CN106298685B - A kind of electronic chip packaging structure using ultrasonic bonding - Google Patents
A kind of electronic chip packaging structure using ultrasonic bonding Download PDFInfo
- Publication number
- CN106298685B CN106298685B CN201610864100.8A CN201610864100A CN106298685B CN 106298685 B CN106298685 B CN 106298685B CN 201610864100 A CN201610864100 A CN 201610864100A CN 106298685 B CN106298685 B CN 106298685B
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- box body
- cover board
- electronic chip
- cavity
- ultrasonic bonding
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- Lining Or Joining Of Plastics Or The Like (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention discloses a kind of electronic chip packaging structure using ultrasonic bonding, which includes cover board and box body made of polyetheretherketonematerials materials；The conical ring that one of section is triangle is circumferentially machined on cover board outer circumference surface, the apex angle of conical ring is arc transition；There is the triangular-section welding structure of one of annular on the bottom surface of cover board；The inner cavity of box body is made of two continuous cylindrical cavities, and the cavity diameter at box opening end is greater than the cavity diameter of closed end, and the triangular-section welding structure of one of annular is circumferentially machined on the step surface between two cylindrical cavities；Cover board is fixed in the major diameter cavity of box body open end by way of ultrasonic bonding, and electronic chip is encapsulated in the minor diameter cavity of box body.The problem of present invention realizes relieved package using reasonable welding structure, is able to solve long-life packages under the complex working conditions such as high pressure, high temperature, impact and oscillating load, acid-base environment.
Description
Technical field
The present invention relates to a kind of encapsulating structures, and in particular to and it is a kind of for storing the encapsulating structure of electronic chip, belong to super
Sonic welding techniques field.
Background technique
Focus development Marine oil and gas resource is proposed in national energy strategy, China's deep-sea oil gas resource exploitation equipment troop meets
The good opportunity that develops on an unprecedented scale is carried out, the important member of equipment troop has been developed as deep-sea oil gas resource, oil pipe and its auxiliary equipment undertake
The key task of On The Oil And Gas Transportation.And using electronic chip as a series of electronic components of representative, carry underground equipment and depth
The life cycle management of extra large exploring equipment manages and maintains mission, had recorded in electronic chip pipeline various specifications parameter and
Safeguard information, electronic chip must be reliably mounted on corresponding pipeline by corresponding encapsulating structure.No matter make in underground
For industry still in deep ocean work, encapsulating structure inevitably, is faced with extremely harsh requirement and extremely severe operating condition, makees
Industry environment has the characteristics that high pressure, high temperature, the weak property of acid, vibration.
Normally, most of encapsulating structure mostly uses screw thread pair to cooperate greatly, some airtight watertight equipment then use rubber
Glue sealing ring is as sealing, pressure-bearing means.Screw thread pair needs the profuse tooth number of turning in processing technology, and sealing position needs pole
Its tooth number grown, to reach expected sealing effect, this design is had the disadvantage that: occupying the confined space, has slackened resistance to
The intensity of laminated structure, while the failure that is extremely easy to be corroded is threadedly engaged in the liquid with severe corrosive, it cannot achieve
Sealing and pressure-bearing under adverse circumstances.At the same time, usual scheme need to configure age inhibiting high quality import sealing ring to realize
Sealing, the rubber seal period is long, price, and service life is extremely limited.
Summary of the invention
In view of this, the present invention provides a kind of electronic chip packaging structure using ultrasonic bonding, the encapsulating structure
Relieved package is realized using reasonable welding structure, high pressure (70MPa), high temperature (200 DEG C), impact and vibration is able to solve and carries
Under the complex working conditions such as lotus, acid-base environment aiming at the problem that carrying out high reliability, long-life packages in extremely limited space.
A kind of electronic chip packaging structure using ultrasonic bonding, which includes being made of polyetheretherketonematerials materials
Cover board and box body, peripheral equipment is electronic chip；
The cover board is circular configuration, and the conical ring that one of section is triangle is circumferentially machined on outer circumference surface,
The conical ring is located at the center of cover sheet thickness, and the apex angle of conical ring is arc transition；Have on the bottom surface of the cover board together
The welding structure of annular, the welded section are triangle；
The inner cavity of the box body is made of two continuous cylindrical cavities, and the cavity diameter at box opening end is greater than closing
The cavity diameter at end forms horizontal step surface between two cylindrical cavities, and one of annular is circumferentially machined on step surface
Welding structure, welded section be triangle；The end face of box body closed end is conical surface；
The cover board is fixed in the major diameter cavity of box body open end by way of ultrasonic bonding, cover board and box body
On welding structure melt after be fastened to each other, electronic chip is encapsulated in the minor diameter cavity of box body.
Further, the substrate of the polyether-ether-ketone uses Wei Gesi 450, and auxiliary material uses glass and carbon fiber, the two ratio
The sum of less than 45%；Temperature during injection molding is maintained at 390 degree, and pressure is maintained at 30MPa.
Further, the cover board with a thickness of 1.8mm, the height of welding structure section triangle is 0.6mm, bottom side length
Degree is 0.7mm.
Further, the height of the box body welding structure section triangle is 0.6mm, and bottom edge length is 0.7mm, cover board
With the welded center of box body away from respectively 8mm and 7mm, the outer diameter of cover board is 17.4mm, and the outer diameter of box body is 20mm, box body
The internal diameter of first cavity is 18mm.
Further, the taper of box body bottom is 2 °.
The utility model has the advantages that
1, while guaranteeing to be enough to bear external pressure, internal disc will not have in largely the thickness of cover board of the present invention
It falls into, and then leads to that there is acid, corrosive liquid indentation cavity after there is pressure break, cause packed chip pressure break, corrosion；
Also it is avoided that invagination depth is once larger, stress can be generated in the maximum part of concavity and concentrated, act directly on electronics member
Unnecessary damage is caused in the upper surface of device.
2, circular cone ring of the processing with minute angle on the outer circumference surface of cover board of the present invention, circular cone ring apex angle use circular arc mistake
It crosses, forms circular conical surface partial pressure and damping effect.As a kind of protection structure, coning angle make coverplate stress be decomposed into lower pressure and
Circumferential pressure, lower pressure are to press the pressure of package main body straight down, and circumferential pressure is the pressure that circumferentially normal is outside, angle
Degree is bigger, and circumferential pressure is bigger, generates lateral bending square=circumferential pressure * body height, and the function which does is destructive useless
Function, thus design the relatively small angle of the angle Selection；At the same time, coning angle, which designs, needs to meet vibration damping in a certain range
Effect, prevents mechanical shock loading.
3, the substrate that polyether-ether-ketone of the present invention uses can resist higher pressure, but poor fluidity；Glass in auxiliary material
Fibre has the function of strengthening rigidity, characteristic of the carbon fiber with self-lubricating, intensity with higher, while flowing with higher
Property, the two makes material have good welding performance after forming by ratio mixed injection molding appropriate.
4, the section designed on box body of the present invention is on the one hand the welding structure of triangle can carry out the energy of welding
It focuses, generates more powerful energy and high temperature, on the other hand moment fusion welding can resist the vibration from cover board, no
Harmful vibration is only reduced, the beneficial vibration to facilitation is welded with is translated into, furthermore also increases local intensity,
It is unlikely to that the bad phenomenons such as conquassation occur when melting completely not yet.
5, box body bottom of the present invention has the conical bottom of certain taper, has the energy of carrying higher pressure higher temperature operating condition
Power, the same cover board of taper design；Box body wall thickness is designed as with the pressure and hydraulic ability for resisting periphery normal direction.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the present invention before welding；
Fig. 2 is the overall structure diagram after welding of the invention；
Fig. 3 is the three dimensional structure diagram of box body of the present invention.
Wherein, 1- cover board, 2- box body.
Specific embodiment
The present invention will now be described in detail with reference to the accompanying drawings and examples.
As shown in Fig. 1, the present invention provides a kind of electronic chip packaging structure using ultrasonic bonding, the encapsulation knots
Structure includes cover board 1 and box body 2 made of polyetheretherketonematerials materials, and peripheral equipment is electronic chip；The material of cover board 1 and box body 2
Using polyether-ether-ketone, the substrate of polyether-ether-ketone uses Wei Gesi 450, and auxiliary material uses 20% glass and 15% carbon fiber, the two
The sum of ratio is less than 45%；Temperature during injection molding is maintained at 390 degree, and pressure is maintained at 30MPa.
The cover board 1 is circular configuration, and the conical ring that one of section is triangle is circumferentially machined on outer circumference surface,
The conical ring is located at the center of 1 thickness of cover board, and the apex angle of conical ring is arc transition；Have on the bottom surface of the cover board together
The welding structure of annular, the welded section are triangle；Cover board 1 with a thickness of 1.8mm, welding structure section triangle
Height be 0.6mm, bottom edge length be 0.7mm.
The inner cavity of box body 2 is made of two continuous cylindrical cavities, and the cavity diameter of 2 open end of box body is greater than closed end
Cavity diameter, form horizontal step surface between two cylindrical cavities, one of annular be circumferentially machined on step surface
Welding structure, welded section are triangle；The end face of 2 closed end of box body is conical surface；Box body welding structure section
The height of triangle is 0.6mm, and bottom edge length is 0.7mm, cover board and the welded center of box body away from respectively 8mm and 7mm,
The outer diameter of cover board is 17.4mm, and the outer diameter of box body is 20mm, and the internal diameter of first cavity of box body is 18mm, the taper of box body bottom
It is 2 °
As shown in Fig. 2 and 3, cover board 1 is fixed on the major diameter cavity of 2 open end of box body by way of ultrasonic bonding
Interior, the welding structure on cover board 1 and box body 2 is fastened to each other after melting, and electronic chip is encapsulated in the minor diameter of box body 2
In cavity.
In conclusion the above is merely preferred embodiments of the present invention, being not intended to limit the scope of the present invention.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (5)
1. a kind of electronic chip packaging structure using ultrasonic bonding, which is characterized in that the encapsulating structure includes by polyethers ether
Cover board made of ketone material and box body, peripheral equipment are electronic chip；
The cover board is circular configuration, and the conical ring that one of section is triangle, the cone are circumferentially machined on outer circumference surface
Shape ring is located at the center of cover sheet thickness, and the apex angle of conical ring is arc transition；There is one of annular on the bottom surface of the cover board
Welding structure, the welded section be triangle；
The inner cavity of the box body is made of two continuous cylindrical cavities, and the cavity diameter at box opening end is greater than closed end
Cavity diameter forms horizontal step surface between two cylindrical cavities, and the weldering of one of annular is circumferentially machined on step surface
Binding structure, welded section are triangle；The end face of box body closed end is conical surface；
Welding of the cover board by way of ultrasonic bonding in the major diameter cavity of box body open end, on cover board and box body
Structure is fastened to each other after melting, and electronic chip is encapsulated in the minor diameter cavity of box body.
2. using the electronic chip packaging structure of ultrasonic bonding as described in claim 1, which is characterized in that the polyethers ether
The substrate of ketone material uses Wei Gesi 450, and auxiliary material uses glass and carbon fiber, and the sum of glass and carbon fiber ratio are less than 45%；Injection molding
During temperature be maintained at 390 degree, pressure is maintained at 30MPa.
3. using the electronic chip packaging structure of ultrasonic bonding as claimed in claim 1 or 2, which is characterized in that the lid
Plate with a thickness of 1.8mm, the height of welding structure section triangle is 0.6mm, and bottom edge length is 0.7mm.
4. using the electronic chip packaging structure of ultrasonic bonding as claimed in claim 3, which is characterized in that the box body weldering
The height of binding structure section triangle is 0.6mm, and bottom edge length is 0.7mm, cover board and the welded center of box body away from respectively
For 8mm and 7mm, the outer diameter of cover board is 17.4mm, and the outer diameter of box body is 20mm, and the internal diameter of first cavity of box body is 18mm.
5. using the electronic chip packaging structure of ultrasonic bonding as described in claim 1, which is characterized in that box body bottom
Taper is 2 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864100.8A CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610864100.8A CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
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| CN106298685A CN106298685A (en) | 2017-01-04 |
| CN106298685B true CN106298685B (en) | 2019-01-04 |
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| CN201610864100.8A Expired - Fee Related CN106298685B (en) | 2016-09-29 | 2016-09-29 | A kind of electronic chip packaging structure using ultrasonic bonding |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108122812A (en) * | 2017-12-15 | 2018-06-05 | 威海万丰镁业科技发展有限公司 | A kind of electronic packaging device and method based on ultrasonic wave solid phase lamination |
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| JPH05264750A (en) * | 1991-12-28 | 1993-10-12 | Eta Sa Fab Ebauches | Watch, watch glass, case and method for fixing glass to watch case |
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| CN201078803Y (en) * | 2007-08-15 | 2008-06-25 | 东莞太洋橡塑制品有限公司 | Encapsulation structure of electronic component |
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| CN106298685A (en) | 2017-01-04 |
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Granted publication date: 20190104 Termination date: 20190929 |