JP2003338475A - Machining method of brittle material - Google Patents
Machining method of brittle materialInfo
- Publication number
- JP2003338475A JP2003338475A JP2002147552A JP2002147552A JP2003338475A JP 2003338475 A JP2003338475 A JP 2003338475A JP 2002147552 A JP2002147552 A JP 2002147552A JP 2002147552 A JP2002147552 A JP 2002147552A JP 2003338475 A JP2003338475 A JP 2003338475A
- Authority
- JP
- Japan
- Prior art keywords
- brittle material
- unit
- sensitive adhesive
- pressure
- hard plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、脆質材料の加工方
法に係り、更に詳しくは、両面粘着剤層を備えたシート
等を介して硬質板に貼付された半導体ウェハ等の脆質材
料を剥がす方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing a brittle material, and more particularly, to a brittle material such as a semiconductor wafer attached to a hard plate through a sheet having a double-sided adhesive layer. Regarding the method of peeling.
【０００２】[0002]
【従来の技術】従来より、電子産業や光学産業等におい
て、表面に回路パターンが形成された半導体ウェハが広
く利用されるに至っている。この半導体ウェハの厚み
は、従来２００μｍ〜３００μｍ程度に研削加工を施し
ていたが、近時のＩＣチップの小型化や薄型化の要請に
より、５０μｍ程度の極薄への加工が主流になりつつあ
る。そのため、研削加工後の半導体ウェハの保管、搬送
する際に、半導体ウェハに割れや傷が発生し易くなる。
そこで、研削加工を行う前に、半導体ウェハを補強し、
且つ、半導体ウェハのハンドリング性を確保するため、
半導体ウェハをガラス板等の硬質板に固定する方法を採
用する場合がある。半導体ウェハを硬質板に固定するに
際しては、これらをワックスを介して貼付する手法が知
られている。2. Description of the Related Art Conventionally, a semiconductor wafer having a circuit pattern formed on its surface has been widely used in the electronic industry, the optical industry, and the like. Conventionally, the thickness of this semiconductor wafer has been ground to about 200 μm to 300 μm, but due to the recent demand for smaller and thinner IC chips, processing to an extremely thin thickness of about 50 μm is becoming mainstream. . Therefore, when the semiconductor wafer after grinding is stored and transported, the semiconductor wafer is likely to be cracked or scratched.
Therefore, before carrying out the grinding process, the semiconductor wafer is reinforced,
Moreover, in order to secure the handling property of the semiconductor wafer,
A method of fixing a semiconductor wafer to a hard plate such as a glass plate may be adopted. When fixing a semiconductor wafer to a hard plate, a method of sticking these via a wax is known.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記ワ
ックスを介して貼付する場合、ワックスの厚さを均一に
塗布することが困難であり、半導体ウェハを平滑り研削
することが難しくなる。また、ワックス硬質板の端部か
らワックスがはみ出す傾向が強く、作業性に支障がある
という不都合を生じる。更に、半導体ウェハを硬質板か
ら剥がした後、有機溶剤を用いて洗浄しなければなら
ず、自然環境の汚染を招来するという点において好まし
くない。However, when sticking via the wax, it is difficult to apply the wax to a uniform thickness and it is difficult to smooth and grind the semiconductor wafer. In addition, the wax tends to stick out from the edge of the hard hard plate, which causes a problem in workability. Furthermore, after peeling the semiconductor wafer from the hard plate, it must be washed with an organic solvent, which is not preferable in that it causes pollution of the natural environment.
【０００４】そこで、本出願人より、特開２０００−１
３６３６２号公報に開示されるように、ワックスに代え
て熱収縮性のフィルムの両面に粘着剤層を備えた両面粘
着シートを用いて硬質板と半導体ウェハとを貼付する方
法が提案されている。[0004] Therefore, the applicant of the present invention, Japanese Patent Laid-Open No. 2000-1
As disclosed in Japanese Patent No. 36362, there is proposed a method of sticking a hard plate and a semiconductor wafer using a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides of a heat-shrinkable film instead of wax.
【０００５】しかしながら、前記シートを用いて貼付し
た場合には、研削加工後、熱処理がある工程に使用でき
ないという不都合がある。However, when the sheet is pasted, there is a disadvantage in that it cannot be used in a certain process after the grinding process.
【０００６】そこで、本発明者が種々の実験を行ったと
ころ、硬質板から半導体ウェハを剥がす前に、液体中に
浸漬することによって、極薄化した半導体ウェハの割れ
等を回避できることを知見した。Therefore, the inventors of the present invention have conducted various experiments and found that the semiconductor wafer, which has been extremely thinned, can be prevented from cracking by immersing it in a liquid before peeling the semiconductor wafer from the hard plate. .
【０００７】[0007]
【発明の目的】本発明は、前述した不都合を契機とする
知見に基づいて案出されたものであり、その目的は、硬
質板に貼付された半導体ウェハ等の脆質材料を容易に剥
がすことができ、且つ、剥離時における脆質材料の割れ
や傷の発生を防止することができる脆質材料の加工方法
を提供することにある。SUMMARY OF THE INVENTION The present invention has been devised on the basis of the above-mentioned inconvenience as a trigger, and its object is to easily remove brittle materials such as semiconductor wafers attached to a hard plate. It is an object of the present invention to provide a method of processing a brittle material, which is capable of preventing the occurrence of cracks and scratches in the brittle material during peeling.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するた
め、本発明は、脆質材料が両面に粘着剤層を有する両面
粘着シートを介して硬質板に固定されたユニットを形成
し、前記硬質板から脆質材料を剥離する工程を含む加工
方法において、前記ユニットを前記粘着剤と不溶又は難
溶の液体中に浸漬させて、両面粘着シートと脆質材料と
の界面、又は、両面粘着シートと硬質板との界面に前記
液体を侵入させた後、前記ユニットの端部より脆質材料
を剥がす、という手法を採っている。このような手法に
より、粘着剤層の剥離抵抗力が低下するようになり、剥
離時における脆質材料及び硬質板への負荷を軽減するこ
とができる。これにより、極薄化によって剛性が低下し
た脆質材料であっても、硬質板から容易に剥がすことが
でき、且つ、脆質材料及び硬質板の割れ等を防止するこ
とが可能となる。しかも、従来のようにワックス洗浄に
使用するような有機溶剤を用いることなく剥離できるの
で、近時の環境問題に対応することができる。In order to achieve the above object, the present invention provides a unit in which a brittle material is fixed to a hard plate through a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides. In a processing method including a step of peeling a brittle material from a plate, the unit is immersed in a liquid which is insoluble or hardly soluble in the pressure-sensitive adhesive, an interface between the double-sided pressure-sensitive adhesive sheet and the brittle material, or a double-sided pressure-sensitive adhesive sheet. After injecting the liquid into the interface between the hard plate and the hard plate, the brittle material is peeled off from the end of the unit. By such a method, the peeling resistance of the pressure-sensitive adhesive layer is reduced, and the load on the brittle material and the hard plate during peeling can be reduced. As a result, even a brittle material whose rigidity has decreased due to ultra-thinning can be easily peeled off from the hard plate, and cracking of the brittle material and the hard plate can be prevented. Moreover, since peeling can be performed without using an organic solvent which is conventionally used for wax cleaning, it is possible to cope with recent environmental problems.
【０００９】また、本発明における脆質材料は半導体ウ
ェハを対象とすることができる。このような半導体ウェ
ハに本発明を適用することで、加工精度の厳格なる要求
に十分に応えることができる。The brittle material in the present invention can be applied to semiconductor wafers. By applying the present invention to such a semiconductor wafer, it is possible to sufficiently meet strict requirements for processing accuracy.
【００１０】更に、前記半導体ウェハを前記両面粘着シ
ートを介して硬質板に固定した後、半導体ウェハを所定
厚に研削加工することによりユニットを形成する方法を
採用してもよく、更に、半導体ウェハを所定厚に研削加
工した後、さらに所定サイズのチップにダイシングして
ユニットを形成する方法を採ってもよい。これにより、
種々のユニットに対応して半導体ウェハの剥離を行うこ
とが可能となる。Further, a method may be adopted in which the semiconductor wafer is fixed to a hard plate via the double-sided adhesive sheet, and then the semiconductor wafer is ground to a predetermined thickness to form a unit. It is also possible to employ a method in which the unit is formed by performing grinding processing to a predetermined thickness and then dicing into chips of a predetermined size. This allows
It is possible to separate the semiconductor wafer corresponding to various units.
【００１１】また、前記粘着剤層は、紫外線硬化型粘着
剤層からなり、前記粘着剤と不溶又は難溶の液体が、脱
イオン水、純水又はアルコールの何れかを用いるとよ
い。粘着剤層に紫外線硬化型粘着剤を用いた場合、紫外
線を照射して粘着剤層を硬化させることにより、液体中
から取り出しても、侵入した液体により剥離した界面
は、再付着することがない。Further, it is preferable that the pressure-sensitive adhesive layer is composed of an ultraviolet-curable pressure-sensitive adhesive layer, and that the liquid insoluble or slightly soluble in the pressure-sensitive adhesive is deionized water, pure water or alcohol. When an ultraviolet-curable adhesive is used for the adhesive layer, the adhesive layer is cured by irradiating it with ultraviolet light, so that even if the adhesive layer is taken out of the liquid, the interface separated by the invading liquid does not reattach. .
【００１２】更に、前記ユニットを前記粘着剤と不溶又
は難溶の液体中に浸漬させた後、前記ユニットを液体中
から取り出し前記ユニットの脆質材料側に転写テープを
介してその周囲をリングフレームに固定し、前記ユニッ
トの硬質板側を吸着固定し、前記リングフレームの一端
側を徐々に持ち上げ、脆質材料を転写テープ側に転写す
ることにより、脆質材料を硬質板から剥離する方法、或
いは、ユニットの脆質材料側に転写テープを介してその
周囲をリングフレームに固定した後、前記ユニットを前
記粘着剤と不溶又は難溶の液体中に浸漬させ、前記ユニ
ットを液体中から取り出し前記ユニットの硬質板側を吸
着固定し、前記リングフレームの一端側を徐々に持ち上
げ、脆質材料を転写テープ側に転写することにより、脆
質材料を硬質板から剥離する方法も選択的に採用され
る。Further, after the unit is immersed in a liquid insoluble or hardly soluble in the adhesive, the unit is taken out of the liquid, and the periphery of the unit is attached to the brittle material side of the unit via a transfer tape. Fixed to, the hard plate side of the unit is adsorbed and fixed, one end side of the ring frame is gradually lifted, by transferring the brittle material to the transfer tape side, a method of peeling the brittle material from the hard plate, Alternatively, after fixing the periphery to the ring frame via the transfer tape on the brittle material side of the unit, the unit is immersed in a liquid insoluble or hardly soluble in the adhesive, and the unit is taken out of the liquid and removed. The hard plate side of the unit is adsorbed and fixed, and one end of the ring frame is gradually lifted to transfer the brittle material to the transfer tape side. Method for peeling also be employed selectively.
【００１３】[0013]
【発明の実施の形態】本発明における硬質板としては、
例えば、ガラス板、石英板や、アクリル板、ポリ塩化ビ
ニル板、ポリエチレンテレフタレート板、ポリプロピレ
ン板、ポリカーボネート板等のプラスチック板が使用で
きる。硬質板のＡＳＴＭＤ ８８３により定義される硬
度は、好ましくは７０ＭＰａ以上である。硬質板の厚み
は、その材質にもよるが、通常は、０．１〜１０mm程度
である。また、両面粘着シートの粘着剤層に紫外線硬化
型粘着剤を用いる場合には、硬質板は、紫外線透過性の
材質により形成される。BEST MODE FOR CARRYING OUT THE INVENTION As the hard plate in the present invention,
For example, a glass plate, a quartz plate, a plastic plate such as an acrylic plate, a polyvinyl chloride plate, a polyethylene terephthalate plate, a polypropylene plate or a polycarbonate plate can be used. The hardness of the hard plate defined by ASTM D 883 is preferably 70 MPa or more. The thickness of the hard plate depends on its material, but is usually about 0.1 to 10 mm. When a UV-curable pressure-sensitive adhesive is used for the pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet, the hard plate is formed of a UV-transparent material.
【００１４】図１に示すように、本発明に用いる両面粘
着シート１２は、基材フィルム１４、基材フィルム１４
の脆質材料１０に貼付する側の粘着材層１５，及び硬質
板１１に貼付する側の粘着剤層１５’よりなる。基材フ
ィルム１４は寸法安定性、耐熱性、耐溶剤性にすぐれる
ことから、ポリエチレンテレフタレートフィルム、ポリ
エチレンナフタレートフィルム等のポリエステルフィル
ムが好ましく使用される。粘着剤層１５、１５’は、使
用する液体Ｌにそれぞれ不溶性または難溶性であれば何
ら限定されるものではないが、ゴム系、アクリル系、シ
リコーン系、ポリウレタン系、ポリビニルエーテル系の
再剥離型の粘着剤や紫外線硬化型粘着剤あるいは水膨潤
性の粘着剤が用いられる。粘着剤層１５、１５’のう
ち、剥離操作を行う際、先に剥離して欲しい被着体（脆
質材料１０または硬質板１１）の側に設けられる粘着剤
層は、紫外線硬化型粘着剤や水膨潤性の粘着剤からなる
ことが特に好ましい。粘着剤層が紫外線硬化型粘着剤で
あり、液体Ｌに浸漬する前に紫外線硬化していれば、ユ
ニットＵを液体Ｌから取り出して乾燥した後でも、粘着
剤が紫外線で硬化しているため被着体との界面が再び粘
着することがない。また、粘着剤層が水膨潤性粘着剤で
あり液体Ｌが水（脱イオン水、純水等）であれば、粘着
剤層と被着体との界面に水が侵入しやすく、また剥離し
た直後に乾燥しにくいため、その界面が再び粘着しにく
くなる。前記粘着剤層の反対面に設けられる粘着剤層
（後から剥離したい側）は、前述した粘着剤の中から選
択でき、さらに両側に設けられる粘着剤層は同種の粘着
剤であってもよいし、異なってもよい。なお、粘着剤１
５，１５’の選択により、ユニットＵから脆質材料１０
を剥がした際に、両面粘着シート１２が、硬質板１１に
残着する場合と、脆質材料１０に付着して硬質板１１に
残らない場合がある。脆質材料１０に付着した場合は、
剥離した後に脆質材料１０に残った両面粘着シート１２
を剥離すればよい。本発明に用いる液体Ｌは、使用する
粘着剤層１５、１５’と不溶または難溶であり、乾燥が
可能であれば何ら限定されないが、水やアルコール等の
環境に安全な液体が好ましい。脆質材料１０が半導体ウ
エハであり、液体Ｌに水を使用する場合は半導体ウエハ
に悪影響を及ぼさないよう脱イオン水や純水を用いるこ
とが好ましい。本発明において、不溶または難溶という
用語は、粘着剤に液体Ｌが接触した場合に、液体Ｌが粘
着剤に吸収されずにその表面を被覆し、粘着力を消失さ
せるように働く性質を表す。反対に、粘着剤が液体Ｌに
可溶であれば、粘着剤に液体Ｌが吸収されその表面が軟
化し、粘着力が増すような性質を示す。ユニットＵを液
体Ｌに浸漬することにより、液体Ｌは毛細管現象により
顕微鏡では検出できない程度の量が粘着剤層と被着体と
の界面に侵入するものと考えられる。粘着剤は液体Ｌに
不溶または難溶なので、液体Ｌが侵入した界面は非粘着
状態となり剥離しやすくなる。なお、液体Ｌの毛細管現
象を促進させるためには、液体Ｌに界面活性剤を添加し
てもよい。脆質材料１０が半導体ウェハである場合は、
非イオン性界面活性剤を使用することが好ましい。ま
た、ユニットＵを浸漬した液体Ｌの槽に超音波処理を行
って、液体Ｌの毛細管現象を促進させてもよい。本発明
において、ユニットＵから脆質材料１０を剥離する手段
は、何ら限定はない。ユニットＵの脆質材料１０側に転
写テープ１８を粘着し、この転写テープ１８ごと脆質材
料１０を剥離すれば、脆質材料１０を破損する可能性が
小さくなるので好ましい（図４）。また、転写テープ１
８の周囲にダイシング等に使用するリングフレーム１９
を貼着し、このリングフレーム１９でユニットＵを固定
するとリングフレーム１９の操作で、剥離作業が可能と
なるので好ましい。転写テープ１８を脆質材料１０に貼
着するのは、液体Ｌに浸漬する前であっても、後であっ
てもよい。本発明に使用する転写テープ１８は、市販の
ダイシングテープをそのまま使用することができる。市
販のダイシングテープを使用すれば、転写テープ１８に
脆質材料１０を転写した後、そのままの状態でダイシン
グすることが可能となる。As shown in FIG. 1, the double-sided pressure-sensitive adhesive sheet 12 used in the present invention comprises a base film 14 and a base film 14.
The adhesive layer 15 on the side of attaching to the brittle material 10 and the adhesive layer 15 ′ on the side of attaching to the hard plate 11. A polyester film such as a polyethylene terephthalate film or a polyethylene naphthalate film is preferably used because the base film 14 has excellent dimensional stability, heat resistance and solvent resistance. The adhesive layers 15 and 15 'are not particularly limited as long as they are insoluble or sparingly soluble in the liquid L to be used, but may be rubber-based, acrylic-based, silicone-based, polyurethane-based, polyvinyl ether-based removable type. The pressure-sensitive adhesive, the UV-curable pressure-sensitive adhesive, or the water-swellable pressure-sensitive adhesive is used. Among the pressure-sensitive adhesive layers 15 and 15 ′, the pressure-sensitive adhesive layer provided on the side of the adherend (brittle material 10 or hard plate 11) that is desired to be peeled first when performing a peeling operation is an ultraviolet curable pressure-sensitive adhesive. It is particularly preferable that the adhesive comprises a water-swellable pressure-sensitive adhesive. If the pressure-sensitive adhesive layer is a UV-curable pressure-sensitive adhesive and is UV-cured before being immersed in the liquid L, the pressure-sensitive adhesive will be cured by UV light even after the unit U is taken out of the liquid L and dried. The interface with the body does not re-stick. When the pressure-sensitive adhesive layer is a water-swellable pressure-sensitive adhesive and the liquid L is water (deionized water, pure water, etc.), water easily penetrates into the interface between the pressure-sensitive adhesive layer and the adherend and is peeled off. Immediately after that, since it is difficult to dry, the interface becomes difficult to stick again. The pressure-sensitive adhesive layer provided on the opposite surface of the pressure-sensitive adhesive layer (the side to be peeled off later) can be selected from the above-mentioned pressure-sensitive adhesives, and the pressure-sensitive adhesive layers provided on both sides may be the same type of pressure-sensitive adhesive. And may be different. In addition, adhesive 1
The brittle material 10 from the unit U is selected by selecting 5, 15 '.
When peeled off, the double-sided pressure-sensitive adhesive sheet 12 may remain on the hard plate 11 or may adhere to the brittle material 10 and not remain on the hard plate 11. If it adheres to the brittle material 10,
Double-sided adhesive sheet 12 remaining on the brittle material 10 after peeling
Can be peeled off. The liquid L used in the present invention is insoluble or sparingly soluble in the pressure-sensitive adhesive layers 15 and 15 ′ to be used, and is not limited as long as it can be dried, but an environment-safe liquid such as water or alcohol is preferable. When the brittle material 10 is a semiconductor wafer and water is used as the liquid L, it is preferable to use deionized water or pure water so as not to adversely affect the semiconductor wafer. In the present invention, the term insoluble or sparingly soluble represents a property that, when the liquid L comes into contact with the pressure-sensitive adhesive, the liquid L coats the surface of the pressure-sensitive adhesive without being absorbed by the pressure-sensitive adhesive and loses the pressure-sensitive adhesive force. . On the contrary, when the adhesive is soluble in the liquid L, the adhesive L absorbs the liquid L, softens its surface, and exhibits a property of increasing the adhesive strength. It is considered that by immersing the unit U in the liquid L, the liquid L enters the interface between the adhesive layer and the adherend in an amount that cannot be detected by a microscope due to the capillary phenomenon. Since the adhesive is insoluble or hardly soluble in the liquid L, the interface into which the liquid L has entered is in a non-adhesive state and easily peels off. In order to promote the capillary action of the liquid L, a surfactant may be added to the liquid L. When the brittle material 10 is a semiconductor wafer,
Preference is given to using nonionic surfactants. Further, ultrasonic treatment may be performed on the bath of the liquid L in which the unit U is immersed to promote the capillary phenomenon of the liquid L. In the present invention, the means for peeling the brittle material 10 from the unit U is not limited at all. It is preferable to adhere the transfer tape 18 to the brittle material 10 side of the unit U and peel off the brittle material 10 together with the transfer tape 18 because the possibility of damaging the brittle material 10 is reduced (FIG. 4). Also, transfer tape 1
Ring frame 19 used for dicing around 8
It is preferable that the unit U is attached and the unit U is fixed by the ring frame 19 because the peeling work can be performed by operating the ring frame 19. The transfer tape 18 may be attached to the brittle material 10 before or after it is immersed in the liquid L. As the transfer tape 18 used in the present invention, a commercially available dicing tape can be used as it is. If a commercially available dicing tape is used, it is possible to transfer the brittle material 10 to the transfer tape 18 and then perform dicing as it is.
【００１５】なお、脆質材料及び硬質板を接着するため
の両面粘着シート及び転写テープは、脆質材料が面的に
広がりを有していることに対応した説明概念であって、
細長いテープをも含むものである。The double-sided pressure-sensitive adhesive sheet and the transfer tape for bonding the brittle material and the hard plate are explanatory concepts corresponding to the brittle material having a planar spread.
It also includes an elongated tape.
【００１６】[0016]
【実施例】以下、本発明に係る方法の具体的な実施例
を、図面及び比較例を参照しながら説明する。EXAMPLES Specific examples of the method according to the present invention will be described below with reference to the drawings and comparative examples.
【００１７】［実施例１］先ず、脆質材料となる材料と
して、２００ｍｍ径、７２５μｍ厚の半導体シリコンウ
ェハ１０を適用し、５０μｍまで研削加工することによ
り脆質材料とした。また、硬質板として、２００ｍｍ
径、７００μｍ厚のガラス板１１（ソーダライムガラ
ス）を使用した。両面粘着シート１２は、両面が紫外線
硬化型の両面粘着シートを用いた。ここでは、基材フィ
ルム１４をポリエチレンナフタレート（ＰＥＮ、厚さ２
５μｍ）とし、基材フィルム１４の両面の粘着剤層１
５，１５’を紫外線硬化性官能基を有するアクリルポリ
マーからなる２０μｍ厚の紫外線硬化型粘着剤層とし
た。また、転写テープ１８は、紫外線硬化型のダイシン
グテープ（リンテック株式会社製、Ａｄｗｉｌｌ Ｄ６
５０）を使用した。先ず、テープラミネータ（リンテッ
ク株式会社製、Ａｄｗｉｌｌ ＲＡＤ３５００／ｍ１
２）を用いて、両面粘着シート１２の一方の面をシリコ
ンウェハ１０（鏡面側）に貼付し、両面粘着シート１２
をシリコンウェハ１０の外周に沿って切断した。次い
で、両面貼付装置（リンテック株式会社製、Ａｄｗｉｌ
ｌ ＲＡＤ８００１ＬＡ）を用いて、両面粘着シート１
２の他方の面をガラス板１１に貼付し、図１に示される
ように、シリコンウェハ１０をガラス板１１上に固定し
た。次に、ガラス板１１に固定されたシリコンウェハ１
０を研削装置（ディスコ社製、ＤＦＧ−８４０）に搭載
し、シリコンウェハ１０を仕上げ厚さが５０μｍとなる
まで研削した。さらに、ダイシング装置（東京精密社
製、ＡＷＤ４０００Ｂ）を用い、図２に示されるよう
に、シリコンウェハ１０を１０ｍｍ×１０ｍｍのサイズ
のチップに分割してユニットＵを形成した。そして、紫
外線照射装置（リンテック株式会社製、Ａｄｗｉｌｌ
ＲＡＤ２０００／ｍ８）を用いて、ガラス板１１側から
紫外線を照射し、両面粘着シート１２の各粘着剤層１
５，１５’を両方とも硬化させた。続いて、テープマウ
ンタ（リンテック株式会社製、Ａｄｗｉｌｌ ＲＡＤ２
５００／ｍ８）を用いて、ユニットＵのシリコンウェハ
１０（チップ）面に転写テープ１８を貼付し、転写テー
プ１８を介してシリコンウェハ１０（チップ）をリング
フレーム１９（ディスコ社製、ＭＯＤＴＦ２−８−１）
に固定した。リングフレーム１９に固定されたユニット
Ｕを、図３に示されるように、粘着剤層１５，１５’が
不溶の液体Ｌ（２５℃の脱イオン水）の水槽Ｗに１２時
間浸漬した。その後、図４に示されるように、水槽Ｗか
ら取り出したユニットＵのガラス板１１側を吸着テーブ
ルＴ上に載置してから吸着保持した。そして、リングフ
レーム１９の一端側を徐々に持ち上げることによって、
両面粘着シート１２とシリコンウェハ１０との層間で剥
離し、図５に示されるように、シリコンウェハ１０（チ
ップ）をガラス板１１から転写テープ１８に転写した。
結果を表１に示す。Example 1 First, a semiconductor silicon wafer 10 having a diameter of 200 mm and a thickness of 725 μm was applied as a material to be a brittle material, and a brittle material was obtained by grinding up to 50 μm. Also, as a hard plate, 200 mm
A glass plate 11 (soda lime glass) having a diameter of 700 μm was used. As the double-sided pressure-sensitive adhesive sheet 12, a double-sided pressure-sensitive adhesive sheet whose both sides are UV-curable was used. Here, the base film 14 is made of polyethylene naphthalate (PEN, thickness 2).
5 μm) and the pressure-sensitive adhesive layer 1 on both sides of the base film 14
Reference numerals 5 and 15 ′ were 20 μm thick UV-curable pressure-sensitive adhesive layers made of an acrylic polymer having a UV-curable functional group. The transfer tape 18 is an ultraviolet curable dicing tape (Adwill D6 manufactured by Lintec Co., Ltd.).
50) was used. First, a tape laminator (Adwill RAD3500 / m1 manufactured by Lintec Co., Ltd.)
2) is used to attach one surface of the double-sided pressure-sensitive adhesive sheet 12 to the silicon wafer 10 (mirror surface side).
Was cut along the outer periphery of the silicon wafer 10. Next, double-sided sticking device (Adwil manufactured by Lintec Co., Ltd.
Double-sided PSA sheet 1 using RAD8001LA)
The other surface of No. 2 was attached to the glass plate 11, and the silicon wafer 10 was fixed on the glass plate 11 as shown in FIG. Next, the silicon wafer 1 fixed to the glass plate 11
0 was mounted on a grinding machine (DFG-840, manufactured by Disco Co., Ltd.), and the silicon wafer 10 was ground until the finished thickness became 50 μm. Further, using a dicing device (AWD4000B manufactured by Tokyo Seimitsu Co., Ltd.), as shown in FIG. 2, the silicon wafer 10 was divided into chips each having a size of 10 mm × 10 mm to form a unit U. Then, an ultraviolet irradiation device (Adwill, manufactured by Lintec Co., Ltd.)
RAD2000 / m8) is used to irradiate ultraviolet rays from the glass plate 11 side to form each pressure-sensitive adhesive layer 1 of the double-sided pressure-sensitive adhesive sheet 12.
Both 5,15 'were cured. Then, a tape mounter (Adwill RAD2 manufactured by Lintec Co., Ltd.)
500 / m8), the transfer tape 18 is attached to the silicon wafer 10 (chip) surface of the unit U, and the silicon wafer 10 (chip) is attached to the ring frame 19 (manufactured by DISCO, MODTF2-8) via the transfer tape 18. -1)
Fixed to. As shown in FIG. 3, the unit U fixed to the ring frame 19 was immersed in a water tank W of a liquid L (deionized water at 25 ° C.) in which the pressure-sensitive adhesive layers 15 and 15 ′ were insoluble for 12 hours. Then, as shown in FIG. 4, the glass plate 11 side of the unit U taken out from the water tank W was placed on the adsorption table T and then adsorbed and held. Then, by gradually lifting one end of the ring frame 19,
The double-sided adhesive sheet 12 and the silicon wafer 10 were separated from each other, and the silicon wafer 10 (chip) was transferred from the glass plate 11 to the transfer tape 18 as shown in FIG.
The results are shown in Table 1.
【００１８】［実施例２］実施例２では、実施例１に対
し、シリコンウェハ１０の研削加工後にはダイシングを
行わず、転写テープ１８にシリコンウェハ１０を転写し
た後に、転写テープ１８上でフルカットダイシングを行
った。結果を表１に示す。[Embodiment 2] In Embodiment 2, as compared with Embodiment 1, dicing is not performed after the grinding of the silicon wafer 10 and the silicon wafer 10 is transferred onto the transfer tape 18 and then fully transferred onto the transfer tape 18. Cut dicing was performed. The results are shown in Table 1.
【００１９】［実施例３］実施例３では、先ず、テープ
ラミネータを用いて、両面粘着シート１２の一方の面を
ガラス板１１に貼付し、両面粘着シート１２をガラス板
１１の外周に沿って切断した。次いで、両面貼付装置を
用いて、両面粘着シート１２の他方の面をシリコンウェ
ハ１０に貼付し、シリコンウェハ１０をガラス板１１上
に固定した。ガラス板１１に固定されたシリコンウェハ
１０を研削装置に搭載し、シリコンウェハ１０を仕上げ
厚さが５０μｍとなるまで研削した。さらに、ダイシン
グ装置を用いて、シリコンウェハ１０を１０ｍｍ×１０
ｍｍのサイズのチップに分割してユニットＵを形成し
た。次に、紫外線照射装置を用いて、ガラス板１１側か
ら紫外線を照射し、両面粘着シート１２の各粘着剤層１
５，１５’を両方とも硬化させた。その後、ユニットＵ
を、粘着剤１５が不溶の液体Ｌ（２５℃の脱イオン水）
の水槽Ｗに１２時間浸漬した。次いで、テープマウンタ
を用いて、水槽Ｗから取り出したユニットＵのシリコン
ウェハ１０（チップ）面に転写テープ１８を貼付し、転
写テープ１８を介してシリコンウェハ１０（チップ）を
リングフレーム１９に固定した。そして、ユニットＵの
ガラス板１１側を吸着テーブルＴ上に載置してから吸着
保持した。その後、リングフレーム１９の一端側を徐々
に持ち上げることによって、両面粘着シート１２とシリ
コンウェハ１０との層間で剥離し、シリコンウェハ１０
（チップ）をガラス板１１から転写テープ１８に転写し
た。結果を表１に示す。なお、実施例３において使用す
るシリコンウェハ１０、ガラス板１１、両面粘着テープ
１２その他の装置類等は実施例１と同じものを使用し
た。[Example 3] In Example 3, first, one side of the double-sided pressure-sensitive adhesive sheet 12 was attached to the glass plate 11 using a tape laminator, and the double-sided pressure-sensitive adhesive sheet 12 was formed along the outer periphery of the glass plate 11. Disconnected. Next, the other surface of the double-sided pressure-sensitive adhesive sheet 12 was attached to the silicon wafer 10 using a double-sided attachment device, and the silicon wafer 10 was fixed on the glass plate 11. The silicon wafer 10 fixed to the glass plate 11 was mounted on a grinding machine, and the silicon wafer 10 was ground to a finished thickness of 50 μm. Furthermore, using a dicing device, the silicon wafer 10 is set to 10 mm × 10.
The unit U was formed by dividing it into chips each having a size of mm. Next, ultraviolet rays are radiated from the glass plate 11 side by using an ultraviolet ray irradiator, and each pressure-sensitive adhesive layer 1 of the double-sided pressure-sensitive adhesive sheet 12 is irradiated.
Both 5,15 'were cured. Then unit U
Liquid L in which the adhesive 15 is insoluble (deionized water at 25 ° C.)
It was immersed in the water tank W for 12 hours. Then, using a tape mounter, the transfer tape 18 was attached to the silicon wafer 10 (chip) surface of the unit U taken out from the water tank W, and the silicon wafer 10 (chip) was fixed to the ring frame 19 via the transfer tape 18. . Then, the glass plate 11 side of the unit U was placed on the suction table T and then suction-held. After that, by gradually lifting one end of the ring frame 19, the double-sided pressure-sensitive adhesive sheet 12 and the silicon wafer 10 are separated from each other.
The (chip) was transferred from the glass plate 11 to the transfer tape 18. The results are shown in Table 1. The silicon wafer 10, glass plate 11, double-sided adhesive tape 12, and other devices used in Example 3 were the same as those in Example 1.
【００２０】［実施例４］実施例４では、実施例３に対
し、シリコンウェハ１０の研削加工後にはダイシングを
行わず、転写テープ１８にシリコンウェハ１０を転写し
た後に、転写テープ１８上でフルカットダイシングを行
った。結果を表１に示す。[Embodiment 4] In Embodiment 4, as compared with Embodiment 3, dicing is not performed after the silicon wafer 10 is ground and the silicon wafer 10 is transferred onto the transfer tape 18, and then the transfer tape 18 is fully filled. Cut dicing was performed. The results are shown in Table 1.
【００２１】［実施例５〜実施例８］実施例１〜４に対
し、両面粘着テープ１２のガラス板１１に貼付する側の
粘着剤層１５’を水膨潤型のアクリル系粘着剤（厚さ２
０μｍ）とし、シリコンウェハ１０に貼付する側の粘着
剤層１５を実施例１と同様に紫外線硬化型粘着剤を使用
した。これ以外は、同様の加工を行って、それぞれを実
施例５〜実施例８とした。結果を表１に示す。[Examples 5 to 8] In contrast to Examples 1 to 4, the pressure-sensitive adhesive layer 15 'on the side of the double-sided pressure-sensitive adhesive tape 12 to be attached to the glass plate 11 is a water-swelling acrylic pressure-sensitive adhesive (thickness Two
0 μm), and the adhesive layer 15 on the side to be attached to the silicon wafer 10 was an ultraviolet-curable adhesive as in Example 1. Except for this, the same processing was carried out to make each of Examples 5 to 8. The results are shown in Table 1.
【００２２】［比較例１，２］比較例１，２では、前記
ユニットＵを不溶の液体の水槽Ｗに浸漬しなかった以外
は、実施例１，２と同様の加工を行った。結果を表１に
示す。Comparative Examples 1 and 2 In Comparative Examples 1 and 2, the same processing as in Examples 1 and 2 was performed, except that the unit U was not immersed in the water tank W of insoluble liquid. The results are shown in Table 1.
【００２３】[0023]
【表１】 [Table 1]
【００２４】以上のように、各実施例及び比較例におい
て１枚のシリコンウェハ１０から得られたチップ（周辺
チップを除く）及び硬質板１１をそれぞれ観察し、表１
に示されるような結果を得た。As described above, in each of the examples and comparative examples, the chips (excluding the peripheral chips) and the hard plate 11 obtained from one silicon wafer 10 were observed, and Table 1
The results are shown in.
【００２５】ここで、表１に示されるように、実施例１
〜８について、割れが発生したチップは５０枚中１枚も
なく、硬質板１１についても割れが発生しなかった。こ
れに対し、比較例１，２については、割れが発生したチ
ップ１７の枚数が５０枚中１２枚、４２枚となり、硬質
板１１には割れが発生した。Here, as shown in Table 1, Example 1
Regarding Nos. 8 to 8, no chip was found in 50 chips out of 50, and the hard plate 11 was not cracked. On the other hand, in Comparative Examples 1 and 2, the number of cracked chips 17 was 12, 42 out of 50, and the hard plate 11 was cracked.
【００２６】従って、前記実施例１〜８は、脆質材料１
０を剥がすときに、比較例１，２よりもチップ及び硬質
板１１の割れを回避することができることが明らかであ
る。Therefore, the above-mentioned Examples 1 to 8 are similar to the brittle material 1
It is clear that when peeling 0, cracking of the chip and the hard plate 11 can be avoided as compared with Comparative Examples 1 and 2.
【００２７】[0027]
【発明の効果】以上説明したように、本発明によれば、
両面粘着シートを介して貼付された脆質材料及び硬質板
を液体に所定時間浸漬させることにより、両面粘着シー
トの粘着剤層と脆質材料又は硬質板との間に液体が侵入
し、当該粘着剤層の剥離抵抗力を低下させることができ
る。これにより、硬質板から脆質材料を容易に剥がすこ
とができ、且つ、脆質材料の割れや傷等を効果的に回避
することが可能となる。As described above, according to the present invention,
By immersing the brittle material and the hard plate pasted via the double-sided PSA sheet in a liquid for a predetermined time, the liquid penetrates between the PSA layer of the double-sided PSA sheet and the brittle material or the hard plate, The peel resistance of the agent layer can be reduced. Thereby, the brittle material can be easily peeled off from the hard plate, and cracks, scratches, etc. of the brittle material can be effectively avoided.
【図１】本発明方法が適用される脆質材料がシートを介
して硬質板に貼付された状態を示す概略断面図。FIG. 1 is a schematic cross-sectional view showing a state in which a brittle material to which the method of the present invention is applied is attached to a hard plate via a sheet.
【図２】脆質材料のダイシングを行った後の状態を示す
断面図。FIG. 2 is a cross-sectional view showing a state after dicing a brittle material.
【図３】脆質材料及び硬質板を液体に浸漬した状態を示
す断面図。FIG. 3 is a cross-sectional view showing a state in which a brittle material and a hard plate are immersed in a liquid.
【図４】脆質材料及び硬質板を剥離する状態を示す断面
図。FIG. 4 is a cross-sectional view showing a state in which a brittle material and a hard plate are peeled off.
【図５】脆質材料及び硬質板を剥離した後の状態を示す
断面図。FIG. 5 is a cross-sectional view showing a state after peeling a brittle material and a hard plate.
１０ 脆質材料（半導体シリコンウェハ） １１ 硬質板（ガラス板） １２ 両面粘着シート １５，１５’ 粘着剤層 Ｌ 液体 Ｕ ユニット 10 Brittle materials (semiconductor silicon wafers) 11 Hard plate (glass plate) 12 Double-sided adhesive sheet 15,15 'adhesive layer L liquid U unit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 妹尾 秀男 東京都板橋区本町23番23号 リンテック株 式会社内 Ｆターム(参考） 3C058 AA01 AB04 CB02 CB03 DA17 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Hideo Senoo 23-23 Honmachi, Itabashi-ku, Tokyo Lintec Co., Ltd. Inside the company F-term (reference) 3C058 AA01 AB04 CB02 CB03 DA17
Claims (7)
粘着シートを介して硬質板に固定されたユニットを形成
し、前記硬質板から脆質材料を剥離する工程を含む加工
方法において、 前記ユニットを前記粘着剤と不溶又は難溶の液体中に浸
漬させて、両面粘着シートと脆質材料との界面、又は、
両面粘着シートと硬質板との界面に前記液体を侵入させ
た後、 前記ユニットの端部より脆質材料を剥がすことを特徴と
する脆質材料の加工方法。1. A processing method comprising the step of forming a unit in which a brittle material is fixed to a hard plate via a double-sided pressure-sensitive adhesive sheet having pressure-sensitive adhesive layers on both sides, and peeling the brittle material from the hard plate, By immersing the unit in a liquid insoluble or hardly soluble with the pressure-sensitive adhesive, the interface between the double-sided pressure-sensitive adhesive sheet and the brittle material, or,
A method for processing a brittle material, characterized in that the brittle material is peeled from an end of the unit after the liquid is allowed to enter the interface between the double-sided pressure-sensitive adhesive sheet and the hard plate.
を特徴とする請求項１記載の脆質材料の加工方法。2. The method for processing a brittle material according to claim 1, wherein the brittle material is a semiconductor wafer.
を介して硬質板に固定した後、 前記半導体ウェハを所定厚に研削加工することによりユ
ニットを形成することを特徴とする請求項２記載の脆質
材料の加工方法。3. The brittleness according to claim 2, wherein the unit is formed by fixing the semiconductor wafer to a hard plate via the double-sided adhesive sheet and then grinding the semiconductor wafer to a predetermined thickness. Of high quality materials.
た後、さらに所定サイズのチップにダイシングしてユニ
ットを形成することを特徴とする請求項３記載の脆質材
料の加工方法。4. The method for processing a brittle material according to claim 3, wherein after the semiconductor wafer is ground to a predetermined thickness, it is further diced into chips of a predetermined size to form a unit.
からなり、前記粘着剤と不溶又は難溶の液体が、脱イオ
ン水、純水又はアルコールであることを特徴とする請求
項１ないし４の何れかに記載の脆質材料の加工方法。5. The pressure-sensitive adhesive layer comprises an ultraviolet-curable pressure-sensitive adhesive layer, and the liquid insoluble or hardly soluble in the pressure-sensitive adhesive is deionized water, pure water or alcohol. 5. The method for processing a brittle material according to any one of 1 to 4.
溶の液体中に浸漬させた後、前記ユニットを前記液体中
から取り出し前記ユニットの脆質材料側に転写テープを
介してその周囲をリングフレームに固定し、前記ユニッ
トの硬質板側を吸着固定し、前記リングフレームの一端
側を徐々に持ち上げ、脆質材料を転写テープ側に転写す
ることにより、脆質材料を硬質板から剥離することを特
徴とする請求項１ないし５の何れかに記載の脆質材料の
加工方法。6. The unit is immersed in a liquid which is insoluble or hardly soluble in the adhesive, and then the unit is taken out of the liquid and a ring around the brittle material side of the unit via a transfer tape. The brittle material is fixed to a frame, the hard plate side of the unit is adsorbed and fixed, and one end side of the ring frame is gradually lifted to transfer the brittle material to the transfer tape side, thereby peeling the brittle material from the hard plate. The method for processing a brittle material according to any one of claims 1 to 5, wherein:
を介してその周囲をリングフレームに固定した後、前記
ユニットを前記粘着剤と不溶又は難溶の液体中に浸漬さ
せ、前記ユニットを液体中から取り出し前記ユニットの
硬質板側を吸着固定し、前記リングフレームの一端側を
徐々に持ち上げ、脆質材料を転写テープ側に転写するこ
とにより、脆質材料を硬質板から剥離することを特徴と
する請求項１ないし５の何れかに記載の脆質材料の加工
方法。7. The unit is fixed to a brittle material side of the unit with a transfer tape around the periphery of the unit, and then the unit is dipped in a liquid which is insoluble or sparingly soluble in the pressure sensitive adhesive to make the unit liquid. It is characterized in that the brittle material is separated from the hard plate by taking out from the inside, adsorbing and fixing the hard plate side of the unit, gradually lifting one end of the ring frame, and transferring the brittle material to the transfer tape side. The method for processing a brittle material according to any one of claims 1 to 5.
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|---|---|---|---|
| JP2002147552A JP4271409B2 (en) | 2002-05-22 | 2002-05-22 | Processing method for brittle materials |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002147552A JP4271409B2 (en) | 2002-05-22 | 2002-05-22 | Processing method for brittle materials |
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| Publication Number | Publication Date |
|---|---|
| JP2003338475A true JP2003338475A (en) | 2003-11-28 |
| JP4271409B2 JP4271409B2 (en) | 2009-06-03 |
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