JP2003506873A - 相互接続アセンブリ及び方法 - Google Patents

相互接続アセンブリ及び方法

Info

Publication number
JP2003506873A
JP2003506873A JP2001514483A JP2001514483A JP2003506873A JP 2003506873 A JP2003506873 A JP 2003506873A JP 2001514483 A JP2001514483 A JP 2001514483A JP 2001514483 A JP2001514483 A JP 2001514483A JP 2003506873 A JP2003506873 A JP 2003506873A
Authority
JP
Japan
Prior art keywords
contact element
substrate
beam portion
base portion
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001514483A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003506873A5 (ko
Inventor
エルドリッジ，ベンジャミン，エヌ
マシュー，ゲータン
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/364,788 external-priority patent/US7435108B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2003506873A publication Critical patent/JP2003506873A/ja
Publication of JP2003506873A5 publication Critical patent/JP2003506873A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2001514483A 1999-07-30 2000-07-28 相互接続アセンブリ及び方法 Pending JP2003506873A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US36485599A 1999-07-30 1999-07-30
US09/364,855 1999-07-30
US09/364,788 US7435108B1 (en) 1999-07-30 1999-07-30 Variable width resilient conductive contact structures
US09/364,788 1999-07-30
PCT/US2000/020530 WO2001009952A2 (en) 1999-07-30 2000-07-28 Interconnect assemblies and methods

Publications (2)

Publication Number Publication Date
JP2003506873A true JP2003506873A (ja) 2003-02-18
JP2003506873A5 JP2003506873A5 (ko) 2007-09-13

Family

ID=27002648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001514483A Pending JP2003506873A (ja) 1999-07-30 2000-07-28 相互接続アセンブリ及び方法

Country Status (6)

Country Link
EP (1) EP1208595A2 (ko)
JP (1) JP2003506873A (ko)
KR (2) KR100733525B1 (ko)
AU (1) AU6385600A (ko)
TW (1) TW518916B (ko)
WO (1) WO2001009952A2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011516284A (ja) * 2008-04-08 2011-05-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 傾斜構造体を備えたマイクロメカニカル型の構成エレメントおよび相応する製作方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7137830B2 (en) 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6888362B2 (en) 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6627980B2 (en) 2001-04-12 2003-09-30 Formfactor, Inc. Stacked semiconductor device assembly with microelectronic spring contacts
DE10143790B4 (de) * 2001-09-06 2007-08-02 Infineon Technologies Ag Elektronisches Bauteil mit wenigstens einem Halbleiterchip
US7010854B2 (en) 2002-04-10 2006-03-14 Formfactor, Inc. Re-assembly process for MEMS structures
US10281648B2 (en) * 2013-07-30 2019-05-07 President And Fellows Of Harvard College Device support structures from bulk substrates
KR102655504B1 (ko) 2022-06-10 2024-04-11 영진전자산업 주식회사 스핀들 미세조정장치를 구비한 pcb 챔퍼링 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06213929A (ja) * 1993-01-19 1994-08-05 Sharp Corp 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド
JPH0927521A (ja) * 1995-07-07 1997-01-28 Hewlett Packard Co <Hp> 回路部材の電気接続構造
JPH09129675A (ja) * 1995-10-31 1997-05-16 Oki Electric Ind Co Ltd 素子の実装構造及びその実装方法
JPH09281144A (ja) * 1996-04-15 1997-10-31 Nec Corp プローブカードとその製造方法
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4423401A (en) * 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
JPH05259584A (ja) * 1992-01-14 1993-10-08 Internatl Business Mach Corp <Ibm> 集積光デフレクタおよびその製造方法
JPH06260383A (ja) * 1993-03-03 1994-09-16 Nikon Corp 露光方法
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
JPH08306708A (ja) * 1995-05-09 1996-11-22 Sanyo Electric Co Ltd 半導体装置およびその製造方法
DE69635083T2 (de) * 1995-05-26 2006-05-18 Formfactor, Inc., Livermore Herstellung von verbindungen und ansatzstücken unter verwendung eines opfersubstrats
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06213929A (ja) * 1993-01-19 1994-08-05 Sharp Corp 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド
JPH0927521A (ja) * 1995-07-07 1997-01-28 Hewlett Packard Co <Hp> 回路部材の電気接続構造
JPH09129675A (ja) * 1995-10-31 1997-05-16 Oki Electric Ind Co Ltd 素子の実装構造及びその実装方法
JPH09281144A (ja) * 1996-04-15 1997-10-31 Nec Corp プローブカードとその製造方法
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
JPH10303345A (ja) * 1997-04-28 1998-11-13 Shinko Electric Ind Co Ltd 半導体チップの基板への実装構造
WO1998052224A1 (en) * 1997-05-15 1998-11-19 Formfactor, Inc. Lithographically defined microelectronic contact structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011516284A (ja) * 2008-04-08 2011-05-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 傾斜構造体を備えたマイクロメカニカル型の構成エレメントおよび相応する製作方法
US8847336B2 (en) 2008-04-08 2014-09-30 Robert Bosch Gmbh Micromechanical component having an inclined structure and corresponding manufacturing method

Also Published As

Publication number Publication date
TW518916B (en) 2003-01-21
EP1208595A2 (en) 2002-05-29
WO2001009952A2 (en) 2001-02-08
KR20070043856A (ko) 2007-04-25
KR100807426B1 (ko) 2008-02-25
KR20020022139A (ko) 2002-03-25
WO2001009952A3 (en) 2001-11-15
AU6385600A (en) 2001-02-19
KR100733525B1 (ko) 2007-06-28

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