JP2003255017A - Contact sheet for electronic device inspection - Google Patents
Contact sheet for electronic device inspectionInfo
- Publication number
- JP2003255017A JP2003255017A JP2002052741A JP2002052741A JP2003255017A JP 2003255017 A JP2003255017 A JP 2003255017A JP 2002052741 A JP2002052741 A JP 2002052741A JP 2002052741 A JP2002052741 A JP 2002052741A JP 2003255017 A JP2003255017 A JP 2003255017A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- layer
- inspection
- circuit board
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子デバイスの機
能、特性等を検査する検査装置において用いられ、電子
デバイスと検査用回路基板との間に配設され、電子デバ
イスの端子部と検査用回路基板の端子部とを電気的に接
続するための、シート状の中間接続用部材であるコンタ
クトシートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in an inspection apparatus for inspecting the function, characteristics, etc. of an electronic device, and is disposed between the electronic device and the inspection circuit board, and the terminal portion of the electronic device and the inspection device The present invention relates to a contact sheet which is a sheet-shaped intermediate connecting member for electrically connecting to a terminal portion of a circuit board.
【０００２】[0002]
【従来の技術】従来より、外部端子ピッチが比較的狭い
半導体などの電子デバイスの電気特性検査には、主要部
が図７のような構成の検査用装置を用いるのが一般的で
あった。図７において、ゴム弾性シート６６０は検査用
回路基板６３０の下側に配置され、押圧具６４０により
電子デバイス６２０が検査用回路基板６３０に押し付け
られることで、そのゴム弾性の反発力により、電子デバ
イス６２０の端子６２１と検査用回路基板６３０の端子
６３１ａ間の電気的接触が図られる。尚、検査用回路基
板６３０はテスター（図示していない）に接続されてお
り、電子デバイス６２０の特性が解析されるが、図７で
は要部のみを示してある。2. Description of the Related Art Conventionally, in order to inspect the electrical characteristics of an electronic device such as a semiconductor having a relatively narrow external terminal pitch, it has been general to use an inspection apparatus having a main part as shown in FIG. In FIG. 7, the rubber elastic sheet 660 is arranged below the inspection circuit board 630, and the electronic device 620 is pressed against the inspection circuit board 630 by the pressing tool 640, so that the repulsive force of the rubber elasticity causes the electronic device to move. Electrical contact is made between the terminal 621 of 620 and the terminal 631a of the inspection circuit board 630. The inspection circuit board 630 is connected to a tester (not shown), and the characteristics of the electronic device 620 are analyzed, but only the main parts are shown in FIG. 7.
【０００３】しかし、近年の 電子デバイスの高機能
化、高速動作化に伴ない、その電気特性を正確に検査す
るには、検査用回路基板側も高速動作時のノイズ、及び
遅延などが許容レベル以下であることが必要となってき
た。このため、検査用回路基板としても電源ライン、グ
ランドライン等を信号ラインとは別の層で引き回すこと
が必要となり、必然的に検査用回路基板は多層基板が用
いられるようになってきた。しかし、検査用回路基板を
多層基板とした場合には、基板の剛性は高くなり、図７
に示す検査装置では、検査用回路基板６３０の下部に配
置したゴム弾性シート６６０の本来の機能が発揮でき
ず、信頼性のある特性検査ができない場合が発生し、問
題となってきた。However, in order to accurately inspect the electrical characteristics of electronic devices in recent years due to higher functionality and higher speed operation, the circuit board for inspection also has an acceptable level of noise and delay during high speed operation. It has become necessary to: For this reason, it is necessary to route the power supply line, the ground line and the like in a layer different from the signal line also as the inspection circuit board, and inevitably a multilayer board has been used as the inspection circuit board. However, when the inspection circuit board is a multilayer board, the rigidity of the board increases, and
In the inspection device shown in (1), the original function of the rubber elastic sheet 660 arranged under the inspection circuit board 630 cannot be exerted, and a reliable characteristic inspection may not be performed, which has been a problem.
【０００４】[0004]
【発明が解決しようとする課題】上記のように、近年の
電子デバイスの高機能化、高速動作化に伴ない、図７
に示す検査装置では、検査用回路基板６３０の下部に配
置したゴム弾性シート６６０の本来の機能が発揮でき
ず、信頼性のある特性検査ができない場合が発生し、こ
の対応が求められていた。本発明はこれに対応するもの
で、剛性の高い検査用多層回路基板を使わざるをえない
場合おいて、測定する電子デバイスと検査用回路基板間
の電気接触を確実にできる手段を提供しようとするもの
で、詳しくは、電子デバイスと検査用回路基板との間に
配設され、電子デバイスの端子部と検査用回路基板の端
子部とを電気的に接続するための、シート状の中間接続
用部材で、測定する電子デバイスと検査用回路基板間の
電気接触を確実にできるコンタクトシートを提供しよう
とするものである。As described above, as electronic devices have become more sophisticated and operate at higher speeds in recent years, FIG.
In the inspection apparatus shown in (1), the original function of the rubber elastic sheet 660 arranged under the inspection circuit board 630 cannot be exhibited, and reliable characteristic inspection cannot be performed in some cases. The present invention deals with this, and it is an object of the present invention to provide a means for ensuring electrical contact between an electronic device to be measured and a circuit board for inspection in the case where a multilayer board for inspection having high rigidity cannot be used. Specifically, a sheet-like intermediate connection that is arranged between the electronic device and the inspection circuit board and electrically connects the terminal portion of the electronic device and the terminal portion of the inspection circuit board. (EN) It is intended to provide a contact sheet which can surely make electrical contact between an electronic device to be measured and a circuit board for inspection with a member.
【０００５】[0005]
【課題を解決するための手段】本発明の電子デバイス検
査用コンタクトシートは、検査用回路基板および電子デ
バイスを、固定台と押圧具等により挟み、押圧して、電
子デバイスの端子部を検査用回路基板の端子部に電気的
に接続させて、電子デバイスの機能、特性等を検査する
検査装置において用いられ、電子デバイスと検査用回路
基板との間に配設され、電子デバイスの端子部と検査用
回路基板の端子部とを電気的に接続するための、シート
状の中間接続用部材であって、基材は、若干の剛性を有
する絶縁材層と絶縁性でゴム弾性を有するゴム弾性層と
を積層したシート状の積層材で、基材の表裏面に直交す
る方向に基材を貫通する孔部中に表裏を導通する表裏導
通部を設けており、基材の一面側をゴム弾性層とし、表
裏導通部に接続してゴム弾性層の表面に沿い設けられた
配線部に接続する金属層からなる接続用端子部を、所定
量だけ表裏導通部に離れて設け、基材の他面側を絶縁材
層とし、表裏導通部に接続して絶縁材層の表面に沿い設
けられた配線部に接続する金属層からなる接続用端子部
を設けており、電子デバイスを検査する際には、基材の
両面の接続用端子部を、それぞれ、電子デバイスの端子
部と検査用回路基板の端子部とを接触させ、デバイスの
端子部と検査用回路基板の端子部とを電気的に接続する
ものであることを特徴とするものである。そして、上記
において、表裏導通部は、孔部を通る金属細線で基材両
面の配線部間をワイヤボンディング接続し、且つ、孔部
に充填された絶縁性の樹脂により金属細線を固定してい
るものであることを特徴とするものである。あるいは、
上記において、表裏導通部は、孔部を充填する導電性樹
脂ペーストを固化したものからなることを特徴とするも
のである。あるいはまた、上記において、表裏導通部
は、孔部を充填する金属めっき層からなることを特徴と
するものである。A contact sheet for inspecting an electronic device according to the present invention comprises a circuit board for inspecting and an electronic device sandwiched between a fixing base and a pressing tool and pressed to inspect the terminal portion of the electronic device. It is used in an inspection device that electrically connects to a terminal portion of a circuit board and inspects the function, characteristics, etc. of an electronic device, is arranged between the electronic device and the inspection circuit board, and is used as a terminal portion of the electronic device. A sheet-shaped intermediate connecting member for electrically connecting to a terminal portion of a circuit board for inspection, wherein a base material is an insulating material layer having a slight rigidity and a rubber elastic material having insulating and elastic properties. A sheet-shaped laminated material in which layers are laminated, and a front and back conduction portion that conducts the front and back is provided in a hole penetrating the base material in a direction orthogonal to the front and back surfaces of the base material. As an elastic layer, connect to the front and back conducting parts A connecting terminal part consisting of a metal layer that connects to the wiring part provided along the surface of the rubber elastic layer is provided apart from the front and back conducting parts by a predetermined amount, and the other side of the base material is the insulating material layer, and the front and back conducting Connection terminal part consisting of a metal layer connected to the wiring part provided along the surface of the insulating material layer when connecting to the parts, and when inspecting an electronic device, the connection terminals on both sides of the base material And a terminal section of the electronic circuit device and a terminal section of the inspection circuit board, respectively, to electrically connect the terminal section of the device and the terminal section of the inspection circuit board. It is a thing. Further, in the above, the front and back conducting portions connect the wiring portions on both surfaces of the base material by wire bonding with the metal thin wires passing through the holes, and fix the metal thin wires by the insulating resin filled in the holes. It is characterized by being a thing. Alternatively,
In the above, the front and back conduction portions are characterized by being formed by solidifying the conductive resin paste filling the holes. Alternatively, in the above, the front and back conducting portions are characterized by being formed of a metal plating layer filling the holes.
【０００６】ここで言う電子デバイスとしては、例え
ば、半導体ベアチップ、ＣＳＰ、ＱＦＮ、ＳＯＮ等のタ
イプの半導体装置が挙げられる。一平面に沿い端子部の
端子面を持つものや、半田ボール端子を平面的に配列し
たものでもよい。また、「若干の剛性を有する」とは、
基材がシート状の形態を保つことができる程度の剛性を
有するという意味であり、「接続用端子部を、所定量だ
け表裏導通部に離れて設け、」とは、電子デバイスの端
子部との接触による接続用端子部にかかる力による変形
が、表裏導通部ないし表裏導通部と配線部との接続部に
及ぼす影響を考慮した所定量の距離という意味である。Examples of the electronic device mentioned here include semiconductor devices of the type such as a semiconductor bare chip, CSP, QFN and SON. It may have a terminal surface of a terminal portion along one plane, or may have solder ball terminals arranged in a plane. Also, "having a certain rigidity" means
It means that the base material has a rigidity that can maintain a sheet-like form, and "the connection terminal portion is provided apart from the front and back conduction portions by a predetermined amount," means that the terminal portion of the electronic device is This means a predetermined amount of distance in consideration of the influence of the deformation of the connection terminal portion due to the contact between the front and back conduction portions or the connection portion between the front and back conduction portions and the wiring portion.
【０００７】[0007]
【作用】本発明の電子デバイス検査用コンタクトシート
は、このような構成にすることにより、電子デバイスと
検査用回路基板との間に配設され、電子デバイスの端子
部と検査用回路基板の端子部とを電気的に接続するため
の、シート状の中間接続用部材で、測定する電子デバイ
スと検査用回路基板間の電気接触を確実にできるコンタ
クトシートの提供を可能としている。詳しくは、基材の
一面側をゴム弾性層とし、表裏導通部に接続してゴム弾
性層の表面に沿い設けられた配線部に接続する金属層か
らなる接続用端子部を、所定量だけ表裏導通部に離れて
設け、基材の他面側を絶縁材層とし、表裏導通部に接続
して絶縁材層の表面に沿い設けられた配線部に接続する
金属層からなる接続用端子部を設けていることにより、
電子デバイスを検査する際に、基材の両面の接続用端子
部を、それぞれ、電子デバイスの端子部と検査用回路基
板の端子部とを接触させるが、接触すると、電子デバイ
スの端子部と接触する接続用端子部は、電子デバイスの
端子部に押され、押圧に対応した分だけゴム弾性層を変
形させることができ、電子デバイスの端子部の平坦性に
バラツキがあっても、各端子部をそれぞれ確実に接触さ
せることができる。また、絶縁性でゴム弾性を有するゴ
ム弾性層上に、電子デバイスまたは検査用回路基板の端
子部と接触する接続用端子部を、所定量だけ表裏導通部
から離れた位置に設けておくことにより、接続用端子部
は、これと表裏導通部とを接続する配線をも、その表裏
導通部側を支点として変形させることができ、変形に強
度的に強い構造としている。更に、ゴム弾性層が電子デ
バイスの端子部と直接接触することはなく、例えば、ゴ
ム弾性層がシリコーンである場合に問題となる低分子シ
ロキサンの電子デバイスの端子部面への移行はなく、半
田実装時の半田の濡れ性を劣化させることが無い。The contact sheet for inspecting an electronic device of the present invention is arranged between the electronic device and the circuit board for inspection by the above-mentioned structure, and the terminal portion of the electronic device and the terminal of the circuit board for inspection are arranged. It is possible to provide a contact sheet that can ensure electrical contact between an electronic device to be measured and a circuit board for inspection by using a sheet-shaped member for intermediate connection for electrically connecting the parts. Specifically, one side of the base material is a rubber elastic layer, and the connecting terminal part made of a metal layer that connects to the front and back conducting parts and connects to the wiring part provided along the surface of the rubber elastic layer A connecting terminal portion that is provided separately from the conductive portion, has the other surface side of the base material as an insulating material layer, and is connected to the front and back conductive portion and is connected to the wiring portion provided along the surface of the insulating material layer, is formed of a metal layer. By providing
When inspecting an electronic device, the connecting terminal portions on both sides of the base material are brought into contact with the terminal portion of the electronic device and the terminal portion of the circuit board for inspection, respectively. The connecting terminal portion to be pressed is pressed by the terminal portion of the electronic device, and the rubber elastic layer can be deformed by an amount corresponding to the pressing, and even if the flatness of the terminal portion of the electronic device varies, each terminal portion Can be surely brought into contact with each other. Also, by providing a connecting terminal portion, which is in contact with the terminal portion of the electronic device or the inspection circuit board, on the rubber elastic layer having insulating properties and rubber elasticity, at a position separated from the front and back conducting portions by a predetermined amount. In the connection terminal portion, the wiring connecting the connection terminal portion and the front and back conducting portion can also be deformed using the front and back conducting portion side as a fulcrum, and has a structure that is strong against deformation. Further, the rubber elastic layer does not come into direct contact with the terminal portion of the electronic device. For example, when the rubber elastic layer is silicone, there is no migration of low-molecular-weight siloxane to the terminal portion surface of the electronic device. Does not deteriorate solder wettability during mounting.
【０００８】表裏導通部としては、孔部を通る金属細線
で基材両面の配線部間をワイヤボンディング接続し、且
つ、孔部に充填された絶縁性の樹脂により金属細線を固
定しているものや、孔部を充填する導電性樹脂ペースト
を固化したものからなるものや、表裏導通部は、孔部を
充填する金属めっき層からなるものが挙げられるが、こ
れらの場合は、いずれも、ファインピッチ化にも対応で
きる。また、表裏導通部の抵抗値を低くできる。本発明
の電子デバイス検査用コンタクトシートは、特に、端子
部に弾力性がない電子デバイス、例えば、半導体ベアチ
ップ、ＣＳＰ、ＱＦＮ、ＳＯＮ等のタイプの半導体装置
の検査に有効である。As the front and back conducting portion, a metal thin wire passing through the hole is used for wire bonding connection between wiring portions on both surfaces of the base material, and the metal thin wire is fixed by an insulating resin filled in the hole. Alternatively, the conductive resin paste that fills the pores may be solidified, and the front and back conductive portions may include the metal plating layer that fills the pores. It can also be used for pitching. Further, the resistance value of the front and back conduction portion can be reduced. The contact sheet for inspecting an electronic device of the present invention is particularly effective for inspecting an electronic device in which the terminal portion has no elasticity, for example, a semiconductor bare chip, a semiconductor device of a type such as CSP, QFN, or SON.
【０００９】[0009]
【実施の形態】本発明の実施の形態を図に基づいて説明
する。図１（ａ）は本発明の電子デバイス検査用コンタ
クトシートの実施の形態の第１の例を示した一部断面図
で、図１（ｂ）は図１（ａ）に示す電子デバイス検査用
コンタクトシートを検査装置に使用した状態を示した概
略断面図で、図２（ａ）は本発明の電子デバイス検査用
コンタクトシートの実施の形態の第２の例を示した一部
断面図で、図２（ｂ）は本発明の電子デバイス検査用コ
ンタクトシートの実施の形態の第２の例の変形例を示し
た一部断面図で、図３は本発明の電子デバイス検査用コ
ンタクトシートの実施の形態の第３の例を示した一部断
面図で、図４は実施例１における図１（ａ）に示す第１
の例の電子デバイス検査用コンタクトシートの製造工程
図で、図５は実施例２における図２（ａ）に示す第２の
例の電子デバイス検査用コンタクトシートの製造工程図
で、図６は図５（ｆ）〜図５（ｇ）の工程の１例の詳細
工程図である。尚、図１（ａ）は図１（ｂ）のＡ１部の
拡大図である。図１〜図６中、１１０は電子デバイス検
査用コンタクトシート、１１１は基材、１１１ａは絶縁
性材層、１１１Ａは絶縁性材層用素材、１１１ｂは（絶
縁性の）ゴム弾性層、１１１Ｂはゴム弾性層用素材、１
１２は（ゴム弾性層からなる）表裏導通部、１１２ａは
金属細線、１１３は金属層配線、１１３ａは銅層（銅
箔）、１１３ｂはニッケルめっき層、１１３ｃは金めっ
き層、１１３Ａは銅箔（金属層配線用素材）、１１３Ａ
１は開口、１１３Ｔは接続用端子部、１１４は金属層配
線、１１４Ａは銅箔（金属層配線用素材），１１４Ｔは
接続用端子部、１１５は絶縁性樹脂部、１１８はガイド
ホール、１２０は電子デバイス、１２１は端子部（単に
端子とも言う）、１３０は検査用回路基板、１３１は配
線部、１３１ａは端子部、１４０は押圧具、１５０は固
定台、１６０は位置決めピン、１８０は（基材の）孔
部、２１０、２１０Ａは電子デバイス検査用コンタクト
シート、２１１は基材、２１１ａは絶縁性材層、２１１
Ａは絶縁性材層用素材、２１１ｂは（絶縁性の）ゴム弾
性層、２１１Ｂはゴム弾性層用素材、２１２は（ゴム弾
性層からなる）表裏導通部、２１２Ａは表裏導通部形成
用素材（樹脂ペースト）、２１３は金属層配線、２１３
ａは銅層（銅箔）、２１３ｂはニッケルめっき層、２１
３ｃは金めっき層、２１３Ａは銅箔（金属層配線用素
材）、２１３Ｔは接続用端子部、２１４は金属層配線、
２１４Ａは銅箔（金属層配線用素材）、１２１４Ｔは接
続用端子部、２１８はガイドホール、２７０は保護ーシ
ート、２８０は（基材の）孔部、２９０は無電解めっき
層、３１０は電子デバイス検査用コンタクトシート、３
１１は基材、３１１ａは絶縁性材層、３１１ｂは（絶縁
性の）ゴム弾性層、、３１２は（ゴム弾性層からなる）
表裏導通部、３１３、３１４は金属層配線、３１３Ｔ、
３１４Ｔは接続用端子部、３１８はガイドホール、３８
０は（基材の）孔部である。Embodiments of the present invention will be described with reference to the drawings. FIG. 1 (a) is a partial cross-sectional view showing a first example of an embodiment of an electronic device inspection contact sheet of the present invention, and FIG. 1 (b) is an electronic device inspection contact sheet shown in FIG. 1 (a). FIG. 2 (a) is a partial cross-sectional view showing a second example of the embodiment of the contact sheet for inspecting electronic devices of the present invention, 2B is a partial cross-sectional view showing a modification of the second example of the embodiment of the electronic device inspection contact sheet of the present invention, and FIG. 3 is an implementation of the electronic device inspection contact sheet of the present invention. 4 is a partial cross-sectional view showing a third example of the embodiment of the present invention, and FIG. 4 shows the first example shown in FIG.
FIG. 5 is a manufacturing process drawing of the contact sheet for inspecting electronic devices of the example, FIG. 5 is a manufacturing process drawing of the contact sheet for inspecting electronic devices of the second example shown in FIG. FIG. 5F is a detailed process chart of an example of the process of FIGS. It should be noted that FIG. 1A is an enlarged view of a portion A1 of FIG. 1 to 6, 110 is an electronic device inspection contact sheet, 111 is a base material, 111a is an insulating material layer, 111A is an insulating material layer material, 111b is an (insulating) rubber elastic layer, and 111B is Material for rubber elastic layer, 1
12 is a front and back conduction part (consisting of a rubber elastic layer), 112a is a thin metal wire, 113 is a metal layer wiring, 113a is a copper layer (copper foil), 113b is a nickel plating layer, 113c is a gold plating layer, and 113A is a copper foil ( Material for metal layer wiring), 113A
1 is an opening, 113T is a connecting terminal portion, 114 is a metal layer wiring, 114A is a copper foil (material for metal layer wiring), 114T is a connecting terminal portion, 115 is an insulating resin portion, 118 is a guide hole, and 120 is An electronic device, 121 is a terminal portion (also simply referred to as a terminal), 130 is an inspection circuit board, 131 is a wiring portion, 131a is a terminal portion, 140 is a pressing tool, 150 is a fixing base, 160 is a positioning pin, and 180 is a base board. (For material), 210, 210A are contact sheets for inspecting electronic devices, 211 is a base material, 211a is an insulating material layer, 211
A is a material for an insulating material layer, 211b is a (elastic) rubber elastic layer, 211B is a material for a rubber elastic layer, 212 is a front and back conducting part (consisting of a rubber elastic layer), 212A is a material for forming a front and back conducting part ( (Resin paste), 213 is metal layer wiring, 213
a is a copper layer (copper foil), 213b is a nickel plating layer, 21
3c is a gold plating layer, 213A is a copper foil (metal layer wiring material), 213T is a connecting terminal portion, 214 is a metal layer wiring,
214A is a copper foil (metal layer wiring material), 1214T is a connecting terminal portion, 218 is a guide hole, 270 is a protective sheet, 280 is a (base material) hole portion, 290 is an electroless plating layer, and 310 is an electronic device. Inspection contact sheet, 3
Reference numeral 11 is a base material, 311a is an insulating material layer, 311b is a (elastic) rubber elastic layer, and 312 is a rubber elastic layer.
Front and back conduction parts 313, 314 are metal layer wiring, 313T,
314T is a connection terminal portion, 318 is a guide hole, 38
0 is the hole (of the substrate).
【００１０】はじめに、本発明の電子デバイス検査用コ
ンタクトシートの実施の形態の第１の例を図１に基づい
て説明する。第１の例の電子デバイス検査用コンタクト
シート１１０は、図１（ｂ）に示すように、検査用回路
基板１３０および電子デバイス１２０を、固定台１５０
と押圧具１４０により挟み、押圧して、電子デバイス１
２０の端子部１２１を検査用回路基板１３０の端子部１
３１ａに電気的に接続させて、電子デバイスの機能、特
性等を検査する検査装置において用いられる、電子デバ
イス１２０と検査用回路基板１３０との間に配設され、
電子デバイス１２０の端子部１２１と検査用回路基板１
３０の端子部１３１ａとを電気的に接続するための、シ
ート状の中間接続用部材である。そして、図１（ａ）に
要部を拡大して示すように、基材１１１は、若干の剛性
を有する絶縁材層１１１ａと絶縁性でゴム弾性を有する
ゴム弾性層１１１ｂとを積層したシート状の積層材で、
基材１１１の表裏面に直交する方向に基材を貫通する孔
部中に表裏を導通する表裏導通部１１２を設けており、
基材１１１の一面側である電子デバイス（図１（ｂ）の
１２０）の端子部１２１と接触する側をゴム弾性層１１
１ｂとし、表裏導通部１１２に接続してゴム弾性層１１
１ｂの表面に沿い設けられた配線部１１３に接続する金
属層からなる接続用端子部１１３Ｔを、所定量だけ表裏
導通部に離れて設け、基材１１１の他面側である検査用
回路基板（図１（ｂ）の１３０）の端子部１３１ａと接
触する側を絶縁材層とし、表裏導通部１１２に接続して
絶縁材層１１１ａの表面に沿い設けられた配線部１１４
に接続する金属層からなる接続用端子部１１４Ｔを設け
ており、電子デバイス（図１（ｂ）の１２０）を検査す
る際には、基材１１１の両面の接続用端子部１１３Ｔ、
１１４Ｔを、それぞれ、電子デバイス１２０の端子部１
２１と検査用回路基板１３０の端子部１３１ａとを接触
させ、電子デバイス１２０の端子部１２１と検査用回路
基板１３０の端子部１３１ａとを電気的に接続するもの
である。First, a first example of the embodiment of the electronic device inspection contact sheet of the present invention will be described with reference to FIG. In the electronic device inspection contact sheet 110 of the first example, as shown in FIG. 1B, the inspection circuit board 130 and the electronic device 120 are fixed to a fixing base 150.
The electronic device 1 is sandwiched and pressed by the pressing tool 140.
20 of the terminal portion 121 to the terminal portion 1 of the inspection circuit board 130
31a, which is disposed between the electronic device 120 and the circuit board 130 for inspection, which is used in an inspection apparatus for inspecting the function, characteristics, etc. of the electronic device by being electrically connected to 31a.
The terminal portion 121 of the electronic device 120 and the inspection circuit board 1
It is a sheet-shaped intermediate connecting member for electrically connecting to the terminal portion 131a of 30. Then, as shown in an enlarged view of a main part in FIG. 1A, the base material 111 has a sheet shape in which an insulating material layer 111a having a slight rigidity and a rubber elastic layer 111b having insulation and rubber elasticity are laminated. Of laminated materials,
The front and back conduction part 112 that conducts the front and back is provided in a hole that penetrates the base in a direction orthogonal to the front and back of the base 111.
The side of one side of the base material 111 that is in contact with the terminal portion 121 of the electronic device (120 in FIG. 1B) is the rubber elastic layer 11.
1b, and the rubber elastic layer 11 is connected to the front and back conducting portions 112.
A connecting terminal portion 113T made of a metal layer, which is connected to the wiring portion 113 provided along the surface of 1b, is provided a predetermined distance apart from the front and back conducting portions, and the inspection circuit board on the other surface side of the base material 111 ( The wiring portion 114 provided along the surface of the insulating material layer 111a by connecting to the front and back conductive portions 112 on the side contacting the terminal portion 131a in FIG. 1B as an insulating material layer.
The connection terminal portion 114T made of a metal layer to be connected to is provided, and when the electronic device (120 in FIG. 1B) is inspected, the connection terminal portions 113T on both surfaces of the base material 111,
114T is the terminal portion 1 of the electronic device 120, respectively.
21 and the terminal portion 131a of the inspection circuit board 130 are brought into contact with each other to electrically connect the terminal portion 121 of the electronic device 120 and the terminal portion 131a of the inspection circuit board 130.
【００１１】基材１１１の絶縁性材層１１１ａの材質と
しては、ポリイミド樹脂、ガラス布基材エポキシ等の樹
脂フィルムが挙げられる。また、ゴム弾力層１１１ｂと
しては、シリコーンゴム、ブタジエンゴム等が挙げられ
る。表裏導通部１１２を形成する金属細線１１２ａとし
ては、ワイヤボンディング用の金線、アルミニウム線等
が挙げられる。また、孔部を充填して金属細線１１２ａ
を固定する絶縁性の樹脂１１５としては、強度的に強い
ものが好ましく、シリコーンゴム、ブタジエンゴム、エ
ポキシ樹脂等が挙げられる。尚、金線、アルミニウム線
等を用いた場合、表裏導通部１１２の抵抗は、十分低く
なり、電子デバイスの高速化に対応できる。Examples of the material of the insulating material layer 111a of the base material 111 include resin films such as polyimide resin and glass cloth base material epoxy. Examples of the rubber elastic layer 111b include silicone rubber and butadiene rubber. Examples of the metal thin wire 112a forming the front and back conducting portion 112 include a gold wire for wire bonding, an aluminum wire, and the like. In addition, the metal thin wire 112a is filled with the holes.
As the insulative resin 115 for fixing the resin, those having strong strength are preferable, and examples thereof include silicone rubber, butadiene rubber, and epoxy resin. Note that when a gold wire, an aluminum wire, or the like is used, the resistance of the front and back conduction portion 112 is sufficiently low, and it is possible to cope with the speedup of electronic devices.
【００１２】次に、本発明の電子デバイス検査用コンタ
クトシートの実施の形態の第２の例を図２（ａ）に基づ
いて説明する。第２の例の電子デバイス検査用コンタク
トシート２１０も、第１の例と同様にして、用いられる
電子デバイスの端子部と検査用回路基板の端子部を電気
的に接続するための、シート状の中間接続用部材であ
る。第２の例は、第１の例と同様、基材２１１の表裏面
に直交する方向に基材を貫通する孔部中に表裏を導通す
る表裏導通部２１２を設けているが、第１の例における
孔部を通る金属細線で基材両面の配線部間をワイヤボン
ディング接続し、且つ、孔部に充填された絶縁性の樹脂
により金属細線を固定している表裏導通部１１２に代
え、基材２１１の孔部２８０を充填する導電性樹脂ペー
ストを固化したものを表裏導通部２１２としているもの
である。他の点については、第１の例と同様である。Next, a second example of the embodiment of the electronic device inspection contact sheet of the present invention will be described with reference to FIG. Similarly to the first example, the electronic device inspection contact sheet 210 of the second example also has a sheet-like shape for electrically connecting the terminal portion of the electronic device used and the terminal portion of the inspection circuit board. It is a member for intermediate connection. In the second example, similarly to the first example, the front and back conduction portions 212 that conduct the front and back sides are provided in the holes that penetrate the base material in the direction orthogonal to the front and back surfaces of the base material 211. In the example, instead of the front and back conduction part 112 in which the metal wire passing through the hole is used for wire bonding connection between the wiring parts on both surfaces of the base material, and the metal wire is fixed by the insulating resin filled in the hole, The front and back conduction portions 212 are formed by solidifying the conductive resin paste filling the holes 280 of the material 211. The other points are the same as in the first example.
【００１３】第２の例の場合も、第１の例と同様、基材
２１１の絶縁性材層２１１ａ材質としては、ポリイミド
樹脂、ガラス布基材エポキシ樹脂等の樹脂フィルムが挙
げられ、ゴム弾力層２１１ｂとしては、シリコーンゴ
ム、ブタジエンゴム等が挙げられる。表裏導通部２１２
を形成する導電性樹脂ペーストの固化物としては、エポ
キシ樹脂、ポリイミド樹脂等に銀等の金属粒子を混ぜた
ペーストを固化したものが挙げられる。表裏導通部２１
２の抵抗としては、１箇所当たり１０ｍΩ以下であるこ
とが好ましい。Also in the case of the second example, as in the first example, as the material of the insulating material layer 211a of the base material 211, a resin film such as a polyimide resin or a glass cloth base material epoxy resin can be cited, and the rubber elasticity Examples of the layer 211b include silicone rubber and butadiene rubber. Front and back conduction part 212
Examples of the solidified material of the conductive resin paste that forms the material include solidified paste obtained by mixing metal particles such as silver with epoxy resin, polyimide resin, or the like. Front and back conduction part 21
The resistance of 2 is preferably 10 mΩ or less per location.
【００１４】第２の例の変形例としては、図２（ｂ）に
示すように、電子デバイスと接触する側である一面側に
は、孔部２８０を充填する導電性樹脂ペーストを固めた
硬化物が、配線部面より外側にまで達するように形成
し、硬化物を露出させる構造のものが挙げられる。As a modified example of the second example, as shown in FIG. 2 (b), one surface side, which is the side in contact with the electronic device, is hardened by hardening a conductive resin paste filling the holes 280. An example is a structure in which an object is formed so as to reach the outside of the wiring portion surface and the cured material is exposed.
【００１５】次に、本発明の電子デバイス検査用コンタ
クトシートの実施の形態の第３の例を図３に基づいて説
明する。第３の例の電子デバイス検査用コンタクトシー
ト３１０も、第１の例、第２の例と同様にして、用いら
れる電子デバイスの端子部と検査用回路基板の端子部を
電気的に接続するための、シート状の中間接続用部材で
ある。第３の例は、第１の例と同様、基材３１１の表裏
面に直交する方向に基材を貫通する孔部中に表裏を導通
する表裏導通部３１２を設けているが、第１の例におけ
る孔部を通る金属細線で基材両面の配線部間をワイヤボ
ンディング接続し、且つ、孔部に充填された絶縁性の樹
脂により金属細線を固定している表裏導通部１１２に代
え、基材３１１の孔部３８０を充填する金属めっき層を
表裏導通部３１２としているものである。他の点につい
ては、第１の例と同様である。Next, a third example of the embodiment of the contact sheet for inspecting electronic device of the present invention will be explained based on FIG. The electronic device inspection contact sheet 310 of the third example also electrically connects the terminal portion of the electronic device used and the terminal portion of the inspection circuit board in the same manner as in the first and second examples. Is a sheet-shaped member for intermediate connection. In the third example, as in the first example, the front and back conduction parts 312 that conduct the front and back are provided in the holes penetrating the base material 311 in the direction orthogonal to the front and back surfaces of the base material 311. In the example, instead of the front and back conduction part 112 in which the metal wire passing through the hole is used for wire bonding connection between the wiring parts on both surfaces of the base material, and the metal wire is fixed by the insulating resin filled in the hole, The metal plating layers filling the holes 380 of the material 311 are used as the front and back conduction parts 312. The other points are the same as in the first example.
【００１６】第３の例の場合も、第１の例、第２の例と
同様、基材３１１の絶縁性材層３１１ａ材質としては、
ポリイミド樹脂、ガラス布基材エポキシ樹脂等の樹脂フ
ィルムが挙げられ、ゴム弾力層３１１ｂとしては、シリ
コーンゴム、ブタジエンゴム等が挙げられる。表裏導通
部３１２を形成する金属めっき層としては、銅めっき層
単層、あるいは、銅めっき層を主たるめっき層として表
面部にニッケルめっき層や金めっき層を積層して配設し
たもの等が挙げられるが、これに限定はされない。第３
の例の場合、表裏導通部３１２の抵抗は、十分低くな
り、電子デバイスの高速化に対応できる。Also in the case of the third example, as in the first and second examples, the material of the insulating material layer 311a of the base material 311 is as follows:
A resin film such as a polyimide resin or a glass cloth base epoxy resin may be used, and the rubber elastic layer 311b may be a silicone rubber or a butadiene rubber. Examples of the metal plating layer that forms the front and back conduction portion 312 include a copper plating layer single layer, or a layer in which a nickel plating layer or a gold plating layer is laminated on the surface portion with the copper plating layer as the main plating layer. However, the present invention is not limited to this. Third
In the case of the above example, the resistance of the front and back conduction portion 312 is sufficiently low, and it is possible to cope with the speedup of the electronic device.
【００１７】[0017]
【実施例】更に、実施例を挙げて、本発明を説明する。
（実施例１）実施例１は、図１に示す、実施の形態の第
１の例の電子デバイス検査用コンタクトシートで、基材
１１１が、厚さ０. ０７５ｍｍのポリイミドフィルムか
らなる絶縁材層１１１ａと厚さ０. ０５ｍｍのシリコー
ンゴムからなるゴム弾力層１１１ｂからなる積層基材
で、表裏導通部１１２を形成する金属細線１１２ａが、
ワイヤボンディング用の金線からなり、接続用端子部１
１３Ｔ、１１４Ｔが、基材１１１側から順に、銅層１１
３ａ、ニッケルめっき層１１３ｂ、金めっき層１１３ｃ
を、それぞれ、厚さ、３５μｍ、２μｍ、０. ５μｍに
形成してなるものを、図４に示す製造工程で作製したも
のである。以下、図４に基づいて、作製方法を説明す
る。先ず、厚さ３５μｍの銅箔１１３Ａ、厚さ０. ０５
ｍｍのゴム弾性層用素材１１１Ｂ、厚さ０. ０７５ｍｍ
のポリイミドからなる絶縁材層用素材１１１Ａ、銅箔１
１４Ａとを、この順に、熱圧着により積層した積層基材
を作製した。（図４（ａ））
次いで、この積層基材に対し、銅箔１１３Ａ上に、表裏
導通部１１２形成用の孔部１８０形成領域を開口したレ
ジストパターンからなるマスク（図示していない）を形
成し、マスクの開口から露出した銅箔１１３Ａを塩化第
二鉄溶液でエッチングした後、マスクを除去した。（図
４（ｂ））
次いで、銅箔１１３Ａ側から、レーザ加工により、銅箔
部１１４Ａは残し、絶縁性のゴム弾性層用基材１１１
Ｂ、ポリイミドからなる絶縁材層１１１Ａに貫通孔を開
け、孔部１８０を形成した。（図４（ｃ））
レーザ光としては炭酸ガスレーザを用いた。次いで、両
面に配線を形成する所定領域をマスクした、レジストパ
ターンからなるマスク（図示していない）を形成し、マ
スクの開口から露出した銅箔１１３Ａ、１１４Ａを塩化
第二鉄溶液でエッチングした後、マスクを除去した。
（図４（ｄ））
これにより、配線部１１３、１１４と接続用端子部１１
３Ｔ、１１４Ｔの一部である、銅層１１３ａ、１１４ａ
が形成される。更に、銅層１１３ａ、１１４ａ上に、ニ
ッケルめっき層１１３ｂ（１１４ｂ）、金めっき層１１
３ｃ（１１４ｃ）を、電解めっき形成し、接続用端子部
１１３Ｔ、１１４Ｔを形成した。（図４（ｅ））
図４（ｄ）から図４（ｅ）に至るめっき層配設処理につ
いて、本実施例では、図４（ｄ）の銅箔１１３ａ、１１
４ａ形成する際に、めっき層配設処理を行なうための給
電層を予め形成しておき、この給電層を用いて電解めっ
きを行ない、銅箔１１３ａ、１１４ａ上全面にめっき層
の配設を行なう方法が採られたが、これに限定はされな
い。ニッケルめっきは、ＷＨＮめっき液（日本高純度化
学社製）を用い、温度５０℃、電流密度１Ａ／ｄｍ
2 で、金めっきは、テンペレジストＫ−９１Ｓ（日本高
純度化学社製）を用い、温度６０℃、電流密度０. ４Ａ
／ｄｍ2 で行った。 また、本例においては、予め、電
解めっき用の給電層を、配線部形成の際に形成しておい
た。次いで、ワイヤボンディングにより、配線部１１３
と配線部１１４とを接続する金線からなる金属細線１１
２ａを孔部１８０に形成した。（図４（ｆ））
次いで、孔部１８０を充填し、且つ、金属細線１１２ａ
を覆うようにシリコーンペーストを充填し、これを熱硬
化して、絶縁性樹脂１１５とした後、プレスにより外形
形成、ガイドホール１１８形成を行なった。（図４
（ｇ）） 本例では、絶縁性樹脂１１５の素材として熱
硬化性樹脂のシリコーンゴムを用いたがこれに限定され
ない。他の熱硬化性樹脂やＵＶ硬化性樹脂を用い、孔部
１８０への充填し、必要に応じ、熱硬化、あるいはＵＶ
硬化してもよい。このようにして、図１に示す第１の例
の電子デバイス検査用コンタクトシート１１０が作製さ
れた。The present invention will be further described with reference to examples. (Example 1) Example 1 is an electronic device inspection contact sheet of the first embodiment shown in FIG. 1, in which the base material 111 is an insulating material layer made of a polyimide film having a thickness of 0.075 mm. 111a and a rubber elastic layer 111b made of silicone rubber having a thickness of 0.05 mm, and a metal thin wire 112a forming a front and back conducting part 112,
Connection terminal part 1 made of gold wire for wire bonding
13T and 114T are copper layers 11 in order from the base material 111 side.
3a, nickel plating layer 113b, gold plating layer 113c
Are formed in a thickness of 35 μm, 2 μm, and 0.5 μm, respectively, and are manufactured by the manufacturing process shown in FIG. Hereinafter, the manufacturing method will be described with reference to FIG. First, the copper foil 113A having a thickness of 35 μm and the thickness of 0.05
mm rubber elastic layer material 111B, thickness 0.075 mm
Insulation material 111A made of polyimide, copper foil 1
14A and 14A were laminated in this order by thermocompression bonding to prepare a laminated base material. (FIG. 4A) Next, on this laminated base material, a mask (not shown) is formed on the copper foil 113A, which is made of a resist pattern having openings for forming the holes 180 for forming the front and back conduction portions 112. Then, the copper foil 113A exposed from the opening of the mask was etched with a ferric chloride solution, and then the mask was removed. (FIG. 4B) Next, from the copper foil 113A side, the copper foil portion 114A is left by laser processing and the insulating rubber elastic layer base material 111 is left.
B, a through-hole was formed in the insulating material layer 111A made of polyimide to form a hole 180. (FIG. 4C) A carbon dioxide gas laser was used as the laser light. Next, a mask (not shown) consisting of a resist pattern is formed by masking a predetermined area for forming wiring on both surfaces, and the copper foils 113A and 114A exposed from the openings of the mask are etched with a ferric chloride solution. , The mask was removed.
(FIG. 4D) As a result, the wiring portions 113 and 114 and the connection terminal portion 11 are formed.
Copper layers 113a and 114a which are part of 3T and 114T
Is formed. Further, the nickel plating layer 113b (114b) and the gold plating layer 11 are formed on the copper layers 113a and 114a.
3c (114c) was formed by electrolytic plating to form connection terminal portions 113T and 114T. (FIG. 4E) Regarding the plating layer disposing process from FIG. 4D to FIG. 4E, in this embodiment, the copper foils 113a and 11a of FIG.
When forming 4a, a power supply layer for performing a plating layer disposing process is previously formed, and electrolytic plating is performed using this power supply layer to dispose the plating layer on the entire surfaces of the copper foils 113a and 114a. The method was adopted, but is not limited to this. The nickel plating uses a WHN plating solution (manufactured by Japan Kojundo Chemical Co., Ltd.), temperature 50 ° C., current density 1 A / dm.
In 2 , the gold plating was performed using Tempe resist K-91S (manufactured by Nippon Kojundo Chemical Co., Ltd.) at a temperature of 60 ° C. and a current density of 0.4 A.
/ Dm 2 . Further, in this example, the power supply layer for electrolytic plating was previously formed at the time of forming the wiring portion. Then, by wire bonding, the wiring portion 113
Metal wire 11 made of a gold wire connecting the wiring part 114 and the wiring part 114
2a was formed in the hole 180. (FIG. 4 (f)) Next, the hole 180 is filled and the thin metal wire 112 a is formed.
Was filled with a silicone paste and heat-cured to form an insulating resin 115, and then an outer shape and a guide hole 118 were formed by pressing. (Fig. 4
(G)) In this example, the thermosetting resin silicone rubber is used as the material of the insulating resin 115, but the material is not limited to this. Filling the hole 180 with another thermosetting resin or UV curable resin, and if necessary, thermosetting or UV
It may be cured. In this way, the electronic device inspection contact sheet 110 of the first example shown in FIG. 1 was produced.
【００１８】（実施例２）実施例２は、図２（ａ）に示
す、第２の例の電子デバイス検査用コンタクトシート２
１０で、基材２１１が、厚さ０. １ｍｍのポリイミドフ
ィルムからなる絶縁材層２１１ａと厚さ０. ０５ｍｍの
シリコーンゴムからなるゴム弾性層２１１ｂからなる積
層基材で、表裏導通部２１２は、孔部を充填する導電性
樹脂ペーストを固化したものからなり、接続用端子部２
１３Ｔ、２１４Ｔが、基材２１１側から順に、銅層２１
３ａ、ニッケルめっき層２１３ｂ、金めっき層２１３ｃ
を、それぞれ、厚さ、３５μｍ、２μｍ、０. ５μｍに
形成してなるものを、図５に示す製造工程で作製したも
のである。以下、図５に基づいて、作製方法を説明す
る。先ず、図５（ａ）に示すように、厚さ０. ０５ｍｍ
の絶縁性のゴム弾性層用素材２１１Ｂの一面に厚さ０.
１ｍｍのＰＥＴ（ポリエチレンテレフタレート）フィル
ム保護シート２７０を積層したものと、厚さ０. １ｍｍ
のポリイミドからなる絶縁材層用素材２１１Ａの一面に
厚さ３５μｍの銅箔２１４Ａを積層した基材を用意し、
保護シート２７０、絶縁性のゴム弾性層用素材２１１
Ｂ、絶縁材層用素材２１１Ａ、銅箔２１４Ａの順に、熱
圧着により積層した積層基材を作製した。（図５
（ｂ））
次いで、この積層基材に対し、保護シート２７０側か
ら、レーザ加工により、銅箔部は残し、保護シート２７
０、絶縁性のゴム弾性層用素材２１１Ｂ、絶縁材層用素
材２１１Ａに貫通孔を孔部２８０として開けた。（図５
（ｃ））
保護シート２７０となる樹脂シートとしては、レーザ加
工が容易にできるものが好ましく、ＰＥＴ（ポリエチレ
ンテレフタレート）フィルムに限定はされない。レーザ
光としては炭酸ガスレーザ等が用いた。次いで、孔部２
８０にメタルマスク印刷法により、エポキシ樹脂に銀粒
子を混ぜた、ペースト状の導電性の樹脂ペーストである
表裏導通部形成用素材２１２Ａ、を充填した。（図５
（ｄ））
次いで、保護シート２７０を除去後、保護シート２７０
を除去面に銅箔２１３Ａをラミネートし、表裏導通部形
成用素材２１２Ａを熱硬化して、表裏導通部２１２を形
成した。（図５（ｅ））
次いで、配線部（接続用端子部も含む）形成領域を覆う
レジストパターンのマスク（図示していない）を形成
し、マスク開口から露出する部分をエッチング除去し
て、配線部形成領域の銅箔２１３ａ、２１４ａを残し
た。（図５（ｆ））
次いで、レジストパターンのマスクを除去した後、残っ
た端子部形成領域の銅箔２１３ａ、２１４ａの表面に、
順に、ニッケルめっき層２１３ｂ、２１４ｂ、金めっき
層２１３ｃ、２１４ｃからなるめっき層を配設した後、
プレスにより外形形成、ガイドホール２１８形成を行な
った。（図５（ｇ））
尚、ニッケルめっきは、ＷＨＮめっき液（日本高純度化
学社製）を用い、温度５０℃、電流密度１Ａ／ｄｍ
2 で、金めっきは、テンペレジストＫ−９１Ｓ（日本高
純度化学社製）を用い、温度６０℃、電流密度０. ４Ａ
／ｄｍ2 で行った。このようにして、図２（ａ）に示す
第２の例の電子デバイス検査用コンタクトシート２１０
が作製された。(Example 2) Example 2 is a contact sheet 2 for electronic device inspection of the second example shown in FIG. 2 (a).
10, the base material 211 is a laminated base material including an insulating material layer 211a made of a polyimide film having a thickness of 0.1 mm and a rubber elastic layer 211b made of silicone rubber having a thickness of 0.05 mm. The connecting terminal portion 2 is made of a solidified conductive resin paste filling the holes.
13T and 214T are copper layers 21 in order from the base material 211 side.
3a, nickel plating layer 213b, gold plating layer 213c
Are formed in the thicknesses of 35 μm, 2 μm, and 0.5 μm, respectively, by the manufacturing process shown in FIG. Hereinafter, the manufacturing method will be described with reference to FIG. First, as shown in FIG. 5 (a), the thickness is 0.05 mm.
Insulating rubber elastic layer material 211B has a thickness of 0.1.
A 1 mm thick PET (polyethylene terephthalate) film protective sheet 270 is laminated, and a thickness of 0.1 mm
1. Prepare a base material in which a copper foil 214A having a thickness of 35 μm is laminated on one surface of the insulating material layer material 211A made of polyimide,
Protective sheet 270, insulating rubber elastic layer material 211
B, the insulating material layer material 211A, and the copper foil 214A were laminated in this order by thermocompression bonding to prepare a laminated base material. (Fig. 5
(B)) Next, with respect to this laminated base material, a copper foil portion is left from the protective sheet 270 side by laser processing, and the protective sheet 27 is left.
0, a through hole was formed as a hole 280 in the insulating rubber elastic layer material 211B and the insulating material layer material 211A. (Fig. 5
(C)) The resin sheet that becomes the protective sheet 270 is preferably one that can be easily laser-processed, and is not limited to a PET (polyethylene terephthalate) film. A carbon dioxide gas laser or the like was used as the laser light. Then, the hole 2
80 was filled with a front and back conduction portion forming material 212A, which is a paste-like conductive resin paste in which silver particles were mixed with an epoxy resin, by a metal mask printing method. (Fig. 5
(D)) Next, after removing the protective sheet 270, the protective sheet 270
A copper foil 213A was laminated on the removed surface, and the front and back conduction part forming material 212A was thermally cured to form the front and back conduction part 212. (FIG. 5E) Next, a mask (not shown) of a resist pattern is formed to cover the wiring portion (including the connection terminal portion) forming region, and the portion exposed from the mask opening is removed by etching to form the wiring. The copper foils 213a and 214a in the part formation region were left. (FIG. 5 (f)) Next, after removing the mask of the resist pattern, the remaining surfaces of the copper foils 213a and 214a in the terminal portion formation regions are
After arranging plating layers consisting of nickel plating layers 213b and 214b and gold plating layers 213c and 214c in this order,
An outer shape and a guide hole 218 were formed by pressing. (FIG. 5 (g)) The nickel plating was performed using a WHN plating solution (manufactured by Japan Kojundo Chemical Co., Ltd.) at a temperature of 50 ° C. and a current density of 1 A / dm.
In 2 , the gold plating was performed using Tempe resist K-91S (manufactured by Nippon Kojundo Chemical Co., Ltd.) at a temperature of 60 ° C. and a current density of 0.4 A.
/ Dm 2 . In this way, the contact sheet 210 for electronic device inspection of the second example shown in FIG.
Was created.
【００１９】図５（ｆ）から図５（ｇ）に至るめっき層
配設処理について、本実施例では、図５（ｆ）の銅箔２
１３ａ、２１４ａ形成する際に、めっき層配設処理を行
なうための給電層を予め形成しておき、この給電層を用
いて電解めっきを行ない、銅箔２１３ａ、２１４ａ上全
面にめっき層の配設を行なう方法が採られたが、これに
限定はされない。例えば、給電層を予め形成しておかな
い場合で、図６に示すめっき層配設処理方法を採っても
よい。先ず、図６（ａ）（図５（ｆ））と同じ、レジス
トパターン等のマスク除去後）において、両面全面に無
電解ニッケルめっきを施し、ソフトエッチング可能な厚
さに、無電解ニッケルめっき層２９０を形成する。（図
６（ｂ））
次いで、配線部形成領域を開口するレジストパターンの
マスク２９５を形成し（図６（ｃ））、マスク開口から
露出する部分に、無電解ニッケルめっき層２９０を給電
層として電解めっきを行ない、銅箔２１３ａ、２１４ａ
の表面に、順に、ニッケルめっき層２１３ｂ、２１４
ｂ、金めっき層２１３ｃ、２１４ｃからなるめっき層を
配設する。（図６（ｄ））
次いで、マスク２９５を剥離後（図５（ｅ））、ソフト
エッチングにより不要の無電解ニッケルめっき層２９０
をエッチング除去する。（図５（ｆ））
更に、プレスにより外形形成、ガイドホール２１８形成
を行なう。（図６（ｆ））Regarding the plating layer disposing process from FIG. 5 (f) to FIG. 5 (g), the copper foil 2 of FIG. 5 (f) is used in this embodiment.
When forming the plating layers 13a and 214a, a power feeding layer for performing the plating layer arranging process is formed in advance, and electrolytic plating is performed using this power feeding layer to dispose the plating layer on the entire surfaces of the copper foils 213a and 214a. However, the method is not limited to this. For example, when the power feeding layer is not formed in advance, the plating layer disposing treatment method shown in FIG. 6 may be adopted. First, as shown in FIG. 6A (FIG. 5F), after removing the mask of the resist pattern or the like, electroless nickel plating is applied to the entire surfaces of both sides, and the electroless nickel plating layer is formed to a thickness capable of soft etching. 290 is formed. (FIG. 6B) Next, a mask 295 having a resist pattern for opening the wiring portion forming region is formed (FIG. 6C), and the electroless nickel plating layer 290 is used as a power feeding layer in a portion exposed from the mask opening. Copper foil 213a, 214a by electrolytic plating
On the surface of the nickel plating layers 213b, 214
b, a plating layer including gold plating layers 213c and 214c is provided. (FIG. 6D) Next, after removing the mask 295 (FIG. 5E), unnecessary electroless nickel plating layer 290 is formed by soft etching.
Are removed by etching. (FIG. 5F) Further, the outer shape and the guide hole 218 are formed by pressing. (Fig. 6 (f))
【００２０】尚、図２（ｂ）に示す第２の例の変形例の
電子デバイス検査用コンタクトシートの製造方法として
は、例えば、図５の工程において、保護シートに代え、
銅箔層あるいは金属薄膜層を設け、表裏導通部形成箇所
に開口部を開け、導電性樹脂ペーストを充填し、硬化し
た後、この開口を開けた銅箔層あるいは金属薄膜層を銅
箔２１３Ａに代えて配線形成用に用いることにより、図
２（ｂ）に示す第２の例の変形例を得る、製造方法があ
る。As a method of manufacturing a contact sheet for inspecting electronic devices of a modification of the second example shown in FIG. 2B, for example, in the step of FIG.
A copper foil layer or a metal thin film layer is provided, an opening is formed in the front and back conduction part forming portion, the conductive resin paste is filled and cured, and then the copper foil layer or the metal thin film layer with the opening is formed on the copper foil 213A. There is a manufacturing method in which a modified example of the second example shown in FIG. 2B is obtained by using it instead for wiring formation.
【００２１】また、図３に示す第３の例の電子デバイス
検査用コンタクトシートの製造方法の１例としては、例
えば、図４の工程において、銅箔１１３ａ側の面（孔部
１８０の面も含む）側を無電解銅めっきした（図４
（ｄ））後、銅箔１１３ａ側の面の表裏導通部３１２形
成領域を開口する（孔部１８０は勿論開口）レジストパ
ターン等のマスククを形成し、該マスクから露出した部
分を選択的に電解銅めっきすることにより、表裏導通部
３１２を形成し、この後、マスクを除去し、プレスによ
り外形加工、ガイドホール３１８の形成を行ない、第３
の例の電子デバイス検査用コンタクトシート３１０を得
る、製造方法がある。As an example of the method for manufacturing the contact sheet for inspecting electronic devices of the third example shown in FIG. 3, for example, in the step of FIG. 4, the surface on the copper foil 113a side (the surface of the hole 180 is also (Including) side was electroless copper plated (Fig. 4
(D)) After that, a mask pattern such as a resist pattern for opening the front and back conduction portion 312 forming area on the surface on the copper foil 113a side (opening of course the hole portion 180) is formed, and the portion exposed from the mask is selectively electrolyzed. The front and back conduction parts 312 are formed by plating with copper, after which the mask is removed, the outer shape is processed by a press, and the guide hole 318 is formed.
There is a manufacturing method for obtaining the electronic device inspection contact sheet 310 of the example.
【００２２】[0022]
【発明の効果】本発明は、上記のように、電子デバイス
と検査用回路基板との間に配設され、電子デバイスの端
子部と検査用回路基板の端子部とを電気的に接続するた
めの、シート状の中間接続用部材で、剛性の高い検査用
多層回路基板を使わざるをえない場合おいて、測定する
電子デバイスと検査用回路基板間の電気接触を確実にで
きる電子デバイス検査用コンタクトシートの提供を可能
にした。As described above, the present invention is arranged between the electronic device and the inspection circuit board and electrically connects the terminal portion of the electronic device and the terminal portion of the inspection circuit board. This is a sheet-shaped member for intermediate connection, for electronic device inspection that can ensure electrical contact between the electronic device to be measured and the inspection circuit board when it is unavoidable to use a highly rigid inspection multilayer circuit board. Made it possible to provide contact sheets.
【図１】図１（ａ）は本発明の電子デバイス検査用コン
タクトシートの実施の形態の第１の例を示した一部断面
図であり、図１（ｂ）は図１（ａ）に示す電子デバイス
検査用コンタクトシートを検査装置に使用した状態を示
した概略断面図である。FIG. 1 (a) is a partial cross-sectional view showing a first example of an embodiment of an electronic device inspection contact sheet of the present invention, and FIG. 1 (b) is shown in FIG. 1 (a). It is a schematic sectional drawing which showed the state which used the contact sheet for electronic device inspections shown in the inspection apparatus.
【図２】図２（ａ）は本発明の電子デバイス検査用コン
タクトシートの実施の形態の第２の例を示した一部断面
図であり、図２（ｂ）は本発明の電子デバイス検査用コ
ンタクトシートの実施の形態の第２の例の変形例を示し
た一部断面図である。FIG. 2 (a) is a partial cross-sectional view showing a second example of the embodiment of the electronic device inspection contact sheet of the present invention, and FIG. 2 (b) is an electronic device inspection of the present invention. FIG. 9 is a partial cross-sectional view showing a modified example of the second example of the embodiment of the contact sheet for use in the present invention.
【図３】本発明の電子デバイス検査用コンタクトシート
の実施の形態の第３の例を示した一部断面図である。FIG. 3 is a partial cross-sectional view showing a third example of the embodiment of the electronic device inspection contact sheet of the present invention.
【図４】実施例１における図１（ａ）に示す第１の例の
電子デバイス検査用コンタクトシートの製造工程図であ
る。FIG. 4 is a manufacturing process diagram of the electronic device inspection contact sheet of the first example shown in FIG. 1A in Example 1.
【図５】実施例２における図２（ａ）に示す第２の例の
電子デバイス検査用コンタクトシートの製造工程図であ
る。5A to 5C are manufacturing process diagrams of a contact sheet for inspecting an electronic device according to a second example shown in FIG.
【図６】図５（ｆ）〜図５（ｇ）の工程の１例の詳細工
程図である。FIG. 6 is a detailed process chart of an example of the process of FIGS. 5 (f) to 5 (g).
【図７】従来の電子デバイスの電気特性検査装置の一部
概略断面図FIG. 7 is a partial schematic cross-sectional view of a conventional electrical property inspection apparatus for electronic devices.
１１０ 電子デバイス検査用コンタクトシ
ート
１１１ 基材
１１１ａ 絶縁性材層
１１１Ａ 絶縁性材層用素材
１１１ｂ （絶縁性の）ゴム弾性層
１１１Ｂ ゴム弾性層用素材
１１２ （ゴム弾性層からなる）表裏導通部
１１２ａ 金属細線
１１３ 金属層配線
１１３ａ 銅層（銅箔）
１１３ｂ ニッケルめっき層
１１３ｃ 金めっき層
１１３Ａ 銅箔（金属層配線用素材）
１１３Ａ１ 開口
１１３Ｔ 接続用端子部
１１４ 金属層配線
１１４Ａ 銅箔（金属層配線用素材）
１１４Ｔ 接続用端子部
１１５ 絶縁性樹脂部
１１８ ガイドホール
１２０ 電子デバイス
１２１ 端子部（単に端子とも言う）
１３０ 検査用回路基板
１３１ 配線部
１３１ａ 端子部
１４０ 押圧具
１５０ 固定台
１６０ 位置決めピン
１８０ （基材の）孔部
２１０、２１０Ａ 電子デバイス検査用コンタクトシ
ート
２１１ 基材
２１１ａ 絶縁性材層
２１１Ａ 絶縁性材層用素材
２１１ｂ （絶縁性の）ゴム弾性層
２１１Ｂ ゴム弾性層用素材
２１２ （ゴム弾性層からなる）表裏導通部
２１２Ａ 表裏導通部形成用素材（樹脂ペー
スト）
２１３ 金属層配線
２１３ａ 銅層（銅箔）
２１３ｂ ニッケルめっき層
２１３ｃ 金めっき層
２１３Ａ 銅箔（金属層配線用素材）
２１３Ｔ 接続用端子部
２１４ 金属層配線
２１４Ａ 銅箔（金属層配線用素材）
１２１４Ｔ 接続用端子部
２１８ ガイドホール
２７０ 保護ーシート
２８０ （基材の）孔部
２９０ 無電解めっき層
３１０ 電子デバイス検査用コンタクトシ
ート
３１１ 基材
３１１ａ 絶縁性材層
３１１ｂ （絶縁性の）ゴム弾性層
３１２ （ゴム弾性層からなる）表裏導通部
３１３、３１４ 金属層配線
３１３Ｔ、３１４Ｔ 接続用端子部
３１８ ガイドホール
３８０ （基材の）孔部
６２０ 電子デバイス
６２１ 端子
６３０ 検査用回路基板
６３１ 配線
６３１ａ 端子
６４０ 押圧具
６５０ 固定台
６６０ ゴム弾性シート６６０110 Electronic Device Inspection Contact Sheet 111 Base Material 111a Insulating Material Layer 111A Insulating Material Layer Material 111b (Insulating) Rubber Elastic Layer 111B Rubber Elastic Layer Material 112 (Comprising Rubber Elastic Layer) Front and Back Conducting Part 112a Metal Fine wire 113 Metal layer wiring 113a Copper layer (copper foil) 113b Nickel plating layer 113c Gold plating layer 113A Copper foil (metal layer wiring material) 113A1 Opening 113T Connection terminal portion 114 Metal layer wiring 114A Copper foil (metal layer wiring material) ) 114T connection terminal portion 115 insulating resin portion 118 guide hole 120 electronic device 121 terminal portion (also simply referred to as terminal) 130 inspection circuit board 131 wiring portion 131a terminal portion 140 pressing tool 150 fixing base 160 positioning pin 180 (base material) Hole) 210, 210A Electronic device inspection module Tact sheet 211 Base material 211a Insulating material layer 211A Insulating material layer material 211b (Insulating) rubber elastic layer 211B Rubber elastic layer material 212 (consisting of rubber elastic layer) front and back conducting portion 212A Front and back conducting portion forming material (Resin paste) 213 Metal layer wiring 213a Copper layer (copper foil) 213b Nickel plating layer 213c Gold plating layer 213A Copper foil (material for metal layer wiring) 213T Connection terminal portion 214 Metal layer wiring 214A Copper foil (for metal layer wiring) Material) 1214T Connection terminal portion 218 Guide hole 270 Protective sheet 280 Hole portion (of base material) 290 Electroless plating layer 310 Electronic device inspection contact sheet 311 Base material 311a Insulating material layer 311b (Insulating) rubber elastic layer 312 front and back conduction parts 313 (consisting of rubber elastic layer) 314, metal layer wiring 313T, 14T connecting terminal portions 318 guide hole 380 (the base material) hole 620 Electronic device 621 terminal 630 testing circuit board 631 wires 631a terminals 640 pusher 650 fixed stand 660 elastic sheet 660
───────────────────────────────────────────────────── フロントページの続き (72)発明者 永田 昌博 東京都新宿区市谷加賀町一丁目１番１号 大日本印刷株式会社内 Ｆターム(参考） 2G003 AA07 AB01 AG07 AG12 AH05 2G011 AA16 AB06 AB07 AB08 AC14 AE03 AE22 AF07 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Masahiro Nagata 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo Dai Nippon Printing Co., Ltd. F-term (reference) 2G003 AA07 AB01 AG07 AG12 AH05 2G011 AA16 AB06 AB07 AB08 AC14 AE03 AE22 AF07
Claims (4)
固定台と押圧具等により挟み、押圧して、電子デバイス
の端子部を検査用回路基板の端子部に電気的に接続させ
て、電子デバイスの機能、特性等を検査する検査装置に
おいて用いられ、電子デバイスと検査用回路基板との間
に配設され、電子デバイスの端子部と検査用回路基板の
端子部とを電気的に接続するための、シート状の中間接
続用部材であって、基材は、若干の剛性を有する絶縁材
層と絶縁性でゴム弾性を有するゴム弾性層とを積層した
シート状の積層材で、基材の表裏面に直交する方向に基
材を貫通する孔部中に表裏を導通する表裏導通部を設け
ており、基材の一面側をゴム弾性層とし、表裏導通部に
接続してゴム弾性層の表面に沿い設けられた配線部に接
続する金属層からなる接続用端子部を、所定量だけ表裏
導通部に離れて設け、基材の他面側を絶縁材層とし、表
裏導通部に接続して絶縁材層の表面に沿い設けられた配
線部に接続する金属層からなる接続用端子部を設けてお
り、電子デバイスを検査する際には、基材の両面の接続
用端子部を、それぞれ、電子デバイスの端子部と検査用
回路基板の端子部とを接触させ、デバイスの端子部と検
査用回路基板の端子部とを電気的に接続するものである
ことを特徴とする電子デバイス検査用コンタクトシー
ト。1. A circuit board for inspection and an electronic device,
It is sandwiched by a fixed base and a pressing tool, and pressed to electrically connect the terminal part of the electronic device to the terminal part of the circuit board for inspection, which is used in an inspection device for inspecting the function, characteristics, etc. of the electronic device, A sheet-shaped intermediate connecting member, which is disposed between an electronic device and an inspection circuit board and electrically connects the terminal portion of the electronic device and the terminal portion of the inspection circuit board, The material is a sheet-like laminated material in which an insulating material layer having a slight rigidity and a rubber elastic layer having insulating properties and rubber elasticity are laminated, and a hole portion penetrating the base material in a direction orthogonal to the front and back surfaces of the base material. There is a front and back conducting part that conducts the front and back inside, and one side of the base material is a rubber elastic layer, and from the metal layer that connects to the front and back conducting part and connects to the wiring part provided along the surface of the rubber elastic layer The connection terminal part is separated from the front and back conducting parts by a specified amount. An insulating layer is provided on the other side of the base material, and a connecting terminal section is provided that is formed of a metal layer that is connected to the front and back conducting sections and is connected to the wiring section provided along the surface of the insulating layer. When inspecting, the connecting terminal parts on both sides of the base material are brought into contact with the terminal part of the electronic device and the terminal part of the circuit board for inspection, respectively, and the terminal part of the device and the terminal part of the circuit board for inspection are connected. A contact sheet for inspecting electronic devices, characterized in that it is electrically connected to and.
を通る金属細線で基材両面の配線部間をワイヤボンディ
ング接続し、且つ、孔部に充填された絶縁性の樹脂によ
り金属細線を固定しているものであることを特徴とする
電子デバイス検査用コンタクトシート。2. The front and back conduction portion according to claim 1, wherein the wiring portions on both surfaces of the base material are wire-bonded to each other by metal thin wires passing through the holes, and the metal thin wires are made of an insulating resin filled in the holes. A contact sheet for inspecting electronic devices, characterized in that it is fixed.
を充填する導電性樹脂ペーストを固化したものからなる
ことを特徴とする電子デバイス検査用コンタクトシー
ト。3. The contact sheet for electronic device inspection according to claim 1, wherein the front and back conduction portions are formed by solidifying a conductive resin paste filling the holes.
を充填する金属めっき層からなることを特徴とする電子
デバイス検査用コンタクトシート。4. The contact sheet for inspecting an electronic device according to claim 1, wherein the front and back conduction portions are formed of a metal plating layer filling the holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002052741A JP2003255017A (en) | 2002-02-28 | 2002-02-28 | Contact sheet for electronic device inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002052741A JP2003255017A (en) | 2002-02-28 | 2002-02-28 | Contact sheet for electronic device inspection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003255017A true JP2003255017A (en) | 2003-09-10 |
Family
ID=28664354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002052741A Withdrawn JP2003255017A (en) | 2002-02-28 | 2002-02-28 | Contact sheet for electronic device inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003255017A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013012408A (en) * | 2011-06-29 | 2013-01-17 | Tyco Electronics Japan Kk | Electric connection structure |
| KR20130036457A (en) * | 2011-10-04 | 2013-04-12 | 솔브레인이엔지 주식회사 | Electrical contact unit and probe assembly for electrical inspecting a device having the same |
| JP2014093121A (en) * | 2012-10-31 | 2014-05-19 | Tyco Electronics Japan Kk | Connector |
| JP5639897B2 (en) * | 2009-01-15 | 2014-12-10 | ポリマテック・ジャパン株式会社 | connector |
| WO2016030788A1 (en) * | 2014-08-27 | 2016-03-03 | Sendyne Corporation | Attachment of leads having low thermoelectric errors |
-
2002
- 2002-02-28 JP JP2002052741A patent/JP2003255017A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5639897B2 (en) * | 2009-01-15 | 2014-12-10 | ポリマテック・ジャパン株式会社 | connector |
| JP2013012408A (en) * | 2011-06-29 | 2013-01-17 | Tyco Electronics Japan Kk | Electric connection structure |
| CN103620877A (en) * | 2011-06-29 | 2014-03-05 | 泰科电子日本合同会社 | Electric connection structure |
| KR20130036457A (en) * | 2011-10-04 | 2013-04-12 | 솔브레인이엔지 주식회사 | Electrical contact unit and probe assembly for electrical inspecting a device having the same |
| KR101856182B1 (en) | 2011-10-04 | 2018-06-21 | 폭스브레인 주식회사 | Electrical contact unit and Probe assembly for electrical inspecting a device having the same |
| JP2014093121A (en) * | 2012-10-31 | 2014-05-19 | Tyco Electronics Japan Kk | Connector |
| WO2016030788A1 (en) * | 2014-08-27 | 2016-03-03 | Sendyne Corporation | Attachment of leads having low thermoelectric errors |
| US9470724B2 (en) | 2014-08-27 | 2016-10-18 | Sendyne Corporation | Attachment of leads having low thermoelectric errors |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050510 |