３の隙間を満たす。なお、位置決めピン５の破断面５ａが溶融する場合もある。
（ｄ）は超音波溶着後の状態を示す。すなわち、超音波溶着時に、溶融した樹脂１７の一部が接合面４，１３から外部へ溢れ出ようとするが、カバー１０の接合面１３の外周縁に溢出樹脂を吸収するための溝１６が形成されているので、溶融樹脂１７は溝１６に溜まり、外部に溢れ出ることがない。溶融樹脂１７は接合面４，１３の全周を満たすので、ケース１とカバー１０との間が完全に気密封止される。
【００１５】
上記のように、超音波振動の方向が横方向であるため、気密溶着性が良好であるとともに、ケース１、カバー１０さらにはケース１内に収納される内蔵部品に与えるダメージが小さく、特に薄肉のケース１とカバー１０との溶着に有効である。また、位置決めピン５と位置決め穴１４との嵌合によって、超音波溶着前のケース１とカバー１０との位置決めができているので、溶着後のケース１とカバー１０との位置ずれも、超音波振動の振幅の範囲内に収めることができ、外観および寸法精度のよいパッケージを得ることができる。また、位置決めピン５は超音波振動によって簡単に折れるので、超音波振動を阻害することなく、溶着に不都合はない。
【００１６】
上記実施例では、位置決めピンをケース側に、超音波溶着用の小突起をカバー側に設けたが、位置決めピンおよび小突起を共にケースあるいはカバーの一方側にのみ設けてもよい。
本発明のパッケージ構造は、超音波振動が横振動であるため、縦振動に比べて衝撃荷重が大幅に低減される。そのため、内部に収納される部品が、圧電素子や精密素子、バンプ接合された素子、ワイヤボンディングされた素子のようなデリケートな部品である場合に好適である。
【００１７】
【発明の効果】
以上の説明で明らかなように、本発明によれば、第１パッケージ部品と第２パッケージ部品とを位置決めピンと位置決め穴との嵌合により高精度に位置決めした後、横方向の超音波振動を加えることにより、位置決めピンを折損させ、接合面同士を超音波溶着している。そのため、高精度の位置決めを行いつつ、パッケージやその中に収納される部品に対するダメージが少ない溶着を実現することができる。
【図面の簡単な説明】
【図１】本発明にかかる超音波溶着方法により溶着したパッケージを持つ電子部品の斜視図である。
【図２】図１に示すケースとカバーとの分解斜視図である。
【図３】図１に示すケースとカバーの超音波溶着を示す工程図である。
【符号の説明】
１　　　　ケース（第１パッケージ部品）
４　　　　接合面
５　　　　位置決めピン
１０　　　　カバー（第２パッケージ部品）
１３　　　接合面
１４　　　位置決め穴
１５　　　超音波溶着用小突起
１６　　　溢出樹脂吸収溝[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for ultrasonically welding a resin package such as an electronic component.
[0002]
[Prior art]
[Patent Document 1] Japanese Unexamined Patent Application Publication No. 4-102388 [Patent Document 2] Japanese Unexamined Patent Application Publication No. 11-328910 Conventionally, when an electronic component is sealed in a resin package, an ultrasonic welding method is used as a method for sealing the resin package. Used.
Patent Literature 1 discloses a method of ultrasonically welding an electronic component element to a printed circuit board. That is, by positioning the columnar convex portion provided on the bottom of the electronic component element and the concave portion provided on the printed board side and applying ultrasonic vibration, the electronic component element is welded on the printed board, The terminal portion of the electronic component element is electrically connected to a printed circuit board.
Patent Literature 2 discloses that when welding an upper case and a lower case of a disk cartridge, an insertion protrusion is provided near a peripheral wall of one case, and a hole is provided near the peripheral wall of the other case for inserting the insertion protrusion. There is disclosed a method in which a plurality of projections provided on any one of the abutting surfaces of both cases are ultrasonically welded to each other to connect the upper and lower cases in a state where the receiving projections are provided and both are fitted.
[0003]
[Problems to be solved by the invention]
However, in any of the welding methods, the vibration direction of the ultrasonic wave used is vertical, that is, the ultrasonic vibration is applied in the insertion direction of the positioning protrusion or projection. Such a method of welding by longitudinal vibration is not suitable for welding of a thin case or welding of a case in which a delicate element is housed inside, because the ultrasonic vibration applied to the joining member (a case or the like) causes a large damage. .
[0004]
On the other hand, it is also conceivable to make the vibration direction of the ultrasonic waves horizontal. The transverse vibration welding method has good hermetic weldability and less damage to the joining members, and is particularly effective for welding thin joining members. However, due to the lateral vibration, a lateral clearance of about several tens to several hundreds μm is required between the joining members.
Since the clearance is required in the vibration direction as described above, the bonding members are not positioned with each other, and dropping or displacement occurs due to vibration or impact during conveyance before ultrasonic welding. As a result, the joining members are often welded in a state of being shifted from each other, and there is a disadvantage that a high-quality package cannot be obtained.
[0005]
Accordingly, an object of the present invention is to provide a method of ultrasonically welding a resin package that performs high-accuracy positioning and causes less damage to the package when performing ultrasonic welding.
[0006]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a method of forming a resin package by ultrasonically welding a joining surface between a first package component and a second package component made of resin. At least two positioning pins that can be broken by ultrasonic vibration are integrally formed on the joining surface of the second package component, and a positioning hole in which the positioning pin is fitted is formed on the joining surface of the second package component. The pin is fitted into the positioning hole, and the first package component and the second package component are pressed in the opposite direction while being substantially parallel to the joint surface and larger than the fitting gap between the positioning pin and the positioning hole. A method for ultrasonically welding a resin package, wherein the positioning pin is broken and the joint surface is welded by applying ultrasonic vibration of amplitude. To provide.
[0007]
The present invention focuses on the point that the first package component and the second package component need only be positioned at the start of the application of the ultrasonic vibration, and after positioning with high accuracy by fitting the positioning pins and the positioning holes. By applying ultrasonic vibration in the lateral direction, the positioning pin is intentionally broken. Therefore, the welding can be performed without disturbing the ultrasonic vibration, and the welding can be realized with less damage to the package and the components housed therein while performing the positioning with high accuracy.
The reason why at least two positioning pins are provided is to surely perform positioning in the X, Y, and θ directions.
The amplitude of the ultrasonic vibration needs to be an amplitude at which the positioning pin can be reliably broken. Therefore, the amplitude of the ultrasonic vibration needs to be larger than the fitting gap in the lateral direction (the direction parallel to the joining surface) between the positioning pin and the positioning hole. For example, when the positioning pin is press-fitted into the positioning hole, the fitting gap becomes zero, so that if the amplitude of the ultrasonic vibration is 40 μm or more, the positioning pin can be easily broken.
It is preferable that the positioning pin has a strength or thickness that does not break due to vibration or impact during transportation or the like but can be broken easily by ultrasonic vibration (lateral vibration).
[0008]
As described in claim 2, small projections for ultrasonic welding lower than the positioning pins are formed continuously on substantially one entire circumference of the joining surface on one of the joining surfaces of the first package component and the second package component. It is preferable to seal the joint surface between the first package component and the second package component by ultrasonic welding the projection.
That is, when the package is sealed using ultrasonic welding, a small projection for concentrating the ultrasonic vibration is provided on the joining surface, but by positioning the small projection lower than the positioning pin, the positioning is performed by the positioning pin. Ultrasonic welding can be started in the state. When the ultrasonic welding is completed, the small projections are melted to seal the joint surface between the first package component and the second package component, and a resin package having a sealed structure can be obtained.
[0009]
According to a third aspect of the present invention, it is preferable that a groove is formed on one of the joining surfaces of the first package component and the second package component for absorbing the overflow resin during ultrasonic welding.
That is, at the time of ultrasonic welding, a part of the melted resin may overflow from the joint surface to the outside and impair the appearance. Therefore, by forming a groove for absorbing the overflowing resin on the joint surface of one of the package components, the resin accumulates in the groove and does not overflow to the outside.
[0010]
The resin package of the present invention does not necessarily need to be sealed, and it is sufficient that at least the first package component and the second package component are accurately positioned and securely fixed by welding.
In addition to solid objects such as electronic components, a fluid can be sealed inside the resin package.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
1 to 3 show an example in which the present invention is applied to a resin package of an electronic component. FIG. 1 is an external view of the same, FIG. 2 is an exploded view thereof, and FIG.
In the drawing, reference numeral 1 denotes a case which is a first package component, and 10 denotes a cover which is a second package component. Both components are integrally formed of a resin material such as LCP, PPS, PS, PET or the like which can be welded by ultrasonic waves. I have. The case 1 and the cover 10 are preferably made of the same material.
[0012]
The case 1 is provided with a concave portion 2 for accommodating an electronic component element (not shown) and a peripheral wall 3 surrounding the concave portion 2, and a continuous joining surface 4 is provided on a top surface of the peripheral wall 3. I have. A thick terminal block 3a is provided on a part of the peripheral wall 3 of the case 1, and a plurality of terminals 6 are fixed to the terminal block 3a by insert molding. Two positioning pins 5 protrude on the joint surface 4 of the case, particularly on the terminal block 3a. These positioning pins 5 are integrally formed of a resin material constituting the case 1 and have a thickness that can be easily broken by ultrasonic vibration described later. Here, a cylindrical pin is used so that the case 1 and the cover 10 are not broken by vibration or impact when transported in a state where the case 1 and the cover 10 are fitted, and can be easily broken when ultrasonic vibration is applied. A polygonal pin may be used.
[0013]
The cover 10 is provided with a shallow recess 11 facing the recess 2 of the case 1 and a peripheral wall 12 surrounding the recess 11. A joining surface 13 facing the joining surface 4 of the case 4 is formed on the top surface of the peripheral wall 12. The joining surface 13 is provided with two positioning holes 14 into which the positioning pins 5 are press-fitted. Since the positioning pin 5 and the positioning hole 14 are press-fitted, the lateral fitting gap is zero. In this example, the pin diameter was 0.37 mm and the hole diameter was 0.34 mm. A small projection 15 having a triangular cross section for ultrasonic welding is continuously formed on almost the entire periphery of the joining surface 13 excluding the positioning holes 14, and the entire periphery of the joining surface 13 is formed by ultrasonic welding. A groove 16 for absorbing the overflow resin is formed. The protrusion height h of the small protrusion 15 is lower than the protrusion height H of the positioning pin 5. That is, h <H.
Here, the overflow resin absorption groove 16 is provided on the cover 10, but may be provided on the case 1. Further, the position of the absorption groove 16 is not limited to the outer peripheral edge of the bonding surface 13 but may be the inner peripheral edge.
[0014]
Here, a method of joining the case 1 and the cover 10 will be described with reference to FIG.
(A) shows a state in which the cover 10 faces the case 1.
2B shows a state in which the positioning pins 5 of the case 1 are press-fitted into the positioning holes 14 of the cover 10 and the small projections 15 are pressed against the joint surface 4 of the case 1. Since the positioning pin 5 is longer than the small projection 15, the positioning pin 5 is securely press-fitted into the positioning hole 14. In this state, the case 1 and the cover 10 are transported to the position of the ultrasonic wave application device, but the case 1 and the cover 10 are fixed in the X, Y, and θ directions by press-fitting the positioning pins 5 and the positioning holes 14. As a result, misalignment or falling off can be reliably prevented.
(C) shows the state immediately after the application of the ultrasonic vibration. That is, in a state where the positioning pin 5 is press-fitted into the positioning hole 14 as shown in FIG. 3B, the case 1 is held by a holding device (not shown), and the cover 10 slips due to an ultrasonic applying device (horn) not shown. Keep it away. Then, while the cover 10 is pressed toward the case 1 by the ultrasonic applying device, the ultrasonic vibration in the lateral direction, that is, the ultrasonic vibration in the direction substantially parallel to the joining surfaces 4 and 13 is applied. The conditions of the ultrasonic vibration in this embodiment are as follows.
Ultrasonic amplitude: 80 μm
Ultrasonic frequency: 20kHz
Horn descending speed: 60mm / s
Since the amplitude of the ultrasonic vibration is larger than the fitting gap (substantially 0) between the positioning pin 5 and the positioning hole 14, the ultrasonic vibration acts on the positioning pin 5 in a direction perpendicular to the positioning pin 5, and the positioning pin 5 Break near. 5a is a fracture surface of the positioning pin 5. However, since the positional relationship between the case 1 and the cover 10 is held by the case holding device and the ultrasonic wave applying device, the position of the case 1 and the cover 10 is shifted by more than the ultrasonic amplitude during the application of the ultrasonic vibration. Does not occur. By continuing to apply the ultrasonic vibration even after the positioning pin 5 is broken, the small projections 15 which are in pressure contact with the bonding surface 4 are melted, and the gap between the bonding surfaces 4 and 13 is filled. The fractured surface 5a of the positioning pin 5 may be melted.
(D) shows the state after ultrasonic welding. That is, at the time of ultrasonic welding, a part of the melted resin 17 tends to overflow from the joint surfaces 4 and 13 to the outside, but the groove 16 for absorbing the overflow resin is formed on the outer peripheral edge of the joint surface 13 of the cover 10. Since it is formed, the molten resin 17 accumulates in the groove 16 and does not overflow to the outside. Since the molten resin 17 fills the entire circumference of the joint surfaces 4 and 13, the space between the case 1 and the cover 10 is completely hermetically sealed.
[0015]
As described above, since the direction of the ultrasonic vibration is the horizontal direction, the hermetic welding property is good, and the damage to the case 1, the cover 10 and the built-in components housed in the case 1 is small, and especially the thin wall Is effective for welding the case 1 to the cover 10. Further, since the case 1 and the cover 10 before the ultrasonic welding are positioned by fitting the positioning pins 5 and the positioning holes 14, the positional displacement between the case 1 and the cover 10 after the welding can be prevented by the ultrasonic wave. The vibration amplitude can be kept within the range, and a package with good appearance and dimensional accuracy can be obtained. Further, since the positioning pin 5 is easily broken by the ultrasonic vibration, there is no inconvenience in welding without hindering the ultrasonic vibration.
[0016]
In the above embodiment, the positioning pin is provided on the case side and the small projection for ultrasonic welding is provided on the cover side. However, both the positioning pin and the small projection may be provided only on one side of the case or the cover.
In the package structure of the present invention, since the ultrasonic vibration is the transverse vibration, the impact load is significantly reduced as compared with the longitudinal vibration. Therefore, it is suitable when the components housed inside are delicate components such as piezoelectric elements, precision elements, bump-bonded elements, and wire-bonded elements.
[0017]
【The invention's effect】
As is apparent from the above description, according to the present invention, after the first package component and the second package component are positioned with high precision by fitting the positioning pins and the positioning holes, a transverse ultrasonic vibration is applied. As a result, the positioning pins are broken, and the joining surfaces are ultrasonically welded to each other. Therefore, it is possible to achieve welding with less damage to the package and the components housed therein while performing highly accurate positioning.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component having a package welded by an ultrasonic welding method according to the present invention.
FIG. 2 is an exploded perspective view of a case and a cover shown in FIG.
FIG. 3 is a process diagram showing ultrasonic welding of the case and the cover shown in FIG. 1;
[Explanation of symbols]
1 case (first package component)
4 Joining surface 5 Positioning pin 10 Cover (second package component)
13 joining surface 14 positioning hole 15 small projection for ultrasonic welding 16 overflow resin absorption groove

Claims (3)

樹脂製の第１パッケージ部品と第２パッケージ部品との接合面を超音波溶着して樹脂パッケージを構成する方法において、
上記第１パッケージ部品の接合面に超音波振動により折損し得る少なくとも２本の位置決めピンが一体に形成され、
上記第２パッケージ部品の接合面に上記位置決めピンが嵌合される位置決め穴が形成されており、
上記位置決めピンを位置決め穴に嵌合させ、第１パッケージ部品と第２パッケージ部品とを対向方向に加圧しつつ、上記接合面に対してほぼ平行な方向でかつ位置決めピンと位置決め穴との嵌合隙間より大きな振幅の超音波振動を与えることにより、上記位置決めピンを折るとともに、接合面を溶着することを特徴とする樹脂パッケージの超音波溶着方法。A method of forming a resin package by ultrasonically welding a joining surface between a first package component and a second package component made of resin,
At least two positioning pins that can be broken by ultrasonic vibration are integrally formed on the joint surface of the first package component,
A positioning hole into which the positioning pin is fitted is formed on a joint surface of the second package component;
The positioning pin is fitted in the positioning hole, and the first package component and the second package component are pressed in the opposite direction, while being fitted in a direction substantially parallel to the joint surface and between the positioning pin and the positioning hole. An ultrasonic welding method for a resin package, wherein the positioning pin is broken and a bonding surface is welded by applying an ultrasonic vibration having a larger amplitude. 上記第１パッケージ部品および第２パッケージ部品の一方の接合面に、上記位置決めピンより低い超音波溶着用の小突起を、上記接合面のほぼ全周に連続的に形成し、
上記小突起を超音波溶着することにより、第１パッケージ部品と第２パッケージ部品の接合面を封止することを特徴とする請求項１に記載の樹脂パッケージの超音波溶着方法。Small projections for ultrasonic welding, which are lower than the positioning pins, are formed continuously on one of the joining surfaces of the first package component and the second package component over substantially the entire periphery of the joining surface.
The ultrasonic welding method for a resin package according to claim 1, wherein the small projections are ultrasonically welded to seal a joint surface between the first package component and the second package component. 上記第１パッケージ部品および第２パッケージ部品の一方の接合面に、超音波溶着時の溢出樹脂を吸収するための溝部が設けられていることを特徴とする請求項１または２に記載の樹脂パッケージの超音波溶着方法。3. The resin package according to claim 1, wherein a groove is formed on one of the joining surfaces of the first package component and the second package component for absorbing an overflow resin during ultrasonic welding. 4. Ultrasonic welding method.
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Cited By (14)

* Cited by examiner, † Cited by third party
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WO2006112183A1 (en) 2005-03-31 2006-10-26 Nhk Spring Co., Ltd. Bonded body and bonding method
JP2007007968A (en) * 2005-06-30 2007-01-18 Nippon Plast Co Ltd Positioning structure of resin component
JP2007021626A (en) * 2005-07-14 2007-02-01 Fuji Heavy Ind Ltd Press-in device and press-in method
JP2007165495A (en) * 2005-12-13 2007-06-28 Dainippon Printing Co Ltd Sensor package and method of manufacturing same
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KR100846404B1 (en) 2005-11-25 2008-07-16 도쿄엘렉트론가부시키가이샤 Bonding apparatus and bonding method
JP2008270174A (en) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp Compact self-ballasted fluorescent lamp, and lighting system
JP2008265162A (en) * 2007-04-20 2008-11-06 Takata Corp Vibration-welding method, vibration welding structure, and air bag device
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JP2015094226A (en) * 2013-11-08 2015-05-18 トヨタ紡織株式会社 Resin cylinder head cover
JP2015205592A (en) * 2014-04-21 2015-11-19 カルソニックカンセイ株式会社 Instrument panel structure and processing method for instrument panel
JP2016039122A (en) * 2014-08-11 2016-03-22 株式会社小松ライト製作所 Switch and manufacturing method of the same
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EP1864783A4 (en) * 2005-03-31 2011-09-28 Nhk Spring Co Ltd Bonded body and bonding method
EP1864783A1 (en) * 2005-03-31 2007-12-12 Nhk Spring Company Limited Bonded body and bonding method
WO2006112183A1 (en) 2005-03-31 2006-10-26 Nhk Spring Co., Ltd. Bonded body and bonding method
US8113735B2 (en) 2005-03-31 2012-02-14 Nhk Spring Co., Ltd. Joint structure and joining method
JP2007007968A (en) * 2005-06-30 2007-01-18 Nippon Plast Co Ltd Positioning structure of resin component
JP4721789B2 (en) * 2005-06-30 2011-07-13 日本プラスト株式会社 Resin parts positioning structure
JP2007021626A (en) * 2005-07-14 2007-02-01 Fuji Heavy Ind Ltd Press-in device and press-in method
JP4621555B2 (en) * 2005-07-14 2011-01-26 富士重工業株式会社 Press-fitting device and press-fitting method
KR100846404B1 (en) 2005-11-25 2008-07-16 도쿄엘렉트론가부시키가이샤 Bonding apparatus and bonding method
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US7896052B2 (en) 2005-11-25 2011-03-01 Tokyo Electron Limited Bonding apparatus and bonding method
JP2007165495A (en) * 2005-12-13 2007-06-28 Dainippon Printing Co Ltd Sensor package and method of manufacturing same
JP2008075626A (en) * 2006-09-25 2008-04-03 Fujitsu General Ltd Turbo fan and air conditioner provided therewith
JP2008270174A (en) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp Compact self-ballasted fluorescent lamp, and lighting system
JP2008265162A (en) * 2007-04-20 2008-11-06 Takata Corp Vibration-welding method, vibration welding structure, and air bag device
EP2821206A1 (en) * 2013-07-01 2015-01-07 Gealan Formteile GmbH Component centring
JP2015094226A (en) * 2013-11-08 2015-05-18 トヨタ紡織株式会社 Resin cylinder head cover
JP2015205592A (en) * 2014-04-21 2015-11-19 カルソニックカンセイ株式会社 Instrument panel structure and processing method for instrument panel
JP2016039122A (en) * 2014-08-11 2016-03-22 株式会社小松ライト製作所 Switch and manufacturing method of the same
CN105984118A (en) * 2015-02-06 2016-10-05 上海鸿研物流技术有限公司 Material overflowing preventing structure
JP2018176438A (en) * 2017-04-04 2018-11-15 トヨタ自動車株式会社 Joint resin body

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