JP2003332500A - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JP2003332500A JP2003332500A JP2002136959A JP2002136959A JP2003332500A JP 2003332500 A JP2003332500 A JP 2003332500A JP 2002136959 A JP2002136959 A JP 2002136959A JP 2002136959 A JP2002136959 A JP 2002136959A JP 2003332500 A JP2003332500 A JP 2003332500A
- Authority
- JP
- Japan
- Prior art keywords
- electronic
- resin
- electronic component
- electronic circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発熱性の高い電子部
品を実装した電子回路装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device mounted with an electronic component having a high heat generating property.
【０００２】[0002]
【従来の技術】近年、電子回路装置は消費電力の大きい
パワー部品を取り込み、小型化する要求がある。2. Description of the Related Art In recent years, electronic circuit devices have been required to incorporate power components that consume a large amount of power to reduce their size.
【０００３】そのため小型電子回路装置では発熱性の高
い電子部品の近くに熱の影響を受けたくない電子部品を
配置せざるを得ない場合や、発熱性の高い電子部品同士
が接近して配置される場合がある。Therefore, in a small-sized electronic circuit device, there is no choice but to place an electronic component which does not want to be affected by heat near an electronic component having a high heat generating property, or an electronic component having a high heat generating property is placed close to each other. There is a case.
【０００４】従来技術では、発熱性の高い電子部品で発
生した熱を放熱フィンで放熱する、または基板サイズを
確保し、前述の発熱性の高い電子部品間の距離を大きく
する等の手法、また近年は電子部品を実装した電子回路
基板上に、主として耐腐食性、耐イオンマイグレーショ
ン性の向上、または外力からの保護等の目的で配設する
封止用樹脂に熱伝導性の高いフィラーを混合する事で、
放熱性の向上を図る手法も編み出されている。In the prior art, the heat generated by the electronic components having high heat generating property is radiated by the heat radiation fins, or the size of the board is secured to increase the distance between the electronic components having high heat generating property. In recent years, fillers with high thermal conductivity have been mixed with the sealing resin that is placed mainly on the electronic circuit board on which electronic components are mounted for the purpose of improving corrosion resistance, ion migration resistance, or protection from external forces. By doing
Techniques for improving heat dissipation have also been devised.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上述の手法で
は発熱性の高い電子部品と、熱の影響を受けたくない電
子部品とを混在させて一様に配設し、樹脂またはシリコ
ーンゲルにて両電子部品を封止すると、発熱性の高い電
子部品から発生する熱が、封止用樹脂を介して熱の影響
を受けたくない電子部品へも短時間の間に伝わってしま
う。とりわけ前者の電子部品が一時的に高熱量を発生し
た場合は、その高温の影響が直接的に後者の電子部品に
及ぶ恐れがある。However, in the above-mentioned method, electronic parts having a high heat generation property and electronic parts which do not want to be affected by heat are mixed and uniformly arranged, and resin or silicone gel is used. When both electronic components are sealed, the heat generated from the electronic component having a high heat generating property is transferred to the electronic components which are not desired to be affected by the heat through the sealing resin in a short time. In particular, when the former electronic component temporarily generates a large amount of heat, the high temperature may directly affect the latter electronic component.
【０００６】本発明は上記の点を鑑みてなされたもので
あり、発熱性の電子部品と熱の影響を受けたくない電子
部品とを混在させて実装した場合であっても、後者の電
子部品への熱の影響を低減可能とした電子回路装置を提
供する事を目的とする。The present invention has been made in view of the above points, and even in the case where a heat-generating electronic component and an electronic component which is not desired to be affected by heat are mixed and mounted, the latter electronic component is mounted. An object of the present invention is to provide an electronic circuit device capable of reducing the influence of heat on the electronic circuit device.
【０００７】[0007]
【課題を解決するための手段】請求項１に記載の発明で
は、発熱性の第一の電子部品と、前記第一の電子部品か
ら生ずる熱の影響を受けたくない第二の電子部品とが混
在して実装される電子回路装置であって、前記第一、第
二の電子部品が第一の樹脂またはシリコーンゲルにて封
止され、前記第一の電子部品と前記第二の電子部品との
間にある前記第一の樹脂またはシリコーンゲル中に、前
記第一の樹脂またはシリコーンゲルよりも熱伝導性が低
く、かつ前記第一、第二の電子部品間を実質的に分断す
る第二の樹脂が配設される事を特徴とする。According to a first aspect of the present invention, there is provided a heat-generating first electronic component and a second electronic component which does not want to be affected by heat generated from the first electronic component. An electronic circuit device mounted in a mixed manner, wherein the first and second electronic components are sealed with a first resin or silicone gel, and the first electronic component and the second electronic component A second resin having a lower thermal conductivity than the first resin or the silicone gel in the first resin or the silicone gel between the first and the second electronic components, which substantially separates the first and second electronic components. It is characterized in that the resin is provided.
【０００８】これにより第一、第二の電子部品を混在さ
せて実装しても、第一の電子部品から第二の電子部品へ
の熱の影響の低減が可能になる。特に第一の電子部品が
一時的に高熱量を発生した場合には、第二の樹脂により
第二の電子部品への一時的高熱の伝導を遅らせる事が出
来、その間に熱拡散するため、第二の電子部品への熱の
影響を効果的に低減出来る。そのため電子回路装置自体
の小型化も可能となる。This makes it possible to reduce the influence of heat from the first electronic component on the second electronic component even when the first and second electronic components are mixed and mounted. In particular, when the first electronic component temporarily generates a high amount of heat, the second resin can delay the conduction of the temporary high heat to the second electronic component, and heat is diffused during that time. The effect of heat on the second electronic component can be effectively reduced. Therefore, the electronic circuit device itself can be downsized.
【０００９】請求項２に記載の発明では、発熱性の第一
の電子部品と、前記第一の電子部品から生ずる熱の影響
を受けたくない第二の電子部品とが共通の電子回路基板
上に実装される電子回路装置であって、前記第一、第二
の電子部品及び前記電子回路基板が熱伝導性の高い第一
の樹脂にて封止され、前記第一の電子部品と前記第二の
電子部品との間にある前記第一の樹脂中に、前記第一の
樹脂よりも熱伝導性が低く、かつ前記第一、第二の電子
部品間を実質的に分断する第二の樹脂が配設される事を
特徴とする。According to a second aspect of the present invention, the first electronic component having heat generating property and the second electronic component which does not want to be affected by heat generated from the first electronic component are on a common electronic circuit board. In the electronic circuit device mounted on, the first and second electronic components and the electronic circuit board are sealed with a first resin having a high thermal conductivity, the first electronic component and the first electronic component. In the first resin between the two electronic components, the thermal conductivity is lower than that of the first resin, and the first, the second electronic component that substantially divides between the second electronic component. It is characterized in that a resin is provided.
【００１０】これにより、熱伝導性の高い第一の樹脂を
用いる事で第一の電子部品からの放熱性能を向上させる
事と、その場合でもあっても第二の樹脂の作用により、
第二の電子部品への熱伝導による影響を低減させる事と
の両立が可能になる。そのため当該装置自体の小型化も
可能となり、第二の電子部品の熱による誤動作や故障の
発生を低減する事が可能となる。As a result, by using the first resin having high thermal conductivity, the heat radiation performance from the first electronic component is improved, and even in that case, the action of the second resin is
It is possible to be compatible with reducing the influence of heat conduction to the second electronic component. Therefore, the device itself can be downsized, and the occurrence of malfunction and failure due to heat of the second electronic component can be reduced.
【００１１】請求項３に記載の発明では、前記第二の樹
脂の一端は、前記電子回路基板の主面上に被着される事
を特徴とする。According to a third aspect of the present invention, one end of the second resin is attached to the main surface of the electronic circuit board.
【００１２】これにより、電子回路基板の主面上から前
述の第二の樹脂は配設当初の位置から動く事が少なく一
定の位置を安定的に占めるので、前述の第一、第二の電
子部品間の実質的な分断を安定的なものにする事が出来
る。As a result, the above-mentioned second resin does not move from the initial position on the main surface of the electronic circuit board and occupies a certain position in a stable manner. Substantial division between parts can be made stable.
【００１３】請求項４ならびに５に記載の発明では、第
一、第二の樹脂を収容するケースとそのケースに係合す
る金属部材が前述の電子回路基板に熱伝導可能に配設さ
れる事を特徴する。In the inventions according to claims 4 and 5, the case for accommodating the first and second resins and the metal member engaging with the case are arranged so as to be able to conduct heat to the electronic circuit board. Characterize
【００１４】これにより、第一、第二の樹脂が第一の電
子部品から吸収した熱を前述のケース並びにケースに係
合する金属部材に吸収させる事が出来るので放熱性を更
に向上させる事が出来る。As a result, the heat absorbed by the first and second resins from the first electronic component can be absorbed by the case and the metal member engaged with the case, so that the heat dissipation can be further improved. I can.
【００１５】[0015]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
【００１６】（第一実施形態）本発明の第一実施形態に
かかる電子回路装置について、その概略構成を示す図１
を参照しながら説明する。(First Embodiment) FIG. 1 is a schematic diagram showing the configuration of an electronic circuit device according to a first embodiment of the present invention.
Will be described with reference to.
【００１７】図１（ａ）は図１（ｂ）中の１ｂ−１ｂ線
に沿った電子回路装置１０の断面図であり、図１（ａ）
は図１ｂ中の１ａ−１ａ線に沿った電子回路装置１０の
断面図である。FIG. 1A is a sectional view of the electronic circuit device 10 taken along the line 1b-1b in FIG. 1B.
1A is a cross-sectional view of the electronic circuit device 10 taken along the line 1a-1a in FIG. 1b.
【００１８】図１（ａ）に示す電子回路装置１０は、一
端面が開口したケース７内に電子回路基板３を挿入後、
このケース７内に封止用樹脂４を注ぎ硬化させる、注型
法を用いたＳＩＰ（Single In-Line Package）タイプ
の電子回路装置である。In the electronic circuit device 10 shown in FIG. 1A, after the electronic circuit board 3 is inserted into the case 7 whose one end face is open,
This is a SIP (Single In-Line Package) type electronic circuit device using a casting method in which the sealing resin 4 is poured into the case 7 and cured.
【００１９】電子回路装置１０は発熱性電子部品１並び
に熱の影響を受けたくない電子部品２をはじめとする、
図示しない多数の電子部品を実装した長方形の板状部材
である電子回路基板３と、この長手方向に順次並べると
共にこの短手方向に略平行方向に配設される複数のリー
ド端子６と、この電子回路基板３が挿入されるケース７
と、そのケース７の内部に充填され、固着する封止用樹
脂４からなる。The electronic circuit device 10 includes an exothermic electronic component 1 and an electronic component 2 which is not desired to be affected by heat.
An electronic circuit board 3 which is a rectangular plate-shaped member on which a large number of electronic components (not shown) are mounted, a plurality of lead terminals 6 which are sequentially arranged in the longitudinal direction and are arranged substantially parallel to the lateral direction, Case 7 into which the electronic circuit board 3 is inserted
And a sealing resin 4 that is filled and fixed inside the case 7.
【００２０】リード端子６は前述の電子回路基板３上の
図示しない配線パターンと電気的に接続され、電子回路
装置１０が実装される、図示しない表面に挿通孔を備え
た基板に挿通、半田づけされる導通性の端子であり、そ
の多くは線状の細長い板状をなす。The lead terminals 6 are electrically connected to a wiring pattern (not shown) on the electronic circuit board 3 described above, and are inserted and soldered in a board (not shown) having an insertion hole on the surface on which the electronic circuit device 10 is mounted. It is a conductive terminal, and most of them have a linear elongated plate shape.
【００２１】リード端子６の図示しない実装基板側の一
端の先端部位の表面には、前述の半田の接合強度を向上
させると同時に、実装品質の経時的劣化を低減させる為
にＡｕメッキが施される事もある。The surface of the tip portion of one end of the lead terminal 6 on the side of the mounting board (not shown) is plated with Au in order to improve the joint strength of the above-mentioned solder and at the same time reduce the deterioration of the mounting quality with time. Sometimes
【００２２】また、リード端子６の他端は前述の通り電
子回路基板３上の図示しない配線パターンと電気的に接
続され、この電気的な接続の形態には例えば図２（ａ）
に示すようにリード端子６の先端部を電子回路基板３上
の図示しない配線パターン上に乗せて直接半田付けする
方法、図２（ｂ）に示すようにリード端子６の先端部が
クリップ状に形成されており、このクリップ部位が電子
回路基板３上の図示しない配線パターンを電子回路基板
３ごと挟み込んだ後、半田付けを行う方法、図２（ｃ）
に示すように前述の（ｂ）と同じクリップ形状を成すが
（ｂ）のクリップ部位とは逆方向をクリップする方法等
があり、上記のどの形態による電気的接続かは当該ＳＩ
Ｐ製品の生産の規模、要求される品質水準の度合いな
ど、総合的見地から選択される事が多い。Further, the other end of the lead terminal 6 is electrically connected to a wiring pattern (not shown) on the electronic circuit board 3 as described above, and the form of this electrical connection is, for example, as shown in FIG.
As shown in FIG. 2, a method of placing the tip of the lead terminal 6 on a wiring pattern (not shown) on the electronic circuit board 3 and directly soldering it, and as shown in FIG. 2B, the tip of the lead terminal 6 is formed into a clip shape. 2C, in which the clip portion is formed and the wiring pattern (not shown) on the electronic circuit board 3 is sandwiched together with the electronic circuit board 3 and then soldered.
There is a method of clipping the same clip shape as the above-mentioned (b) but clipping in the opposite direction to the clip portion of (b) as shown in FIG.
Often selected from a comprehensive point of view, such as the scale of P product production and the degree of quality level required.
【００２３】本実施例で例示する電子回路装置１０のリ
ード端子６の代表的なリード間の標準間隔は約２．５４
ｍｍ（約０．１インチ）だが、このＳＩＰタイプを小型
化したものではリード端子６の多本数化が進んでおり、
前述の標準間隔の約１／２間隔の製品も存在する。The standard interval between the typical leads of the lead terminals 6 of the electronic circuit device 10 illustrated in this embodiment is about 2.54.
Although it is mm (about 0.1 inch), the number of lead terminals 6 is increasing in the miniaturized version of this SIP type.
There are also products that are about 1/2 the standard spacing described above.
【００２４】また、ケース７は樹脂等からなり、製造時
の誤捺印防止の為、検査時の図示しない検査治具への逆
挿入防止の為、実装時の図示しない実装基板への逆実装
防止の為に、例えば図３（ａ）または図３（ｂ）に示す
ように、外観的形状で方向性を示す目印的部位を備える
事が多い。Further, the case 7 is made of resin or the like, for preventing improper marking at the time of manufacturing, for preventing reverse insertion into an inspection jig (not shown) at the time of inspection, and for preventing reverse mounting on a mounting board (not shown) at the time of mounting. Therefore, as shown in FIG. 3 (a) or 3 (b), for example, there are many cases where a mark portion showing a directivity is provided in an external shape.
【００２５】更に前述のリード端子６が常に所定の位置
に配設されるようにする為、またケース７内に挿入する
前述の電子回路基板３の逆挿入等を防ぐために、ケース
７内部には挿入用の図示しないガイド機構が設けられて
いる事もある。Further, in order to ensure that the lead terminals 6 are always arranged at predetermined positions, and to prevent the electronic circuit board 3 inserted into the case 7 from being reversely inserted, the inside of the case 7 is A guide mechanism (not shown) for insertion may be provided.
【００２６】また、電子回路基板３はその構成素材とし
て電気的絶縁性が高く、高温に対し物理的、化学的に安
定しており、曲がり、反り、うねり等の発生が少ないガ
ラスエポキシ樹脂またはセラミック等が多く用いられて
いる。The electronic circuit board 3 has a high electrical insulating property as its constituent material, is physically and chemically stable against high temperatures, and has little occurrence of bending, warping, undulation, etc., glass epoxy resin or ceramic. Etc. are often used.
【００２７】前述の封止用樹脂４の役割としては電子回
路基板３をケース７内に固定する事および実装されてい
る各電子部品１、２を外気や湿気から保護する事の他
に、電子回路装置１０全体の放熱性能を向上する為の高
い熱伝導性ならびに高い品質を維持するための、低い熱
膨張性、高い成形性等が求められている。The role of the sealing resin 4 is to fix the electronic circuit board 3 in the case 7 and to protect the mounted electronic components 1 and 2 from the outside air and moisture. High thermal conductivity for improving the heat dissipation performance of the circuit device 10 as a whole and low thermal expansion and high moldability for maintaining high quality are required.
【００２８】特に封入後は内部で固着する事から、封止
用樹脂４の求められる化学的性質としては電子回路基板
３の表面上の経時的変化を抑えるため、酸無水物系の性
質を持ち、更に金属との接着性が良く吸水性の少ない性
質を持った樹脂が多く用いられ、例えばエポキシ樹脂等
が代表的である。In particular, since the resin is fixed inside after encapsulation, the required chemical property of the sealing resin 4 is an acid anhydride type property in order to suppress the change over time on the surface of the electronic circuit board 3. In addition, a resin having a property of good adhesion to a metal and a low water absorption is often used, and an epoxy resin or the like is typical.
【００２９】現在の電子回路基板３上に実装される電子
部品点数の多数化とそれに伴う単位体積あたりの発熱量
の増大に対しては、前述の封止用樹脂４の熱伝導性能を
向上させる為にフィラーを混入させる事で対応する手法
が確立しており、そのフィラーとは主として酸化マグネ
シウムまたはアルミニウム粉末等が用いられる事が多
い。With respect to the increase in the number of electronic components mounted on the electronic circuit board 3 at present and the increase in the amount of heat generated per unit volume due to the increase in the number of electronic components, the heat conduction performance of the sealing resin 4 is improved. Therefore, a corresponding method has been established by mixing a filler, and magnesium oxide or aluminum powder is often used as the filler.
【００３０】また発熱性電子部品１は、主としてパワー
トランジスタ、パワートランジスタを内蔵するＩＣ、サ
イリスタなどの高電力型能動素子であり、他方、熱の影
響を受けたくない電子部品２は主として温度による特性
変化を問題にする抵抗、コンデンサ、発振素子等の受動
素子や、温度による暴走や高速動作が制限される事を問
題にするマイクロコンピューターチップ等の能動素子で
ある。The heat-generating electronic component 1 is mainly a high power active element such as a power transistor, an IC incorporating the power transistor, or a thyristor, while the electronic component 2 which is not desired to be affected by heat has characteristics mainly due to temperature. It is a passive element such as a resistor, a capacitor, or an oscillating element that causes a change, or an active element such as a microcomputer chip that causes a limitation of runaway or high speed operation due to temperature.
【００３１】この発熱性電子部品１から放熱される熱
は、駆動時間すなわち電流が供給され続ける時間に応じ
てその発熱量は増加する事が知られており、その熱は摂
氏で十数度から数十度に達する事がある。It is known that the heat radiated from the heat-generating electronic component 1 increases in the amount of heat generated according to the driving time, that is, the time during which the current continues to be supplied. It can reach tens of degrees.
【００３２】また樹脂５は、発熱性電子部品１より発生
した熱の影響が直接的に前述の電子部品２に及ばないよ
うに熱の伝導を遅延する役目を持つ。The resin 5 also has a function of delaying the conduction of heat so that the influence of the heat generated from the heat-generating electronic component 1 does not directly affect the electronic component 2 described above.
【００３３】そのために少なくとも両電子部品１、２と
の間でかつ両電子部品１、２が対向する位置に配設され
る。Therefore, at least the electronic components 1 and 2 are arranged at a position where the electronic components 1 and 2 face each other.
【００３４】この樹脂５は、前述の封入用樹脂４が封入
される前に電子回路基板３上の所定位置に壁状または凸
状に配設、固着され実質的に封入用樹脂４を分断してい
る。This resin 5 is arranged in a wall shape or a convex shape at a predetermined position on the electronic circuit board 3 before the encapsulating resin 4 is encapsulated, and is fixed so as to substantially divide the encapsulating resin 4. ing.
【００３５】この樹脂５の形成方法としては、例えば図
示しない壁状の樹脂部材を予め用意しておき、この樹脂
部材を電子回路基板３上に固着させる方法、または樹脂
部材を積み上げるように複数回重ねて塗布し硬化させて
凸状に形成させる方法がある。As a method for forming the resin 5, for example, a wall-shaped resin member (not shown) is prepared in advance, and the resin member is fixed on the electronic circuit board 3, or a plurality of resin members are stacked so as to be stacked. There is a method of forming a convex shape by applying it overlying and curing it.
【００３６】この樹脂５は封入用樹脂４と同じく低い熱
膨張性と高い成形性を持ち、また化学的性質としても酸
無水物系の性質を持ち、さらに金属との接着性が良く吸
水性の少ない性質を持った樹脂である事が望ましい。This resin 5 has low thermal expansion and high moldability like the encapsulating resin 4, has an acid anhydride type chemical property, and has good adhesiveness to metal and water absorbability. It is desirable that the resin has few properties.
【００３７】この樹脂５の電子回路基板３上の配設場所
は選択的に行われ、図１では直線的な形状を持つ壁状の
それが例示されているが、発熱性電子部品１と熱の影響
を受けたくない電子部品２とは実際には電子部品基板３
上に数多く実装されているので、その間の隅々にまで充
填されている前述の封入用樹脂４を実質的に分断するよ
うに配設されるため、様々な形状を成す事となる。The location of the resin 5 on the electronic circuit board 3 is selectively provided, and a wall-shaped one having a linear shape is shown in FIG. 1 as an example. The electronic component 2 that does not want to be affected by is actually the electronic component substrate 3
Since a large number of them are mounted on the above, they are arranged so as to substantially divide the above-mentioned encapsulating resin 4 filled in every corner between them, so that various shapes are formed.
【００３８】発熱性電子部品１が発した熱は樹脂５を迂
回する間に封止用樹脂４に熱拡散されケース７を介し
て、外部へ放熱される。The heat generated by the heat-generating electronic component 1 is diffused into the sealing resin 4 while bypassing the resin 5, and is radiated to the outside through the case 7.
【００３９】この時、発熱性電子部品１から直接的に電
子部品２側に向かう熱は樹脂５にその伝導を阻まれ、熱
伝導が遅くなる。At this time, the heat from the heat-generating electronic component 1 directly toward the electronic component 2 is blocked by the resin 5 and the heat conduction becomes slow.
【００４０】特に発熱性電子部品１が一時的に高熱量を
発生した場合には、その高温の影響が直接的に電子部品
２に伝わるのを防止出来る。In particular, when the heat-generating electronic component 1 temporarily generates a large amount of heat, the influence of the high temperature can be prevented from being directly transmitted to the electronic component 2.
【００４１】また定常的に熱が発生する場合でも、封止
用樹脂４の熱伝導性を高くして放熱性を高めつつ、樹脂
４、５の熱伝導性の設定、組み合わせにより電子部品２
が持っている温度の特性値を超えないように出来、電子
部品２の破損、誤動作等の発生率は樹脂５を配設してい
ない従来の電子回路装置のそれよりも低減する事が出来
る。Even when heat is constantly generated, the electronic component 2 is set by combining and setting the thermal conductivity of the resins 4 and 5 while enhancing the thermal conductivity of the sealing resin 4 to enhance the heat dissipation.
It is possible to prevent the temperature from exceeding the characteristic value of the temperature, and the occurrence rate of damage and malfunction of the electronic component 2 can be reduced as compared with that of the conventional electronic circuit device in which the resin 5 is not provided.
【００４２】また従来は放熱性向上の観点からの設計
上、発熱性電子部品１と熱の影響を受けたくない電子部
品２との間の距離は、封止用樹脂４の熱伝導性を考慮に
入れた一定の距離を確保する事が必要であった。Further, in the conventional design, the distance between the heat-generating electronic component 1 and the electronic component 2 which does not want to be affected by heat is taken into consideration in the thermal conductivity of the encapsulating resin 4 from the viewpoint of improving heat dissipation. It was necessary to secure a certain distance put in.
【００４３】しかし、本発明のように樹脂５を予め電子
回路基板３上の、封止用樹脂４を実質的に分断するよう
に配設する事によって、従来熱の影響を低減させる為に
確保していた電子部品間の距離を短くして、電子回路基
板３を設計開発する事が出来、電子回路装置１０の小型
化への要求にも対応する事が出来る。However, by preliminarily disposing the resin 5 on the electronic circuit board 3 so as to substantially divide the sealing resin 4 as in the present invention, it is ensured in order to reduce the influence of conventional heat. It is possible to design and develop the electronic circuit board 3 by shortening the distance between the electronic components which has been used, and it is possible to meet the demand for miniaturization of the electronic circuit device 10.
【００４４】また、本実施形態は前述したように注型法
によるＳＩＰタイプの製品についての例示であるが、同
様にＤＩＰ（Dual In-Line Package）タイプ、ＦＩＰ
（Flat In-Line Package）タイプ等の各電子回路装置
にも適用する事が出来る。Further, although the present embodiment is an example of the SIP type product by the casting method as described above, similarly, the DIP (Dual In-Line Package) type, FIP
It can be applied to each electronic circuit device such as (Flat In-Line Package) type.
【００４５】（第二実施例）本発明の第二実施形態にか
かる電子回路装置について、その概略構成を示す図４を
参照しながら説明する。(Second Example) An electronic circuit device according to a second embodiment of the present invention will be described with reference to FIG. 4 showing its schematic configuration.
【００４６】図４（ａ）は図４（ｂ）中の４ｂ−４ｂ線
に沿った電子回路２０の断面図であり、図４（ａ）は図
４ｂ中の４ａ−４ａ線に沿った電子回路装置２０の断面
図である。FIG. 4A is a sectional view of the electronic circuit 20 taken along line 4b-4b in FIG. 4B, and FIG. 4A is an electron taken along line 4a-4a in FIG. 4b. 3 is a cross-sectional view of the circuit device 20. FIG.
【００４７】図４に示した電子回路装置は、ケースを用
いず金型の中に電子回路基板１３を設置し、そこに封止
用樹脂１４を注入し、固化させるトランスファモールド
法等を用いて成形した電子回路装置である。この電子回
路基板１３は第一実施形態の電子回路基板３とほぼ同じ
構成である。In the electronic circuit device shown in FIG. 4, the electronic circuit board 13 is placed in a mold without using a case, and a sealing resin 14 is injected into the electronic circuit board 13 and solidified by a transfer molding method or the like. It is a molded electronic circuit device. The electronic circuit board 13 has almost the same structure as the electronic circuit board 3 of the first embodiment.
【００４８】トランスファモールド法とは、あらかじめ
リードフレーム１６にＩＣチップ等の回路素子をワイヤ
ボンディング等により組み込んでおき、これを金型に入
れて、粉末状またはタブレット状のエポキシ樹脂等に温
度と圧力をかけて溶融させ、粘度の低い状態にして金型
内に注入し固化させる製法である。In the transfer molding method, a circuit element such as an IC chip is preliminarily incorporated in the lead frame 16 by wire bonding or the like, and the lead frame 16 is put in a mold, and powdered or tablet-shaped epoxy resin or the like is heated at a temperature and pressure. It is a manufacturing method in which it is melted by pouring it into a state where it has a low viscosity and is poured into a mold to be solidified.
【００４９】前述の製法により大量生産に向いており、
成形圧力と成形速度を低くして細かい成形上のコントロ
ールが出来るので、繊細な構造や特性を損なわないの
で、現在ＩＣやＬＳＩの主要封止法になっている。Suitable for mass production by the above-mentioned manufacturing method,
Since the molding pressure and the molding speed can be lowered and fine molding control can be performed without deteriorating the delicate structure and characteristics, it is currently the main encapsulation method for ICs and LSIs.
【００５０】電子回路基板１３を前述の図示しない金型
の中に入れる前に、前述の第一実施形態で示したのと同
様に、樹脂５を発熱性電子部品１と熱の影響を受けたく
ない電子部品２との間に選択的に配設し、その後金型内
に流入する封止用樹脂１４で成形する。Before inserting the electronic circuit board 13 into the mold (not shown), the resin 5 is not affected by the heat generating electronic component 1 as in the case of the first embodiment. It is selectively disposed between the electronic component 2 and the electronic component 2 that is not present, and is then molded with the sealing resin 14 that flows into the mold.
【００５１】その際、樹脂１４の流入方向と樹脂５の配
設方向を略平行に揃えて金型内に設置する事により、樹
脂１４の流入、充填をスムーズに出来る。At this time, the resin 14 can be smoothly introduced and filled by aligning the resin 14 inflow direction and the resin 5 disposition direction substantially parallel to each other and installing them in the mold.
【００５２】これにより発熱性電子部品１からの熱が熱
の影響を受けたくない電子部品２へ伝わりにくくなり、
第一実施形態で例示したのと同じように、該電子部品２
の破損、誤動作等の発生率の低減、また小型化の要求を
満たせる電子回路装置２０を得る事が出来る。As a result, it becomes difficult for the heat from the heat-generating electronic component 1 to be transferred to the electronic component 2 which does not want to be affected by the heat.
In the same manner as illustrated in the first embodiment, the electronic component 2
It is possible to obtain the electronic circuit device 20 that can satisfy the requirements of reduction in the occurrence of damage, malfunction, etc. and miniaturization.
【００５３】（第三実施形態）本発明の第三実施形態に
かかる電子回路装置について、その概略構成を示す図５
を参照しながら説明する。(Third Embodiment) An electronic circuit device according to a third embodiment of the present invention is shown in FIG.
Will be described with reference to.
【００５４】図５（ａ）は図５（ｂ）中の５ｂ−５ｂ線
に沿った電子回路３０の断面図であり、図５（ａ）は図
５ｂ中の５ａ−５ａ線に沿った電子回路装置３０の断面
図である。FIG. 5A is a sectional view of the electronic circuit 30 taken along the line 5b-5b in FIG. 5B, and FIG. 5A shows the electron taken along the line 5a-5a in FIG. 5B. 3 is a cross-sectional view of the circuit device 30. FIG.
【００５５】図５に示す電子回路装置３０はアルミダイ
キャスト製のケース２７の内部に電子回路基板２３を設
置し該基板２３の背面をケース２７の底部と熱伝導可能
に接着し、熱伝導性の低い樹脂５の上端が空気中に露出
する程度までシリコーンゲル２４を封入後、同じアルミ
ダイキャスト製の蓋２８にて封止した電子回路装置であ
る。In the electronic circuit device 30 shown in FIG. 5, an electronic circuit board 23 is installed inside an aluminum die-cast case 27, and the back surface of the board 23 is adhered to the bottom of the case 27 so as to be thermally conductive. This is an electronic circuit device in which the silicone gel 24 is encapsulated to the extent that the upper end of the low-resin resin 5 is exposed in the air, and then sealed with the same aluminum die-cast lid 28.
【００５６】シリコーンゲル２４の封入は電子回路装置
３０の耐湿性を高め、電子回路基板２３上に実装された
各電子部品を保護すると同時に電子回路基板２３上の発
熱性電子部品１からの放熱を吸収しケース２７を介して
外部に効率よく放熱する効果がある。The encapsulation of the silicone gel 24 enhances the moisture resistance of the electronic circuit device 30, protects each electronic component mounted on the electronic circuit board 23, and at the same time radiates heat from the heat generating electronic component 1 on the electronic circuit board 23. It has an effect of absorbing and efficiently radiating heat to the outside through the case 27.
【００５７】前述のアルミダイキャスト製のケース２７
内に設置された電子回路基板２３は前述の第一実施形態
で例示した電子回路基板３とほぼ同じ構成である。The above-mentioned aluminum die-cast case 27
The electronic circuit board 23 installed therein has almost the same configuration as the electronic circuit board 3 exemplified in the above-described first embodiment.
【００５８】前述の第一実施形態での例示と同じように
樹脂５が発熱性の高い電子部品１からの熱の伝導を妨げ
遅くするので、熱の影響を受けたくない電子部品２の熱
の影響を低くし、ひいては電子回路装置３０の動作上の
信頼性を高める事が可能となっている。As in the case of the above-described first embodiment, the resin 5 prevents and slows the conduction of heat from the electronic component 1 having a high heat generating property, so that the heat of the electronic component 2 which is not desired to be affected by the heat is absorbed. It is possible to reduce the influence and to enhance the operational reliability of the electronic circuit device 30.
【００５９】また、図６に示すように電子回路装置３０
の放熱性を更に向上させる為に前述のアルミダイキャス
ト製のケース２７の裏面に放熱板２５が係合していても
良い。Further, as shown in FIG. 6, the electronic circuit device 30
In order to further improve the heat dissipation of the above, the heat dissipation plate 25 may be engaged with the back surface of the case 27 made of aluminum die cast.
【００６０】これにより電子回路装置３０の動作上の品
質を向上する事が出来るとともに、電子回路装置３０の
小型化の要求に応える事が出来る。As a result, the operational quality of the electronic circuit device 30 can be improved and the demand for miniaturization of the electronic circuit device 30 can be met.
【図１】（ａ）（ｂ）ともに第一実施形態にかかる電子
回路装置１０の断面図である。FIG. 1A and FIG. 1B are cross-sectional views of an electronic circuit device 10 according to a first embodiment.
【図２】電子回路基板３とリード線６との電気的接続の
例示であり、（ａ）は直接半田付けの例示図であり、
（ｂ）はクリップ型接続の例示図であり、（ｃ）はクリ
ップ型接続の第二の例示図である。FIG. 2 is an illustration of an electrical connection between an electronic circuit board 3 and a lead wire 6, (a) is an illustration of direct soldering,
(B) is an illustration figure of a clip type connection, (c) is a 2nd illustration figure of a clip type connection.
【図３】（ａ）（ｂ）ともに第一実施形態にかかる電子
回路装置１０が備えるケース７の外観的形状の例示図で
ある。FIG. 3A and FIG. 3B are each an exemplary view of an external shape of a case 7 included in the electronic circuit device 10 according to the first embodiment.
【図４】（ａ）（ｂ）ともに第一実施形態にかかる電子
回路装置２０の断面図である。FIG. 4A and FIG. 4B are cross-sectional views of an electronic circuit device 20 according to the first embodiment.
【図５】（ａ）（ｂ）ともに第一実施形態にかかる電子
回路装置３０の断面図である。5A and 5B are cross-sectional views of the electronic circuit device 30 according to the first embodiment.
【図６】（ａ）（ｂ）ともに第一実施形態にかかる電子
回路装置３０の断面図である。FIG. 6A and FIG. 6B are sectional views of the electronic circuit device 30 according to the first embodiment.
１ 発熱性電子部品（第一の電子部品）
２ 熱の影響を受けたくない電子部品（第二の電子部
品）
３ １３ ２３ 電子回路基板
４ １４ 封止用樹脂（第一の樹脂）
５ 熱伝導性の低い樹脂（第二の樹脂）
６ １６ リード端子
７ ケース
８ ハンダ
１０ ２０ ３０ 電子回路装置
２４ シリコーンゲル
２５ 放熱板
２７ アルミダイキャストケース
２８ アルミダイキャストケースの蓋DESCRIPTION OF SYMBOLS 1 Exothermic electronic component (first electronic component) 2 Electronic component that does not want to be affected by heat (second electronic component) 3 13 23 Electronic circuit board 4 14 Sealing resin (first resin) 5 Heat conduction Low-resistivity resin (second resin) 6 16 Lead terminal 7 Case 8 Solder 10 20 30 Electronic circuit device 24 Silicone gel 25 Heat sink 27 Aluminum die cast case 28 Aluminum die cast case lid
Claims (5)
電子部品から生ずる熱の影響を受けたくない第二の電子
部品とが混在して実装される電子回路装置であって、前
記第一、第二の電子部品が第一の樹脂またはシリコーン
ゲルにて封止され、前記第一の電子部品と前記第二の電
子部品との間にある前記第一の樹脂またはシリコーンゲ
ル中に、前記第一の樹脂またはシリコーンゲルよりも熱
伝導性が低く、かつ前記第一、第二の電子部品間を実質
的に分断する第二の樹脂が配設される事を特徴とする電
子回路装置。1. An electronic circuit device in which a heat-generating first electronic component and a second electronic component which does not want to be affected by heat generated from the first electronic component are mounted in a mixed manner, In the first resin or silicone gel, the first and second electronic components are sealed with a first resin or silicone gel, and the first and second electronic components are between the first electronic component and the second electronic component. In the electronic device, a second resin having a lower thermal conductivity than that of the first resin or the silicone gel and substantially separating the first and second electronic components from each other is provided. Circuit device.
電子部品から生ずる熱の影響を受けたくない第二の電子
部品とが共通の電子回路基板上に実装される電子回路装
置であって、前記第一、第二の電子部品及び前記電子回
路基板が熱伝導性の高い第一の樹脂にて封止され、前記
第一の電子部品と前記第二の電子部品との間にある前記
第一の樹脂中に、前記第一の樹脂よりも熱伝導性が低
く、かつ前記第一、第二の電子部品間を実質的に分断す
る第二の樹脂が配設される事を特徴とする電子回路装
置。2. An electronic circuit device in which a heat-generating first electronic component and a second electronic component which does not want to be affected by heat generated from the first electronic component are mounted on a common electronic circuit board. The first and second electronic components and the electronic circuit board are sealed with a first resin having a high thermal conductivity, and the first electronic component and the second electronic component are separated from each other. A second resin having a lower thermal conductivity than the first resin and substantially separating the first and second electronic components in the first resin in An electronic circuit device characterized by:
基板の主面上に被着される事を特徴とする請求項２記載
の電子回路装置。3. The electronic circuit device according to claim 2, wherein one end of the second resin is attached to the main surface of the electronic circuit board.
熱伝導可能に配設される事を特徴とする請求項３記載の
電子回路装置。4. The electronic circuit device according to claim 3, wherein a metal member is disposed on the back surface side of the electronic circuit board so as to be able to conduct heat.
記第一、第二の樹脂を収容する金属ケースで構成される
事を特徴とする請求項４記載の電子回路装置。5. The electronic circuit device according to claim 4, wherein the metal member includes a metal case that houses the electronic circuit board and the first and second resins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002136959A JP2003332500A (en) | 2002-05-13 | 2002-05-13 | Electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002136959A JP2003332500A (en) | 2002-05-13 | 2002-05-13 | Electronic circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003332500A true JP2003332500A (en) | 2003-11-21 |
Family
ID=29698846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002136959A Pending JP2003332500A (en) | 2002-05-13 | 2002-05-13 | Electronic circuit device |
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|---|---|---|---|---|
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
| JP2011023593A (en) * | 2009-07-16 | 2011-02-03 | Denso Corp | Electronic control unit |
| JP2013115297A (en) * | 2011-11-30 | 2013-06-10 | Hitachi Ltd | Power semiconductor device |
| JP2014236113A (en) * | 2013-06-03 | 2014-12-15 | 株式会社デンソー | Molded package |
| WO2018068939A1 (en) * | 2016-10-13 | 2018-04-19 | Robert Bosch Gmbh | Electronic assembly and method for producing an electronic assembly |
| WO2020100253A1 (en) * | 2018-11-15 | 2020-05-22 | 三菱電機株式会社 | Electric motor and air conditioner |
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2002
- 2002-05-13 JP JP2002136959A patent/JP2003332500A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008010261A1 (en) * | 2006-07-18 | 2008-01-24 | Panasonic Corporation | Substrate structure, and mobile terminal |
| JPWO2008010261A1 (en) * | 2006-07-18 | 2009-12-10 | パナソニック株式会社 | Substrate structure and portable terminal |
| JP2011023593A (en) * | 2009-07-16 | 2011-02-03 | Denso Corp | Electronic control unit |
| US8355254B2 (en) | 2009-07-16 | 2013-01-15 | Denso Corporation | Electronic control unit |
| JP2013115297A (en) * | 2011-11-30 | 2013-06-10 | Hitachi Ltd | Power semiconductor device |
| US9013877B2 (en) | 2011-11-30 | 2015-04-21 | Hitachi Power Semiconductor Device, Ltd. | Power semiconductor device |
| JP2014236113A (en) * | 2013-06-03 | 2014-12-15 | 株式会社デンソー | Molded package |
| WO2018068939A1 (en) * | 2016-10-13 | 2018-04-19 | Robert Bosch Gmbh | Electronic assembly and method for producing an electronic assembly |
| CN109791917A (en) * | 2016-10-13 | 2019-05-21 | 罗伯特·博世有限公司 | Electronic building brick and method for manufacturing electronic building brick |
| WO2020100253A1 (en) * | 2018-11-15 | 2020-05-22 | 三菱電機株式会社 | Electric motor and air conditioner |
| JPWO2020100253A1 (en) * | 2018-11-15 | 2021-06-10 | 三菱電機株式会社 | Motor and air conditioner |
| JP7019071B2 (en) | 2018-11-15 | 2022-02-14 | 三菱電機株式会社 | Motor and air conditioner |
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