JP2003243586A - Air-cooled heat sink - Google Patents
Air-cooled heat sinkInfo
- Publication number
- JP2003243586A JP2003243586A JP2002040119A JP2002040119A JP2003243586A JP 2003243586 A JP2003243586 A JP 2003243586A JP 2002040119 A JP2002040119 A JP 2002040119A JP 2002040119 A JP2002040119 A JP 2002040119A JP 2003243586 A JP2003243586 A JP 2003243586A
- Authority
- JP
- Japan
- Prior art keywords
- cooling air
- heat sink
- air
- cooled heat
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、サイリスタやパワ
ートランジスタなどの発熱量が大きい電子部品の放熱用
として使用される空冷ヒートシンクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air-cooled heat sink used for radiating heat from electronic components such as thyristors and power transistors that generate a large amount of heat.
【０００２】[0002]
【従来の技術】サイリスタやパワートランジスタなどの
発熱量が大きい半導体素子は、規格内の出力容量で効率
良く使用するためにヒートシンクに取り付けて用いる。
ヒートシンクの種類としては水冷ヒートシンクと空冷ヒ
ートシンクがあり、簡便性から空冷ヒートシンクが多用
されている。また空冷ヒートシンクで高い冷却能力が要
求される場合には、部品取付ベースの片面に複数のフイ
ンが平行して設けられ、そのフインの間に強制的に冷却
風を送るファンを設けた空冷ヒートシンクが使用され
る。2. Description of the Related Art Semiconductor elements such as thyristors and power transistors that generate a large amount of heat are mounted on a heat sink for efficient use with an output capacity within the standard.
There are water-cooled heat sinks and air-cooled heat sinks as the types of heat sinks, and air-cooled heat sinks are often used for simplicity. Also, when high cooling capacity is required for the air-cooled heat sink, a plurality of fins are provided in parallel on one side of the component mounting base, and an air-cooled heat sink with a fan forcibly sending cooling air between the fins is used. used.
【０００３】図２（ａ）は、従来のファンを設けた空冷
ヒートシンクの構造図（ファンは図示せず）で、図２
（ｂ）は図２（ａ）の矢印Ａ−Ａよりの断面にファン部
を追加した断面図である。一般に空冷ヒートシンク１は
アルミニュウム製の部品取付ベース２に、複数のアルミ
ニュウム押し出し板により作られたフイン３が等間隔で
直立するようにろう付けされている。冷却の際には、フ
イン３の間に向けて冷却風４を吹き付けるような位置に
ファン５が設けられている。FIG. 2A is a structural view of a conventional air-cooled heat sink provided with a fan (the fan is not shown).
2B is a cross-sectional view in which a fan portion is added to the cross section taken along the arrow AA in FIG. Generally, the air-cooled heat sink 1 is brazed to a component mounting base 2 made of aluminum so that fins 3 made of a plurality of aluminum extruding plates stand upright at equal intervals. A fan 5 is provided at a position where the cooling air 4 is blown between the fins 3 during cooling.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、本発明
者の解析によると、図２（ａ）に示した従来の空冷ヒー
トシンク１では、フイン３の間を流れる冷却風４は、図
２（ｂ）に示すような流線で流れており、部品取付ベー
ス２の表面の凸凹により流線が乱れ、この流線の乱れに
よってフイン３の根元部分の流速が冷却風４の出口側ほ
ど低下し、最も温度が高い部品取付ベース２と冷却風４
の間に流れの淀み層７が生じる。この淀み層７は冷却風
４の入口側より出口側にかけて厚い層となっている。そ
の結果、部品取付ベース２の温度は冷却風４の入口側よ
り出口側にかけて次第に上昇するような温度勾配を生じ
る。ヒートシンク１の冷却風４の出口側では強制空冷の
効果が少なくなくなってしまい、部品取付板２に取り付
けた半導体素子６の一部が許容値以上の温度になること
がある。However, according to the analysis of the present inventor, in the conventional air-cooled heat sink 1 shown in FIG. 2 (a), the cooling air 4 flowing between the fins 3 is shown in FIG. 2 (b). The flow lines are as shown in Fig. 2, and the flow lines are disturbed by the unevenness of the surface of the component mounting base 2. Due to the disturbance of the flow lines, the flow velocity at the root of the fin 3 decreases toward the outlet side of the cooling wind 4, and High temperature parts mounting base 2 and cooling air 4
During this, a stagnation layer 7 of flow is created. The stagnation layer 7 is thicker from the inlet side of the cooling air 4 to the outlet side thereof. As a result, a temperature gradient is generated such that the temperature of the component mounting base 2 gradually increases from the inlet side of the cooling air 4 to the outlet side thereof. On the outlet side of the cooling air 4 of the heat sink 1 , the effect of forced air cooling becomes small, and a part of the semiconductor element 6 mounted on the component mounting plate 2 may reach a temperature above the allowable value.
【０００５】本発明は、このような従来の問題を解決し
た新しい空冷ヒートシンクを提供する。The present invention provides a new air-cooled heat sink that solves the above-mentioned conventional problems.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するた
め、本発明の空冷ヒートシンクは、発熱部品を搭載した
部品取付ベースの片面に複数のフインを設けると共に、
該フインの間に冷却風を部品取付ベース面に沿って送る
ファンを備えた空冷ヒートシンクにおいて、前記フイン
とフインの間に前記冷却風の流れを部品取付ベースの方
向に偏向させる冷却風案内体を設けたことを特徴とす
る。To achieve this object, the air-cooled heat sink of the present invention is provided with a plurality of fins on one surface of a component mounting base on which heat-generating components are mounted, and
In an air-cooled heat sink equipped with a fan that sends cooling air along the surface of the component mounting base between the fins, a cooling air guide body that deflects the flow of the cooling air in the direction of the component mounting base between the fins. It is characterized by being provided.
【０００７】[0007]
【発明の実施の形態】以下、図面を参照して本発明の実
施の形態を詳細に説明する。図１は本発明に係わる空冷
ヒートシンクの一実施例の構造図（ファンは図示せず）
で、図１（ｂ）は図１（ａ）の矢印Ａ−Ａよりの断面に
ファン部を追加した断面図である。空冷ヒートシンク１
は部品取付ベース２の上面に半導体素子６が搭載され、
部品取付ベース２の下面に複数のフイン３が平行に形成
されている。８は冷却風案内板でフイン３の間に挿入さ
れる。冷却風案内板８は図１（ｂ）に示すようにフイン
３の冷却風４の入口側先端部３ａ（部品取付ベース２と
の間隔Ａ）より、冷却風４の出口側のフイン３の先端部
３ａと部品取付ベース２との間隔Ａのほぼ中央（１／
２）の位置（部品取付ベース２との間隔Ｂ）に向けて傾
斜するように設けられている。ファン５から送り込まれ
冷却風４は、冷却風案内板８の案内により部品取付ベー
ス２もしくはその近傍に向けて流れを偏向させる。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 is a structural diagram of an embodiment of an air-cooled heat sink according to the present invention (fan is not shown)
Then, FIG. 1B is a cross-sectional view in which a fan portion is added to the cross section taken along the arrow AA of FIG. Air-cooled heat sink 1
Is mounted with the semiconductor element 6 on the upper surface of the component mounting base 2,
A plurality of fins 3 are formed in parallel on the lower surface of the component mounting base 2. A cooling air guide plate 8 is inserted between the fins 3. As shown in FIG. 1 (b), the cooling air guide plate 8 has a tip end of the fin 3 on the outlet side of the cooling air 4 with respect to a tip end 3 a of the fin 3 on the inlet side of the cooling air 4 (a distance A from the component mounting base 2). Almost at the center of the space A between the portion 3a and the component mounting base 2 (1 /
It is provided so as to be inclined toward the position 2) (the distance B between the component mounting base 2). The cooling air 4 sent from the fan 5 is deflected by the cooling air guide plate 8 toward the component mounting base 2 or the vicinity thereof.
【０００８】部品取付ベース２、フイン３および冷却風
案内板８の材質としては、例えば熱伝導の良いアルミニ
ュウム、あるいはアルミニュウム合金等が用いれてい
る。また部品取付ベース２の片面に設けるフイン３の接
合は、ろう付け接合、かしめ等の機械的接合など、部品
取付ベース２からフイン３への熱抵抗の小さい接合方法
であれば良い。なお、空冷ヒートシンクとしては部品取
付ベース２とフイン３の部分がアルミ合金等の鋳造で一
体化されている構造の物も市販されている。フイン３の
間に傾斜挿入する冷却風案内板８は、所定幅の短冊状の
薄板を１枚１枚フイン３とフイン３の間に挿入保持させ
るようにしても良いが、例えば図１（ｃ）に示すように
１枚の薄板にフイン３が通り抜ける幅のスリット８ａを
フインの数と間隔に合わせてあけたものを、図１（ａ）
に示すようにフイン３に差し込んで固定するようにして
も良い。このような構成の動作を表１および図３〜図５
を参照して次に説明する。As a material for the component mounting base 2, fins 3 and cooling air guide plate 8, for example, aluminum or aluminum alloy having good heat conductivity is used. Further, the fins 3 provided on one surface of the component mounting base 2 may be joined by any joining method such as brazing, mechanical joining such as caulking, which has a small thermal resistance from the component mounting base 2 to the fins 3. As the air-cooled heat sink, a structure in which the component mounting base 2 and the fin 3 are integrally formed by casting an aluminum alloy or the like is also commercially available. The cooling air guide plates 8 that are inserted obliquely between the fins 3 may be configured such that strip-shaped thin plates having a predetermined width are inserted and held between the fins 3 and the fins 3, for example, as shown in FIG. As shown in FIG. 1A, one thin plate is provided with slits 8a having a width that allows the fins 3 to pass therethrough according to the number and intervals of the fins.
It may be fixed by inserting it into the fin 3 as shown in FIG. The operation of such a configuration is shown in Table 1 and FIGS.
Will be described next.
【０００９】[0009]
【表１】 [Table 1]
【００１０】表１は半導体素子６を搭載して所定の出力
容量で動作させ、冷却風案内板８の取付の条件（傾斜
等）を変えた場合、部品取付ベース２上のほぼ中央部を
熱電対の温度計で測温した値を示したものである。図３
〜図５は冷却風案内板８をフイン３に取付ける条件を変
えて設置したときの断面図で、それぞれのフイン３間の
冷却風４の流線を示したものである。Table 1 shows that when the semiconductor element 6 is mounted and operated with a predetermined output capacity and the conditions (inclination, etc.) for mounting the cooling air guide plate 8 are changed, the central portion on the component mounting base 2 is thermoelectrically charged. It shows the value measured by a pair of thermometers. Figure 3
5A to 5C are cross-sectional views when the cooling wind guide plate 8 is installed by changing the conditions for mounting the cooling wind guide plate 8 and show the streamlines of the cooling wind 4 between the fins 3.
【００１１】表１を説明すると、Ｎｏ１の空冷ヒートシ
ンクは、図２（ｂ）に示すようにフイン３に冷却風案内
板８を設けない従来の場合で、先に述べたように最も温
度の高い部品取付部２の冷流風４の出口側に流れの淀み
層７が生じており、温度８３℃で冷却効率の良いもので
はなかった。Ｎｏ２の空冷ヒートシンクは、図３に示す
ようにフイン３に冷却風案内板８を傾斜を設けずフイン
３の先端の位置にフラットに取り付けたものである。図
３に示すようにフイン３間の冷却風４は、部品取付ベー
ス２および冷却風案内板８の表面の凸凹により流線が乱
れ、部品取付ベース２および冷却風案内板８と冷却風４
の間に流れの淀み層７が生じており、温度８２℃で冷却
風案内板８を設けているがＮｏ１の従来の空冷ヒートシ
ンクより冷却効率が明確に向上するものではなかった。Explaining Table 1, the No. 1 air-cooled heat sink has the highest temperature as described above in the conventional case where the cooling air guide plate 8 is not provided in the fin 3 as shown in FIG. 2 (b). A stagnation layer 7 of the flow was generated on the outlet side of the cold airflow 4 of the component mounting portion 2, and the cooling efficiency was not good at the temperature of 83 ° C. As shown in FIG. 3, the No. 2 air-cooled heat sink has a cooling air guide plate 8 attached to the fins 3 at a position at the tip of the fins 3 without providing an inclination. As shown in FIG. 3, the cooling air 4 between the fins 3 is disturbed in the streamline due to the unevenness of the surfaces of the component mounting base 2 and the cooling air guide plate 8, and the component mounting base 2 and the cooling air guide plate 8 and the cooling air 4
A stagnation layer 7 of the flow is formed between them, and the cooling air guide plate 8 is provided at a temperature of 82 ° C., but the cooling efficiency was not clearly improved as compared with the conventional air-cooled heat sink of No. 1.
【００１２】Ｎｏ３の空冷ヒートシンクは、図１（ｂ）
に示すようにフイン３に冷却風案内板８をフイン３の冷
却風４の入口側先端部３ａより、冷却風４の出口側のフ
インの先端部３ａと部品取付ベース２の間隔Ａのほぼ中
央（１／２）の位置に向けて傾斜させて取り付けたもの
である。図１（ｂ）に示すようにフイン３間の冷却風４
は、乱れがない流線を示しており、温度７５℃でＮｏ１
の従来の空冷ヒートシンクより冷却効率が明確に向上し
ている。Ｎｏ４の空冷ヒートシンクは、図４に示すよう
にフイン３に冷却風案内板８をフイン３の冷却風４の入
口側先端部３ａより、冷却風４の出口側のフイン３の先
端部３ａと部品取付ベース２との間隔ＡのほぼＡ・１／
４の位置に向けて傾斜させて取り付けたものである。図
４に示すようにフイン３間の冷却風４は、乱れがない流
線を示しており、温度７８℃でＮｏ１の従来の空冷ヒー
トシンクより冷却効率が明確に向上している。Ｎｏ５の
空冷ヒートシンクは、図５に示すようにフイン３に冷却
風案内板８をフイン３の冷却風４の入口側先端部３ａよ
り、冷却風４の出口側のフインの先端部３ａと部品取付
ベース２との間隔ＡのほぼＡ・３／４の位置に向けて傾
斜させて取り付けたものである。図５に示すようにフイ
ン３間の冷却風４は、乱れがない流線を示しており、温
度７９℃でＮｏ１の従来の空冷ヒートシンクより冷却効
率が明確に向上している。The No. 3 air-cooled heat sink is shown in FIG.
As shown in FIG. 3, the cooling air guide plate 8 is provided on the fin 3 from the inlet-side tip portion 3a of the cooling air 4 of the fin 3 to substantially the center of the interval A between the tip end portion 3a of the fin on the outlet side of the cooling air 4 and the component mounting base 2. It is attached so as to be inclined toward the (1/2) position. As shown in FIG. 1B, the cooling air 4 between the fins 3
Indicates a streamline with no turbulence, and No1 at a temperature of 75 ° C.
The cooling efficiency is clearly improved over the conventional air-cooled heat sink. In the No. 4 air-cooled heat sink, as shown in FIG. Approximately A / 1 / of the distance A from the mounting base 2
It is attached so as to be inclined toward the position 4. As shown in FIG. 4, the cooling air 4 between the fins 3 shows a streamline without disturbance, and the cooling efficiency is clearly improved over the conventional air-cooled heat sink of No. 1 at the temperature of 78 ° C. In the No. 5 air-cooled heat sink, as shown in FIG. It is attached so as to be inclined toward a position approximately A · 3/4 of the distance A from the base 2. As shown in FIG. 5, the cooling air 4 between the fins 3 shows a streamline without disturbance, and the cooling efficiency is clearly improved at a temperature of 79 ° C. as compared with the conventional air-cooled heat sink of No1.
【００１３】表１の結果、Ｎｏ３，Ｎｏ４，Ｎｏ５空冷
ヒートシンクでは、図１、図４、図５に示すように冷却
風案内板８が傾斜するように設けられ、出口側に向かっ
てフイン間の容積が狭くなる。冷却風４は、出口側に向
かって流動抵抗を受けて圧力が高くなり流速が上がり、
流線は冷却風案内板８に沿って部品取付ベース２に向け
て流れが偏向される。従って、図２に示した従来の空冷
ヒートシンクで見られる部品取付ベース２の表面の凸凹
により流線が乱れ流速が下がることによる流れの淀み層
が、部品取付ベース２に向けて流れが偏向されと同時に
流速が上がることにより流線の乱れが解消して流れの淀
み層７が改善され、熱伝導が促進されてヒートシンクの
冷却性能が高くなる。As shown in Table 1, in the No3, No4 and No5 air-cooled heat sinks, the cooling air guide plates 8 are provided so as to incline as shown in FIGS. The volume decreases. The cooling wind 4 receives a flow resistance toward the outlet side to increase the pressure and the flow velocity,
The streamline is deflected along the cooling air guide plate 8 toward the component mounting base 2. Therefore, the flow stagnation layer caused by the irregularity of the surface of the component mounting base 2 seen in the conventional air-cooled heat sink shown in FIG. 2 and the flow velocity being reduced causes the flow to be deflected toward the component mounting base 2. At the same time, as the flow velocity increases, the turbulence of the streamlines is eliminated, the stagnation layer 7 of the flow is improved, heat conduction is promoted, and the cooling performance of the heat sink is enhanced.
【００１４】以上、本発明の一実施例について説明した
が、本発明は上記実施形態に限定されるものでない。例
えば、冷却風案内板８は直線で用いているがエックスポ
ネンシャル曲線や双曲線等の曲線の形状を持ったもので
も良い。また、ファンを複数台使用しても良い。また、
ファンは冷却風を吹き付ける側と吸い込む側の双方に設
けても良い。Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. For example, although the cooling air guide plate 8 is used as a straight line, it may have a curved shape such as an exponential curve or a hyperbola. Also, a plurality of fans may be used. Also,
The fans may be provided on both the side that blows the cooling air and the side that sucks the cooling air.
【００１５】[0015]
【発明の効果】以上の説明から明らかなように、本発明
の空冷ヒートシンクでは、冷却風案内板をフインの冷却
風の入口側の先端部より冷却風の出口側の部品取付ベー
スに向かって傾斜して取り付けることによって、冷却風
の流れを部品取付ベース方向に偏向させるように制御す
ることができ、その結果、温度の高い部品取付ベースか
ら効率的に放熱を行うことが可能となり、放熱性能の高
い空冷ヒートシンクとすることができる。As is apparent from the above description, in the air-cooled heat sink of the present invention, the cooling air guide plate is inclined from the tip of the fin on the inlet side of the cooling air toward the component mounting base on the outlet side of the cooling air. It is possible to control so that the flow of the cooling air is deflected toward the component mounting base, and as a result, it is possible to efficiently dissipate heat from the component mounting base with a high temperature, and to improve the heat dissipation performance. It can be a high air cooled heat sink.
【００１６】[0016]
【図１】本発明の空冷ヒートシンクの一実施例の形態を
示す図である。FIG. 1 is a diagram showing a form of an embodiment of an air-cooled heat sink of the present invention.
【図２】従来の空冷ヒートシンクの一実施例の形態を示
す図である。FIG. 2 is a diagram showing a form of an example of a conventional air-cooled heat sink.
【図３】本発明の実施例を示す断面図である。FIG. 3 is a sectional view showing an embodiment of the present invention.
【図４】本発明の実施例を示す断面図である。FIG. 4 is a sectional view showing an embodiment of the present invention.
【図５】本発明の実施例を示す断面図である。FIG. 5 is a sectional view showing an embodiment of the present invention.
１…ヒートシンク、２…部品取付ベース、３…フイン、
４…冷却風、５…ファン、６…半導体素子、７…淀み
層、８…冷却風案内板、1 ... Heat sink, 2 ... Component mounting base, 3 ... Fin,
4 ... Cooling air, 5 ... Fan, 6 ... Semiconductor element, 7 ... Stagnation layer, 8 ... Cooling air guide plate,
Claims (3)
に複数のフインを設けると共に、該フインの間に冷却風
を部品取付ベース面に沿って送るファンを備えた空冷ヒ
ートシンクにおいて、前記フインとフインの間に前記冷
却風の流れを部品取付ベースの方向に偏向させる冷却風
案内体を設けたことを特徴とする空冷ヒートシンク。1. An air-cooled heat sink having a plurality of fins on one surface of a component mounting base on which heat-generating components are mounted, and a fan for sending cooling air along the component mounting base surface between the fins. An air-cooled heat sink, characterized in that a cooling air guide body for deflecting the flow of the cooling air toward the component mounting base is provided between the fins.
インの略全長にわたる長さを有し、その冷却風入口側先
端部と前記ベースとの間隔Ａが冷却風出口側の端部と前
記ベースとの間隔Ｂよりも大きくなるように傾斜して設
けられることを特徴とする請求項１に記載の空冷ヒート
シンク。2. The cooling air guide has a length that extends over substantially the entire length of the fin in the cooling air flow direction, and the distance A between the tip of the cooling air inlet and the base is the end on the cooling air outlet side. The air-cooled heat sink according to claim 1, wherein the air-cooled heat sink is provided so as to be inclined so as to be larger than a distance B between the base and the base.
隔Ａに対してＡ／４≦Ｂ≦３Ａ／４に選定されているこ
とを特徴とする請求項２に記載の空冷ヒートシンク。3. The air-cooled heat sink according to claim 2, wherein the interval B of the cooling air guide body is selected such that A / 4 ≦ B ≦ 3A / 4 with respect to the interval A.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040119A JP2003243586A (en) | 2002-02-18 | 2002-02-18 | Air-cooled heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002040119A JP2003243586A (en) | 2002-02-18 | 2002-02-18 | Air-cooled heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003243586A true JP2003243586A (en) | 2003-08-29 |
Family
ID=27780953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002040119A Pending JP2003243586A (en) | 2002-02-18 | 2002-02-18 | Air-cooled heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003243586A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016178285A (en) * | 2016-02-09 | 2016-10-06 | 日本電気株式会社 | Cooling structure and device |
| DE102006060046B4 (en) | 2006-05-31 | 2022-02-03 | Hitachi Industrial Equipment Systems Co. Ltd. | Electrical converter |
-
2002
- 2002-02-18 JP JP2002040119A patent/JP2003243586A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102006060046B4 (en) | 2006-05-31 | 2022-02-03 | Hitachi Industrial Equipment Systems Co. Ltd. | Electrical converter |
| JP2016178285A (en) * | 2016-02-09 | 2016-10-06 | 日本電気株式会社 | Cooling structure and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008140802A (en) | Heat sink | |
| US20020185269A1 (en) | Heat sink, method of manufacturing the same, and cooling apparatus using the same | |
| JP2004056151A (en) | Thermosyphon for electronics cooled by uneven airflow | |
| JP2005348533A (en) | Inverter | |
| JP2006100293A (en) | Cooling fin and cooling structure | |
| JP3604310B2 (en) | Forced air-cooled comb heat sink | |
| JP2008177314A (en) | Motor controller | |
| JP2009277699A (en) | Heat sink, heat sink assembly, semiconductor module, and semiconductor device with cooling device | |
| JP2008091700A (en) | Semiconductor device | |
| US10278239B2 (en) | Cooling assembly for an induction hob | |
| US20120138284A1 (en) | Heat dissipating device | |
| JP4462877B2 (en) | Heat sink with louver | |
| JP2003243586A (en) | Air-cooled heat sink | |
| JPH10125836A (en) | Heat sink cooling apparatus | |
| TW200524514A (en) | Compound heat sink with multi-directional fins | |
| JP2003338595A (en) | Cooling device for electronic component | |
| JP3077575B2 (en) | Heat sink cooling device | |
| JP2004128439A (en) | Heating element cooling device | |
| JP2010093034A (en) | Cooling device for electronic component | |
| JPH10209351A (en) | Heat sink | |
| JP2003060135A (en) | Radiation fin | |
| JP2004047789A (en) | Heat sink | |
| JP2017069522A (en) | Cold plate | |
| JP2003249611A (en) | Heat sink with fin | |
| JPH10190265A (en) | Pin fin type heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041018 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050613 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050705 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20051213 |